Cosmetic refrigerated container

Abstract

The beauty makeup refrigerating box comprises a box body, a box cover and a box cover, the heat conducting plate divides the interior of the box body into a refrigeration area and a back area which are arranged in the first direction; the two refrigeration assemblies are arranged at intervals in the second direction, each refrigeration assembly comprises a semiconductor refrigeration sheet and a radiator which are arranged in the back area, the cold end of the semiconductor refrigeration sheet abuts against the heat conduction plate, and the hot end of the semiconductor refrigeration sheet is connected to the radiator. The semiconductor chilling plates of the two refrigeration assemblies form two cold energy sources on the heat conduction plate to cool the heat conduction plate, then cold energy is provided for the refrigeration area through the heat conduction plate, the refrigeration effect in the refrigeration area can be improved, and therefore the size of a radiator at the hot ends of the semiconductor chilling plates in the first direction can be reduced, and the overall size of the refrigerator body is smaller; and since the semiconductor chilling plates of the two refrigeration assemblies transfer heat through the same heat conducting plate, the cold ends of the semiconductor chilling plates do not need to be provided with radiators in the first direction, and the thickness of the box body can be reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of refrigeration technology, and in particular to a beauty and cosmetics refrigerator. Background Art

[0002] At present, there is a type of small refrigerator that can be used to store beauty products, etc. due to the demand for beautiful and delicate appearance. Small refrigerators for such items are generally placed on bedside tables and dressing tables, which requires a smaller overall thickness and thinner thickness. For example, the overall thickness is about 20 cm to 23 cm. Therefore, in order to place more items, it is necessary to minimize the space for the back refrigeration device and make it as thin as possible. In some related technologies, beauty refrigerators have the problem that the back refrigeration device is thick and occupies a large space, resulting in a larger overall thickness of the beauty refrigerator. Summary of the invention

[0003] Some embodiments of the present disclosure provide a beauty refrigerator to alleviate the problem of large thickness.

[0004] In one aspect of the present disclosure, a beauty refrigerator is provided, comprising:

[0005] Box;

[0006] A heat conducting plate, which divides the box into a refrigeration area and a back area arranged along a first direction; and

[0007] Two refrigeration components are arranged at intervals along the second direction, each refrigeration component includes a semiconductor refrigeration plate and a radiator arranged in the back area, the cold end of the semiconductor refrigeration plate is abutted against the heat conduction plate, and the hot end of the semiconductor refrigeration plate is connected to the radiator, and the second direction intersects with the first direction.

[0008] In some embodiments, it also includes a thermal insulation layer arranged in the back area, the thermal insulation layer is arranged in contact with the heat conductive plate, the semiconductor cooling plate is arranged inside the thermal insulation layer, and the heat sink of the radiator is located outside the thermal insulation layer.

[0009] In some embodiments, each refrigeration component further includes a heat conductive block located inside the thermal insulation layer, a first end of the heat conductive block is in contact with the heat conductive plate, and a second end of the heat conductive block is in contact with the cold end of the semiconductor refrigeration plate.

[0010] In some embodiments, the heat conductive plate comprises a heat conductive aluminum plate, and the heat conductive block comprises a heat conductive aluminum block.

[0011] In some embodiments, each refrigeration assembly further includes a first fan, wherein the first fan is disposed in the back area and located on one side of the radiator in a third direction, and the third direction intersects with the first direction and the second direction respectively.

[0012] In some embodiments, at least one of the two refrigeration assemblies further includes a second fan, the second fan is disposed in the refrigeration area, and the second fan is configured to blow air upward.

[0013] In some embodiments, the heat conducting plate includes a first plate, a second plate and a connecting plate, the first plate and the second plate are connected by the connecting plate, the first plate and the second plate are both flat plates, the second plate is located below the first plate, and the second plate is located on the rear side of the first plate, the cold end of the semiconductor refrigeration plate of one of the two refrigeration components abuts against the first plate, and the cold end of the semiconductor refrigeration plate of the other of the two refrigeration components abuts against the second plate.

[0014] In some embodiments, the lower refrigeration assembly of the two refrigeration assemblies further includes a second fan, the second fan is disposed on a side of the second plate located in the refrigeration area, and the second fan is configured to blow air upward.

[0015] In some embodiments, a main control panel is further included. The main control panel is disposed between the two refrigeration components, and the main control panel is located on a side of the first panel away from the refrigeration area.

