Semiconductor substrate cleaning equipment and cleaning method thereof

Abstract

The invention discloses semiconductor substrate cleaning equipment and a cleaning method thereof. The semiconductor substrate cleaning equipment comprises a control cabinet body, an ultrasonic cleaning box is installed on the control cabinet body, three fixing rods are connected to the ultrasonic cleaning box, the other ends of the fixing rods are fixedly connected with connecting cylinders, and air pipes are connected to the connecting cylinders in a penetrating mode. According to the ultrasonic cleaning device, the ultrasonic cleaning box, the bearing frame, the air suction frame, the air outlet channel, the rotating beads and the guide groove are adopted, dust and particle impurities attached to the surface of a semiconductor substrate are blown and cleaned before the semiconductor substrate enters a cleaning agent in the ultrasonic cleaning box, and multi-angle blown air comprehensively covers the surface of the semiconductor substrate and gaps of the semiconductor substrate; dust and particle impurities are sucked by the air suction frame along with air, the influence of the dust and particle impurities on the cleaning agent is avoided, organic matter, the particle impurities and the dust are treated separately, and the service life of the cleaning agent and the cleaning effect of gaps in the semiconductor substrate are guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor cleaning, and in particular relates to a semiconductor substrate cleaning device and a cleaning method thereof. Background Art

[0002] In the field of semiconductor substrate cleaning technology, ultrasonic cleaning technology has been widely used. Its working principle is to use high-frequency alternating current to excite piezoelectric resonator crystals to generate high-frequency sound waves. These sound waves form a thin acoustic boundary layer on the surface of the substrate and generate tiny pressure fluctuations in the cleaning solution. The effect of this sound wave energy, combined with the synergistic effect of chemical cleaning agents, effectively cleans semiconductor substrates in depth and removes contaminants on the surface and in tiny gaps.

[0003] However, existing ultrasonic cleaning technology has certain limitations in practical applications. Specifically, when stubborn dust, particulate debris and organic matter adhere to the surface of the semiconductor substrate, traditional cleaning methods are often difficult to completely remove these impurities. During the cleaning process, the dust and particles adhering to the substrate are easy to fall off and mix into the cleaning agent, which not only causes contamination of the cleaning agent and reduces its cleaning efficiency, but may also shorten the service life of the cleaning agent. In addition, the dust and particulate debris in the tiny gaps and grooves on the surface of the substrate are difficult to be thoroughly cleaned by the cleaning agent due to physical obstacles, thereby affecting the final cleaning effect and the surface cleanliness of the semiconductor substrate. Therefore, in view of these technical defects, the optimization and innovation of semiconductor substrate cleaning equipment is particularly important.

[0004] Based on this, the present invention designs a semiconductor substrate cleaning device and a cleaning method thereof to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to propose a semiconductor substrate cleaning device and a cleaning method to solve the problem of cleaning agent contamination, reduced cleaning efficiency, and possibly shortened service life of the cleaning agent, which makes it difficult to be thoroughly cleaned by the cleaning agent, thereby affecting the final cleaning effect and the surface cleanliness of the semiconductor substrate.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A semiconductor substrate cleaning device comprises a control cabinet, an ultrasonic cleaning box is installed on the control cabinet, three fixing rods are connected to the ultrasonic cleaning box, the other end of the fixing rod is fixedly connected to a connecting tube, an air pipe is connected through the connecting tube, the bottom end of the air pipe is connected to a rotating air outlet device, a guide groove is provided in the connecting tube, the rotating air outlet device is slidably connected in the guide groove, the rotating air outlet device is connected to a movable adjustment device that is arranged on the connecting tube, the back of the movable adjustment device is connected to an intermediate tube, the other end of the intermediate tube is connected to a fixed An extrusion adjustment device is fixedly connected to the inner wall of the ultrasonic cleaning box, three sliding support devices are fixedly connected to the inner wall of the ultrasonic cleaning box, a bearing frame is fixedly connected to the sliding support device, a placement groove is provided on the bearing frame, both sides of the bearing frame are penetrated and connected with movable limiting devices located in the placement groove, a vertical plate is connected to the position of the bearing frame at the rear side of the inner wall of the ultrasonic cleaning box corresponding to the position of the bearing frame, an extrusion block is fixedly connected to the front side of the vertical plate, an extension rod is connected to the position of the movable limiting device at the lower side of the inner wall of the ultrasonic cleaning box, and the top of the extension rod is fixedly connected to the extrusion plate.

[0008] As a further description of the above technical solution:

[0009] The width of the extrusion plate is greater than the width of the extrusion block, two cabinet doors are hinged on the front of the control cabinet, the bottom end of the air pipe is connected to a fan assembly, the fan assembly is fixedly connected to the side of the control cabinet, the support frame is fixedly connected to an air suction frame, and the side of the air suction frame is connected to a connecting pipe.

