An LED packaging process based on a TGV substrate

Abstract

The application discloses a kind of LED packaging processes based on TGV substrate, it is related to LED packaging field, it is solved that existing TGV glass substrate is easy to appear broken when taking, including following steps: four corner positioning adsorption of adsorption unit is carried out to glass substrate, the position of adsorption unit is adjusted by adjusting unit, and glass substrate is matched;Glass substrate is placed in laser operation table opening by taking adsorption unit, recovery adsorption unit, and cleaning unit is cleaned and stored to adsorption unit;Sputtering seed layer metal, copper is electroplated in the hole of glass substrate;With the chip of temporary substrate arranged in advance according to defined specification is aligned and is pressed together, welding, and protective glue, transparent glue, black glue and the like are applied on the surface of chip;Glass substrate exposed copper is polished, and independent LED chip is made;The application is adsorbed to the top of glass substrate by adjusting mechanism, and glass substrate is conveniently taken, so that the effect of safe feeding is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED packaging, in particular to an LED packaging process based on TGV substrate. BACKGROUND

[0002] LED packaging refers to the packaging of light-emitting chips. The function of packaging is to provide sufficient protection for the chips to prevent the chips from failing due to long-term exposure to air or mechanical damage, so as to improve the stability of the chips. For LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation. Good packaging can make the LED have better light-emitting efficiency and heat dissipation environment, thereby improving the service life of the LED.

[0003] TGV substrate is an advanced LED packaging technology that combines the precision of laser processing with the advantages of glass substrate to achieve high-density and high-reliability vertical electrical interconnection. The production steps include: TGV glass taking and placing, making TGV through holes, plating seed layer metal, electroplating filling, making double-sided circuit, precisely aligning and bonding the LED chip array with the TGV substrate with the made circuit, and welding to complete the LED packaging. However, TGV glass needs to be thinned to a relatively thin thickness to make double-sided circuit. The thinning process is difficult, and the glass has insufficient mechanical strength, is prone to breakage, has low yield, and reduces the yield, resulting in increased cost. SUMMARY

[0004] The present application aims to provide an LED packaging process based on TGV substrate to solve the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] An LED packaging process based on TGV substrate, comprising the following steps:

[0007] S1, a glass substrate with a thickness of 0.5-1.1mm is prepared, the glass substrate is positioned and adsorbed by four corners by an adsorption unit, and the position of the adsorption unit is adjusted by an adjusting unit to match the glass substrate;

[0008] S2, the glass substrate is placed on a laser workbench by the adsorption unit, a hole with a depth of 200-300um is opened, the size feature of the hole is an opening of 80-120um at the top, the adsorption unit is recovered, and the adsorption unit is cleaned and stored by a cleaning unit;

[0009] S3, a seed layer metal is sputtered, copper is electroplated in the hole of the glass substrate, or conductive paste is filled and solidified after sputtering the metal, the resistivity of the conductive paste after solidification is less than or equal to 0.01 ohm centimeter, and the surface of the glass substrate is polished to remove the metal and conductive paste outside the surface opening.

[0010] S4, making a conductive circuit on the glass substrate on the side of the opening;

[0011] S5, aligning and pressing the chip with the temporary substrate, welding, separating the temporary substrate, coating the chip surface with protective glue, transparent glue, black glue, etc.

[0012] S6, thinning and polishing the opposite side of the opening surface of the glass substrate until the metal in the opening is exposed, separating the temporary carrier plate, cutting the glass substrate, and making an independent LED chip.

[0013] Preferably, the adsorption unit comprises a ring-shaped frame, the top of the ring-shaped frame is provided with four mounting plates which are centrally symmetrically distributed, the bottom of the mounting plate is provided with an air valve located in the inner circle of the ring-shaped frame, the bottom of the air valve is fixedly installed with a vacuum chuck, the top of the air valve and the bottom of the mounting plate are fixedly installed with a spring, the spring provides a buffer for the contact between the vacuum chuck and the glass substrate, the top of the mounting plate is fixedly installed with a compression gas pump, the compression gas pump is connected with the air valve through an air pipe, the compression gas pump starts the air valve through the air pipe, and the air valve pumps the gas between the vacuum chuck and the glass substrate to adsorb the glass substrate, the top of the air valve is fixedly installed with four center-symmetric supporting rods, the supporting rods slide through the mounting plate to provide guidance and support for the movement of the air valve, and four supporting rods are fixedly installed with a limiting ring located at the top of the mounting plate.

