Chip sorting equipment and sorting method

Abstract

The invention relates to the technical field of MCU chip sorting, in particular to chip sorting equipment and a sorting method. The device comprises an operation box, a control box, a conveying unit, a discharging box, a sorting box, a bearing assembly and a sorting assembly. Firstly, materials are automatically discharged through the discharging box. The sorting seat at the upper part is moved, lifted and rotated to adjust the trend of the isolation sheets to be consistent with the cutting arrangement trend of the chips; and the spacer descends to extend into the cutting gap on the wafer. The chips are detected by the corresponding detectors at a short distance in the separated and positioned states, and the detection result is accurate. And finally, according to a detection result, qualified / unqualified chips fall into the corresponding qualified sorting cavities and unqualified sorting cavities, and the films are sucked into the sorting discs and pricked on the positioning needles, so that classified discharging of the chips is realized. The whole chip screening process is intelligent and automatic, damage to the chips is small, the positions of the chips in the whole process are stable, detection pertinence is high, and the purpose of efficient and accurate sorting is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of MCU chip sorting, and in particular to a chip sorting device and a chip sorting method. Background Art

[0002] MCU chip, or microcontroller chip, is a highly integrated electronic component that integrates a central processing unit (CPU), memory (such as ROM, RAM), input and output interface (I / O) and various peripheral controllers (such as timers, serial communication interfaces, ADC / DAC, etc.) on a single chip. This design enables MCU to perform complex control logic and data processing tasks while maintaining a small size and low power consumption.

[0003] The Chinese patent document with authorization announcement number CN219745571U provides a chip sorting mobile platform and a chip sorting machine, wherein the chip sorting mobile platform includes: a lateral moving component and a lifting shaft component, the chip material tray of the chip sorting machine is connected to the lateral moving component through the lifting shaft component, the lateral moving component includes a lateral moving guide, a first driving device, a lateral moving device, a first mounting seat and a first sensing device, the lateral moving guide, the first driving device and the first sensing device are respectively mounted on the first mounting seat, the first driving device is connected to the lateral moving device, and the lateral moving device is movably connected to the lateral moving guide.

[0004] Before chip sorting, the whole wafer needs to be divided into single chips (grains) according to the chip size. During sorting, the whole wafer needs to be used as the sorting object, and qualified products and unqualified products need to be selected separately. The chip sorting equipment in the prior art mainly assists chip sorting by moving and lifting. When the cut chip is removed from the film, the film is prone to deformation, which will cause the chips that were originally expanded during the detection process to be re-attached together, which affects the expansion effect on the one hand, and on the other hand, the chip movement is prone to damage and affects the detection results. The film is also not fixed and may adsorb the chip and cannot be completely peeled off the chip. Summary of the invention

[0005] In view of the problems existing in the background technology, a chip sorting device and a chip sorting method are proposed. The entire chip screening process is intelligent and automatic, with little damage to the chip. The chip position is stable throughout the whole process, and the detection is highly targeted, so as to achieve the purpose of efficient and accurate sorting.

[0006] The present invention provides a chip sorting device, comprising an operating box, a control box, a conveying unit, a discharge box, a sorting box, a bearing assembly and a sorting assembly; the operating box and the control box are integrated; the conveying unit is located in the middle of the operating box, and a parallel double-layer structure is arranged one above and one below, and the upper and lower layers are staggered head to tail; the discharge box is located at the top of the operating box, which is located at one side of the upper conveying unit and the head end of the lower conveying unit, and is used for stacking wafers and discharging materials to the lower conveying unit; the sorting box is located at the bottom of the operating box, which is located at one side of the lower conveying unit and the tail end of the upper conveying unit, and is used for sorting qualified wafers after sorting by the upper conveying unit / Unqualified chips are packaged and the remaining film on the lower conveying unit is collected; the carrying component and the sorting component cooperate with each other, the carrying component is located on the lower conveying unit, and circulates between the discharge box and the sorting box to carry the wafers in the discharge box and assist in the separation of chips and films through the ejection end; the sorting component is located on the upper conveying unit, and circulates between the discharge box and the sorting box. On the one hand, it is lifted and lowered through the isolation end and extends between adjacent chips to separate and position the chips. On the other hand, the detection end detects the chips one by one, sorts out qualified / unqualified products, and peels off the chips from the film.

[0007] Preferably, the discharge box includes a box body one; the discharge pieces are arranged on both sides of the box body one, one on the left and one on the right, and drive the wafers to move layer by layer through synchronous downward rotation; the discharge port is located at the bottom of the box body one.

