Organic light emitting display device

Abstract

An organic light emitting display device includes: a first three-dimensional structure on a substrate; a second three-dimensional structure spaced apart from the first three-dimensional structure along the first direction by a separation region on the substrate, the separation region being located between the second three-dimensional structure and the first three-dimensional structure; a first sub-pixel on a side surface of the first three-dimensional structure; a second sub-pixel on a side surface of the second three-dimensional structure; and a third sub-pixel on the separation region, where the first sub-pixel includes a first organic light emitting element, and the second sub-pixel includes a second organic light emitting element. The first sub-pixel includes a first organic light-emitting element, the second sub-pixel includes a second organic light-emitting element, the third sub-pixel includes a third organic light-emitting element, each of the first three-dimensional structure and the second three-dimensional structure has a structure separated into at least units of one or more pixels in the second direction, and one side surface of the first three-dimensional structure and one side surface of the second three-dimensional structure are each inclined with respect to the substrate.

Description

Technical Field

[0001] The present embodiment relates to an organic light emitting display device. Background Art

[0002] Recently, as society has entered a mature information age, interest in information displays that can process and display large amounts of information has grown. In addition, as the demand for the use of portable information media has increased, the display field has developed rapidly. In view of this, various thin and light flat panel display devices have attracted much attention.

[0003] Among these flat panel display devices, organic light emitting display (OLED, hereinafter referred to as OLED) is attracting attention. OLED is being actively developed to be used as a display device for a head mounted display (HMD) installed close to the human eye. The HMD can be worn in the form of a helmet or glasses to realize virtual reality (VR) or augmented reality (AR).

[0004] The HMD is equipped with a high-resolution and small OLED. The high-resolution and small OLED includes an organic light-emitting element disposed on a driving circuit formed using a wafer-based semiconductor process. At the same time, the glasses-shaped HMD requires a brighter and clearer screen with a very small screen size. To achieve this goal, the amount of light from the organic light-emitting element and the light extraction efficiency must be maximized. In addition, light leakage between pixels must be suppressed to improve image quality. Light extraction efficiency improvement technology that can be applied to ultra-high resolution is expected to be widely used in large-screen display industries such as mobile devices and IT devices.

[0005] Meanwhile, conventionally, a fine metal mask (FMM) is used as a pattern mask for deposition to form an organic light emitting layer constituting an organic light emitting element by depositing the organic light emitting layer to form each sub-pixel.

[0006] However, when manufacturing a high-precision (e.g., 500PPI or higher) display device or a large-area (e.g., eighth generation or higher) display device, it is difficult to form an organic light-emitting layer for each sub-pixel using FMM. In addition, when using FMM, there is a limitation to further improve the high precision. In addition, when using FMM, there is a problem of low yield and increased production cost. In addition, when using FMM, there is a problem of reduced product life due to the difficulty of optimizing deposition.

[0007] At the same time, recently, as the resolution of the display has been improved, the pixel resolution (ppi) has also been improved, and the gap between pixels (or sub-pixels) has gradually narrowed. In addition, as the efficiency of the light-emitting material used for the organic light-emitting element is improved, high brightness can be produced with low current and voltage, so it has the advantage of reducing power consumption. However, as the efficiency of the light-emitting material used for the organic light-emitting element is improved, it is possible to emit light with a small amount of current, and therefore light can be emitted by a small amount of leakage current from one pixel (or sub-pixel) to another adjacent pixel (or sub-pixel). As a result, the phenomenon of adjacent pixels (or sub-pixels) that should not emit light follows the light emission occurs. This leakage of current is called lateral leakage current.

[0008] When light leakage occurs due to lateral leakage current, problems such as color mixing and chromaticity coordinate change may occur. In addition, when light leakage occurs in a low-brightness area, black brightness may increase.

[0009] In order to suppress light leakage, there are methods of reducing the efficiency of the luminescent material or reducing the resolution of the display device. However, as the demand for low-power, high-resolution products has increased recently, it is not expected to solve the problem of light leakage caused by lateral leakage current by reducing the efficiency of the luminescent material or the resolution of the display device. Therefore, there is a need for a technology that can suppress light leakage caused by lateral leakage current in a display device using high-efficiency, high-luminescent materials without reducing resolution. Summary of the invention

[0010] It is an object of the present embodiment to address the foregoing problems and other problems.

[0011] Another object of the present embodiment is to provide an organic light emitting display device with high precision and high resolution.

[0012] Another object of the present embodiment is to provide an organic light emitting display device without using an FMM.

[0013] Another object of the present embodiment is to provide an organic light emitting display device capable of preventing lateral leakage current between pixels (or sub-pixels).

[0014] The technical problems of the present embodiment are not limited to the technical problems described herein, and include technical problems that can be understood through the present invention specification.

[0015] According to one aspect of an embodiment for achieving the foregoing or other objectives, an organic light-emitting display device includes: a first three-dimensional structure located on a substrate; a second three-dimensional structure separated from the first three-dimensional structure by a separation region on the substrate along a first direction, and the separation region is located between the second three-dimensional structure and the first three-dimensional structure; a first sub-pixel located on a side surface of the first three-dimensional structure; a second sub-pixel located on a side surface of the second three-dimensional structure; and a third sub-pixel located on the separation region, wherein the first sub-pixel includes a first organic light-emitting element, wherein the second sub-pixel includes a second organic light-emitting element, wherein the third sub-pixel includes a third organic light-emitting element, wherein the first three-dimensional structure and the second three-dimensional structure each have a structure that is at least separated into units of one or more pixels along a second direction, and wherein the one side surface of the first three-dimensional structure and the one side surface of the second three-dimensional structure are each inclined relative to the substrate.

[0016] The one side surface of the first three-dimensional structure may have a first average wall angle relative to the substrate, the one side surface of the second three-dimensional structure may have a second average wall angle relative to the substrate, and the first average wall angle and the second average wall angle may each be greater than 60 degrees and less than 90 degrees.

[0017] The organic light emitting display device may further include: another second sub-pixel located on another side surface of the first three-dimensional structure; and another first sub-pixel located on another side surface of the second three-dimensional structure.

[0018] One or two first organic light emitting elements may be disposed on one side surface of the first three-dimensional structure along the second direction. One or two second organic light emitting elements may be disposed on one side surface of the second three-dimensional structure along the second direction, and one or two third organic light emitting elements may be disposed on the third auxiliary electrode along the second direction.

[0019] The organic light emitting display device may include: a first anode separation structure disposed along a periphery of the first three-dimensional structure; and a second anode separation structure disposed along a periphery of the second three-dimensional structure.

[0020] The first organic light-emitting element, the second organic light-emitting element and the third organic light-emitting element may include a common charge generation layer, the first anode separation structure may be configured to disconnect the charge generation layer between the first subpixel and the third subpixel, and the second anode separation structure may be configured to disconnect the charge generation layer between the second subpixel and the third subpixel.

[0021] The organic light-emitting display device may also include: a first insulating layer located on the first organic light-emitting element, the second organic light-emitting element and the third organic light-emitting element; a second insulating layer located on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure; and a third insulating layer located on the second insulating layer.

[0022] The third insulating layer may be configured to contact an upper surface of the first three-dimensional structure and an upper surface of the second three-dimensional structure.

[0023] The second insulating layer may include light scattering particles.

[0024] The organic light emitting display device may further include: a lens structure located on the second insulating layer between the first three-dimensional structure and the second three-dimensional structure.

[0025] Effects of the organic light emitting display device according to each embodiment are described as follows.

[0026] According to at least one embodiment, sub-pixels can be arranged on a three-dimensional structure. Therefore, the light emitting area of ​​each sub-pixel is maintained or enlarged, but the occupied area is reduced, so that a high-precision and high-resolution display can be realized.

[0027] According to at least one embodiment, by increasing the inclination angle of the side surface of the three-dimensional structure or by having a vertical surface, the blue organic light-emitting layer in the blue common structure may not be formed on the side surface of the three-dimensional structure or may be formed with a very thin thickness. Therefore, the blue organic light-emitting layer does not affect the light emission of each pixel, and defects caused by color purity attenuation or color unevenness can be prevented.

[0028] According to at least one embodiment, the anode of each sub-pixel can be naturally disconnected (or separated) by the anode separation structure. Therefore, there is no need for a patterning process to separate the anode for each sub-pixel, thereby preventing defects caused by the patterning process, simplifying the process, and reducing costs.

[0029] According to at least one embodiment, for each sub-pixel, the charge generation layer may be disconnected (or separated) by the anode separation structure. Therefore, lateral leakage current between each sub-pixel may be prevented.

[0030] The additional scope of applicability of the embodiment will become apparent from the detailed description below. However, since those skilled in the art can clearly understand various changes or modifications within the spirit and scope of the present embodiment, the detailed description and specific embodiments (such as the preferred embodiment) should be understood to be given by way of example only. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1FIG. 1 is a plan view schematically showing an organic light emitting display device according to an embodiment.

[0032] Figure 2 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a first example.

[0033] Figure 3 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a second example.

[0034] Figure 4 is a perspective view schematically illustrating an organic light emitting display device according to one embodiment as a third example.

[0035] Figure 5 is a cross-sectional view showing an organic light emitting display device according to a first embodiment.

[0036] Figure 6 is a cross-sectional view showing an organic light emitting display device according to a second embodiment.

[0037] Figure 7 is a cross-sectional view showing an organic light emitting display device according to a third embodiment.

[0038] Figure 8 is a cross-sectional view showing an organic light emitting display device according to a fourth embodiment.

[0039] Fig. 9A is a cross-sectional view showing a stacked structure of each organic light emitting display element according to the first embodiment.

[0040] Fig. 9B is a cross-sectional view showing a stacked structure of each organic light emitting display element according to the second embodiment.

[0041] Fig. 10A A deposition system according to one embodiment is shown.

[0042] Fig. 10B The deposition of a blue organic light emitting layer, a red organic light emitting layer and a green organic light emitting layer on a substrate is shown.

[0043] Fig. 10C is a diagram illustrating a self-aligned deposition (SAD) method according to one embodiment.

[0044] Fig.11 is a flowchart illustrating a method for manufacturing an organic light emitting display device according to a first embodiment.

[0045] FIG. 12A to FIG. 12N is a cross-sectional view illustrating a method of manufacturing an organic light emitting display device according to a first embodiment.

[0046] Fig.13 is a flowchart showing a method for manufacturing an organic light emitting display device according to a second embodiment.

[0047] FIG. 14A to FIG. 14D is a cross-sectional view illustrating a method of manufacturing an organic light emitting display device according to a second embodiment.

[0048] Fig.15 yes Figure 7 Detailed cross-sectional view of region X in FIG.

[0049] Fig.16 is a flowchart illustrating a method for manufacturing an organic light emitting display device according to a third embodiment.

[0050] FIG. 17A to FIG. 17G is a cross-sectional view illustrating a method of manufacturing an organic light emitting display device according to a third embodiment.

[0051] Fig.18 The height and depth of the undercut structure in the anode separator structure according to one embodiment are shown.

[0052] Fig.19 is a cross-sectional view showing an organic light emitting display device according to a fifth embodiment.

[0053] Fig. 20 is a cross-sectional view showing an organic light emitting display device according to a sixth embodiment.

[0054] Fig.21A It is a cross-sectional view of a schematic panel design of an AR product.

[0055] Fig.21B yes Fig.21A Design data sheet for panel design.

[0056] Fig. 22 It is a plan view of a schematic panel design of an AR product.

[0057] The size, shape, dimension, etc. of the elements shown in the drawings may be different from the actual ones. In addition, although the same element is shown in different sizes, shapes, dimensions, etc. between different drawings, this is only an example in the drawings, and the same element has the same size, shape, dimension, etc. between different drawings. DETAILED DESCRIPTION

[0058] Hereinafter, the embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings, but the same or similar elements are given the same reference numerals, and their redundant descriptions will be omitted. Considering the convenience of writing the specification, the suffixes such as "module" and "unit" used for the elements described below can be given or used interchangeably, and such suffixes themselves do not have different meanings or functions from each other. In addition, the accompanying drawings are for ease of understanding the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the accompanying drawings. In addition, when an element such as a layer, a region or a substrate is described as being "on" another element, this means that the element can be directly located on another element or there is another intermediate element between them.

[0059] Figure 1 FIG. 1 is a plan view schematically showing an organic light emitting display device according to an embodiment.

[0060] The organic light emitting display device 100 according to this embodiment may be a top emission type or a bottom emission type. A top emission organic light emitting display device may display an image by emitting light in an upward direction. A bottom emission organic light emitting display device may display an image by emitting light in a downward direction.

[0061] Reference Figure 1 According to an embodiment, an organic light emitting display device 100 may include: a plurality of pixels P disposed on a substrate 101 .

[0062] The substrate 101 may be divided into a display area and a non-display area. A plurality of pixels P may be arranged on the display area. A driving device such as a gate driver, a data driver, etc. may be arranged on the non-display area, but is not limited thereto. A plurality of pixels P may be arranged in a matrix. A plurality of pixels P may be arranged along a first direction X. A plurality of pixels P may be arranged along a second direction Y.

[0063] Each pixel P may include a plurality of sub-pixels SPg, SPr, SPb. The sub-pixels SPg, SPr, SPb may include: sub-pixels of at least three different colors.

[0064] As a first example, the sub-pixels SPg, SPr, and SPb may be separated in units of pixels P or in rows along the second direction Y. For example, the green sub-pixels SPg may be separated in units of pixels P or in rows along the second direction Y, the red sub-pixels SPr may be separated in units of pixels P or in rows along the second direction Y, and the blue sub-pixels SPb may be separated in units of pixels P or in rows along the second direction Y.

[0065] As a second example, a plurality of sub-pixels SPg, SPr, SPb may be arranged in a strip shape along the second direction Y. In the strip structure, a plurality of sub-pixels SPg, SPr, SPb may be arranged sequentially, respectively, without being separated along the second direction Y. For example, green sub-pixels SPg may be arranged continuously along the second direction Y, red sub-pixels SPr may be arranged continuously along the second direction Y, and blue sub-pixels SPb may be arranged continuously along the second direction Y.

[0066] Meanwhile, in the first and second examples, the green sub-pixels SPg, the red sub-pixels SPr, and the blue sub-pixels SPb may be alternately arranged in column lines along the first direction X. That is, in one embodiment, the green sub-pixels SPg, the red sub-pixels SPr, and the blue sub-pixels SPb having different colors may be arranged in a side-by-side structure along the first direction X. In the side-by-side structure, it is very important to achieve high precision and high resolution without reducing the light emitting area of ​​each of the plurality of sub-pixels SPg, SPr, SPb.

