Display module and display device

Abstract

The invention discloses a display module and a display device.The display module is provided with a display area and a frame area which at least partially surrounds the display area, and the display module comprises a functional film layer which comprises a first film layer; the adhesive layer is at least partially arranged in the frame area and at least partially arranged on the side, in the thickness direction of the display module, of the first film layer, the first film layer comprises a first surface facing the adhesive layer in the thickness direction of the display module, and a buffer layer is arranged between the first surface and the adhesive layer; the elastic modulus of the material of the buffer layer is smaller than that of the material of the first film layer, and the elastic modulus of the material of the buffer layer is smaller than that of the material of the viscous layer. According to the display module, the deformation difference between the first film layer and the viscous layer is eliminated by arranging the buffer layer, generation of extra stress is avoided, stripping of the first film layer and the viscous layer or cracking of the viscous layer is avoided, and the use performance of the display module is improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display module and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved.

[0004] Therefore, a new display module and display device are urgently needed. Summary of the invention

[0005] The embodiments of the present application provide a display module and a display device, which improve the performance of the display module.

[0006] On the one hand, an embodiment of the present application provides a display module, comprising a display area and a frame area at least partially arranged around the display area, the display module comprising: a functional film layer, the functional film layer comprising a first film layer; an adhesive layer, at least partially arranged in the frame area, and at least partially arranged on one side of the first film layer along the thickness direction of the display module, along the thickness direction of the display module, the first film layer comprises a first surface facing the adhesive layer, a buffer layer is arranged between the first surface and the adhesive layer, the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the first film layer, and the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the adhesive layer.

[0007] According to one aspect of the present application, along the thickness direction of the display module, the functional film layer includes a display layer and a supporting structure layer provided on a side of the display layer away from a light emitting surface, and the supporting structure layer includes the first film layer.

[0008] According to one aspect of the present application, the supporting structure layer includes a metal layer, and the metal layer is the first film layer; preferably, along the direction in which the metal layer approaches the display layer, the supporting structure layer also includes a first bonding layer, a foam layer and a second bonding layer located between the metal layer and the display layer and arranged in sequence; preferably, the elastic modulus of the material of the metal layer is greater than or equal to 50GPa; preferably, the elastic modulus of the material of the buffer layer is less than or equal to 50MPa; preferably, the elastic modulus of the material of the adhesive layer is greater than or equal to 500MPa; preferably, the material of the metal layer includes copper; preferably, the material of the buffer layer includes polyurethane.

[0009] According to one aspect of the present application, the orthographic projection of the buffer layer on the functional film layer is a strip structure; the width of the buffer layer is greater than or equal to 0.6 mm, and the width direction of the buffer layer is perpendicular to the thickness direction of the display module; preferably, along the thickness direction of the display module, the thickness of the buffer layer is greater than or equal to 50 μm and less than or equal to 300 μm.

[0010] According to one aspect of the present application, along a direction perpendicular to the thickness direction of the display module, the adhesive layer is located on a side of the inner edge of the buffer layer away from the display area; preferably, along a direction perpendicular to the thickness direction of the display module, part of the adhesive layer is located on the outer side of the supporting structure layer, and along a direction perpendicular to the thickness direction of the display module, the first film layer includes a first side surface close to the adhesive layer, the buffer layer includes a second side surface close to the adhesive layer, and the first side surface and the second side surface are flush with each other.

[0011] According to one aspect of the present application, along the thickness direction of the display module, the functional film layer includes a display layer and a cover plate structure provided on the light emitting side of the display layer, and the cover plate structure includes the first film layer.

[0012] According to one aspect of the present application, the cover plate structure includes a cover plate and a shading layer located on the side of the cover plate facing the adhesive layer, and the shading layer is located in the frame area, and the surface of the shading layer facing the adhesive layer is the first surface, and the buffer layer is arranged between the shading layer and the adhesive layer; the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the cover plate, and the cover plate and the shading layer form the first film layer; or, the cover plate structure includes a cover plate, and the cover plate is the first film layer; preferably, the material of the shading layer includes ink; preferably, the elastic modulus of the material of the cover plate is greater than or equal to 70GPa.

