Clamp for testing microwave performance of BGA (Ball Grid Array) packaging assembly and testing method

Abstract

The invention discloses a clamp and a test method for a BGA packaging assembly microwave performance test, and belongs to the technical field of BGA packaging assembly test.The clamp comprises a mounting base, a test mother board fixed to the upper end face of the mounting base and a limiting plate fixed to the upper end face of the test mother board, the limiting plate is of a square structure, and a containing space is formed in the middle of the limiting plate; a needle plate is arranged in the containing space, guide rods are fixed to the tops of the side walls of the periphery of the limiting plate, a pressure applying mechanism is jointly arranged among the four guide rods, grooves are formed in the inner walls of the periphery of the limiting plate, positioning clamping plates are arranged in the grooves, and movable rods are fixed to one sides of the positioning clamping plates; the BGA packaging assembly can be automatically clamped and fixed during testing, the pressure applying mechanism cannot drive the BGA packaging assembly to move when applying pressure to the BGA packaging assembly, the testing accuracy is guaranteed, BGA packaging assemblies of different sizes can be fixed and tested, and the applicability is high.

Description

Technical Field

[0001] The invention relates to the technical field of BGA package component testing, and in particular to a fixture and a testing method for microwave performance testing of a BGA package component. Background Art

[0002] With the development of microwave components with small size, multi-function and high performance, BGA packages with advantages such as small package size, high integration density, large number of pins, short interconnection path and excellent RF performance are increasingly used. However, for BGA packaged microwave components, BGA solder balls are spherical as signal input and output ports and are arranged in a non-standard array, which cannot be directly interconnected with the standardized RF connector on the test instrument for testing. At present, the commonly used test method for BGA packaged microwave components is to flexibly interconnect the component with the test motherboard through elastic conductors, solder the RF connector on the test motherboard, and connect the connector to the test instrument to realize the transfer input and output of microwave signals in the component, so as to realize the microwave performance test of BGA packaged components.

[0003] At present, during the inspection, the BGA package component is placed on the pin board, and pressure is applied to the BGA package component to make the BGA solder ball contact with the spring pin on the pin board, and the BGA package component, the spring pin and the test motherboard are connected. Then the test instrument and the computer are connected, and the probe pierces the pad of the film-based piercing test board according to the control instruction to perform automated testing. However, the current pressure application method is generally to apply force to the BGA package component in the form of screw pressure. After the pressure head contacts the BGA package component, it needs to continue to move downward to ensure sufficient pressure. At this time, friction will be generated between the pressure head and the surface of the BGA package component. The lateral friction may cause the BGA package component to be displaced, thereby affecting the accuracy of the test. Summary of the invention

[0004] The purpose of the present invention is to provide a fixture and a testing method for microwave performance testing of BGA package components, and to solve the following technical problems: At present, the pressure application method is generally to apply force to the BGA package components in the form of screw pressure, and friction will be generated between the pressure head and the surface of the BGA package components. The lateral friction force may cause the BGA package components to be displaced, thereby affecting the accuracy of the test.

[0005] The purpose of the present invention can be achieved through the following technical solutions: The fixture and test method for microwave performance test of BGA package components include a mounting seat, a test motherboard fixed on the upper end surface of the mounting seat, and a limit plate fixed on the upper end surface of the test motherboard, wherein the limit plate is a "mouth"-shaped structure, a receiving space is formed in the middle of the limit plate, a needle plate is arranged in the receiving space, guide rods are fixed to the tops of the side walls around the limit plate, a pressure mechanism is arranged between the four guide rods, grooves are opened on the inner walls around the limit plate, a positioning clamp is arranged in the groove, a movable rod is fixed to one side of the positioning clamp, and an end of the movable rod away from the positioning clamp extends to the outside of the receiving space; a transmission mechanism is arranged between the guide rod and the movable rod on the same side, and after the pressure mechanism is assembled, the positioning clamp fixes the BGA package component through the transmission mechanism.

[0006] As a further solution of the present invention: a needle piercing test board is symmetrically arranged on the mounting seat, the needle piercing test board is connected to the test mother board through a gold belt, the test mother board and the needle piercing test board form a test channel, and metal partition bars are bonded between adjacent test channels.