[0067] The green sub-pixel SPg may be named a first sub-pixel, the red sub-pixel SPr may be named a second sub-pixel, and the blue sub-pixel SPb may be named a third sub-pixel.

[0068] Figure 2 and Figure 4 The organic light emitting display device on various three-dimensional structures 130-1 and 130-2 is shown. Figure 2 is a perspective view schematically showing an organic light emitting display device according to an embodiment as a first example, Figure 3 is a perspective view schematically showing an organic light emitting display device according to an embodiment as a second example, and Figure 4 is a perspective view schematically illustrating an organic light emitting display device according to one embodiment as a third example. Figures 2 to 4 is along Figure 1 A cross-sectional view taken along the line A-A'.

[0069] For ease of description, two three-dimensional structures 130 - 1 and 130 - 2 are shown, but a plurality of three-dimensional structures may be provided on the substrate 100 .

[0070] like Figures 1 to 4As shown, the organic light-emitting display device 100 according to this embodiment may include: three-dimensional structures 130-1, 130-2. The three-dimensional structures 130-1, 130-2 may have at least two side surfaces 130-1a, 130-1b, 130-2a, 130-2b, and at least two sub-pixels SPg, SPr may be arranged on the at least two side surfaces 130-1a, 130-1b, 130-2a, 130-2b. With this structure, high-precision and high-resolution implementation is possible, and there is no need to reduce the light-emitting area of ​​each sub-pixel SPg, SPr.

[0071] In the drawings, the side surfaces 130-1a, 130-1b, 130-2a, 130-2b have straight surfaces, but alternatively, they may have curved surfaces or uneven surfaces. The side surfaces 130-1a, 130-1b, 130-2a, 130-2b may be referred to as wall surfaces. The side surfaces 130-1a, 130-1b, 130-2a, 130-2b and wall surfaces may be used interchangeably.

[0072] The three-dimensional structures 130-1 and 130-2 may have a dot structure. The three-dimensional structures 130-1 and 130-2 may be arranged in an array along the first direction X and the second direction Y. The three-dimensional structures 130-1 and 130-2 may be separated in units of pixels P or column lines along the first direction X. Figure 2 and Figure 4 As shown, the three-dimensional structures 130-1 and 130-2 may be separated in units of pixels P or rows along the second direction Y. Figure 3 As shown, the three-dimensional structures 130 - 1 and 130 - 2 may be separated along the second direction Y in units of two or more pixels P or in row lines.

[0073] Although not shown, the three-dimensional structures 130 - 1 and 130 - 2 may be continuously disposed in a strip shape along the second direction Y. That is, the three-dimensional structures 130 - 1 and 130 - 2 may be integrally disposed in a strip shape along the second direction Y without being separated.

[0074] The side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 may have inclined surfaces ( Figure 2 and Figure 3 ) or vertical surface ( Figure 4 Although not shown, the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 may be separated in units of two or more pixels P or in row lines along the second direction Y, and may also have vertical surfaces.

[0075] The scanning signal can sequentially or alternately drive a plurality of sub-pixels SPg, SPr, SPb for at least one row line. For example, the first row line, the third row line, the second row line, and the fourth row line can be alternately driven in this order. Through this alternate driving, the leakage current along the second direction Y can be reduced.

[0076] Since the three-dimensional structures 130-1 and 130-2 are separated in units of one pixel P or two or more pixels P along the second direction Y, the patterning process of the anode is simple and leakage current in the second direction Y between the pixels P or the sub-pixels SPg, SPr, and SPb can be reduced.

[0077] According to the resolution of the organic light emitting display device 100 , the height or width of the three-dimensional structures 130 - 1 and 130 - 2 may be determined, and a manufacturing method of the three-dimensional structures 130 - 1 and 130 - 2 may also be determined.

[0078] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be disposed on the substrate 101. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be spaced apart by the separation region 105 therebetween. The second three-dimensional structure 130-2 may be spaced apart from the first three-dimensional structure 130-1 along the first direction X by the separation region 105.

[0079] In this case, one pixel P may be defined using the first side surface 130-1a of the first three-dimensional structure 130-1, the first side surface 130-2a of the second three-dimensional structure 130-2, and the separation region 105. The first side surface 130-1a of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2 may be positioned to face each other with the separation region 105 interposed therebetween. The first side surface 130-1a of the first three-dimensional structure 130-1 may contact one side of the separation region 105, and the first side surface 130-2a of the second three-dimensional structure 130-2 may contact the other side of the separation region 105.

[0080] For example, a green sub-pixel SPg may be defined on the first side surface 130-1a of the first three-dimensional structure 130-1, a red sub-pixel SPr may be defined on the first side surface 130-2a of the second three-dimensional structure 130-2, and a blue sub-pixel SPb may be defined on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. One pixel P may be composed of a green sub-pixel SPg, a red sub-pixel SPr, and a blue sub-pixel SPb. Therefore, by providing a plurality of three-dimensional structures on the substrate 101, a plurality of pixels may be defined.

[0081] The green organic light emitting element 140g may be disposed in the green sub-pixel SPg, the red organic light emitting element 140r may be disposed in the red sub-pixel SPr, and the blue organic light emitting element 140b may be disposed in the blue sub-pixel SPb. The green organic light emitting element 140g may be named as a first organic light emitting element, the red organic light emitting element 140r may be named as a second organic light emitting element, and the blue organic light emitting element 140b may be named as a third organic light emitting element.

[0082] Another red organic light emitting element 140'r may be disposed in a red subpixel SPr on the second side surface 130-1b of the first three-dimensional structure 130-1, and another green organic light emitting element 140'g may be disposed in a green subpixel SPg on the second side surface 130-2b of the second three-dimensional structure 130-2.

[0083] Therefore, the red sub-pixel SPr, the green sub-pixel SPg, the blue sub-pixel SPb, the red sub-pixel SPr, and the green sub-pixel SPg may be arranged in this order along the first direction X. Another red organic light emitting element 140'r, the green organic light emitting element 140g, the blue organic light emitting element 140b, the red organic light emitting element 140r, and another green organic light emitting element 140'g may be arranged in this order along the first direction X.

[0084] The average wall angles θa1 and θa2 may be obtained from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2. For example, the average wall angles θa1 and θa2 may be angles of the surface of the separation region 105 extending from the upper and lower ends of the anode and contacting the substrate 101 at the upper surface 130T of the three-dimensional structures 130-1 and 130-2. When the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 have rounded surfaces, the average wall angles θa1 and θa2 may be obtained using a linear extrapolation method.

[0085] As an example, depending on the size of the average wall angles θa1, θa2, when viewed from the side, the three-dimensional structures 130-1 and 130-2 may have diamond-shaped columns ( Figure 2 and Figure 3 ) or square column ( Figure 4 ) shape. That is, the inner diameter or area of ​​the three-dimensional structures 130-1, 130-2 can be reduced from bottom to top. Figure 2 and Figure 3 ) or square column ( Figure 4 )-shaped three-dimensional structures 130-1 and 130-2, the average wall angles θa1 and θa2 can be greater than 60 degrees and less than 90 degrees.

[0086] As another example, the average wall angles θa1, θa2 may be perpendicular to the substrate 101. That is, the average wall angles θa1, θa2 may be 90 degrees relative to the substrate 101.

[0087] As another example, the three-dimensional structures 130 - 1 , 130 - 2 may have a reverse tapered shape in which the inner diameter or area increases from bottom to top. In this case, the average wall angles θa1 and θa2 may be 90 degrees or more relative to the substrate 101 .

[0088] At the same time, when the average wall angle θa is vertical (i.e., closer to 90 degrees), it is advantageous for high resolution. The average wall angle θa may be an angle relative to the ground or substrate 101. In a blue common structure, the blue organic light emitting layer 142B may be commonly disposed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. When the average wall angle θa is vertical (i.e., closer to 90 degrees), the thickness of the blue organic light emitting layer 142B commonly disposed in the green sub-pixel SPg and the red sub-pixel SPr may be minimized, and thereby defects caused by color purity attenuation or color unevenness may be minimized.

[0089] At the same time, if Figure 3 As shown, the three-dimensional structures 130-1 and 130-2 may be separated in units of two or more pixels P or in rows along the second direction Y. In this case, two or more green organic light emitting elements 140g may be disposed on the first side surface 130-1a of the first three-dimensional structure 130-1 along the second direction Y. Two or more red organic light emitting elements 140r may be disposed on the first side surface 130-2 of the second three-dimensional structure 130-2 along the second direction Y. Two or more blue organic light emitting elements 140b may be disposed on the separation region 105 along the second direction Y.

[0090] In the following, reference will be made to Figures 5 to 8 Various organic light emitting display devices are described. Figures 5 to 8 Along Figure 1 Cross-sectional view taken along line BB'.

[0091] Figure 5 is a cross-sectional view showing an organic light emitting display device according to a first embodiment.

[0092] Figure 5 The organic light emitting display device 100A shown may be Figure 2 or Figure 3 The organic light emitting display device shown in FIG. 1 may be configured such that side surfaces 130 - 1 a and 130 - 1 b of the first three-dimensional structure 130 - 1 and side surfaces 130 - 2 a and 130 - 2 b of the second three-dimensional structure 130 - 2 may be inclined relative to the substrate 101 .

[0093] Reference Figure 5 The organic light emitting display device 100A according to the first embodiment may include a first three-dimensional structure 130 - 1 , a second three-dimensional structure 130 - 2 , a green organic light emitting element 140 g , a red organic light emitting element 140 r , a blue organic light emitting element 140 b , and the like.

[0094] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be disposed on the substrate 101. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may have a square column or a diamond column ( Figures 2 to 4 The side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 may be inclined relative to the substrate 101. In this case, the average wall angle θa may be greater than 60 degrees and less than 90 degrees.

[0095] Meanwhile, the three-dimensional structures 130-1 and 130-2 may have a flat or rounded upper surface 130T. For example, in the case of a photo process, it is advantageous to manage the thickness for flatness, while in the case of a printing process, it does not necessarily need to be flat. Although not shown, the three-dimensional structures 130-1 and 130-2 may have vertices instead of the upper surface 130T.

[0096] Meanwhile, the first three-dimensional structure 130 - 1 and the second three-dimensional structure 130 - 2 may be respectively separated into units of one pixel P or units of two or more pixels P along the second direction Y, or may have a stripe shape.

[0097] The green sub-pixel SPg may be disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, the red sub-pixel SPr may be disposed on the first side surface 130-2a of the second three-dimensional structure 130-2, and the blue sub-pixel SPb may be disposed on the separation region 105. The separation region 105 may be a region on the substrate 101 located between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0098] The first side surface 130 - 1 a of the first three-dimensional structure 130 - 1 and the first side surface 130 - 2 a of the second three-dimensional structure 130 - 2 may contact both sides of the separation region 105 .

[0099] The area of ​​the separation region 105 may vary according to the separation distance between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Therefore, the area of ​​the blue sub-pixel SPb set on the separation region 105 may be determined by the area of ​​the separation region 105. As the separation distance increases, the area of ​​the separation region 105 increases, and the area of ​​the blue sub-pixel SPb may increase. If the area of ​​the blue sub-pixel SPb increases, the brightness increases, but this may not be conducive to an increase in resolution. Therefore, the separation distance between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be determined in consideration of the resolution.

[0100] The green organic light emitting element 140g may be disposed in the green sub-pixel SPg, the red organic light emitting element 140r may be disposed in the red sub-pixel SPr, and the blue organic light emitting element 140b may be disposed in the blue sub-pixel SPb.

[0101] The green organic light emitting element 140g may include a first anode 141g, a green organic light emitting layer 142G, and a cathode 143. The red organic light emitting element 140r may include a second anode 141r, a red organic light emitting layer 142R, and a cathode 143. The blue organic light emitting element 140b may include a third anode 141b, a blue organic light emitting layer 142B, and a cathode 143. The green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b may include more layers in addition to the above layers.

[0102] The green organic light emitting layer 142G may be named a first organic light emitting layer, the red organic light emitting layer 142R may be named a second organic light emitting layer, and the blue organic light emitting layer 142B may be named a third organic light emitting layer.

[0103] The first anode 141g and the green organic light emitting layer 142G of the green organic light emitting element 140g may be disposed in the green sub-pixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1. The second anode 141r and the red organic light emitting layer 142R of the red organic light emitting element 140r may be disposed in the red sub-pixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2. The third anode 141b and the blue organic light emitting layer 142B of the blue organic light emitting element 140b may be disposed in the blue sub-pixel SPb on the separation region 105.

[0104] The cathode 143 may be commonly disposed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. The cathode 143 may be commonly disposed in the entire area of ​​the substrate 101 (eg, all pixels P or all sub-pixels SPg, SPr, SPb).

[0105] In one embodiment, the blue organic light-emitting layer 142B may be disposed not only in the blue sub-pixel SPb, but also in the green sub-pixel SPg and the red sub-pixel SPr. That is, the blue organic light-emitting layer 142B may be disposed in common in the entire area of ​​the substrate 101 (e.g., all pixels P or all sub-pixels SPg, SPr, SPb). This structure may be referred to as a blue shared structure. In the blue shared structure, the blue organic light-emitting layer 142B may be disposed on the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1, the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2, and the separation region 105. The blue organic light-emitting layer 142B may be disposed between the first anode 141g and the green organic light-emitting layer 142G in the green sub-pixel SPg. The blue organic light-emitting layer 142B may be disposed between the second anode 141r and the red organic light-emitting layer 142R in the red sub-pixel SPr.

[0106] According to one embodiment, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B may be formed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb, respectively, without using FMM. In other words, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B may be formed using a self-aligned deposition (SAD) method and the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The SAD method will be described later.

[0107] Meanwhile, the organic light emitting display device 100A according to the first embodiment may include: a substrate 101 , a plurality of driving circuits 103 , a protective layer 110 , and a plurality of auxiliary electrodes 120 g , 120 r , and 120 b .

[0108] A plurality of driving circuits 103 may be disposed on the substrate 101, a protective layer 110 may be disposed on the driving circuits 103, and a plurality of auxiliary electrodes 120g, 120r, 120b may be disposed on the protective layer 110. The auxiliary electrodes may be referred to as pixel electrodes.

[0109] The substrate 101 may be made of silicon wafer, glass, plastic, ceramic, etc. The substrate 101 may be made of transparent or opaque material. The driving circuit 103 may include: a plurality of transistors and at least one or more capacitors. One of the plurality of transistors may be a driving transistor.

[0110] The protective layer 110 may be a single layer made of an inorganic film or an organic film. The protective layer 110 may be a multilayer of an inorganic film, or a combination of multilayers of an inorganic film and an organic film. The protective layer 110 may be formed of a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof.