[0013] According to one aspect of the present application, along a direction perpendicular to the thickness direction of the display module, at least a portion of the first film layer is located outside the display layer, and the buffer layer is in contact with a portion of the first film layer located outside the display layer.

[0014] According to one aspect of the present application, along a direction perpendicular to the thickness direction of the display module, the buffer layer is located on the outside of the display layer, and along a direction perpendicular to the thickness direction of the display module, the buffer layer and the display layer are spaced apart; preferably, the distance between the buffer layer and the display layer is greater than or equal to 0.3 mm; preferably, along a direction perpendicular to the thickness direction of the display module, the width of the buffer layer is greater than or equal to 0.3 mm.

[0015] According to one aspect of the present application, there are multiple buffer layers, and the functional film layer includes multiple first film layers, and the buffer layer is provided between each of the first film layers and the adhesive layer; preferably, along the thickness direction of the display module, the display module includes a stacked support structure layer, a display layer and a cover structure, and the support structure layer and the cover structure both include the first film layer.

[0016] According to one aspect of the present application, the multiple buffer layers include a first buffer layer located between the supporting structure layer and the adhesive layer, and the buffer layer includes a second buffer layer located between the cover structure and the adhesive layer; the first buffer layer and the second buffer layer are arranged independently of each other; or, the first buffer layer and the second buffer layer are an integrated structure, and a connecting portion is provided between the first buffer layer and the second buffer layer, and the connecting portion at least partially covers the side of the supporting structure layer and the display layer facing the adhesive layer.

[0017] According to one aspect of the present application, the orthographic projection of the buffer layer on the functional film layer is a strip structure; or, the buffer layer is arranged on the entire surface; preferably, the orthographic projection of the buffer layer on the functional film layer is a ring structure; preferably, the orthographic projection of the buffer layer on the functional film layer is a non-closed ring structure.

[0018] According to one aspect of the present application, the buffer layer includes an avoidance opening; the display layer includes a display portion and a bending portion connected to the display portion, the bending portion is at least partially bent to the side of the supporting structure layer away from the display portion, and along the thickness direction of the display module, the avoidance opening at least partially overlaps with the bending portion; preferably, the display module also includes a circuit board, and the circuit board is electrically connected to the bending portion.

[0019] According to one aspect of the present application, the border area includes a straight edge area and a corner area adjacent to the straight edge area, and the buffer layer is at least arranged in the corner area.

[0020] According to one aspect of the present application, the first film layer includes an inner region and an edge region surrounding the inner region, and along the thickness direction of the display module, the orthographic projection of the buffer layer on the first film layer is located in the edge region.

[0021] On the other hand, an embodiment of the present application provides a display module, having a display area and a frame area at least partially arranged around the display area, the display module comprising: a functional film layer, comprising a display layer and a supporting structure layer arranged on the side of the display layer away from the light emitting surface, the supporting structure layer comprising a first film layer; the display layer comprises a driving circuit layer and a light emitting layer, the driving circuit layer is located between the supporting structure layer and the light emitting layer; a viscosity layer, at least partially arranged in the frame area, and at least partially arranged on one side of the first film layer along the thickness direction of the display module, along the thickness direction of the display module, the first film layer comprises a first surface facing the viscosity layer, a buffer layer is arranged between the first surface and the viscosity layer, the buffer layer is in contact with the first surface and the viscosity layer respectively, the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the first film layer, and the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the viscosity layer.

[0022] According to another aspect of the present application, the supporting structure layer includes a metal layer, and the surface of the metal layer facing away from the display layer is the first surface, and the buffer layer is arranged between the metal layer and the adhesive layer; preferably, the elastic modulus of the material of the metal layer is greater than or equal to 50GPa; preferably, the elastic modulus of the material of the buffer layer is less than or equal to 50MPa; preferably, the elastic modulus of the material of the adhesive layer is greater than or equal to 500MPa; preferably, the material of the metal layer includes copper; preferably, the orthographic projection of the buffer layer on the functional film layer is a strip structure; preferably, along the direction perpendicular to the thickness direction of the display module, the width of the buffer layer is greater than or equal to 0.6mm; preferably, along the thickness direction of the display module, the thickness of the buffer layer is greater than or equal to 50μm and less than or equal to 300μm.

