High-frequency carrier plate and manufacturing method

Abstract

The invention provides a high-frequency carrier plate and a manufacturing method. The high-frequency carrier plate comprises a first copper foil layer, a first PP layer, a first LCP layer, a first bonding layer, a core plate layer, a second bonding layer, a second LCP layer, a second PP layer and a second copper foil layer which are sequentially stacked in the height direction. The LCP layer is matched with the PP layer, so that the loss of high-frequency signals in the transmission process is reduced, and the transmission quality of the high-frequency signals is improved; and the glass fiber reinforced PP layer is arranged, and meanwhile, the insulation effect of the PP layer is improved through glass fibers, so that the problem of short circuit of the PCB is avoided. The PP layer is arranged on the outer side of the LCP layer, deformation of the LCP layer under the influence of the welding temperature is avoided, meanwhile, glass fibers of the glass fiber reinforced PP layer are used for supporting the copper foil layer, and the supporting performance of the high-frequency carrier plate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to a high-frequency carrier board and a manufacturing method thereof. Background Art

[0002] With the continuous advancement of communication technology, especially the widespread application of the fifth generation mobile communication technology (5G), the signal frequency design of electronic equipment is getting higher and higher, which puts higher performance requirements on PCB boards used in key facilities such as base stations. These include increasing data rates, reducing delays, saving energy, reducing costs, and increasing system capacity and the ability to connect large-scale devices. In order to meet these performance requirements, high-frequency PCB boards, as carriers of electronic equipment components, play an important role in high-frequency signal integrity. The thickness uniformity of the dielectric layer of high-frequency PCB boards plays a key role in controlling the impedance of the circuit, reducing signal reflection and loss, and ensuring signal integrity. If the dielectric thickness is uneven, it will lead to inconsistent impedance, which will affect the transmission speed and quality of the signal.

[0003] A patent document in China with application number 201721728098.8 and announcement date 2018.10.26 discloses a PCB board coated with a blue glue layer; including a first solder resist layer, a first copper foil layer, a first PP layer, a first core board layer, a second PP layer, a second core board layer, a third PP layer and a second copper foil layer; the first solder resist layer, the first copper foil layer, the first PP layer, the first core board layer, the second PP layer, the second core board layer, the third PP layer and the second copper foil layer are provided with penetrating conductive through holes, and the conductive through holes are used to form electrical conduction between the first copper foil layer, the first core board layer, the second core board layer and the second copper foil layer.

[0004] The fluidity of the PP layer is large. During lamination, the dielectric thickness at different positions of the PP layer is inconsistent. The dielectric thickness in the middle area of ​​the PP layer is greater than that in the edge area, which results in poor dielectric thickness uniformity. Due to the inconsistent dielectric thickness at different positions of the PP layer, the propagation path of the high-frequency signal in the PP layer changes, causing the high-frequency signal to reflect, which increases the loss of the high-frequency signal during transmission. This affects the transmission quality and integrity of the high-frequency signal. When multiple PP layers are stacked on each other, the dielectric thickness uniformity of the PCB board is further reduced due to the superposition of the multiple PP layers. This further increases the loss of the high-frequency signal during transmission, resulting in reduced transmission quality of the high-frequency signal. Summary of the invention

[0005] In view of this, the purpose of the present invention is to provide a high-frequency carrier board, which reduces the loss of high-frequency signals during transmission and improves the transmission quality and efficiency of high-frequency signals by cooperating with the LCP core board layer and the PP layer.

[0006] In order to solve the above technical problems, the technical solution used in the present invention is:

[0007] A high-frequency carrier board described in the present invention comprises a first copper foil layer, a first PP layer, a first LCP layer, a first adhesive layer, a core board layer, a second adhesive layer, a second LCP layer, a second PP layer and a second copper foil layer which are sequentially stacked in the height direction;.

[0008] Preferably, the first PP layer and the second PP layer are both glass fiber reinforced PP layers.

[0009] Preferably, both the first adhesive layer and the second adhesive layer are pure adhesive layers.

[0010] Preferably, the dielectric thickness of the first adhesive layer and the dielectric thickness of the second adhesive layer are consistent.

[0011] Preferably, the core board layer is a core board layer.

