A semiconductor refrigeration device

Abstract

The present invention relates to the field of semiconductor refrigeration technology, and discloses a semiconductor refrigeration device, including a refrigeration pad, a liquid cooling system, and a non-contact cooling system; the refrigeration pad is provided with a regulating air inlet, and the regulating air outlet of the non-contact cooling system is connected to the regulating air inlet, and the non-contact cooling system is used to deliver regulating air to the refrigeration pad; the inner side of the refrigeration pad is provided with a plurality of cooling air holes and a liquid storage cavity, the cooling air holes are interconnected with the regulating air inlet, the liquid cooling system and the liquid storage cavity are interconnected, and the liquid cooling system is used to circulate and deliver liquid medium cooled by a semiconductor refrigeration plate to the liquid storage cavity. The semiconductor refrigeration device of this scheme uses liquid cooling and air cooling to achieve the purpose of cooling, which can effectively enhance the cooling effect and overcome the shortcomings of the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor refrigeration, and in particular to a semiconductor refrigeration device. Background Art

[0002] According to the relationship between ambient temperature and human thermal balance, living environments above 35°C and production environments above 32°C are usually considered high temperature environments. Under high temperature conditions, human physiological functions, especially temperature regulation, water and salt metabolism, and blood circulation, undergo abnormal changes. For example, excessive sweating will increase the burden on the cardiovascular system. If the high temperature exceeds the human body's tolerance, it will affect attention and reduce work efficiency at the least, or cause heat stroke at the worst, and even lead to sudden death, endangering the personal safety of workers and causing unnecessary economic losses.

[0003] For people who work continuously in outdoor environments without air conditioning, especially in high temperature environments, such as construction workers working under the scorching sun or maintenance personnel performing related maintenance work outdoors at high altitudes, they often have to overcome various discomforts caused by high temperatures to continue working for a period of time. When wearing ordinary clothes to work under high temperature conditions, people will sweat, and sweat will migrate to the surface of clothes through diffusion and transmission, and some heat will be taken away through sweat evaporation. However, the evaporation source provided by sweat evaporation is limited, so the heat taken away is also limited. Especially when working continuously for a period of time in a high temperature environment, ordinary clothes cannot achieve the effect of cooling down within a certain period of time.

[0004] In order to solve the above problems, cooling and air-conditioning clothing for human body temperature regulation has appeared in the prior art, but the cooling and air-conditioning clothing currently on the market usually adopts a single cooling method, that is, air cooling or liquid cooling, so the cooling effect on the human body is very limited. For example, the Chinese invention patent "A portable protective clothing micro-space temperature control and dehumidification device" with the publication number CN117045006A realizes the regulation of the temperature and humidity inside the protective clothing by mixed air supply, creating a comfortable clothing environment, and can adjust the user's comfort in the protective clothing body by mixed air supply and mixed adjustment of the hot and humid gas inside the protective clothing while ensuring the protective effect of the protective clothing. For another example, the Chinese utility model patent "A phase change cooling clothing with good cooling effect" with the announcement number CN220343733U uses a water pump to flow ice water into the liquid circulation pipeline and then into the ice water bag, so that the ice water absorbs the body heat during the circulation process, achieving the cooling effect of the cooling clothing. Therefore, there is an urgent need for a cooling clothing that can effectively enhance the cooling effect. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor refrigeration device, which utilizes liquid cooling and air cooling to achieve the purpose of cooling, can effectively enhance the cooling effect, and overcome the shortcomings of the prior art.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A semiconductor refrigeration device, comprising a refrigeration pad, a liquid cooling system and a non-contact cooling system;

[0008] The refrigeration pad is provided with a regulated air inlet, and the regulated air outlet of the non-contact cooling system is connected to the regulated air inlet, and the non-contact cooling system is used to deliver regulated air to the refrigeration pad;

[0009] A plurality of cooling air holes and a liquid storage cavity are provided on the inner side of the refrigeration pad. The cooling air holes are interconnected with the regulating air inlet, the liquid cooling system and the liquid storage cavity are interconnected, and the liquid cooling system is used for circulating the liquid medium cooled by the semiconductor refrigeration plate to the liquid storage cavity.

[0010] Preferably, the refrigeration pad comprises a liquid cooling air outlet layer, an air duct layer and a heat insulating outer layer which are arranged in sequence from the inside to the outside;

[0011] The liquid-cooled air outlet layer is provided with a plurality of cooling air holes and the liquid storage cavity, and the plurality of cooling air holes are distributed around the liquid storage cavity;

[0012] The regulating air inlet and the cooling air hole are connected to each other through the air duct layer.

[0013] Preferably, the regulating air inlet is located at the lower part of the refrigeration pad, and the aperture of the cooling air hole gradually decreases from top to bottom.

[0014] Preferably, the liquid storage cavity comprises a liquid inlet channel, a cooling main cavity and a liquid outlet channel which are connected in sequence, and the cooling main cavity is located at the upper center of the refrigeration pad;

[0015] The liquid inlet channel is connected to the liquid cooling outlet of the liquid cooling system, and the liquid outlet channel is connected to the liquid cooling inlet of the liquid cooling system.