[0023] According to another aspect of the present application, the functional film layer also includes a cover plate structure arranged on the side of the light-emitting layer away from the driving circuit layer, and the buffer layer is arranged between the cover plate structure and the adhesive layer in the border area; preferably, the cover plate structure includes a cover plate and a shading layer located on the side of the cover plate facing the adhesive layer, and the shading layer is located in the border area, and the surface of the shading layer facing the adhesive layer is the first surface, and the buffer layer is arranged between the shading layer and the adhesive layer; the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the cover plate; preferably, the elastic modulus of the material of the cover plate is greater than or equal to 70GPa.

[0024] Another aspect of the embodiments of the present application provides a display device, which includes a middle frame structure, the middle frame structure includes a receiving space, the display module is at least partially located in the receiving space, and the display module is the display module in any of the above embodiments.

[0025] According to another aspect of the present application, the middle frame structure includes a bottom plate and a side plate connected to each other, and the bottom plate and the side plate enclose the accommodating space; the display device also includes a structural adhesive, and the structural adhesive includes a first adhesive portion and a second adhesive portion connected to each other, the first adhesive portion is arranged between the bottom plate and the adhesive layer, and the second adhesive portion is arranged between the side plate and the adhesive layer; preferably, the cross-sectional area of ​​the second adhesive portion gradually decreases from the bottom plate to the direction of the display module.

[0026] Compared with the prior art, the display module provided by the embodiment of the present invention includes a functional film layer, a viscosity layer and a buffer layer. The elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the first film layer and the viscosity layer. The elastic modulus is a physical quantity that describes the material's ability to resist deformation. The smaller the elastic modulus of the material, the easier the material is to deform. Since the buffer layer is arranged between the first surface of the first film layer and the viscosity layer, when the first film layer and the viscosity layer are deformed, the part of the buffer layer in contact with the first film layer deforms with the first film layer, and the part of the buffer layer in contact with the viscosity layer deforms with the viscosity layer. That is, by setting the buffer layer, the difference in deformation between the first film layer and the viscosity layer is eliminated, the generation of additional stress is avoided, and then the first film layer and the viscosity layer are prevented from peeling off, or the viscosity layer is prevented from cracking, thereby improving the performance of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 is a schematic structural diagram of a display module provided by an embodiment of the present invention;

[0029] Figure 2 An embodiment provides Figure 1 The film structure diagram at AA in the middle;

[0030] Figure 3 Another embodiment provides Figure 1 The film structure diagram at AA in the middle;

[0031] Figure 4 is a schematic structural diagram of a support structure layer provided by an embodiment of the present invention;

[0032] Figure 5 Yet another embodiment provides Figure 1 The film structure diagram at AA in the middle;

[0033] Figure 6 Yet another embodiment provides Figure 1 The film structure diagram at AA in the middle;

[0034] Figure 7 An embodiment provides Figure 1 The film structure diagram at the middle BB;

[0035] Figure 8 It is a schematic diagram of the structure of a display device provided by an embodiment of the present invention.

[0036] In the attached figure:

[0037] 100-functional film layer; 10-first film layer; 110-support structure layer; 111-metal layer; 112-glue layer; 113-foam layer; 120-display layer; 130-cover structure; 131-cover; 132-shading layer; 140-polarizer; 150-adhesive layer;

[0038] 200 - adhesive layer;

[0039] 300-buffer layer; 310-first buffer layer; 320-second buffer layer; 330-connecting portion;

[0040] 400-circuit board; 500-shielding adhesive layer; 600-heightening block; 700-middle frame structure; 710-bottom plate; 720-side plate; 800-structural adhesive; 810-first adhesive part; 820-second adhesive part;

