An apparatus, system, and method for wafer transfer

Abstract

The application discloses a device, a system and a method for wafer conveying. The device comprises a sealing assembly, a driving mechanism and a vacuum assembly. The sealing assembly comprises a sealing conveying device and a connecting assembly. The connecting assembly comprises a connecting plate. The conveying assembly comprises a sealing plate. The conveying assembly can be moved in a vertical direction to convey a wafer and seal a second cavity. The sealing plate is provided with first and second vacuum openings. The connecting plate is provided with first and second vacuum ports. The driving mechanism comprises a driving assembly and a transmission assembly. The transmission assembly is positioned relative to a processing device and is fixedly connected with the sealing plate. The driving assembly and the transmission assembly are in abutment at a driving slope, so that horizontal movement of the driving assembly drives vertical movement of the transmission assembly. The vacuum assembly comprises first and second vacuum assemblies. The first vacuum assembly comprises a rough pumping assembly which is in communication with the first vacuum opening, and a first valve plate assembly which is used for closing the first vacuum opening. The second vacuum assembly comprises a fine pumping assembly and a second valve plate assembly which is used for closing the second vacuum opening.

Description

Technical Field

[0001] The present disclosure generally relates to the field of silicon wafer processing technology. More specifically, the present disclosure relates to an apparatus, system, and method for wafer transfer. Background Art

[0002] In the field of silicon wafer processing, processing equipment often needs to transfer wafers from the atmospheric environment into a vacuum chamber. This process often requires conveying devices such as robots for vertical wafer transfer. Such devices can occupy a relatively large vertical space when set up. This not only occupies a large space in the production site, but also makes it difficult to install and maintain production equipment.

[0003] In view of this, there is an urgent need to provide a device for wafer transfer, so as to make the structure of the device for wafer transfer more compact. Summary of the Invention

[0004] In order to at least solve one or more of the technical problems mentioned above, the present disclosure provides, in multiple aspects, an apparatus, a system, and a method for wafer transfer.

[0005] In a first aspect, the present disclosure provides a device for wafer transfer, which is used to transfer wafers between a first chamber and a second chamber of a processing device, the device comprising: a sealing assembly, which comprises a sealing transfer device and a connecting assembly fixedly connected to the processing device, the connecting assembly comprising a connecting plate, the transfer assembly comprising a sealing plate spaced apart from the connecting plate in a vertical direction, the transfer assembly being able to move in a vertical direction relative to the connecting assembly to transfer the wafer and seal the second chamber relative to the first chamber, the sealing plate being provided with a first vacuum opening and a second vacuum opening penetrating the plate surface, the connecting plate being provided with a first vacuum pipe port and a second vacuum pipe port penetrating the plate surface; a driving mechanism comprising a driving assembly to and a transmission assembly, the transmission assembly is limited relative to the processing equipment along a first horizontal direction and is fixedly connected to the sealing plate, the driving assembly has a driving inclined surface inclined from the first horizontal direction toward the vertical direction, the driving assembly and the transmission assembly abut at the driving inclined surface, so that the movement of the driving assembly along the first horizontal direction drives the transmission assembly to move vertically; a vacuum assembly, which includes a first vacuum assembly and a second vacuum assembly, the first vacuum assembly respectively includes a rough pumping assembly connected to the first vacuum opening on the sealing plate, and a first valve plate assembly for closing the first vacuum opening, the second vacuum assembly includes a fine pumping assembly connected to the second vacuum opening, and a second valve plate assembly for closing the second vacuum opening.

[0006] In some embodiments, the driving assembly includes a driving member and a guide plate driven by the driving member to move along a first horizontal direction. The transmission assembly includes a follower wheel. The guide plate is provided with a guide groove inclined from the first horizontal direction to the vertical direction and cooperating with the follower wheel. The guide groove is used to drive the follower wheel to move in the vertical direction when the guide plate moves along the first horizontal direction.

[0007] In some embodiments, multiple transmission through holes are provided on the connecting plate, the transmission assembly includes a relay and multiple transmission rods, the follower wheel is provided on the side of the relay, one end of the multiple transmission rods is fixedly connected to the relay, and the other end passes through the transmission through hole and is fixedly connected to the sealing plate.

[0008] In some embodiments, the sealing plate includes a plurality of sealing rod holes passing through the plate surface, the first valve plate assembly includes a first valve plate and a plurality of sealing rods fixedly connected to the first valve plate, the second valve plate assembly includes a second valve plate and a plurality of sealing rods fixedly connected to the second valve plate, and the plurality of transmission rods each include a sealing through-hole passing through in the axial direction, and the plurality of sealing rods are respectively arranged in the sealing through-holes of the corresponding transmission rods, and respectively pass through the sealing rod holes on the sealing plate and are fixedly connected to the first valve plate and the second valve plate.

[0009] In some embodiments, the first valve plate assembly and the second valve plate assembly also include multiple single-acting cylinders arranged in the vertical direction, and compression springs fixedly arranged at the protruding ends of the single-acting cylinders. The fixed part of the single-acting cylinder is fixedly connected to the relay, and the upper ends of the multiple compression springs are respectively abutted against the bottom of the transmission rod in the vertical direction.

[0010] In some embodiments, the vacuum assembly also includes a limit bracket fixedly connected to the relay, the limit bracket includes a limit block extending in the vertical direction, the first valve plate assembly and the second valve plate assembly each include two single-acting cylinders for driving the valve plate movement, the protruding ends of the two corresponding single-acting cylinders of the first valve plate assembly are fixedly connected to the first synchronous bracket, and the protruding ends of the two corresponding single-acting cylinders of the second valve plate assembly are fixedly connected to the second synchronous bracket, a buffer spring is arranged between the first synchronous bracket and the second synchronous bracket and the limit bracket, and the limit block limits the first synchronous bracket and the second synchronous bracket in the vertical direction.

[0011] In some embodiments, the sealing assembly also includes multiple bellows, one end of the bellows is fully welded to the upper surface of the connecting plate, and the other end is fully welded to the lower surface of the sealing plate, and the bellows are arranged corresponding to the transmission through hole and the sealing rod hole, the first vacuum opening and the first vacuum pipe port, the second vacuum opening and the second vacuum pipe port to surround and seal them.

[0012] In a second aspect, the present disclosure provides a system for wafer transfer, comprising: a wafer storage device for storing, sending out and receiving wafers; a first transfer mechanism for transferring wafers between a second chamber and a third chamber of a processing device; and a device for wafer transfer according to any one of claims 1 to 5, which is used to perform at least the following operations: receiving wafers sent out by the wafer storage device; transferring wafers between the first chamber and the second chamber through a sealing assembly; and transferring wafers between the second chamber and the third chamber through the first transfer mechanism.

[0013] In a third aspect, the present disclosure provides a method for wafer transfer using a system according to the claim, comprising: positioning the sealing assembly at a corresponding position in the second chamber, the wafer storage device delivering the wafer to the second chamber, and the wafer being carried by the sealing assembly; causing the sealing assembly to evacuate the second chamber, and transferring the wafer to a relay position for waiting; causing the first transfer mechanism to extend into a transfer window connecting the second chamber and the third chamber, and move to under the wafer; causing the sealing assembly to move to a corresponding position in the first chamber, the first transfer mechanism receiving the wafer; and causing the first transfer mechanism to carry the wafer out of the transfer window.

