Silicon wafer positioning system and silicon wafer grinding system

Abstract

The invention provides a silicon wafer positioning system and a silicon wafer grinding system, and relates to the technical field of semiconductors, and the silicon wafer positioning system comprises at least two silicon wafer positioning devices which are connected through a conveying device; the silicon wafer positioning device comprises a silicon wafer bearing mechanism and a silicon wafer positioning mechanism; the silicon wafer bearing mechanism is arranged on the side edge and / or below the first silicon wafer, and the silicon wafer bearing mechanism is used for bearing the first silicon wafer and driving the first silicon wafer to rotate; the silicon wafer positioning mechanism is arranged above and / or below the first silicon wafer, and the silicon wafer positioning mechanism is used for positioning the first silicon wafer according to the notch position of the first silicon wafer; the conveying device is used for conveying the first silicon wafer positioned by the first silicon wafer positioning device to the second silicon wafer positioning device, and the second silicon wafer positioning device is a silicon wafer positioning device adjacent to the first silicon wafer positioning device. According to the invention, at least two times of positioning of the silicon wafer can be realized, mechanical errors are eliminated, and the positioning precision of the finally positioned silicon wafer is improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a silicon wafer positioning system and a silicon wafer grinding system. Background Art

[0002] The double-disc grinder is a double-sided grinding device specially used for thinning 12-inch silicon wafers. When the double-sided grinder is used to process the silicon wafer, the silicon wafer is in the grinding chamber and the carrier ring in the grinding chamber keeps the silicon wafer in a vertical state. The carrier ring drives the silicon wafer to rotate to achieve grinding. During grinding, Figure 1 As shown, the silicon wafer is located at the center of the carrier ring, and the notch on the silicon wafer is just stuck on the positioning piece of the carrier ring.

[0003] Before transporting the silicon wafers to the carrier ring, a positioning device (or positioning unit) is required to uniformly position the silicon wafers, and then a robotic arm will load the positioned silicon wafers into the carrier ring in the grinding chamber. However, the existing positioning device can only roughly position the silicon wafers, which results in a certain deviation when the silicon wafers completed by the positioning device are loaded into the carrier ring, and cannot be loaded smoothly. This requires the carrier ring to rotate to adapt to the deviation, but the adaptation process is time-consuming and may even cause the double disc grinder equipment to shut down. Summary of the invention

[0004] The embodiments of the present invention provide a silicon wafer positioning system and a silicon wafer grinding system, which are used to solve the problem that the existing silicon wafer has low positioning accuracy and cannot be quickly engaged with a carrier ring in a grinding chamber.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] An embodiment of the present invention provides a silicon wafer positioning system, comprising:

[0007] at least two silicon wafer positioning devices connected by a conveying device;

[0008] Each of the silicon wafer positioning devices comprises a silicon wafer carrying mechanism and a silicon wafer positioning mechanism;

[0009] The silicon wafer carrying mechanism is disposed on the side and / or below the horizontally placed first silicon wafer, and the silicon wafer carrying mechanism is used to carry the first silicon wafer and drive the first silicon wafer to rotate;

[0010] The silicon wafer positioning mechanism is disposed above and / or below the first silicon wafer, and the silicon wafer positioning mechanism is used to position the first silicon wafer according to the position of the notch of the first silicon wafer;

[0011] The conveying device is used to convey the positioned first silicon wafer from the first silicon wafer positioning device to the second silicon wafer positioning device, wherein the first silicon wafer positioning device is any one of the at least two silicon wafer positioning devices, and the second silicon wafer positioning device is a silicon wafer positioning device adjacent to the first silicon wafer positioning device.

[0012] In some embodiments, the silicon wafer carrying mechanism includes a silicon wafer clamping mechanism and a silicon wafer rotating table;

[0013] The silicon wafer clamping mechanism is disposed on a side edge of the first silicon wafer, and is used to clamp the side edge of the first silicon wafer;

[0014] The silicon wafer rotating platform is disposed below the first silicon wafer and is used to drive the first silicon wafer to rotate.

[0015] In some embodiments, the silicon wafer rotating platform is fixedly connected to the lower surface of the first silicon wafer by vacuum adsorption.

