Inverter, motor controller and vehicle

Abstract

The embodiment of the invention provides an inverter, a motor controller and a vehicle, and the inverter comprises an integrated drive control board which comprises a drive part and a control part which are disposed on the same circuit board; the onboard current sensor is used for detecting direct current and converting the direct current into three-phase alternating current; the integrated liquid cooling heat dissipation capacitor comprises a high-voltage film capacitor and a liquid cooling heat dissipation device, and at least part of the high-voltage film capacitor is in contact with the liquid cooling heat dissipation device. At least part of the power semiconductor device is in contact with the liquid cooling radiator, the high-voltage film capacitor is connected with a positive electrode and a negative electrode of an upper bridge of the power semiconductor device through a positive electrode switching copper bar and a negative electrode switching copper bar respectively, and a lower bridge of the power semiconductor device is connected with the three-phase copper bar. The integrated liquid cooling heat dissipation capacitor and the liquid cooling heat dissipation device are arranged to dissipate heat of the power semiconductor device and the high-voltage thin film capacitor, and the high-voltage thin film capacitor and the power semiconductor device can be dissipated at the same time through one liquid cooling heat dissipation device.

Description

Technical Field

[0001] The present specification relates to the field of vehicle technology, and in particular to an inverter, a motor controller and a vehicle. Background Art

[0002] As the core component of new energy vehicles, motor controllers have difficulties such as large size, difficult production and manufacturing, and high cost. New energy vehicles need to convert the direct current of the battery into three-phase alternating current that can drive the motor. In order to ensure the stability of the voltage during the conversion process, high-voltage film capacitors are needed to filter and absorb peak voltages and high pulse currents while reducing inductance. At present, many capacitors on the market use direct or indirect heat dissipation methods, and the heat dissipation effect is relatively general. Summary of the invention

[0003] In view of this, the embodiments of the present specification provide an inverter, a motor controller and a vehicle. By setting up an integrated liquid-cooled heat dissipation capacitor, the liquid in the liquid-cooled radiator directly dissipates heat for the power semiconductor device and indirectly dissipates heat for the high-voltage film capacitor. The high-voltage film capacitor and the power semiconductor device can be dissipated simultaneously through one liquid-cooled radiator, and the heat dissipation effect is good.

[0004] The embodiments of this specification provide the following technical solutions: an inverter, comprising:

[0005] An integrated drive control board includes a drive unit and a control unit arranged on the same circuit board;

[0006] Onboard current sensor to detect the conversion of DC into three-phase AC;

[0007] An integrated liquid-cooled heat dissipation capacitor, comprising a high-voltage film capacitor and a liquid-cooled radiator, wherein the high-voltage film capacitor is at least partially in contact with the liquid-cooled radiator, and the liquid-cooled radiator is provided with a liquid inlet and a liquid outlet;

[0008] A power semiconductor device, wherein the power semiconductor device is at least partially in contact with the liquid-cooled radiator, the high-voltage film capacitor is connected to the positive and negative electrodes of the upper bridge of the power semiconductor device through the positive transfer copper bus and the negative transfer copper bus respectively, and the lower bridge of the power semiconductor device is connected to the three-phase copper bus.

[0009] Preferably, the liquid-cooled radiator includes a shell, a heat dissipation water-cooled plate, and a sealing ring. The high-voltage film capacitor is at least partially inserted into the shell. The heat dissipation water-cooled plate has a plurality of raised copper needles placed in the water channel position of the shell and sealed by the sealing ring.

[0010] Preferably, the liquid-cooled radiator further comprises an insulating cover, and the insulating cover is arranged between the heat dissipation water-cooled plate and the power semiconductor device.

[0011] Preferably, the liquid-cooled radiator further includes a water temperature sensor, and the water temperature sensor measures the liquid temperature at the liquid inlet and the liquid outlet.

[0012] Preferably, the onboard current sensor is integrated on the support base of the three-phase copper busbar, and the AC copper busbars of the three-phase copper busbar pass through the magnetic steel of the onboard current sensor respectively to complete current signal collection and feed back the current signal to the integrated drive control board.