[0010] As a further description of the above technical solution:

[0011] The rotating air outlet device includes a connecting cover and a rotating seat connected to the bottom end of the air pipe. The rotating seat is outer-circuited with a sealing bearing, and the sealing bearing is rotatably connected to the inner wall of the connecting cover. The outer arc surface of the rotating seat is fixedly connected to a rotating ball, and the rotating ball is slidably connected in the guide groove.

[0012] As a further description of the above technical solution:

[0013] Four circles of air outlet channels are connected through the rotating seat, each circle of air outlet channels is equidistantly arranged under the rotating seat, the axes of the four circles of air outlet channels coincide, and the inclination angles of the four circles of air outlet channels are different. The connecting cover is slidably connected in the connecting cylinder.

[0014] As a further description of the above technical solution:

[0015] The movable adjustment device includes an upper piston cylinder connected to the connecting cylinder, a first piston plate is slidably connected inside the upper piston cylinder, an adjusting rod is connected below the first piston plate, the bottom end of the adjusting rod is fixedly connected to the connecting cover, and an air storage chamber located on the upper side of the first piston plate in the upper piston cylinder is connected to the middle tube of the trachea.

[0016] As a further description of the above technical solution:

[0017] The adjusting rod is slidably connected to a first sealing connection sleeve penetrating and connected to the lower part of the upper piston cylinder. The adjusting rod outer sleeve is provided with a first elastic component, and the two ends of the first elastic component are respectively fixedly connected to the first piston plate and the inner wall of the upper piston cylinder.

[0018] As a further description of the above technical solution:

[0019] The extrusion adjustment device includes a lower piston cylinder fixedly connected to the inner wall of the ultrasonic cleaning box, a second piston plate is slidably connected in the lower piston cylinder, an air storage chamber located at the lower side of the second piston plate in the lower piston cylinder is connected to the intermediate tube, an elastic telescopic rod is fixedly connected to the second piston plate, a top block is fixedly connected to the top of the elastic telescopic rod, the top block is set to be hemispherical, a second sealing connecting sleeve is provided on the outer sleeve of the elastic telescopic rod, the second sealing connecting sleeve is connected to the lower piston cylinder through, and a second elastic component arranged in the lower piston cylinder is fixedly connected under the second piston plate.

[0020] As a further description of the above technical solution:

[0021] The sliding support device includes an electric hydraulic rod fixedly connected in the ultrasonic cleaning box, the top end of the electric hydraulic rod is fixedly connected to an intermediate seat, the intermediate seat is provided with a sliding groove, a sliding block fixedly connected to the supporting frame is slidably connected in the sliding groove, the sliding block is T-shaped, and the back side of the sliding block is fixedly connected to a third elastic component arranged in the sliding groove.

[0022] As a further description of the above technical solution:

[0023] The movable limiting device includes a linear bearing that passes through and is connected to the side wall of the supporting frame, a movable rod is sleeved inside the linear bearing, one end of the movable rod located outside the placement groove is fixedly connected to a contact ball, one end of the movable rod located inside the placement groove is fixedly connected to a limiting plate, and a fourth elastic component is sleeved outside the movable rod that is fixedly connected to the linear bearing and the contact ball.

[0024] A cleaning method for a semiconductor substrate cleaning device, the cleaning method comprising the following steps:

[0025] Directly place the semiconductor substrate to be cleaned in the placement tank, then control the electric hydraulic rod, the fan assembly and the ultrasonic cleaning box to work, the electric hydraulic rod drives the middle seat to move downward, at this time the contact ball contacts the extrusion plate, the inclined part of the extrusion plate pushes the contact ball and the movable rod to move, while the movable rod moves, the semiconductor substrate is clamped by the limit plate, when the contact ball contacts the vertical section of the extrusion plate, the limit plate remains stable, the middle seat moves downward, while the bearing frame is pulled downward by the sliding block, while the bearing frame moves downward, it is pushed forward by the inclined part of the extrusion block;

[0026] When the carrying frame passes over the extrusion block, the third elastic component controls the sliding block and the carrying frame to move backward quickly, so as to vibrate the carrying frame and the semiconductor substrate therein. The vibration makes it easier for dust and particulate debris on the surface of the semiconductor substrate to be separated from the semiconductor substrate. When the carrying frame moves downward, the top block and the elastic telescopic rod are squeezed downward. When the elastic telescopic rod moves, the gas in the lower piston cylinder is squeezed by the second piston plate and transferred to the upper piston cylinder through the intermediate tube. The increased air pressure in the upper piston cylinder controls the first piston plate and the adjusting rod to move downward. The adjusting rod controls the connection cover to move downward in the connection cylinder. At the same time, the rotating bead moves downward along the guide groove, which controls the rotating seat to rotate when it moves downward. The fan assembly sprays the gas downward onto the semiconductor substrate through the connection cover and the air outlet channel through the air pipe. Since the gas capacity of the lower piston cylinder is larger than that of the upper piston cylinder, the downward movement speed of the adjusting rod is greater than the downward movement speed of the carrying frame, so that the air outlet channel moves rapidly relative to the semiconductor substrate.

