Photovoltaic silicon wafer drying device of photovoltaic battery piece
By using segmented columns and connecting rods to adjust the silicon wafer space in the photovoltaic silicon wafer drying device, combined with the arc-shaped design of ultrasonic cleaning and spraying units, the problems of silicon wafer scratches and particle impurities during traditional cleaning and drying are solved, and the problem of silicon wafer scratches and particles is realized. Efficient regional cleaning and drying, improving the finished product quality of the battery cells.
Patent Information
- Application Number
- CN202411218083.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2044-09-02
AI Technical Summary
During the cleaning and drying of traditional photovoltaic silicon wafers, there are problems with spatial invariance and high-pressure spraying on the surface of the silicon wafer, and it is difficult to effectively remove granular impurities during the cleaning and drying process, which affects the finished product quality of the battery.
A photovoltaic silicon wafer drying device for photovoltaic cell cells is designed, using segmented columns and connecting rods to adjust the vertical space of the silicon wafer. Through the fluidity of ultrasonic cleaning liquid and the arc-shaped design of the spray unit, combined with IPA spraying Dry with hot air to achieve regional cleaning and drying, avoiding impurities sputtering and scratches.
It improves the cleaning effect and neatness of the silicon wafer surface, reduces the probability of scratching of the silicon wafer, enhances the fluidity of the cleaning liquid and the cleanliness of the spray equipment, and improves the finished product quality and production efficiency of photovoltaic cells.
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Figure CN119297108A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of silicon wafer processing, and in particular relates to a photovoltaic silicon wafer drying device for a photovoltaic cell. Background Art
[0002] Silicon wafer cleaning: an important step in the production of photovoltaic cells. Even trace contamination can cause device failure.
[0003] Purpose of cleaning: to remove surface contamination impurities, including organic and inorganic substances, and some of the above impurities exist in atomic or ionic state, and some exist in the form of thin film or particles on the surface of silicon wafers;
[0004] Organic pollution includes: photoresist, organic solvent residues and synthetic wax, or grease or fibers brought by human contact with devices, tools and utensils; inorganic pollution includes: heavy metals such as gold, copper, iron and chromium, which seriously affect the minority carrier lifetime and surface conductivity; particle pollution includes: silicon slag, dust, bacteria, microorganisms and organic colloidal fibers, etc. There are two methods to remove pollution: physical cleaning and chemical cleaning;
[0005] Purpose of drying: Evaporate residual water stains on the surface of silicon wafers to reduce the irreversible effects of moisture on subsequent photolithography, boron diffusion, alkali polishing, positive etching and thin film coating, and increase production costs; Drying methods: rotary drying, evaporative drying, IPA drying, etc.
[0006] However, there are several problems when cleaning and drying photovoltaic silicon wafers:
[0007] 1. For photovoltaic silicon wafers, the traditional physical cleaning method is usually to place a certain amount of silicon wafers into a basket, and then move the basket to the ultrasonic cleaning machine for cleaning through a suspension device, that is, to use the cavitation effect generated by ultrasonic waves in the process of liquid vibration to rapidly expand or contract the liquid around the silicon wafer, so as to peel off the organic or inorganic impurities attached to the surface of the silicon wafer, thereby achieving the effect of cleaning the surface of the silicon wafer; however, the above method has the problem of spatial invariance between adjacent positions of the silicon wafers to be cleaned in the basket. The fixed property of the reserved space between adjacent silicon wafers in the basket limits the disorder of liquid flow and the cavitation effect of ultrasonic waves to a certain extent, thereby reducing the cleaning effect of ultrasonic waves on impurities on the surface of silicon wafers;
[0008] In addition, before the silicon wafers in the basket leave the ultrasonic cleaning machine, they usually pass through a spray device to rinse the basket and the silicon wafers as a whole, further reducing the residual rate of impurities on the surface of the silicon wafers; however, due to the limitation of the space between the silicon wafers in the basket, there is a possibility that during the high-pressure spraying process, the impurity particles on the surface of the silicon wafers may scratch the surface of the silicon wafers in the adjacent baskets during the sputtering process, thereby destroying the integrity and usability of the silicon wafers;
[0009] 2. The traditional rotary drying method usually uses a rotating bracket to fix the silicon wafers one by one in the corresponding position. After that, the water stains on the surface of the silicon wafer are removed and dried by using the spinning force generated by the rotation. However, there may still be certain granular impurities on the surface of the silicon wafer after cleaning. Therefore, during the rotation process, the granular impurities on the end face of the silicon wafer may scratch the surface of the adjacent silicon wafer during the sputtering process. At the same time, the residual impurities may further affect the forming of the finished photovoltaic cell under the effect of drying and curing. Summary of the invention
[0010] The purpose of the present invention is to propose a photovoltaic silicon wafer drying device for photovoltaic cells, so as to realize regional cleaning and drying treatment of multiple photovoltaic silicon wafers, thereby avoiding the problem of silicon wafer surface scratches caused by sputtering of solid particles in the traditional integrated cleaning and drying process.
[0011] In order to achieve the above-mentioned object, the present invention adopts the following technical scheme: a photovoltaic silicon wafer drying device for photovoltaic cells, comprising a chassis, the chassis is a rectangular skeleton structure, a control unit is arranged on one side of the top of the chassis, an adjustment unit is arranged on the side of the control unit close to the center line of the chassis, a washing unit is arranged on the side of the adjustment unit away from the control unit, spray units are arranged on both sides of the washing unit, and a drying unit is arranged on one side of the inside of the chassis;
[0012] The drying unit comprises:
[0013] The corner pad has an L-shaped cross section and is detachably mounted on one side of the top end face of the chassis by means of bolts;
[0014] The straight board has an L-shaped cross section and is installed at one end of the vertical section of the corner pad through a mounting bracket;
[0015] The water distribution trough is opened in the middle of the horizontal section of the straight board;
[0016] There is at least one bottom plate, which is installed in a sliding and snap-fitting manner at the middle position of the end surface of the straight plate near the corner pad, and is arranged opposite to the water distribution trough;
[0017] The sheet plate is installed on the end surface of the horizontal section of the straight plate close to the corner pad in a sliding and snap-fitting manner, and corresponds to the bottom plate one by one;
[0018] The vertical plate is mounted on the bottom plate at one end close to the center line of the vertical plate;
[0019] The vertical plate is mounted on the sheet plate at one end close to the vertical plate;
[0020] The chain plates are respectively mounted on the middle position of the end faces of the bottom plate and the sheet plate away from the corner pad, and the chain plates are mounted in a sliding and clamping manner with the horizontal section of the straight plate;
[0021] The screw is rotatably mounted on the end face of the straight plate away from the corner pad through an ear seat and is located on one side of the water diversion trough; the screw is threadedly mounted with the chain plate, and the threaded mounting directions of the chain plate and the screw at the corresponding positions of the bottom plate and the sheet plate are opposite.
