A self-cooling laser module

Abstract

The invention relates to a self-cooling laser module, comprising a packaging cavity, a heat dissipation component, a laser generating component, a heat transfer component, a porous heat conductive component, and a thermal phase change medium; wherein the interior of the packaging cavity is configured as a sealed chamber; the heat dissipation component comprises heat dissipation fins; the laser generating component comprises a pump source module and a laser gain medium; the heat transfer component comprises a first heat sink and a second heat sink, the first heat sink is thermally connected to the pump source module, and the second heat sink is thermally connected to the laser gain medium; the porous heat conductive component comprises a first porous heat conductive layer and a second porous heat conductive layer, the first porous heat conductive layer is coated on the surfaces of the first heat sink and the second heat sink, the second porous heat conductive layer is coated on the inner surface of the sealed chamber, and the cavity between the first porous heat conductive layer and the second porous heat conductive layer is configured as a phase change vaporization channel; the thermal phase change medium circulates in the porous heat conductive component and the phase change vaporization channel to perform vaporization and liquefaction processes.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation and cooling of laser modules, and in particular to a self-cooling laser module. Background Art

[0002] With the continuous development of laser technology, lasers have been widely used in many fields such as industrial processing, medical treatment, scientific research, and communications. In these applications, higher requirements are placed on the size, energy consumption, and long-term working stability of lasers. Traditional cooling and heat dissipation methods are not applicable in some specific scenarios.

[0003] Among the existing lasers, solid-state lasers have always been the mainstream application direction. Solid-state lasers are composed of three parts: pump source, working material, and resonant cavity. The pump source is responsible for providing energy, the working material is responsible for converting the energy of the pump source into laser, and the resonant cavity is responsible for providing boundary conditions to ensure the directionality and monochromaticity of the laser. There are many common pump sources for solid-state lasers, such as xenon lamps, krypton lamps, LDs, and LEDs. However, the energy emitted by the pump source cannot be completely absorbed by the working material and converted into lasers. Most of it will exist in the form of heat, which is harmful to the laser and requires a separate device to take the heat away.

[0004] Common heat dissipation methods for solid-state lasers include water cooling, air cooling, semiconductor cooling and conduction cooling. Water cooling and semiconductor cooling have high cooling efficiency, but have disadvantages such as large size, complex structure and require additional energy. Air cooling and conduction cooling methods are small in size and require little additional energy, but have the disadvantage of low cooling efficiency. They are not suitable for long-term stable working environments and are only suitable for application scenarios where lasers are emitted for a short period of time. Summary of the invention

[0005] The present invention discloses a self-cooling laser module, aiming to solve the technical problems existing in the prior art. The present invention adopts the following technical solutions:

[0006] In one embodiment of the present invention, a self-cooling laser module is provided, including a packaging cavity, a heat dissipation component, a laser generation component, a heat transfer component, a porous heat conductive component, and a thermal phase change working fluid;

[0007] The interior of the packaging cavity is configured as a sealed chamber;

[0008] The heat dissipation component is arranged on at least a part of the outer surface of the packaging cavity, and the heat dissipation component includes a plurality of heat dissipation fins arranged at intervals;

[0009] The laser generating assembly is arranged in a sealed chamber and includes a pump source module and a laser gain medium;

[0010] The heat transfer component includes a first heat sink and a second heat sink, the first heat sink is thermally connected to the pump source module, and the second heat sink is thermally connected to the laser gain medium;

[0011] The porous heat-conducting component comprises a first porous heat-conducting layer and a second porous heat-conducting layer, wherein the first porous heat-conducting layer is coated on the surfaces of the first heat sink and the second heat sink, and the second porous heat-conducting layer is coated on the inner surface of the sealed chamber, and the cavity between the first porous heat-conducting layer and the second porous heat-conducting layer is configured as a phase-change vaporization channel;

[0012] The liquid form of the thermal phase change medium is contained in the pores of the porous heat-conducting component, and the gaseous form is filled in the phase change vaporization channel. The thermal phase change medium circulates in the porous heat-conducting component and the phase change vaporization channel to perform vaporization and liquefaction processes.