[0111] For example, the protective layer 110 may be composed of a multi-structure of an organic layer and an inorganic layer. In this case, the organic layer may include acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc. The inorganic layer may include silicon oxide (SiOx), silicon nitride (SiNx), etc.

[0112] The electrodes 120g, 120r, 120b may be arranged to correspond to the sub-pixels SPg, SPr, SPb. For example, the first auxiliary electrode 120g may be connected to the green sub-pixel SPg, the second auxiliary electrode 120r may be connected to the red sub-pixel SPr, and the third auxiliary electrode 120b may be connected to the blue sub-pixel SPb. For example, the first auxiliary electrode 120g may be connected to the green organic light emitting element 140g, the second auxiliary electrode 120r may be connected to the red organic light emitting element 140r, and the third auxiliary electrode 120b may be connected to the blue organic light emitting element 140b.

[0113] At the same time, the first auxiliary electrode 120g, the second auxiliary electrode 120r, and the third auxiliary electrode 120b can each connect the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b to the corresponding driving circuit 103 through the through hole 114 of the protective layer 110. The plurality of auxiliary electrodes 120g, 120r, 120b can provide power or apply signals to the plurality of sub-pixels SPg, SPr, SPb, or can be used as pads or terminals for inspection.

[0114] As described above, the auxiliary electrodes 120g, 120r, 120b can electrically connect the drive circuit 103 to the anodes 141g, 141r, 141b of the organic light-emitting elements 140g, 140r, 140b. For example, the auxiliary electrodes 120g, 120r, 120b can be formed of a single layer such as Ti or Mo to improve the contact resistance characteristics. For example, the auxiliary electrodes 120g, 120r, 120b can have an oxide film (such as ITO or IZO) formed on a single layer such as Ti or Mo to facilitate fairness and reliability. For example, the auxiliary electrodes 120g, 120r, 120b can have a dual structure of ITO / (Ti or Mo). For example, the auxiliary electrodes 120g, 120r, 120b can have a triple structure of (Ti or Mo) / ITO / (Ti or Mo).

[0115] At the same time, in the blue sub-pixel SPb, the third auxiliary electrode 120b can replace the third anode 141b. In this case, the third anode 141b can be omitted from the blue sub-pixel SPb. In other words, the third auxiliary electrode 120b needs to have a low contact resistance with the drain of the driving transistor of the driving circuit 103, needs to have excellent reflection performance, or needs to be suitable for the work function value of the third anode 141b (>4.8eV). In this case, only the first anode 141g of the green organic light-emitting element 140g and the second anode 141r of the red organic light-emitting element 140r can be formed. For example, after forming the first anode 141g of the green organic light-emitting element 140g, the second anode 141r of the red organic light-emitting element 140r, and the third anode 141b of the blue organic light-emitting element 140b, the third anode 141b can be removed.

[0116] The first three-dimensional structure 130-1 may be disposed on the first auxiliary electrode 120g, and the second three-dimensional structure 130-2 may be disposed on the second auxiliary electrode 120r. Part of the end of the first auxiliary electrode 120g may be electrically connected to the first anode 141g disposed in the green sub-pixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1. Part of the end of the second auxiliary electrode 120r may be electrically connected to the second anode 141r disposed in the red sub-pixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2.

[0117] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be made of an inorganic film or an organic resin. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may have a dual structure of an organic resin on an inorganic film. The organic resin may be a black resin, but is not limited thereto. When a black resin is used as the organic resin, external light or internal light may be absorbed by the black resin, so that image quality (such as contrast characteristics and color unevenness caused by light leakage) can be improved.

[0118] When selecting the material, a material that is easy to process may be selected according to the height of the first three-dimensional structure 130-1 and / or the second three-dimensional structure 130-2 and the width of the lower surface of the first three-dimensional structure 130-1 and / or the second three-dimensional structure 130-2 according to the resolution.

[0119] Meanwhile, the organic light emitting display device 100A according to the first embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc. The first insulating layer 150 may be made of an inorganic material, the second insulating layer 160 may be made of an organic material, and the third insulating layer 170 may be made of an inorganic material, but are not limited thereto.

[0120] The first insulating layer 150 may be disposed on the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b. That is, the first insulating layer 150 may be disposed on the side surfaces 130-1a, 130-1b and the upper surface 130T of the first three-dimensional structure 130-1, the side surfaces 130-2a, 130-2b and the upper surface 130T of the second three-dimensional structure 130-2, and the separation region 105. Since the first insulating layer 150 has a relatively thin thickness, it may be formed to be curved according to the respective shapes of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0121] The second insulating layer 160 may be disposed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The second insulating layer 160 may be disposed on the upper surface 130T of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. That is, the second insulating layer 160 may cover the first insulating layer 150 disposed on the upper surface 130T of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Since the second insulating layer 160 requires a large thickness, it may be formed of an inorganic material that is easy to form a large thickness during the process. The second insulating layer 160 may be a planarization layer that flattens the upper surface 130T to facilitate the formation of the third insulating layer 170.

[0122] The third insulating layer 170 may be disposed on the second insulating layer 160 .

[0123] The first insulating layer 150, the second insulating layer 160 and the third insulating layer 170 may be used to prevent the penetration of oxygen, moisture, etc. and mitigate impact. Since the first insulating layer 150 and the third insulating layer 170 are made of an inorganic material, the penetration of oxygen or moisture may be completely blocked.

[0124] At least one layer or more layers may be added on the third insulating layer 170. For example, a planarization layer, an anti-reflection layer, a PSA layer, a cover film, etc. may be provided on the third insulating layer 170.

[0125] The substrate 101 may be a silicon substrate on which a plurality of driving circuits 103 are formed using a semiconductor process. Alternatively, a glass substrate or a plastic substrate may be used. In addition, an organic light emitting display device manufactured using various materials, structures, methods, processes, etc. may be obtained.

[0126] According to this embodiment, the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb can each be disposed on the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1, the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2, and the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Therefore, the light emitting area of ​​each of the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb can be maintained or expanded, but the occupied area is reduced, so that a high-precision and high-resolution display can be realized.

[0127] Figure 6 is a cross-sectional view showing an organic light emitting display device according to a second embodiment.

[0128] The second embodiment is similar to the first embodiment except that the third insulating layer 170 may contact the upper surface 130T of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Figure 5 In the second embodiment, components having the same structure, shape and / or function as those of the first embodiment are given the same reference numerals, and detailed description thereof is omitted.

[0129] Figure 6 The organic light emitting display device shown can be Figure 2 and Figure 3 In the organic light emitting display device shown, side surfaces 130 - 1 a and 130 - 1 b of the first three-dimensional structure 130 - 1 and side surfaces 130 - 2 a and 130 - 2 b of the second three-dimensional structure 130 - 2 may be inclined relative to the substrate 101 .

[0130] Reference Figure 6 The organic light-emitting display device 100B according to the second embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100B according to the second embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100B according to the second embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0131] The green organic light emitting element 140g may be disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light emitting element 140r may be disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light emitting element 140b may be disposed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light emitting element 140g may be disposed in the green sub-pixel SPg, the red organic light emitting element 140r may be disposed in the red sub-pixel SPr, and the blue organic light emitting element 140b may be disposed in the blue sub-pixel SPb. One pixel P may be composed of a green sub-pixel SPg, a red sub-pixel SPr, and a blue sub-pixel SPb.

[0132] The side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 may be inclined with respect to the substrate 101. For example, the average wall angle θa may be greater than 60 degrees and less than 90 degrees.

[0133] The third insulating layer 170 may be in contact with the upper surface 130T of the first three-dimensional structure 130-1. The third insulating layer 170 may be in contact with the upper surface 130T of the second three-dimensional structure 130-2.

[0134] The second embodiment can be the first embodiment ( Figure 5 ) is a modified example. That is, according to the first embodiment ( Figure 5 ), a green organic light emitting layer 142G, a red organic light emitting layer 142R, a blue organic light emitting layer 142B, a cathode 143, a first insulating layer 150, and a second insulating layer 160 are formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. Thereafter, the second insulating layer 160, the first insulating layer 150, the cathode 143, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B located on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively, may be removed so that the upper surfaces 130T of the first three-dimensional structure 130-1 and the upper surfaces 130T of the second three-dimensional structure 130-2 may be exposed. Then, the third insulating layer 170 may be formed on the upper surface 130T of the first three-dimensional structure 130-1, the upper surface 130T of the first three-dimensional structure 130-1, and the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Therefore, as in the second embodiment, the third insulating layer 170 may contact the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2.

[0135] Although not shown, a charge generation layer CGL common to the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb may be formed on the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. In this case, the charge generation layer CGL may be removed from the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, and the charge generation layer CGL of the green sub-pixel SPg and the charge generation layer CGL of the red sub-pixel SPr may be disconnected, thereby preventing lateral leakage current between each sub-pixel.

[0136] Figure 7 is a cross-sectional view showing an organic light emitting display device according to a third embodiment.

[0137] The third embodiment is similar to the first embodiment ( Figure 5 ) and the second embodiment ( Figure 6 ). In the third embodiment, the same as the first embodiment ( Figure 5 ) or the second embodiment ( Figure 6 )Components with the same structure, shape and / or function are given the same figure marks, and their detailed description is omitted.

[0138] Figure 7 The organic light emitting display device shown can be Figure 4 The organic light emitting display device shown, and side surfaces 130 - 1 a and 130 - 1 b of the first three-dimensional structure 130 - 1 and side surfaces 130 - 2 a and 130 - 2 b of the second three-dimensional structure 130 - 2 may be perpendicular to the substrate 101 .

[0139] Reference Figure 7 The organic light-emitting display device 100C according to the third embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100C according to the third embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100C according to the third embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0140] The green organic light emitting element 140g may be disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light emitting element 140r may be disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light emitting element 140b may be disposed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light emitting element 140g may be disposed in the green sub-pixel SPg, the red organic light emitting element 140r may be disposed in the red sub-pixel SPr, and the blue organic light emitting element 140b may be disposed in the blue sub-pixel SPb. One pixel P may be composed of a green sub-pixel SPg, a red sub-pixel SPr, and a blue sub-pixel SPb.

[0141] The side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 may be perpendicular to the substrate 101. For example, the average wall angle θa may be 90 degrees. The green organic light emitting element 140g may be disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light emitting element 140r may be disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. Since the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101, when viewed from the front, the occupied area of ​​the green organic light emitting element 140g and the occupied area of ​​the red organic light emitting element 140r may be minimized, so that a display with ultra-high resolution may be realized.

[0142] Since the average wall angle θa is 90 degrees, in the blue common structure, the blue organic light emitting layer 142B may not be formed on the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 or the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2, or may be formed with a very thin thickness. Therefore, the blue organic light emitting layer 142B (which should not affect the light emission of each of the green sub-pixel SPg and the red sub-pixel SPr) is not formed or is formed with a minimum thickness, thereby preventing defects caused by color purity attenuation or color unevenness.

[0143] Figure 8 is a cross-sectional view showing an organic light emitting display device according to a fourth embodiment.

[0144] The fourth embodiment is similar to the first embodiment ( Figure 5 ) or the second embodiment ( Figure 6). In addition, except that the third insulating layer 170 contacts the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2, the fourth embodiment is the same as the third embodiment ( Figure 7 ). In the fourth embodiment, the same as the first to third embodiments ( Figures 5 to 7 )Components with the same structure, shape and / or function are given the same figure marks, and their detailed description is omitted.

[0145] Figure 8 The organic light emitting display device shown can be Figure 4 The organic light emitting display device shown, and side surfaces 130 - 1 a and 130 - 1 b of the first three-dimensional structure 130 - 1 and side surfaces 130 - 2 a and 130 - 2 b of the second three-dimensional structure 130 - 2 may be perpendicular to the substrate 101 .

[0146] Reference Figure 8 The organic light-emitting display device 100D according to the fourth embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100D according to the fourth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100D according to the fourth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0147] The green organic light emitting element 140g may be disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light emitting element 140r may be disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light emitting element 140b may be disposed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light emitting element 140g may be disposed in the green sub-pixel SPg, the red organic light emitting element 140r may be disposed in the red sub-pixel SPr, and the blue organic light emitting element 140b may be disposed in the blue sub-pixel SPb. One pixel P may be composed of a green sub-pixel SPg, a red sub-pixel SPr, and a blue sub-pixel SPb.

[0148] The third insulating layer 170 may be in contact with the upper surface 130T of the first three-dimensional structure 130-1. The third insulating layer 170 may be in contact with the upper surface 130T of the second three-dimensional structure 130-2.

[0149] The fourth embodiment may be the third embodiment ( Figure 7 ). According to the third embodiment ( Figure 7 ), a green organic light emitting layer 142G, a red organic light emitting layer 142R, a blue organic light emitting layer 142B, a cathode 143, a first insulating layer 150, and a second insulating layer 160 may be formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. Then, the second insulating layer 160, the first insulating layer 150, the cathode 143, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B may be removed so that the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2 may be exposed. Then, a third insulating layer 170 may be formed on the upper surface 130T of the first three-dimensional structure 130-1, the upper surface 130T of the first three-dimensional structure 130-1, and the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Therefore, for the second embodiment, the third insulating layer 170 may be in contact with the upper surface 130T of the first three-dimensional structure 130 - 1 and the upper surface 130T of the second three-dimensional structure 130 - 2 .

[0150] Although not shown, a charge generation layer CGL common to the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb may be formed on the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. In this case, the charge generation layer CGL may be removed from the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, and the charge generation layer CGL of the green sub-pixel SPg and the charge generation layer CGL of the red sub-pixel SPr may be disconnected, thereby preventing lateral leakage current between each sub-pixel.

[0151] Meanwhile, according to the first to fourth embodiments ( Figures 5 to 8 ) may include a first anode separation structure 180-1 and a second anode separation structure 180-2. That is, one pixel P may be provided with two anode separation structures 180-1 and 180-2.

[0152] The first anode separation structure 180-1 may be disposed along the periphery of the first three-dimensional structure 130-1. The first anode separation structure 180-1 may be located between the green sub-pixel SPg and the blue sub-pixel SPb. The first anode separation structure 180-1 may be located at the lower side of the first three-dimensional structure 130-1 between the green sub-pixel SPg and the red sub-pixel SPr. The second anode separation structure 180-2 may be disposed along the periphery of the second three-dimensional structure 130-2. The second anode separation structure 180-2 may be located between the red sub-pixel SPr and the blue sub-pixel SPb. The second anode separation structure 180-2 may be located at the lower side of the second three-dimensional structure 130-2 between the red sub-pixel SPr and the blue sub-pixel SPb.