[0016] Preferably, the air duct layer is a 3D support structure, and a plurality of mutually interlaced support ribs are arranged inside the 3D support structure.

[0017] Preferably, a wind shield strip is protrudingly provided on the edge of the air duct layer, and the wind shield strip forms a wind retaining cavity; the wind shield strip is provided with an air inlet notch, and the air inlet notch is communicated with the regulating air inlet.

[0018] Preferably, a plurality of support blocks are protrudingly provided on the inner side of the air duct layer, and the surfaces of the support blocks abut against the outer side of the liquid-cooled air outlet layer.

[0019] Preferably, the refrigeration pad further comprises an air-permeable mesh inner layer, and the air-permeable mesh inner layer, the liquid-cooled air outlet layer, the air duct layer and the heat-insulating outer layer are arranged in sequence from inside to outside.

[0020] Preferably, the refrigeration pad further comprises a fixing belt, and the fixing belt is connected to the heat insulating outer layer.

[0021] Preferably, at least five fixing belts are provided, any three fixing belts are evenly arranged on the top of the heat-insulating outer layer, and the remaining two fixing belts are respectively arranged on both sides of the heat-insulating outer layer.

[0022] Preferably, the liquid cooling system comprises a cold conducting head, a circulating pump, a liquid cooling joint, the semiconductor cooling sheet and a radiator;

[0023] The cold conduction head, the circulation pump and the liquid cooling joint are connected to each other through a cooling channel, a receiving cavity for receiving a liquid medium is provided inside the cold conduction head, and the liquid cooling joint is provided with the liquid cooling inlet and the liquid cooling outlet;

[0024] The semiconductor refrigeration plate comprises a hot end surface and a cold end surface, the cold end surface is in contact with the cold conducting head, and the hot end surface is in contact with the heat sink.

[0025] Preferably, the liquid cooling system further comprises a mounting plate and a heat insulation cover;

[0026] A mounting position for mounting the semiconductor refrigeration sheet is provided in the middle of the mounting plate, the cold conduction head, the circulating pump, the liquid cooling joint, the semiconductor refrigeration sheet and the heat preservation cover are mounted on one side of the mounting plate, and the cold conduction head and the semiconductor refrigeration sheet are mounted inside the heat preservation cover;

[0027] The radiator is mounted on the other side of the mounting plate.

[0028] Preferably, the liquid cooling system further comprises a cooling fan and a housing;

[0029] The radiator and the cooling fan are both installed on the other side of the mounting plate, and the radiator is provided with a cooling channel, and the outlet of the cooling fan faces the cooling channel;

[0030] The cooling head, the circulating pump, the liquid cooling joint, the semiconductor cooling sheet, the radiator, the mounting plate, the heat preservation cover and the cooling fan are all installed inside the shell, and the shell wall of the shell is provided with a heat dissipation port, and the heat dissipation port is arranged close to the heat dissipation channel.

[0031] Preferably, the non-contact cooling system comprises a mounting shell and a cooling fan, and the cooling fan is mounted inside the mounting shell;

[0032] The mounting shell is provided with an air inlet and the regulating air outlet, and the inlet of the cooling fan is arranged close to the air inlet, the outlet of the cooling fan is arranged close to the regulating air outlet, and the air inlet and the regulating air outlet are located on two different side walls of the mounting shell.

[0033] Preferably, the air inlet and the regulating air outlet are respectively located on two opposite side walls of the mounting shell;

[0034] Alternatively, the air inlet and the regulating air outlet are respectively located on two adjacent side walls of the mounting shell.

[0035] Preferably, the cooling fan is any one of an axial flow fan or a centrifugal fan.

[0036] Preferably, the non-contact cooling system further comprises an air guide plate, wherein the air guide plate is installed inside the mounting shell, and the air guide plate is arranged between the outlet of the cooling fan and the regulating air outlet.

[0037] Preferably, the non-contact cooling system further comprises a semiconductor refrigeration module, the semiconductor refrigeration module is installed inside the installation shell, and the semiconductor refrigeration module is arranged at the outlet of the cooling fan;

[0038] The semiconductor refrigeration module comprises a semiconductor refrigerator, a cooling block and a heat sink, wherein the semiconductor refrigerator is provided with a cold end face and a hot end face opposite to each other, and the cold end face is attached to the cooling block, and the hot end face is attached to the heat sink;

[0039] The installation shell is also provided with a heat dissipation air outlet;

[0040] The cooling block and the heat dissipation block are both provided with heat exchange channels, the inlet of the heat exchange channel of the cooling block and the inlet of the heat exchange channel of the heat dissipation block are arranged close to the outlet of the cooling fan, the outlet of the heat exchange channel of the cooling block is arranged close to the regulating air outlet, and the outlet of the heat exchange channel of the heat dissipation block is arranged close to the heat dissipation air outlet.

[0041] Preferably, the non-contact cooling system further comprises an air guide cover, and the air guide cover is a hollow structure;

[0042] The air guide cover is detachably mounted on the outside of the mounting shell, and the regulating air outlet is connected to the inlet of the air guide cover, and the regulating air outlet is connected to the regulating air inlet through the air guide cover.