[0027] The gas is ejected downward through the gas outlet channels with different inclination angles. The gas ejected from the rotating gas outlet channel can evenly cover the semiconductor substrate, and the semiconductor substrate moves downward relative to the gas outlet channel, so that the angle of the gas sprayed on the semiconductor substrate changes, so that the debris and dust adhered to the gaps on the surface of the semiconductor substrate can be blown and cleaned more fully and thoroughly, and the gas carries the dust and particulate debris and flows upward along the inclined side wall of the placement groove, and the gas and debris flowing upward in the placement groove are sucked through the connecting pipe and the suction frame until the semiconductor substrate moves downward with the carrying frame into the liquid in the ultrasonic cleaning box, and ultrasonic cleaning is performed at this time.

[0028] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0029] 1. In the present invention, an ultrasonic cleaning box, a carrying frame, an air suction frame, an air outlet channel, a rotating bead and a guide groove are used. During the downward movement of the carrying frame, the connecting cover is controlled to move downward in the connecting tube. At the same time, the rotating bead moves downward along the guide groove, which controls the rotating seat to rotate when it moves downward. The downward movement speed of the adjusting rod is greater than the downward movement speed of the carrying frame, so that the air outlet channel moves quickly relative to the semiconductor substrate, and the gas is ejected downward through the air outlet channels with different inclination angles. The gas ejected from the rotating air outlet channel can evenly cover the semiconductor substrate, and the semiconductor substrate moves downward relative to the air outlet channel, so that the gas sprayed on the semiconductor substrate The gas angle changes, and the debris and dust adhered to the gaps on the surface of the semiconductor substrate are blown away more fully and thoroughly. The dust and particulate debris adhered to the surface of the semiconductor substrate are blown away before the semiconductor substrate enters the cleaning agent in the ultrasonic cleaning box, and the multi-angle blowing covers the surface of the semiconductor substrate and its gaps more comprehensively. The dust and particulate debris are sucked away by the suction frame along with the gas, avoiding the influence of dust and particulate debris on the cleaning agent, and processing organic matter, particulate debris and dust separately, thereby ensuring the service life of the cleaning agent and the cleaning effect of the gaps in the semiconductor substrate.

[0030] 2. In the present invention, a sliding block, a sliding groove, a third elastic component, and an extrusion block are used. When the supporting frame moves downward, it is pushed forward by the inclined surface of the extrusion block. When the supporting frame passes over the extrusion block, the third elastic component controls the sliding block and the supporting frame to move backward quickly, thereby vibrating the supporting frame and the semiconductor substrate therein. The vibration makes it easier to separate the dust and particulate debris on the surface of the semiconductor substrate from the semiconductor substrate, so that the dust and particulate debris on the surface of the semiconductor substrate can be fully impacted and fallen off by the airflow, and the organic matter on the surface of the semiconductor substrate can be smoothly detached in the cleaning agent, thereby ensuring a better cleaning effect of the semiconductor substrate.

[0031] 3. In the present invention, an extrusion block, a contact ball, a movable rod, and a limit plate are used. The carrier frame and the semiconductor substrate move downward, and the contact ball contacts the extrusion plate before the carrier frame contacts the extrusion block and the top block. The inclined position of the extrusion plate controls the movement of the contact ball, the movable rod, and the limit plate. The limit plate automatically completes the extrusion positioning of the semiconductor substrate, so that the positioning of the semiconductor substrate is related to the process of taking and placing the semiconductor substrate from the ultrasonic cleaning box. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of the three-dimensional structure of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0033] Figure 2 A schematic diagram of the three-dimensional structure of a fixing rod of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0034] Figure 3A schematic diagram of the three-dimensional structure of a carrier frame of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0035] Figure 4 A schematic diagram of a side-view three-dimensional cross-sectional structure of a sliding support device of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0036] Figure 5 A schematic diagram of a three-dimensional cross-sectional structure of an extrusion adjustment device of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0037] Figure 6 A schematic diagram of a three-dimensional cross-sectional structure of a connecting tube of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0038] Figure 7 A schematic diagram of the three-dimensional exploded structure of a rotating gas outlet device of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0039] Figure 8 A bottom-up stereoscopic structural schematic diagram of a rotating gas outlet device of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0040] Fig. 9 A schematic diagram of a three-dimensional cross-sectional structure of a movable adjustment device of a semiconductor substrate cleaning device and a cleaning method thereof proposed by the present invention;

[0041] Fig.10 The present invention provides a schematic three-dimensional structural diagram of a movable limiting device of a semiconductor substrate cleaning device and a cleaning method thereof.