[0014] In some embodiments, the method also includes: allowing the first transfer mechanism to carry the wafer to be sent out and move it into the first chamber from the transfer window; allowing the sealing component to move from the corresponding position of the first chamber to the relay position, and receive the wafer to be sent out; allowing the first transfer mechanism to move out from the transfer window; and allowing the sealing component to move from the relay position to the corresponding position of the second chamber, and the wafer storage device moves the wafer to be sent out from the second chamber.

[0015] Through the device for wafer conveying provided above, the embodiment of the present disclosure sets a horizontally placed drive component, and makes the drive component abut against the transmission component with the help of an inclined surface to drive the transmission component to move in a vertical direction. This can change the setting direction of the drive component, make the equipment layout more compact, and facilitate the miniaturization of the wafer conveying equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0018] Figure 2 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0019] Figure 3 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0020] Figure 4 An exemplary perspective view showing a driving mechanism of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0021] Figure 5 An exemplary perspective view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0022] Figure 6 An exemplary cross-sectional view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0023] Figure 7 An exemplary perspective view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0024] Figure 8 An exemplary side view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0025] Figure 9a An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0026] Figure 9b An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0027] Figure 9c An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0028] Figure 10a A top view showing a combination of a first transfer mechanism, a second transfer mechanism, and an apparatus for wafer transfer in a system for wafer transfer according to some embodiments of the present disclosure;

[0029] Figure 10b A top view showing a combination of a first transfer mechanism, a second transfer mechanism, and an apparatus for wafer transfer in a system for wafer transfer according to some embodiments of the present disclosure;

[0030] Figure 11 An exemplary flow chart of a method for wafer transfer according to some embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of this disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this disclosure, not all of them. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this disclosure.

[0032] It should be understood that the terms “include” and “comprising” used in the specification and claims of the present disclosure indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0033] It should also be understood that the terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the claims, the singular forms "a," "an," and "" are intended to include the plural forms unless the context clearly indicates otherwise. It should be further understood that the term "and / or" as used in this disclosure and the claims refers to any and all possible combinations of one or more of the associated listed items, including and including these combinations.

[0034] As used in this specification and claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0035] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0036] The disclosed embodiment provides a device for wafer conveying, which can change the setting direction of the drive component and make the equipment layout more compact by setting a horizontally placed drive component and making the drive component abut against the transmission component with the help of an inclined surface to drive the transmission component to move in a vertical direction. This is conducive to the miniaturization of the wafer conveying equipment.

[0037] See also Figure 1 and Figure 8 , Figure 1 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure; Figure 8An exemplary side view of a system for wafer transfer according to some embodiments of the present disclosure is shown. In some embodiments, the wafer transfer apparatus 100 can be used to seal and evacuate a second chamber 220 communicating with the first chamber 210 relative to the first chamber 210, thereby transferring a wafer 90 to a high-vacuum processing or inspection space under a vacuum environment. The wafer transfer apparatus can include a sealing assembly 10 for sealing the chamber, a drive mechanism 20 for driving the sealing assembly 10 to perform related actions, and a vacuum assembly 30 for evacuating the chamber.

[0038] See also Figure 2 and Figure 3 , Figure 2 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure; Figure 3 An exemplary stereoscopic view of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown. Specifically, in some embodiments, the sealing assembly 10 may include a connecting assembly 120 for connecting to the processing equipment 200, and a sealing conveying device 110 capable of moving relative to the connecting assembly 120 to transfer wafers. The connecting assembly 120 may, for example, include a connecting plate 12 for fixedly connecting to the processing equipment 200, which may, for example, be fixedly connected to the bottom wall of the first chamber 210. The sealing conveying device 110 may include a sealing plate 11 vertically spaced from the connecting plate 12, the sealing plate 11 being capable of moving relative to the connecting plate 12 in the vertical direction to transfer wafers and being capable of sealing the second chamber 220 relative to the first chamber 210. To this end, an upper sealing groove 116 may, for example, be provided on the upper surface of the sealing plate 11, and an upper sealing ring 117 may be provided in the upper sealing groove 116 for fitting with the step surface 224 adjacent to the second chamber 220 and the first chamber 210.

[0039] The sealing plate 11 may be provided with a first vacuum opening 111 and a second vacuum opening 112 extending through the plate surface, and the connecting plate 12 may be provided with a first vacuum pipe opening 121 and a second vacuum pipe opening 122 extending through the plate surface. The first vacuum opening 111 and the second vacuum opening 112 may, for example, be connected to corresponding vacuum pumps, so that when the sealing conveyor 110 seals the second chamber 220, the first vacuum opening 111 and the second vacuum opening 112 are connected to the second chamber 220 to evacuate it. Vacuum pipes for connecting to vacuum pumps may be provided radially inwardly of the first vacuum pipe opening 121 and the second vacuum pipe opening 122. In some embodiments, the first vacuum opening 111 may be vertically aligned with the first vacuum pipe opening 121, while the second vacuum opening 112 may be aligned with the second vacuum pipe opening 122 to facilitate the installation of the vacuum pipes.

[0040] See also Figure 4 , Figure 4An exemplary stereoscopic diagram of a drive mechanism of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown, wherein components such as a transmission rod are hidden to clearly illustrate its internal structure. The drive mechanism 20 may include a drive assembly and a transmission assembly, wherein the transmission assembly is limited relative to the processing equipment 200 along a first horizontal direction, and the transmission assembly is fixedly connected to the sealing plate 11 of the sealing conveying device 110. The drive assembly may include a drive bevel inclined from the first horizontal direction toward the vertical direction, and the drive assembly and the transmission assembly abut at the drive bevel, so that the horizontal movement of the drive assembly along the first horizontal direction drives the vertical movement of the transmission assembly. Thus, the drive mechanism 20 can drive the sealing conveying device 110 to rise in the vertical direction to seal the second chamber 220, or to descend in the vertical direction to connect the first chamber 210 with the second chamber 220, by means of a drive member arranged in the horizontal direction.

[0041] The vacuum assembly 30 may include a first vacuum assembly and a second vacuum assembly. The first vacuum assembly includes a roughing assembly 33 connected to the first vacuum opening 111 on the sealing plate 11 via a first vacuum line 38, and a first valve plate assembly for sealing the first vacuum opening 111. The second vacuum assembly includes a fine pumping assembly 34 connected to the second vacuum opening 112 via a second vacuum line 37, and a second valve plate assembly for sealing the second vacuum opening 112. The roughing assembly 33 may, for example, be a vacuum pipe connected to the first vacuum line 38 and a centralized negative pressure generator (not shown) in the factory connected to the vacuum pipe. The roughing assembly 33 provides a stable negative pressure source to the first vacuum opening 111 for initially evacuating the sealed second chamber 220. The fine pumping assembly 34 may, for example, include a molecular pump that begins operating after the roughing assembly 33 performs the initial evacuation, further evacuating the second chamber 220 to achieve the target vacuum level.