[0016] In some embodiments, the silicon wafer positioning mechanism includes a signal transmitter and a signal receiver;

[0017] Wherein, the signal transmitter is arranged above or below the first silicon wafer;

[0018] In the case where the signal transmitter is disposed above the first silicon wafer, the signal receiver is disposed below the first silicon wafer;

[0019] In the case where the signal transmitter is disposed below the first silicon wafer, the signal receiver is disposed above the first silicon wafer;

[0020] The signal transmitter is used to transmit a signal to the edge of the first silicon wafer, and the signal receiver is used to receive the signal, sense the gap of the first silicon wafer through the signal, and complete the positioning of the first silicon wafer.

[0021] In some embodiments, the signal transmitter transmits a signal to an edge of the first silicon wafer;

[0022] The signal receiver receives the signal;

[0023] When a gap in the first silicon wafer is sensed through the signal, the signal transmitter stops transmitting the signal to the edge of the first silicon wafer;

[0024] When no gap of the first silicon wafer is sensed by the signal, the silicon wafer supporting mechanism drives the first silicon wafer to rotate by a first preset angle in a first preset direction;

[0025] Return to the step of causing the signal transmitter to transmit a signal to an edge of the first silicon wafer until a notch in the first silicon wafer is sensed by the signal.

[0026] In some embodiments, the signal transmitter comprises an infrared signal transmitter, and the signal receiver comprises an infrared signal receiver;

[0027] and / or,

[0028] The signal transmitter comprises a laser signal transmitter, and the signal receiver comprises a laser signal receiver.

[0029] In some embodiments, the conveying device includes a first driving device and a conveyor belt connected to the first driving device.

[0030] In some embodiments, during the process in which the conveying device conveys the positioned first silicon wafer from the first silicon wafer positioning device to the second silicon wafer positioning device, the direction of the notch of the positioned first silicon wafer remains unchanged.

[0031] An embodiment of the present invention further provides a silicon wafer grinding system, comprising the silicon wafer positioning system, the robot arm, the carrier ring and the silicon wafer grinding device as described above;

[0032] The robotic arm is used to transfer the first silicon wafer positioned by the silicon wafer positioning system to the carrier ring according to a preset route;

[0033] The carrier ring is engaged with the notch of the first silicon wafer through a positioning sheet;

[0034] The silicon wafer grinding equipment is used to grind the first silicon wafer.

[0035] In some embodiments, the number of the silicon wafer clamping mechanisms is multiple;

[0036] A plurality of the silicon wafer clamping mechanisms are evenly arranged on the edge of the first silicon wafer.

[0037] The embodiments of the present invention have the following beneficial effects:

[0038] The silicon wafer positioning system provided by the embodiment of the present invention comprises at least two silicon wafer positioning devices. First, the first silicon wafer carried by the silicon wafer carrying mechanism in the first silicon wafer positioning device is positioned by the silicon wafer positioning mechanism in the first silicon wafer positioning device to complete the positioning of the first silicon wafer. The conveying device conveys the first silicon wafer after the first silicon wafer positioning device completes the positioning to the next silicon wafer positioning device. The next silicon wafer positioning device continues to perform positioning according to the same process until the last silicon wafer positioning device completes the final positioning of the first silicon wafer. That is, the silicon wafer positioning system provided by the embodiment of the present invention can realize at least two positioning of the silicon wafer, eliminate mechanical errors, and improve the positioning accuracy of the finally positioned silicon wafer, so that the finally positioned silicon wafer is transferred to the carrier ring of the grinding chamber and can be more accurately engaged with the positioning device on the carrier ring, thereby reducing the alarm information of abnormal loading of the silicon wafer, and reducing the time for the carrier ring to adjust its position to adapt to the positioning error of the silicon wafer, thereby improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram showing the structure of the silicon wafer positioning system provided by the present invention;

[0040] Figure 2 A schematic diagram showing the engagement of the notch of the first silicon wafer and the positioning piece on the carrier ring provided by an embodiment of the present invention.