[0043] The cross-sectional area of ​​the inlet of the air guide cover is greater than or equal to the cross-sectional area of ​​the outlet of the air guide cover.

[0044] Preferably, the non-contact cooling system further comprises a mounting bag, the mounting shell is mounted inside the mounting bag, and the mounting bag is provided with a mesh surface, and the mesh surface is arranged close to the air inlet.

[0045] Preferably, at least two sets of the non-contact cooling system are provided, and the two sets of the non-contact cooling system are respectively provided on both sides of the refrigeration pad.

[0046] The technical solution provided by the present invention may include the following beneficial effects:

[0047] 1. This technical solution proposes a semiconductor refrigeration device that uses liquid cooling and air cooling to achieve the purpose of cooling, which is more conducive to satisfying the wearer's experience. In addition, since the wearable product of this solution is designed as a cooling pad, it can be worn independently on the one hand, and can also be flexibly combined with backpacks, car seat cushions and other products on the other hand, so that it can be applied to more scenarios, which is more conducive to improving the applicability of the cooling pad.

[0048] 2. This technical solution utilizes the cold fluid formed by the liquid medium and the airflow formed by the regulated wind to jointly take away the heat from the human body, so that the wearer can feel the flow of the regulated wind while directly contacting the cooling pad storing the liquid medium, thereby further enhancing the wearer's sense of coolness, making the wearer's cooling feeling stronger, and being more conducive to satisfying the wearer's usage experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a structural schematic diagram of a semiconductor refrigeration device of the present invention.

[0050] Figure 2 It is a cross-sectional view of a refrigeration pad in a semiconductor refrigeration device of the present invention.

[0051] Figure 3 It is a structural schematic diagram of a liquid-cooled air outlet layer in a semiconductor refrigeration device of the present invention.

[0052] Figure 4 It is a structural schematic diagram of a first embodiment of an air duct layer in a semiconductor refrigeration device of the present invention.

[0053] Figure 5 It is a structural schematic diagram of a second embodiment of an air duct layer in a semiconductor refrigeration device of the present invention.

[0054] Figure 6 It is a structural exploded diagram of a liquid cooling system in a semiconductor refrigeration device of the present invention.

[0055] Figure 7 It is a structural exploded view of the first embodiment of a non-contact cooling system in a semiconductor refrigeration device of the present invention.

[0056] Figure 8 It is a structural exploded view of a second embodiment of a non-contact cooling system in a semiconductor refrigeration device of the present invention.

[0057] Fig. 9 It is a structural exploded view of a third embodiment of a non-contact cooling system in a semiconductor refrigeration device of the present invention.

[0058] Fig.10 It is a structural exploded view of the fourth embodiment of a non-contact cooling system in a semiconductor refrigeration device of the present invention.

[0059] Fig.11 It is a partial structural schematic diagram of a semiconductor refrigeration device of the present invention.

[0060] Among them: In the above figures, the solid arrows are the flow direction of the regulating wind, and the hollow arrows are the flow direction of the liquid medium.

[0061] Refrigeration pad 11, liquid cooling air outlet layer 111, cooling air hole 1111, liquid storage cavity 1112, liquid inlet channel 11121, cooling main cavity 11122, liquid outlet channel 11123, air duct layer 112, wind shield 1121, air inlet notch 11211, support block 1122, heat insulation outer layer 113, fixing belt 114, liquid cooling system 12, cold conducting head 121, circulation pump 122, liquid cooling joint 123, semiconductor refrigeration sheet 124, radiator 125, mounting plate 126, heat preservation cover 127, cooling fan 128, housing 129, heat dissipation port 1291;

[0062] Non-contact cooling system 2, mounting shell 21, air inlet 211, regulating air outlet 212, heat dissipation air outlet 213, cooling fan 22, air guide plate 23, semiconductor refrigeration module 24, cooling block 241, heat dissipation block 242, air guide cover 25, mounting bag 26. DETAILED DESCRIPTION

[0063] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0064] The technical solution provides a semiconductor refrigeration device, including a refrigeration pad 11, a liquid cooling system 12 and a non-contact cooling system 2;

[0065] The refrigeration pad 11 is provided with a regulated air inlet, and the regulated air outlet 212 of the non-contact cooling system 2 is connected to the regulated air inlet, and the non-contact cooling system 2 is used to deliver regulated air to the refrigeration pad 11;

[0066] A plurality of cooling air holes 1111 and a liquid storage cavity 1112 are provided on the inner side of the refrigeration pad 11, the cooling air holes 1111 are interconnected with the regulating air inlet, the liquid cooling system 12 and the liquid storage cavity 1112 are interconnected, and the liquid cooling system 12 is used for circulating the liquid medium cooled by the semiconductor refrigeration plate 124 to the liquid storage cavity 1112.

[0067] The cooling and air-conditioning clothing currently on the market usually uses a single cooling method, that is, air cooling or liquid cooling, so the cooling effect on the human body is very limited. Therefore, in order to enhance the cooling effect of existing cooling wearable products, this technical solution proposes a semiconductor refrigeration device that uses liquid cooling and air cooling to achieve the cooling purpose, which is more conducive to satisfying the wearer's experience. In addition, since the wearable product of this solution is designed in the form of a cooling pad, it can be worn independently on the one hand, and on the other hand, it can be flexibly combined with products such as backpacks and car seat cushions, so that it can be applied to more scenarios, which is more conducive to improving the applicability of the cooling pad.