[0008] Preferably, the discharging member includes rotating rollers rotatably arranged on the upper and lower sides of the box body; the rotating belt rotates by sleeve-engaging the rotating rollers on the upper and lower sides; and multiple groups of isolation frames are arranged at equal intervals along the rotating belt.

[0009] Preferably, the conveying unit includes two groups of conveying rollers driven by motor 2 and two groups of conveying belts which are parallelly sleeved on the two groups of conveying rollers; the two groups of conveying belts are arranged at intervals; and the bearing component / sorting component is arranged between the two groups of conveying belts.

[0010] Preferably, the sorting assembly includes a mounting seat one connected to the two sets of conveyor belts; a lifting seat is lifted and lowered below the mounting seat one; a sorting seat is rotatably arranged on the lifting seat, and an isolation end and a sorting end are arranged on the sorting seat.

[0011] Preferably, the sorting seat includes a seat body, a plurality of groups of isolation plates arranged in parallel along the surface of the seat body, a plurality of groups of detectors located between two groups of isolation plates, and an adsorption tank located outside the detector.

[0012] Preferably, the supporting assembly includes a load-bearing frame connected to the conveyor belt, a supporting seat for fixing the wafer, and an ejector located between the two; the supporting seat is penetrated by through holes corresponding to the detectors one by one; an adsorption groove two is arranged on the periphery of the through hole; the ejector is squeezed up and down, and the ejection end extends out of the through hole to eject the chips on the wafer one by one.

[0013] Preferably, the ejector includes an airbag bag corresponding to the position of the row of detectors and located between the load-bearing frame and the bearing seat; the pressure valves are arranged along the airbag bag and extend into the through holes from the bottom one by one; the ejector head is slidably arranged in the through hole, and air is discharged / intaken through the pressure valve, and the ejector head moves up and down and enters and exits the through hole; an elastic member for assisting the airbag bag inlet is also arranged between the load-bearing frame and the bearing seat.

[0014] Preferably, the sorting box includes a second box body and a sorting disk; the second box body is divided into a qualified sorting chamber and an unqualified sorting chamber by a partition frame; the material guide table is located on the partition frame, and an arc-shaped convex surface is provided to assist in the classification and placement of the sorted chips; a filter is provided on the sorting disk; a vacuum pump is used to form a negative pressure at the bottom of the filter to adsorb the film, and a positioning needle is provided at the top of the filter to pierce the film for positioning.

[0015] The present invention further proposes a chip sorting method, using the above chip sorting equipment, the sorting steps are as follows:

[0016] The wafers stacked in the discharge box fall on the carrying assembly; the carrying assembly moves from the discharge box along with the lower conveying unit, and the external chip expansion equipment expands its capacity; the sorting assembly moves from the discharge box along with the upper conveying unit; after the sorting assembly and the carrying assembly move to relative positions, the isolation end extends between adjacent chips to separate and position the chips, the detection end detects the chips one by one, sorts out qualified / unqualified products, and peels off the film from the chips; the qualified / unqualified chips move to the top of the sorting box along with the sorting assembly, and fall into the corresponding sorting cavities respectively; the film moves to the top of the sorting box along with the carrying assembly and is collected by it.

[0017] Compared with the prior art, the present invention has the following beneficial technical effects: the present invention first stacks the cut wafers layer by layer through the discharge box, and automatically drops the wafers onto the bearing seat of the bearing assembly, and then cooperates with the bearing assembly and the sorting assembly to move horizontally up and down to relative positions. The sorting seat above adjusts the direction of its isolation plate to be consistent with the direction of the chip cutting arrangement by moving, lifting and rotating; the isolation plate descends to extend into the cutting gap on the wafer. On the one hand, the isolation plate is separated to achieve separation and positioning of the chips, and on the other hand, the seat body is lowered to press the bearing seat, and the airbag bag is exhausted to push the ejection head out, assisting the separation of the upper chip and the film, and finally reducing the damage and displacement of the chip. In the state of separation and positioning, the chip is detected at close range by the corresponding detector, and the detection result is accurate. Finally, according to the detection results, the qualified / unqualified chips fall into the corresponding qualified sorting cavity and unqualified sorting cavity, and the film is sucked into the sorting disk and pierced on the positioning pin to achieve the classification and discharge of the chips. The entire chip screening process is intelligent and automatic, with little damage to the chips. The chips are kept in a stable position throughout the process, and the detection is highly targeted, so as to achieve the goal of efficient and accurate sorting. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the chip sorting device in the present invention (viewing angle 1);