[0022] Preferably, a micro motor is mounted on the end face of the vertical plate close to the midline of the base plate through a mounting plate, a vertical rod rotatably mounted on the output end of the micro motor is mounted on the vertical plate in a snap-fitting manner, an air plug is rotatably mounted on the middle position of the end of the vertical plate away from the base plate, gears meshing with each other are fixedly mounted on the outer wall of the air plug close to the end of the micro motor, a star-locking ring coaxially distributed with the air plug is mounted on the end face of the vertical plate away from the micro motor, an intake valve pipe is rotatably mounted on the axial position of the end of the air plug away from the star-locking ring in a plug-in manner, an air guide pipe is mounted on the air inlet end of the air guide pipe, a horizontal air pump fixedly connected to the base plate is mounted on the air inlet end of the air guide pipe, and a bracket mounted on the outer wall of the air plug close to the end of the air inlet valve pipe is mounted on the bracket coaxially mounted on the vertical plate.
[0023] Preferably, a mosaic plate is slidably installed in the middle position of the end face of one side of the vertical plate away from the vertical plate, and an angle shovel is fixedly installed with the sliding snap-fit installation with the vertical plate at one end of the mosaic plate away from the center line of the sheet plate through a transfer shaft. An L single plate is symmetrically installed and snap-fitted with the end face of one side of the vertical plate close to the vertical plate, and the vertical sections of the L single plate on one side are snap-fitted with jet nozzles in an array, and there are at least one jet nozzle, and the liquid outlet end of the jet nozzle faces the angle shovel, and the vertical sections of the L single plate on the other side are snap-fitted with pillars in an array, and there are three pillars, and the three pillars are jointly plugged and installed with side guard plates snap-fitted with the vertical plate at one end away from the jet nozzle, and the three pillars are jointly snap-fitted with a wedge plate at one end close to the jet nozzle, and the wedge plate faces the angle shovel, an air blowing plate is snap-fitted with one end of the wedge plate away from the end face of the vertical plate, and a heat conducting plate is snap-fitted with the other end of the wedge plate away from the end face of the vertical plate.
[0024] Preferably, the vertical end surfaces of the chassis are rotatably fitted with cabinet doors to separate the interior of the chassis from the external interactive space, a processing chamber is arranged on the top of the chassis, a partition plate is plugged in and installed inside the processing chamber, and the control unit, adjustment unit, washing unit and drying unit are respectively located in the processing chamber area on both sides of the partition plate, casters are detachably installed at the four corners of the bottom of the chassis, an integrated electric box is arranged at one end of the chassis, a water tank is arranged at the other end of the chassis to be snap-fitted to the outer wall of the processing chamber, and a water pump matching the water tank is arranged inside the chassis.
[0025] Preferably, the control unit comprises:
[0026] The cross beam is mounted on the top end surface of the chassis by sliding and snap-fitting;
[0027] There are two electric telescopic rods, which are symmetrically mounted on the horizontal section of the cross beam close to the end surface of the chassis;
[0028] Steel lining plate, the quantity is one, and is clamped and installed on one end of the electric telescopic rod close to the chassis;
[0029] The stepper motor is installed at the middle position of the end surface of the steel liner away from the chassis through the mounting plate, and the output shaft of the stepper motor passes through the steel liner;
[0030] The middle bearing plate is fixedly installed on the output shaft end of the stepper motor and is rotatably mounted with the steel liner;
[0031] The notch frame is detachably mounted on the end surface of the middle support plate away from the electric telescopic rod by means of bolts;
[0032] The end rod is one in number and is rotationally mounted between the vertical sections of the notched frame;
[0033] There is at least one segmented column, which is evenly fixed on the outer wall of the end rod in an array;
[0034] The connecting rod can be slidably connected and installed on the outer wall of the segmented column.
[0035] Preferably, the adjustment unit comprises:
[0036] A splitter and assembler seat, which is snap-fitted and installed at one end of the connecting rod away from the segmented column;
[0037] The mouth frames are two in a group and are symmetrically clamped and installed on the end surface of the separation and combination seat away from the segmented column;
[0038] A bidirectional lead screw is rotatably mounted at one end of two brackets;
[0039] The guide rod is rotatably mounted on the other end of the two opening frames;
[0040] The clamping plates are arranged in groups of two and are symmetrically arranged between the clamping frames of a group, and the clamping plates are installed in cooperation with the two-way lead screw thread and the guide rod slidingly and clampingly;
[0041] The screw cap is fixedly installed at one end of the bidirectional screw.
[0042] Preferably, the washing unit comprises:
[0043] A suspension rod, two in a group, is installed in a sliding snap-fit manner at one end of each of the split-and-joint seats away from the connecting rod, and the suspension rod is installed in a through-type snap-fit manner with the joint plate at the corresponding position;
[0044] The angle plates are two in a group and are symmetrically clamped and installed on the outer wall of the end of the suspension rod away from the separation and combination seat;
[0045] The strip board is installed by snap-fitting at the end of the suspension rod away from the separation and combination seat, and is installed by snap-fitting with the angle board;
[0046] The long end clips are installed at both ends of the strips in a plug-in manner, and four are in a group, symmetrically distributed in pairs;
[0047] The retaining plates, two in a group, are symmetrically arranged on the side of each strip away from the angle plate, and are installed by snapping and fitting with the buckles at the long ends;
[0048] The axial column is mounted on the end surface of the retaining plate on one side close to the center line of the separation seat by snap-fitting, and the distribution track is an arc;
[0049] The engaging groove is arranged on the end surface of the other side of the retaining plate close to the center line of the separation and combination seat, and corresponds one to one between the axial columns.
[0050] Preferably, the spray unit comprises:
[0051] There are two side plates, one of which is fixedly installed at the middle position of the inner wall of one side of the processing chamber, and the other is fixedly installed at the middle position of the end surface of one side of the partition plate, and the two side plates are arranged opposite to each other;
[0052] The spray valves are sequentially mounted on the end surface of the side plate near the middle of the treatment chamber;
[0053] The blowing port is evenly arranged at one end of the blowing valve away from the side plate and has an arc shape;
[0054] The spoiler is snap-fitted and installed on the top of one side of the side plate of the injection valve element.
[0055] Preferably, the vertical distance between the upright plate and the vertical plate is greater than the vertical distance between the two retaining plates that are oppositely distributed, and the reserved vertical distance between the two retaining plates on the same side is less than the width of the water diversion trough.
[0056] Preferably, a spiral groove is provided on the outer wall of the segmented column, and the spiral groove is installed with the connecting rod by sliding card fitting. In addition, the pitch of the spiral groove provided on the outer wall of the segmented column at different positions increases or decreases linearly, and the spiral groove on the outer wall of the segmented column at one end has an opposite rotation direction to that of the segmented columns at other positions. The cross-sectional shape of the end of the angle shovel away from the mosaic plate is an isosceles right trapezoid, and one end of the angle shovel is wedge-shaped.