[0042] In some embodiments, the drive assembly of the drive mechanism 20 includes a drive member 22 and a guide plate 21 driven by the drive member 22 to move along a first horizontal direction, and the transmission assembly includes a follower wheel 222. The guide plate 21 is provided with a guide groove 211 formed by being recessed laterally into the interior of the guide plate 21. The guide groove 211 is inclined from the first horizontal direction toward the vertical direction, and its inner side is capable of cooperating with the follower wheel 222. The guide groove 211 is used to drive the follower wheel 222 to move in the vertical direction when the guide plate 21 moves along the first horizontal direction. The drive member 22 can be, for example, a rotary drive member such as a stepper motor or a servo motor, and provides precise drive along the first horizontal direction via a lead screw and guide rail mechanism. In some embodiments, the drive member 22 can also be a linear drive member such as a linear motor or a cylinder, thereby directly providing drive along the first horizontal direction.

[0043] In some embodiments, the two inclined sidewalls of the guide groove 211 form two opposing driving ramps. When the driving member 22 drives the guide plate 21 to reciprocate along the first horizontal direction, the two driving ramps of the guide groove 211 can respectively abut against the follower wheel 222, driving it to move vertically. The follower wheel 222 can extend entirely or partially into the guide groove 211, with its circumferential side surfaces able to contact and roll along the two driving ramps of the guide groove 211. The diameter of the follower wheel 222 can match the width of the guide groove 211, ensuring a small gap between the follower wheel 222 and the driving ramps. This prevents the follower wheel 222 from bouncing during movement within the guide groove 211, which could cause vibration in the sealing conveyor 110 and affect wafer handling.

[0044] In some embodiments, the guide groove 211 may include multiple sections. For example, it may include an inclined section 213, as described above, for driving the follower wheel 222 up and down. Near the upper end of the inclined section 213, an adjustment section 214 and a holding section 215 are also provided. The holding section 215 may be formed by extending horizontally from the end of the guide groove 211, for example, at a relatively higher end of the guide groove 211 in the vertical direction. The adjustment section 214 may be disposed between the holding section 215 and the inclined section 213 and may extend at a shallower angle than the inclined section 213. The holding section 215 supports the follower wheel 222 when the sealing conveyor 110 needs to be maintained in an elevated position, while the adjustment section 214 allows for fine-tuning of the height. For example, when the sealing conveyor 110 is in the elevated position, the follower wheel 222 moves from the inclined section 213 to the adjustment section 214. At this time, because the inclination angle of the adjustment section 214 is more gradual, when the driving member 22 drives the guide plate 21 to move the same distance in the first horizontal direction, the driving wheel moves a shorter distance in the vertical direction in the adjustment section 214 than when the driving wheel moves in the inclined section 213. As a result, the height of the sealing conveyor 110 can be fine-tuned to achieve a more satisfactory sealing effect.

[0045] In addition, an access port 216 can be provided on the upper side of the guide groove 211. The access port 216 can be a groove opened upward and laterally from the upper side of the guide groove 211. The access port 216 can be used to allow the follower wheel 222 to fall into the guide groove 211 from top to bottom to facilitate the installation and replacement of the transmission component.

[0046] In some embodiments, the drive assembly may include two guide plates 21 arranged at intervals along a horizontal direction perpendicular to the first horizontal direction. The bottoms of the two guide plates 21 may be fixedly connected to a guide base plate 217, and one end of the two guide plates 21 along the first horizontal direction may be fixedly connected to a drive support plate 218. The bottom of the guide base plate 217 may be connected to a guide rail assembly 29, which may be a guide rail slider assembly arranged along the first direction. The bottom surface of the guide base plate 217 is fixedly connected to the slider of the guide rail slider assembly so that it can be accurately guided by the guide rail. The drive support plate 218 may be fixedly connected to the output end of the drive assembly, thereby allowing it to reciprocate along the first horizontal direction under the drive of the driver 22. The two guide plates 21, the guide base plate 217, and the drive support plate 218 together form a guide bracket, which enhances the stability of the drive assembly when transmitting driving force.

[0047] See also Figure 5 and Figure 6 , Figure 5 An exemplary perspective view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure; Figure 6 An exemplary cross-sectional view of a combination of a sealing component and a vacuum component of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown, wherein Figure 5 and Figure 6 Also shown are multiple transmission rods connected to the connecting plate. The connecting plate 12 may be provided with multiple transmission through-holes 128. The transmission assembly may include a relay 23 and multiple transmission rods 24. A follower wheel 222 is connected to the side of the relay 23. One end of the multiple transmission rods 24 is fixedly connected to the relay 23, and the other end passes through the transmission through-holes 128 and is fixedly connected to the sealing plate 11. In some embodiments, a transmission stopper 129 is also fixedly provided on the underside of the connecting plate 12. The transmission stopper 129 can be, for example, a hollow ball bearing sleeve or other limiting device. The radially inner through-hole of the transmission stopper 129 surrounds the transmission through-hole 128, thereby limiting and guiding the transmission rod 24 as it passes through the transmission through-hole 128.

[0048] The relay 23 can, for example, be roughly in the shape of a hollow cuboid, the length direction of which can be consistent with the first horizontal direction, and the width direction of which can be set to be perpendicular to the first horizontal direction. The follower wheel 222 can, for example, include an axle and a wheel body that can rotate freely relative to the axle. The axle can, for example, be fixed to the side of the relay 23 by bolt connection or the like, and enable the follower wheel 222 to roll on an inclined surface. In some embodiments, four follower wheels 222 can be provided on the relay 23, of which two follower wheels 222 are respectively provided on the sides facing the guide plate 21. Correspondingly, the drive assembly includes two guide plates 21 respectively arranged on both sides of the relay 23 in the transverse direction, and each guide plate 21 is provided with two guide grooves 211 corresponding to the follower wheels 222.

[0049] In some embodiments, the sealing plate 11 can be generally circular and can include multiple sealing rod holes 118 extending through the plate surface. The first valve plate assembly can include a first valve plate 31 and multiple sealing rods 351 fixedly connected to the first valve plate 31. The second valve plate assembly can include a second valve plate 32 and multiple sealing rods 351 fixedly connected to the second valve plate 32. Both the first valve plate 31 and the second valve plate 32 can be formed as generally elongated plates, with sealing holes 39 for fixed connection to the sealing rods 351 disposed on the bottom sides of their respective longitudinal ends. Each of the multiple transmission rods 24 can include a sealing through hole 242 extending axially through the transmission rod 24. The multiple sealing rods 351 are respectively disposed in the sealing through hole 242 of the corresponding transmission rod 24 and pass through the sealing rod holes 118 in the sealing plate 11 to be fixedly connected to the sealing holes 39 in the first valve plate 31 and the second valve plate 32, respectively. In some embodiments, a guide sleeve 241 is fixedly disposed within the sealing through-hole 242. The guide sleeve 241 may be, for example, a ball bearing sleeve or other component capable of vertically guiding the sealing rod 351 therein. One or more guide sleeves may be disposed within the sealing through-hole 242. For example, two guide sleeves 241 may be disposed, each located near the vertical ends of the sealing through-hole 242, thereby stably supporting and guiding the sealing rod 351.