[0042] Legend:

[0043] 1. Control cabinet; 2. Cabinet door; 3. Ultrasonic cleaning box; 4. Fixing rod; 5. Connecting cylinder; 6. Air pipe; 7. Fan assembly; 8. Rotating air outlet device; 81. Connecting cover; 82. Rotating seat; 83. Sealing bearing; 84. Rotating ball; 85. Air outlet channel; 9. Guide groove; 10. Movable adjustment device; 101. Upper piston cylinder; 102. First piston plate; 103. Adjusting rod; 104. First sealing connecting sleeve; 105. First elastic component; 11. Intermediate tube; 12. Extrusion adjustment device; 121. Lower piston cylinder; 122. Second piston plate; 123. Elastic telescopic rod; 124, second sealing connecting sleeve; 125, top block; 126, second elastic component; 13, sliding support device; 131, electric hydraulic rod; 132, middle seat; 133, sliding groove; 134, sliding block; 135, third elastic component; 14, bearing frame; 15, placement groove; 16, suction frame; 17, connecting pipe; 18, vertical plate; 19, extrusion block; 20, movable limiting device; 201, linear bearing; 202, movable rod; 203, contact ball; 204, fourth elastic component; 205, limiting plate; 21, extrusion plate; 22, extension rod. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Please see attached Figure 1 -Attached Fig.10The present invention provides a technical solution: a semiconductor substrate cleaning device, comprising a control cabinet 1, an ultrasonic cleaning box 3 is installed on the control cabinet 1, three fixing rods 4 are connected to the ultrasonic cleaning box 3, the other end of the fixing rod 4 is fixedly connected to a connecting tube 5, an air pipe 6 is connected to the connecting tube 5, the bottom end of the air pipe 6 is connected to a rotating air outlet device 8, a guide groove 9 is provided in the connecting tube 5, the rotating air outlet device 8 is slidably connected in the guide groove 9, the rotating air outlet device 8 is connected to a movable adjustment device 10 that is arranged on the connecting tube 5, the back of the movable adjustment device 10 is connected to an intermediate tube 11, and the other end of the intermediate tube 11 is connected to a fixed connection An extrusion adjustment device 12 is connected to the inner wall of the ultrasonic cleaning box 3, and three sliding support devices 13 are fixedly connected to the inner wall of the ultrasonic cleaning box 3. A bearing frame 14 is fixedly connected to the sliding support device 13, and a placement groove 15 is provided on the bearing frame 14. Both sides of the bearing frame 14 are penetrated and connected with movable limiting devices 20 located in the placement groove 15. A vertical plate 18 is connected to the position of the bearing frame 14 at the rear side of the inner wall of the ultrasonic cleaning box 3, and a squeezing block 19 is fixedly connected to the front of the vertical plate 18. An extension rod 22 is connected to the position of the movable limiting device 20 at the lower side of the inner wall of the ultrasonic cleaning box 3, and a squeezing plate 21 is fixedly connected to the top of the extension rod 22.

[0046] The ultrasonic cleaning box 3 cooperates with the cleaning agent inside it and uses ultrasonic waves to act on the cleaning agent and the semiconductor substrate to achieve cleaning treatment on the surface of the semiconductor substrate;

[0047] Specifically, Figure 1-2 As shown, the width of the extrusion plate 21 is greater than the width of the extrusion block 19, two cabinet doors 2 are hinged on the front of the control cabinet 1, the bottom end of the air pipe 6 is connected to the fan assembly 7, the fan assembly 7 is fixedly connected to the side of the control cabinet 1, the support frame 14 is fixedly connected to the air intake frame 16, and the side of the air intake frame 16 is connected to the connecting pipe 17.

[0048] The fan assembly 7 is used to suck gas, and can control the gas to smoothly pass through the air pipe 6 and the connecting cover 81. The suction frame 16 is used to suck the gas flowing upward in the placement groove 15, so as to realize the suction treatment of the gas mixed with dust and particulate debris;

[0049] Specifically, Figure 2 and Figure 6-8 As shown, the rotating air outlet device 8 includes a connecting cover 81 and a rotating seat 82 connected to the bottom end of the air pipe 6. The rotating seat 82 is provided with a sealing bearing 83 on the outer sleeve. The sealing bearing 83 is rotatably connected to the inner wall of the connecting cover 81. The outer arc surface of the rotating seat 82 is fixedly connected to a rotating bead 84, and the rotating bead 84 is slidably connected in the guide groove 9.