[0014] Preferably, the adjusting unit comprises a rotating ring rotatably installed in the inner side of the ring-shaped frame, the top of the rotating ring is fixedly installed with a vortex strip, the top of the ring-shaped frame is provided with a sliding groove for limiting sliding of the mounting plate, and the bottom of the mounting plate is fixedly installed with an arc-shaped clamping strip which is equidistantly distributed and matched with a plurality of vortex strips, so that when the rotating ring rotates, the vortex strip and the arc-shaped clamping strip can drive the mounting plate to move along the sliding groove on the ring-shaped frame, the position of the vacuum chuck is adjusted, guide plates are arranged on both sides of the mounting plate, the guide plates are fixedly installed on the inner side of the ring-shaped frame, the stability of the movement of the mounting plate is improved, the side of the guide plate close to the ring-shaped frame is in contact with the inner side of the rotating ring, two symmetrically distributed positioning clamping strips are fixedly installed in the sliding groove of the ring-shaped frame, the positioning clamping strips are fixedly connected with the side of the guide plate close to the mounting plate, and a clamping groove is formed in the outer side of the mounting plate for limiting sliding of the positioning clamping strip, and the movement of the mounting plate is limited.

[0015] Preferably, the cleaning unit comprises four positioning plates located directly below the four mounting plates, the positioning plates are fixedly installed on the inner side of the annular frame, two symmetrically distributed guide bars are fixedly installed on one end of the air valve close to the positioning plate, two slide columns are fixedly installed on the two sides of the air valve respectively and in a horizontal line with the two guide bars, the end of the guide bar close to the slide column is in a bevel structure, so that when the slide column and the bevel of the guide bar move, the air valve can be pushed to move upwards, a receiving cover is fixedly installed on the bottom of the positioning plate, a sleeve is arranged on the side of the receiving cover away from the air valve, the sleeve is fixedly installed on the bottom of the positioning plate, a rotating rod extending to the top of the positioning plate is rotatably installed on the outer side of the sleeve, a gear is fixedly installed on the top end of the rotating rod, an installation ring is fixedly installed on the bottom of the rotating ring, four arc-shaped racks matched with the four gears are fixedly installed on the inner side of the installation ring, so that when the arc-shaped rack is in contact with the gear, the arc-shaped rack drives the gear to rotate with the rotation of the rotating ring, a placing disc is fixedly installed on the end of the rotating rod away from the gear, for placing the cleaning cotton, and the top of the placing disc and the bottom of the receiving cover are in a horizontal line, so that when the placing disc rotates, the bottom of the vacuum sucker can be cleaned and protected by the cleaning cotton.

[0016] Preferably, two symmetrically distributed handles are fixedly installed on the top of the annular frame, so as to facilitate pulling the annular frame to move.

[0017] Preferably, a rubber gasket is arranged on the outer side of the spring, the rubber gasket is fixedly installed on the bottom of the mounting plate, and the rubber gasket provides buffering and protection for the movement of the air valve.

[0018] Preferably, an anti-skid pushing ring is fixedly installed on the bottom of the rotating ring and located in the inner circle of the annular frame, so as to facilitate the rotating operation of the rotating ring.

[0019] Preferably, a resisting bar is fixedly installed on the top of the mounting plate, and two symmetrically distributed resisting bars are fixedly installed on the top of the annular frame sliding groove, so as to prevent the mounting plate from moving too long.

[0020] Preferably, a rotating disc is rotatably installed on the inner side of the placing disc, a rotating block slidingly penetrating the placing disc is fixedly installed on the bottom of the rotating disc, and a torsion plate is fixedly installed on the bottom of the rotating block, so as to facilitate the cleaning of the bottom of the vacuum sucker by the cleaning cotton in the rotating placing disc.

[0021] Preferably, two symmetrically distributed rubber buckles are fixedly installed on the top of the rotating disc, for fixing the cleaning cotton.

[0022] Compared with the prior art, the present application has the following advantages:

[0023] The application can adopt four-point positioning mode to adsorb the top of the glass substrate, facilitate taking and placing the glass substrate on the laser operation table for punching operation, improve the safety of glass substrate feeding, solve the problem of easy breakage of glass substrate, so as to achieve the effect of safe feeding.