[0153] For example, during the deposition process of forming the anode, the first anode 141g of the green organic light emitting element 140g and the third anode 141b of the blue organic light emitting element 140b may be disconnected by the first anode separation structure 180-1. For example, during the deposition process, the second anode 141r of the red organic light emitting element 140r and the third anode 141b of the blue organic light emitting element 140b may be disconnected by the second anode separation structure 180-2. Therefore, it is not necessary to separate the first anode 141g and the third anode 141b or the second anode 141r and the third anode 141b by a separate patterning process, so that: defects caused by patterning can be prevented, the process can be simplified, and the cost can be reduced.

[0154] For example, the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb may be arranged in this order along the first direction X, and the charge generation layer CGL may be formed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb together. In this case, the lateral leakage current LCL can occur between the green organic light emitting element 140g located on the green sub-pixel SPg, the red organic light emitting element 140r located on the red sub-pixel SPr, and the blue organic light emitting element 140b located on the blue sub-pixel SPb through the charge generation layer CGL. However, according to this embodiment, the charge generation layer CGL formed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb together may be disconnected by the first anode separation structure 180-1 and the second anode separation structure 180-2, respectively. That is, the charge generation layer CGL between the green sub-pixel SPg and the blue sub-pixel SPb may be disconnected by the first anode separation structure 180-1. The charge generation layer CGL between the red sub-pixel SPr and the blue sub-pixel SPb may be disconnected by the second anode separation structure 180-2. Therefore, lateral leakage current flowing between the green, red, and blue organic light emitting elements 140g, 140r, and 140b may be prevented by the charge generation layer CGL commonly formed in the green, red, and blue sub-pixels SPg, SPr, and SPb.

[0155] Reference Figures 15 to 18 The first anode separator structure 180 - 1 and the second anode separator structure 180 - 2 are described in detail.

[0156] Meanwhile, in this embodiment, the anodes 141g, 141r, and 141b may be formed of a transparent conductive film or a reflective film. A light-transmissive transparent conductive material (TCO) such as ITO or IZO may be used to form the transparent conductive film to a thickness of less than 50 nanometers using a sputtering method. A metal film may be formed on the transparent conductive film using an electroplating method.

[0157] According to one embodiment, the transparent conductive film of the anode 141g, 141r, 141b can be formed to a thickness of less than 50 nanometers, or the anode 141g, 141r, 141b can be connected to the auxiliary electrode 120g, 120r, 120b and the side surface 130-1a, 130-1b, 130-2a, 130-2b of the three-dimensional structure 130-1, 130-2, so that the anode 141g, 141r, 141b can be basically formed into a structure without requiring multiple steps. Alternatively, an anode separation structure 180-1, 180-2 can be provided. Therefore, point defects caused by short circuits between the anode 141g, 141r, 141b and the cathode 143 or leakage currents between pixels P (or sub-pixels) can be prevented without forming a barrier (bank), such as a PDL (pixel definition layer).

[0158] Fig. 9A is a cross-sectional view showing a stacked structure of each organic light emitting display element according to the first embodiment. Fig. 9B is a cross-sectional view showing a stacked structure of each organic light emitting display element according to the second embodiment.

[0159] The green organic light emitting element 140g, the red organic light emitting element 140r and the blue organic light emitting element 140b may be formed by a stack ( Fig. 9A ) or a series connection structure including two stacks ST1 and ST2 ( Fig. 9B Although not shown, it may include three or more stacks.

[0160] like Fig. 9A As shown, the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b may be composed of a stack including a green organic light emitting layer G-EML, a red organic light emitting layer R-EML, and a blue organic light emitting layer B-EML.

[0161] The green organic light emitting element 140g may include a green organic light emitting layer G-EML between the first anode 141g and the cathode. The red organic light emitting element 140r may include a red organic light emitting layer R-EML between the second anode 141r and the cathode. The blue organic light emitting element 140b may include a blue organic light emitting layer B-EML between the third anode 141b and the cathode.

[0162] The green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b may each include: a hole injection layer HIL, a hole transport layer HTL, an organic light emitting layer EML, an electron transport layer ETL, and an electron injection layer. In addition, the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b may each include at least one or more electron blocking layers EBL. The capping layer CPL may be formed on the cathode in each of the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b. The hole injection layer HIL, the hole transport layer HTL, the electron transport layer ETL, the electron injection layer, the cathode, and the capping layer CPL may also be included in the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b.

[0163] The cathode may be formed of a transparent conductive film, a semi-permeable film, a reflective film, etc. The semi-permeable film may be formed using magnesium Mg and silver Ag alloy (Mg:Ag) with a thickness of 20 nanometers or less. The semi-permeable film may be composed of a double layer. That is, the semi-permeable film may include a first layer and a second layer, the first layer comprising a Mg:Ag alloy, and the second layer comprising a transparent conductive material (TCO) such as ITO or IZO located on the first layer. When the cathode is made of only a transparent film, the transparent film may be formed of only a transparent conductive film comprising a transparent conductive material (TCO).

[0164] When a voltage is applied to the first anode 141g and the cathode of the green organic light emitting element 140g, holes and electrons move to the green organic light emitting layer G-EML through the hole transport layer HTL, and in the green organic light emitting layer G-EML, holes and electrons can be combined with each other to emit light. Similarly, the red organic light emitting element 140r and the blue organic light emitting element 140b can also emit light by combining holes and electrons.

[0165] In the blue common structure, the blue organic light emitting layer B-EML may be commonly included in the blue organic light emitting element 140 b , the green organic light emitting element 140 g , and the red organic light emitting element 140 r .

[0166] like Fig. 9BAs shown, the green organic light emitting element 140g, the red organic light emitting element 140r and the blue organic light emitting element 140b may be composed of two stacks ST1 and ST2 including two organic light emitting layers. The green organic light emitting element 140g may be composed of two stacks ST1 and ST2 including two green organic light emitting layers G-EML1 and G-EML2 located between the first anode 141g and the cathode. The red organic light emitting element 140r may be composed of two stacks ST1 and ST2 including two red organic light emitting layers R-EML1 and R-EML2 located between the second anode 141r and the cathode. The blue organic light emitting element 140b may be composed of two stacks ST1 and ST2 including two blue organic light emitting layers B-EML1 and B-EML2 located between the third anode 141b and the cathode.

[0167] The green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b may each include: a hole injection layer HIL, two hole transport layers HTL1, HTL2, two electron transport layers ETL1, ETL2, two electron blocking layers EBL1, EBL2, etc. A capping layer CPL may be formed on the cathode in each of the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b. The hole injection layer HIL, the hole transport layers HTL1, HTL2, the electron transport layers ETL1, ETL2, the electron blocking layers EBL1, EBL2, and the capping layer CPL may also be included in the green organic light emitting element 140g and the red organic light emitting element 140r.

[0168] In particular, the charge generation layer may be formed between the first stack ST1 and the second stack ST2 in the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b. For example, the charge generation layer may include: a first charge generation layer (i.e., an n-type charge generation layer n-CGL) formed adjacent to the first stack ST1 and a second charge generation layer (i.e., a p-type charge generation layer p-CGL) formed adjacent to the second stack ST2. The n-type charge generation layer n-CGL may inject electrons into the first stack ST1, and the p-type charge generation layer p-CGL may inject holes into the second stack ST2. The n-type charge generation layer n-CGL may be made of an organic layer doped with an alkali metal (such as Li, Yb, Na, K, or Cs) or an alkaline earth metal (such as Mg, Sr, Ba, or Ra). The p-type charge generation layer p-CGL may be formed by doping the hole transport layer HTL2 with a dopant.

[0169] As described above, since the charge generation layer is made of a low resistance material and is formed together in the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b, a lateral leakage current can occur between the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. As will be described later, by disconnecting the charge generation layer between the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb, a lateral leakage current between each sub-pixel can be prevented.

[0170] Meanwhile, in the blue common structure, two blue organic light emitting layers B-EML1 and B-EML2 may be included in the green organic light emitting element 140g and the red organic light emitting element 140r. The first blue organic light emitting layer B-EML1 may be located below the first stack ST1, and the second blue organic light emitting layer B-EML2 may be located between the first stack ST1 and the second stack ST2.

[0171] Fig. 10A A deposition system according to one embodiment is shown. Fig. 10B The deposition of a blue organic light emitting layer, a red organic light emitting layer and a green organic light emitting layer on a substrate is shown.

[0172] Although the top of the three-dimensional structure is Fig. 10B is shown as a vertex, but it can also have Figures 5 to 8 In the drawings, seven chambers CH1-CH7 are provided, but more chambers may be provided.

[0173] like Figures 5 to 8 , Fig. 9A , Fig. 10A and Fig. 10B As shown, the deposition system according to this embodiment can be operated in-line. That is, as the substrate 101 passes through the first to seventh chambers CH1-CH7 in one direction, the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b can be formed on the substrate 101. That is, as the substrate 101 is transferred, the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b can be deposited on the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb on the substrate 101.

[0174] The hole injection layer HIL and / or the hole transport layer HTL may be deposited on the substrate 101 in the first chamber CH1. The hole injection layer HIL and the hole transport layer HTL may each be deposited in a separate chamber. The blue organic light emitting layer B-EML may be deposited on the substrate 101 in the second chamber CH2. The red organic light emitting layer R-EML may be deposited on the substrate 101 in the third chamber CH3. The green organic light emitting layer G-EML may be deposited on the substrate 101 in the fourth chamber CH4. The electron transport layer ETL may be deposited on the substrate 101 in the fifth chamber CH5. The electron injection layer EIL and / or the cathode may be deposited on the substrate 101 in the sixth chamber CH6. The electron injection layer EIL and the cathode may each be deposited in a separate chamber. The capping layer CPL may be deposited on the substrate 101 in the seventh chamber CH7.

[0175] like Fig. 9B As shown, when the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b are each composed of two stacks ST1 and ST2, the separated chambers (i.e., the second chamber CH2 to the fourth chamber CH4) can be additionally provided between the fourth chamber CH4 and the fifth chamber CH5. In this case, the substrate 101 passes through the second chamber CH2 to the fourth chamber CH4, so that: the first stack ST1 including the first blue organic light emitting layer B-EML1, the first red organic light emitting layer R-RML1, and the first green organic light emitting layer G-EML1 can be formed on the substrate 101. Then, when the substrate 101 passes through the separated chambers (i.e., the additionally provided second chambers CH2 to the fourth chamber CH4), the charge generation layer CGL and the second stack ST2 can be formed on the first stack ST1. The second stack ST2 may include the second blue organic light emitting layer B-EML1, the second red organic light emitting layer R-RML2, and the second green organic light emitting layer G-EML2. Therefore, the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b may have a series structure including a first stack ST1 and a second stack ST2. The first blue organic light emitting layer B-EML1 and the second blue organic light emitting layer B-EML1 may be deposited together on the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b, respectively.

[0176] like Fig. 10A and Fig. 10BAs shown, the substrate 101 may be transferred from left to right on the first evaporation source 251, the second evaporation source 252, and the third evaporation source 253. The first evaporation source 251 may be disposed in the second chamber CH2, the second evaporation source 252 may be disposed in the third chamber CH3, and the third evaporation source 253 may be disposed in the fourth chamber CH4. The first evaporation source 251 may discharge a blue organic light-emitting material, the second evaporation source 252 may discharge a red organic light-emitting material, and the third evaporation source 253 may discharge a green organic light-emitting material. The first evaporation source 251 may discharge a blue organic light-emitting material toward the substrate 101 in a vertical direction. The second evaporation source 252 may discharge a red organic light-emitting material toward the substrate 101 in a first diagonal direction, and the third evaporation source 253 may discharge a green organic light-emitting material toward the substrate 101 in a second diagonal direction. The first diagonal direction and the second diagonal direction may be symmetrical to each other based on the normal direction.

[0177] Meanwhile, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be disposed on the substrate 101. As described above, the separation region 105 may be defined on the substrate 101 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0178] After the substrate 101 is turned over so that the first and second three-dimensional structures 130 - 1 and 130 - 2 face the first, second, and third evaporation sources 251 , 252 , and 253 , the substrate 101 may be transferred to each of the first, second, and third chambers CH1 , CH2 , and CH3 .

[0179] When the substrate 101 passes through the first chamber CH1, the blue organic light emitting material vertically discharged from the first evaporation source 251 may be deposited on the entire area of ​​the substrate 101. That is, the blue organic light emitting material may be deposited on the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1, the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2, and the separation region 105. The blue organic light emitting layer B-EML may be formed of the blue organic light emitting material deposited on the separation region 105.

[0180] When the substrate 101 passes through the second chamber CH2, the red organic light emitting material discharged from the second evaporation source 252 in the first diagonal direction may be deposited on the exposed area of ​​the substrate 101. That is, the red organic light emitting material may be deposited only on the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. The red organic light emitting layer R-EML may be formed of the red organic light emitting material deposited on each of the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. Since the red organic light emitting material extending in the first diagonal direction is blocked by the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the red organic light emitting material is not deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 and the separation area 105.

[0181] When the substrate 101 passes through the third chamber CH3, the green organic light emitting material discharged from the third evaporation source 253 in the second diagonal direction may be deposited on the exposed area of ​​the substrate 101. That is, the green organic light emitting material may be deposited only on the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. The green organic light emitting layer G-EML may be formed of the green organic light emitting material deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. Since the green organic light emitting material extending in the second diagonal direction is blocked by the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the green organic light emitting material is not deposited on the first side surface 130-1a of the second three-dimensional structure 130-2 and the separation area 105.

[0182] Therefore, as the substrate 101 passes through the second chamber CH2 and the third chamber CH3, the blue organic light-emitting material can be deposited on the entire area of ​​the substrate 101 including the separation area 105, the red organic light-emitting material can be deposited only on the first side surface 130-2a of the second three-dimensional structure 130-2, and the green organic light-emitting material can be deposited only on the first side surface 130-1a of the first three-dimensional structure 130-1.

[0183] According to one embodiment, the blue organic light-emitting layer EML, the red organic light-emitting layer R-EML, and the green organic light-emitting layer G-EML can be formed by an in-line deposition system without using a separate deposition pattern mask (such as FMM). Therefore, since a separate deposition pattern mask (such as FMM) is not used, a high-precision (e.g., 500PPI or higher) display or a large-area (e.g., eighth generation or higher) display can be achieved. Since a separate deposition pattern mask (such as FMM) is not used, the manufacturing cost can be greatly reduced. Since a separate deposition pattern mask (such as FMM) is not used, the yield rate can be improved, and the product life can be extended by optimizing the deposition.