[0050] Four circles of air outlet channels 85 are connected through the rotating seat 82, and each circle of air outlet channels 85 is equidistantly arranged under the rotating seat 82. The axes of the four circles of air outlet channels 85 coincide with each other, and the inclination angles of the four circles of air outlet channels 85 are different. The connecting cover 81 is slidably connected in the connecting tube 5.

[0051] The sealing bearing 83 is used to connect the rotating seat 82 and the connecting cover 81 and ensure the sealing effect. The rotating ball 84 cooperates with the guide groove 9. The spiral guide groove 9 guides the rotating ball 84 moving downward to control the rotating seat 82 to rotate. The gas is ejected downward through the gas outlet channels 85 with different inclination angles. The gas ejected from the rotating gas outlet channels 85 can evenly cover the semiconductor substrate. The rotating seat 82 allows the gas at various angles to be sprayed on the semiconductor substrate.

[0052] Specifically, Figure 2 and Fig. 9 As shown, the movable adjustment device 10 includes an upper piston cylinder 101 which is connected to the connecting cylinder 5, a first piston plate 102 is slidably connected inside the upper piston cylinder 101, an adjusting rod 103 is connected below the first piston plate 102, the bottom end of the adjusting rod 103 is fixedly connected to the connecting cover 81, and an air storage chamber located on the upper side of the first piston plate 102 in the upper piston cylinder 101 is connected to the middle tube 11 of the air pipe 6.

[0053] The adjusting rod 103 is slidably connected to a first sealing connection sleeve 104 that penetrates and is connected to the lower part of the upper piston cylinder 101. The adjusting rod 103 is outer-mounted with a first elastic component 105. The two ends of the first elastic component 105 are fixedly connected to the first piston plate 102 and the inner wall of the upper piston cylinder 101 respectively.

[0054] The force exerted by the first elastic component 105 on the first piston plate 102 can prevent the first piston plate 102 and the connecting cover 81 from shaking randomly, and when the air pressure in the upper piston cylinder 101 returns to normal, the connecting cover 81 is controlled to move up and reset, and the increased air pressure in the upper piston cylinder 101 controls the first piston plate 102 and the adjusting rod 103 to move downward, and the adjusting rod 103 controls the connecting cover 81 to move downward in the connecting cylinder 5. Since the gas capacity of the lower piston cylinder 121 is larger than that of the upper piston cylinder 101, the downward movement speed of the adjusting rod 103 is greater than the downward movement speed of the bearing frame 14, so that the air outlet channel 85 moves quickly relative to the semiconductor substrate, and the bearing frame 14 moves slowly and quickly downward relative to the rotating seat 82. The gas ejected from the air outlet channel 85 changes its angle as the two get closer to each other, and the variable jet angle can fully act on the gap on the surface of the semiconductor substrate.

[0055] Specifically, Figure 1-2 and Figure 5As shown, the extrusion adjustment device 12 includes a lower piston cylinder 121 fixedly connected to the inner wall of the ultrasonic cleaning box 3, a second piston plate 122 is slidably connected in the lower piston cylinder 121, an air storage chamber located at the lower side of the second piston plate 122 in the lower piston cylinder 121 is connected to the intermediate tube 11, an elastic telescopic rod 123 is fixedly connected to the second piston plate 122, a top block 125 is fixedly connected to the top of the elastic telescopic rod 123, the top block 125 is set to be hemispherical, the elastic telescopic rod 123 is outer-mounted with a second sealing connecting sleeve 124, the second sealing connecting sleeve 124 is connected to the lower piston cylinder 121, and a second elastic component 126 arranged in the lower piston cylinder 121 is fixedly connected under the second piston plate 122.

[0056] The force required for the elastic telescopic rod 123 to be squeezed and deformed is greater than the force required for the second elastic component 126 to deform. Therefore, when the supporting frame 14 squeezes the elastic telescopic rod 123, the second elastic component 126 is squeezed and deformed first, and then the elastic telescopic rod 123 is squeezed and shortened. The second elastic component 126 supports the second piston plate 122 and the elastic telescopic rod 123 upward, or subsequently controls the reset of the second piston plate 122. When the supporting frame 14 moves downward, the top block 125 and the elastic telescopic rod 123 are squeezed downward. When the elastic telescopic rod 123 moves, the gas in the lower piston cylinder 121 is squeezed through the second piston plate 122 and transferred to the upper piston cylinder 101 through the intermediate tube 11.

[0057] Specifically, Figure 1-4 As shown, the sliding support device 13 includes an electric hydraulic rod 131 fixedly connected in the ultrasonic cleaning box 3, the top of the electric hydraulic rod 131 is fixedly connected to an intermediate seat 132, the intermediate seat 132 is provided with a sliding groove 133, and a sliding block 134 fixedly connected to the supporting frame 14 is slidably connected in the sliding groove 133, the sliding block 134 is set to be T-shaped, and the back of the sliding block 134 is fixedly connected to a third elastic component 135 arranged in the sliding groove 133.