[0016] In some embodiments, the dimension of the first plate in the second direction accounts for at least two-thirds of the height of the box.

[0017] In some embodiments, the two refrigeration components are flush with each other on a side facing away from the refrigerated area.

[0018] In some embodiments, the two refrigeration assemblies are configured to be independently controlled.

[0019] Based on the above technical solution, the present disclosure has at least the following beneficial effects:

[0020] In some embodiments, a whole heat conduction plate is arranged in the body of the beauty refrigerator, and the heat conduction plate divides the body of the refrigerator into a refrigerated area and a back area arranged along a first direction. The semiconductor refrigeration plates and radiators of the two refrigeration components are arranged in the back area, and the radiator is close to the hot end of the corresponding semiconductor refrigeration plate, and the cold end of the semiconductor refrigeration plate is abutted against the heat conduction plate. The semiconductor refrigeration plates of the two refrigeration components form two sources of cold energy on the heat conduction plate, which cools the heat conduction plate, and then provides cold energy to the refrigerated area through the heat conduction plate, which can improve the refrigeration effect in the refrigerated area; and because the semiconductor refrigeration plates of the two refrigeration components transfer heat through the same heat conduction plate, there is no need to set a radiator at the cold end of the semiconductor refrigeration plate along the first direction, which can reduce the size of the refrigeration component in the first direction; furthermore, by setting two semiconductor refrigeration plates to cool the refrigerated area, the refrigeration effect can be improved, so the size of the radiator at the hot end of the semiconductor refrigeration plate in the first direction can be appropriately reduced, so that the overall size of the box is thinner, more beautiful, and more suitable for placement on a bedside table or dressing table. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of the present disclosure. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation on the present disclosure. In the drawings:

[0022] Figure 1 It is a cross-sectional schematic diagram of a beauty refrigerator provided according to some embodiments of the present disclosure;

[0023] Figure 2 A schematic diagram of two refrigeration components of a beauty refrigerator provided according to some embodiments of the present disclosure;

[0024] Figure 3 It is a schematic rear view of a beauty refrigerator provided according to some embodiments of the present disclosure. The reference numerals in the accompanying drawings are described as follows:

[0025] 1-Box body; 11-Refrigeration area; 12-Back area;

[0026] 2-heat conducting plate; 21-first plate; 22-second plate; 23-connecting plate;

[0027] 3-refrigeration component; 31-semiconductor refrigeration sheet; 32-heat sink; 33-heat conduction block; 34-first fan; 35-second fan;

[0028] 4- Insulation layer;

[0029] 5- Main control board.

[0030] It should be understood that the size of each part shown in the accompanying drawings is not drawn according to the actual proportional relationship. In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary and not as limiting.

[0032] The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0033] In the present disclosure, when a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other device without an intermediate device, or may not be directly connected to the other device but have an intermediate device.

[0034] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0035] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0036] In some related technologies, due to the refrigeration demand, the thickness of the radiator of the refrigerator needs to be large in order to effectively cool down (for example: the thickness of the radiator is 40 mm~50 mm), and the radiator is superimposed with an axial flow fan in the thickness direction, so that the thickness of the entire refrigeration device of the refrigerator exceeds 10 cm. If the entire refrigeration device is arranged in the upper area of ​​the back of the refrigerator, the upper area will bulge toward the refrigeration area, forming a protruding structure, which makes the volume utilization rate of the already small refrigeration compartment very poor (it is almost impossible to place things on the upper part). In order to make it flat, the entire refrigeration device of the refrigerator is placed back, and it is necessary to set up a space to accommodate the entire refrigeration device, resulting in the overall thickness of the refrigerator including the insulation layer exceeding 40 cm, making the refrigerator relatively thick and unable to be placed on some dressing tables or bedside tables, or even if it is placed on a dressing table or bedside table, it will make part of the refrigerator suspended or make the front of the dressing table without operating space.

[0037] Based on this, the embodiments of the present disclosure provide a beauty and cosmetics refrigerator to alleviate the problem of the large thickness of the beauty and cosmetics refrigerator.

[0038] Figure 1 Schematic diagram of the structure of some embodiments of the beauty refrigerator according to the present disclosure. Figure 1 In some embodiments, the beauty refrigerator includes a box body 1, a heat conduction plate 2 and two refrigeration components 3.