[0019] Figure 2 This is a schematic diagram of the structure of the chip sorting device in the present invention (viewing angle 2);

[0020] Figure 3 It is a cross-sectional view of the discharge box in the present invention;

[0021] Figure 4 It is a schematic diagram of the combined structure of the conveying unit, the bearing assembly and the sorting assembly in the present invention;

[0022] Figure 5 It is a schematic diagram of the splitting of the sorting components in the present invention;

[0023] Figure 6 It is a structural schematic diagram of the sorting seat in the present invention;

[0024] Figure 7 It is a partial cross-sectional view of the load-bearing component in the present invention;

[0025] Figure 8 for Figure 7 The enlarged schematic diagram at A in the middle;

[0026] Fig. 9 It is a structural schematic diagram of the sorting box in the present invention.

[0027] Reference numerals: 1, operation box; 2, control box; 201, display screen; 3, discharge box; 301, box body 1; 302, discharge port; 303, rotating roller; 304, rotating belt; 305, isolation frame; 4, conveying unit; 401, conveying roller; 402, conveying belt; 5, bearing assembly; 501, load-bearing frame; 502, mounting frame 2; 503, bearing seat; 50301, through hole; 504, ejector; 50401, airbag bag; 50402, pressure valve; 50403, ejector Head; 50404, adsorption slot 2; 505, elastic part; 6, sorting component; 601, mounting seat 1; 602, cylinder; 603, mounting frame 1; 604, lifting seat; 605, sorting seat; 60501, seat body; 60502, isolation plate; 60503, detector; 60504, adsorption slot 1; 7, sorting box; 701, box body 2; 702, sorting plate; 703, partition frame; 704, material guide table; 705, box door; 706, filter screen; 707, positioning pin. DETAILED DESCRIPTION

[0028] Embodiment 1

[0029] like Figure 1-Figure 2As shown, the present invention proposes a chip sorting device, including an operation box 1, a control box 2, a conveying unit 4, a discharge box 3, a sorting box 7, a bearing assembly 5 and a sorting assembly 6; the operation box 1 and the control box 2 are integrated; the conveying unit 4 is located in the middle of the operation box 1, and a parallel double-layer structure is arranged one above and one below, and the upper and lower layers are staggered head to tail; the discharge box 3 is located at the top of the operation box 1, which is located on one side of the upper conveying unit 4 and the head end of the lower conveying unit 4, and is used for stacking wafers and discharging to the lower conveying unit 4; the sorting box 7 is located at the bottom of the operation box 1, which is located on one side of the lower conveying unit 4 and the tail end of the upper conveying unit 4, and is used for stacking wafers to the lower conveying unit 4. 4. The qualified / unqualified chips are packaged after sorting and the remaining film on the lower conveying unit 4 is collected; the carrying component 5 and the sorting component 6 cooperate with each other, the carrying component 5 is located on the lower conveying unit 4, and circulates between the discharge box 3 and the sorting box 7 to carry the wafers in the discharge box 3, and assists in the separation of the chips and the film through the ejection end; the sorting component 6 is located on the upper conveying unit 4, and circulates between the discharge box 3 and the sorting box 7. On the one hand, it is lifted and lowered through the isolation end and extends into between adjacent chips to separate and position the chips. On the other hand, the detection end detects the chips one by one, sorts out qualified / unqualified products, and peels off the film from the chips.

[0030] like Figure 3 As shown, the discharge box 3 includes a box body 301; the discharge pieces are arranged on both sides of the box body 301 on the left and the right, and drive the wafers to move layer by layer through synchronous downward rotation; the discharge port 302 is located at the bottom of the box body 301.

[0031] like Figure 3 As shown, the discharging member includes rotating rollers 303 arranged on the upper and lower sides of the box body 301 and driven by a motor; the rotating belt 304 rotates by sleeve-engaging the rotating rollers 303 on the upper and lower sides; and multiple groups of isolation frames 305 are arranged at equal intervals along the rotating belt 304.

[0032] It should be further explained that the isolation racks 305 of the two groups of discharge pieces are arranged in a one-to-one correspondence.

[0033] It should be further explained that an opening is provided on the side wall of the box body 301 for the rotating belt 304 to pass through.

[0034] When feeding, the wafers are placed layer by layer between the two sets of rotating belts 304, and the wafers are fixed by the upper, lower, left and right isolation frames 305. When the rotating belts 304 rotate, the wafers are driven to descend synchronously and fall one by one on the supporting assembly 5.