[0013] As a preferred technical solution, the packaging cavity includes a first half cavity and a second half cavity, and the first half cavity and the second half cavity both include a high thermal conductivity material;

[0014] At least the first half cavity is used to accommodate the laser generating component, and at least the upper surface of the second half cavity is provided with a heat dissipation component. The first half cavity and the second half cavity are vacuum sealed.

[0015] As a preferred technical solution, the heat dissipation fins are arranged vertically in an array on the upper surface of the second half cavity, the heat dissipation fins are integrally formed with the second half cavity, and the heat dissipation fins include a high thermal conductivity material.

[0016] As a preferred technical solution, the first heat sink and the second heat sink are both configured with an internal heat conduction section and an external heat dissipation section;

[0017] The internal heat-conducting section is disposed inside the packaging cavity and is closely thermally coupled with the laser generating component;

[0018] The external heat dissipation section extends outward from both ends of the packaging cavity and is sealed and matched with both ends of the first half cavity and the second half cavity respectively, so as to enhance heat exchange with the outside.

[0019] As a preferred technical solution, at least a portion of the bottom surface of the first heat sink is tightly thermally coupled with at least a portion of the top surface of the second heat sink;

[0020] The first heat sink includes a module mating surface and a first heat conducting surface; the module mating surface is configured as a plurality of grooves at the bottom of the first heat sink, and is used for close thermal contact with the pump source module; the first heat conducting surface is configured as the top surface and the side surface of the first heat sink, and is closely fitted with the first porous heat conducting layer;

[0021] The second heat sink includes a medium channel and a second heat conduction surface; the medium channel is configured as a channel running through the middle of the second heat sink for the laser gain medium to pass through and be in close thermal contact with it; the second heat conduction surface is configured as the bottom and side surfaces of the second heat sink, which are closely matched with the first porous heat conductive layer.

[0022] As a preferred technical solution, the first heat conducting surface and the second heat conducting surface together form a continuous composite curved surface, and the first porous heat conducting layer has a shape matching the composite curved surface.

[0023] As a preferred technical solution, the thickness of the second porous thermally conductive layer is the same as or different from that of the first porous thermally conductive layer, the cross-section of the second porous thermally conductive layer is configured to be a proportional enlargement of the cross-section of the first porous thermally conductive layer or other geometric shape, and the cross-section of the phase change vaporization channel can be configured to have a uniform width or different widths.

[0024] As a preferred technical solution, the phase change vaporization channel completely covers the first porous heat-conducting layer in the axial direction and the circumferential direction to form an annular loop.

[0025] As a preferred technical solution, the first porous heat-conducting layer and the second porous heat-conducting layer are all covered with pores, and the shapes of the pores of the two are irregular polygons that are interconnected;

[0026] The average pore sizes of the first porous thermally conductive layer and the second porous thermally conductive layer may be configured to be the same or different;

[0027] The porosity of the first and second porous thermally conductive layers may be configured to be the same or different.

[0028] As a preferred technical solution, the porous heat-conducting component includes a porous heat-conducting metal material;

[0029] The thermal phase change working fluid includes methanol, ethanol or halogenated hydrocarbon refrigerant.

[0030] One embodiment of the above invention has the following advantages or beneficial effects:

[0031] The present invention mainly provides a self-cooling laser module, which includes a packaging cavity, a heat dissipation component, a laser generation component, a heat transfer component, a porous heat conductive component and a thermal phase change medium, wherein the heat transfer component is in direct contact with a heat source (i.e., the laser generation component) to ensure rapid heat conduction; the porous heat conductive component and the heat transfer component have a large-area heat exchange surface, which enhances the heat transfer efficiency while being able to store liquid thermal phase change medium; a phase change vaporization channel is provided in the porous heat conductive component, and a vaporization and liquefaction cycle process of the thermal phase change medium is utilized to achieve efficient heat transfer, and a heat dissipation fin is provided on the outside of the packaging cavity to enhance heat exchange with the environment.