[0039] The heat conducting plate 2 divides the interior of the box 1 into a refrigeration area 11 and a back area 12 arranged along a first direction X.

[0040] refer to Figure 1 and Figure 2 , two refrigeration components 3 are arranged at intervals along the second direction Y, each refrigeration component 3 includes a semiconductor refrigeration plate 31 and a heat sink 32 arranged in the back area 12, the cold end of the semiconductor refrigeration plate 31 abuts against the heat conduction plate 2, and the hot end of the semiconductor refrigeration plate 31 is connected to the heat sink 32; the second direction Y intersects the first direction X. Optionally, the second direction Y is perpendicular to the first direction X.

[0041] In some embodiments, the first direction X is the thickness direction of the box body 1 .

[0042] In the above embodiment, a whole heat conducting plate 2 is arranged in the box body 1, and the heat conducting plate 2 divides the box body 1 into a cold storage area 11 and a back area 12 arranged along the first direction X. Two refrigeration components 3, semiconductor cooling plates 31 and a heat sink 32 are arranged in the back area 12. The radiator 32 is close to the hot end of the corresponding semiconductor cooling plate 31, and the cold end of the semiconductor cooling plate 31 is in contact with the heat conducting plate 2. The semiconductor cooling plates 31 of the two refrigeration components 3 form two sources of cold energy on the heat conducting plate 2, which cools down the heat conducting plate 2, and then provides cold energy to the cold storage area 11 through the heat conducting plate 2, which can improve the refrigeration effect in the cold storage area. Since the semiconductor refrigeration plates 31 of the two refrigeration components 3 transfer heat through the same heat conducting plate 2, the heat conducting plate 2 is arranged at the cold end of the semiconductor refrigeration plate 31, which is equivalent to an evaporator for cooling the refrigeration area 11. Therefore, the cold end of the semiconductor refrigeration plate 31 does not need to be provided with a radiator along the first direction X, which can reduce the size of the refrigeration component 3 in the first direction X; furthermore, by providing two semiconductor refrigeration plates 31 to cool the refrigeration area 11, the refrigeration effect can be improved, so the size of the radiator at the hot end of the semiconductor refrigeration plate 31 in the first direction X can be appropriately reduced, so that the overall size of the box body 1 is thinner, more beautiful, and more suitable for placement.

[0043] In the above embodiment, two refrigeration components 3 are arranged at intervals in the back area 12 of the box body 1 along the second direction Y. Since the areas of the semiconductor refrigeration plates 31 are basically the same, for example, the area is 40mmx40mm, the arrangement of two semiconductor refrigeration plates 31 can preferably double the heat dissipation area and improve the refrigeration effect of the refrigeration area 11.

[0044] In the above embodiment, the cooling capacity provided by the two semiconductor refrigeration plates 31 is twice that of a single semiconductor refrigeration plate, and the hot ends of the two semiconductor refrigeration plates 31 are respectively equipped with a heat sink 32 for independent heat dissipation, so the radiator 32 can be set to be thinner and smaller, thereby making the size of the back area 12 in the first direction X smaller. When the entire box body 1 is thinner, the space of the refrigeration area 11 is not affected.

[0045] In some embodiments, the first direction X is the thickness direction of the cabinet 1, that is, the direction from the door opening side to the back side of the cabinet 1, or the depth direction of the cabinet 1. The second direction Y is the height direction of the cabinet 1, that is, the up and down direction of the cabinet 1 in a normal placement state. The third direction Z is the width direction of the cabinet 1. The third direction Z is perpendicular to the first direction X and the second direction Y, respectively. The first direction X is perpendicular to the second direction Y. In this embodiment, the two refrigeration assemblies 3 are spaced apart along the height direction of the cabinet 1.

[0046] In other embodiments, the first direction X is the thickness direction of the cabinet 1, that is, the direction of the door opening side and the back side of the cabinet 1, or the depth direction of the cabinet 1. The second direction Y is the width direction of the cabinet 1. The third direction Z is the height direction of the cabinet 1, that is, the up and down direction of the cabinet 1 in a normal placement state. The third direction Z is perpendicular to the first direction X and the second direction Y, respectively. The first direction X is perpendicular to the second direction Y. In this embodiment, the two refrigeration components 3 are spaced apart along the width direction of the cabinet 1.