[0057] A photovoltaic cell cleaning and drying integrated method is provided, wherein the photovoltaic silicon wafer drying device of the photovoltaic cell is used for testing, and the specific steps are as follows:
[0058] S1: First, the electric telescopic rod drives the steel liner to move toward the bottom wall of the treatment chamber until the top of the guard plate is completely immersed in the cleaning liquid inside the treatment chamber. After that, the end rod is rotated to cause the segmented column and the connecting rod to move relative to each other until the separation and combination seat drives the suspension rod to move to different positions;
[0059] S2: Then, the protective plate is driven by the electric telescopic rod to move away from the bottom wall of the processing chamber. During this process, the protective plate and the spray valve move relative to each other, and the protective plate and the end face of the silicon wafer are further sprayed through the spray port of the spray valve.
[0060] S2: Finally, the silicon wafer is positioned by adsorption through the air plug, and the air plug is driven to rotate by the gear. At the same time, the angle shovel is driven to perform a lifting and delivering motion through the interlocking plate. At this time, the silicon wafer in the rotating state continuously undergoes a relative scraping motion with the angle shovel. In addition, the IPA solution for accelerating drying, cooling and cleaning is sprayed on the angle shovel and the silicon wafer processing area through the jet nozzle to fully ensure the cleanliness of the silicon wafer end face. The hot air is combined with the heat conduction plate to achieve rapid drying of the silicon wafer end face.
[0061] The present invention has the following beneficial effects:
[0062] 1. The present invention controls the separation and combination seats at different positions to slide with a linear increase or decrease in moving distance per unit time under the guidance of the notch frame through the cooperation between the segmented columns and the connecting rods, so as to adjust the reserved vertical space of the silicon wafers to be cleaned between adjacent holding plates, increase the maneuverability of the silicon wafers to be cleaned in the cleaning liquid, improve the fluidity and disorder of the interaction between the silicon wafers to be cleaned and the cleaning liquid, and at the same time, to a certain extent, strengthen the impact force of the bubble expansion or contraction generated by the ultrasonic cavitation effect on the surface of the silicon wafer to be cleaned, thereby improving the cleaning effect of the silicon wafer to be cleaned.
[0063] 2. The present invention controls the vertical distance between adjacent silicon wafers to be cleaned by rotating the end rod, thereby reducing the probability of impurities on the silicon wafer surface sputtering to the adjacent silicon wafer end faces to a certain extent, thereby reducing the probability of scratches on the adjacent silicon wafer end faces, helping to improve the integrity and usability of the silicon wafers, while reducing production costs. At the same time, it can improve the contact between the guard plates, suspension rods, strips and axial columns and the spray equipment, helping to improve the cleanliness of the spray equipment body, thereby indirectly improving the neatness of the silicon wafers after cleaning.
[0064] 3. The present invention fully ensures the positive unity and stability between the fluid and the washing unit through the inclined spray valve and the arc-shaped spray port. At the same time, it is supplemented by a spoiler to improve the spray integrity of the spray valve to the washing unit components, reduce the sputtering area, and ensure the cleanliness of the silicon wafer surface.
[0065] 4. The present invention controls the air plug to adsorb and position the silicon wafer in real time through the suction and ventilation of the horizontal air pump. After that, the angle shovel is controlled to perform the feeding motion through the interlocking plate. In this process, the air plug drives the silicon wafer to rotate under the control of the gear. At this time, the angle shovel performing the feeding motion moves relative to the rotating silicon wafer, thereby realizing the progressive scraping process of the impurities on the end face of the silicon wafer by the angle shovel. On the one hand, it helps to improve the cleanliness of the end face of the silicon wafer; on the other hand, the progressive motion can enhance the scraping ability of the angle shovel on the impurities on the end face of the silicon wafer, while reducing the probability of the angle shovel breaking and the end face of the silicon wafer cracking.
[0066] 5. The present invention dries silicon wafers through regional management, that is, vertical plates and vertical plates are used to separate the interaction space between the corner shovel, the silicon wafer and the outside world, so as to avoid the influence of granular impurities sputtering on the end faces of adjacent silicon wafers during the scraping of the corner shovel and the rotation of the silicon wafer. At the same time, the silicon wafers are efficiently dried by the IPA spraying method combined with the hot air drying method, that is, the IPA vapor is blown toward the periphery of the silicon wafer through the blowing plate, so that the silicon wafer generates Marangoni force and realizes spin drying. BRIEF DESCRIPTION OF THE DRAWINGS
[0067] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0068] Figure 2 The present invention is attached Figure 1 A top view of the structure in the middle;
[0069] Figure 3 The present invention is attached Figure 1 Front view of the middle structure (some cabinet doors omitted);
[0070] Figure 4 It is a three-dimensional display diagram of the partial structure of the control unit, the adjustment unit and the washing unit of the present invention;
[0071] Figure 5 The present invention is attached Figure 4 Left view of the middle structure;
[0072] Figure 6 It is a three-dimensional structure display diagram of the regulating unit and the washing unit of the present invention;
[0073] Figure 7 The present invention is attached Figure 6 A schematic diagram showing the enlarged local structure at point A in the middle;
[0074] Figure 8 This is a three-dimensional structure diagram of the spray unit of the present invention;
[0075] Fig. 9 This is a three-dimensional structure diagram of the drying unit of the present invention;
[0076] Fig.10 It is a three-dimensional display diagram of the local structure of the drying unit of the present invention;
[0077] Fig.11 The present invention is attached Fig.10 Front view of the middle structure (screw and chain plate added);
[0078] Fig.12 It is a three-dimensional display diagram of another part of the structure of the drying unit of the present invention;
[0079] Fig.13 The present invention is attached Fig.12 Another perspective showing the structure.
[0080] Numbers in the figure: 1, chassis; 2, control unit; 3, adjustment unit; 4, washing unit; 5, spray unit; 6, drying unit;
[0081] 11. Cabinet door; 12. Processing chamber; 13. Partition plate; 14. Casters; 15. Integrated electrical box; 16. Water tank; 17. Water pump;
[0082] 21. Transverse beam; 22. Electric telescopic rod; 23. Steel lining plate; 24. Stepper motor; 25. Middle bearing plate; 26. Notched frame; 27. End rod; 28. Sectional column; 29. Connecting rod;
[0083] 31. Splitting and closing seat; 32. Mouth frame; 33. Bidirectional lead screw; 34. Guide rod; 35. Closing plate; 36. Screw cap;
[0084] 41. Suspension rod; 42. Angle plate; 43. Strip plate; 44. Long end buckle; 45. Guard plate; 46. Axis column; 47. Joint groove;
[0085] 51. side plate; 52. injection valve; 53. injection port; 54. spoiler;
[0086] 61. Angle pad; 62. Straight plate; 63. Water distribution trough; 64. Bottom plate; 65. Sheet plate; 66. Vertical plate; 67. Vertical plate; 68. Chain plate; 69. Screw;
[0087] 641, micro motor; 642, vertical rod; 643, air plug; 644, gear; 645, star lock ring; 646, air inlet valve pipe; 647, air guide pipe; 648, horizontal air pump; 649, bracket;
[0088] 661. interlocking plate; 662. angle shovel; 663. L single plate; 664. jet nozzle; 665. pillar; 666. side guard plate; 667. oblique plate; 668. blowing plate; 669. heat conduction plate. DETAILED DESCRIPTION
[0089] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0090] It should be noted that the terms “vertical”, “horizontal”, “left”, “right” and similar expressions used in this document are only for the purpose of explanation and do not represent the only implementation method.