[0184] At the same time, if Figures 5 to 8 and Fig. 10B As shown, the average wall angle θa of the substrate 101 and the three-dimensional structures 130-1, 130-2 can be determined according to the selection of the materials of the three-dimensional structures 130-1, 130-2 and the equipment or process conditions for forming the three-dimensional structures 130-1, 130-2. In order to ensure uniform image quality within the screen to prevent color unevenness, it is necessary to optimize the manufacturing method or process conditions for uniformly forming the shapes of the three-dimensional structures 130-1, 130-2 or the side surfaces 130-1a, 130-1b, 130-2a, 130-2b of the three-dimensional structures 130-1, 130-2.

[0185] The angles of the side surfaces 130-1a, 130-1b, 130-2a, 130-2b of the three-dimensional structures 130-1, 130-2 and the anodes 141g, 141r, 141b relative to the substrate 101 can affect the formation of the organic light-emitting elements 142G, 142R, 142B and can affect the final image quality. Therefore, the selection of the angle can be a key success factor (KSF) in the process and product design stage.

[0186] At the same time, if Fig. 10B As shown, the deposition angle θe of the green organic light emitting material discharged from the third evaporation source 253 can be expressed by Formula 1. The structure of the third evaporation source 253 can be varied according to the design of the deposition angle θe.

[0187] [Formula 1]

[0188]

[0189] The deposition angle θe may be an angle for depositing the green organic light emitting material only in a specific region of the first three-dimensional structure 130 - 1 or the second three-dimensional structure 130 - 2 using a shadow effect caused by the first three-dimensional structure 130 - 1 or the second three-dimensional structure 130 - 2 on the substrate 101 .

[0190] TS may represent a distance between the substrate 101 and the third evaporation source 253 , and Offset may represent a shortest distance at which the green organic light emitting material discharged from the third evaporation source 253 is deposited on the substrate 101 .

[0191] Formula 1 may be equally applied to the deposition angle of the red organic light emitting material discharged from the second evaporation source 252 .

[0192] At the same time, if Fig. 10C As shown, the deposition angle θe at which the green organic light emitting material discharged from the third evaporation source 253 is received in a specific area of ​​the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 on the substrate 101 can be expressed by Formula 2. The structure of the pixel P on the substrate 101 can be varied according to the design of the deposition angle θe.

[0193] [Formula 2]

[0194]

[0195] W1 may represent a width of the first three-dimensional structure 130 - 1 or the second three-dimensional structure 130 - 2 , W2 may represent a width of the separation region 105 , and H may represent a height of the first three-dimensional structure 130 - 1 or the second three-dimensional structure 130 - 2 .

[0196] According to Formula 2, the maximum deposition angle θe may increase as the height H of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 increases. According to Formula 2, as the width W1 of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 or the width W2 of the separation region 105 decreases, the maximum deposition angle θe may increase.

[0197] Formula 2 may be equally applied to the deposition angle of the red organic light emitting material discharged from the second evaporation source 252 .

[0198] At the same time, if Fig. 10B As shown, the blue organic light emitting material discharged from the first evaporation source 251 may be deposited on the entire area on the substrate 101 to form a blue organic light emitting layer B-EML.

[0199] The thickness of the blue organic light emitting layer B-EML may vary in the blue sub-pixel SPb, the green sub-pixel SPg, and the red sub-pixel SPr. That is, the thickness of the blue organic light emitting layer B-EML may vary in the blue sub-pixel SPb, the green sub-pixel SPg, and the red sub-pixel SPr according to the average wall angle θa.

[0200] Theoretically, when the average wall angle θa is 90 degrees (i.e., when the green sub-pixel SPg or the red sub-pixel SPr is perpendicular to the substrate 101), the blue organic light-emitting layer B-EML on the green sub-pixel SPg or the red sub-pixel SPr may not be formed. In addition, if the blue organic light-emitting material discharged from the first evaporation source 251 travels in a straight line at the same angle, the blue organic light-emitting layer B-EML may not be formed on the green sub-pixel SPg or the red sub-pixel SPr perpendicular to the substrate 101.

[0201] However, since the blue organic light emitting material discharged from the first evaporation source 251 travels in a straight line at different angles, the blue organic light emitting layer B-EML can be formed on the green sub-pixel SPg or the red sub-pixel SPr even if the green sub-pixel SPg or the red sub-pixel SPr is perpendicular to the substrate 101. The thickness of the blue organic light emitting layer B-EML can be expressed by Formula 3.

[0202] [Formula 3]

[0203] T WS =T BS cos(θa-θb)

[0204] T WS T may represent the thickness of the blue organic light emitting layer B-EML formed on the green sub-pixel SPg or the red sub-pixel SPr. BS θa may denote a thickness of a blue organic light emitting layer B-EML formed on the blue sub-pixel SPb, θa may denote an average wall surface value, and θb may denote a correction angle considering a structure of the first evaporation source 251 (particularly, evaporation characteristics).

[0205] The smaller the correction angle θb is, the thickness T of the blue organic light emitting layer B-EML formed on the green sub-pixel SPg or the red sub-pixel SPr is. WS For example, when the correction angle θb is 0, the thickness T of the blue organic light emitting layer B-EML formed on the green sub-pixel SPg or the red sub-pixel SPr is WS It may be 0. This may mean that the blue organic light emitting layer B-EML is not formed on the green sub-pixel SPg or the red sub-pixel SPr.

[0206] For example, when the green sub-pixel SPg or the red sub-pixel SPr is perpendicular to the substrate 101 and the correction angle θb is about 10 degrees, the thickness of the blue organic light-emitting layer B-EML formed on the green sub-pixel SPg and / or the red sub-pixel SPr may be 17.4% of the thickness of the blue organic light-emitting layer B-EML formed on the blue sub-pixel SPb. In this case, when the thickness of the blue organic light-emitting layer B-EML formed on the blue sub-pixel SPb is 20nm, the thickness of the blue organic light-emitting layer B-EML formed on the green sub-pixel SPg and / or the red sub-pixel SPr is 3.5nm, and thus can be ignored. In other words, even if a 3.5nm blue organic light-emitting layer B-EML is formed on the green sub-pixel SPg and / or the red sub-pixel SPr, it does not affect the brightness of the green light emitted from the green sub-pixel SPg or the red light emitted from the red sub-pixel SPr.

[0207] According to this embodiment, since the blue organic light emitting layer B-EML is deposited on the entire area of ​​the substrate 101 , there is no need to use a deposition pattern mask such as an FMM to deposit it only on a specific area of ​​the substrate 101 .

[0208] In addition, as described above, by using the SAD method and the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, only the green organic light-emitting layer G-EML can be formed in the green sub-pixel SPg, and only the red organic light-emitting layer R-EML can be formed in the red sub-pixel SPr without using a deposition pattern mask (such as an FMM).

[0209] Fig.11 is a flowchart illustrating a method for manufacturing an organic light emitting display device according to a first embodiment. FIG. 12A to FIG. 12N FIG. 1 is a cross-sectional view showing a method for manufacturing an organic light emitting display device according to a first embodiment. Figures 11 to 12N An organic light emitting display device ( Figure 7 and Figure 8 ) is a method for manufacturing. However, Fig.11 and Fig.12N The manufacturing method shown can be equally applied to an organic light emitting display device having a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 (whose average wall angles θa1 and θa2 are less than 90 degrees). Figure 5 and Figure 6 ).

[0210] like Fig. 12A As shown, a plurality of driving circuits 103 may be formed on a substrate 101 (step A1 ).

[0211] A plurality of driving circuits 103 may be arranged to be spaced apart from each other. The driving circuit 103 may be formed for each sub-pixel, but is not limited thereto. The plurality of driving circuits 103 may include: a plurality of transistors and at least one or more capacitors formed using a semiconductor process. The transistor may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material.

[0212] like Fig. 12B As shown, after the protective layer 110 is formed on the plurality of driving circuits 103 , the through holes 114 may be formed in the protective layer 110 (step A2 ).

[0213] The protective layer 110 may be formed as a single layer or multiple layers made of an inorganic material. The protective layer 110 may include a polymer resin layer. A through hole 114 may be formed to penetrate the protective layer to expose a drain electrode of a driving transistor of a driving circuit.

[0214] For example, when a polymer resin is formed on the driving circuit 103, a first through hole may be formed in the polymer resin layer. Then, after the inorganic film is formed on the polymer resin layer, a second through hole having a larger diameter than the first through hole may be formed in the inorganic film. The second through hole may be connected to the first through hole. The through hole 114 may be formed by the first through hole and the second through hole. In this case, the protective layer 110 may be formed by the polymer resin layer and the inorganic film.

[0215] like Fig. 12C As shown, a plurality of auxiliary electrodes 120g, 120r, and 120b may be formed on the protective layer 110 (step A3).

[0216] A plurality of auxiliary electrodes 120g, 120r, 120b can be formed by being deposited and patterned using a sputtering process. A plurality of auxiliary electrodes 120g, 120r, 120b can be formed for each sub-pixel. The width of the third auxiliary electrode 120b can be greater than the width of the first auxiliary electrode 120g or the width of the second auxiliary electrode 120r, but is not limited thereto. A plurality of auxiliary electrodes 120g, 120r, 120b can be arranged to be spaced apart from each other. A plurality of auxiliary electrodes 120g, 120r, 120b can each overlap vertically with a plurality of drive circuits 103. A plurality of auxiliary electrodes 120g, 120r, 120b can each be electrically connected to a corresponding drain of a drive transistor of a plurality of drive circuits 103 through a corresponding through hole 114 of the protective layer 110.

[0217] like Fig.12D As shown, the first three-dimensional structure 130 - 1 and the second three-dimensional structure 130 - 2 may be formed on the first auxiliary electrode 120 g and the second auxiliary electrode 120 r (step A4 ).

[0218] For example, the first three-dimensional structure 130-1 may be formed on the first auxiliary electrode 120g, and the second three-dimensional structure 130-2 may be formed on the second auxiliary electrode 120r. No three-dimensional structure is formed on the third auxiliary electrode 120b. The third auxiliary electrode 120b may be defined as a separation region 105, but is not limited thereto.

[0219] For example, the green sub-pixel SPg may be defined on the first side surface 130-1a of the first three-dimensional structure 130-1, the red sub-pixel SPr may be defined on the first side surface 130-2a of the second three-dimensional structure 130-2, and the blue sub-pixel SPb may be defined on the separation region 105. As will be described later, the green organic light emitting element ( Figure 12K The organic light emitting element 140g in the green sub-pixel SPg may be disposed in the green sub-pixel SPg, the red organic light emitting element 140r may be disposed in the red sub-pixel SPr, and the blue organic light emitting element 140b may be disposed in the blue sub-pixel SPb.

[0220] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be made of acrylic or polyimide resin. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be formed of inorganic materials to achieve high-resolution products. If the resolution of the product is 300 ppi or less, an organic material may be applied to a substrate using printing technology, accurately aligned and transferred to the substrate, and then patterned by ultraviolet rays or thermal curing. Thus, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be formed.

[0221] like Fig.12E As shown, the plurality of auxiliary electrodes 120g, 120r, and 120b may be patterned using the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 as masks (step A5).

[0222] According to the type and structure of the auxiliary electrodes 120g, 120r, 120b or the anode separation structure ( Fig.12F According to the design values ​​of 180-1 and 180-2 in FIG. 1 , the auxiliary electrodes 120g, 120r and 120b can be patterned by wet etching or dry etching, or a combination of the two etching methods. In addition, after patterning, an ashing process can be added.

[0223] When the auxiliary electrodes 120g, 120r, and 120b are made of a plurality of metal films and the metal films are patterned, the ends of the plurality of metal films may be positioned in different ways according to the materials or etching characteristics of the plurality of metal films. That is, the ends of some of the metal films among the plurality of metal films may protrude further outward than the ends of other metal films. Fig.17A and Fig. 17B Describe this in detail.

[0224] like Fig.12F As shown, a plurality of anode separation structures 180 - 1 , 180 - 2 may be formed (step A6 ).

[0225] For example, the first anode separation structure 180 - 1 may be formed along the periphery of the first three-dimensional structure 130 - 1 , and the second anode separation structure 180 - 2 may be formed along the periphery of the second three-dimensional structure 130 - 2 .

[0226] The anode separation structure may refer to a plurality of disconnection structures configured to self-align and electrically disconnect the anode or the charge generation layer CGL using an undercut structure formed in the protection layer 110 , but is not limited thereto.

[0227] Therefore, the anode can be formed separately for each sub-pixel SPg, SPr, SPb without using a separate patterning process, thereby simplifying the process and reducing manufacturing costs. In addition, at high precision or high resolution, poor anode patterning can be substantially avoided. In addition, the charge generation layer CGL formed together in a plurality of sub-pixels SPg, SPr, SPb can be disconnected for each sub-pixel SPg, SPr, SPb, thereby preventing lateral leakage current between each sub-pixel.

[0228] Will refer to it later Figures 16 to 17G A method for manufacturing an anode separator structure is described in detail.

[0229] like Figure 12G As shown, the anodes 141g, 141r, 141b may be deposited on the substrate 101 provided with the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. In this case, the anodes 141g, 141r, 141b may be separated into sub-pixels SPg, SPr, SPb by a plurality of anode separation structures 180-1, 180-2 (step A7). That is, the anodes 141g, 141r, 141b may be formed only in the corresponding sub-pixels SPg, SPr, SPb, and may not be formed between the sub-pixels SPg, SPr, SPb.

[0230] The anodes 141g, 141r, 141b may include a transparent conductive film, but are not limited thereto. The anodes 141g, 141r, 141b may be a single metal film (such as Ni, Au, etc.) or may include a plurality of metal films (such as Ni / Au). The third auxiliary electrode 120b on the blue sub-pixel SPb may be made of a multilayer (e.g., ITO / Ag alloy / Ti) to ensure reflectivity.

[0231] Meanwhile, a photoresist pattern may be formed on the first and second three-dimensional structures 130-1 and 130-2 before the film formation process so that the anodes 141g, 141r, 141b may not be formed on their respective upper surfaces 130T, but is not limited thereto.

[0232] like Fig.12H , Fig.12I and Fig.12J As shown, a blue organic light emitting layer 142B, a red organic light emitting layer 142R, and a green organic light emitting layer 142G may be sequentially deposited on the substrate 101 (step A8).