[0047] In some embodiments, the beauty refrigerator also includes an insulation layer 4, which is arranged in the back area 12, and the insulation layer 4 is arranged in contact with the heat conduction plate 2, the semiconductor refrigeration plate 31 is arranged inside the insulation layer 4, and the heat sink of the radiator 32 is located outside the insulation layer 4.

[0048] In the above embodiment, the semiconductor cooling sheet 31 is arranged inside the insulation layer 4, and the semiconductor cooling sheet 31 will no longer occupy additional space in the first direction X, which can make the space utilization of the back area 12 more efficient, and is more conducive to reducing the thickness of the back area 12, making the entire box body 1 thinner.

[0049] In the above embodiment, the semiconductor refrigeration chip 31 is arranged inside the thermal insulation layer 4, and the heat sink of the radiator 32 is arranged outside the thermal insulation layer 4. The thermal insulation layer 4 can effectively reduce the influence of the external environment on the cold end of the semiconductor refrigeration chip 31 and reduce the loss of cold energy, so that the semiconductor refrigeration chip 31 can provide cold energy more concentratedly, making it easier to reach and maintain the temperature of the cold storage area 11 within the required temperature range, thereby improving the refrigeration effect and efficiency.

[0050] In some embodiments, part of the heat sink 32 is embedded in the thermal insulation layer 4 .

[0051] In some embodiments, the heat sink 32 includes a base, the heat sink is connected to the base, and the base is arranged in the insulation layer 4. Optionally, the thickness of the base is 3mm-5mm. The base is embedded in the insulation layer 4, and the airflow only blows the heat sink to form an air duct.

[0052] In some embodiments, each refrigeration component 3 also includes a heat conductive block 33 located inside the insulation layer 4, the first end of the heat conductive block 33 is in contact with the heat conductive plate 2, and the second end of the heat conductive block 33 is in contact with the cold end of the semiconductor refrigeration plate 31.

[0053] In the above embodiment, the heat conductive block 33 makes it easier to connect the semiconductor refrigeration sheet 31 with the heat conductive plate 2, thereby reducing the direct stress between the semiconductor refrigeration sheet 31 and the heat conductive plate 2. The heat conductive block 33 itself has a high thermal conductivity, and can quickly transfer the cold generated by the semiconductor refrigeration sheet 31 to the heat conductive plate 2, thereby reducing the thermal resistance between the semiconductor refrigeration sheet 31 and the heat conductive plate 2, ensuring that the cold can be efficiently transferred, which is beneficial to improving the overall cooling effect of the refrigeration area 11.

[0054] In some embodiments, the heat conducting plate 2 comprises a heat conducting aluminum plate, and the heat conducting block 33 comprises a heat conducting aluminum block.

[0055] In the above embodiment, the heat conducting plate 2 and the heat conducting block 33 are both made of aluminum. Aluminum as a heat conducting member has the characteristics of high thermal conductivity, good heat conducting effect and low cost.

[0056] In some embodiments, the heat conducting plate 2 is a solid aluminum plate.

[0057] refer to Figure 3 In some embodiments, each refrigeration assembly 3 further includes a first fan 34, which is disposed in the back area 12 and located on one side of the radiator 32 in the third direction Z, and the third direction Z intersects the first direction X and the second direction Y. Optionally, the third direction Z is perpendicular to the first direction X and the second direction Y.

[0058] In the above embodiment, the first fan 34 is arranged in the back area 12 and is located on one side of the radiator 32 in the third direction Z. The first fan 34 and the heat sink of the radiator 32 are arranged flush on the side away from the refrigeration area 11. The first fan 34 will not expand the size of the first direction X, which can be beneficial to reducing the volume of the refrigeration component 3 and thinning the box body 1. The first fan 34 inhales ambient air from the outside and blows out heat to the radiator 32, thereby improving the heat dissipation effect of the radiator 32.

[0059] In some embodiments, the first fan 34 includes a centrifugal fan.

[0060] In some embodiments, at least one of the two refrigeration assemblies 3 further includes a second fan 35 , which is disposed in the refrigeration area 11 , and is configured to blow air upward.