[0024] The adjusting unit can synchronously adjust the positions of the four vacuum adsorbers, facilitate adsorption and positioning of glass substrates of different sizes, utilize the space in the inner ring of the annular frame to process the glass substrate, facilitate directly taking the glass substrate after punching is completed, so as to facilitate adsorption and taking of more sizes of glass substrates, and improve the convenience of glass substrate punching.

[0025] The cleaning unit can make the vacuum adsorber enter the storage cover after the vacuum adsorber is used, and rotate the placing disc to make the cleaning cotton contact the bottom of the vacuum adsorber, so as to facilitate cleaning and protection of the vacuum adsorber. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a schematic diagram of the whole structure of the application;

[0027] Figure 2 It is a schematic diagram of the structure of the vacuum adsorber and the placing disc in the application;

[0028] Figure 3 It is a schematic diagram of the structure of the vortex strip and the rotating ring in the application;

[0029] Figure 4 It is a schematic diagram of the structure of the storage cover and the guide plate in the application;

[0030] Figure 5 It is a schematic diagram of the structure of the supporting rod and the limiting ring in the application;

[0031] Figure 6 It is a schematic diagram of the structure of the resisting strip and the blocking strip in the application;

[0032] Figure 7 It is a schematic diagram of the structure of the mounting ring and the anti-skid pushing ring in the application;

[0033] Figure 8 It is a schematic diagram of the structure of the rotating disc and the rotating block in the application.

[0034] In the figure: 1, annular frame; 2, mounting plate; 3, air valve; 4, vacuum chuck; 5, spring; 6, compressed air pump; 7, air pipe; 8, support rod; 9, limiting ring; 10, rotating ring; 11, spiral strip; 12, arc-shaped clamping strip; 13, guide plate; 14, positioning clamping strip; 15, positioning plate; 16, guide strip; 17, sliding column; 18, storage cover; 19, sleeve; 20, rotating rod; 21, gear; 22, mounting ring; 23, arc-shaped rack; 24, placement disc; 25, handle; 26, rubber gasket; 27, anti-skid push ring; 28, abutting strip; 29, blocking strip; 30, rotating disc; 31, rotating block; 32, torsion plate; 33, rubber buckle rope. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of the present application.

[0036] Embodiment one: please refer to Figures 1-8 , a LED packaging process based on TGV substrate, comprising the following steps:

[0037] S1, prepare a glass substrate with a thickness of 0.5-1.1mm, position and adsorb the glass substrate at four corners by an adsorption unit, adjust the position of the adsorption unit by an adjusting unit to match the glass substrate;

[0038] S2, place the glass substrate on a laser workbench by the adsorption unit, open a hole with a depth of 200-300um, the size feature of the hole is that the top opening is 80-120um, recover the adsorption unit, and clean the adsorption unit by a cleaning unit;

[0039] S3, sputter a seed layer metal, electroplate copper in the hole of the glass substrate, or fill conductive paste after sputtering the metal and solidify, the resistivity of the conductive paste after solidification is less than or equal to 0.01 ohm centimeter, and polish the surface of the glass substrate to remove the metal and conductive paste outside the surface opening;

[0040] S4, make a conductive circuit on the glass substrate on the side of the opening;

[0041] S5, align and press the chip on the temporary substrate according to the defined specifications, separate the temporary substrate, and sequentially apply protective glue, transparent glue, and black glue on the surface of the chip;

[0042] S6, the opposite side of the glass substrate opening surface is thinned, polished until the metal in the opening is exposed, the temporary carrier plate is separated, the glass substrate is cut, and an independent LED chip is made.

[0043] The adsorption unit comprises a ring frame 1, the top of the ring frame 1 is provided with four mounting plates 2 which are centrally symmetrically distributed, the bottom of the mounting plate 2 is provided with an air valve 3 located in the inner circle of the ring frame 1, the bottom of the air valve 3 is fixedly installed with a vacuum chuck 4, the top of the air valve 3 is fixedly installed with a spring 5 between the bottom of the mounting plate 2, the spring 5 is used to provide buffering for the contact between the vacuum chuck 4 and the glass substrate, the top of the mounting plate 2 is fixedly installed with a compressed air pump 6, the compressed air pump 6 is connected with the air valve 3 through an air pipe 7, the compressed air pump 6 starts the air valve 3 through the air pipe 7, the air valve 3 pumps the gas between the vacuum chuck 4 and the glass substrate to vacuum, and the glass substrate is adsorbed, the top of the air valve 3 is fixedly installed with four center-symmetrically distributed supporting rods 8, the supporting rods 8 are slidably penetrated through the mounting plate 2, and the supporting rods 8 provide guidance and support for the movement of the air valve 3, and the four supporting rods 8 are fixedly installed with a limiting ring 9 located at the top of the mounting plate 2;