[0058] The sliding groove 133 and the sliding block 134 connect and support the carrying frame 14, so that the electric hydraulic rod 131 can control the carrying frame 14 to move in the vertical direction, and the carrying frame 14 can slide in the front-back direction. The third elastic component 135 applies elastic force to the sliding block 134 and the carrying frame 14 to prevent the carrying frame 14 from shaking when it is not squeezed by the outside. When the carrying frame 14 is squeezed and pushed by the inclined surface of the squeezing block 19, the carrying frame 14 can move forward. After the carrying frame 14 passes over the squeezing block 19, the third elastic component 135 controls the sliding block 134 to reset, so that the carrying frame 14 is vibrated.

[0059] Specifically, Figure 2-3 and Fig.10As shown, the movable limiting device 20 includes a linear bearing 201 which is connected to the side wall of the supporting frame 14, a movable rod 202 is sleeved inside the linear bearing 201, one end of the movable rod 202 located outside the placement groove 15 is fixedly connected to a contact ball 203, one end of the movable rod 202 located inside the placement groove 15 is fixedly connected to a limiting plate 205, and the outer sleeve of the movable rod 202 is provided with a fourth elastic component 204 which is fixedly connected to the linear bearing 201 and the contact ball 203.

[0060] The contact ball 203 cooperates with the extrusion plate 21, and the inclined section of the extrusion plate 21 controls the contact ball 203 and the movable rod 202 to move toward the carrier frame 14, so as to automatically control the limit plate 205 to clamp the semiconductor substrate. When the contact ball 203 is not in contact with the extrusion plate 21, the fourth elastic component 204 controls the limit plate 205 to maintain a stable state separated from the semiconductor substrate.

[0061] A cleaning method for a semiconductor substrate cleaning device, the cleaning method comprising the following steps:

[0062] Directly place the semiconductor substrate to be cleaned in the placement groove 15, then control the electric hydraulic rod 131, the fan assembly 7 and the ultrasonic cleaning box 3 to work, the electric hydraulic rod 131 drives the middle seat 132 to move downward, at this time the contact ball 203 contacts the extrusion plate 21, the inclined part of the extrusion plate 21 pushes the contact ball 203 and the movable rod 202 to move, and the movable rod 202 clamps the semiconductor substrate through the limit plate 205 while moving, when the contact ball 203 contacts the vertical section of the extrusion plate 21, the limit plate 205 remains stable, the middle seat 132 moves downward, and at the same time, the bearing frame 14 is pulled downward by the sliding block 134, and the bearing frame 14 moves downward and is pushed forward by the inclined part of the extrusion block 19;

[0063] When the carrying frame 14 passes over the squeezing block 19, the third elastic component 135 controls the sliding block 134 and the carrying frame 14 to move backward quickly, so as to vibrate the carrying frame 14 and the semiconductor substrate therein. The vibration makes it easier for dust and particulate debris on the surface of the semiconductor substrate to be separated from the semiconductor substrate. When the carrying frame 14 moves downward, the top block 125 and the elastic telescopic rod 123 are squeezed to move downward. When the elastic telescopic rod 123 moves, the gas in the lower piston cylinder 121 is squeezed through the second piston plate 122 and transferred to the upper piston cylinder 101 through the intermediate tube 11. The large air pressure controls the first piston plate 102 and the adjusting rod 103 to move downward, and the adjusting rod 103 controls the connection cover 81 to move downward in the connection cylinder 5. At the same time, the rotating bead 84 moves downward along the guide groove 9, which controls the rotating seat 82 to rotate when moving downward. The fan assembly 7 sprays the gas downward onto the semiconductor substrate through the connection cover 81 and the gas outlet channel 85 through the air pipe 6. Since the gas capacity of the lower piston cylinder 121 is larger than that of the upper piston cylinder 101, the downward movement speed of the adjusting rod 103 is greater than the downward movement speed of the bearing frame 14, so that the gas outlet channel 85 moves quickly relative to the semiconductor substrate.

[0064] The gas is ejected downward through the gas outlet channels 85 with different inclination angles. The gas ejected from the rotating gas outlet channels 85 can evenly cover the semiconductor substrate, and the semiconductor substrate moves downward relative to the gas outlet channels 85, so that the angle of the gas sprayed on the semiconductor substrate changes, so that the debris and dust adhered to the gaps on the surface of the semiconductor substrate can be blown and cleaned more fully and thoroughly, and the gas carries the dust and particulate debris and flows upward along the side wall of the inclined placement groove 15, and the gas and debris flowing upward in the placement groove 15 are sucked through the connecting pipe 17 and the suction frame 16 until the semiconductor substrate moves downward along with the supporting frame 14 into the liquid in the ultrasonic cleaning box 3, and ultrasonic cleaning is performed at this time.