[0061] In the refrigerator, since the cold air has a greater density than the hot air, the cold air will naturally sink to the bottom, while the hot air will rise to the top. This natural convection phenomenon causes the bottom temperature of the refrigerator to be lower than the top temperature. Therefore, at least one of the two refrigeration components 3 further includes a second fan 35. The second fan 35 blows air upward to blow the cold air to the top, which is conducive to the uniform temperature in the refrigeration area 11.

[0062] In some embodiments, two refrigeration assemblies 3 are arranged one above the other.

[0063] In some embodiments, the lower refrigeration assembly 3 of the two refrigeration assemblies 3 further includes a second fan 35 . The second fan 35 is disposed in the refrigeration area 11 . The second fan 35 is configured to blow air upward.

[0064] refer to Figure 1 In some embodiments, the heat conducting plate 2 includes a first plate 21, a second plate 22 and a connecting plate 23. The first plate 21 and the second plate 22 are connected by the connecting plate 23. The first plate 21 and the second plate 22 are both flat plates. The second plate 22 is located below the first plate 21, and the second plate 22 is located on the rear side of the first plate 21. The cold end of the semiconductor refrigeration plate 31 of one of the two refrigeration components 3 is abutted against the first plate 21, and the cold end of the semiconductor refrigeration plate 31 of the other of the two refrigeration components 3 is abutted against the second plate 22.

[0065] Since the entire refrigerator body 1 is relatively thin, a drawer is further provided at the bottom of the refrigeration area 11 to meet the use requirements. In order to increase the capacity of the drawer, the thickness of the back area 12 at the bottom needs to be further reduced. Therefore, the second plate 22 of the heat conducting plate 2 is located at the rear side of the first plate 21 to expand the capacity of the drawer area and to make the best use of the space in the box body 1. Furthermore, the specifications of the components such as the radiator 32 in the refrigeration assembly 3 corresponding to the position of the second plate 22 can be further reduced, so that the structural arrangement of the entire back area 12 is more compact.

[0066] The thickness of the radiator 32 of the refrigeration assembly 3 located at the bottom is smaller than the thickness of the radiator 32 of the refrigeration assembly 3 located at the top.

[0067] In the above embodiment, in order to accommodate the thinner space at the bottom of the back area 12, the heat conducting block 33 of the refrigeration assembly 3 located below can also be set to be thinner.

[0068] The thickness of the heat conducting block 33 of the refrigeration assembly 3 located at the bottom is smaller than the thickness of the heat conducting block 33 of the refrigeration assembly 3 located at the top.

[0069] Optionally, the thickness of the heat-conducting block 33 of the refrigeration assembly 3 located at the bottom is 10 mm, and the thickness of the heat-conducting block 33 of the refrigeration assembly 3 located at the top is 20 mm.

[0070] In some embodiments, the lower refrigeration assembly 3 of the two refrigeration assemblies 3 further includes a second fan 35, and the second fan 35 is disposed on a side of the second plate 22 located in the refrigeration area 11, and the second fan 35 is configured to blow air upward.

[0071] In the above embodiment, the second plate 22 of the heat conducting plate 2 is located at the rear side of the first plate 21, and is used to expand the capacity of the drawer area. A small second fan 35 can be arranged in the expanded drawer area space. The second fan 35 sucks in the compartment air and blows upward to release the cold energy of the heat conducting plate 2 into the refrigerated compartment, thereby cooling the refrigerated compartment and making the structure more compact.

[0072] In some embodiments, the second fan 35 includes a centrifugal fan.

[0073] refer to Figure 1 and Figure 3 In some embodiments, the beauty refrigerator further includes a main control panel 5 , which is disposed between the two refrigeration components 3 , and the main control panel 5 is located on a side of the first panel 21 away from the refrigeration area 11 .

[0074] In the above embodiment, the main control panel 5 is arranged between the two refrigeration components 3 by utilizing the space in the back area 12, and the side of the main control panel 5 away from the cold storage area 11 is flush with the refrigeration component 3. The structure is compact and the thickness of the back area 12 is not increased, thereby improving the space utilization of the entire back area 12.

[0075] In some embodiments, the dimension of the first plate 21 in the second direction Y accounts for at least two-thirds of the height of the box body 1 .

[0076] In the above embodiment, most of the area of ​​the heat conducting plate 2 is the flat first plate 21 , which is helpful to make the back of the box body 1 neat and flat.

[0077] In other embodiments, the heat conducting plate 2 may also be a flat plate that is flat as a whole.