[0044] The user contacts the four vacuum chucks 4 on the ring frame 1 with the top of the glass substrate, uses the elastic force of the spring 5 to provide buffering for the contact between the vacuum chuck 4 and the glass substrate, starts the compressed air pump 6 and the air valve 3 to extract the air between the vacuum chuck 4 and the glass substrate, and the glass substrate is adsorbed and positioned, so that the user can take the glass substrate through the ring frame 1, and place the glass substrate on the laser workbench for punching, thereby achieving the effect of safe feeding and solving the problem that the glass substrate is easy to break.

[0045] The adjusting unit comprises a rotating ring 10 rotatably installed in the inner side of the ring frame 1, the top of the rotating ring 10 is fixedly installed with a vortex strip 11, the top of the ring frame 1 is provided with a sliding groove for limiting sliding of the mounting plate 2, the bottom of the mounting plate 2 is fixedly installed with arc-shaped clamping strips 12 which are equidistantly distributed and matched with the plurality of vortex strips 11, so that when the rotating ring 10 rotates, the mounting plate 2 can be driven to move along the sliding groove on the ring frame 1 through the vortex strip 11 and the arc-shaped clamping strip 12, the position of the vacuum chuck 4 is adjusted, the two sides of the mounting plate 2 are provided with guide plates 13 which are fixedly installed on the inner side of the ring frame 1, the stability of the movement of the mounting plate 2 is improved, the side of the guide plate 13 close to the ring frame 1 is in contact with the inner side of the rotating ring 10, the sliding groove of the ring frame 1 is fixedly installed with two symmetrically distributed positioning clamping strips 14, the positioning clamping strips 14 are fixedly connected with the side of the guide plate 13 close to the mounting plate 2, and the outer side of the mounting plate 2 is provided with a clamping groove for limiting sliding of the positioning clamping strip 14, which provides limiting for the movement of the mounting plate 2;

[0046] The user can rotate the rotating ring 10 inside the annular frame 1, so that the rotating ring 10 drives the spiral strip 11 to rotate along the arc-shaped clamping strip 12 at the bottom of the mounting plate 2, drives the mounting plate 2 to move along the sliding groove of the annular frame 1 through the arc-shaped clamping strip 12, drives the clamping groove on the mounting plate 2 to move along the outside of the positioning clamping strip 14, and realizes the synchronous movement of the four mounting plates 2 to the center of the annular frame 1. The mounting plate 2 can adjust the position of the vacuum chuck 4, and the space in the inner ring of the annular frame 1 can be used for punching the glass substrate, which is convenient for taking the glass substrate after punching, thereby facilitating the adsorption and taking of more sizes of glass substrates and improving the convenience of glass substrate punching.

[0047] The cleaning unit includes four positioning plates 15 located directly below the four mounting plates 2, the positioning plates 15 are fixedly installed on the inner side of the annular frame 1, two symmetrically distributed guide strips 16 are fixedly installed on one end of the positioning plate 15 close to the air valve 3, two slide columns 17 are fixedly installed on the two sides of the air valve 3 respectively on a horizontal line, one end of the guide strip 16 close to the slide column 17 is a beveled structure, so that when the slide column 17 moves with the bevel of the guide strip 16, the air valve 3 can be pushed to move upward, a receiving cover 18 is fixedly installed on the bottom of the positioning plate 15, a sleeve 19 is arranged on the side of the receiving cover 18 away from the air valve 3, the sleeve 19 is fixedly installed on the bottom of the positioning plate 15, a rotating rod 20 extending to the top of the positioning plate 15 is rotatably installed on the outside of the sleeve 19, a gear 21 is fixedly installed on the top end of the rotating rod 20, an installation ring 22 is fixedly installed on the bottom of the rotating ring 10, four arc-shaped racks 23 matched with the four gears 21 are fixedly installed on the inner side of the installation ring 22, so that when the arc-shaped rack 23 contacts with the gear 21, the arc-shaped rack 23 drives the gear 21 to rotate with the rotation of the rotating ring 10, a placing disc 24 is fixedly installed on the end of the rotating rod 20 away from the gear 21, for placing cleaning cotton, and the top of the placing disc 24 and the bottom of the receiving cover 18 are on a horizontal line, so that the placing disc 24 can clean and protect the bottom of the vacuum chuck 4 through the cleaning cotton when rotating;