[0041] B1-first back bearing layer; B2-second back bearing layer; C1-first side; C2-second side; C3-third side; C4-fourth side; F1-first surface; K-avoidance opening; AA-display area; NA-frame area; ZA-straight edge area; BA-corner area; XA-inner area; YA-edge area; X-direction perpendicular to the thickness direction of the display module; Y-thickness direction of the display module. DETAILED DESCRIPTION

[0042] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0043] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0044] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0045] It is obvious to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit or scope of the present application. Therefore, the present application is intended to cover modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0046] In the related art, a display module usually includes a light-emitting layer, a cover plate and other functional film layers, and the functional film layers can be bonded and fixed by an adhesive layer. According to the research direction of the inventor, since the thermal expansion coefficients of the materials of the adhesive layer and each film layer in the functional film layer are significantly different, when performing reliability testing, the thermal deformation of the adhesive layer and the thermal deformation of the film layer at the junction of the functional film layer are quite different, resulting in the problem of film peeling between the adhesive layer and the corresponding functional film layer, affecting the reliability and performance of the display module.

[0047] In order to solve the above problems, the display module provided by the embodiment of the present invention eliminates the difference in deformation between the first film layer and the adhesive layer by setting a buffer layer, thereby avoiding the generation of additional stress, thereby avoiding peeling of the first film layer and the adhesive layer, or cracking of the adhesive layer, thereby improving the performance of the display module.

[0048] The present application provides a display module and a display device. Figures 1 to 8 Various embodiments of a display module and a display device are described.

[0049] See also Figure 1 to Figure 2 A display module provided in an embodiment of the present application has a display area AA and a frame area NA at least partially arranged around the display area AA, the display module includes: a functional film layer 100, the functional film layer 100 includes a first film layer 10; an adhesive layer 200, at least partially arranged in the frame area NA, and at least partially arranged on one side of the first film layer 10 along the thickness direction of the display module, along the thickness direction Y of the display module, the first film layer 10 includes a first surface F1 facing the adhesive layer 200, a buffer layer 300 is arranged between the first surface F1 and the adhesive layer 200, the buffer layer 300 is in contact with the first surface F1 and the adhesive layer 200 respectively, the elastic modulus of the material of the buffer layer 300 is smaller than the elastic modulus of the material of the first film layer 10, and the elastic modulus of the material of the buffer layer 300 is smaller than the elastic modulus of the material of the adhesive layer 200.

[0050] The display module provided by the embodiment of the present invention includes a functional film layer 100, a viscosity layer 200 and a buffer layer 300. The elastic modulus of the material of the buffer layer 300 is smaller than the elastic modulus of the material of the first film layer 10 and the viscosity layer 200. The elastic modulus is a physical quantity that describes the material's ability to resist deformation. The smaller the elastic modulus of a material, the easier it is for the material to deform. Since the buffer layer 300 is arranged between the first surface F1 of the first film layer 10 and the viscosity layer 200, when the first film layer 10 and the viscosity layer 200 are deformed, the portion of the buffer layer 300 in contact with the first film layer 10 deforms along with the first film layer 10, and the portion of the buffer layer 300 in contact with the viscosity layer 200 deforms along with the viscosity layer 200. That is, by providing the buffer layer 300, the difference in deformation between the first film layer 10 and the viscosity layer 200 is eliminated, the generation of additional stress is avoided, and then the first film layer 10 and the viscosity layer 200 are prevented from peeling off, or the viscosity layer 200 is prevented from cracking, thereby improving the performance of the display module.

[0051] In this embodiment, the functional film layer 100 may specifically include a driving circuit layer and a light-emitting layer of the display panel, or an optical film layer for improving the light-emitting effect of the display module, such as a polarizer 140 and a cover plate structure 130, etc., which may be specifically configured according to the specific structure of the display module.

[0052] The elastic modulus of the buffer layer 300 and the first film layer 10 may specifically be the shear elastic modulus, also known as the shear modulus or the rigidity modulus, which is the ratio of the shear stress to the shear strain within the elastic deformation proportional limit range under the shear stress of the material. It characterizes the ability of the material to resist shear strain. A large modulus indicates a strong rigidity of the material.