[0012] Preferably, the thickness of the first PP layer and the second PP layer are both greater than the thickness of the first LCP layer and the second LCP layer.

[0013] Preferably, the thickness of the first PP layer and the second PP layer are both 47-49 μm; the thickness of the first LCP layer and the second LCP layer are both 24-26 μm.

[0014] Preferably, the thickness of the first adhesive layer and the second adhesive layer is 24-26 μm.

[0015] Another object of the present invention is to provide a method for manufacturing a high-frequency carrier, comprising the following steps: using PP glue to press and bond the second LCP layer and the second copper foil layer to form a second PP layer between the second LCP layer and the second copper foil layer; then using pure glue to press and bond the core board layer and the second LCP layer to form a second bonding layer between the core board layer and the second LCP layer; then using pure glue to press and bond the first LCP layer and the core board layer to form a first bonding layer between the first LCP layer and the core board layer; then using PP glue to press and bond the first copper foil layer and the first LCP layer to form a first PP layer between the first copper foil layer and the first LCP layer.

[0016] Preferably, before bonding the first copper foil layer, the first LCP layer, the core board layer, the second LCP layer and the second copper foil layer, the second copper foil layer is first etched to obtain a circuit layer; and then the first LCP layer, the core board layer and the second LCP layer are cleaned.

[0017] Compared with the prior art, the beneficial effects of the high-frequency carrier board described in the present invention are mainly reflected in:

[0018] The first PP layer is stacked with the first LCP layer, and the second LCP layer is stacked with the second PP layer; the LCP layer and the PP layer are stacked, and through the interaction between the LCP layer and the PP layer, the support of the high-frequency carrier board is improved while the high-frequency signal transmission loss is reduced.

[0019] Due to the low dielectric constant and dielectric loss of the LCP layer, the loss of high-frequency signals transmitted in the high-frequency carrier is reduced by laminating the LCP layer with the PP layer. This reduces the attenuation of the signal during transmission, thereby improving the transmission efficiency and quality of the high-frequency signal.

[0020] At the same time, the dielectric thickness uniformity of the LCP layer is better than that of the PP layer. The LCP layer is set to reduce the reflection of the high-frequency signal in the high-frequency carrier, thereby further reducing the transmission loss of the high-frequency signal. By setting the pure rubber layer and the PP layer to reduce the number of PP layers and reduce the superposition effect of adjacent PP layers, the influence of the PP layer on the overall loss is further reduced.

[0021] By setting the first adhesive layer and the second adhesive layer to have the same dielectric thickness, reflection of high-frequency signals in the first adhesive layer and the second adhesive layer is reduced, and thus the transmission loss of high-frequency signals in the first adhesive layer and the second adhesive layer is further reduced.

[0022] A glass fiber reinforced PP layer is set up, and the glass fiber of the glass fiber reinforced PP layer is used to improve the support of the high-frequency carrier board; the glass fiber supports the copper foil layer to prevent the copper foil layer from deforming during welding; at the same time, the glass fiber improves the insulation effect of the PP layer to avoid short circuit problems on the PCB board. The PP layer is set outside the LCP layer to prevent the LCP layer from deforming under the influence of welding temperature, and then the welding quality of the device can be guaranteed when the high-frequency carrier board is used to weld it into a device. The thickness of the PP layer is greater than that of the LCP layer. The PP layer is used to enhance the protection of the LCP layer and improve the support effect of the copper foil layer.

[0023] Compared with the prior art, the beneficial effects of the method for manufacturing a high-frequency carrier board described in the present invention are mainly reflected in: the PP glue and the pure glue are respectively formed into a PP layer and a pure glue layer by lamination, so that the surfaces of the first PP layer, the second PP layer, the first adhesive layer and the second adhesive layer are smooth and flat, and at the same time, the connecting surfaces between the LCP layer and the PP layer, and between the LCP layer and the pure glue layer are also smooth and flat; this ensures the transmission performance of high-frequency signals.

[0024] The present invention solves the problems of uneven dielectric thickness and loss of high-frequency signal transmission by cooperating the LCP layer, the pure rubber layer and the PP layer, thereby improving the transmission quality and transmission frequency of the high-frequency signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other purposes, features and advantages of the present invention will become more clear by more specific description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals indicate the same parts in all the accompanying drawings, and the accompanying drawings are not deliberately scaled to the actual size, and the focus is on illustrating the main purpose of the present invention.