[0048] After the vacuum chuck 4 is separated from the glass substrate, the user reversely rotates the rotating ring 10 to drive the four mounting plates 2 to move in the direction opposite to the center of the annular frame 1. When the slide post 17 on the air valve 3 contacts the inclined surface of the guide strip 16, the slide post 17 moves upward along the inclined surface of the guide strip 16. Under the limitation and guidance of the supporting rod 8, the air valve 3 moves towards the mounting plate 2. The air valve 3 drives the vacuum chuck 4 to move synchronously, so that the vacuum chuck 4 is close to the storage cover 18. At the same time, the rotating ring 10 drives the arc-shaped rack 23 to rotate synchronously through the mounting ring 22. The arc-shaped rack 23 drives the rotating rod 20 to rotate through the gear 21, so that the rotating rod 20 drives the placement disc 24 to rotate to the position directly below the vacuum chuck 4, thereby shielding and protecting the bottom of the vacuum chuck 4. The cleaning cotton in the placement disc 24 can clean the bottom of the vacuum chuck 4, so that the effect of conveniently cleaning and protecting the vacuum chuck 4 is achieved.

[0049] Working principle: first, the user rotates the rotating ring 10 in the inside of the annular frame 1, so that the rotating ring 10 drives the vortex-shaped strip 11 to rotate along the arc-shaped clamping strip 12 at the bottom of the mounting plate 2. The arc-shaped clamping strip 12 drives the mounting plate 2 to move along the sliding groove of the annular frame 1. The clamping groove on the mounting plate 2 moves along the outside of the positioning clamping strip 14, so that the four mounting plates 2 move synchronously towards the center of the annular frame 1. The mounting plate 2 drives the vacuum chuck 4 to move synchronously, so that the positions of the four vacuum chucks 4 match the size of the glass substrate. Then, the user makes the four vacuum chucks 4 close to the top of the glass substrate. The spring 5 provides a buffer for the contact between the vacuum chuck 4 and the glass substrate. Subsequently, the user starts the compressed air pump 6 and the air valve 3 to extract the air between the vacuum chuck 4 and the glass substrate, so that the vacuum chuck 4 is adsorbed on the glass substrate. At this time, the user holds the annular frame 1 to take the glass substrate. The glass substrate is placed on the laser workbench to be punched. Finally, the user starts the compressed air pump 6 and the air valve 3 to separate the vacuum chuck 4 from the glass substrate. The rotating ring 10 is reversely rotated, so that the rotating ring 10 drives the four mounting plates 2 to move synchronously in the direction away from the annular frame 1. The mounting plate 2 drives the air valve 3 to move synchronously. When the slide post 17 on the air valve 3 contacts the inclined surface of the guide strip 16, the slide post 17 moves upward along the inclined surface of the guide strip 16. Under the limitation and guidance of the supporting rod 8, the air valve 3 moves towards the mounting plate 2, and the vacuum chuck 4 moves upward. The vacuum chuck 4 is close to the storage cover 18. At the same time, the rotating ring 10 drives the arc-shaped rack 23 to rotate synchronously through the mounting ring 22. The arc-shaped rack 23 drives the rotating rod 20 to rotate through the gear 21, so that the rotating rod 20 drives the placement disc 24 to rotate to the position directly below the vacuum chuck 4, thereby shielding and protecting the bottom of the vacuum chuck 4. The cleaning cotton in the placement disc 24 can clean the bottom of the vacuum chuck 4, so that the effect of conveniently cleaning and protecting the vacuum chuck 4 is achieved.