[0078] In some embodiments, the two refrigeration components 3 are flush with each other at the sides facing away from the refrigerated area 11 .

[0079] In the above embodiment, the two refrigeration components 3 are flush with each other on the side facing away from the refrigeration area 11, which is beneficial to make the back of the box body 1 neat and flat, thereby improving the aesthetics of the beauty refrigerator.

[0080] In some embodiments, the specifications and sizes of the components in the upper and lower refrigeration assemblies 3 may be the same or different. When there is enough space above the back area 12, the radiator 32 of the upper refrigeration assembly 3 may be larger in the first direction X, so as to achieve a better cooling effect.

[0081] In some embodiments, the two refrigeration assemblies 3 are configured to be independently controlled.

[0082] In the above embodiment, the semiconductor refrigeration plates 31 of the two refrigeration components 3 can be controlled independently. By utilizing the different duty cycle outputs of the semiconductor refrigeration plates 31 in the two refrigeration components 3 and the combination with the first fan 34, the refrigeration efficiency can be improved, and multi-speed stepless adjustment of small cooling capacity can be achieved to achieve fine temperature control.

[0083] refer to Figures 1 to 3 In some specific embodiments, the beauty refrigerator includes a box body 1, a heat conduction plate 2, two refrigeration components 3, a heat preservation layer 4 and a main control board 5.

[0084] The heat conducting plate 2 is an integral aluminum plate, and the heat conducting plate 2 divides the box body 1 into a refrigeration area 11 and a back area 12 arranged along a first direction X, and the first direction X is the thickness direction of the box body 1. A door body is arranged in front of the refrigeration area 11, and the back of the refrigeration area 11 is the back area 12. At least two-thirds of the area from top to bottom in the refrigeration area 11 is a storage room, and a storage rack can be arranged in the storage room. A drawer can be arranged in the area below the storage room, which is a drawer area. The back area 12 is used to set refrigeration appliances and the main control board 5, etc.

[0085] The heat conducting plate 2 includes a first plate 21, a second plate 22 and a connecting plate 23 which are integrally arranged. The first plate 21 and the second plate 22 are connected by the connecting plate 23. The first plate 21 and the second plate 22 are both flat plates. The second plate 22 is located below the first plate 21. The position of the second plate 22 corresponds to the drawer area. To increase the capacity of the drawer area, the second plate 22 is located on the rear side of the first plate 21, thereby increasing the size of the drawer area in the first direction X.

[0086] The heat-insulating layer 4 is disposed in the back region 12 and is disposed in close contact with the heat-conducting plate 2 .

[0087] The two refrigeration components 3 are arranged up and down, that is, the two refrigeration components 3 are arranged at intervals along the height direction of the box body 1, and the main control board 5 is arranged between the two refrigeration components 3. The main control board 5 and the refrigeration component 3 located above are correspondingly arranged at the positions corresponding to the first plate 21, and the refrigeration component 3 located below is arranged at the position corresponding to the second plate 22.

[0088] Each refrigeration assembly 3 includes a semiconductor refrigeration sheet 31 , a heat sink 32 , a heat conduction block 33 and a first fan 34 .

[0089] The semiconductor cooling sheet 31 and the heat conducting block 33 are arranged inside the heat insulating layer 4, and the heat sink of the heat sink 32 is located outside the heat insulating layer 4. The first end of the heat conducting block 33 is in contact with the heat conducting plate 2, and the second end of the heat conducting block 33 is in contact with the cold end of the semiconductor cooling sheet 31. The hot end of the semiconductor cooling sheet 31 is connected to the heat sink 32.

[0090] The cold end of the semiconductor refrigeration plate 31 of the refrigeration assembly 3 located at the upper side abuts against the first plate 21 , and the cold end of the semiconductor refrigeration plate 31 of the refrigeration assembly 3 located at the lower side abuts against the second plate 22 .

[0091] The first fan 34 is disposed in the back area 12 and is located on one side of the radiator 32 in the third direction Z. Optionally, the first fan 34 is located on one side of the radiator 32 in the width direction of the box 1. The side of the first fan 34 away from the refrigerated area 11 is flush with the sides of the two radiators 32 away from the refrigerated area 11, which is conducive to making the back of the box 1 flat.