[0035] like Figure 4As shown, the conveying unit 4 includes two groups of conveying rollers 401 driven by a second motor and two groups of conveying belts 402 which are parallelly sleeved on the two groups of conveying rollers 401. The two groups of conveying belts 402 are arranged at intervals; the bearing assembly 5 / sorting assembly 6 is arranged between the two groups of conveying belts 402.

[0036] like Figure 5 As shown, the sorting assembly 6 includes a mounting seat 1 601 connected to two sets of conveyor belts 402 and mounted on a cylinder 602. A lifting seat 604 is driven by the cylinder 602, raised and lowered on the mounting seat 1 601, and mounted on the motor 3; a sorting seat 605 is driven by the motor 3, and is rotatably arranged on the lifting seat 604, and an isolation end and a sorting end are arranged on the sorting seat 605.

[0037] The sorting seat 605 can adjust the positions of its isolation end and sorting end by moving, lifting and rotating to assist it in cooperating with the carrying assembly 5 .

[0038] like Figure 6 As shown, the sorting seat 605 includes a seat body 60501, multiple groups of isolation plates 60502 arranged in parallel along the surface of the seat body 60501, multiple groups of detectors 60503 located between two groups of isolation plates 60502, and an adsorption groove 60504 located outside the detector 60503.

[0039] It should be further explained that the seat body 60501 is installed on the conveyor belt 402 through a mounting frame 603.

[0040] It should be further explained that the isolation sheet 60502 is the isolation end, which is set to a trapezoidal cross-section with a narrow top and a narrow bottom, and is made of rubber material. It separates and positions adjacent chips by extending into the cutting gap on the wafer.

[0041] It should be further explained that the number and position of the detectors 60503 correspond one-to-one to the chips on the wafer, and the image acquisition technology is used to sort whether the chip appearance is qualified and determine its specification category.

[0042] It should be further explained that a display screen 201 for displaying the enlarged image of the chip is provided on the control box 2 .

[0043] It should be further explained that the adsorption tank 60504 is arranged around the detector 60503, and the two constitute a sorting end. A corresponding adsorption pump 1 is arranged in the tank, and the corresponding chips are adsorbed one by one through negative pressure. After detection, the chips are peeled off to separate them from the bottom film.

[0044] like Figure 7As shown, the bearing assembly 5 includes a load-bearing frame 501 connected to the conveyor belt 402, a bearing seat 503 for fixing the wafer, and an ejector 504 located therebetween; the load-bearing frame 501 is installed on the conveyor belt 402 through a second mounting frame 502; the bearing seat 503 is penetrated by through holes 50301 corresponding to the detectors 60503 one by one; adsorption grooves 50404 are arranged on the periphery of the through holes 50301; the ejector 504 is squeezed up and down, and the ejection end extends out of the through holes 50301 to eject the chips on the wafer one by one.

[0045] like Figure 8 As shown, the ejector 504 includes an airbag bag 50401 corresponding to the position of the row of detectors 60503 and located between the load-bearing frame 501 and the bearing seat 503; the pressure valves 50402 are arranged along the airbag bag 50401 and extend into the through hole 50301 from the bottom one by one; the ejector head 50403 is slidably set in the through hole 50301, and air is discharged / intaken through the pressure valve 50402, and the ejector head 50403 moves up and down and enters and exits the through hole 50301.

[0046] It should be further explained that the adsorption groove 50404 is arranged around the ejection head 50403, and the two constitute the ejection end. The corresponding adsorption pump 2 is arranged in the groove, and the film on the outer periphery of the corresponding chip is adsorbed by negative pressure to assist the chip peeling.

[0047] It should be further explained that an elastic member 505 for assisting the air bag 50401 in air intake is also provided between the load-bearing frame 501 and the bearing seat 503 .

[0048] It should be further explained that the elastic member 505 is a spring, which is located at the periphery of the airbag bag 50401 to assist the airbag bag 50401 in taking in air.

[0049] When the seat body 60501 descends, it presses the bearing seat 503, and the bearing seat 503 descends to squeeze the airbag 50401. The gas in the airbag 50401 is discharged through the pressure valve 50402, so that the ejector head 50403 extends out of the through hole 50301 and lifts up the chip above. At this time, negative pressure is generated around the adsorption groove 2 50404, which adsorbs the film on the outer periphery of the corresponding chip and assists in chip peeling. When the seat body 60501 moves up, the spring assists the airbag 50401 to take in air and reset it.