[0050] Example two: please refer to Figures 1-7The embodiment is further illustrated based on the first embodiment. Two handles 25 are symmetrically arranged on the top of the annular frame 1 in the drawing, which facilitates pulling the annular frame 1 to move. The outer side of the spring 5 is provided with a rubber washer 26, which is fixedly arranged on the bottom of the mounting plate 2, thereby providing buffering and protection for the movement of the air valve 3. The bottom of the rotating ring 10 is fixedly arranged with an anti-skid pushing ring 27 in the inner ring of the annular frame 1, which facilitates rotating operation of the rotating ring 10. The top of the mounting plate 2 is fixedly arranged with a stop bar 28, and the top of the sliding groove of the annular frame 1 is fixedly arranged with two symmetrically arranged stop bars 29, which prevents the mounting plate 2 from moving too long.

[0051] In the embodiment, when the vacuum chuck 4 is in contact with the top of the glass substrate, the vacuum chuck 4 drives the air valve 3 to be in contact with the rubber washer 26, which can provide buffering and protection for the bottom of the air valve 3, thereby improving the durability of the air valve 3. The anti-skid pushing ring 27 can be used to push the rotating ring 10, thereby improving the convenience of rotating adjustment of the rotating ring 10. When the mounting plate 2 moves along the sliding groove of the annular frame 1, the stop bar 28 on the mounting plate 2 is in contact with the stop bar 29 on the annular frame 1, thereby limiting the movement of the mounting plate 2 and preventing the mounting plate 2 from falling off the sliding groove due to excessive rotation. After the vacuum chuck 4 adsorbs the glass substrate, the user can hold the glass substrate by the two handles 25, thereby facilitating transportation.

[0052] Embodiment three: please refer to Figure 7 and Figure 8 The embodiment is further illustrated based on other embodiments. The inner side of the placement disc 24 in the drawing is rotatably arranged with a rotating disc 30, the bottom of the rotating disc 30 is fixedly arranged with a rotating block 31 which slides through the placement disc 24, and the bottom of the rotating block 31 is fixedly arranged with a torsion plate 32, which facilitates cleaning the bottom of the vacuum chuck 4 with the cleaning cotton in the placement disc 24. The top of the rotating disc 30 is fixedly arranged with two symmetrically arranged rubber buckle ropes 33, which are used to fix the cleaning cotton.

[0053] In the embodiment, the user can place the cleaning cotton on the rotating disc 30 by stretching the two rubber buckle ropes 33, and the elasticity of the rubber buckle ropes 33 can fix the cleaning cotton on the rotating disc 30, thereby improving the convenience of installing the cleaning cotton. When the placement disc 24 is rotated to the bottom of the vacuum chuck 4, the user can rotate the torsion plate 32 to drive the rotating block 31 to rotate, so that the rotating block 31 drives the cleaning cotton on the rotating disc 30 to rotate, thereby cleaning the bottom of the vacuum chuck 4, which facilitates cleaning and protection of the vacuum chuck 4.

[0054] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and illustrative figures, it should be apparent that the scope of the present application is not limited to these specific embodiments.

[0055] While the embodiments of the application have been shown and described herein, it will be understood by those skilled in the art that many changes, modifications, substitutions and alterations to these embodiments can be made without departing from the spirit and scope of the present application, which is defined by the appended claims and their equivalents.