[0068] Specifically, Figure 1 , 11 As shown, the semiconductor refrigeration device of the present scheme mainly includes a refrigeration pad 11 worn by the human body, a liquid cooling system 12 for generating a liquid medium (such as water, etc.) refrigerated by a semiconductor refrigeration sheet 124, and a non-contact cooling system 2 for generating regulated wind, wherein the refrigerated liquid medium and the regulated wind both act on the refrigeration pad 11, and the cold fluid formed by the liquid medium and the airflow formed by the regulated wind are used to take away the heat of the human body, so that the wearer can feel the flow of the regulated wind under the premise of directly contacting the refrigeration pad 11 storing the liquid medium, which is conducive to further enhancing the wearer's coolness in terms of body sensation, making the wearer's cooling feeling stronger, and more conducive to satisfying the wearer's usage experience.

[0069] In one embodiment, the regulating air outlet 212 of the non-contact cooling system 2 and the regulating air inlet of the cooling pad 11 can be detachably connected via a hollow elastic band, so that the semiconductor refrigeration device of this solution is more convenient to wear.

[0070] It should be noted that the inner side of the cooling pad 11 in this embodiment refers to the side that is in direct contact with the wearer's body surface.

[0071] To further explain, the cooling pad 11 includes a liquid cooling air outlet layer 111, an air duct layer 112 and a heat insulating outer layer 113 which are sequentially arranged from the inside to the outside;

[0072] The liquid-cooled air outlet layer 111 is provided with a plurality of cooling air holes 1111 and the liquid storage cavity 1112, and the plurality of cooling air holes 1111 are distributed around the liquid storage cavity 1112;

[0073] The regulating air inlet and the cooling air holes 1111 are connected to each other through the air duct layer 112 .

[0074] In order to allow the wearer to feel the enhanced cooling effect brought by the two cooling methods at the same time, the present solution also optimizes the structure of the cooling pad 11, especially the cooling air holes 1111 and the liquid storage cavity 1112 are simultaneously provided in the liquid cooling air outlet layer 111 of the cooling pad 11. Figure 2 , 3 As shown, the cooling air holes 1111 are distributed around the liquid storage cavity 1112 to make the cooling effect at each position inside the cooling pad 11 more uniform, thereby achieving the best cooling experience.

[0075] In addition, the provision of the air duct layer 112 is conducive to better storing a large amount of regulated air in the cooling pad 11, thereby increasing the airflow of the cooling air holes 1111 and making the cooling effect more obvious. The provision of the heat-insulating outer layer 113 is mainly used to prevent the regulated air from escaping from the outside of the cooling pad 11, and can also, to a certain extent, block the temperature of the wearer from the external environment, thereby being more conducive to increasing the cooling effect of the cooling pad; in one embodiment, the material of the heat-insulating outer layer 113 can be polyester fiber, which is not limited here.

[0076] To further illustrate, the regulating air inlet is located at the lower part of the refrigeration pad 11, and the aperture of the cooling air hole 1111 gradually decreases from top to bottom.

[0077] In a preferred embodiment of the present technical solution, the regulating air inlet is located at the lower part of the cooling pad 11, that is, the non-contact cooling system 2 is installed at the lower part of the cooling pad 11, which is convenient for human body to wear. Based on the above wearing method, in order to ensure the uniform cooling effect of the cooling pad 11, the present solution especially gradually reduces the aperture of the cooling air hole 1111 from top to bottom. The larger aperture can reduce the wind resistance of the regulating air flow generated by the non-contact cooling system 2, making it easier for the regulating air flow to reach the upper part of the cooling pad 11, thereby matching with the outlet air flow of the cooling air hole 1111 at the lower part of the cooling pad 11, ensuring the uniform cooling effect.

[0078] Further, the liquid storage chamber 1112 includes a liquid inlet channel 11121, a cooling main chamber 11122 and a liquid outlet channel 11123 which are connected in sequence, and the cooling main chamber 11122 is located at the upper center of the cooling pad 11;

[0079] The liquid inlet channel 11121 is connected to the liquid cooling outlet of the liquid cooling system 12 , and the liquid outlet channel 11123 is connected to the liquid cooling inlet of the liquid cooling system 12 .

[0080] In addition, the liquid storage cavity 1112 of the present solution includes a liquid inlet channel 11121, a cooling main cavity 11122 and a liquid outlet channel 11123 which are connected in sequence, and the cooling main cavity 11122 is located in the upper center of the cooling pad 11. When the cooling pad 11 of the present solution is in direct contact with the back of the wearer, the liquid medium is mainly stored in the cooling main cavity 11122, and is arranged near the heart point and the lung point on the back of the human body. Since the heart point and the lung point of the human body have the most significant effect on regulating the temperature of the whole human body, the above corresponding points are fully cooled, which is more conducive to increasing the cooling effect and comfort of the human body.

[0081] To further explain, the air duct layer 112 is a 3D support structure, and a plurality of interlaced support ribs are arranged inside the 3D support structure.