[0050] In some embodiments, the upper side of the sealing plate 11 further forms a first accommodating cavity 310 for accommodating the first valve plate 31, and a second accommodating cavity 320 for accommodating the second valve plate 32. The first valve plate 31 and the second valve plate 32 can be at least partially retracted vertically within the corresponding first accommodating cavity 310 and the second accommodating cavity 320. The first vacuum opening 111 can be located in a portion of the sealing plate 11 corresponding to the center of the first accommodating cavity 310, while the second vacuum opening 112 can be located in a portion of the sealing plate 11 corresponding to the center of the second accommodating cavity 320. Thus, the first valve plate 31 and the second valve plate 32 can move vertically within the corresponding first accommodating cavity 310 or the second accommodating cavity 320 during operation of the equipment, opening or closing the first vacuum opening 111 or the second vacuum opening 112. They do not protrude excessively vertically, thereby interfering with wafer handling. Furthermore, the provision of the first accommodating cavity 310 and the second accommodating cavity 320 also reduces the weight of the sealing plate 11 , thereby making the device lighter and saving energy costs.

[0051] In some embodiments, the bottom surfaces of the first and second valve plates 31 and 32 may be provided with a sealing flange 329 for enclosing the first and second vacuum openings 111 and 112. The sealing flange 329 may, for example, be a vertically downwardly projecting annular protrusion. In some embodiments, the sealing flange 329 may also include a vertically downwardly projecting annular sealing groove configured to engage with a sealing member, such as a rubber sealing ring, to enhance sealing performance. In some embodiments, the outer periphery of the first and second vacuum openings 111 and 112 may also be provided with an opening boss 119 radially enclosing the first and second vacuum openings 111 and 112. The opening boss 119 protrudes vertically upward, and its upper surface is configured to abut against the sealing flange 329 on the bottom side of the first and second valve plates 31 and 32, thereby reducing the vertical distance required for the first and second valve plates 31 and 32 to move during sealing.

[0052] Both the first and second valve plate assemblies may further include a plurality of single-acting cylinders 35 vertically arranged, and compression springs 353 vertically disposed between the protruding ends of the single-acting cylinders 35 and the transmission rod 24. The fixed portion 359 of the single-acting cylinder 35 is fixedly connected to the relay plate 233. The relay plate 233 and the relay member 23 may be vertically spaced apart and fixedly connected to each other via a threaded connection or other means. The protruding ends 358 of the single-acting cylinder 35 are fixedly connected to the sealing rod 351. The upper ends of the plurality of compression springs 353 vertically abut the bottom of the transmission rod 24, while their lower ends abut the upper side of the protruding ends 358 of the single-acting cylinder 35. The sealing rod 351 extends radially inwardly of the compression springs 353 and extends into the sealing through-hole 242 of the transmission rod 24. Thus, the first valve plate 31 or the second valve plate 32 can be driven by the single-acting cylinder 35 to move upward in the vertical direction, and when the single-acting cylinder 35 is not driven, the protruding end of the single-acting cylinder 35 is pressed downward by the spring force of the compression spring 353.

[0053] In some embodiments, the central portion of the relay plate 233 is further provided with a plurality of pipe through-holes for passing vacuum tubes. For example, the relay plate 233 may include a first pipe through-hole 234 and a second pipe through-hole 235. The first pipe through-hole 234 may be used to pass through the first vacuum tube 38, while the second pipe through-hole 235 may be used to pass through the second vacuum tube 37. Thus, the connection portion between the roughing assembly 33 and the first vacuum tube 38 and the fine pumping assembly 34 may be disposed on the vertical lower side of the relay plate 233. Furthermore, since the fixing portions of the plurality of single-acting cylinders 35 are also disposed on the vertical lower side of the relay plate 233, workers can easily access and maintain the relevant pneumatic pipelines, significantly facilitating the use and maintenance of the equipment.

[0054] When the first valve plate 31 or the second valve plate 32 is driven upward by the single-acting cylinder 35, the first valve plate 31 or the second valve plate 32 separates vertically from the first vacuum opening 111 and the second vacuum opening 112, respectively, thereby opening the first vacuum opening 111 and / or the second vacuum opening 112. At this time, the second chamber 220 can be evacuated by the vacuum pump. When the single-acting cylinder 35 is not driven, the downward spring force exerted by the compression spring 353 on the extended end of the single-acting cylinder 35 drives the sealing rod 351 downward, thereby automatically sealing the first vacuum opening 111 and the second vacuum opening 112. In this way, the corresponding chamber can be sealed for a long time without consuming energy, making the equipment more energy-efficient during production and debugging, and able to cope with unexpected situations such as sudden drops in air pressure caused by sudden power outages or equipment failures.

[0055] The vacuum assembly 30 may also include a limit bracket 36 fixedly connected to the relay 23. The limit bracket 36 may be formed into a long strip with a roughly "L"-shaped cross section, for example. The limit bracket 36 may include a limit block 366 extending in the vertical direction, and a spring support portion 362 extending horizontally perpendicular to the vertical direction. In some embodiments, the first valve plate assembly and the second valve plate assembly each include two single-acting cylinders 35 for driving the valve plate to move. The first valve plate assembly also includes a first synchronization bracket 368. The protruding ends 358 of the two corresponding single-acting cylinders 35 of the first valve plate assembly are fixedly connected to the first synchronization bracket 368. Similarly, the second valve plate assembly also includes a second synchronization bracket 369. The protruding ends 358 of the two corresponding single-acting cylinders 35 of the second valve plate assembly are fixedly connected to the second synchronization bracket 369.

[0056] For example, the first synchronization bracket 368 and the second synchronization bracket 369 can be formed as two semi-annular components that can be fixed relative to each other. The ends of the two semi-annular components are connected to form a circular ring. The hollow portion of the circular ring can be used to accommodate components such as the first vacuum tube 38 or the second vacuum tube 37 located in the center of the ring. The ends of the circular ring can also be used to clamp and secure the extended ends of the two single-acting cylinders 35. This ensures more consistent extension and retraction of the two single-acting cylinders 35 corresponding to the first valve plate assembly or the second valve plate assembly, improving stability during vertical actuation.

[0057] A buffer spring 365 may be provided between the first and second synchronous brackets 368, 369 and the limiting bracket 36, and a limiting block 366 may vertically limit the first and second synchronous brackets 368, 369. Specifically, in some embodiments, the upper surfaces of the first and second synchronous brackets 368, 369 may be vertically opposed to the limiting bracket 36, such that when the first and second synchronous brackets 368, 369 are raised by the corresponding single-acting cylinders 35, their upper surfaces vertically approach the limiting bracket 36. When the first and second synchronous brackets 368, 369 rise to a predetermined height, the vertically extending limiting block 366 of the limiting bracket 36 may abut against the upper surfaces of the first and second synchronous brackets 368, 369. As a result, the lifting height of the first and second synchronous brackets 368, 369 can be limited in the vertical direction, thereby limiting the lifting height of the first and second valve plates 31, 32. At the same time, the upper surfaces of the first and second synchronous brackets 368, 369 can also face the bottom surface of the horizontally extending spring support portion 362 of the limiting bracket 36, and a vertically extending buffer spring 365 can be disposed between the upper sides of the first and second synchronous brackets 368, 369 and the lower side of the spring support portion 362.