[0041] Reference numerals:

[0042] 1: conveying device; 2: silicon wafer positioning device; 21: silicon wafer clamping mechanism; 22: silicon wafer rotating table; 23: signal transmitter; 24: signal receiver; 3: first silicon wafer; 4: carrier ring; 41: positioning sheet. DETAILED DESCRIPTION

[0043] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0044] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0045] In order to solve the problem that the existing silicon wafer has low positioning accuracy and cannot be quickly engaged with the carrier ring in the grinding chamber, the embodiments of the present invention provide a silicon wafer positioning system and a silicon wafer grinding system.

[0046] like Figure 1As shown, an embodiment of the present invention provides a silicon wafer positioning system, comprising:

[0047] At least two silicon wafer positioning devices 2 connected by a conveying device 1;

[0048] Each of the silicon wafer positioning devices 2 includes a silicon wafer carrying mechanism and a silicon wafer positioning mechanism, that is, each silicon wafer positioning device has the same structure, such as Figure 1 As shown, in this embodiment, a silicon wafer positioning system including two silicon wafer positioning devices 2 through a conveying device 1 is taken as an example for description.

[0049] The silicon wafer carrying mechanism is disposed on the side and / or below the horizontally placed first silicon wafer 3 , and the silicon wafer carrying mechanism is used to carry the first silicon wafer 3 and drive the first silicon wafer 3 to rotate.

[0050] Optionally, the silicon wafer bearing mechanism may be arranged only on the side of the first silicon wafer 3, so as to support the first silicon wafer 3 through the side of the first silicon wafer 3 and drive the side of the first silicon wafer 3 to move, thereby driving the rotation of the first silicon wafer 3. The silicon wafer bearing mechanism may be arranged only below the first silicon wafer 3, so as to support the first silicon wafer 3 through the below of the first silicon wafer 3 and drive the rotation of the first silicon wafer 3 through the below of the first silicon wafer 3. The silicon wafer bearing mechanism may also be arranged partly on the side of the first silicon wafer 3 and the other part below the first silicon wafer 3. Since the part located on the side of the first silicon wafer 3 supports the first silicon wafer 3, the part below the first silicon wafer 3 drives the rotation of the first silicon wafer 3.

[0051] The first silicon wafer 3 is any silicon wafer to be ground or processed.

[0052] The silicon wafer positioning mechanism is disposed above and / or below the first silicon wafer 3 , and is used to position the first silicon wafer 3 according to the position of the notch of the first silicon wafer.

[0053] Specifically, during positioning, the silicon wafer is initially supported by the silicon wafer supporting mechanism, and then the silicon wafer positioning mechanism senses the position of the notch of the first silicon wafer. If the notch position is sensed, the positioning is completed; if the notch position is not sensed, the silicon wafer supporting mechanism drives the first silicon wafer to rotate by a first preset angle in a first preset direction, and then the silicon wafer positioning mechanism senses the position of the notch of the first silicon wafer. If sensed, the positioning is completed; otherwise, the silicon wafer supporting mechanism drives the first silicon wafer to rotate by a first preset angle in the first preset direction again until the notch position is sensed, thereby completing the positioning of the first silicon wafer.

[0054] The first preset direction may be a clockwise direction or a counterclockwise direction, which is not limited in this embodiment. The first preset angle may be determined according to the size of the first silicon wafer, which is not limited in this embodiment. The first preset angle may be a smaller angle to avoid missing the position of the notch.

[0055] The conveying device 1 is used to convey the first silicon wafer 3 after positioning from the first silicon wafer positioning device to the second silicon wafer positioning device;

[0056] Wherein, the first silicon wafer positioning device is any one of the at least two silicon wafer positioning devices, and the first silicon wafer positioning device is any one of the at least two silicon wafer positioning devices except the last silicon wafer positioning device;

[0057] The second silicon wafer positioning device is a silicon wafer positioning device adjacent to the first silicon wafer positioning device. It can be understood that the second silicon wafer positioning device is the next silicon wafer positioning device of the first silicon wafer positioning device.