[0065] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor substrate cleaning device, comprising a control cabinet (1), characterized in that: An ultrasonic cleaning box (3) is installed on the control cabinet (1), and three fixing rods (4) are connected to the ultrasonic cleaning box (3). The other end of the fixing rod (4) is fixedly connected to a connecting tube (5), and an air pipe (6) is connected to the connecting tube (5). The bottom end of the air pipe (6) is connected to a rotating air outlet device (8). A guide groove (9) is provided in the connecting tube (5), and the rotating air outlet device (8) is slidably connected in the guide groove (9). The rotating air outlet device (8) is connected to a movable adjustment device (10) which is arranged on the connecting tube (5). The back of the movable adjustment device (10) is connected to an intermediate tube (11), and the other end of the intermediate tube (11) is connected to an extrusion tube (11) which is fixedly connected to the inner wall of the ultrasonic cleaning box (3). The ultrasonic cleaning box (3) is provided with a pressure regulating device (12), three sliding support devices (13) are fixedly connected to the inner wall of the ultrasonic cleaning box (3), a bearing frame (14) is fixedly connected to the sliding support device (13), a placement groove (15) is provided on the bearing frame (14), both sides of the bearing frame (14) are penetrated and connected with movable limiting devices (20) located in the placement groove (15), a vertical plate (18) is connected to the rear side of the inner wall of the ultrasonic cleaning box (3) at a position corresponding to the bearing frame (14), an extrusion block (19) is fixedly connected to the front side of the vertical plate (18), an extension rod (22) is connected to the lower side of the inner wall of the ultrasonic cleaning box (3) at a position corresponding to the movable limiting device (20), and the top end of the extension rod (22) is fixedly connected to an extrusion plate (21).

2. A semiconductor substrate cleaning device according to claim 1, characterized in that: The width of the extrusion plate (21) is greater than the width of the extrusion block (19); the front of the control cabinet (1) is hinged with two cabinet doors (2); the bottom end of the air pipe (6) is connected to a fan assembly (7); the fan assembly (7) is fixedly connected to the side of the control cabinet (1); the support frame (14) is fixedly connected to an air suction frame (16); and the side of the air suction frame (16) is connected to a connecting pipe (17).

3. The semiconductor substrate cleaning device according to claim 1, characterized in that: The rotary air outlet device (8) comprises a connection cover (81) connected to the bottom end of the air pipe (6) and a rotary seat (82); the rotary seat (82) is provided with a sealing bearing (83) on its outer sleeve; the sealing bearing (83) is rotatably connected to the inner wall of the connection cover (81); the outer arc surface of the rotary seat (82) is fixedly connected to a rotary bead (84); and the rotary bead (84) is slidably connected in the guide groove (9).

4. A semiconductor substrate cleaning device according to claim 3, characterized in that: Four circles of air outlet channels (85) are connected and penetrated under the rotating seat (82), and each circle of air outlet channels (85) is arranged under the rotating seat (82) at equal intervals in a circle. The axes of the four circles of air outlet channels (85) are coincident, and the inclination angles of the four circles of air outlet channels (85) are different. The connecting cover (81) is slidably connected in the connecting tube (5).

5. The semiconductor substrate cleaning device according to claim 1, characterized in that: The movable adjustment device (10) comprises an upper piston cylinder (101) which is connected to the connecting cylinder (5) through a first piston plate (102) which is slidably connected inside the upper piston cylinder (101), an adjusting rod (103) being connected below the first piston plate (102), a bottom end of the adjusting rod (103) being fixedly connected to the connecting cover (81), and an air storage chamber located on the upper side of the first piston plate (102) inside the upper piston cylinder (101) being connected to the middle tube (11) of the air pipe (6).

6. The semiconductor substrate cleaning device according to claim 5, characterized in that: The adjusting rod (103) is slidably connected to the outside with a first sealing connection sleeve (104) penetrating and connected to the lower part of the upper piston cylinder (101); the adjusting rod (103) is provided with a first elastic component (105) on its outer sleeve; the two ends of the first elastic component (105) are respectively fixedly connected to the first piston plate (102) and the inner wall of the upper piston cylinder (101).