[0058] The spring force of the buffer spring 365 can act in the same direction as the compression spring 353, thereby further increasing the sealing pressure when the first valve plate 31 and the second valve plate 32 move downward to seal. Furthermore, the buffer spring 365 can be disposed, for example, laterally inboard of two laterally spaced single-acting cylinders 35, thereby vertically pressing downward against the center portions of the first and second synchronization brackets 368 and 369, further vertically compressing the first and second synchronization brackets 368 and 369 to prevent them from shaking or tilting during operation due to lack of restraint.

[0059] See also Figure 7 , Figure 7An exemplary stereoscopic diagram of the combination of a sealing assembly and a vacuum assembly of a wafer transfer device according to some embodiments of the present disclosure is shown, with components such as a relay being shown to illustrate the connection relationship. In some embodiments, the position-limiting bracket 360 can also be configured as having only a generally elongated main body, with each position-limiting bracket 360 having two ends fixedly connected to the top ends of two vertically disposed position-limiting struts 363, while the bottom ends of the position-limiting struts are fixedly connected to a position-limiting support plate 361, which is further fixedly connected to the relay 23. Thus, the position-limiting bracket 360 is fixed relative to the relay 23 and is vertically disposed above the first synchronous bracket 368 and / or the second synchronous bracket 369. When the first synchronous bracket 368 and the second synchronous bracket 369 are raised to a predetermined height, the position-limiting bracket 360 can vertically abut against the upper surface of the first synchronous bracket 368 and / or the second synchronous bracket 369. This also allows for limiting the position of the single-acting cylinder 35. In some embodiments, the limiting bracket 360 can be made of a material with relatively low hardness, such as engineering plastics, so that the sound generated when a collision occurs between the first synchronization bracket 368 and / or the second synchronization bracket 369 and the limiting bracket 360 is smaller, which is beneficial to noise reduction of the equipment.

[0060] See again Figure 6 In some embodiments, the sealing assembly 10 may further include a sealing connection assembly, which may include, for example, multiple bellows. At least some of the bellows may be fully welded to the connecting plate 12 at one end, and fully welded to the sealing plate 11 or the first valve plate 31 and the second valve plate 32 at the other end. Thus, the multiple bellows are securely connected between the connecting plate 12, the sealing plate 11, the first valve plate 31, and the second valve plate 32, and will not loosen due to long-term, high-frequency movement and vibration during production, thereby causing sealing failure. The multiple bellows may be respectively arranged corresponding to the transmission through hole 128, the sealing rod hole 118, the sealing connection hole 39, the first vacuum opening 111, the first vacuum pipe port 121, and the second vacuum opening 112, and the second vacuum pipe port 122, so as to surround and seal them.

[0061] Specifically, the multiple transmission holes 128 on the connecting plate 12 can be aligned with the multiple sealing rod holes 118 on the sealing plate 11, respectively. The multiple sealing rod holes 118 on the sealing plate 11 can be aligned with the multiple sealing connection holes 39 on the first valve plate 31 and the second valve plate 32, respectively. The first vacuum pipe port 121 on the connecting plate 12 can be aligned with the first vacuum opening 111 on the sealing plate 11, and the second vacuum pipe port 122 on the connecting plate 12 can be aligned with the second vacuum opening 112 on the sealing plate 11. One end of the multiple first bellows 141 can be welded to the connecting plate 12, and the other end can pass through the sealing rod holes 118 of the sealing plate 11 and be welded to the first valve plate 31 or the second valve plate 32. Thus, multiple first bellows 141 can be respectively disposed around multiple groups of aligned transmission through-holes 128, sealing rod holes 118, and sealing connection holes 39 to seal the gaps between the transmission rod 24 and the transmission through-holes 128, the gaps between the sealing rod 351 and the sealing rod holes 118, and the gaps between the sealing rod 351 and the sealing connection holes 39. Similarly, second bellows 142 can be disposed around the aligned first vacuum port 121 and the first vacuum opening 111, and third bellows 143 can be disposed around the aligned second vacuum port 122 and the second vacuum opening 112. Thus, the connection between the connecting plate 12 and the sealing plate 11 is strictly sealed by the bellows welded to the connecting plate 12 and the sealing plate 11, significantly improving the airtightness of the sealing assembly 10 during use and preventing a decrease in airtightness due to component wear after prolonged use.

[0062] In some embodiments, the first bellows 141, the second bellows 142, and the third bellows 143 can each be roughly cylindrical, including at least two connecting portions spaced axially apart, and a retractable bellows body disposed between the two adjacent connecting portions. The connecting portions can be made of a material such as an easily weldable metal and can be roughly cylindrical, so as to at least partially extend axially into the corresponding holes to be welded. For example, the first bellows 141 can include three connecting portions spaced axially apart, namely, a first connecting portion 141a, a second connecting portion 141b, and a third connecting portion 141c. The first connecting portion 141a can, for example, at least partially extend into the sealing connection hole 39 of the first valve plate 31 or the second valve plate 32 and be fully welded thereto. The second connecting portion 141b can extend into the sealing rod hole 118 of the sealing plate 11 after the first bellows 141 passes through it and be fully welded thereto. Similarly, the third connecting portion 141c can at least partially extend into the transmission through-hole 128 of the connecting plate 12 and be fully welded to the transmission through-hole 128. Thus, the first bellows 141 completely circumferentially surrounds the corresponding connection gap between the transmission rod 24 and the sealing rod 351. Similarly, the second bellows 142 and the third bellows 143 can, in a similar manner to the first bellows 141, respectively surround and seal the first vacuum opening 111 and the first vacuum port 121, and the second vacuum opening 112 and the second vacuum port 122, thereby significantly improving the overall airtightness of the sealed transmission mechanism.

[0063] In the case where the first bellows 141 includes three connecting parts spaced apart in the axial direction, the first tube body between the first connecting part 141a and the second connecting part 141b can be located in the first accommodating cavity 310 or the second accommodating cavity 320 to seal the sealing rod hole 118 and the sealing connecting hole 39. The second tube body between the second connecting part 141b and the third connecting part 141c can be located between the connecting plate 12 and the sealing plate 11 to seal the transmission through hole 128 and the sealing rod hole 118. Thus, the two tube bodies of the first bellows 141 can realize the sealing function of two separate bellows, and since the two segments are formed as one piece, there is no need to connect and seal the two tube bodies by welding or the like, so the sealing performance can be further ensured. It will be understood by those skilled in the art that the present disclosure does not limit the specific structure of the sealing tube. For example, when the welding sealing effect can be guaranteed, the first tube body and the second tube body can also be set as two separate bellows.

[0064] The sealed transmission mechanism of some embodiments disclosed herein utilizes a horizontally placed drive component, and enables the drive component to abut against the transmission component via an inclined surface to drive the transmission component to move in a vertical direction. This can change the setting direction of the drive component, making the equipment layout more compact, which is conducive to the miniaturization of wafer transfer equipment.