[0092] The refrigeration assembly 3 located at the bottom further includes a second fan 35 . The second fan 35 is disposed on a side of the second plate 22 located at the refrigeration area 11 . The second fan 35 is configured to blow air upward.

[0093] The two refrigeration components 3 form two sources of cold energy, cool the heat conducting plate 2, and then blow upward through the second fan 35 inside to cool the room. The refrigeration effect is good at each ambient temperature, the temperature drop is low, the temperature uniformity in the room is good, and it is closer to the set temperature.

[0094] In the above embodiments, in order to reduce the thickness of the entire box 1 and keep the back plate of the box 1 flat, a layout of upper and lower dual refrigeration components is adopted, which can first reduce the thickness of the radiator 32 (for example, the thickness of the radiator 32 is 30 mm or less, and the thickness of the radiator 32 in this embodiment is 25 mm), and secondly, the radiator 32 can be partially embedded in the foam insulation layer 4 (for example, embedded 5 mm), with only the heat dissipation ribs exposed. At the same time, the first fan 34 is arranged flush, and the first fan 34 inhales ambient air from the outside and blows it to the radiator 32 for heat dissipation.

[0095] The cooling effect of the dual refrigeration components is as follows: since the areas of the semiconductor refrigeration sheets 31 are basically the same, for example, the sizes of 3A / 4A / 5A / 6A are all 40x40mm in area, if a separate refrigeration component is provided, the contact area between the heat conducting block and the semiconductor refrigeration sheet is only 40x40mm, and the heat dissipation can only rely on the conduction of the radiator. However, due to the existence of thermal resistance, the heat transfer gradually decays. The disclosed embodiment adopts the setting mode of dual refrigeration components, which can effectively double the heat dissipation area, and the semiconductor refrigeration sheets 31 of the two refrigeration components dissipate heat independently, so the hot end radiator of the semiconductor refrigeration sheet 31 can be thinner and smaller, and the space utilization rate of the back area 12 is more efficient.

[0096] After the dual refrigeration component layout, the heat exchange efficiency is improved. Since the upper and lower radiators can be relatively thin, the first fan 34 can also be selected to have a thickness of 15 mm. In this way, the first fan 34 and the cooling fins of the radiator are matched (exposed about 20 mm), forming an overall thinner layout.

[0097] The overall height of the box 1 does not exceed 42 cm, and the thickness of the space for the refrigeration appliance layout is only 2.2 cm (22 mm), which is much smaller than 10 cm (100 mm) in the related art. Therefore, the thickness of the entire box can be less than 23 cm. After being placed on a 40 cm dressing table or bedside table, the dressing table or bedside table can still retain about 17 cm of movable space, which is convenient for temporarily placing the face cream, eye cream, lipstick, etc. taken out during makeup.

[0098] After adopting the dual refrigeration components, a combination module of dual semiconductor refrigeration plates and dual first fans is formed. Therefore, different cooling capacity controls can be output according to different ambient temperatures to finely control the compartment temperature. As shown in Table 1, the temperature control strategies under different ambient temperatures are listed:

[0099] Table 1 Temperature control strategies under different ambient temperatures

[0100] According to Table 1 above, when the ambient temperature is low (for example, the ambient temperature is 14°C) and the compartment temperature is close to the set temperature, it means that the cooling capacity demand is very small at this time, and it will switch to gear 1, the semiconductor refrigeration piece will output at 50%, and the first fan will be at low gear (it can also be adjusted steplessly). At this time, if the cooling capacity is insufficient and the compartment temperature rises by 0.1°C, the gear will be switched to 2, and the speed of the first fan will be adjusted to strengthen the heat dissipation of the hot end. If the cooling capacity is still insufficient, the high gear will continue to be raised until the compartment temperature begins to drop. If the gear is 1 at this time, the cooling capacity is still sufficient, and the compartment continues to drop by 0.1°C, then the duty cycle of the semiconductor refrigeration piece will be gradually reduced, such as output at 40%, so that the cooling capacity will be further reduced. In this way, the cooling capacity and the heat leakage of the box can be adjusted to be close to each other, and a balance can be achieved, so that the temperature of the compartment can be precisely controlled to be close to the set temperature. The main function of the second fan set in the compartment is to disturb the airflow in the compartment to make the temperature in the compartment more uniform.