[0026] Figure 1 Schematic diagram of the high frequency carrier board of the present invention.

[0027] Description of the drawings: first copper foil layer 1, first PP layer 2, first LCP layer 3, first adhesive layer 4, core board layer 5, second adhesive layer 6, second LCP layer 7, second PP layer 8, second copper foil layer 9. DETAILED DESCRIPTION

[0028] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it. However, the embodiments cited are not intended to limit the present invention. In the present embodiment, it should be understood that the orientations or positional relationships indicated by terms such as "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", and "outside" are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0029] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element and integrated therewith, or there may be an intermediate element at the same time. The terms "installed", "one end", "the other end" and similar expressions used in the present invention are for illustrative purposes only.

[0030] This embodiment provides a high-frequency carrier board, such as Figure 1 As shown, it includes a first copper foil layer 1, a first PP layer 2, a first LCP layer 3, a first adhesive layer 4, a core board layer 5, a second adhesive layer 6, a second LCP layer 7, a second PP layer 8 and a second copper foil layer 9 which are sequentially stacked along the height direction.

[0031] The first PP layer 2 is stacked with the first LCP layer 3, and the second LCP layer 7 is stacked with the second PP layer 8; the LCP layer and the PP layer are stacked, and through the interaction between the LCP layer and the PP layer, the support of the high-frequency carrier board is improved while the high-frequency signal transmission loss is reduced.

[0032] Due to the low dielectric constant and dielectric loss of the LCP layer, the loss of high-frequency signals during transmission is reduced by laminating the LCP layer with the PP layer, which reduces the attenuation of the signal during transmission, thereby improving the transmission efficiency and quality of the high-frequency signal.

[0033] The first adhesive layer 4 and the second adhesive layer 6 are both pure adhesive layers. By providing the pure adhesive layer and the PP layer to cooperate with each other, the number of PP layers is reduced, and the superposition effect of adjacent PP layers is reduced, so that the effect of the PP layer on the overall loss is further reduced.

[0034] In a preferred embodiment, the dielectric thickness at different positions of the first adhesive layer 4 and the second adhesive layer 6 is consistent. By setting the first adhesive layer 5 and the second adhesive layer 6 with consistent dielectric thickness, the reflection of the high-frequency signal in the first adhesive layer 5 and the second adhesive layer 6 is reduced, and then the loss of the high-frequency signal transmitted in the first adhesive layer 5 and the second adhesive layer 6 is further reduced.

[0035] The first PP layer 2 and the second PP layer 8 are both glass fiber reinforced PP layers. The glass fiber reinforced PP layer is provided to enhance the support of the high-frequency carrier by using the glass fiber of the glass fiber reinforced PP layer; the glass fiber supports the copper foil layer to prevent the copper foil layer from deforming during welding; at the same time, the glass fiber enhances the insulation effect of the PP layer to avoid short circuit problems on the PCB board. The PP layer is provided outside the LCP layer to avoid deformation of the LCP layer under the influence of welding temperature, and then the welding quality of the device can be guaranteed when the high-frequency carrier is used to weld the device.

[0036] The thickness of the first PP layer 2 and the second PP layer 8 are both greater than the thickness of the first LCP layer 3 and the second LCP layer 7. The thickness of the PP layer is greater than that of the LCP layer, and the protection of the LCP layer is enhanced by the PP layer.

[0037] The thickness of the first LCP layer 3 and the second LCP layer 7 are both 24-26 μm. In a preferred embodiment, the thickness of the first LCP layer 3 and the second LCP layer 7 are both 25 μm. The model of the first LCP layer 3 and the second LCP layer 7 is R-F705S13EC-M (12-25-12).

[0038] The thickness of the first PP layer 2 and the second PP layer 8 are both 47-49 μm. In a preferred embodiment, the thickness of the first PP layer 2 and the second PP layer 8 are both 48 μm. The model of the first PP layer 2 and the second PP layer 8 is EM-89BK(A) / Taiguang 1037.