[0032] Unlike traditional active cooling methods, the embodiments of the present invention can achieve continuous heat transfer without external energy input. By utilizing the thermal phase change working fluid circulation in a closed system and combining it with a porous heat-conducting component, an efficient self-driven cooling system is created. Driven by the heat generated by the laser component, the thermal phase change working fluid spontaneously circulates between the porous heat-conducting layer and the phase change vaporization channel, and effectively transfers heat from the heat source to the heat dissipation area through the vaporization heat absorption and liquefaction heat release process. This self-cooling mechanism improves the energy efficiency of the system, reduces dependence on external cooling equipment, reduces mechanical components, improves the reliability and life of the system, and also makes the structure of the entire laser module more compact, which is particularly suitable for application scenarios with limited space. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments, which constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions explain the present invention and do not constitute improper limitations on the present invention. In the drawings:

[0034] Figure 1 A schematic structural diagram of a self-cooling laser module in a preferred implementation manner disclosed in an embodiment of the present invention;

[0035] Figure 2 This is a structural exploded view of a self-cooling laser module in a preferred implementation manner disclosed in an embodiment of the present invention;

[0036] Figure 3 A front view of a self-cooling laser module in a preferred embodiment disclosed in an embodiment of the present invention;

[0037] Figure 4 for Figure 3 AA-direction three-dimensional cross-section diagram;

[0038] Figure 5 A side view of a self-cooling laser module in a preferred embodiment disclosed in an embodiment of the present invention;

[0039] Figure 6 for Figure 5 BB-direction three-dimensional cross-sectional view.

[0040] Description of reference numerals:

[0041] Packaging cavity 10, first half cavity 11, second half cavity 12, heat dissipation assembly 20, pump source module 30, laser gain medium 40, first heat sink 50, first internal heat conduction section 51, first heat conduction surface 52, first external heat dissipation section 53, second heat sink 60, second internal heat conduction section 61, second heat conduction surface 62, second external heat dissipation section 63, first porous heat conductive layer 70, second porous heat conductive layer 80, phase change vaporization channel 90. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. In the description of the present invention, it should be noted that the term "or" is usually used in the sense of including "and / or", unless the content clearly indicates otherwise.

[0043] In the description of the present invention, the terms “first”, “second”, etc. are only used to distinguish the descriptions and should not be understood as indicating or implying relative importance.

[0044] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Existing laser module cooling technology usually relies on an external active cooling system, but the existing technology often fails to take into account both cooling efficiency and lightweight application requirements. To address the various drawbacks of the existing technology, an embodiment of the present invention provides a self-cooling laser module, which reduces dependence on external cooling equipment while efficiently dissipating heat, and also achieves miniaturization and compactness of the structure.

[0046] like Figure 1 — Figure 6 Preferably, the self-cooling laser module includes a packaging cavity 10, a heat dissipation component 20, a laser generating component, a heat transfer component, a porous thermal conductive component and a thermal phase change medium. The interior of the packaging cavity 10 is configured as a sealed chamber. Except for the heat dissipation component 20, other components are arranged inside the sealed chamber, from the inside to the outside, they are the laser generating component, the heat transfer component and the porous thermal conductive component. A phase change vaporization channel 90 is provided in the porous thermal conductive component, and the thermal phase change medium circulates in the porous thermal conductive component and the phase change vaporization channel 90 to perform a vaporization and liquefaction process; the heat dissipation component 20 is arranged on at least a portion of the outer surface of the packaging cavity 10, and is used for the self-cooling laser module to directly exchange heat with the external environment.

[0047] In a preferred embodiment, the laser generating component is disposed in a sealed chamber, and includes a pump source module 30 and a laser gain medium 40, wherein the pump source module 30 is used to convert electrical energy into light energy, and the laser gain medium 40 is used to absorb the light emitted by the pump source and convert part of the energy into laser.