[0058] It should be noted that the silicon wafer positioning system provided in the embodiment of the present invention is arranged before the silicon wafer grinding device in the process direction, and the silicon wafer grinding device includes a grinding chamber and a carrier ring arranged in the grinding chamber. That is, after the first silicon wafer is positioned by the silicon wafer positioning system provided in the embodiment of the present invention, the first silicon wafer is transferred to the carrier ring so that the notch of the first silicon wafer is engaged with the carrier ring, so as to perform subsequent grinding. The schematic diagram of the engagement of the notch of the first silicon wafer 3 with the positioning piece 41 on the carrier ring 4 is shown in FIG. Figure 2 shown.

[0059] The silicon wafer positioning system provided by the embodiment of the present invention first positions the first silicon wafer through the silicon wafer positioning mechanism in the first silicon wafer positioning device. After completing the positioning of the first silicon wafer, the conveying device conveys the positioned first silicon wafer to the next silicon wafer positioning device, and the next silicon wafer positioning device continues to position according to the same process until the last silicon wafer positioning device completes the final positioning of the first silicon wafer. That is, the silicon wafer positioning system provided by the embodiment of the present invention can achieve at least two positioning of the silicon wafer, eliminate mechanical errors, and improve the positioning accuracy of the finally positioned silicon wafer, so that the finally positioned silicon wafer is transferred to the carrier ring of the grinding chamber, so that the notch of the first silicon wafer can be more accurately engaged with the positioning device on the carrier ring, thereby reducing the alarm information of abnormal loading of the silicon wafer, avoiding the risk of equipment downtime, and reducing the time for the carrier ring to adjust its position to adapt to the positioning error of the silicon wafer, thereby improving processing efficiency.

[0060] Among them, the sequence of the silicon wafer positioning devices of the silicon wafer positioning system is set according to the direction of the positioning process route.

[0061] In an optional embodiment, the silicon wafer carrying mechanism includes a silicon wafer clamping mechanism 21 and a silicon wafer rotating platform 22;

[0062] The silicon wafer clamping mechanism 21 is disposed on the side of the first silicon wafer 3 , and is used to clamp the side of the first silicon wafer 3 , thereby supporting the first silicon wafer 3 and preventing the first silicon wafer 3 from tipping over.

[0063] The silicon wafer rotating platform 22 is disposed below the first silicon wafer 3 and is used to drive the first silicon wafer 3 to rotate. The silicon wafer rotating platform can also be called a silicon wafer positioning platform.

[0064] It should be noted that, in order to ensure stable rotation of the first silicon wafer 3, the silicon wafer rotating platform 22 is disposed directly below the first silicon wafer 3. When the silicon wafer needs to be rotated, the silicon wafer rotating platform 22 is fixedly connected to the lower surface of the first silicon wafer to drive the rotation of the first silicon wafer 3. After the silicon wafer positioning device 2 completes the positioning of the first silicon wafer 3, the silicon wafer rotating platform 22 is disconnected from the first silicon wafer 3 to avoid affecting the transmission of the first silicon wafer 3 to the next silicon wafer positioning device 2.

[0065] Optionally, the silicon wafer rotating table 22 is fixedly connected to the lower surface of the first silicon wafer 3 by vacuum adsorption.

[0066] Specifically, the silicon wafer rotating table 22 includes a gas controller (such as a vacuum pump), a gas channel and a rotation controller, wherein the gas controller is connected to the adsorption surface of the silicon wafer rotating table 22 through the gas channel, wherein the adsorption surface of the silicon wafer rotating table 22 is used to adsorb the lower surface of the first silicon wafer 3, that is, the adsorption surface of the silicon wafer rotating table 22 is the upper surface of the silicon wafer rotating table 22. When it is necessary to connect and fix the lower surface of the first silicon wafer 3, the gas controller evacuates the gas channel, so that the adsorption surface of the silicon wafer rotating table 22 is fixedly connected to the lower surface of the first silicon wafer 3 by vacuum adsorption. Then, the rotation controller controls the rotation of the silicon wafer rotating table 22 to drive the first silicon wafer 3 to rotate.