[0233] Specifically, if Fig.12H As shown, a second chamber ( Fig. 10A The first evaporation source of CH2 Fig. 10B 251 in the first chamber CH1) deposits the blue organic light emitting layer 142B on the entire area of ​​the substrate 101. That is, the blue organic light emitting layer 142B can be formed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. The blue organic light emitting layer 142B can be formed on the anodes 141g, 141r, and 141b in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. In addition, before the blue organic light emitting layer 142B is formed, a hole injection layer HIL and a hole transport layer HTL can be formed on the anodes 141g, 141r, and 141b using each evaporation source of the first chamber CH1.

[0234] Even if the hole injection layer HIL, the hole transport layer HTL and the blue organic light emitting layer 142B are deposited on the entire area of ​​the substrate 101, the hole injection layer HIL, the hole transport layer HTL and the blue organic light emitting layer 142B can also be disconnected and separated between the green sub-pixel SPg, the red sub-pixel SPr and the blue sub-pixel SPb by the first anode separation structure 180-1 and the second anode separation structure 180-2.

[0235] In order to prevent defects such as color purity and color unevenness, it is very important to control the thickness of the blue organic light emitting layer 142B on the green sub-pixel SPg and the red sub-pixel SPr. The green sub-pixel SPg can emit green light, the red sub-pixel SPr can emit red light, and the blue sub-pixel SPb can emit blue light. In this case, since the blue organic light emitting layer 142B on the green sub-pixel SPg or the red sub-pixel SPr interferes with the emission of green light or red light, it is desirable to remove it.

[0236] However, as shown in Formula 3, even if the side surfaces 130-1a, 130-1b of the first three-dimensional structure 130-1 or the side surfaces 130-2a, 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101, since the blue organic light-emitting material discharged from the first evaporation source 251 travels in a straight line at different angles, the blue organic light-emitting layer 142B may be formed on the green sub-pixel SPg or the red sub-pixel SPr. In this embodiment, the structure of the first evaporation source 251 (especially the correction angle θb considering the evaporation characteristics) is minimized to reduce the thickness of the blue organic light-emitting layer 142B formed on the green sub-pixel SPg or the red sub-pixel SPr. Even if the blue organic light-emitting layer 142B is formed on the green sub-pixel SPg or the red sub-pixel SPr, the thickness of the blue organic light-emitting layer 142B can be controlled without affecting the brightness of the color light emitted from the green sub-pixel SPg or the red sub-pixel SPr.

[0237] To this end, the average wall angle θa can be optimized within the range of 60 to 980 degrees so that the thickness of the blue organic light-emitting layer 142B on the green sub-pixel SPg or the red sub-pixel SPr can be controlled to be 5% to 60% of the thickness of the blue organic light-emitting layer 142B formed on the blue sub-pixel SPb.

[0238] like Fig.12I As shown, the red organic light emitting layer 142R can be deposited on the substrate 101. The third chamber ( Fig. 10A The second evaporation source of CH3 in Fig. 10B 252) deposits the red organic light-emitting layer 142R on the first side surface 130-2a of the second three-dimensional structure 130-2. The red organic light-emitting layer 142R may be deposited on the second side surface 130-1b of the first three-dimensional structure 130-1 and on the blue organic light-emitting element layer 142B on the first side surface 130-2a of the second three-dimensional structure 130-2. At this time, due to the shadow effect (where the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 act as a screen), the red organic light-emitting material may not be formed on the first side surface 130-1a of the first three-dimensional structure 130-1, the second side surface 130-2b of the second three-dimensional structure 130-2, and the separation area 105.

[0239] Therefore, without using a deposition pattern mask (such as FMM) and using the SAD method, the red organic light emitting layer 142R can be selectively deposited on a specific area, that is, the second side surface 130-1b of the first three-dimensional structure 130-1 or the first side surface 130-2a of the second three-dimensional structure 130-2.

[0240] like Fig.12JAs shown, the green organic light emitting layer 142G can be deposited on the substrate 101. The fourth chamber ( Fig. 10A The third evaporation source (CH4 in Fig. 10B 253) deposits a green organic light-emitting layer 142G on the first side surface 130-1a of the first three-dimensional structure 130-1. The green organic light-emitting layer 142G may be deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 and on the blue organic light-emitting element layer 142B on the second side surface 130-2b of the second three-dimensional structure 130-2. At this time, due to the shadow effect (where the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 act as a screen), the green organic light-emitting material may not be formed on the second side surface 130-1b of the first three-dimensional structure 130-1, the first side surface 130-2a of the second three-dimensional structure 130-2, and the separation area 105.

[0241] Therefore, without using a deposition pattern mask (such as FMM) and using the SAD method, the green organic light emitting layer 142G can be selectively deposited on a specific area, that is, the first side surface 130-1a of the first three-dimensional structure 130-1 or the second side surface 130-2b of the second three-dimensional structure 130-2.

[0242] Then, the electron transport layer ETL and the electron injection layer EIL may be formed using each evaporation source of the fifth chamber CH5 and the sixth chamber CH6 .

[0243] like Figure 12K As shown, cathode 143 may be formed on organic light emitting layer 142 (step A9). Cathode 143 may be formed by sputtering a transparent conductive film such as ITO or IZO using a sputtering process. Cathode 143 may be formed by depositing a metal film such as magnesium Mg or silver Ag using a vacuum deposition method.

[0244] The cathode 143 may be commonly connected to a plurality of sub-pixels SPg, SPr, SPb. The cathode 143 may not be disconnected by the anode separation structures 180-1, 180-2. In the case of vacuum deposition, the step coverage of the cathode 143 is poor, so it is necessary to optimize the deposition angle of the evaporation source so that the cathode 143 is not disconnected by the anode separation structures 180-1, 180-2. In addition, the disconnection of the cathode 143 may be prevented by ensuring that the undercut structure included in the anode separation structures 180-1, 180-2 does not exceed a predetermined height.

[0245] At the same time, through Figures 12G to 12KAccording to the deposition process shown, a green organic light emitting element 140g, a red organic light emitting element 140r, and a blue organic light emitting element 140b may be formed in a green sub-pixel SPg, a red sub-pixel SPr, and a blue sub-pixel SPb, respectively. The green organic light emitting element 140g may include a green organic light emitting layer 142G, the red organic light emitting element 140r may include a red organic light emitting layer 142R, and the blue organic light emitting element 140b may include a blue organic light emitting layer 142B. The first anode 141g, the second anode 141r, and the third anode 141b may be independently included in the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b, respectively, and the cathode 143 may be included in the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b in common.

[0246] like Figure 12L As shown, a first insulating layer 150 may be formed on the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b (step A10).

[0247] The first insulating layer 150 may be formed on the cathode 143 of each of the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b. The first insulating layer 150 may prevent oxygen or moisture from penetrating into the blue organic light emitting layer 142B, the green organic light emitting layer 142G, and the blue organic light emitting layer 142B.

[0248] The first insulating layer 150 may be made of an inorganic film. For example, the inorganic film may be a silicon oxide film or a silicon nitride film formed by a PECVD method. The first insulating layer 150 may include: a film (e.g., a SiNx film, a SiOx film, or an Al2O3 film) formed using an atomic layer deposition (ALD) method. The first insulating layer 150 may include: a double layer of a film formed using an ALD method and a film formed using a PECVD method. The first insulating layer 150 may include: a double layer of a film formed using a PECVD method located on a film formed using an ALD method.

[0249] like Figure 12M As shown, the second insulating layer 160 may be formed on the first insulating layer 150 (step A11 ).

[0250] The second insulating layer 160 may be formed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The second insulating layer 160 may be made of an organic material that can be easily formed into a large thickness, but is not limited thereto. The second insulating layer 160 may be formed using an inkjet method, but is not limited thereto.

[0251] like Fig.12NAs shown, a third insulating layer 170 may be formed on the second insulating layer 160 (step A12).

[0252] The third insulating layer 170 may be made of an inorganic film. The third insulating layer 170 may be formed of the same material as the first insulating layer 150, but is not limited thereto.

[0253] Figure 7 The organic light emitting display device (third embodiment) shown in FIG. FIG. 12A to FIG. 12N The manufacturing method shown is used for manufacturing.

[0254] Fig.13 is a flowchart illustrating a method for manufacturing an organic light emitting display device according to a second embodiment. FIG. 14A to FIG. 14D is a cross-sectional view illustrating a method of manufacturing an organic light emitting display device according to a second embodiment.

[0255] Will use Figures 13 to 14D An image display device having a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 (whose average wall angles θa1 and θa2 are 90 degrees) is described. Figure 7 and Figure 8 ) is a method for manufacturing. However, Figures 13 to 14D The manufacturing method shown can be equally applied to a video display device having a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 (whose average wall angles θa1 and θa2 are less than 90 degrees) Figure 5 and Figure 6 ).

[0256] because Fig.13 Steps A1 to A10 in Figures 11 to 12L Steps A1 to A10 shown are the same, so detailed descriptions thereof are omitted.

[0257] like Fig.14A As shown, a first insulating layer 150 may be formed on the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b (step A10).

[0258] like Fig. 14B As shown, the second insulating layer 160 may be formed on the first insulating layer 150 (step A11 ).

[0259] The second insulating layer 160 may be formed on the first insulating layer 150 between the first three-dimensional structure 130 - 1 and the second three-dimensional structure 130 - 2 .

[0260] Different from Figure 12M , Fig. 14BThe upper surface of the second insulating layer 160 shown may be disposed at least lower than the upper surface 130T of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2. The upper surface of the second insulating layer 160 may be positioned higher than the upper end of the first anode 141g on the first side surface 130-1a of the first three-dimensional structure 130-1. The upper surface of the second insulating layer 160 may be positioned higher than the upper end of the second anode 141r on the first side surface 130-2a of the second three-dimensional structure 130-2.

[0261] To this end, in the case of an inkjet process, the number of dotting and the amount of shrinkage after vacuum drying may be considered. In addition, a material considering the surface energy between the first insulating layer 150 and the second insulating layer 160 may be selected.

[0262] like Fig. 14C As shown, the first insulating layer 150 , the cathode 143 , the green organic light emitting layer 142G, the red organic light emitting layer 142R and the blue organic light emitting layer 142B on the upper surface 130T of each of the first three-dimensional structure 130 - 1 and the second three-dimensional structure 130 - 2 may be removed (step A111 ).

[0263] In the dry etching process, the amount of ashing and possible selection of gas for each material are important, and damage to the blue organic light emitting element 140 b should not occur in the dry etching process.

[0264] The second insulating layer 160 may be used as a stopper when removing the first insulating layer 150, the cathode 143, etc. That is, the first insulating layer 150, the cathode 143, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B may each be removed until the upper surface of the second insulating layer.

[0265] By removing the first insulating layer 150, the cathode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B (these elements are higher than the upper surface of the second insulating layer), the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be exposed. Therefore, the lateral leakage current between the green sub-pixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1 and the red sub-pixel SPr on the second side surface 130-1b can be prevented. The lateral leakage current between the red sub-pixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2 and the green sub-pixel SPg on the second side surface 130-2b can be prevented. In particular, in the two-stack series structure, the charge generation layer on the upper surface 130T of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 can be removed, so that: the lateral leakage current between the green sub-pixel SPg and the red sub-pixel SPr through the charge generation layer can be prevented.

[0266] At least one or more of the removed and remaining first insulating layer 150, cathode 143, green organic light emitting layer 142G, red organic light emitting layer 142R, and blue organic light emitting layer 142B can be positioned lower than the upper surface 130T of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2. With this structure, the organic light emitting elements 142G, 142R, and 142B on adjacent sub-pixels SPg and SPr can be completely disconnected, so that lateral leakage current can be more reliably prevented.

[0267] like Fig.14D As shown, a third insulating layer 170 may be formed on the substrate 101 (step A12).

[0268] The third insulating layer 170 may be formed on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The third insulating layer 170 may be formed on the exposed upper surface 130T of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0269] Not only is the organic light-emitting layer between adjacent sub-pixels SPg and SPr completely disconnected from the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, but the third insulating layer 170 is in contact with the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, thereby more thoroughly preventing lateral leakage current.

[0270] Figure 8 The organic light emitting display device (fourth embodiment) shown in FIG. FIG. 14A to FIG. 14D The manufacturing method shown is used for manufacturing.

[0271] At the same time, if Fig. 14C As shown, lateral leakage current can be prevented without removing all layers located on the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, such as the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R and the blue organic light-emitting layer 142B.

[0272] Specifically, if Figure 12M As shown, the second insulating layer 160 may be formed on the first insulating layer 150. Then, the second insulating layer 160, the first insulating layer 150, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B may be partially removed on the upper surface 130T of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, so that the upper surface of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be exposed. Therefore, the second insulating layer 160, the first insulating layer 150, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B may have a structure separated from each other on the upper surface of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Therefore, the path for the leakage current to flow between the green sub-pixel SPg and the red sub-pixel SPr on the upper surface of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be removed, thereby preventing the lateral leakage current.

[0273] According to this embodiment, the leakage current paths between all sub-pixels SPg, SPr, SPb can be blocked by the anode separation structures 180-1, 180-2 and the separation structures on the three-dimensional structures 130-1, 130-2, so that the lateral leakage current can be completely prevented.

[0274] Then, the third insulating layer 170 may be formed on the second insulating layer 160. In this case, the third insulating layer 170 may be in contact with the etched cross-sections of each of the second insulating layer 160, the first insulating layer 150, the green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B, and may be in contact with the upper surface of the first three-dimensional structure 130-1 and the upper surface of the second three-dimensional structure 130-2. The green organic light emitting layer 142G, the red organic light emitting layer 142R, and the blue organic light emitting layer 142B may each have a structure in which they are separated by the third insulating layer 170.

[0275] Fig.15 yes Figure 7 Detailed cross-sectional view of the X region in the reference Fig.15 The first anode separator structure 180 - 1 and the second anode separator structure 180 - 2 are described in detail.

[0276] like Fig.15As shown, the green sub-pixel SPg may be defined on the first side surface 130-1a of the first three-dimensional structure 130-1, the red sub-pixel SPr may be defined on the first side surface 130-2a of the second three-dimensional structure 130-2, and the blue sub-pixel SPb may be defined on the separation region 105. The green sub-pixel SPg may include a green organic light emitting element 140g, the red sub-pixel SPr may include a red organic light emitting element 140r, and the blue sub-pixel SPb may include a blue organic light emitting element 140b. One pixel P may be composed of a green sub-pixel SPg, a red sub-pixel SPr, and a blue sub-pixel SPb.

[0277] The first anode separation structure 180-1 may be disposed along the periphery of the first three-dimensional structure 130-1. The first anode separation structure 180-1 may be disposed at the lower side of the first three-dimensional structure 130-1 between the green sub-pixel SPg and the blue sub-pixel SPb. The first anode separation structure 180-1 may be disposed at the lower side of the first three-dimensional structure 130-1 located between the green organic light emitting element 140g and the blue organic light emitting element 140b.