[0048] In a preferred embodiment, the pump source module 30 includes one or more semiconductor laser diodes (LD) or LD arrays for directly converting electrical energy into light energy. In this embodiment, the specific quantity, specifications and output parameters of the pump source module 30 are no longer specifically limited, and those skilled in the art can freely adjust them as needed.

[0049] In a preferred embodiment, the laser gain medium 40 is configured as a slender columnar structure, which can be a solid rod, an optical fiber or a flat plate. After absorbing the pump light, the active ions inside the laser gain medium 40 are excited to a high energy level. When these ions fall back to a low energy level, they release photons with a specific wavelength to form a laser. The wavelength of the generated laser depends on the selected gain medium material. In this embodiment, the specific material and size of the laser gain medium 40 are not specifically limited.

[0050] On the one hand, the electro-optical conversion efficiency of the pump source module 30 is between 40% and 60%, so 40%-60% of the input electrical energy will be converted into heat, and the performance and life of the pump source module 30 are very sensitive to temperature. Excessive temperature will cause output power to drop, wavelength drift, or even permanent damage; on the other hand, since the conversion efficiency of the laser gain medium 40 is not 100%, part of the absorbed pump light energy is converted into laser, and the rest is converted into heat. The increase in temperature will cause a thermal lens effect inside the laser gain medium 40, affecting the quality and stability of the laser beam. In addition, the increase in temperature will cause the laser gain to drop, affecting the output power and efficiency.

[0051] From the above, it can be seen that in order to ensure that the entire laser module can operate at a stable temperature to ensure the consistency and reliability of the output and the efficiency of the operation, the laser generating components need to be effectively cooled.

[0052] In a preferred embodiment, the heat transfer component is used to increase the surface area of ​​heat transfer, thereby accelerating the conduction of heat and the dissipation of heat to the surrounding environment, and preventing the laser generating component from overheating; the heat transfer component includes a first heat sink 50 and a second heat sink 60, wherein the first heat sink 50 is thermally connected to the pump source module 30 and serves as its supporting structure, and the second heat sink 60 is thermally connected to the laser gain medium 40 and serves as its supporting structure.

[0053] In a preferred embodiment, the first heat sink 50 and the second heat sink 60 may be made of the same or different materials, and the optional materials include aluminum and its alloys, copper and its alloys, or other composite materials, which are not specifically limited in this embodiment.

[0054] like Figure 2 — Figure 4In a preferred embodiment, the first heat sink 50 and the second heat sink 60 are both configured with an internal heat conduction section and an external heat dissipation section. The internal heat conduction section is arranged inside the packaging cavity 10, and can absorb the heat generated by the laser generating component and transfer heat to the porous heat conduction component, while the external heat dissipation section extends outward from both ends of the packaging cavity 10 and can directly exchange heat with the outside to enhance the heat dissipation effect.

[0055] In a preferred embodiment, the internal heat conductive section of the first heat sink 50 is defined as a first internal heat conductive section 51, and the first internal heat conductive section 51 is tightly thermally coupled with the pump source module 30. Specifically, the first internal heat conductive section 51 includes a module mating surface and a first heat conductive surface 52. The module mating surface is configured as a partial plane or groove at the bottom of the first heat sink 50, which is used to fit tightly with the pump source module 30 to increase the thermal contact area between the two; the first heat conductive surface 52 is configured as the top surface and side surface of the first heat sink 50, which is used to fit tightly with the porous heat conductive component.

[0056] Preferably, the module mating surface can be directly in contact with the pump source module 30 , and a high thermal conductivity silicone grease or a thermal conductive gasket can be used to fill the tiny gap between the pump source module 30 and the first heat sink 50 .

[0057] In a preferred embodiment, the internal heat-conducting section of the second heat sink 60 is defined as a second internal heat-conducting section 61, and the second internal heat-conducting section 61 is tightly thermally coupled with the laser gain medium 40. Specifically, the second internal heat-conducting section 61 includes a medium channel and a second heat-conducting surface 62. The medium channel is configured as a channel axially penetrating the second heat sink 60 for the laser gain medium 40 to pass through and fit tightly therewith to increase the thermal contact area between the two. The second heat-conducting surface 62 is configured as the bottom and side surfaces of the second heat sink 60, and is also used to fit tightly with the porous heat-conducting component.