7. The semiconductor substrate cleaning device according to claim 1, characterized in that: The squeezing adjustment device (12) comprises a lower piston cylinder (121) fixedly connected to the inner wall of the ultrasonic cleaning box (3), a second piston plate (122) being slidably connected inside the lower piston cylinder (121), an air storage chamber located below the second piston plate (122) in the lower piston cylinder (121) being communicated with the intermediate tube (11), an elastic telescopic rod (123) being fixedly connected to the second piston plate (122), a top block (125) being fixedly connected to the top of the elastic telescopic rod (123), the top block (125) being set in a hemispherical shape, a second sealing connection sleeve (124) being provided on the outer sleeve of the elastic telescopic rod (123), the second sealing connection sleeve (124) being connected through the lower piston cylinder (121), and a second elastic component (126) arranged in the lower piston cylinder (121) being fixedly connected below the second piston plate (122).

8. The semiconductor substrate cleaning device according to claim 1, characterized in that: The sliding support device (13) comprises an electric hydraulic rod (131) fixedly connected in the ultrasonic cleaning box (3); the top end of the electric hydraulic rod (131) is fixedly connected to an intermediate seat (132); a sliding groove (133) is provided on the intermediate seat (132); a sliding block (134) fixedly connected to the supporting frame (14) is slidably connected in the sliding groove (133); the sliding block (134) is T-shaped; the back of the sliding block (134) is fixedly connected to a third elastic component (135) arranged in the sliding groove (133).

9. The semiconductor substrate cleaning device according to claim 1, characterized in that: The movable limiting device (20) comprises a linear bearing (201) penetrating and connected to the side wall of the supporting frame (14); a movable rod (202) is sleeved inside the linear bearing (201); one end of the movable rod (202) located outside the placement groove (15) is fixedly connected to a contact ball (203); one end of the movable rod (202) located inside the placement groove (15) is fixedly connected to a limiting plate (205); and a fourth elastic component (204) is sleeved outside the movable rod (202) and is fixedly connected to the linear bearing (201) and the contact ball (203).

10. A cleaning method for a semiconductor substrate cleaning device, according to any one of claims 1 to 9, characterized in that: The cleaning method comprises the following steps: The semiconductor substrate to be cleaned is directly placed in the placement groove (15), and then the electric hydraulic rod (131), the fan assembly (7) and the ultrasonic cleaning box (3) are controlled to work. The electric hydraulic rod (131) drives the middle seat (132) to move downward. At this time, the contact ball (203) contacts the extrusion plate (21), and the inclined part of the extrusion plate (21) pushes the contact ball (203) and the movable rod (202) to move. When the movable rod (202) moves, the semiconductor substrate is clamped by the limit plate (205). When the contact ball (203) contacts the vertical section of the extrusion plate (21), the limit plate (205) remains stable. When the middle seat (132) moves downward, the bearing frame (14) is pulled downward by the sliding block (134). When the bearing frame (14) moves downward, it is pushed forward by the inclined part of the extrusion block (19); When the carrying frame (14) passes over the squeezing block (19), the third elastic component (135) controls the sliding block (134) and the carrying frame (14) to move backward quickly, thereby vibrating the carrying frame (14) and the semiconductor substrate therein. The vibration makes it easier for dust and particulate debris on the surface of the semiconductor substrate to separate from the semiconductor substrate. When the carrying frame (14) moves downward, the top block (125) and the elastic telescopic rod (123) are squeezed downward. When the elastic telescopic rod (123) moves, the gas in the lower piston cylinder (121) is squeezed through the second piston plate (122) and transferred to the upper piston cylinder (101) through the intermediate tube (11). The enlarged gas in the upper piston cylinder (101) The air pressure controls the first piston plate (102) and the adjusting rod (103) to move downward, and the adjusting rod (103) controls the connecting cover (81) to move downward in the connecting cylinder (5). At the same time, the rotating ball (84) moves downward along the guide groove (9), which controls the rotating seat (82) to rotate when moving downward. The fan assembly (7) sprays the gas downward onto the semiconductor substrate through the connecting cover (81) and the air outlet channel (85) via the air pipe (6). Since the gas capacity of the lower piston cylinder (121) is larger than that of the upper piston cylinder (101), the downward movement speed of the adjusting rod (103) is greater than the downward movement speed of the supporting frame (14), so that the air outlet channel (85) moves quickly relative to the semiconductor substrate. The gas is ejected downward through the gas outlet channels (85) with different inclination angles. The gas ejected from the rotating gas outlet channels (85) can evenly cover the semiconductor substrate. The semiconductor substrate moves downward relative to the gas outlet channels (85), so that the angle of the gas ejected onto the semiconductor substrate changes, so that the debris and dust adhering to the gaps on the surface of the semiconductor substrate can be blown and cleaned more thoroughly. The gas carries the dust and particulate debris and flows upward along the side wall of the inclined placement groove (15). The gas and debris flowing upward in the placement groove (15) are sucked through the connecting pipe (17) and the suction frame (16) until the semiconductor substrate moves downward along the carrier frame (14) into the liquid in the ultrasonic cleaning box (3), and ultrasonic cleaning is then performed.

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