[0082] In order to ensure that the air channel layer 112 can store the conditioned air flow, in the first embodiment of the present technical solution, the air channel layer 112 is a 3D support structure, such as Figure 4 As shown, the three-dimensional space of the air duct layer 112 is supported by a plurality of mutually interlaced supporting ribs, which is conducive to regulating the large amount of storage of wind, while not affecting the flow of airflow inside the air duct layer 112, avoiding the increase of wind resistance.

[0083] To further illustrate, a wind shield 1121 is protruding from the edge of the air duct layer 112, and the wind shield 1121 forms a wind cavity; the wind shield 1121 is provided with an air inlet notch 11211, and the air inlet notch 11211 is interconnected with the regulating air inlet.

[0084] In order to ensure that the air channel layer 112 can store the conditioned air flow, in the second embodiment of the present technical solution, the air channel layer 112 is a 3D support structure, such as Figure 5 As shown, a windshield strip 1121 is protruding from its edge, which can better achieve the large-scale storage of regulated wind and prevent the air flow from being lost from places other than the cooling air holes 1111.

[0085] To further explain, a plurality of support blocks 1122 are protrudingly provided on the inner side of the air duct layer 112 , and the surfaces of the support blocks 1122 abut against the outer side of the liquid-cooled air outlet layer 111 .

[0086] As a better embodiment of the above embodiment, a plurality of support blocks 1122 are protrudingly provided on the inner side of the air duct layer 112 , which can effectively ensure effective storage space for conditioned wind in the air duct layer 112 .

[0087] To further explain, the cooling pad 11 also includes an air-permeable mesh inner layer, and the air-permeable mesh inner layer, the liquid-cooled air outlet layer 111, the air duct layer 112 and the heat-insulating outer layer 113 are arranged in sequence from the inside to the outside.

[0088] Furthermore, in order to enhance the wearing comfort of the wearer, the present solution also provides an air-permeable mesh inner layer (not shown in the figure) on the inner side of the liquid-cooled air outlet layer 111, while taking into account the cooling effect and comfort of the cooling pad.

[0089] Preferably, the mesh size of the inner layer of the breathable net is 16-20 meshes.

[0090] Preferably, the material of the inner layer of the breathable mesh in this embodiment can be nylon, which is not limited here.

[0091] To further explain, the cooling pad 11 also includes a fixing belt 114 , and the fixing belt 114 is connected to the heat insulating outer layer 113 .

[0092] Furthermore, in order to facilitate the wearing stability of the cooling pad 11 and its coordination stability with products such as backpacks and car seat cushions, the present solution also adds a fixing belt 114 to the cooling pad 11. In addition, when the wearer wears the cooling pad 11 of the present solution independently, in order to make it have a better fit with the body surface, the present solution also specially connects the fixing belt 114 with the heat-insulating outer layer 113 to ensure that the cooling effect of the cooling pad is effectively transmitted to the body surface.

[0093] To further explain, at least five fixing belts 114 are provided, any three fixing belts 114 are evenly provided on the top of the heat insulating outer layer 113 , and the remaining two fixing belts 114 are respectively provided on both sides of the heat insulating outer layer 113 .

[0094] In a more preferred embodiment of the present technical solution, Fig.11 As shown, the setting position of the fixing belt 114 is also optimized so that the refrigeration pad can be matched for use in more application scenarios.

[0095] To further illustrate, the liquid cooling system 12 includes a cold conducting head 121, a circulating pump 122, a liquid cooling joint 123, the semiconductor cooling sheet 124 and a radiator 125;

[0096] The cold conduction head 121, the circulation pump 122 and the liquid cooling joint 123 are connected to each other through a cooling channel, the cold conduction head 121 is provided with a receiving cavity for receiving a liquid medium, and the liquid cooling joint 123 is provided with the liquid cooling inlet and the liquid cooling outlet;

[0097] The semiconductor cooling plate 124 includes a hot end surface and a cold end surface. The cold end surface is in contact with the cooling head 121 , and the hot end surface is in contact with the heat sink 125 .

[0098] The liquid cooling system 12 of the present invention includes a cooling head 121, a circulating pump 122, a liquid cooling joint 123, a semiconductor cooling sheet 124 and a radiator 125. Figure 6As shown, it uses semiconductor refrigeration to cool down the liquid medium in the liquid storage chamber 1112. Specifically, the semiconductor refrigeration sheet 124 is made using the Peltier effect. The Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration sheet 124 is made of two semiconductor materials to form a hot end and a cold end. The cold end continuously absorbs heat to achieve refrigeration; the hot end continuously releases heat. This technical solution uses the semiconductor refrigeration sheet 124 as a refrigeration device for the liquid medium, eliminating the complex mechanical refrigeration structure, and can effectively simplify the overall structure of the liquid cooling system and the overall volume of the compressed liquid cooling system, which is convenient for realizing silent refrigeration, and is safe and reliable, convenient and practical, with low manufacturing cost and a wide range of applications. Furthermore, a cold end of the semiconductor refrigeration plate 124 is provided with a cold end surface, and a hot end of the semiconductor refrigeration plate 124 is provided with a hot end surface, so that the cold end surface and the cold conducting head 121 are in contact with each other, and the hot end surface and the radiator 125 are in contact with each other, which is beneficial to the direct and effective conduction of heat and cold, thereby facilitating the improvement of the cooling effect of the liquid cooling system.