[0050] like Fig. 9As shown, the sorting box 7 includes a box body 701 and a sorting plate 702; the box body 701 is divided into a qualified sorting chamber and an unqualified sorting chamber by a partition frame 703; the material guide table 704 is located on the partition frame 703, and an arc-shaped convex surface is provided to assist in the classification and placement of the sorted chips; a filter screen 706 is provided on the sorting plate 702; a vacuum pump is used to form a negative pressure at the bottom of the filter screen 706 to adsorb the film, and a positioning needle 707 is provided at the top of the filter screen 706 to pierce the film for positioning.

[0051] The qualified / unqualified chips move to the top of the sorting box 7 along with the sorting component 6, and fall into the corresponding qualified sorting cavity and unqualified sorting cavity. The sorted chips are taken out by opening the box door 705; the film moves to the top of the sorting box 7 along with the supporting component 5, is sucked into the sorting disk 702, and is pierced on the positioning pin 707, and can be removed after sorting.

[0052] Embodiment 2

[0053] This embodiment proposes a chip sorting method, using the chip sorting device described in the first embodiment, and the sorting steps are as follows:

[0054] S1. The staff places the wafers layer by layer between the two sets of rotating belts 304. The wafers are fixed by the upper, lower, left and right isolation frames 305. When the rotating belts 304 rotate, the wafers are driven to descend synchronously and fall one by one on the supporting seats 503 of the supporting assembly 5.

[0055] S2, negative pressure is generated around the second adsorption groove 50404, the film on the outer periphery of the corresponding chip is adsorbed to fix the wafer;

[0056] S3, the carrying component 5 moves from the discharge box 3 along with the lower conveying unit 4, and the external chip expansion device expands its capacity; the sorting component 6 moves from the discharge box 3 along with the upper conveying unit 4; the sorting component 6 and the carrying component 5 move to opposite positions;

[0057] S4, the sorting seat 605 adjusts the direction of its isolation plate 60502 to be consistent with the chip cutting arrangement direction by moving, lifting and rotating; the isolation plate 60502 descends to extend into the cutting gap on the wafer;

[0058] S5, the seat body 60501 descends, pressing the supporting seat 503, and the supporting seat 503 descends to squeeze the airbag 50401; the gas in the airbag 50401 is discharged through the pressure valve 50402, so that the ejector head 50403 extends out of the through hole 50301, and lifts up the chip above; at this time, negative pressure is generated around the adsorption groove 2 50404, which adsorbs the film on the outer periphery of the corresponding chip to assist in chip peeling;

[0059] S6. The chips are separated and positioned by the isolation sheet 60502, and at the same time, the corresponding chips are adsorbed one by one by the negative pressure around the adsorption groove 1 60504, and the chips are peeled off and separated from the bottom film;

[0060] S7, the detector 60503 detects the independent chips one by one to determine whether the chip appearance is qualified and to determine its specification category;

[0061] S8. The qualified / unqualified chips move to the top of the sorting box 7 along with the sorting component 6 and fall into the corresponding qualified sorting cavity and unqualified sorting cavity; the film moves to the top of the sorting box 7 along with the supporting component 5, is sucked into the sorting disk 702, and is pierced on the positioning pin 707.

[0062] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A chip sorting device, characterized in that: include: An integrated operation box (1) and a control box (2); The conveying unit (4) is located in the middle of the operation box (1), and has a parallel double-layer structure, with the upper and lower layers being staggered head to tail; A discharge box (3) located at the top of the operation box (1), which is located on one side of the upper conveying unit (4) and the head end of the lower conveying unit (4), and is used for stacking wafers and discharging materials to the lower conveying unit (4); A sorting box (7) located at the bottom of the operation box (1), which is located on one side of the lower conveying unit (4) and at the rear end of the upper conveying unit (4), is used for packaging qualified / unqualified chips after sorting by the upper conveying unit (4) and collecting the remaining film on the lower conveying unit (4); and a supporting component (5) and a sorting component (6) that cooperate with each other; The carrying assembly (5) is located on the lower conveying unit (4), and circulates between the discharge box (3) and the sorting box (7), carries the wafers in the discharge box (3), and assists in the separation of the chip and the film through the ejection end; The sorting component (6) is located on the upper conveying unit (4) and circulates between the discharge box (3) and the sorting box (7). On the one hand, it is lifted and lowered through the isolation end and extends into the gaps between adjacent chips to separate and position the chips. On the other hand, it detects the chips one by one through the detection end to sort out qualified / unqualified products and peel off the chips from the film.