[0065] See also Figure 8 In some embodiments, a system 300 for wafer transfer may include some of the devices 100 for wafer transfer in the above-mentioned embodiments, and the system further includes a wafer storage device 400 and a processing device 200. The wafer storage device 400 may be, for example, a front-end module (EFEM) of a device for wafer processing, which may include, for example, a wafer storage mechanism for storing multiple wafers, a wafer transport mechanism for transferring wafers, and a wafer recovery mechanism for recovering wafers after processing or inspection. The wafers 90 enter and exit the wafer storage device 400 through a wafer transfer port 410. The processing device 200 may be, for example, a device for receiving wafers and performing inspection or processing on the wafers, and may include a first chamber 210 and a second chamber 220 stacked and interconnected, a wafer receiving opening 221 for communicating with the second chamber 220 to receive the wafer 90, and a third chamber 230 for performing corresponding processing on the wafers. The third chamber 230 is connected to the first chamber 210 via a transfer window 231, and a first transfer mechanism 70 for transferring wafers between the second chamber 220 and the third chamber 230 is also provided in the third chamber 230. The wafer transfer apparatus 100 described in some embodiments of the present disclosure can be connected to the wafer storage device 400 and receive wafers transferred from the wafer storage device 400. The sealed transfer device 110 is then used to transfer the wafers between the first chamber 210 and the second chamber 220, and the wafers are then removed or returned by the first transfer mechanism 70.

[0066] See also Figures 9a to 9c , Figure 9a An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein a sealing transfer device is located at a corresponding position of the second chamber; Figure 9b An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein a sealing transfer device is located at a relay position; Figure 9c An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein the sealed transfer device is located at a position corresponding to the first chamber. In some embodiments, the sealed transfer device 110 can be driven by a drive mechanism 20 to reciprocate vertically relative to the first chamber 210 and the second chamber 220 and can move to three predetermined positions: a position corresponding to the first chamber, a position corresponding to the second chamber, and a relay position.

[0067] In some embodiments, when the sealing conveyor 110 is located at a position corresponding to the second chamber, the follower wheel 222 can be located, for example, above the inclined section 213 of the guide groove 211, or at a position corresponding to the adjustment section 214, so that the sealing conveyor 110 is vertically positioned high, thereby causing the outer periphery of the sealing plate 11 to abut against and seal the step surface 224 between the first chamber 210 and the second chamber 220. By adjusting the vertical height of the wafer support 115 on the upper side of the sealing plate 11, the wafer 90 transferred from the wafer storage device 400 can be received through the wafer receiving opening 221.

[0068] When the sealing conveyor 110 is in the intermediate position, the follower wheel 222 can, for example, be located in the middle of the inclined section 213, causing the sealing plate 11 to disengage from the stepped surface 224 and move downward into the first chamber 210. By setting the vertical height of the intermediate position, the sealing conveyor 110 can correspond to the first transfer mechanism 70 at the intermediate position, allowing the receiving portion of the first transfer mechanism 70 to move below the wafer 90 carried by the sealing conveyor 110. Alternatively, the receiving portion of the first transfer mechanism 70 can transfer the wafer 90 from the third chamber 230 to above the sealing conveyor 110. In some embodiments, the drive member 22 can be a drive member with controllable output, such as a stepper motor. By adjusting the output of the drive member 22, the guide plate 21 can be stopped and locked at a preset position after moving to the preset position. Thus, by setting the preset position, the height of the sealing conveyor 110 at the intermediate position can be determined without requiring adaptive modifications to the guide plate structure for the intermediate position.

[0069] Furthermore, when the sealed conveyor 110 is located at the position corresponding to the first chamber, the follower wheel 222 can be located, for example, below the inclined section 213, so that the sealed conveyor 110 is vertically positioned at a low position. If the sealed conveyor 110 is loaded with wafers 90 at the intermediate position, the wafers 90 will disengage from the sealed conveyor 110 during its movement to the position corresponding to the first chamber and will be supported by the receiving portion of the first transfer mechanism 70, thereby being transferred to the interior of the third chamber 230.

[0070] See also Figure 10a and Figure 10b , Figure 10a A top view of a combination of a first transfer mechanism, a second transfer mechanism, and a device for wafer transfer in a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein the wafer is placed on the upper side of the second transfer mechanism; Figure 10bA top view of a combination of a first transfer mechanism, a second transfer mechanism, and an apparatus for wafer transfer in a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein the wafer has been transferred from the second transfer mechanism to the upper side of the sealing transfer apparatus.

[0071] In some embodiments, the system for wafer transfer further includes a second transfer mechanism 80, which is disposed within the third chamber 230 and is configured to receive and transfer the wafer 90 transferred by the first transfer mechanism 70, and further move the wafer 90 to, for example, a processing position or an inspection position. The second transfer mechanism 80 may, for example, include a wafer transfer table driven by a drive device. The wafer transfer table may be provided with a plurality of wafer supports 115 to provide stable support for the wafer placed thereon. Furthermore, the second transfer mechanism 80 may, for example, include a lifting mechanism configured to drive the wafer transfer table to move between a preparation position and a receiving position. For example, in the preparation position, the lifting mechanism is lowered, allowing the receiving portion carrying the wafer to move above the wafer transfer table. In the receiving position, the wafer transfer table is lifted by the lifting mechanism, and the wafer on the receiving portion is lifted by the wafer support mechanism on the wafer transfer table. The receiving portion can be moved away from under the wafer, and the second transfer mechanism 80 then transfers the wafer to the next position.

[0072] In some embodiments, the first transfer mechanism 70 may include a rotating mechanism (not shown) and a receiving portion. For example, the first transfer mechanism 70 may include a rotating shaft, one end of which is vertically downward and connected to the rotating mechanism, and the other end of the rotating shaft is connected to two oppositely arranged receiving portions, and the two receiving portions extend in opposite directions to each other. The rotating mechanism can drive the rotating shaft to rotate, and then drive the two receiving portions to rotate to the target position at a predetermined angle to receive the wafer. When one receiving portion is aligned with the wafer transfer table, the other receiving portion can extend into the transfer window 231 and align with the wafer to be received above the sealing conveying device 110. In some embodiments, the receiving portion can be roughly sheet-shaped, and each receiving portion is provided with an avoidance groove for avoiding the wafer support 115 on the side so that the receiving portion can be rotated to the bottom of the wafer to stably receive the wafer.

[0073] Figure 11 FIG. 9 is an exemplary flow chart of a method 900 for wafer transfer according to some embodiments of the present disclosure. It is understood that the method can be combined with the above. Figure 8 The described system for wafer transfer is performed.

[0074] like Figure 11As shown in FIG, in step S901, the sealed conveyor device 110 is positioned at a position corresponding to the second chamber, and the wafer storage device 400 delivers a wafer from the wafer transfer port 410 to the second chamber 220 of the equipment, where the wafer is carried by the sealed conveyor device 110. In step S902, the vacuum assembly 30 evacuates the second chamber 220, and the sealed conveyor device 110 transfers the wafer 90 to a relay position for waiting, the relay position being located between the positions corresponding to the first chamber and the second chamber. In step S903, the first transfer mechanism 70 extends into the transfer window 231 to receive the wafer. In step S904, the sealed conveyor device 110 moves to a position corresponding to the first chamber, and the first transfer mechanism 70 receives the wafer. In step S905, the first transfer mechanism 70 carries the wafer and moves it out of the transfer window 231.