[0099] To further illustrate, the liquid cooling system 12 also includes a mounting plate 126 and a heat preservation cover 127;

[0100] The middle part of the mounting plate 126 is provided with a mounting position for mounting the semiconductor cooling sheet 124. The cooling head 121, the circulating pump 122, the liquid cooling joint 123, the semiconductor cooling sheet 124 and the heat preservation cover 127 are mounted on one side of the mounting plate 126, and the cooling head 121 and the semiconductor cooling sheet 124 are mounted inside the heat preservation cover 127.

[0101] The heat sink 125 is installed on the other side of the mounting plate 126 .

[0102] Since the carrier used to achieve cold transfer in the present solution is a liquid medium, preferably water, which is not limited here; therefore, in order to reduce the ineffective loss of cold and further ensure that the cold of the semiconductor refrigeration plate 124 is effectively transferred, the present solution also provides an insulation cover 127 on the outside of the cold conduction head 121 that is in direct contact with the cold end of the semiconductor refrigeration plate 124 to prevent the ineffective loss of cold.

[0103] To further illustrate, the liquid cooling system 12 also includes a cooling fan 128 and a housing 129;

[0104] The radiator 125 and the cooling fan 128 are both installed on the other side of the mounting plate 126, and the radiator 125 is provided with a cooling channel, and the outlet of the cooling fan 128 faces the cooling channel;

[0105] The cold conduction head 121, the circulation pump 122, the liquid cooling joint 123, the semiconductor cooling sheet 124, the radiator 125, the mounting plate 126, the heat preservation cover 127 and the cooling fan 128 are all installed inside the outer shell 129, and the shell wall of the outer shell 129 is provided with a heat dissipation port 1291, and the heat dissipation port 1291 is arranged close to the heat dissipation channel.

[0106] In addition, the liquid cooling system of the present solution also includes a cooling fan 128. The cooling fan 128 can effectively accelerate the air flow, thereby improving the heat dissipation efficiency of the semiconductor refrigeration plate 124. It should be noted that the cooling fan 128 in the present solution can be an axial flow fan or a centrifugal fan, which is not limited here.

[0107] To further illustrate, the non-contact cooling system 2 includes a mounting shell 21 and a cooling fan 22, and the cooling fan 22 is mounted inside the mounting shell 21;

[0108] The mounting shell 21 is provided with an air inlet 211 and the regulating air outlet 212, and the inlet of the cooling fan 22 is arranged close to the air inlet 211, the outlet of the cooling fan 22 is arranged close to the regulating air outlet 212, and the air inlet 211 and the regulating air outlet 212 are located on two different side walls of the mounting shell 21.

[0109] Specifically, the non-contact cooling system 2 of the present solution includes a mounting shell 21 and a cooling fan 22, wherein the cooling fan 22 is used to introduce air outside the cooling pad into the cooling pad 11, so as to deliver regulated air in a directional manner to the cooling pad 11. In addition, the air inlet 211 and the regulated air outlet 212 provided in the mounting shell 21 of the present solution are located on two different side walls thereof, which is conducive to a large amount of external air entering the non-contact cooling system 2 smoothly.

[0110] To further illustrate, the air inlet 211 and the regulating air outlet 212 are respectively located on two opposite side walls of the mounting shell 21;

[0111] Alternatively, the air inlet 211 and the regulating air outlet 212 are respectively located on two adjacent side walls of the mounting shell 21 .

[0112] like Figure 7 , 8 As shown, the air inlet 211 and the regulating air outlet 212 are respectively located on two adjacent sides or two opposite sides of the mounting shell 21 , which is beneficial to reduce interference with the incoming air flow and is more conducive to a large amount of external air smoothly entering the non-contact cooling system 2 .

[0113] It should be noted that the number of the air inlets 211 can be set according to the actual demand for adjusting the air volume and is not limited here.

[0114] To further explain, the cooling fan 22 is any one of an axial flow fan and a centrifugal fan.

[0115] To further explain, the non-contact cooling system 2 also includes an air guide plate 23 , which is installed inside the mounting shell 21 , and the air guide plate 23 is disposed between the outlet of the cooling fan 22 and the regulating air outlet 212 .

[0116] In this solution, a wind guide plate 23 is also provided in the non-contact cooling system 2, such as Fig. 9 As shown, the directional flow of external air is achieved, thereby improving the conversion rate of the conditioned wind in the non-contact cooling system 2.

[0117] Further, the non-contact cooling system 2 further includes a semiconductor refrigeration module 24, which is installed inside the installation shell 21, and the semiconductor refrigeration module 24 is arranged at the outlet of the cooling fan 22;

[0118] The semiconductor refrigeration module 24 includes a semiconductor refrigerator, a cooling block 241 and a heat sink 242. The semiconductor refrigerator is provided with a cold end face and a hot end face opposite to each other, and the cold end face is attached to the cooling block 241, and the hot end face is attached to the heat sink 242.