2. The chip sorting device according to claim 1, characterized in that: The discharge box (3) comprises a box body (301); the discharge pieces are arranged on both sides of the box body (301) on the left and the right, and drive the wafers to move layer by layer by synchronously rotating downward; the discharge port (302) is located at the bottom of the box body (301).

3. The chip sorting device according to claim 2, characterized in that: The material discharging member comprises rotating rollers (303) rotatably arranged on the upper and lower sides of the box body (301); the rotating belt (304) rotates by sleeve-engaging the rotating rollers (303) on the upper and lower sides; and a plurality of isolation frames (305) are arranged at equal intervals along the rotating belt (304).

4. The chip sorting device according to claim 1, characterized in that: The conveying unit (4) comprises two groups of conveying rollers (401) driven by a second motor and two groups of conveying belts (402) sleeved in parallel on the two groups of conveying rollers (401); Two sets of conveyor belts (402) are arranged at intervals; The carrying assembly (5) / sorting assembly (6) is arranged between two groups of conveyor belts (402).

5. The chip sorting device according to claim 4, characterized in that: The sorting assembly (6) comprises a mounting base (601) connected to two sets of conveyor belts (402); The lifting seat (604) is lifted and lowered below the first mounting seat (601); The sorting seat (605) is rotatably arranged on the lifting seat (604), and an isolation end and a sorting end are arranged on the sorting seat (605).

6. The chip sorting device according to claim 5, characterized in that: The sorting seat (605) includes a seat body (60501), multiple groups of isolation plates (60502) arranged in parallel along the surface of the seat body (60501), multiple groups of detectors (60503) located between two groups of isolation plates (60502), and an adsorption tank (60504) located outside the detector (60503).

7. The chip sorting device according to claim 6, characterized in that: The bearing assembly (5) comprises a bearing frame (501) connected to the conveyor belt (402), a bearing seat (503) for fixing the wafer, and an ejector (504) located between the two; The support base (503) is provided with through holes (50301) corresponding to the detectors (60503) one by one; the outer periphery of the through hole (50301) is provided with a second adsorption groove (50404); The ejector (504) is pressed up and down, and the ejector end extends out of the through hole (50301) to eject the chips on the wafer one by one.

8. The chip sorting device according to claim 7, characterized in that: The ejector (504) includes an air bag (50401) corresponding to the position of the row of detectors (60503) and located between the load-bearing frame (501) and the bearing seat (503); The pressure valves (50402) are arranged along the airbag bag (50401) and extend into the through holes (50301) from the bottom in a one-to-one correspondence; The ejector head (50403) is slidably disposed in the through hole (50301), and air is discharged / intaken through the pressure valve (50402), and the ejector head (50403) moves up and down and enters and exits the through hole (50301); An elastic member (505) for assisting the air bag (50401) in air intake is also provided between the load-bearing frame (501) and the bearing seat (503).

9. The chip sorting device according to claim 1, characterized in that: The sorting box (7) comprises a second box body (701) and a sorting plate (702); The second box body (701) is divided into a qualified sorting chamber and an unqualified sorting chamber by a partition frame (703); The guide table (704) is located on the partition frame (703) and is provided with an arc-shaped convex surface to assist in the classification and placement of the sorted chips; A filter screen (706) is arranged on the sorting plate (702); a vacuum pump is used to form a negative pressure at the bottom of the filter screen (706) to adsorb the film, and a positioning needle (707) is arranged at the top of the filter screen (706) to pierce the film for positioning.

10. A chip sorting method, characterized in that: Using the chip sorting device described in claim 1, the sorting steps are as follows: The wafers stacked in the discharge box (3) fall onto the carrier assembly (5); the carrier assembly (5) moves from the discharge box (3) along with the conveying of the lower conveying unit (4), and the external chip expansion device expands its capacity; the sorting assembly (6) moves from the discharge box (3) along with the conveying of the upper conveying unit (4); after the sorting assembly (6) and the carrier assembly (5) move to relative positions, the isolation end extends between adjacent chips to separate and position the chips, the detection end detects the chips one by one, sorts out qualified / unqualified products, and peels off the film from the chips; the qualified / unqualified chips move to the top of the sorting box (7) along with the sorting assembly (6), and fall into the corresponding sorting chambers respectively; the film moves to the top of the sorting box (7) along with the carrier assembly (5), and is collected by it.

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