[0278] The first anode separation structure 180 - 1 may include a first undercut structure 1810 and a first disconnection structure 1820 .

[0279] The first undercut structure 1810 may be formed such that an end portion of at least one or more insulating films 112 among the plurality of insulating films 111 to 113 constituting the protective layer 110 is positioned inside the first side surface 130 - 1 a of the first three-dimensional structure 130 - 1 .

[0280] The first disconnection structure 1820 may disconnect the green sub-pixel SPg and the blue sub-pixel SPb through the first undercut structure 1810. The first disconnection structure 1820 may include a first-first disconnection structure 1821, a first-second disconnection structure 1822, a first-third disconnection structure 1823, and the like.

[0281] The disconnect structure 1821 may disconnect the first anode 141g of the green organic light emitting element 140g and the third anode 141b of the blue organic light emitting element 140b between the green sub-pixel SPg and the blue sub-pixel SPb. During the anode formation process, at least one or more metal films may be formed on the substrate 101. In this case, the first undercut structure 1810 may disconnect at least one or more metal films between the green sub-pixel SPg and the blue sub-pixel SPb. Therefore, the first anode 141g may be formed in the green sub-pixel SPg, and the third anode 141b may be formed in the blue sub-pixel SPb.

[0282] At the same time, if Fig. 9A and Fig. 9BAs shown, a common layer may be formed in the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b. Fig. 9A In the embodiment, the common layers may include a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a blue organic light emitting layer 142B, a charge generation layer CGL, an electron transport layer ETL and a cathode 143. For example, in Fig. 9B In the embodiment, the common layers may include a hole injection layer HIL, hole transport layers HTL1 and HTL2, electron blocking layers EBL1 and EBL2, a blue organic light emitting layer 142B, a charge generating layer CGL, electron transport layers ETL1 and ETL2, a cathode 143 and the like.

[0283] Since the blue organic light emitting layer 142B or the charge generation layer CGL causes lateral leakage current, it must be disconnected between the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. In contrast, the cathode 143 can be electrically connected to the green organic light emitting element 140g, the red organic light emitting element 140r, and the blue organic light emitting element 140b in common, so that it should not be disconnected between the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb.

[0284] According to one embodiment, the first undercut structure 1810 may disconnect the blue organic light emitting layer 142B, the charge generation layer CGL, etc. between the green sub-pixel SPg and the blue sub-pixel SPb.

[0285] The disconnection structure 1822 may disconnect the blue organic light emitting layer 142B between the green sub-pixel SPg and the blue sub-pixel SPb through the first undercut structure 1810 and / or the separation gap between the first anode 141g and the third anode 141b. The first-third disconnection structure 1823 may disconnect the charge generation layer CGL between the green sub-pixel SPg and the blue sub-pixel SPb through the first undercut structure 1810, the separation gap between the first anode 141g and the third anode 141b, and / or the disconnected blue organic light emitting layer 142B.

[0286] Therefore, the first undercut structure 1810 or the like may disconnect the blue organic light emitting layer 142B or the charge generation layer CGL between the green sub-pixel SPg and the blue sub-pixel SPb, thereby preventing a lateral leakage current between each sub-pixel.

[0287] The anode separation structure 180-2 may be disposed along the periphery of the second three-dimensional structure 130-2. The second anode separation structure 180-2 may be disposed at the lower side of the second three-dimensional structure 130-2 between the red sub-pixel SPr and the blue sub-pixel SPb. The second anode separation structure 180-2 may be disposed at the lower side of the second three-dimensional structure 130-2 between the red organic light emitting element 140r and the blue organic light emitting element 140b.

[0288] The anode separation structure 180 - 2 may include a second undercut structure 1830 and a second disconnection structure 1840 .

[0289] The second undercut structure 1830 may be formed such that an end portion of at least one or more insulating films 112 among the plurality of insulating films 111 - 113 constituting the protective layer 110 is positioned inside the first side surface 130 - 2 a of the second three-dimensional structure 130 - 2 .

[0290] The second disconnection structure 1840 may disconnect the red sub-pixel SPr and the blue sub-pixel SPb through the second undercut structure 1830. The second disconnection structure 1840 may include a second-first disconnection structure 1841, a second-second disconnection structure 1842, a second-third disconnection structure 1843, and the like.

[0291] The second-first disconnection structure 1841 may disconnect the second anode 141r of the red organic light emitting element 140r and the third anode 141b of the blue organic light emitting element 140b between the red sub-pixel SPr and the blue sub-pixel SPb. During the anode formation process, at least one or more metal films may be formed on the substrate 101. In this case, the third undercut structure 1830 may disconnect at least one or more metal films between the red sub-pixel SPr and the blue sub-pixel SPb. Therefore, the second anode 141r may be formed in the green sub-pixel SPg, and the third anode 141b may be formed in the blue sub-pixel SPb.

[0292] According to one embodiment, the third undercut structure 1830 may disconnect a common layer (such as the blue organic light emitting layer 142B, the charge generation layer CGL, etc.) between the red sub-pixel SPr and the blue sub-pixel SPb.

[0293] The second-second disconnection structure 1842 may disconnect the blue organic light emitting layer 142B between the red sub-pixel SPr and the blue sub-pixel SPb through the second undercut structure 1830 and / or the separation gap between the second anode 141r and the third anode 141b. The second-third disconnection structure 1823 may disconnect the charge generation layer CGL between the red sub-pixel SPr and the blue sub-pixel SPb through the second undercut structure 1830, the separation gap between the second anode 141r and the third anode 141b, and / or the disconnected blue organic light emitting layer 142B.

[0294] Therefore, the second undercut structure 1830 or the like may disconnect the blue organic light emitting layer 142B or the charge generation layer CGL between the red sub-pixel SPr and the blue sub-pixel SPb, thereby preventing a lateral leakage current between each sub-pixel.

[0295] Meanwhile, the first anode separation structure 180-1 may include only the first undercut structure 1810, and the second anode separation structure 180-2 may include only the second undercut structure 1830. That is, the first disconnection structure 1820 may not be included in the first anode separation structure 180-1, and the second disconnection structure 1840 may not be included in the second anode separation structure 180-2.

[0296] Although not shown, the third auxiliary electrode 120b may be disposed under the third anode 141b. The third anode 141b may be removed, and the third auxiliary electrode 120b may be disposed with the Fig. 9A and Fig. 9B In this case, the third auxiliary electrode 120b may serve as the third anode 141b.

[0297] Meanwhile, the first auxiliary electrode 120g, the second auxiliary electrode 120r, and the third auxiliary electrode 120b may include a plurality of metal films 121a, 121b, 122a, 122b, 123a, 123b, respectively.

[0298] For example, the first metal film 121a, 121b may be made of a metal material having excellent electrical contact characteristics with the driving circuit 103 and being easy to dry etch, and may be made of, for example, Ti, Mo, etc. For example, the second metal film 122a, 122b may be made of a metal material having excellent reflective characteristics and being easy to wet etch, and may be made of, for example, Ag, Ag alloy, Al, etc. For example, the third metal film 123a, 123b may be made of a transparent material having low contact resistance with the anode 141g, 141r, 141b and having excellent processing reliability, and may be made of ITO, IZO, etc. For example, the third metal film 123a, 123b may be made of Mo, MoTi alloy, Ti, etc.

[0299] The first auxiliary electrode 120 g may be disposed under the first three-dimensional structure 130 - 1 , and the second auxiliary electrode 120 r may be disposed under the second three-dimensional structure 130 - 2 .

[0300] At least one metal film 121a among the plurality of metal films 121a, 122a, 123a of the first auxiliary electrode 120g may include a first protruding region 1211 that protrudes outward from the first side surface 130-1a of the first three-dimensional structure 130-1 and contacts the first anode 141g. In the first protruding region 1211, an end of one metal layer 121a of the first auxiliary electrode 120g may protrude further outward than ends of the other metal layers 122a, 123a.

[0301] Among the plurality of metal films 121b, 122b, 123b of the second auxiliary electrode 120r, at least one metal film 121b may include: a second protruding region 1212, which protrudes outward from the first side surface 130-2a of the second three-dimensional structure 130-2 and contacts the second anode 141r. In the second protruding region 1212, an end of the metal film 121b of the first auxiliary electrode 120g may protrude more outward than ends of the other metal films 122b, 123b.

[0302] Fig.16 is a flowchart illustrating a method for manufacturing an organic light emitting display device according to a third embodiment. FIG. 17A to FIG. 17G is a cross-sectional view illustrating a method of manufacturing an organic light emitting display device according to a third embodiment. FIG. 17A to FIG. 17G Shows Fig.15 The red sub-pixel SPr and the blue sub-pixel SPb are used, but the green sub-pixel SPg can also be applied equally.

[0303] because Fig.16 Steps A1 to A4 in Fig.11 Steps A1 to A4 shown are the same, so their detailed description is omitted.

[0304] like Fig.17A As shown, the auxiliary electrode 120r may be patterned using the three-dimensional structure 130-2 (step A5).

[0305] Specifically, the protective layer 110 and the auxiliary electrode 120r may be formed on the substrate 101, and the three-dimensional structure 130-2 may be formed on the auxiliary electrode 120r. The protective layer 110 may include a plurality of insulating films 111-113. The auxiliary electrode may include a plurality of metal films 121b, 122b, 123b.

[0306] Then, the auxiliary electrode 120r can be patterned using the three-dimensional structure 130-2 as a mask. In this case, the ends of the plurality of metal films 121b, 122b, 123b can be positioned differently from each other. The third metal film 123b, the second metal film 122b, and the first metal film 121b can be etched into various cross-sectional shapes according to the etching characteristics of the material.

[0307] For example, while the third metal film and the second metal film may be etched, the first metal film may not be etched. Therefore, the third metal film and the second metal film may be over-etched under the three-dimensional structure 130-2.

[0308] Fig.16 Step A6 in the embodiment is a step of forming an anode separation structure, and will be referred to as FIG. 17B to FIG. 17G Describe in detail.

[0309] like Fig. 17B As shown, the width or height of the three-dimensional structure 130-2 can be reduced by an ashing process or dry etching (step A61). Therefore, the over-etched third metal film and the second metal film can be exposed. The first metal film may include: a protruding area 1212, which protrudes outward from the side surfaces 130-1a, 130-1b, 130-2a, 130-2b of the three-dimensional structure 130-2. The protruding area 1212 can protrude from the side surfaces 130-1a, 130-1b, 130-2a, 130-2b of the three-dimensional structure 130-2 within about 2 microns.

[0310] The etched side surfaces 130 - 1 a , 130 - 1 b , 130 - 2 a , 130 - 2 b of each of the third and second metal films of the auxiliary electrode 120 r may be positioned on the same vertical line within an error range of about several hundred nanometers.

[0311] like Fig. 17C As shown, the plurality of insulating films 111-113 of the protective layer 110 may be patterned (step A62). For example, the third insulating film 113 and the second insulating film 112 of the protective layer 110 may be patterned by dry etching using the first metal film of the auxiliary electrode 120r as a mask.

[0312] The dry etching characteristics of the first insulating film 111, the second insulating film 112, and the third insulating film 113 may be different. For example, although the dry etching characteristics of the second insulating film 112 and the third insulating film 113 are very excellent, the first insulating film 111 may be patterned without dry etching. For example, HF series may be used as an etching scheme, but is not limited thereto.

[0313] For example, the first insulating film 111 and the third insulating film 113 may be silicon nitride films, and the second insulating film 112 may be silicon oxide films, but are not limited thereto. In the deposition steps of the first insulating film 111, the second insulating film 112, and the third insulating film 113, the ratio of silicon to nitrogen, the ratio of silicon to oxygen, the density of the film, etc. may be optimized, and in the dry etching process, the type and composition ratio of the dry etching gas, etc. may be optimized.

[0314] like Fig.17D As shown, dry etching may be continuously performed to pattern the second insulating layer 112 (step A63). Through additional dry etching, the first insulating layer 111 and the third insulating layer 113 may not be patterned, and the second insulating layer 112 may be patterned. Thus, an undercut structure 1830 (in which the end of the second insulating film 112 is located within the side surfaces 130-1a, 130-1b, 130-2a, 130-2b of the three-dimensional structure 130-2) may be formed.

[0315] Meanwhile, the third insulating film 113 may be omitted, and a double-layer structure of the first insulating film 111 and the second insulating film 112 may be formed. In this case, the first insulating layer 111 may include a resin layer, and the second insulating layer 112 may include an inorganic layer (such as a silicon nitride layer or a silicon oxide layer). Therefore, the undercut structure 1830 may be easily formed by using a high etching selectivity between the resin film and the inorganic film. When the first insulating film 111 is a resin film, the etching selectivity may be improved to facilitate structure formation by utilizing the fact that the resin film is difficult to etch in a wet etching scheme.

[0316] like Fig.17E As shown, anodes 141r and 141b may be formed on substrate 101 (step A7). Green anode ( Fig.15 142g) can also be formed on the substrate 101.

[0317] At least one or more metal films may be formed on the substrate 101. In this case, the second-first disconnection structure 1841 may be formed by the undercut structure 1830. The second-first disconnection structure 1841 may disconnect at least one or more metal films between the red sub-pixel SPr and the blue sub-pixel SPb to separate them into the second anode 141r and the third anode 141b. The second anode 141r may be formed in the red sub-pixel SPr on the side surface 130-1b of the three-dimensional structure 130-1, and the third anode 141b may be formed on the separation region 105 in the blue sub-pixel SPb.

[0318] Since the thickness of the one or more metal films is very small (50 nm or less), the height 182 of the undercut structure 1830 is not reduced by the anodes 141r, 141b, and the anodes 141r, 141b can be prevented from being connected without being separated.

[0319] According to this embodiment, the anodes 141r, 141b may be formed separately from each other without using an additional process (such as by FMM, etc.), so that: the manufacturing process may be simplified and the manufacturing cost may be reduced.

[0320] At the same time, the second anode 141r can be electrically connected to the protruding region 1212 of the first metal film 121b of the auxiliary electrode 120r. That is, the second anode 141r can be in contact with the top surface and the side surface of the protruding region 1212, and can be in contact with the side surfaces of the second metal film 122b and the third metal film 123b. Therefore, the contact area between the second anode 141r and the auxiliary electrode 120r can be maximized, and the voltage or current supply characteristics can be improved, thereby improving the electrical / optical characteristics.

[0321] The anode 141 b may be removed, and an auxiliary electrode (not shown) positioned below the third anode 141 b may be used as the third anode 141 b.