[0058] Preferably, the medium channel is a cylindrical channel that matches the shape and size of the laser gain medium 40; the laser gain medium 40 can be directly abutted against the medium channel, or liquid metal or high thermal conductivity epoxy resin can be used to fill the gap between the laser gain medium 40 and the medium channel.

[0059] In a preferred embodiment, both ends of the laser gain medium 40 extend outward from both ends of the medium channel for coupling with other optical elements. In this embodiment, the specific optical elements coupled thereto are no longer limited, but preferably, at least both ends of the medium channel are sealed and connected to the laser gain medium 40 to ensure the sealing of the entire packaging cavity 10.

[0060] In a preferred embodiment, at least a portion of the bottom surface of the first heat sink 50 is tightly thermally coupled with at least a portion of the top surface of the second heat sink 60. Through the thermal coupling between the two, heat redistribution between the two heat sources (i.e., the pump source module 30 and the laser gain medium 40) is achieved. If the heat load of one component is temporarily high, the excess heat can be partially transferred to the other heat sink to balance the overall heat load, so that the temperature distribution of the entire system is more uniform, which helps to reduce the formation of local hot spots and improve the overall heat dissipation efficiency.

[0061] In a preferred embodiment, the external heat dissipation section is the two axial end faces of the first heat sink 50 and the second heat sink 60, and the axial ends of the packaging cavity 10 have a receiving area for the external heat dissipation section to be exposed outward. The external heat dissipation section is sealed and matched with the receiving area at both ends of the packaging cavity 10. The external heat dissipation section of the first heat sink 50 is defined as a first external heat dissipation section 53, and the external heat dissipation section of the second heat sink 60 is defined as a second external heat dissipation section 63. The first external heat dissipation section 53 and the second external heat dissipation section 63 are coplanar, and the two are coplanar with the two ends of the packaging cavity 10, which improves the heat dissipation efficiency while reducing the additional space requirements, which is conducive to the miniaturization of the entire laser module. In addition, the sealing cooperation between the external heat dissipation section and the packaging cavity 10 ensures the sealed isolation of the internal environment, which is conducive to maintaining the vacuum of the sealed chamber.

[0062] In a preferred embodiment, the porous thermal conductive component includes a first porous thermal conductive layer 70 and a second porous thermal conductive layer 80, the first porous thermal conductive layer 70 is coated on the surface of the first heat sink 50 and the second heat sink 60, the second porous thermal conductive layer 80 is coated on the inner surface of the sealed chamber, and the cavity between the first porous thermal conductive layer 70 and the second porous thermal conductive layer 80 is configured as a phase change vaporization channel 90; the liquid form of the thermal phase change medium is accommodated in the pores of the porous thermal conductive component, and the gaseous form of the thermal phase change medium is filled in the phase change vaporization channel 90, and the thermal phase change medium circulates in the porous thermal conductive component and the phase change vaporization channel 90 to perform vaporization and liquefaction processes.

[0063] In a preferred embodiment, the first porous heat conductive layer 70 is closely attached to the first heat conductive surface 52 and the second heat conductive surface 62. More preferably, the first heat conductive surface 52 and the second heat conductive surface 62 together form a continuous composite curved surface to eliminate discontinuity in the heat transfer path, which helps to distribute heat more evenly and improve the overall heat conduction efficiency. The first porous heat conductive layer 70 has a shape matching the composite curved surface to ensure that the two have a maximum contact area, thereby improving the efficiency of heat transfer.