[0091] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.
[0092] Reference Figure 1 , Figure 2 , Figure 4 and Figure 7 It can be seen that a photovoltaic silicon wafer drying device for photovoltaic cells includes a chassis 1, the chassis 1 is a rectangular skeleton structure, a control unit 2 is arranged on one side of the top of the chassis 1, an adjustment unit 3 is arranged on the side of the control unit 2 close to the center line of the chassis 1, a washing unit 4 is arranged on the side of the adjustment unit 3 away from the control unit 2, spray units 5 are arranged on both sides of the washing unit 4, and a drying unit 6 is arranged on one side of the inside of the chassis 1;
[0093] Reference Figure 1 , Figure 2 and Figure 3 It can be seen that the vertical end surfaces of the chassis 1 are rotatably mounted with cabinet doors 11 to separate the internal space of the chassis 1 from the external space. A processing chamber 12 is arranged on the top of the chassis 1, and a partition plate 13 is installed inside the processing chamber 12. The control unit 2, the adjustment unit 3, the washing unit 4 and the drying unit 6 are respectively located in the processing chamber 12 area on both sides of the partition plate 13. Casters 14 are detachably mounted at the four corners of the bottom of the chassis 1. An integrated electric box 15 is arranged at one end of the chassis 1, and a water tank 16 that is clamped and mounted on the outer wall of the processing chamber 12 is arranged at the other end of the chassis 1. A water pump 17 that cooperates with the water tank 16 is arranged inside the chassis 1.
[0094] Chassis 1 and processing chamber 12: Chassis 1 and processing chamber 12 are the main body of the ultrasonic cleaning machine;
[0095] The processing chamber 12 is managed in sections through the protective plate 13, that is, half of the area is used for ultrasonic cleaning, and the other half of the area is used for the drying unit 6 to dry the silicon wafer. The regional processing management helps to fully optimize the resource allocation and coordination between the control unit 2, the adjustment unit 3 and the washing unit 4. At the same time, it avoids interference between different units in adjacent areas, which helps to achieve standardized management of cleaning and drying of silicon wafers.
[0096] Casters 14: facilitate operators to move and carry the main body of the equipment (including the control unit 2, the adjustment unit 3, the washing unit 4, the spray unit 5 and the drying unit 6), while improving the overall mobility and flexibility of the equipment and increasing equipment movement solutions in special environments;
[0097] Integrated electric box 15: can be used as a circuit transfer station for connecting the control unit 2, the regulating unit 3, the washing unit 4, the spraying unit 5 and the drying unit 6 with computer equipment or communication equipment, etc., and can realize intelligent control of system parameters such as voltage, current and power factor, thereby improving the energy saving and operation efficiency of the power system;
[0098] Water tank 16 and water pump 17: At the moment of opening and closing, the water pump 17 can supply water to the inside of the water tank 16 and pump the waste water inside one side of the treatment chamber 12 to the outside through an external pipe, which helps to achieve a circulating water supply of clean water and indirectly ensure the long-term effectiveness of the washing unit 4.
[0099] Reference Figure 1 , Figure 4 and Figure 5 It can be seen that the control unit 2 includes: a cross beam 21, which is slidably mounted on the top end face of the chassis 1; two electric telescopic rods 22, which are symmetrically mounted on the end face of the horizontal section of the cross beam 21 close to the chassis 1; one steel liner 23, which is mounted on the end of the electric telescopic rod 22 close to the chassis 1; a stepper motor 24, which is mounted on the middle position of the end face of the steel liner 23 away from the chassis 1 through a mounting plate, and the output shaft of the stepper motor 24 passes through the steel liner 23;
[0100] The middle support plate 25 is fixedly mounted on the output shaft end of the stepper motor 24 and is rotatably mounted with the steel liner plate 23; the notch frame 26 is detachably mounted on the end face of the middle support plate 25 away from the electric telescopic rod 22 by bolts; the end rod 27 is one in number and is rotatably mounted between the vertical sections of the notch frame 26; the segmented column 28 is at least one and is evenly fixed on the outer wall of the end rod 27 in an array; the connecting rod 29 is slidably mounted on the outer wall of the segmented column 28;
[0101] Reference Figure 6 and Figure 7It can be seen that the adjusting unit 3 includes: a split and joint seat 31, which is clamped and installed at one end of the connecting rod 29 away from the segmented column 28; a U-shaped frame 32, with two in a group, and symmetrically clamped and installed on the end face of the split and joint seat 31 away from the segmented column 28; a bidirectional lead screw 33, rotatably fitted and installed at one end of the two U-shaped frames 32; a guide rod 34, rotatably fitted and installed at the other end of the two U-shaped frames 32; a U-shaped joint plate 35, with two in a group, and symmetrically arranged between a group of the U-shaped frames 32, and the U-shaped joint plate 35 is both threadedly fitted and installed with the bidirectional lead screw 33 and slidably clamped and fitted with the guide rod 34; a nut 36, fixedly installed at one end of the bidirectional lead screw 33.
[0102] Referring to Figure 4 , Figure 5 and Figure 6 It can be seen that the washing unit 4 includes: a suspension rod 41, with two in a group, and slidably clamped and fitted at one end of each split and joint seat 31 away from the connecting rod 29, and the suspension rod 41 is in a through clamping and fitting with the U-shaped joint plate 35 at the corresponding position; an angle plate 42, with two in a group, and symmetrically clamped and installed on the outer wall of one end of the suspension rod 41 away from the split and joint seat 31; a strip plate 43, clamped and installed at one end of the suspension rod 41 away from the split and joint seat 31, and clamped and fitted with the angle plate 42; a long-end buckle 44, plug-in installed at both ends of the strip plate 43, and with four in a group, symmetrically distributed in pairs.
[0103] A holding and protecting plate 45, with two in a group, symmetrically arranged on one side of each strip plate 43 away from the angle plate 42, and clamped and fitted with the long-end buckle 44; an axial position column 46, clamped and fitted on the end face of one side of the holding and protecting plate 45 close to the midline of the split and joint seat 31, and the distribution locus is arc-shaped; a joint groove 47, opened on the end face of the other side of the holding and protecting plate 45 close to the midline of the split and joint seat 31, and corresponding to the axial position column 46 one by one.