[0007] As a further solution of the present invention: the transmission mechanism includes an L-shaped rod fixed on the side wall of the limiting plate, one end of the L-shaped rod is fixed with an L-shaped pipe, one end of the pipe is provided with a piston rod, one end of the piston rod is connected to a force rod, and the other end is connected to a first piston block, the force rod is slidably connected to the guide rod, a fixed ring block is provided in the pipe, a first spring is provided between the fixed ring block and the first piston block, one end of the movable rod extends into the interior of the pipe and is connected to a second piston block, and a second spring is mounted on the movable rod.

[0008] As a further solution of the present invention: the pressure mechanism includes a pressure plate, the pressure plate is provided with four through holes, the four through holes are respectively matched with four guide rods, the pressure plate is provided with a mounting ring, and the mounting ring is internally threadedly connected with a pressure head.

[0009] As a further solution of the present invention: counterweight blocks are arranged at the four corners of the upper surface of the pressure plate.

[0010] As a further solution of the present invention: a circular hole is provided on the pressure plate, the mounting ring is located in the circular hole, two limiting rings are fixed on the outer wall of the mounting ring, and the two limiting rings are located on both sides of the pressure plate, recesses are provided on both sides of the circular hole, magnetic parts are provided in the recesses, and adsorption parts are provided on both sides of the mounting ring.

[0011] A method for testing microwave performance of a BGA package assembly, using a fixture for testing microwave performance of a BGA package assembly as described in any one of the above technical solutions, comprising the following steps: S1. Place the BGA package component to be tested on the pin board. The BGA soldering of the BGA package component corresponds one-to-one with the spring pins in the pin board. The bottom of the spring pin corresponds one-to-one with the metal pad on the test motherboard. S2, assembling the pressure mechanism onto the guide rod, the pressure mechanism automatically descends under the action of gravity, and the four positioning clamps are moved synchronously through the transmission mechanism to fix the BGA package assembly; S3, applying force to the BGA package component in the form of screw pressure by rotating the pressure applying head, so that the BGA package component, the spring pin and the test motherboard are connected; S4. Connect the test instrument and the computer, and the probe pierces the pad of the piercing test board according to the control instruction to perform automatic testing and record the test data.

[0012] Beneficial effects of the present invention: (1) The present invention is provided with structures such as guide rods, movable rods, positioning clamps, and transmission mechanisms. During testing, after the pressure mechanism is assembled, the four positioning clamps can automatically clamp and fix the BGA package assembly. Then, the pressure mechanism is used to apply force to the BGA package assembly for testing. Since the BGA package assembly is fixed at this time, the pressure mechanism cannot cause it to move when applying pressure to it, thereby ensuring the accuracy of the test; (2) The present invention provides a transmission mechanism. When the force-bearing rod of the transmission mechanism is automatically lowered after receiving the pressure from the pressure-applying mechanism, the movable rod is pushed to move by air pressure, thereby moving the positioning clamp. The positioning clamp automatically stops moving after contacting the BGA package component, thereby avoiding excessive clamping force on the BGA package component. The present invention is suitable for BGA package components of different sizes. (3) The present invention provides a mounting ring, a pressure plate, a magnetic part, an adsorbing part and other structures to avoid excessive pressure on the BGA package component during screw pressing. When the pressure head is rotated to make it descend and contact the BGA package component, if it continues to rotate, the adsorbing part and the magnetic part will be separated. At this time, the mounting ring can rotate freely, and continued rotation of the pressure head will not cause excessive pressure on the BGA package component. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention after the pressure-applying component is hidden; Figure 3 It is a structural schematic diagram of the limiting plate of the present invention; Figure 4 It is a schematic diagram of the internal structure of the pipeline of the present invention; Figure 5It is a structural schematic diagram of the pressure-applying assembly of the present invention; Figure 6 It is a schematic diagram of the structure of the pressure plate and the mounting ring of the present invention in a disassembled state; Figure 7 It is a structural schematic diagram of the mounting ring of the present invention.