[0013] Preferably, the integrated drive control board is provided with a through slot for the onboard current sensor to pass through.

[0014] Preferably, the high-voltage film capacitor is formed by welding one or more capacitor cores and a laminated busbar.

[0015] Preferably, the lower connector of the power semiconductor device is connected to the three-phase copper busbar by laser welding.

[0016] A motor controller comprises a filter, a three-phase terminal block and an inverter as described in any one of the above items, wherein the filter is connected to the high-voltage film capacitor, and the three-phase terminal block is connected to the three-phase copper busbar.

[0017] A vehicle comprises the motor controller as described above.

[0018] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of this specification include at least:

[0019] By setting up an integrated liquid-cooled heat dissipation capacitor, the liquid in the liquid-cooled radiator directly dissipates heat for the power semiconductor device and indirectly dissipates heat for the high-voltage film capacitor. The high-voltage film capacitor and the power semiconductor device can be dissipated simultaneously through one liquid-cooled radiator, with good heat dissipation effect. The drive unit and the control unit are integrated on the same circuit board, and there is no need to connect them through cables in the traditional way. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the exploded structure of the inverter provided by the present application;

[0022] Figure 2 It is a schematic diagram of the connection structure of the power semiconductor device of the inverter provided by the present application;

[0023] Figure 3 It is a schematic diagram of a three-phase copper busbar integrated current sensor of an inverter provided by the present application;

[0024] Figure 4 It is a structural schematic diagram of the inverter provided in this application.

[0025] In the figure, 010, shell; 020, positive electrode transfer copper busbar; 030, high-voltage film capacitor; 040, negative electrode transfer copper busbar; 050, integrated drive control board; 060, sealing ring; 070, heat dissipation water cooling plate; 080, insulation cover; 090, power semiconductor device; 100, three-phase copper busbar; 110, on-board current sensor; 101, magnetic core; 102, chip. DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0027] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0028] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0029] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0030] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0031] New energy vehicles need to convert the direct current of the battery into three-phase alternating current that can drive the motor. To ensure the stability of the voltage during the conversion process, high-voltage film capacitors are needed to filter and absorb peak voltages and high pulse currents while reducing inductance. At present, many capacitors on the market use direct or indirect heat dissipation, and the heat dissipation effect is relatively general. In addition, the size of general capacitors is relatively large and does not have the advantage of platformization. It is basically necessary to redesign an inverter structure to meet different customer needs, which greatly increases labor costs and production manufacturing costs.

[0032] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0033] like Figure 1-Figure 4 As shown, an inverter comprises:

[0034] The integrated drive control board 050 includes a drive unit and a control unit arranged on the same circuit board. The drive unit and the control unit are integrated on the same circuit board, and there is no need to connect them through cables in the traditional mode.

[0035] The onboard current sensor 110 is used to detect the conversion of direct current into three-phase alternating current. The onboard current sensor 110 is a device for detecting the conversion of direct current into three-phase alternating current and is integrated in the drive control board, which brings lower cost, smaller space and higher reliability.

[0036] An integrated liquid-cooled heat dissipation capacitor, comprising a high-voltage film capacitor 030 and a liquid-cooled heat sink, wherein the high-voltage film capacitor 030 is at least partially in contact with the liquid-cooled heat sink, and the liquid-cooled heat sink is provided with a liquid inlet and a liquid outlet;

[0037] The power semiconductor device 090 is at least partially in contact with the liquid-cooled radiator, the high-voltage film capacitor 030 is connected to the positive and negative electrodes of the upper bridge of the power semiconductor device 090 through the positive transfer copper bus 020 and the negative transfer copper bus 040 respectively, and the lower bridge of the power semiconductor device 090 is connected to the three-phase copper bus 100.

[0038] By providing an integrated liquid-cooled heat dissipation capacitor, the liquid-cooled radiator directly dissipates heat for the power semiconductor device 090 and indirectly dissipates heat for the high-voltage film capacitor 030 , and the high-voltage film capacitor 030 and the power semiconductor device 090 can be dissipated simultaneously by one liquid-cooled radiator.