[0104] A spiral groove is opened on the outer wall of the segmented column 28, and the spiral groove is slidably clamped and fitted with the connecting rod 29. In addition, the pitch of the spiral grooves opened on the outer walls of the segmented columns 28 at different positions increases or decreases linearly, and the spiral direction of the spiral groove on the outer wall of one end of the segmented column 28 is opposite to that of the spiral grooves on the outer walls of the other segmented columns 28.
[0105] Referring to Figure 2 and Figure 8It can be seen that the spray unit 5 includes: two side plates 51, one of which is fixedly installed at the middle position of the inner wall on one side of the processing chamber 12, and the other is fixedly installed at the middle position of the end face on one side of the partition plate 13, and the two side plates 51 are arranged opposite to each other; the spray valve 52 is sequentially clamped and installed on the end face of the side plate 51 close to the middle position of the processing chamber 12; the spray port 53 is evenly opened at the end of the spray valve 52 away from the side plate 51, and has an arc shape; the spoiler 54 is clamped and installed on the top of one side of the spray valve 52 side plate 51.
[0106] Immerse the silicon wafer to be cleaned in the ultrasonic cleaning solution on one side of the processing chamber 12:
[0107] First, the electric telescopic rod 22, under the control of the diaphragm beam 21, drives the steel lining plate 23 to move to the top of one side of the processing chamber 12;
[0108] Then, the steel liner 23 drives the middle support plate 25 to move toward the bottom wall of the processing chamber 12 under the extension and retraction action of the electric telescopic rod 22;
[0109] Finally, the support plate 45 is synchronously driven to move by the suspension rod 41 until the support plate 45 (before that, the silicon wafer to be cleaned is placed between the opposite support plates 45 by the operator) is completely immersed in the cleaning liquid (ultrasonic cleaning liquid on one side of the processing chamber 12);
[0110] Overall steering adjustment scheme and process for adjustment unit 3 and washing unit 4:
[0111] When the stepper motor 24 rotates, the middle support plate 25, under the dual action of the stepper motor 24 output shaft drive and the steel liner plate 23 guide, drives the notch frame 26 to rotate to any angle inside the processing chamber 12 (it can also be outdoors, which is determined in the specific implementation according to the compatibility of the length of the processing chamber 12 and the length of the middle support plate 25, and when rotating outdoors, it is necessary to consider the compatibility of the vertical distance from the steel liner plate 23 to the bottom end of the guard plate 45 and the vertical distance from the horizontal section of the cross beam 21 to the top of the chassis 1);
[0112] The process of adjusting the position of the adjacent connecting rods 29 (i.e., the process of adjusting the position of the adjacent separation and combination seats 31 or the adjacent guard plates 45 at the corresponding positions):
[0113] Take the space increment of adjacent connecting rods 29 as an example:
[0114] The end rod 27 drives the segmented column 28 to rotate under the guidance of the notch frame 26. Specifically, the end rod 27 can be driven to rotate by an external motor. In this process, the connecting rod 29, under the guidance and limiting action of the spiral groove on the outer wall of the segmented column 28, prompts the separation and combination seat 31 to drive the suspension rod 41 to move as a whole under the guidance of the horizontal section of the notch frame 26.
[0115] In addition, due to the inequality of the pitch of the spiral groove on the outer wall of the segmented column 28 at different positions, when the segmented column 28 rotates at the same angle or number of turns, the horizontal movement distance of the connecting rod 29 driven by the segmented column 28 is unequal, thereby completing the linear unequal distance adjustment of the position of the adjacent separation and combination seats 31 (the connecting rod 29 is connected with the separation and combination seat 31);
[0116] Steps for decreasing the space between adjacent connecting rods 29: just reverse the end rod 27, and the specific working principle is opposite to the aforementioned step for increasing the space between adjacent connecting rods 29;
[0117] The process of adjusting the vertical distance between the guard plates 45 holding the two sides of the silicon wafer to be cleaned (or the process of adjusting the guard plates 45 to hold silicon wafers of different thicknesses):
[0118] The operator manually rotates the screw cap 36 to a specified angle or number of turns. During this process, the bidirectional screw 33 rotates synchronously under the action of the screw cap 36. At this time, the two opposite clamping plates 35 move toward or away from each other to the specified position under the guidance of the spiral of the bidirectional screw 33 and the guide rod 34 (the clamping frame 32 guides and supports the guide rod 34 and the bidirectional screw 33). At the same time, the suspension rod 41 moves toward or away from each other to the specified position synchronously under the dual action of the control of the clamping plate 35 and the limiting guidance of the separation and combination seat 31, thereby changing the vertical distance between the two opposite strips 43, thereby changing the vertical distance between the holding plates 45 on both sides of the silicon wafer, and then realizing the support and limiting of silicon wafers of different thicknesses, which helps to enhance the practicality and scene diversity of the device;
[0119] Axis column 46 and engagement groove 47: Through the plug-in cooperation between the axis column 46 and the engagement groove 47, the same-position clamping and limiting of silicon wafers of different thicknesses are realized (it is specially noted that the laying tracks of several axis columns 46 for clamping the same silicon wafer are circular, which fully ensures the contact integrity between the axis column 46 and the circular silicon wafer);
[0120] Introduction to the functions of each component in the washing unit 4 involved in washing:
[0121] Suspension rod 41: increases the vertical distance between the control unit 2 and the regulating unit 3 and the cleaning liquid inside the processing chamber 12. On the one hand, it reduces the influence of water vapor evaporation on the above units and ensures the long-term stable operation of the equipment; on the other hand, it helps to perform immersion ultrasonic cleaning on silicon wafers;
[0122] Angle plate 42: enhances the connection stability between the suspension rod 41 and the strip plate 43, and helps to increase the service life of the suspension rod 41;
[0123] Long end buckle 44: The length can be designed and adjusted by the user during the specific implementation. On the one hand, the movement stability of the guard plate 45 is improved; on the other hand, the dry-wet interaction channel between the guard plate 45 and the strip plate 43 is further separated, thereby reducing the maintenance cost and difficulty.
[0124] Specific operation process of spray unit 5:
[0125] After the silicon wafer to be cleaned completes ultrasonic cleaning and adjacent distance adjustment, the electric telescopic rod 22 retracts, and the silicon wafer inside the protective plate 45 moves away from the bottom wall of the processing chamber 12. In this process, the positive singleness and stability between the fluid and the components of the washing unit 4 are fully guaranteed through the inclined spray valve 52 and the arc-shaped spray port 53. At the same time, the spoiler 54 is used to improve the spray integrity of the spray valve 52 to the components of the washing unit 4, while reducing the sputtering area to ensure the cleanliness of the silicon wafer surface.