[0015] In the figure: 1. mounting base; 2. test motherboard; 3. limit plate; 4. pressure mechanism; 401. pressure plate; 402. through hole; 403. counterweight; 404. mounting ring; 405. pressure head; 406. limit ring; 407. magnetic part; 408. adsorption part; 5. guide rod; 6. transmission mechanism; 601. L-shaped rod; 602. pipeline; 603. force rod; 604. piston rod; 605. first piston block; 606. fixing ring block; 607. first spring; 608. second piston block; 609. second spring; 7. movable rod; 8. positioning splint.

[0016] The drawings are only used for illustrative purposes and should not be construed as limitations on this patent. In order to better illustrate this embodiment, some parts of the drawings may be omitted, enlarged, or reduced, and do not represent the size and shape of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1-Figure 3As shown, the present invention is a fixture for microwave performance testing of BGA package components, comprising a mounting seat 1, a test motherboard 2 fixed on the upper end surface of the mounting seat 1, and a limiting plate 3 fixed on the upper end surface of the test motherboard 2. The limiting plate 3 is a "mouth"-shaped structure, and a accommodating space is formed in the middle of the limiting plate 3. A needle plate is arranged in the accommodating space. Guide rods 5 are fixed to the tops of the side walls around the limiting plate 3. A pressure mechanism 4 is arranged between the four guide rods 5. Grooves are provided on the inner walls around the limiting plate 3, and a positioning clamping plate 8 is arranged in the groove. A movable rod 7 is fixed to one side of the positioning clamping plate 8, and one end of the movable rod 7 away from the positioning clamping plate 8 extends to the outside of the accommodating space; a transmission mechanism 6 is arranged between the guide rod 5 and the movable rod 7 on the same side. After the pressure mechanism 4 is assembled, the positioning clamping plate 8 fixes the BGA package component through the transmission mechanism 6. A needle test board is symmetrically arranged on the mounting seat 1, and the needle test board is connected to the test motherboard 2 by a gold belt. , the test motherboard 2 and the needle test board form a test channel, and metal ribs are bonded between adjacent test channels; the BGA package component to be tested is placed on the needle board, the BGA welding of the BGA package component corresponds one-to-one with the spring pins in the needle board, and the bottom of the spring pin corresponds one-to-one with the metal pads on the test motherboard. After assembling the pressure mechanism 4, the four positioning clamps 8 can automatically clamp and fix the BGA package component, and then the pressure mechanism 4 is used to apply a force to the BGA package component to make the BGA package component, the spring pins and the test motherboard 2 conductive. Since the BGA package component is fixed at this time, the pressure mechanism 4 cannot drive it to move when applying pressure to it, thereby ensuring the accuracy of the test. The test instrument and the computer are connected, and the probe is inserted into the pad of the needle test board according to the control instruction to perform automated testing. It is worth mentioning that the structures such as the needle board, the needle test board and the test instrument are all existing technologies, and their specific structures are not described here.

[0019] See also Figure 3-Figure 4 The transmission mechanism 6 includes an L-shaped rod 601 fixed on the side wall of the limit plate 3, an L-shaped pipe 602 is fixed to one end of the L-shaped rod 601, a piston rod 604 is arranged at one end of the pipe 602, one end of the piston rod 604 is connected to a force rod 603, and the other end is connected to a first piston block 605, the force rod 603 is slidably connected to the guide rod 5, a fixed ring block 606 is arranged in the pipe 602, a first spring 607 is arranged between the fixed ring block 606 and the first piston block 605, and one end of the movable rod 7 A second piston block 608 is connected to the inside of the pipe 602, and a second spring 609 is mounted on the movable rod 7. After the pressure mechanism 4 is assembled, the four force-bearing rods 603 move downward under the influence of the gravity of the pressure mechanism 4, driving the piston rod 604 and the first piston block 605 to move downward, squeezing the first spring 607 and the air in the pipe 602. Under the action of air pressure, the second piston block 608 is pushed, causing the movable rod 7 to move, thereby pushing the positioning clamp 8 to move and fixing the BGA package assembly on the needle plate.