[0067] It should be noted that, in order to realize the rotation of the first silicon wafer 3 driven by the silicon wafer rotating table 22, when the silicon wafer clamping mechanism 21 clamps the side of the first silicon wafer 3, it is slightly in contact with the side of the first silicon wafer 3, that is, the clamping force between the silicon wafer clamping mechanism 21 and the side of the first silicon wafer 3 is less than the adsorption force of the silicon wafer rotating table 22 on the lower surface of the first silicon wafer 3. The clamping force between the silicon wafer clamping mechanism 21 and the side of the first silicon wafer 3 ensures that the first silicon wafer 3 does not tip over and does not affect the rotation of the first silicon wafer 3.

[0068] In some embodiments, in order to ensure stable support for the first silicon wafer 3, the number of the silicon wafer clamping mechanisms 21 is multiple; the multiple silicon wafer clamping mechanisms 21 are evenly arranged at the edge of the first silicon wafer 3. In this embodiment, multiple refers to three or more. Optionally, as Figure 1 As shown, the number of the silicon wafer clamping mechanisms 21 is three.

[0069] In some embodiments, the silicon wafer positioning mechanism includes a signal transmitter 23 and a signal receiver 24;

[0070] Wherein, the signal transmitter 23 is arranged above or below the first silicon wafer 3;

[0071] In the case where the signal transmitter 23 is disposed above the first silicon wafer 3, the signal receiver 24 is disposed below the first silicon wafer;

[0072] When the signal transmitter 23 is disposed below the first silicon wafer 3 , the signal receiver 24 is disposed above the first silicon wafer.

[0073] That is, the signal transmitter 23 and the signal receiver 24 are respectively arranged above and below the first silicon wafer 3. Optionally, the signal transmitter 23 and the signal receiver 24 are arranged opposite to each other in the vertical direction, and the signal transmitter and the signal receiver are both arranged above the edge of the first silicon wafer 3. The edge position of the first silicon wafer 3 can be determined according to the size of the notch of the first silicon wafer, that is, to ensure that the projections of the signal transmitter and the signal receiver in the vertical direction cover the notch of the first silicon wafer.

[0074] The signal transmitter 23 is used to transmit a signal to the edge of the first silicon wafer 3, and the signal receiver 24 is used to receive the signal, and the notch of the first silicon wafer 3 is sensed by the signal, so as to complete the positioning of the first silicon wafer 3. Specifically, since the signal strength after transmission through the silicon wafer is different from the signal strength after not transmission through the silicon wafer, after the signal transmitter 23 transmits the signal to the edge of the first silicon wafer 3, the signal receiver 24 receives the signal, and according to the strength of the signal received by the signal receiver 24, it can be determined whether the notch of the first silicon wafer 3 is detected according to the signal. When the positions of the signal transmitter 23 and the signal receiver 24 are relatively fixed, the route of the signal is also determined, and the position of the notch of the silicon wafer detected by the signal is also fixed. After the notch position of the first silicon wafer 3 is detected, the first silicon wafer 3 has completed a positioning.

[0075] Specifically, the signal transmitter 23 transmits a signal to the edge of the first silicon wafer 3;

[0076] The signal receiver 24 receives the signal;

[0077] When the gap of the first silicon wafer 3 is sensed through the signal, the signal transmitter 23 stops transmitting the signal to the edge of the first silicon wafer 3;

[0078] When no gap of the first silicon wafer 3 is sensed by the signal, the silicon wafer supporting mechanism drives the first silicon wafer 3 to rotate by a first preset angle in a first preset direction;

[0079] Return to the step of the signal transmitter 23 transmitting a signal to the edge of the first silicon wafer 3 until the gap of the first silicon wafer 3 is sensed by the signal, thereby completing the positioning of the first silicon wafer 3 .

[0080] It should be noted that since the direction of the notch of the silicon wafer input into the silicon wafer positioning system is random, it may take a long time to position the silicon wafer through the first silicon wafer positioning device. However, after the silicon wafer is positioned by the first silicon wafer positioning device, even if there is a mechanical error in the silicon wafer positioning device, the error is in the same direction and within a smaller range. Therefore, when the silicon wafer is positioned by the silicon wafer positioning device after the first silicon wafer positioning device, the time required will be relatively short.