[0039] The core board layer 5 is a core board layer; the thickness of the core board layer 5 is 2.4-2.6 mil; in a preferred embodiment, the thickness of the core board layer 5 is 2.5 mil; the model of the core board layer 5 is EM526.

[0040] The thickness of the first copper foil layer 1 and the second copper foil layer 9 is 44-46 μm. In a preferred embodiment, the thickness of the first copper foil layer 1 and the second copper foil layer 9 is 45 μm. The model of the first copper foil layer 1 and the second copper foil layer 9 is IF-ME12O1.

[0041] The thickness of the first adhesive layer 4 and the second adhesive layer 6 is 24-26 μm. In a preferred embodiment, the thickness of the first adhesive layer 4 and the second adhesive layer 6 is 25 μm. The model of the first adhesive layer 4 and the second adhesive layer 6 is R-BM17.

[0042] In another embodiment, a method for manufacturing a high-frequency carrier includes the following steps: first, etching the second copper foil layer and the second copper foil layer to obtain a circuit layer; then, cleaning the first LCP layer, the core board layer and the second LCP layer; then, using PP glue to press and bond the second LCP layer to form a second PP layer between the second LCP layer and the second copper foil layer; then, using pure glue to press and bond the core board layer to the second LCP layer to form a second bonding layer between the core board layer and the second LCP layer; then, using pure glue to press and bond the first LCP layer to the core board layer to form a first bonding layer between the first LCP layer and the core board layer; then, using PP glue to press and bond the first copper foil layer to the first LCP layer to form a first PP layer between the first copper foil layer and the first LCP layer.

[0043] In the above method, after PP glue and pure glue are set, the PP layer and the pure glue layer are formed respectively by pressing, so that the surfaces of the first PP layer, the second PP layer, the first adhesive layer and the second adhesive layer are smooth and flat, and at the same time, the connection surfaces between the LCP layer and the PP layer and between the LCP layer and the pure glue layer are also smooth and flat; this ensures the transmission performance of high-frequency signals.

[0044] In this specification, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0046] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A high frequency carrier board, characterized in that: It includes a first copper foil layer, a first PP layer, a first LCP layer, a first adhesive layer, a core board layer, a second adhesive layer, a second LCP layer, a second PP layer and a second copper foil layer which are sequentially stacked in a height direction.

2. The high frequency carrier according to claim 1, characterized in that: The first PP layer and the second PP layer are both glass fiber reinforced PP layers.

3. The high frequency carrier according to claim 1, characterized in that: The first adhesive layer and the second adhesive layer are both pure adhesive layers.

4. The high frequency carrier according to claim 3, characterized in that: The dielectric thickness of the first adhesive layer and the second adhesive layer is consistent.

5. The high frequency carrier according to claim 1, characterized in that: The core board layer is the core board layer.

6. The high frequency carrier according to claim 1, characterized in that: The thickness of the first PP layer and the second PP layer are both greater than the thickness of the first LCP layer and the second LCP layer.

7. The high frequency carrier according to claim 1, characterized in that: The thickness of the first PP layer and the second PP layer are both 47-49 μm; the thickness of the first LCP layer and the second LCP layer are both 24-26 μm.

8. The high frequency carrier board according to claim 1, characterized in that: The thickness of the first adhesive layer and the second adhesive layer is 24-26 μm.

9. A method for manufacturing a high-frequency carrier board, characterized in that: The following steps are involved: The second LCP layer and the second copper foil layer are pressed and bonded by using PP glue to form a second PP layer between the second LCP layer and the second copper foil layer; Then, the core board layer and the second LCP layer are pressed and bonded with pure glue to form a second bonding layer between the core board layer and the second LCP layer; then, the first LCP layer and the core board layer are pressed and bonded with pure glue to form a first bonding layer between the first LCP layer and the core board layer; then, the first copper foil layer and the first LCP layer are pressed and bonded with PP glue to form a first PP layer between the first copper foil layer and the first LCP layer.

10. The method for manufacturing a high frequency carrier according to claim 9, characterized in that: Before bonding the first copper foil layer, the first LCP layer, the core board layer, the second LCP layer and the second copper foil layer, the second copper foil layer and the second copper foil layer are first etched to obtain a circuit layer; and then the first LCP layer, the core board layer and the second LCP layer are cleaned.

Images