[0119] The installation shell 21 is also provided with a heat dissipation air outlet 213;

[0120] The cooling block 241 and the heat dissipation block 242 are both provided with heat exchange channels. The inlet of the heat exchange channel of the cooling block 241 and the inlet of the heat exchange channel of the heat dissipation block 242 are arranged close to the outlet of the cooling fan 22. The outlet of the heat exchange channel of the cooling block 241 is arranged close to the regulating air outlet 212, and the outlet of the heat exchange channel of the heat dissipation block 242 is arranged close to the heat dissipation air outlet 213.

[0121] In a more preferred embodiment of the present technical solution, in order to further enhance the cooling effect of the cooling pad, the present solution can also add a semiconductor cooling module 24 to the non-contact cooling system 2, such as Fig.10 As shown, the external air entering the non-contact cooling system 2 is first cooled by the semiconductor refrigeration module 24, and then forms cold conditioned air to enter the refrigeration pad 11, so as to better meet the wearer's usage experience.

[0122] Further, the non-contact cooling system 2 further includes an air guide cover 25, and the air guide cover 25 is a hollow structure;

[0123] The air guide cover 25 is detachably mounted on the outside of the mounting shell 21 , and the regulating air outlet 212 is connected to the inlet of the air guide cover 25 , and the regulating air outlet 212 is connected to the regulating air inlet through the air guide cover 25 .

[0124] The cross-sectional area of ​​the inlet of the air guide cover 25 is greater than or equal to the cross-sectional area of ​​the outlet of the air guide cover 25 .

[0125] In another preferred embodiment of the present technical solution, an air guide cover 25 may be provided at the regulating air outlet 212 of the mounting shell 21. Fig. 9 , 10 As shown, the different inlet and outlet cross-sectional areas of the air guide cover 25 can effectively increase the wind speed of the regulated wind entering the refrigeration pad 11, and further enhance the cooling experience brought by the airflow.

[0126] To further explain, the non-contact cooling system 2 also includes a mounting bag 26 , the mounting shell 21 is mounted inside the mounting bag 26 , and the mounting bag 26 is provided with a mesh surface, and the mesh surface is provided close to the air inlet 211 .

[0127] Preferably, the mesh size of the mesh is 6-10 meshes.

[0128] To further explain, at least two sets of the non-contact cooling system 2 are provided, and the two sets of the non-contact cooling system 2 are respectively provided on both sides of the cooling pad 11 .

[0129] So, like Fig.11 As shown, it is more conducive to increasing the air intake volume of the regulated wind and improving the cooling experience brought by the flowing airflow formed by the regulated wind.

[0130] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A semiconductor refrigeration device, characterized in that: Including cooling pads, liquid cooling systems and non-contact cooling systems; The refrigeration pad is provided with a regulated air inlet, and the regulated air outlet of the non-contact cooling system is connected to the regulated air inlet, and the non-contact cooling system is used to deliver regulated air to the refrigeration pad; A plurality of cooling air holes and a liquid storage cavity are provided on the inner side of the cooling pad, the cooling air holes are connected to the regulating air inlet, and the liquid cooling system and the liquid storage cavity are connected to each other; The liquid cooling system comprises a cooling head, a circulation pump, a liquid cooling joint, a semiconductor cooling sheet and a radiator, and the liquid cooling system is used to circulate the liquid medium cooled by the semiconductor cooling sheet to the liquid storage cavity; The refrigeration pad comprises a liquid cooling air outlet layer, an air duct layer and a heat insulating outer layer arranged in sequence from the inside to the outside; The liquid-cooled air outlet layer is provided with a plurality of cooling air holes and the liquid storage cavity, and the plurality of cooling air holes are distributed around the liquid storage cavity; The regulating air inlet and the cooling air hole are connected to each other through the air duct layer.

2. A semiconductor refrigeration device according to claim 1, characterized in that: The regulating air inlet is located at the lower part of the refrigeration pad, and the aperture of the cooling air hole gradually decreases from top to bottom.

3. A semiconductor refrigeration device according to claim 1, characterized in that: The liquid storage cavity comprises a liquid inlet channel, a cooling main cavity and a liquid outlet channel which are connected in sequence, and the cooling main cavity is located at the upper center of the refrigeration pad; The liquid inlet channel is connected to the liquid cooling outlet of the liquid cooling system, and the liquid outlet channel is connected to the liquid cooling inlet of the liquid cooling system.

4. A semiconductor refrigeration device according to claim 1, characterized in that: The air duct layer is a 3D support structure, and a plurality of mutually staggered support ribs are arranged inside the 3D support structure.

5. A semiconductor refrigeration device according to claim 1, characterized in that: The edge of the air duct layer is protrudingly provided with a wind shield strip, and the wind shield strip forms a wind cavity; the wind shield strip is provided with an air inlet notch, and the air inlet notch is communicated with the regulating air inlet.

6. A semiconductor refrigeration device according to claim 5, characterized in that: A plurality of support blocks are protrudingly arranged on the inner side of the air duct layer, and the surfaces of the support blocks abut against the outer side of the liquid-cooled air outlet layer.