[0101] In summary, the cosmetics refrigerator provided by the embodiment of the present disclosure alleviates the problem that the refrigeration equipment in the related art occupies a large space, forms a protruding structure that wastes placement space, or does not form an overall flatness and is not aesthetically pleasing due to the thick radiator, large fan, and thick refrigeration equipment components. In addition, the cosmetics refrigerator provided by the embodiment of the present disclosure can output different cooling capacities according to different ambient temperatures, and can finely control the compartment temperature.

[0102] Based on the above-mentioned embodiments of the present disclosure, in the absence of explicit negation or conflict, the technical features of one embodiment may be beneficially combined with one or more other embodiments.

[0103] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A cosmetics refrigerator, characterized in that: include: Box (1); A heat conducting plate (2) which divides the box body (1) into a refrigeration area (11) and a back area (12) arranged along a first direction (X); and Two refrigeration components (3) are arranged at intervals along a second direction (Y), each refrigeration component (3) comprising a semiconductor refrigeration plate (31) and a heat sink (32) arranged in the back area (12), the cold end of the semiconductor refrigeration plate (31) abutting against the heat conduction plate (2), and the hot end of the semiconductor refrigeration plate (31) connected to the heat sink (32); the second direction (Y) intersects with the first direction (X).

2. The beauty refrigerator according to claim 1, characterized in that: It also includes a heat-insulating layer (4) disposed in the back region (12), the heat-insulating layer (4) being arranged in contact with the heat-conducting plate (2), the semiconductor cooling sheet (31) being disposed inside the heat-insulating layer (4), and the heat-dissipating sheet of the heat sink (32) being located outside the heat-insulating layer (4).

3. The beauty refrigerator according to claim 2, characterized in that: Each refrigeration assembly (3) further comprises a heat conducting block (33) located inside the thermal insulation layer (4), wherein a first end of the heat conducting block (33) is in contact with and connected to the heat conducting plate (2), and a second end of the heat conducting block (33) is in contact with and connected to a cold end of the semiconductor refrigeration plate (31).

4. The beauty refrigerator according to claim 3, characterized in that: The heat conducting plate (2) comprises a heat conducting aluminum plate, and the heat conducting block (33) comprises a heat conducting aluminum block.

5. The beauty refrigerator according to claim 1, characterized in that: Each refrigeration assembly (3) further comprises a first fan (34), wherein the first fan (34) is arranged in the back area (12) and is located on one side of the radiator (32) in a third direction (Z), and the third direction (Z) intersects with the first direction (X) and the second direction (Y) respectively.

6. The beauty refrigerator according to claim 1, characterized in that: At least one of the two refrigeration assemblies (3) further comprises a second fan (35), wherein the second fan (35) is arranged in the refrigeration area (11), and the second fan (35) is configured to blow air upwards.

7. The beauty refrigerator according to claim 1, characterized in that: The heat conducting plate (2) comprises a first plate (21), a second plate (22) and a connecting plate (23); the first plate (21) and the second plate (22) are connected via the connecting plate (23); the first plate (21) and the second plate (22) are both flat plates; the second plate (22) is located below the first plate (21), and the second plate (22) is located on the rear side of the first plate (21); the cold end of the semiconductor refrigeration plate (31) of one of the two refrigeration components (3) abuts against the first plate (21), and the cold end of the semiconductor refrigeration plate (31) of the other of the two refrigeration components (3) abuts against the second plate (22).

8. The beauty refrigerator according to claim 7, characterized in that: The lower refrigeration assembly (3) of the two refrigeration assemblies (3) further comprises a second fan (35), wherein the second fan (35) is arranged on a side of the second plate (22) located at the refrigeration area (11), and the second fan (35) is configured to blow air upwards.

9. The beauty refrigerator according to claim 7, characterized in that: It also comprises a main control panel (5), wherein the main control panel (5) is arranged between the two refrigeration components (3), and the main control panel (5) is located on a side of the first panel (21) facing away from the refrigeration area (11).

10. The beauty refrigerator according to claim 7, characterized in that: The dimension of the first plate (21) in the second direction (Y) accounts for at least two thirds of the height of the box body (1).

11. The beauty refrigerator according to any one of claims 1 to 10, characterized in that: The two refrigeration components (3) are flush with each other on a side facing away from the refrigeration area (11).

12. The cosmetics refrigerator according to any one of claims 1 to 10, characterized in that: The two refrigeration assemblies (3) are configured to be independently controlled.

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