[0039] It should be noted that one end of the positive transfer copper bus 020 and the negative transfer copper bus 040 are respectively connected to the positive and negative electrodes of the high-voltage film capacitor 030 by laser welding, and the other end is connected to the positive and negative electrodes of one or more power semiconductor devices 090 by laser welding in the same way. The laser welding connection can minimize the heat generated by the contact resistance and increase reliability.

[0040] It should also be noted that the high-voltage film capacitor 030 can be placed above or below the power semiconductor device 090 or placed side by side, etc. The power semiconductor device 090 can be a three-phase module using direct liquid cooling, or a half-bridge module using direct liquid cooling, or one or more half-bridge modules that indirectly dissipate heat through a water cooling plate.

[0041] like Figure 1 As shown, in some embodiments, the liquid-cooled radiator includes a shell 010, a heat dissipation water-cooled plate 070, and a sealing ring 060. The high-voltage film capacitor 030 is at least partially inserted into the shell 010 and is potted with epoxy resin. The power semiconductor device 090 is placed above the water-cooled plate. The heat dissipation water-cooled plate 070 has a plurality of raised copper needles placed in the water channel position of the shell 010 and is sealed by the sealing ring 060.

[0042] It should be noted that the housing 010 and the heat dissipation water cooling plate 070 are both made of aluminum alloy. Aluminum alloy has good heat conductivity and can dissipate heat for the high-voltage film capacitor 030 and the power semiconductor device 090 at the same time.

[0043] like Figure 1 As shown, in some embodiments, the liquid-cooled radiator also includes an insulating cover 080, and the insulating cover 080 is arranged between the heat dissipation water-cooled plate 070 and the power semiconductor device 090. By setting the insulating cover 080, it is ensured that the heat dissipation water-cooled plate 070 and the power semiconductor device 090 are insulated from each other to avoid circuit failure.

[0044] like Figure 1As shown, in some embodiments, the liquid-cooled radiator also includes a water temperature sensor, which measures the liquid temperature of the liquid at the liquid inlet and the liquid outlet. The water temperature sensor can be directly integrated on the heat dissipation water-cooled plate 070 or the insulating cover 080. The water temperature sensor can be integrated on the heat dissipation water-cooled plate 070 at one end and on the insulating cover 080 at the other end, or integrated on the water-cooled plate or the insulating cover 080 at the same time.

[0045] like Figure 1-Figure 4 As shown, in some embodiments, the on-board current sensor 110 is integrated on the support base of the three-phase copper busbar 100, and the AC copper busbars of the three-phase copper busbar 100 are respectively passed through the magnetic steel of the on-board current sensor 110 to complete the current signal acquisition and feed back the current signal to the integrated drive control board 050 through a set of connectors, and the on-board current sensor 110 is integrated on the support base of the three-phase copper busbar 100. Specifically, the magnetic core 101 and the chip 102 are injection molded into one piece and integrated in the three-phase copper busbar 100, which is fixed by soldering. The three-phase copper busbar 100 passes through the current sampling device and the magnetic ring. The current sampling device monitors the current value flowing through the three-phase copper busbar 100, and the magnetic ring filters the three-phase copper busbar 100 and suppresses noise.

[0046] like Figure 1 and Figure 4 As shown, in some embodiments, a through slot is provided on the integrated drive control board 050 for the onboard current sensor 110 to pass through. By providing a through slot corresponding to the onboard current sensor 110 on the integrated drive control board 050, it is ensured that the onboard current sensor 110 can pass through the through slot and extend above the integrated drive control board 050.

[0047] like Figure 1-Figure 2 As shown, in some embodiments, the high-voltage film capacitor 030 is formed by welding one or more capacitor cores and a laminated busbar. The high-voltage film capacitor 030 is formed by welding one or more capacitor cores and a laminated busbar. The high-voltage film capacitor 030 is not limited to one chamber, but can be one or more capacitor chambers, which can achieve better heat dissipation effect.

[0048] like Figure 1-Figure 3 As shown, in some embodiments, the lower connector of the power semiconductor device 090 is connected to the three-phase copper busbar 100 by laser welding. The connection and transition of the three-phase copper busbar 100 are both connected using laser welding technology, which can greatly reduce the contact resistance of the connection and reduce heat dissipation. Compared with the traditional bolt tightening method, it largely solves the problem of bolt loosening and falling off caused by long-term working operation.