Claims

1. A TGV substrate based LED packaging process, characterized in that: It comprises the following steps: S1, prepare a glass substrate with a thickness of 0.5-1.1mm, position and adsorb the glass substrate with four corners by the adsorption unit, adjust the position of the adsorption unit by the adjusting unit, and match the glass substrate; S2, place the glass substrate on the laser workbench by the adsorption unit, open a hole with a depth of 200-300um, the size of the hole is characterized by a top opening of 80-120um, recover the adsorption unit, and clean and store the adsorption unit by the cleaning unit; S3, sputter seed layer metal, electroplate copper in the hole of the glass substrate, or fill conductive paste after sputtering metal and solidify, the resistivity of the conductive paste after solidification is less than or equal to 0.01 ohm centimeter, and polish the surface of the glass substrate to remove the metal and conductive paste outside the surface opening; S4, make a conductive circuit on the glass substrate on one side of the opening; S5, align and press and weld the chip arranged on the temporary substrate according to the defined specifications, separate the temporary substrate, and apply protective glue, transparent glue, and black glue on the surface of the chip in turn; S6, thin and polish the opposite side of the glass substrate opening surface until the metal in the opening is exposed, separate the temporary carrier, and cut the glass substrate to make independent LED chips; The adsorption unit comprises a ring frame (1), four mounting plates (2) are symmetrically arranged at the top of the ring frame (1), a gas valve (3) is arranged at the bottom of the mounting plate (2) and located in the inner circle of the ring frame (1), a vacuum chuck (4) is fixedly installed at the bottom of the gas valve (3), a spring (5) is fixedly installed between the top of the gas valve (3) and the bottom of the mounting plate (2), a compressed air pump (6) is fixedly installed at the top of the mounting plate (2), the compressed air pump (6) is connected with the gas valve (3) through an air pipe (7), four center-symmetric supporting rods (8) are fixedly installed at the top of the gas valve (3), the supporting rods (8) slide through the mounting plate (2), and a limiting ring (9) is fixedly installed between the four supporting rods (8) and located at the top of the mounting plate (2); The adjusting unit comprises a rotating ring (10) rotatably installed on the inner side of the ring frame (1), a vortex strip (11) is fixedly installed at the top of the rotating ring (10), a sliding groove is formed in the top of the ring frame (1) for limiting sliding of the mounting plate (2), arc-shaped clamping strips (12) are fixedly installed at the bottom of the mounting plate (2) and arranged at equal intervals and matched with the vortex strips (11), guide plates (13) are arranged on both sides of the mounting plate (2), the guide plates (13) are fixedly installed on the inner side of the ring frame (1), one side of the guide plate (13) close to the ring frame (1) is in contact with the inner side of the rotating ring (10), two symmetrically arranged positioning clamping strips (14) are fixedly installed in the sliding groove of the ring frame (1), the positioning clamping strips (14) are fixedly connected with one side of the guide plate (13) close to the mounting plate (2), and a clamping groove is formed in the outer side of the mounting plate (2) for limiting sliding of the positioning clamping strips (14).

2. The LED packaging process based on TGV substrate according to claim 1, wherein: The cleaning unit includes four positioning plates (15) located directly below the four mounting plates (2), the positioning plates (15) are fixedly installed on the inner side of the annular frame (1), two symmetrically distributed guide strips (16) are fixedly installed on one end of the positioning plate (15) close to the air valve (3), two slide columns (17) are fixedly installed on the two sides of the air valve (3) respectively on a horizontal line with the two guide strips (16), one end of the guide strip (16) close to the slide column (17) is a bevel structure, a receiving cover (18) is fixedly installed on the bottom of the positioning plate (15), a sleeve (19) is arranged on the side of the receiving cover (18) away from the air valve (3), the sleeve (19) is fixedly installed on the bottom of the positioning plate (15), a rotating rod (20) extending to the top of the positioning plate (15) is rotatably installed on the outer side of the sleeve (19), a gear (21) is fixedly installed on the top end of the rotating rod (20), an installation ring (22) is fixedly installed on the bottom of the rotating ring (10), four arc-shaped racks (23) matched with the four gears (21) are fixedly installed on the inner side of the installation ring (22), a placing disc (24) is fixedly installed on one end of the rotating rod (20) away from the gear (21), and the top of the placing disc (24) and the bottom of the receiving cover (18) are on a horizontal line.

3. The LED packaging process based on TGV substrate according to claim 1, wherein: Two symmetrically distributed handles (25) are fixedly installed on the top of the annular frame (1).

4. The LED packaging process based on TGV substrate according to claim 1, wherein: A rubber gasket (26) is arranged on the outer side of the spring (5), and the rubber gasket (26) is fixedly installed on the bottom of the mounting plate (2).

5. The LED packaging process based on TGV substrate according to claim 1, wherein: An anti-skid push ring (27) is fixedly installed on the bottom of the rotating ring (10) in the inner circle of the annular frame (1).

6. The LED packaging process based on TGV substrate according to claim 1, wherein: A resisting strip (28) is fixedly installed on the top of the mounting plate (2), and two symmetrically distributed blocking strips (29) are fixedly installed on the top of the sliding groove of the annular frame (1).

7. The TGV substrate based LED packaging process of claim 2, wherein: A rotating disc (30) is rotatably installed on the inner side of the placing disc (24), a rotating block (31) slidingly penetrating the placing disc (24) is fixedly installed on the bottom of the rotating disc (30), and a torsion plate (32) is fixedly installed on the bottom of the rotating block (31).

8. The LED packaging process based on TGV substrate according to claim 7, characterized in that: Two symmetrically distributed rubber buckle ropes (33) are fixedly installed on the top of the rotating disc (30).

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