[0064] like Figure 6In a preferred embodiment, the cross section of the second porous heat-conducting layer 80 is configured to be a proportional enlargement of the cross section of the first porous heat-conducting layer 70. Matching this, the cross section of the sealed chamber is also a proportional enlargement of the cross section of the first porous heat-conducting layer 70, ensuring that the second porous heat-conducting layer 80 can fit tightly with the inner surface of the sealed chamber, ensuring the maximum heat transfer area and improving the overall heat conduction efficiency. At this time, the phase change vaporization channel 90 completely covers the first porous heat-conducting layer 70 in the axial and circumferential directions to form an annular loop.

[0065] In a preferred embodiment, the cross-section of the phase change vaporization channel 90 has a uniform width. After the phase change vaporization channel 90 is configured as a ring loop with uniform width, it helps to optimize the flow characteristics of the thermal phase change working fluid, so that the gaseous thermal phase change working fluid can be evenly distributed and flowed, thereby improving the efficiency of the thermal phase change cycle and ensuring uniform distribution of heat in the entire porous heat conductive component.

[0066] In another preferred embodiment, the cross-section of the phase change vaporization channel 90 may not have a uniform width to adapt to the shape of a specific sealed chamber or the first heat sink 50 and the second heat sink 60. In this case, the cross-section of the second porous thermal conductive layer 80 is no longer a proportional enlargement of the cross-section of the first porous thermal conductive layer 70, but other geometric shapes.

[0067] Preferably, the thickness of the second porous thermally conductive layer 80 is the same as or different from that of the first porous thermally conductive layer 70. In this embodiment, the thickness relationship and specific thickness of the two are not specifically limited. Those skilled in the art can adjust the thickness of the corresponding area or the corresponding porous thermally conductive layer according to the heat load requirements of different parts.

[0068] In a preferred embodiment, the first porous heat-conducting layer 70 and the second porous heat-conducting layer 80 are all covered with pores, and the pores of the two are irregular polygons that are interconnected, so as to enhance the capillary effect, and at the same time, it is conducive to storing more liquid thermal phase change medium, and it can also make it flow autonomously in the porous structure, thereby improving the heat transfer efficiency. In addition, the irregular polygonal pores can greatly increase the internal surface area, and the increased surface area is conducive to the heat exchange and phase change process.

[0069] Preferably, the average pore sizes of the first porous thermally conductive layer 70 and the second porous thermally conductive layer 80 can be configured to be the same or different, and the porosities of the first porous thermally conductive layer 70 and the second porous thermally conductive layer 80 can be configured to be the same or different. Specifically, the pore structure can be optimized according to different phase change processes (such as evaporation and condensation).

[0070] On the one hand, different porosities allow the storage capacity of the thermal phase change working fluid to be adjusted; since the first porous thermal conductive layer 70 is mainly used for evaporation and storage of liquid thermal phase change working fluid, it can be configured with a higher porosity, and the second porous thermal conductive layer 80 is mainly used for condensation of gaseous thermal phase change working fluid, it can be configured with a lower porosity.

[0071] On the other hand, different pore sizes can generate different capillary forces, affecting the flow of the thermal phase change medium. Since the first porous thermal conductive layer 70 is close to the heat source, the first porous thermal conductive layer 70 can be configured with a larger average pore size, which is not only beneficial to reduce the resistance to liquid flow and the circulation of the medium, but also can improve the evaporation efficiency of the thermal phase change medium. Alternatively, the second porous thermal conductive layer 80 can be configured with a larger average pore size to provide more space for the steam to flow quickly and enhance the cooling efficiency.

[0072] In a preferred embodiment, the filling amount of the liquid thermal phase change medium is within 70% of the porous space inside the first porous heat conductive layer 70, which is not specifically limited in this embodiment.

[0073] In a preferred embodiment, the porous heat-conducting component can be selected from materials such as porous copper, porous aluminum, porous nickel, porous titanium, porous stainless steel, etc., preferably foam copper, which has higher thermal conductivity and good processing performance; the thermal phase change working fluid can be selected from one of water, methanol, ethanol or halogenated hydrocarbon refrigerant (Freon), which is not specifically limited in this embodiment. Those skilled in the art can select one or another suitable working fluid according to the thermal phase change working fluid.