[0126] Reference Figure 2 , Fig. 9 and Fig.11 It can be seen that the drying unit 6 includes: a corner pad 61, which has an L-shaped cross-section and is detachably mounted on one side of the top end face of the chassis 1 by bolts; a straight plate 62, which has an L-shaped cross-section and is mounted on one end of the vertical section of the corner pad 61 by plugging through a mounting frame; a water diversion trough 63, which is provided in the middle of the horizontal section of the straight plate 62; at least one bottom plate 64, which is slidably mounted on the middle of the end face of the straight plate 62 close to the corner pad 61, and is arranged directly opposite to the water diversion trough 63; a sheet plate 65, which is slidably mounted on the end face of the horizontal section of the straight plate 62 close to the corner pad 61, and corresponds one to one with the bottom plate 64;
[0127] The vertical plate 66 is mounted on the bottom plate 64 at one end near the center line of the straight plate 62; the vertical plate 67 is mounted on the end of the sheet plate 65 near the vertical plate 66; the chain plate 68 is mounted on the middle position of the end surface of the bottom plate 64 and the sheet plate 65 away from the corner pad 61, and the chain plate 68 is mounted in a sliding and snap-fitting manner with the horizontal section of the straight plate 62; the screw rod 69 is mounted on the end surface of the straight plate 62 away from the corner pad 61 through the ear seat, and is located on one side of the water diversion trough 63; the screw rod 69 is mounted in a threaded manner with the chain plate 68, and the threaded matching directions between the chain plate 68 and the screw rod 69 at the corresponding positions of the bottom plate 64 and the sheet plate 65 are opposite;
[0128] Reference Fig.10 and Fig.11It can be seen that the end face of the vertical plate 66 close to the midline of the bottom plate 64 is mounted with a micro motor through a mounting plate, and the output end of the micro motor is mounted with a vertical rod 642 that is mounted and rotated with the vertical plate 66. The middle position of the vertical plate 66 away from the bottom plate 64 is mounted with an air plug 643 in a through-type rotational manner. The outer wall of the air plug 643 close to the end of the micro motor and the outer wall of the vertical rod 642 are fixedly mounted with mutually meshing gears 644. A star-locking ring 645 coaxially distributed with the air plug 643 is installed in conjunction with it; an air inlet valve pipe 646 is installed in conjunction with the air plug 643 at one end of the air plug 643 away from the axis of the star-locking ring 645 in a plug-in manner; an air guide pipe 647 is installed in conjunction with the air inlet end of the air inlet valve pipe 646; a horizontal air pump 648 fixedly connected to the bottom plate 64 is installed in conjunction with the air guide pipe 647 in conjunction with the air inlet end; a bracket 649 installed in conjunction with the vertical plate 66 is installed in conjunction with the outer wall of one end of the air plug 643 close to the air inlet valve pipe 646;
[0129] Reference Fig.12 and Fig.13 It can be seen that the vertical plate 67 is slidably fitted with a fitting plate 661 at the middle position of the end face of one side away from the vertical plate 66, and the fitting plate 661 is fixedly fitted with an angle shovel 662 that is slidably fitted with the vertical plate 67 through a transfer shaft at one end away from the center line of the sheet plate 65. The vertical plate 67 is symmetrically fitted with an L single plate 663 at the end face of one side close to the vertical plate 66. The vertical section of the L single plate 663 on one side is fitted with a jet nozzle 664 in an array-like manner, and the number is at least one, and the liquid outlet end of the jet nozzle 664 faces the angle shovel 662, and the other end faces the vertical plate 663. The vertical section of the L single plate 663 on the side is mounted with pillars 665 in an array manner, the number of which is three. The three pillars 665 are mounted with a side guard plate 666 mounted with the vertical plate 67 at one end away from the jet nozzle 664. The three pillars 665 are mounted with a wedge plate at one end close to the jet nozzle 664, and the wedge plate faces the angle shovel 662. The end of the wedge plate away from the vertical plate 67 is mounted with a blowing plate 668, and the other end of the end of the wedge plate away from the vertical plate 67 is mounted with a heat conducting plate 669.
[0130] The vertical distance between the vertical plate 66 and the vertical plate 67 is greater than the vertical distance between the two retaining plates 45 that are oppositely distributed, and the reserved vertical distance between the two retaining plates 45 on the same side is less than the width of the water diversion trough 63; the cross-sectional shape of the end of the angle shovel 662 away from the interlocking plate 661 is an isosceles right trapezoid, and one end of the angle shovel 662 is wedge-shaped.
[0131] Preliminary preparation steps for drying unit 6:
[0132] First, the electric telescopic rod 22 performs a contraction movement until the end of the protective plate 45 close to the bottom wall of the processing chamber 12 is separated from the top of the chassis 1 (at this time, the adjustment unit 3 and the washing unit 4 are also separated from the chassis 1);
[0133] Then, the cross beam 21 drives the electric telescopic rod 22 to move to the other side of the processing chamber 12 until it is directly above the drying unit 6;
[0134] Finally, the electric telescopic rod 22 drives the steel liner 23 to move toward the bottom wall of the processing chamber 12 again until the guard plate 45 contacts the straight plate 62 (and at this time, the silicon wafer is in the middle of the bottom plate 64 and the wafer plate 65 at the corresponding position);
[0135] The process of the air plug 643 adsorbing and positioning the end surface of one side of the silicon wafer between the guard plate 45 and the angle shovel 662 contacting the end surface of the other side of the silicon wafer:
[0136] The screw 69 is rotated. In a specific implementation, the screw 69 can be driven to rotate by an external motor. After that, the chain plates 68 belonging to the bottom plate 64 and the plate 65 respectively control the bottom plate 64 and the plate 65 of the same group to move toward each other under the action of the screw until the air plug 643 contacts the silicon wafer and the angle shovel 662 contacts the silicon wafer.
[0137] Wafer rotation process:
[0138] When the gas plug 643 contacts the end face of one side of the silicon wafer, the air pump performs a vacuum process (i.e., sucks the gas inside the suction cup to form a vacuum negative pressure) through the air guide pipe 647 and the air inlet valve pipe 646 until the suction cup stably adsorbs the silicon wafer (through the interference between the locking ring 645 and one end of the gas plug 643, the deformation of the gas plug 643 during adsorption is unified, and in actual operation, the deformation of the suction cup can be calculated for unified control);
[0139] Afterwards, the vertical rod 642 drives its outer wall gear 644 to rotate under the control of the micro motor 641. At the same time, the air plug 643 (the rotation stability of the air plug 643 is improved by the bracket 649, and the connection stability between the air inlet valve pipe 646 and the air plug 643 is ensured) rotates under the synchronous control of its outer wall gear 644 (at this time, the position of the air inlet valve pipe 646 relative to the air plug 643 remains unchanged, that is, the rotation of the air plug 643 will not cause interference with the air inlet valve pipe 646).