[0075] It is understandable that, according to different application scenarios, the above method may also include additional steps, alternative steps or modified steps. Figures 9a to 10b Exemplary specific steps of a method for wafer transfer according to some embodiments of the present disclosure are described.

[0076] In some embodiments, when the processing equipment 200 includes a sealing gate valve 223 for sealing and isolating the wafer receiving opening 221 of the equipment from the outside world, the sealing gate valve 223 can be opened before step 1, that is, before the wafer storage device 400 transfers the wafer 90 to the second chamber 220 of the processing equipment 200. At this time, the second chamber 220 can be filled with a protective gas such as nitrogen, and its pressure can be equal to that of the outside, such as standard atmospheric pressure. At this time, the sealing gate valve 223 can be opened normally. At this time, the sealing conveying device 110 is located at the corresponding position of the second chamber, the sealing plate 11 closes the first vacuum opening 111, the first transfer mechanism 70 is in the initial position, and both receiving parts of the first transfer mechanism 70 are located in the third chamber 230.

[0077] After step S901, that is, after the wafer 90 is transferred to the corresponding position of the second chamber, the sealing gate valve 223 can be closed to seal the second chamber 220 relative to the outside of the equipment. In some embodiments, when the equipment for wafer transfer includes a rough pumping component and a fine pumping component, the first valve plate 31 can be driven to move to open the first vacuum opening 111, and the rough pumping component 33 can be started to perform preliminary vacuuming on the second chamber 220, for example, so that the air pressure in the second chamber 220 reaches 10Pa. Furthermore, in some embodiments, after the air pressure in the second chamber 220 reaches 10Pa, a further vacuuming step can be provided, such as driving the second valve plate 32 to move and opening the second vacuum opening 112. And the fine pumping component 34 is started to further reduce the pressure of the second chamber 220, so that the air pressure in the second chamber 220 is reduced to 10 －3 Pa.

[0078] The pressure in the second chamber 220 is reduced to 10 －3 After Pa, the pressure between the vacuum first chamber 210 and the second chamber 220 is almost balanced, so that the next action in step S902 can be carried out, that is, the wafer 90 is transferred to the relay position and waited. Figure 9b , that is, the sealed conveyor 110 transfers the wafer 90 to a waiting position, which is located between the positions corresponding to the first chamber and the second chamber. By setting the height of the intermediate position, the upper surface of the wafer carrier of the sealed conveyor 110 can be at least partially lower than the transfer window 231 in the vertical direction, so that the transfer window 231 is at least partially aligned with the first chamber 210.

[0079] After step S902, that is, after the wafer 90 is moved to the relay position, step S903 can be performed. When the first transfer mechanism 70 of the device 100 for wafer transfer includes a rotating mechanism for sealing and isolating the device from the outside and a receiving portion driven to rotate by the rotating mechanism, the receiving portion can be driven to rotate and enter the first chamber 210 by the rotating mechanism. Figure 10b , that is, the rotating mechanism of the first transfer mechanism 70 is swung, for example, the receiving portion of the first transfer mechanism 70 is rotated 90 degrees to enter the transfer window 231. At this time, the receiving portion of the first transfer mechanism 70 can be moved vertically below the wafer.

[0080] After step S903, step S904 may be executed, that is, the sealing conveying device 110 is moved to the position corresponding to the first chamber (see Figure 9c The wafer is then disengaged from the wafer support member on the carrier plate of the sealing conveyor 110 and is carried by the receiving portion of the first transfer mechanism 70.

[0081] After step S904 , step S905 is executed, in which the rotating mechanism of the first transfer mechanism 70 drives the receiving portion to rotate, so that the first transfer mechanism 70 carries the wafer and moves it out of the transfer window 231 .

[0082] In addition, when the guide groove 211 of the driving assembly includes an adjustment section 214, an additional step S906 can be included before or at the same time as step S901. Before moving the sealing plate 11 to the corresponding position of the second chamber, the follower wheel 222 of the transmission assembly can be moved to the adjustment section 214, and the height of the sealing plate 11 can be fine-tuned with the help of the contact between the adjustment section 214 and the follower wheel 222, so as to obtain an ideal sealing effect.

[0083] In some embodiments, the wafer transfer apparatus 100 includes a second transfer mechanism 80, and the first transfer mechanism 70 of the device includes multiple receiving portions. When one receiving portion is aligned with the wafer transfer stage, another receiving portion can extend into the transfer window 231 and align with the wafer to be received above the carrier. In this case, an additional step S907 may be included before or simultaneously with step S905. When there is a wafer that needs to be transferred from the second transfer mechanism 80, before the first transfer mechanism 70 carries the wafer out of the transfer window 231 in step S905, the wafer transfer stage of the second transfer mechanism 80 can be moved from the receiving position to the preparatory position, so that the wafer is placed on the receiving portion of the first transfer mechanism 70 facing the third chamber 230. Then, in step S905, the wafer placed on the other receiving portion is transferred to the top of the sealed transfer device 110.

[0084] Furthermore, after step S905, an additional step S908 may be included. After the wafer to be transported is transferred to the top of the sealed conveyor 110, the sealed conveyor 110 moves to the intermediate position, and the wafer support 115 provided on its upper side lifts the wafer 90 off the receiving portion of the first transfer mechanism 70. Simultaneously, the wafer transfer table on the second transfer mechanism 80 is lifted from the preparation position to the receiving position, so that the wafer on the side of the third chamber 230 is also released from contact with the receiving portion, at which point the receiving portion can be rotated and retracted.

[0085] Furthermore, after step S906, an additional step S909 may be included. After the receiving portion is retracted, the sealing conveyor 110 further moves to a position corresponding to the second chamber, sealing the second chamber 220 relative to the first chamber 210. At this point, the first vacuum opening 111, the second vacuum opening 112, the roughing assembly 33, and the fine pumping assembly 34 are closed. Furthermore, the air pressure in the second chamber 220 is raised, for example, by using a uniform air flow mechanism, until it is consistent with the pressure outside the apparatus. The sealing gate valve 223 is then opened, allowing the wafer storage device 400 to retrieve the wafer to be delivered.

[0086] Those skilled in the art will appreciate that, in some embodiments, the aforementioned additional steps S907, S908, and S909 can actually be performed in parallel with steps S901-S905 in the manner described above. That is, in step S905, the wafers to be received and the wafers to be sent out are respectively placed on the two receiving portions of the first transfer mechanism 70. Driven by the rotating mechanism, the two receiving portions carrying the wafers can complete the movement and exchange of the positions of the two wafers through a single rotation, and in the subsequent operation of the sealed conveyor device, the wafers to be sent out are sent out according to the reverse sequence of the sealed conveyor device, so that the wafers can be sent in and out in parallel, significantly improving production efficiency. Furthermore, it is understood that steps S907, S908, and S909 can also be performed independently of steps S901-S905 to be used for one-way discharge of remaining wafers in the processing or inspection device. It is understandable that the present disclosure does not limit the order and number of executions of the multiple steps described above, and the specific steps to be adopted and the way in which they are combined shall be based on whether they can meet specific functional requirements.