[0053] The adhesive layer 200 is at least partially disposed in the frame area NA to achieve adhesion and fixation of the functional film layer 100 to prevent the functional film layer 100 from displacement or falling off. Optionally, the adhesive layer 200 can be made of epoxy glue, acrylic acid or other light-curing glue materials for easy shaping. In one embodiment, the frame area NA is a non-display area. In another embodiment, at least part of the frame area NA can also be a display area.

[0054] It can be understood that the functional film layer 100 includes a first film layer 10, which is a film layer that originally needs to be in contact and bonded with the adhesive layer 200. Taking into account that the deformation of the two is quite different when heated, in order to avoid the problem of film peeling between the two, in this embodiment, an additional buffer layer 300 is arranged between the first surface F1 of the first film layer 10 and the adhesive layer 200, so as to utilize the deformation of the buffer layer 300 to eliminate the deformation difference between the first film layer 10 and the adhesive layer 200, thereby effectively reducing the risk of peeling between the first film layer 10 and the adhesive layer 200.

[0055] See also Figure 2In some optional embodiments, along the thickness direction Y of the display module, the functional film layer 100 includes a display layer 120 and a support structure layer 110 disposed on a side of the display layer 120 away from the light emitting surface, and the support structure layer 110 includes a first film layer 10 .

[0056] In this embodiment, the support structure layer 110 can adopt a single-layer structure or a multi-layer structure. At least one layer of the support structure layer 110 serves as the first film layer 10 in contact with the adhesive layer 200 , usually the bottommost film layer in the support structure layer 110 .

[0057] Optionally, the supporting structure layer 110 includes a metal layer 111, and the surface of the metal layer 111 facing away from the display layer 120 is a first surface F1. The buffer layer 300 is arranged between the metal layer 111 and the adhesive layer 200. The material of the metal layer 111 may include copper, that is, the metal layer 111 may use a copper foil layer. Since the thermal expansion coefficient of the copper material is 16.8μm / (m*℃), and the thermal expansion coefficient of the glue used for the adhesive layer 200 is generally greater than 100μm / (m*℃), the difference between the two is large, resulting in a large difference in the amount of thermal deformation generated by the metal layer 111 and the adhesive layer 200. Therefore, in this embodiment, a buffer layer 300 is arranged between the metal layer 111 and the adhesive layer 200 to reduce the risk of film peeling caused by the deformation difference between the first film layer 10 and the adhesive layer 200, thereby effectively improving the reliability of the display module.

[0058] In this embodiment, the metal layer 111 is used to support the display layer 120. On the other hand, since metal materials have good thermal conductivity, the metal layer 111 can improve the heat dissipation effect of the display module and avoid heat accumulation. Of course, the support structure layer 110 can also use film layers of other materials to achieve support and heat dissipation, for example, other metal material film layers such as aluminum and titanium can also be used.

[0059] See also Figure 4 Optionally, the supporting structure layer 110 further includes at least one adhesive layer 112 and a foam layer 113 disposed between the display layer 120 and the metal layer 111 to achieve buffering and protection for the display layer 120 and prevent the display layer 120 from being damaged.

[0060] Optionally, along the direction in which the metal layer 111 approaches the display layer 120 , the support structure layer 110 further includes a first adhesive layer, a foam layer 113 and a second adhesive layer which are located between the metal layer 111 and the display layer 120 and are sequentially arranged.

[0061] Optionally, a first back bearing layer B1 is provided between the supporting structure layer 110 and the display layer 120 .

[0062] Optionally, the elastic modulus of the material of the metal layer 111 is greater than or equal to 50 GPa, while the elastic modulus of the material of the adhesive layer 200 is generally smaller than the elastic modulus of the material of the metal layer 111. For example, the elastic modulus of the material of the adhesive layer 200 is greater than or equal to 500 MPa, that is, the metal layer 111 is not easily deformed relative to the adhesive layer 200.

[0063] Optionally, the elastic modulus of the material of the buffer layer 300 is less than or equal to 50 MPa, which is much smaller than the elastic modulus of the material of the metal layer 111 and the adhesive layer 200 , so that the buffer layer 300 can be deformed together with the metal layer 111 and the adhesive layer 200 .