[0081] In some embodiments, the signal transmitter 23 includes an infrared signal transmitter, and the signal receiver 24 includes an infrared signal receiver, that is, the notch of the first silicon wafer 3 is detected by infrared signals;

[0082] and / or,

[0083] The signal transmitter 23 includes a laser signal transmitter, and the signal receiver 24 includes a laser signal receiver, that is, the notch of the first silicon wafer 3 is detected by means of a laser signal.

[0084] It should also be noted that in order to avoid other unillustrated parts of the silicon wafer grinding equipment or the silicon wafer positioning system, the silicon wafer can be controlled to rotate in a certain direction to a certain specified angle after any one or several silicon wafer positioning devices have completed positioning the silicon wafer. In this case, the positions of the signal transmitter and signal receiver in different silicon wafer positioning devices can be different according to the angle.

[0085] In some embodiments, the conveying device 1 includes a first driving device (not shown in the figure) and a conveyor belt connected to the first driving device;

[0086] The first driving device drives the conveyor belt to move between the at least two silicon wafer positioning devices 2, that is, the at least two silicon wafer positioning devices 2 are connected through the conveyor belt;

[0087] There are two conveyor belts, which are in contact with a first chord and a second chord on the lower surface of the first silicon wafer 3 respectively. The first silicon wafer 3 is stationary relative to the conveyor belts due to the friction between the conveyor belt and the first chord and the friction between the conveyor belt and the second chord.

[0088] The first chord and the second chord are two symmetrical chords on the lower surface of the first silicon wafer 3. The first chord and the second chord are both different from the diameter of the first silicon wafer 3. That is, the first chord and the second chord are located on both sides of a diameter of the first silicon wafer, and the first chord and the second chord are symmetrical with respect to the diameter.

[0089] That is, in this embodiment, the first silicon wafer 3 is transported by a conveyor belt, which reduces the contact between the conveyor 1 and the first silicon wafer 3 , avoids interference with the silicon wafer positioning device 2 , and affects the positioning of the first silicon wafer 3 by the silicon wafer positioning device 2 .

[0090] That is, the two conveyor belts are in contact with two chords with symmetrical diameters respectively, thereby ensuring the stability of the first silicon wafer 3 during the transportation of the first silicon wafer 3 .

[0091] In some embodiments, during the process in which the conveying device 1 conveys the positioned first silicon wafer 3 from the first silicon wafer positioning device to the second silicon wafer positioning device, the direction of the notch of the positioned first silicon wafer 3 remains unchanged.

[0092] The direction of the notch of the first silicon wafer 3 may be understood as the direction of the opening of the notch.

[0093] That is, during the process of conveying the first silicon wafer 3 by the conveying device 1 , the direction of the positioned first silicon wafer 3 is not changed, so as to facilitate the layout of the position of the silicon wafer positioning device.

[0094] An embodiment of the present invention also provides a silicon wafer grinding system, comprising a silicon wafer positioning system, a robot arm, a carrier ring and a silicon wafer grinding device as described above;

[0095] The robotic arm is used to transfer the first silicon wafer positioned by the silicon wafer positioning system to the carrier ring according to a preset route, wherein the first silicon wafer positioned by the silicon wafer positioning system is the first silicon wafer output after the last silicon wafer positioning device in the silicon wafer positioning system completes positioning.

[0096] The preset route can be determined and optimized based on the structure of the robot arm, the position of the carrier ring, the position of the positioning piece on the carrier ring, and the position of the notch of the historical silicon wafer positioned by the silicon wafer positioning system.

[0097] The carrier ring engages with the notch of the first silicon wafer through the positioning piece, thereby fixing the position of the first silicon wafer in the grinding chamber.

[0098] The silicon wafer grinding equipment is used to grind the first silicon wafer.

[0099] The silicon wafer grinding equipment may be a double-disc grinder, a single-side grinder, etc., which is not limited in this embodiment.

[0100] It should be noted that the silicon wafer grinding system provided in the embodiment of the present invention includes the silicon wafer positioning system as described in any one of the above, and all embodiments of the above-mentioned silicon wafer positioning system are applicable to the silicon wafer grinding system and can achieve the same or similar technical effects.