[0074] In a preferred embodiment, the packaging cavity 10 is composed of a first half cavity 11 and a second half cavity 12, both of which are made of high thermal conductivity materials, such as copper. The first half cavity 11 is arranged at the bottom, and the second half cavity 12 is arranged at the top, and is vacuum sealed. At this time, the entire sealed chamber is a vacuum environment, and the boiling point of the thermal phase change medium will be reduced, which allows the thermal phase change medium to start working at a lower temperature, thereby improving the thermal management efficiency and thermal response speed.

[0075] In a preferred embodiment, the first half cavity 11 has a larger volume, and at least the first half cavity 11 is used to accommodate the laser generating component. The heat dissipation component 20 is at least arranged on the upper surface of the second half cavity 12, so that heat is transferred from the heat source below to the heat dissipation component 20 above, conforming to the natural flow direction of the hot air flow. Moreover, due to the rising tendency of hot air, the speed of the air flow will naturally increase when passing through the heat dissipation component 20. A faster air flow speed means a higher convection heat transfer coefficient, thereby improving the heat dissipation efficiency.

[0076] In a preferred embodiment, the heat dissipation assembly 20 includes a plurality of heat dissipation fins arranged at intervals, and the heat dissipation fins are arranged vertically in an array on the upper surface of the second half cavity 12 to increase the heat dissipation surface area and improve the heat dissipation efficiency; more preferably, the heat dissipation fins are integrally formed with the second half cavity 12 to reduce the thermal resistance caused by the material interface, and the heat dissipation fins are made of a material with a high thermal conductivity coefficient, and the same material as the second half cavity 12, such as copper, can be selected.

[0077] In the above embodiment, the working principle of the self-cooling laser module is as follows:

[0078] During the operation of the pump source module 30 and the laser gain medium 40, most of the energy will exist in the form of heat. This part of heat can be transferred to the first heat sink 50 and the second heat sink 60. The first heat sink 50 and the second heat sink 60 are wrapped by a porous heat-conducting component containing a thermal phase change medium. The porous heat-conducting component is in a vacuum space, which serves as a vaporization phase change environment and evaporation area of ​​the thermal phase change medium. The heat is quickly taken away by the evaporation of the thermal phase change medium. The evaporated thermal phase change medium condenses on the second porous heat-conducting layer 80, and conducts the heat to the packaging cavity 10 and the heat dissipation component 20, and then the heat dissipation component 20 conducts the heat to the ambient air. The porous heat-conducting component can form a circulation of the thermal phase change working fluid. The liquid thermal phase change working fluid returns to the inner side of the first porous heat-conducting layer 70 in contact with the first heat sink 50 and the second heat sink 60 through the pores, forming a gas and liquid circulation. This process does not require external power and no additional power consumption is generated. The vaporization and liquefaction process of the thermal phase change working fluid is efficient and fast, and can achieve a rapid self-cooling effect of the laser module.

[0079] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0080] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0081] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various inventive aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features clearly stated in each claim. More specifically, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with features less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0082] It will be understood by those skilled in the art that, except for mutually exclusive features, all features disclosed in this specification (including the accompanying claims, abstract and drawings) and all processes or units of any method or device disclosed in this specification may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose.

Claims

1. A self-cooling laser module, characterized in that: It includes a packaging cavity, a heat dissipation component, a laser generation component, a heat transfer component, a porous heat conduction component, and a thermal phase change working fluid; The interior of the packaging cavity is configured as a sealed chamber; The heat dissipation component is arranged on at least a portion of the outer surface of the packaging cavity, and the heat dissipation component includes a plurality of heat dissipation fins arranged at intervals; The laser generating assembly is disposed in the sealed chamber and includes a pump source module and a laser gain medium; The heat transfer component comprises a first heat sink and a second heat sink, wherein the first heat sink is thermally connected to the pump source module, and the second heat sink is thermally connected to the laser gain medium; The porous heat-conducting component comprises a first porous heat-conducting layer and a second porous heat-conducting layer, wherein the first porous heat-conducting layer is coated on the surfaces of the first heat sink and the second heat sink, and the second porous heat-conducting layer is coated on the inner surface of the sealed chamber, and the cavity between the first porous heat-conducting layer and the second porous heat-conducting layer is configured as a phase-change vaporization channel; The liquid form of the thermal phase change medium is contained in the pores of the porous heat-conducting component, and the gaseous form is filled in the phase change vaporization channel. The thermal phase change medium circulates in the porous heat-conducting component and the phase change vaporization channel to perform vaporization and liquefaction processes.