[0020] See also Figure 1 , Figure 5-Figure 7 The pressure mechanism 4 includes a pressure plate 401, and four through holes 402 are provided on the pressure plate 401. The four through holes 402 are respectively matched with the four guide rods 5. A mounting ring 404 is provided on the pressure plate 401, and a pressure head 405 is connected to the inner thread of the mounting ring 404. Counterweight blocks 403 are provided at the four corners of the upper surface of the pressure plate 401. A circular hole is provided on the pressure plate 401, and the mounting ring 404 is located in the circular hole. Two limiting rings 406 are fixed on the outer wall of the mounting ring 404, and the two limiting rings 406 are located on both sides of the pressure plate 401. Notches are provided on both sides of the circular hole, and magnetic parts 407 are provided in the notches. Adsorption parts 408 are provided on both sides of the mounting ring 404. When the BGA package component is fixed, the pressure plate 401 stops moving, and the pressure head 405 is rotated to lower it. After it is lowered, it contacts with the BGA package component. The BGA package component, the spring needle and the test motherboard are connected. Due to the different proficiency of different staff members, the pressure cannot be controlled. If the pressure of the pressure head 405 is too large, the BGA package component will be crushed. By setting the magnetic part 407 and the adsorption part 408, when the BGA solder ball contacts the upper surface of the needle plate, if the pressure head 405 continues to be rotated at this time, the pressure head 405 cannot continue to descend, and under the action of the rotational force, the magnetic part 407 and the adsorption part 408 will separate. At this time, the rotating pressure head 405 will drive the mounting ring 404 to rotate, and the pressure head 405 will not continue to descend, thereby avoiding the phenomenon that the BGA package component is crushed by the pressure head 405. It should be noted that the magnetic part 407 is a magnet and the adsorption part 408 is made of iron sheet.

[0021] A method for testing microwave performance of a BGA package assembly, using a fixture for testing microwave performance of a BGA package assembly as described in any one of the above technical solutions, comprising the following steps: S1, placing the BGA package component to be tested on the pin board, the BGA soldering of the BGA package component corresponds one-to-one with the spring pins in the pin board, and the bottom of the spring pin corresponds one-to-one with the metal pad on the test motherboard 2; S2, assembling the pressure mechanism 4 onto the guide rod 5, the pressure mechanism 4 automatically descends under the action of gravity, and the four positioning clamps 8 are moved synchronously through the transmission mechanism 6 to fix the BGA package assembly; S3, applying force to the BGA package component in the form of screw pressure by rotating the pressure applying head 405, so that the BGA package component, the spring pin and the test motherboard 2 are connected; S4. Connect the test instrument and the computer, and the probe pierces the pad of the piercing test board according to the control instruction to perform automatic testing and record the test data.

[0022] The working principle of the present invention is as follows: a BGA package component to be tested is placed on a pin board, the BGA welding of the BGA package component corresponds one-to-one with the spring pin in the pin board, the bottom of the spring pin corresponds one-to-one with the metal pad on the test mother board, a pressure mechanism 4 is assembled, four through holes 402 on the pressure plate 401 are aligned with four guide rods 5, and then the pressure plate 401 is lowered. Under the influence of gravity, the four force rods 603 move downward, driving the piston rod 604 and the first piston block 605 to move downward, squeezing the first spring 607 and the air in the pipe 602. Under the action of air pressure, the second piston block 608 is pushed, so that the movable rod 7 moves, thereby pushing the positioning clamp 8 to move, and the four positioning clamps 8 can automatically clamp and fix the BGA package component; Then, the pressure head 405 is rotated again to make it drop and contact with the BGA package component. The BGA package component, the spring needle and the test motherboard are connected. Since the BGA package component is fixed at this time, the pressure head 405 cannot drive it to move when applying pressure to it, thereby ensuring the accuracy of the test. When the BGA solder ball contacts the upper surface of the needle board, if the pressure head 405 is continued to be rotated, the pressure head 405 cannot continue to drop, and under the action of the rotational force, the magnetic part 407 and the adsorption part 408 will separate. At this time, the rotating pressure head 405 will drive the mounting ring 404 to rotate, and the pressure head 405 will not continue to drop, thereby avoiding the phenomenon that the BGA package component is crushed by the pressure head 405. Finally, the test instrument and the computer are connected, and the probe pierces the pad of the piercing test board according to the control instruction to perform automatic testing. After the test is completed, the pressure mechanism 4 is directly removed, the positioning clamp 8 automatically resets and detaches from the BGA package component, and then the tested BGA package component is removed for subsequent testing.