7. A semiconductor refrigeration device according to claim 1, characterized in that: The refrigeration pad also includes an air-permeable mesh inner layer, and the air-permeable mesh inner layer, the liquid-cooled air outlet layer, the air duct layer and the heat-insulating outer layer are arranged in sequence from the inside to the outside.

8. A semiconductor refrigeration device according to claim 1, characterized in that: The refrigeration pad also includes a fixing belt connected to the thermal insulation outer layer.

9. A semiconductor refrigeration device according to claim 8, characterized in that: At least five fixing belts are provided, any three fixing belts are evenly arranged on the top of the heat-insulating outer layer, and the remaining two fixing belts are respectively arranged on both sides of the heat-insulating outer layer.

10. A semiconductor refrigeration device according to claim 3, characterized in that: The cold conduction head, the circulation pump and the liquid cooling joint are connected to each other through a cooling channel, a receiving cavity for receiving a liquid medium is provided inside the cold conduction head, and the liquid cooling joint is provided with the liquid cooling inlet and the liquid cooling outlet; The semiconductor refrigeration plate comprises a hot end surface and a cold end surface, the cold end surface is in contact with the cold conducting head, and the hot end surface is in contact with the heat sink.

11. A semiconductor refrigeration device according to claim 10, characterized in that: The liquid cooling system also includes a mounting plate and a heat preservation cover; A mounting position for mounting the semiconductor refrigeration sheet is provided in the middle of the mounting plate, the cold conduction head, the circulating pump, the liquid cooling joint, the semiconductor refrigeration sheet and the heat preservation cover are mounted on one side of the mounting plate, and the cold conduction head and the semiconductor refrigeration sheet are mounted inside the heat preservation cover; The radiator is mounted on the other side of the mounting plate.

12. A semiconductor refrigeration device according to claim 11, characterized in that: The liquid cooling system also includes a heat dissipation fan and a housing; The radiator and the cooling fan are both installed on the other side of the mounting plate, and the radiator is provided with a cooling channel, and the outlet of the cooling fan faces the cooling channel; The cooling head, the circulating pump, the liquid cooling joint, the semiconductor cooling sheet, the radiator, the mounting plate, the heat preservation cover and the cooling fan are all installed inside the shell, and the shell wall of the shell is provided with a heat dissipation port, and the heat dissipation port is arranged close to the heat dissipation channel.

13. A semiconductor refrigeration device according to claim 1, characterized in that: The non-contact cooling system comprises a mounting shell and a cooling fan, wherein the cooling fan is mounted inside the mounting shell; The mounting shell is provided with an air inlet and the regulating air outlet, and the inlet of the cooling fan is arranged close to the air inlet, the outlet of the cooling fan is arranged close to the regulating air outlet, and the air inlet and the regulating air outlet are located on two different side walls of the mounting shell.

14. A semiconductor refrigeration device according to claim 13, characterized in that: The air inlet and the regulating air outlet are respectively located on two opposite side walls of the mounting shell; Alternatively, the air inlet and the regulating air outlet are respectively located on two adjacent side walls of the mounting shell.

15. A semiconductor refrigeration device according to claim 13, characterized in that: The cooling fan is any one of an axial flow fan and a centrifugal fan.

16. A semiconductor refrigeration device according to claim 13, characterized in that: The non-contact cooling system further comprises an air guide plate, which is installed inside the mounting shell and is disposed between the outlet of the cooling fan and the regulating air outlet.

17. A semiconductor refrigeration device according to claim 13, characterized in that: The non-contact cooling system further comprises a semiconductor refrigeration module, which is installed inside the installation shell and arranged at the outlet of the cooling fan; The semiconductor refrigeration module comprises a semiconductor refrigerator, a cooling block and a heat sink, wherein the semiconductor refrigerator is provided with a cold end face and a hot end face opposite to each other, and the cold end face is attached to the cooling block, and the hot end face is attached to the heat sink; The installation shell is also provided with a heat dissipation air outlet; The cooling block and the heat dissipation block are both provided with heat exchange channels, the inlet of the heat exchange channel of the cooling block and the inlet of the heat exchange channel of the heat dissipation block are arranged close to the outlet of the cooling fan, the outlet of the heat exchange channel of the cooling block is arranged close to the regulating air outlet, and the outlet of the heat exchange channel of the heat dissipation block is arranged close to the heat dissipation air outlet.

18. A semiconductor refrigeration device according to claim 13, characterized in that: The non-contact cooling system further includes an air guide cover, and the air guide cover is a hollow structure; The air guide cover is detachably mounted on the outside of the mounting shell, and the regulating air outlet is connected to the inlet of the air guide cover, and the regulating air outlet is connected to the regulating air inlet through the air guide cover; The cross-sectional area of ​​the inlet of the air guide cover is greater than or equal to the cross-sectional area of ​​the outlet of the air guide cover.

19. A semiconductor refrigeration device according to claim 13, characterized in that: The non-contact cooling system further comprises a mounting bag, the mounting shell is mounted inside the mounting bag, and the mounting bag is provided with a mesh surface, and the mesh surface is arranged close to the air inlet.

20. The semiconductor refrigeration device according to claim 1, characterized in that: At least two sets of the non-contact cooling system are provided, and the two sets of the non-contact cooling system are respectively provided on both sides of the refrigeration pad.

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