2. The self-cooling laser module according to claim 1, characterized in that: The packaging cavity comprises a first half cavity and a second half cavity, and the first half cavity and the second half cavity both comprise a high thermal conductivity material; At least the first half cavity is used to accommodate the laser generating component, at least the upper surface of the second half cavity is provided with the heat dissipation component, and the first half cavity and the second half cavity are vacuum-sealed.

3. The self-cooling laser module according to claim 2, characterized in that: The heat dissipation fins are arranged vertically on the upper surface of the second half cavity in an array shape, the heat dissipation fins are integrally formed with the second half cavity, and the heat dissipation fins include a material with a high thermal conductivity coefficient.

4. The self-cooling laser module according to claim 2, characterized in that: The first heat sink and the second heat sink are both configured with an internal heat conduction section and an external heat dissipation section; The internal heat-conducting section is disposed inside the packaging cavity and is tightly thermally coupled with the laser generating component; The external heat dissipation section extends outward from both ends of the packaging cavity and is respectively sealed with both ends of the first half cavity and the second half cavity to enhance heat exchange with the outside.

5. The self-cooling laser module according to claim 4, characterized in that: At least a portion of the bottom surface of the first heat sink is tightly thermally coupled to at least a portion of the top surface of the second heat sink; The first heat sink includes a module mating surface and a first heat conducting surface; the module mating surface is configured as a plurality of grooves at the bottom of the first heat sink, and is used for close thermal contact with the pump source module; the first heat conducting surface is configured as the top surface and the side surface of the first heat sink, and is closely attached to the first porous heat conducting layer; The second heat sink includes a medium channel and a second heat conduction surface; the medium channel is configured as a channel that runs through the middle of the second heat sink so that the laser gain medium can pass through and be in close thermal contact with it; the second heat conduction surface is configured as the bottom and side surfaces of the second heat sink, which are tightly matched with the first porous heat conductive layer.

6. The self-cooling laser module according to claim 5, characterized in that: The first heat conducting surface and the second heat conducting surface together form a continuous composite curved surface, and the first porous heat conducting layer has a shape matching the composite curved surface.

7. The self-cooling laser module according to claim 6, characterized in that: The second porous thermally conductive layer has the same or different thickness as the first porous thermally conductive layer, the cross section of the second porous thermally conductive layer is configured to be a proportional enlargement of the cross section of the first porous thermally conductive layer or other geometric shape, and the cross section of the phase change vaporization channel can be configured to have a uniform width or different widths at different locations.

8. The self-cooling laser module according to claim 7, characterized in that: The phase-change vaporization channel completely covers the first porous heat-conducting layer in the axial direction and the circumferential direction to form an annular loop.

9. The self-cooling laser module according to claim 1, characterized in that: The first porous heat-conducting layer and the second porous heat-conducting layer are all covered with pores, and the shapes of the pores of the two are irregular polygons that are interconnected; The average pore sizes of the first porous thermally conductive layer and the second porous thermally conductive layer may be configured to be the same or different; The porosity of the first porous thermally conductive layer and the second porous thermally conductive layer may be configured to be the same or different.

10. The self-cooling laser module according to any one of claims 1 to 9, characterized in that: The porous heat-conducting component comprises a porous heat-conducting metal material; The thermal phase change working fluid includes methanol, ethanol or halogenated hydrocarbon refrigerant.

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