[0101] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A silicon wafer positioning system, characterized in that: include: at least two silicon wafer positioning devices connected by a conveying device; Each of the silicon wafer positioning devices comprises a silicon wafer carrying mechanism and a silicon wafer positioning mechanism; The silicon wafer carrying mechanism is disposed on the side and / or below the horizontally placed first silicon wafer, and the silicon wafer carrying mechanism is used to carry the first silicon wafer and drive the first silicon wafer to rotate; The silicon wafer positioning mechanism is disposed above and / or below the first silicon wafer, and the silicon wafer positioning mechanism is used to position the first silicon wafer according to the position of the notch of the first silicon wafer; The conveying device is used to convey the positioned first silicon wafer from the first silicon wafer positioning device to the second silicon wafer positioning device, wherein the first silicon wafer positioning device is any one of the at least two silicon wafer positioning devices, and the second silicon wafer positioning device is a silicon wafer positioning device adjacent to the first silicon wafer positioning device.

2. The silicon wafer positioning system according to claim 1, characterized in that: The silicon wafer carrying mechanism includes a silicon wafer clamping mechanism and a silicon wafer rotating platform; The silicon wafer clamping mechanism is disposed on a side edge of the first silicon wafer, and is used to clamp the side edge of the first silicon wafer; The silicon wafer rotating platform is disposed below the first silicon wafer and is used to drive the first silicon wafer to rotate.

3. The silicon wafer positioning system according to claim 2, characterized in that: The silicon wafer rotating platform is fixedly connected to the lower surface of the first silicon wafer by vacuum adsorption.

4. The silicon wafer positioning system according to claim 1, characterized in that: The silicon wafer positioning mechanism includes a signal transmitter and a signal receiver; Wherein, the signal transmitter is arranged above or below the first silicon wafer; In the case where the signal transmitter is disposed above the first silicon wafer, the signal receiver is disposed below the first silicon wafer; In the case where the signal transmitter is disposed below the first silicon wafer, the signal receiver is disposed above the first silicon wafer; The signal transmitter is used to transmit a signal to the edge of the first silicon wafer, and the signal receiver is used to receive the signal, sense the gap of the first silicon wafer through the signal, and complete the positioning of the first silicon wafer.

5. The silicon wafer positioning system according to claim 4, characterized in that: The signal transmitter transmits a signal to an edge of the first silicon wafer; The signal receiver receives the signal; When a gap in the first silicon wafer is sensed through the signal, the signal transmitter stops transmitting the signal to the edge of the first silicon wafer; When no gap of the first silicon wafer is sensed by the signal, the silicon wafer supporting mechanism drives the first silicon wafer to rotate by a first preset angle in a first preset direction; Return to the step of causing the signal transmitter to transmit a signal to an edge of the first silicon wafer until a notch in the first silicon wafer is sensed by the signal.

6. The silicon wafer positioning system according to claim 4, characterized in that: The signal transmitter comprises an infrared signal transmitter, and the signal receiver comprises an infrared signal receiver; and / or, The signal transmitter comprises a laser signal transmitter, and the signal receiver comprises a laser signal receiver.

7. The silicon wafer positioning system according to claim 1, characterized in that: The conveying device comprises a first driving device and a conveyor belt connected to the first driving device; The first driving device drives the conveyor belt to move between the at least two silicon wafer positioning devices.

8. The silicon wafer positioning system according to claim 1, characterized in that: When the conveying device conveys the positioned first silicon wafer from the first silicon wafer positioning device to the second silicon wafer positioning device, the direction of the notch of the positioned first silicon wafer remains unchanged.

9. The silicon wafer positioning system according to claim 2, characterized in that: The number of the silicon wafer clamping mechanisms is multiple; A plurality of the silicon wafer clamping mechanisms are evenly arranged on the edge of the first silicon wafer.

10. A silicon wafer polishing system, characterized in that: comprising a silicon wafer positioning system, a robot arm, a carrier ring and a silicon wafer grinding device as claimed in any one of claims 1 to 9; The robotic arm is used to transfer the first silicon wafer positioned by the silicon wafer positioning system to the carrier ring according to a preset route; The carrier ring is engaged with the notch of the first silicon wafer through a positioning sheet; The silicon wafer grinding equipment is used to grind the first silicon wafer.

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