[0064] Optionally, the material of the buffer layer 300 includes polyurethane, specifically TPU (thermoplastic polyurethane elastomer), PU (polyurethane) foam and other materials. The material of the buffer layer 330 has the characteristics of ultra-high elongation, low modulus, high temperature resistance, water vapor resistance, oil resistance and sweat resistance, and the buffer material has excellent adhesion performance with the injection glue. The color of the buffer layer 300 can be transparent, black or other colors.

[0065] In some optional embodiments, along a direction X perpendicular to the thickness direction of the display module, the adhesive layer 200 is located on a side of the inner edge of the buffer layer 300 away from the display area AA.

[0066] It can be understood that the inner edge of the buffer layer 300 refers to the edge of the side of the buffer layer 300 close to the display area AA, and the adhesive layer 200 is located on the side of the inner edge of the buffer layer 300 away from the display area AA, that is, the adhesive layer 200 will not exceed the inner edge of the buffer layer 300, but extend in the direction of the extended display area AA, avoiding direct contact between the adhesive layer 200 and the first film layer 10, thereby preventing the problem of film peeling.

[0067] In this embodiment, the direction X perpendicular to the thickness direction of the display module may refer to a direction from the display area AA to the non-display area NA.

[0068] Optionally, along a direction X perpendicular to the thickness direction of the display module, part of the buffer layer 300 is located on the outside of the adhesive layer 200, along the direction X perpendicular to the thickness direction of the display module, the buffer layer 300 includes a third side C3 away from the adhesive layer 200, and the adhesive layer 200 includes a fourth side C4 close to the third side C3, and along a direction Y of the thickness of the display module, the orthographic projection of the fourth side C4 on the substrate 100 is located within the orthographic projection of the buffer layer 300 on the substrate 100.

[0069] It can be understood that, in the present embodiment, the orthographic projection of the fourth side surface C4 on the substrate 100 is located within the orthographic projection of the buffer layer 300 on the substrate 100, that is, the adhesive layer 200 will not exceed the third side surface C3 of the buffer layer 300. The adhesive layer 200 can partially cover the buffer layer 300, or just completely cover the buffer layer 300, so as to avoid the adhesive layer 200 exceeding the edge of the third side surface C3 of the buffer layer 300 and directly contacting the first film layer 10, so as to avoid the problem of film peeling.

[0070] The positive projection of the buffer layer 300 on the functional film layer 100 is a strip structure. Along the direction X perpendicular to the thickness direction of the display module, the width D of the buffer layer 300 is greater than or equal to 0.6 mm. Specifically, the width between the metal layer 111 and the adhesive layer 200 may be greater than or equal to 0.6 mm. The buffer layer 300 may be arranged flush with one end of the metal layer 111 facing the adhesive layer 200. For example, along the direction X perpendicular to the thickness direction of the display module, part of the adhesive layer 200 is located on the outside of the supporting structure layer 110. Along the direction X perpendicular to the thickness direction of the display module, the first film layer 10 includes a first side surface C1 close to the adhesive layer 200. The buffer layer 300 includes a second side surface C2 close to the adhesive layer 200. Along the thickness direction Y of the display module, the first side surface C1 and the second side surface C2 are flush. The buffer layer 300 can just cover the part of the surface of the metal layer 111 close to the adhesive layer 200, so that the surface of the metal layer 111 facing away from the display layer 120 will not directly contact the adhesive layer 200, avoiding the problem of film peeling. Along the direction X perpendicular to the thickness direction of the display module, part of the adhesive layer 200 is located outside the supporting structure layer 110, that is, in the plan view, part of the adhesive layer 200 is located outside the supporting structure layer 110. The plan view is perpendicular to the thickness direction Y of the display module.

[0071] Optionally, the first side surface C1 and the first surface F1 intersect.

[0072] Optionally, the first side surface C1 and the second side surface C2 may be inclined surfaces inclined relative to the thickness direction Y of the display module.

[0073] Along the direction X perpendicular to the thickness direction of the display module, optionally, along the thickness direction Y of the display module, the thickness H of the buffer layer 300 is greater than or equal to 50 μm and less than or equal to 300 μm.