[0049] Based on the same inventive concept, an embodiment of this specification provides a motor controller, including a filter, a three-phase terminal block and an inverter as described in any one of the above items, wherein the filter is connected to the high-voltage film capacitor 030, and the three-phase terminal block is connected to the three-phase copper bus 100.

[0050] During implementation, by adopting the above-mentioned inverter, the volume is reduced by about 30% and the weight is reduced by about 25% compared with the traditional inverter. It has higher reliability, higher power density and lower production cost, and basically realizes the platform design. In the process of motor controller development, there is no need to develop the most core inverter separately. It is only necessary to add a filter in front of the film capacitor and a three-phase terminal block behind the three-phase copper busbar to complete the development of the electronic control. A DC input filter with an adapter interface and a three-phase terminal block for connecting the motor are developed for different interfaces of the motor controller, which greatly reduces the development time and cost of the motor controller. The high-voltage film capacitor and the inverter structure are integrated into one by laser welding technology, which well solves the problems of large electronic control volume, cumbersome development process and poor adaptability in the current market.

[0051] Based on the same inventive concept, an embodiment of the present specification provides a vehicle, including a motor controller as described above. By adopting the above motor controller, the space occupied by the motor controller is greatly reduced, and it is easy to adapt to different vehicles.

[0052] The same or similar parts between the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment described later, since it corresponds to the system, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0053] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An inverter, characterized in that: include: An integrated drive control board includes a drive unit and a control unit arranged on the same circuit board; Onboard current sensor to detect the conversion of DC into three-phase AC; An integrated liquid-cooled heat dissipation capacitor, comprising a high-voltage film capacitor and a liquid-cooled radiator, wherein the high-voltage film capacitor is at least partially in contact with the liquid-cooled radiator, and the liquid-cooled radiator is provided with a liquid inlet and a liquid outlet; A power semiconductor device, wherein the power semiconductor device is at least partially in contact with the liquid-cooled radiator, the high-voltage film capacitor is connected to the positive and negative electrodes of the upper bridge of the power semiconductor device through the positive transfer copper bus and the negative transfer copper bus respectively, and the lower bridge of the power semiconductor device is connected to the three-phase copper bus.

2. The inverter according to claim 1, characterized in that: The liquid-cooled radiator includes a shell, a heat dissipation water-cooling plate, and a sealing ring. The high-voltage film capacitor is at least partially inserted into the shell. The heat dissipation water-cooling plate has a plurality of raised copper needles placed in the water channel position of the shell and sealed by the sealing ring.

3. The inverter according to claim 2, characterized in that: The liquid cooling radiator further comprises an insulating cover, and the insulating cover is arranged between the heat dissipation water cooling plate and the power semiconductor device.

4. The inverter according to claim 3, characterized in that: The liquid-cooled radiator further includes a water temperature sensor, which measures the temperature of the liquid at the liquid inlet and the liquid outlet.

5. The inverter according to claim 1, characterized in that: The onboard current sensor is integrated on the support base of the three-phase copper busbar, and the AC copper busbars of the three-phase copper busbar pass through the magnetic steel of the onboard current sensor respectively to complete the current signal collection and feed back the current signal to the integrated drive control board.

6. The inverter according to claim 5, characterized in that: The integrated drive control board is provided with a through slot for the onboard current sensor to pass through.

7. The inverter according to claim 1, characterized in that: The high-voltage film capacitor is formed by welding one or more capacitor cores and a laminated busbar.

8. The inverter according to claim 1, characterized in that: The lower end of the power semiconductor device is connected to the three-phase copper busbar by laser welding.

9. A motor controller, characterized in that: It comprises a filter, a three-phase terminal block and the inverter according to any one of claims 1 to 8, wherein the filter is connected to the high-voltage film capacitor, and the three-phase terminal block is connected to the three-phase copper busbar.

10. A vehicle, characterized in that: Comprising a motor controller as claimed in claim 9.

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