[0087] Although a plurality of embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art may conceive of many modifications, changes, and alternatives without departing from the ideas and spirit of the present disclosure. It should be understood that in practicing the present disclosure, various alternatives to some of the embodiments of the present disclosure described herein may be adopted. The appended claims are intended to define the scope of protection of the present disclosure and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. A device for wafer transfer, characterized in that: The device is used for transferring a wafer (90) between a first chamber (210) and a second chamber (220) of a processing device (200), and comprises: A sealing assembly (10) comprising a sealing conveying device (110) and a connecting assembly fixedly connected to a processing device (200), the connecting assembly comprising a connecting plate (12), the conveying assembly comprising a sealing plate (11) spaced apart from the connecting plate (12) in a vertical direction, the conveying assembly being capable of moving relative to the connecting assembly in a vertical direction to convey a wafer (90) and sealing a second chamber (220) relative to a first chamber (210), the sealing plate (11) being provided with a first vacuum opening (111) and a second vacuum opening (112) penetrating the plate surface, and the connecting plate (12) being provided with a first vacuum pipe opening and a second vacuum pipe opening penetrating the plate surface; A driving mechanism (20) includes a driving assembly and a transmission assembly, wherein the driving assembly includes a driving member (22) and a guide plate (21) driven by the driving member (22) to move along a first horizontal direction, the transmission assembly includes a follower wheel (222), the transmission assembly is limited relative to the processing equipment (200) along the first horizontal direction, and is fixedly connected to the sealing plate (11), the guide plate (21) has a driving inclined surface inclined from the first horizontal direction toward the vertical direction, the guide plate (21) and the follower wheel (222) abut on the driving inclined surface, so that the movement of the guide plate (21) along the first horizontal direction drives the transmission assembly to move vertically; A vacuum assembly (30) includes a first vacuum assembly and a second vacuum assembly, wherein the first vacuum assembly includes a roughing assembly (33) connected to a first vacuum opening (111) on a sealing plate (11), and a first valve plate assembly for closing the first vacuum opening (111), and the second vacuum assembly includes a fine pumping assembly (34) connected to a second vacuum opening (112), and a second valve plate assembly for closing the second vacuum opening (112).

2. The device according to claim 1, characterized in that The guide plate (21) is provided with a guide groove (211) that cooperates with the follower wheel (222) and is inclined from a first horizontal direction toward a vertical direction. The guide groove (211) is used to drive the follower wheel (222) to move in a vertical direction when the guide plate (21) moves in the first horizontal direction.

3. The device according to claim 2, characterized in that The connecting plate (12) is provided with a plurality of transmission through holes. The transmission assembly includes a relay (23) and a plurality of transmission rods (24). The follower wheel (222) is provided on the side of the relay (23). One end of the plurality of transmission rods (24) is fixedly connected to the relay (23), and the other end passes through the transmission through hole and is fixedly connected to the sealing plate (11).

4. The device according to claim 3, characterized in that The sealing plate (11) includes a plurality of sealing rod holes 118 penetrating the plate surface, the first valve plate assembly includes a first valve plate (31) and a plurality of sealing rods (351) fixedly connected to the first valve plate (31), the second valve plate assembly includes a second valve plate (32) and a plurality of sealing rods (351) fixedly connected to the second valve plate (32), the plurality of transmission rods (24) each include a sealing through hole (242) penetrating along the axial direction, the plurality of sealing rods (351) are respectively arranged in the sealing through hole (242) of the corresponding transmission rod (24), and respectively pass through the sealing rod holes (118) on the sealing plate (11) to be fixedly connected to the first valve plate (31) and the second valve plate (32).

5. The device according to claim 4, characterized in that The first valve plate assembly and the second valve plate assembly also include a plurality of single-acting cylinders (35) arranged in a vertical direction, and a compression spring (353) fixedly arranged at the protruding end of the single-acting cylinder (35), the fixed portion (359) of the single-acting cylinder (35) is fixedly connected to the relay (23), and the upper ends of the plurality of compression springs (353) are respectively in contact with the bottom of the transmission rod (24) in the vertical direction.

6. The device according to claim 5, characterized in that The vacuum assembly (30) also includes a limit bracket (36) fixedly connected to the relay (23), and the limit bracket (36) includes a limit block (366) extending in the vertical direction. The first valve plate assembly and the second valve plate assembly each include two single-acting cylinders (35) for driving the valve plate to move. The protruding ends (358) of the two corresponding single-acting cylinders (35) of the first valve plate assembly are fixedly connected to the first synchronous bracket (368), and the protruding ends (358) of the two corresponding single-acting cylinders (35) of the second valve plate assembly are fixedly connected to the second synchronous bracket (369). A buffer spring (365) is provided between the first synchronous bracket (368) and the second synchronous bracket (369) and the limit bracket (36), and the limit block (366) limits the first synchronous bracket (368) and the second synchronous bracket (369) in the vertical direction.

7. The device according to claim 6, characterized in that The sealing assembly (10) further comprises a plurality of bellows, one end of the bellows being fully welded to the upper surface of the connecting plate (12), and the other end being fully welded to the lower surface of the sealing plate (11), and the bellows being arranged correspondingly to the transmission through hole and the sealing rod hole (118), the first vacuum opening (111) and the first vacuum pipe port, and the second vacuum opening (112) and the second vacuum pipe port, so as to surround and seal them.

8. A system for wafer transfer, characterized in that: include: a wafer storage device (400) for storing, sending out and receiving the wafer (90); a first transfer mechanism (70) for transferring a wafer (90) between a second chamber (220) and a third chamber (230) of a processing device (200); and The device for wafer transfer according to any one of claims 1 to 7, which is used to at least perform the following operations: receiving a wafer (90) sent from the wafer storage device (400); transferring the wafer (90) between the first chamber (210) and the second chamber (220) through the sealing assembly (10); and The wafer (90) is transferred between the second chamber (220) and the third chamber (230) by the first transfer mechanism (70).

9. A method for wafer transfer using the system according to claim 8, characterized in that: include: The sealing component (10) is positioned at a corresponding position of the second chamber (220), and the wafer storage device (400) sends the wafer (90) into the second chamber (220), and the wafer is carried by the sealing component (10); The sealing component (10) evacuates the second chamber (220) and transfers the wafer (90) to a relay position for waiting; The first transfer mechanism (70) extends into a transfer window (231) connecting the second chamber (220) and the third chamber (230), and moves to below the wafer (90); The sealing assembly (10) is moved to a corresponding position in the first chamber (210), and the first transfer mechanism (70) receives the wafer (90); and The first transfer mechanism (70) carries the wafer (90) and moves it out of the transfer window (231).

10. The method according to claim 9, characterized in that The method further comprises: Instructing the first transfer mechanism (70) to carry the wafer (90) to be transferred out and move it from the transfer window (231) into the first chamber (210); The sealing component (10) is moved from a corresponding position of the first chamber (210) to a relay position, and receives the wafer (90) to be sent out; moving the first transfer mechanism (70) out of the transfer window (231); and The sealing component (10) is moved from the intermediate position to a corresponding position of the second chamber (220), and the wafer storage device (400) moves the wafer (90) to be sent out from the second chamber (220).

Images