[0322] like Fig.17F As shown, the red organic light emitting layer 142R and the blue organic light emitting element 140b can be deposited on the anodes 141r and 141b (step A8). Although not shown, the green organic light emitting layer 142G can also be deposited on the green anode ( Fig.15 141g).

[0323] Fig.17F The red organic light emitting layer 142R shown may be Fig. 9B The red organic light-emitting layers R-EML1 and R-EML2 have two stacked structures.

[0324] like Fig. 9B As shown, the red organic light emitting layer 142R and the blue organic light emitting layer 142B may respectively have a series structure including a first stack ST1 , a charge generation layer CGL, and a second stack ST2 .

[0325] For example, the first stack ST1 of the blue organic light emitting layer 142B may be deposited on the red sub-pixel SPr and the blue sub-pixel SPb, and the first stack ST1 of the red organic light emitting layer 142R may be deposited on the red sub-pixel SPr. Then, the charge generation layer CGL may be deposited on the red sub-pixel SPr and the blue sub-pixel SPb. Thereafter, the second stack ST2 of the blue organic light emitting layer 142B may be deposited on the red sub-pixel SPr and the blue sub-pixel SPb, and the second stack ST2 of the red organic light emitting layer 142R may be deposited on the red sub-pixel SPr.

[0326] In this case, a second-second disconnection structure 1842 may be formed in which the third undercut structure 1830 or the like disconnects the first stack ST1 of the blue organic light emitting layer 142B between the red sub-pixel SPr and the blue sub-pixel SPb. A second-third disconnection structure 1823 may be formed in which the third undercut structure 1830 or the like disconnects the charge generation layer CGL between the red sub-pixel SPr and the blue sub-pixel SPb. The second disconnection structure 1840 may be formed of a second-first disconnection structure 1841, a second-second disconnection structure 1842, and a second-third disconnection structure 1823.

[0327] The disconnection of the second anode 141r and the third anode 141b, the disconnection of the first stack ST1 of the blue organic light emitting layer 142B, and the disconnection of the charge generation layer CGL may be performed at the same position. That is, these disconnections may be performed at a position adjacent to the undercut structure 1830 or on a diagonal line of the undercut structure 1830.

[0328] Meanwhile, the organic deposition film constituting the red organic light emitting layer 142R or the blue organic light emitting layer 142B has a poor step coverage characteristic. However, this embodiment can utilize the poor step coverage characteristic of the organic deposition film. That is, in this embodiment, due to the poor step coverage characteristic of the organic deposition film, even if the organic deposition film is deposited, the material of the organic deposition film will not penetrate into the undercut structure 1830. Therefore, since the first stack ST1 or the charge generation layer CGL of the blue organic light emitting layer 142B is disconnected at the entrance of the undercut structure 1830, it is possible to improve the image quality and improve the brightness by minimizing the influence of the lateral leakage current on the adjacent sub-pixels SPr and SPb.

[0329] like Figure 17G As shown, cathode 143 may be formed (step A9).

[0330] Fig.18 The height and depth of the undercut structure in the anode separator structure according to one embodiment are shown.

[0331] like Fig.18 As shown, the cathode 143 (which is for all sub-pixels ( Fig.15 The SPg, SPr, and SPb (of which are common) may not be disconnected (or separated), the second anode 141r and the third anode 141b may be disconnected (or separated) between the red sub-pixel SPr and the red sub-pixel SPr, the first blue organic light-emitting layer B-EML1 may be disconnected (or separated), and the charge generation layer CGL may be disconnected (or separated). In order to obtain these structures, Formula 4 must be satisfied.

[0332] Formula 4

[0333] The thickness 184 of the third anode 141 b + the thickness 185 of the first stack ST1 + the thickness 186 of the charge generation layer CGL < the height 182 of the undercut structure 1830 < the thickness 184 of the third anode 141 b + the total thickness 187 of the blue organic light emitting layer 142B

[0334] The height 182 of the undercut structure 1830 may be at least greater than the sum of the thickness 184 of the third anode 141b (or the second anode 141r), the thickness 185 of the first stack ST1, and the thickness 186 of the charge generation layer CGL. The height 182 of the undercut structure 1830 may be less than the sum of the thickness 184 of the third anode 141b (or the second anode 141r) and the total thickness 187 of the blue organic light emitting layer 142B. The total thickness 187 of the blue organic light emitting layer 142B may be included in Fig. 9B The total thickness of all organic light-emitting layers in the blue organic light-emitting layer 142B is shown.

[0335] Meanwhile, considering the process deviation, the depth 183 of the undercut structure 1830 may be greater than twice the height 182 of the undercut structure 1830 .

[0336] For example, Fig. 9B As shown, in a structure having two stacked series structures, the height 182 and the depth 183 of the undercut structure 1830 can be calculated as follows.

[0337] Thickness of the third anode 141b 184: 50 nm

[0338] Thickness of the first stack ST1 185: 150 nm

[0339] Thickness of the charge generation layer CGL 186: 20 nm

[0340] The total thickness of the blue organic light emitting layer 142B is 187:450 nm

[0341] The height 182 of the undercut structure 1830 may be calculated to be within a range of 220 nanometers to 500 nanometers, and the depth 183 of the undercut structure 1830 may be calculated to be within a range of 440 nanometers to 1,000 nanometers.

[0342] Meanwhile, in a structure having a two-stacked tandem structure, the height 182 and the depth 183 of the undercut structure 1830 calculated in Formula 4 may vary according to the degree of integration. Formula 4 may be equally applied to a single stacked structure ( Fig. 9A ).

[0343] Fig.19 is a cross-sectional view showing an organic light emitting display device according to a fifth embodiment.

[0344] This example is similar to the third example ( Figure 7 ). In the fifth embodiment, the same as the third embodiment ( Figure 7 ) Components with the same structure, shape and / or function are given the same reference numerals, and detailed description thereof is omitted. The fifth embodiment can be equally applied to the first, second and fourth embodiments.

[0345] Reference Fig.19The organic light-emitting display device 100E according to the fifth embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100E according to the fifth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100E according to the fifth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0346] The light scattering particles 190 may be included in the second insulating layer 160. In the drawing, the light scattering particles 190 are included in the second insulating layer 160 only on the leftmost separation region 105, but the light scattering particles 190 may also be included in the second insulating layer 160 on other separation regions 105.

[0347] Green light emitted from the green organic light emitting element 140g, red light emitted from the red organic light emitting element 140r, and blue light emitted from the blue organic light emitting element 140b may proceed to the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0348] For example, the first anode 141g, the second anode 141r, and the third anode 141b may include a reflective film. For example, the cathode 143 may include a semi-transmissive film. Green light, red light, and blue light may be reflected by the reflective film or the semi-transmissive film and emitted forward. Here, P1 to P4 may represent light paths. Part of the light (e.g., red light) may be completely reflected upward in the red organic light emitting element 140r and emitted forward (P2).

[0349] At the same time, part of the light (eg, red light) may be scattered by the light scattering particles 190 and emitted forward (P3). Since more light is extracted to the outside by the light scattering particles 190, the light brightness may be increased.

[0350] Fig. 20 is a cross-sectional view showing an organic light emitting display device according to a sixth embodiment.

[0351] Except for the lens structure 193, this embodiment is similar to the fifth embodiment ( Fig.19 ). In the sixth embodiment, the same as the fifth embodiment ( Fig.19 ) Components with the same structure, shape and / or function are given the same reference numerals, and detailed description thereof is omitted. The sixth embodiment can be equally applied to the first to fourth embodiments.

[0352] Reference Fig. 20The organic light-emitting display device 100F according to the sixth embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100F according to the sixth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100F according to the sixth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0353] The lens structure 193 may be disposed on the third insulating layer 170. For example, the lens structure 193 may be disposed on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0354] The lens structure 193 is shown as a convex surface, but may be a concave surface. After the light passes through the third insulating film 170 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, it may be incident on the lens 193, and then may be incident on another layer disposed on the upper portion of the lens 193 and emitted therefrom. Through this process, the lens 193 may be optimized so that: the light may be emitted forward as much as possible without being completely reflected on the upper and lower surfaces of the lens 193, and may match the refractive index of each layer through which the light passes.

[0355] Although not shown, the light extraction efficiency may be maximized by patterning the second insulating layer 160 into a lens structure to prevent total reflection from occurring at an interface with the third insulating layer 170 .

[0356] Green light emitted from the green organic light emitting element 140g, red light emitted from the red organic light emitting element 140r, and blue light emitted from the blue organic light emitting element 140b may be emitted forward through the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. In this case, the green light, the red light, and the blue light in the second insulating layer 160 may be focused by the lens structures 193. Each lens structure 193 may be greater than or equal to the width of the second insulating layer 160.

[0357] When the second insulating layer 160 includes the light scattering particles 190, the green light, the red light, and the blue light scattered by the light scattering particles 190 may be focused by the lens structure 193, thereby improving the light brightness. The light scattering particles 190 may be omitted.

[0358] Although the drawings illustrate one lens structure 193 , the lens structure 193 may be disposed on an upper surface of each second insulating layer 160 between the plurality of first three-dimensional structures 130 - 1 and the plurality of second three-dimensional structures 130 - 2 .

[0359] Fig.21A It is a cross-sectional view of a schematic panel design of an AR product. Fig.21B yes Fig.21A Design data sheet for panel design. Fig. 22 It is a plan view of a schematic panel design of an AR product.

[0360] As described above, the larger the average wall angle θa, the smaller the pixel P (or sub-pixel) can be, which is advantageous for high resolution. Fig. 22 A screen designed to have the highest level of integration physically possible.

[0361] Refer to Figure 21 and Fig. 22 , the diagonal size of the screen of the target product may be 0.6”, the screen ratio may be 16:9, and the resolution may be QHD (Quad HD).

[0362] In this case, the integration degree of the pixels P of the panel may be 4,900 ppi, and the size of the pixels P may be 5.2 μm.

[0363] Through this design, a theoretical light emitting area ratio and a target deposition angle θe are calculated. The light emitting area ratio may be the total area of ​​each color emitted from the sub-pixels divided by the area of ​​the pixel P. The target deposition angle θe may be an angle at which the desired organic light emitting material is deposited only on a specific area of ​​the second three-dimensional structure 130-2 and not on other areas (such as the separation area 105, etc.) by using the shadow effect caused by the first three-dimensional structure 130-1.

[0364] like Fig. 22 As shown, the height of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be designed to be 4 μm. The width of each of the lower surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 in the first direction X can be designed to be 2.2 μm, and the width thereof in the second direction Y can be designed to be 4.0 μm. The distance between the rows of the three-dimensional structures 130-1 and 130-2 can be designed to be 1.2 μm. If the vertical boundaries of the red anode and the green anode are designed to be 0.6 μm on the upper side and 1.0 μm on the lower side and the spacing between the rows is 1.0 μm, the total light-emitting area (anode area) can be 22.4 μm 2 In this case, the light emitting area ratio (which is the total area divided by the pixel P area (27 μm 2 )) can be calculated as 83%.

[0365] The target deposition angle θe may be 51 degrees, and the deposition angle margin may be ±6 degrees.

[0366] Compared with the 20 to 25% luminous area ratio of a typical 500ppi mobile phone product, in the structure of this embodiment, although the integration of pixels P is 5,000ppi (ten times higher), it is possible to manufacture products with a luminous area ratio of 3 times or more. In addition, the SAD structure of this embodiment can utilize the integration density of pixels P to realize a side-by-side structure in the product area, in which FMM cannot be used, so it can be seen that this is a breakthrough technology that can improve the brightness and life of the product.

[0367] The above detailed description should not be interpreted as limiting in all aspects, but should be regarded as illustrative. The scope of the embodiments should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the embodiments are included in the scope of the embodiments.

Claims

1. An organic light emitting display device, comprising: a first three-dimensional structure, which is located on a substrate; a second three-dimensional structure, which is separated from the first three-dimensional structure by a separation area along a first direction on the substrate, and the separation area is located between the second three-dimensional structure and the first three-dimensional structure; A first sub-pixel, which is located on a side surface of the first three-dimensional structure; a second sub-pixel located on a side surface of the second three-dimensional structure; and A third sub-pixel is located on the separation area, Wherein, the first sub-pixel includes a first organic light-emitting element, Wherein, the second sub-pixel includes a second organic light-emitting element, Wherein, the third sub-pixel includes a third organic light-emitting element, The first three-dimensional structure and the second three-dimensional structure each have a structure separated into at least one or more pixel units along the second direction, and The one side surface of the first three-dimensional structure and the one side surface of the second three-dimensional structure are each inclined relative to the substrate.

2. The organic light emitting display device according to claim 1, wherein: The one side surface of the first three-dimensional structure has a first average wall angle relative to the substrate, The one side surface of the second three-dimensional structure has a second average wall angle relative to the substrate, and The first average wall angle and the second average wall angle are each greater than 60 degrees and less than 90 degrees.

3. The organic light emitting display device according to claim 1, further comprising: another second sub-pixel, which is located on another side surface of the first three-dimensional structure; and Another first sub-pixel is located on another side surface of the second three-dimensional structure.

4. The organic light emitting display device according to claim 1, wherein: One or two first organic light emitting elements are arranged on the one side surface of the first three-dimensional structure along the second direction, One or two second organic light emitting elements are arranged on the one side surface of the second three-dimensional structure along the second direction, and One or two third organic light emitting elements are disposed on the third auxiliary electrode along the second direction.

5. The organic light emitting display device according to claim 1, comprising: a first anode separation structure disposed along a perimeter of the first three-dimensional structure; and A second anode separator structure is disposed along a perimeter of the second three-dimensional structure.

6. The organic light emitting display device according to claim 5, wherein: The first organic light emitting element, the second organic light emitting element and the third organic light emitting element include a common charge generating layer, The first anode separation structure is configured to disconnect the charge generation layer between the first sub-pixel and the third sub-pixel, and The second anode separation structure is configured to disconnect the charge generation layer between the second sub-pixel and the third sub-pixel.

7. The organic light emitting display device according to claim 1, further comprising: A first insulating layer, which is located on the first organic light emitting element, the second organic light emitting element and the third organic light emitting element; a second insulating layer located on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure; and A third insulating layer is located on the second insulating layer.

8. The organic light emitting display device according to claim 7, wherein: The third insulating layer is configured to contact an upper surface of the first three-dimensional structure and an upper surface of the second three-dimensional structure.

9. The organic light emitting display device according to claim 8, wherein: The second insulating layer includes light scattering particles.

10. The organic light emitting display device according to claim 7, further comprising: A lens structure is located on the second insulating layer between the first three-dimensional structure and the second three-dimensional structure.

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