[0023] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A fixture for microwave performance testing of a BGA package component, comprising a mounting seat (1), a test motherboard (2) fixed to the upper end surface of the mounting seat (1), and a limit plate (3) fixed to the upper end surface of the test motherboard (2), characterized in that: The limiting plate (3) is a "mouth"-shaped structure, with a receiving space formed in the middle of the limiting plate (3), a needle plate being arranged in the receiving space, guide rods (5) being fixed to the tops of the four side walls of the limiting plate (3), a pressure mechanism (4) being arranged between the four guide rods (5), grooves being arranged on the four inner walls of the limiting plate (3), a positioning clamping plate (8) being arranged in the groove, a movable rod (7) being fixed to one side of the positioning clamping plate (8), and an end of the movable rod (7) away from the positioning clamping plate (8) extending to the outside of the receiving space; A transmission mechanism (6) is provided between the guide rod (5) and the movable rod (7) located on the same side. After the pressure mechanism (4) is assembled, the positioning clamp (8) fixes the BGA package assembly through the transmission mechanism (6).

2. The fixture for microwave performance testing of BGA package components according to claim 1, characterized in that: The mounting seat (1) is symmetrically provided with a needle piercing test board, the needle piercing test board is connected to the test mother board (2) via a gold belt, the test mother board (2) and the needle piercing test board form a test channel, and metal partition bars are bonded between adjacent test channels.

3. The fixture for microwave performance testing of BGA package components according to claim 1, characterized in that: The transmission mechanism (6) comprises an L-shaped rod (601) fixed on the side wall of the limit plate (3); an L-shaped pipe (602) is fixed to one end of the L-shaped rod (601); a piston rod (604) is arranged at one end of the pipe (602); one end of the piston rod (604) is connected to a force-bearing rod (603) and the other end is connected to a first piston block (605); the force-bearing rod (603) is slidably connected to the guide rod (5); a fixed ring block (606) is arranged in the pipe (602); a first spring (607) is arranged between the fixed ring block (606) and the first piston block (605); one end of the movable rod (7) extends into the pipe (602) and is connected to a second piston block (608); and a second spring (609) is sleeved on the movable rod (7).

4. The fixture for microwave performance testing of BGA package components according to claim 3, characterized in that: The pressure mechanism (4) comprises a pressure plate (401), the pressure plate (401) is provided with four through holes (402), the four through holes (402) are respectively matched with four guide rods (5), the pressure plate (401) is provided with a mounting ring (404), and the mounting ring (404) is internally threadedly connected with a pressure head (405).

5. The fixture for microwave performance testing of BGA package components according to claim 4, characterized in that: Counterweight blocks (403) are provided at the four corners of the upper surface of the pressure plate (401).

6. The fixture for microwave performance testing of BGA package components according to claim 4, characterized in that: A circular hole is provided on the pressure plate (401), the mounting ring (404) is located in the circular hole, two limiting rings (406) are fixed on the outer wall of the mounting ring (404), and the two limiting rings (406) are located on both sides of the pressure plate (401), recesses are provided on both sides of the circular hole, magnetic parts (407) are provided in the recesses, and adsorption parts (408) are provided on both sides of the mounting ring (404).

7. A method for testing microwave performance of a BGA package assembly, using the fixture for testing microwave performance of a BGA package assembly as described in any one of claims 1 to 6, characterized in that: The following steps are involved: S1, placing the BGA package component to be tested on the pin board, the BGA soldering of the BGA package component corresponds one-to-one with the spring pins in the pin board, and the bottom of the spring pin corresponds one-to-one with the metal pad on the test motherboard (2); S2, assembling the pressure mechanism (4) onto the guide rod (5), so that the pressure mechanism (4) automatically descends under the action of gravity, and the four positioning clamps (8) are moved synchronously through the transmission mechanism (6) to fix the BGA package component; S3, applying force to the BGA package component in the form of screw pressure by rotating the pressure applying head (405), so that the BGA package component, the spring pins and the test motherboard (2) are connected; S4. Connect the test instrument and the computer, and the probe pierces the pad of the piercing test board according to the control instruction to perform automatic testing and record the test data.

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