[0140] The process of the angle shovel 662 removing impurities from the end surface of the silicon wafer and the blowing plate 668 drying the silicon wafer:
[0141] When the silicon wafer rotates:
[0142] The angle shovel 662 (the cross section of the angle shovel 662 is an isosceles trapezoid for the purpose of increasing the smoothness and stability of the action of the angle shovel 662 on the end surface of the silicon wafer impurities) is driven by the interlocking plate 661 and guided by the vertical plate 67, and gradually (linearly increasing) moves from the outer end of the silicon wafer toward the axial direction until the working length of the angle shovel 662 on the end surface of the silicon wafer is greater than the radius of the silicon wafer. Specifically, the interlocking plate 661 can be driven to move by an electric slider;
[0143] During this process, the IPA liquid is sprayed toward the working area of the angle shovel 662 and the silicon wafer through the jet nozzle 664. On the one hand, the heat generated by the relative movement between the angle shovel 662 and the silicon wafer is reduced, thereby improving production safety. On the other hand, the angle shovel 662 is subjected to fluid self-cleaning operation, thereby improving the cleanliness of the angle shovel 662 itself.
[0144] At the same time, the heat emitted by the heat conducting plate 669 (the length of the heat conducting plate 669 is greater than the diameter of the silicon wafer, and the center line of the heat conducting plate 669 is at the same level as the axis of the silicon wafer) is blown toward the end surface of the silicon wafer through the blowing plate 668, so as to dry the silicon wafer in a way of combining gas and heat, thereby enhancing the drying effect. In addition, the IPA vapor is blown toward the periphery of the silicon wafer through the blowing plate 668, so that the silicon wafer generates Marangoni force, thereby realizing spin drying;
[0145] The width of the water diversion groove 63 is greater than the reserved vertical distance between the two guard plates 45 on the same side (see the attached Figure 5 The width is shown at 1-a): to prevent the liquid from being sprayed from the nozzle 664 and interacting with the angle shovel 662 from splashing toward the straight plate 62 area, so as to fully ensure the cleanliness of the equipment itself;
[0146] Vertical plate 66 and vertical plate 67: to separate the interaction space between the angle shovel 662 and the silicon wafer and the outside world, to prevent the impact of granular impurities sputtering on the adjacent silicon wafer end faces during the scraping of the angle shovel 662 and the rotation of the silicon wafer, and to achieve regional management;
[0147] It is hereby explained that after the scraping process on one side of the silicon wafer is completed, the electric telescopic rod 22 is retracted until the bottom end of the protective plate 45 is separated from the top of the chassis 1. Thereafter, the middle supporting plate 25 is driven by the stepper motor 24 to rotate 180 degrees under the guidance of the steel liner 23, and finally the electric telescopic rod 22 is extended to drive the silicon wafer to the initial position (the processing principle of the other side of the silicon wafer is the same as the above and will not be repeated).
[0148] The working principle of the photovoltaic silicon wafer drying device for photovoltaic cells provided by the present invention is as follows: Step 1: First, the steel liner 23 is driven to move toward the bottom wall of the processing chamber 12 by the electric telescopic rod 22 until the top of the protective plate 45 is completely immersed in the cleaning liquid inside the processing chamber 12, and then, the segmented column 28 and the connecting rod 29 are driven to move relative to each other by rotating the end rod 27 until the separation and combination seat 31 drives the suspension rod 41 to move to different positions;
[0149] Step 2: Then, the protective plate 45 is driven by the electric telescopic rod 22 to move away from the bottom wall of the processing chamber 12. During this process, the protective plate 45 and the spray valve 52 move relative to each other, and the protective plate 45 and the end surface of the silicon wafer are further sprayed through the spray port 53 of the spray valve 52.
[0150] Step 3: Finally, the silicon wafer is positioned by adsorption through the air plug 643, and the air plug 643 is driven to rotate through the gear 644. At the same time, the angle shovel 662 is driven to perform a lifting and delivering motion through the interlocking plate 661. At this time, the silicon wafer in the rotating state continuously undergoes a relative scraping motion with the angle shovel 662. In addition, the IPA solution for accelerating drying, cooling and cleaning is sprayed on the angle shovel 662 and the silicon wafer processing area through the jet nozzle 664, which fully ensures the cleanliness of the silicon wafer end face. The hot air is combined with the air blowing plate 668 and the heat conducting plate 669 to achieve rapid drying of the silicon wafer end face.
[0151] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.
[0152] The above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A photovoltaic silicon wafer drying device for photovoltaic cells, comprising a chassis (1), the chassis (1) being a rectangular skeleton structure, characterized in that: A control unit (2) is arranged on one side of the top of the chassis (1); an adjustment unit (3) is arranged on the side of the control unit (2) close to the center line of the chassis (1); a washing unit (4) is arranged on the side of the adjustment unit (3) away from the control unit (2); spray units (5) are arranged on both sides of the washing unit (4); and a drying unit (6) is arranged on one side inside the chassis (1); The drying unit (6) comprises: A corner gasket (61) has an L-shaped cross section and is detachably mounted on one side of the top end surface of the chassis (1) by means of bolts; The straight plate (62) has an L-shaped cross section and is installed at one end of the vertical section of the corner pad (61) through a mounting frame; A water distribution trough (63) is provided in the middle of the horizontal section of the straight plate (62); There is at least one bottom plate (64), which is slidably mounted on the middle of the end surface of the straight plate (62) close to the corner pad (61) and is arranged opposite to the water distribution trough (63); The sheet plate (65) is slidably mounted on the end surface of the horizontal section of the straight plate (62) close to the corner pad (61) and corresponds to the bottom plate (64) one by one; A vertical plate (66) is mounted on the bottom plate (64) by snapping onto one end of the bottom plate (64) near the center line of the straight plate (62); A vertical plate (67) is mounted on the sheet plate (65) by being clamped and mounted on one end thereof close to the vertical plate (66); The chain plate (68) is respectively mounted on the bottom plate (64) and the sheet plate (65) at the middle position of the end surface of one side away from the corner pad (61), and the chain plate (68) is mounted in a sliding and clamping manner with the horizontal section of the straight plate (62); The screw rod (69) is rotatably mounted on the end surface of the straight plate (62) away from the corner pad (61) through an ear seat and is located on one side of the water dividing groove (63); the screw rod (69) is threadedly mounted with the chain plate (68), and the threaded mounting directions of the chain plate (68) and the screw rod (69) at corresponding positions of the bottom plate (64) and the sheet plate (65) are opposite.
2. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 1, characterized in that: The end surface of the vertical plate (66) close to the center line of the bottom plate (64) is mounted with a micro motor through a mounting plate, and a vertical rod (642) is mounted at the output end of the micro motor in a mounting plate ... A star-locking ring (645) is coaxially distributed with the air plug (643); an air intake valve pipe (646) is installed in a plug-in manner at an axial position of one end of the air plug (643) away from the star-locking ring (645); an air guide pipe (647) is installed at the air intake end of the air intake valve pipe (646); a horizontal air pump (648) fixedly connected to the bottom plate (64) is installed at the air intake end of the air guide pipe (647); a bracket (649) installed at the outer wall of one end of the air plug (643) close to the air intake valve pipe (646) is installed in a plug-in manner and is cooperating with the vertical plate (66).
3. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 1, characterized in that: A chimeric plate (661) is slidably mounted on the middle position of the end face of one side of the vertical plate (67) away from the upright plate (66); an angle shovel (662) is fixedly mounted on the chimeric plate (661) away from the center line of the sheet plate (65) through a transfer shaft and is slidably mounted on the end face of one side of the vertical plate (67) close to the upright plate (66); an L single plate (663) is symmetrically mounted and mounted on the end face of one side of the vertical plate (67) close to the upright plate (66); a jet nozzle (664) is mounted on the vertical section of the L single plate (663) on one side in an array-type and snap-fit manner, and the number of the jet nozzles (664) is at least one, and the liquid outlet end of the jet nozzle (664) faces the angle shovel (662); and the other end of the jet nozzle (664) faces the angle shovel (662). The vertical section of the L single board (663) on the side is mounted with pillars (665) in an array manner, and the number is three. The three pillars (665) are installed with a side guard plate (666) that is installed with the vertical plate (67) at one end away from the jet nozzle (664) and is installed with a wedge plate at one end close to the jet nozzle (664). The wedge plate faces the angle shovel (662). The end of the wedge plate away from the vertical plate (67) is mounted with a blowing plate (668), and the other end of the wedge plate away from the vertical plate (67) is mounted with a heat conducting plate (669).
4. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 3, characterized in that: The vertical end surfaces of the chassis (1) are all rotatably mounted with cabinet doors (11) for isolating the interior of the chassis (1) from the external space; a processing chamber (12) is arranged on the top of the chassis (1); a partition plate (13) is installed in the interior of the processing chamber (12); the control unit (2), the adjustment unit (3) and the washing unit (4) are respectively located in the processing chamber (12) area on both sides of the partition plate (13); casters (14) are detachably mounted at the four corners of the bottom of the chassis (1); an integrated electric box (15) is arranged at one end of the interior of the chassis (1); a water tank (16) is arranged at the other end of the interior of the chassis (1) and is clamped and mounted with the outer wall of the processing chamber (12); and a water pump (17) matching the water tank (16) is arranged in the interior of the chassis (1).
5. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 4, characterized in that: The control unit (2) comprises: A transverse beam (21) is mounted on the top end surface of the chassis (1) by sliding and snap-fitting; There are two electric telescopic rods (22) which are symmetrically mounted on the horizontal section of the cross beam (21) and close to the end surface of the chassis (1); A steel lining plate (23), the number of which is one and which is mounted on the electric telescopic rod (22) at one end close to the chassis (1); The stepper motor (24) is mounted on the middle position of the end surface of the steel lining plate (23) away from the chassis (1) through a mounting plate, and the output shaft of the stepper motor (24) passes through the steel lining plate (23); The middle bearing plate (25) is fixedly mounted on the output shaft end of the stepping motor (24) and is rotationally mounted with the steel lining plate (23); A notch frame (26) is detachably mounted on an end surface of the middle support plate (25) away from the electric telescopic rod (22) by means of bolts; The end rod (27) is one in number and is rotationally mounted between the vertical sections of the notched frame (26); There is at least one segmented column (28) which is evenly fixed on the outer wall of the end rod (27) in an array; The connecting rod (29) is slidably mounted on the outer wall of the segmented column (28).
6. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 4, characterized in that: The regulating unit (3) comprises: A split seat (31) is mounted on the end of the connecting rod (29) away from the segmented column (28) by snap-fitting; The mouth frames (32) are two in a group and are symmetrically clamped and installed on the end surface of the separation and combination seat (31) away from the segmented column (28); A bidirectional lead screw (33) is rotatably mounted on one end of the two opening frames (32); A guide rod (34) is rotatably mounted on the other ends of the two opening frames (32); The clamping plates (35) are arranged in a group of two and are symmetrically arranged between a group of the clamping frames (32). The clamping plates (35) are installed by threading with the bidirectional lead screw (33) and also by sliding and clamping with the guide rod (34); The screw cap (36) is fixedly mounted on one end of the bidirectional lead screw (33).
7. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 6, characterized in that: The washing unit (4) comprises: The suspension rods (41) are two in a group and are installed at one end of each of the split and combined seats (31) away from the connecting rod (29) in a sliding snap-fit manner, and the suspension rods (41) are installed in a through-type snap-fit manner with the combined plate (35) at the corresponding position; The angle plates (42) are two in a group and are symmetrically clamped and mounted on the outer wall of one end of the suspension rod (41) away from the separation and combination seat (31); The strip plate (43) is mounted by snap-fitting at one end of the suspension rod (41) away from the separation seat (31), and is mounted by snap-fitting with the angle plate (42); Long end buckles (44) are plug-in mounted at both ends of the strip (43), and four of them form a group, and are symmetrically distributed in pairs; The retaining plates (45) are two in a group and are symmetrically arranged on the side of each strip plate (43) away from the angle plate (42) and are installed by snap-fitting with the long end buckles (44); The axial column (46) is mounted on the end surface of the holding plate (45) on one side close to the center line of the separation seat (31) by snap-fitting, and the distribution track is an arc; The engaging groove (47) is provided on the end surface of the other side of the retaining plate (45) close to the center line of the separation seat (31), and corresponds one to one with the axial column (46).
8. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 4, characterized in that: The spray unit (5) comprises: There are two side plates (51), one of which is fixedly mounted at the middle position of the inner wall of one side of the processing chamber (12), and the other side plate (51) is fixedly mounted at the middle position of the end surface of one side of the partition plate (13), and the two side plates (51) are arranged opposite to each other; The spray valve (52) is sequentially mounted on an end surface of the side plate (51) close to the middle of the processing chamber (12); The blowing port (53) is evenly arranged at one end of the blowing valve (52) away from the side plate (51) and has an arc shape; The spoiler (54) is mounted on the top of one side of the side plate (51) of the injection valve (52) by snap connection.
9. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 7, characterized in that: The vertical distance between the upright plate (66) and the vertical plate (67) is greater than the vertical distance between the two retaining plates (45) that are oppositely distributed, and the reserved vertical distance between the two retaining plates (45) on the same side is less than the width of the water diversion trough (63).
10. The photovoltaic silicon wafer drying device for photovoltaic cells according to claim 5, characterized in that: The outer wall of the segmented column (28) is provided with a spiral groove, and the spiral groove is installed with the connecting rod (29) by sliding engagement. In addition, the pitch of the spiral groove provided on the outer wall of the segmented column (28) at different positions increases or decreases linearly, and the spiral groove on the outer wall of the segmented column (28) at one end has an opposite rotation direction to that of the segmented column (28) at other positions. The cross-sectional shape of the end of the angle shovel (662) away from the interlocking plate (661) is an isosceles right-angled trapezoid, and one end of the angle shovel (662) is processed into a wedge shape.
Citation Information
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