[0074] It is understandable that the thickness H of the buffer layer 300 should not be too small, otherwise it cannot absorb the deformation of the first film layer 10 and the adhesive layer 200, nor should it be too large, otherwise it may affect the overall thickness of the display module. Optionally, along the thickness direction Y of the display module, the thickness H of the buffer layer 300 can be equal to any one of 50μm, 100μm, 150μm, 200μm, 250μm, and 300μm.

[0075] See also Figure 3 In some optional embodiments, along the thickness direction Y of the display module, the functional film layer 100 includes a display layer 120 and a cover structure 130 disposed on the light-emitting side of the display layer 120 , and the cover structure 130 includes a first film layer 10 .

[0076] It should be noted that due to the large difference in the thermal expansion coefficient of the material of the cover structure 130 and the thermal expansion coefficient of the adhesive layer 200, the inventors have found through research that during reliability testing, the thermal deformation of the adhesive layer 200 and the cover structure 130 gradually increases from the center of the display module to the surrounding areas, which is prone to film peeling problems. In the present embodiment, the cover structure 130 includes a first film layer 10, that is, a film layer in the cover structure 130 and a buffer layer 300 is provided between the adhesive layer 200, so as to utilize the buffer layer 300 to play a buffering role and reduce the risk of film peeling caused by the deformation difference between the first film layer 10 and the adhesive layer 200.

[0077] Optionally, the cover plate structure 130 includes a cover plate 131 and a shading layer 132 located on the side of the cover plate 131 facing the adhesive layer 200, and the shading layer 132 is located in the border area NA, the surface of the side of the shading layer 132 facing the adhesive layer 200 is a first surface F1, and the buffer layer 300 is arranged between the shading layer 132 and the adhesive layer 200.

[0078] It can be understood that the light shielding layer 132 is provided in the frame area NA to shield light and avoid the appearance of bright edge lines. Since the light shielding layer 132 is provided on the lower surface of the cover plate 131, the buffer layer 300 needs to be provided between the light shielding layer 132 and the adhesive layer 200. Considering that the thickness of the light shielding layer 132 is relatively small, the influence of the light shielding layer 132 on the deformation of the buffer layer 300 can be approximately regarded as the influence of the cover plate 131 on the buffer layer 300. That is, the difference in thermal deformation between the cover plate 131 and the adhesive layer 200 needs to be improved by providing the buffer layer 300.

[0079] Optionally, the material of the light shielding layer 132 includes ink.

[0080] Optionally, the elastic modulus of the material of the cover plate 131 is greater than or equal to 70 GPa. For example, the cover plate 131 can be made of a rigid material, such as glass, which has a relatively low cost.

[0081] Optionally, a polarizer 140 , an adhesive layer 150 and other film layers are further provided between the display layer 120 and the cover structure 130 .

[0082] Optionally, along a direction X perpendicular to the thickness direction of the display module, at least part of the first film layer 10 is located outside the display layer 120, and the buffer layer 300 is in contact with the part of the first film layer 10 located outside the display layer 120, that is, the buffer layer 300 and the first film layer 10 are both located outside the display layer 120, so as to avoid affecting the normal display of the display layer 120.

[0083] Optionally, the cover plate 131 and the light-shielding layer 132 form a first film layer 10, that is, the first film layer 10 may include two layers, namely, the cover plate 131 and the light-shielding layer 132; or, the cover plate structure 130 includes the cover plate 131, and the cover plate 131 is the first film layer 10, that is, the buffer layer 300 may be arranged between the cover plate 131 and the adhesive layer 200.

[0084] In some optional embodiments, along the direction X perpendicular to the thickness direction of the display module, at least a portion of the buffer layer 300 is located outside the display layer 120, and along the direction X perpendicular to the thickness direction of the display module, the buffer layer 300 and the display layer 120 are spaced apart;

[0085] It can be understood that when the buffer layer 300 is arranged between the cover structure 130 and the adhesive layer 200, since the buffer layer 300 is also arranged in the border area NA, it is at least partially located on the side of the display layer 120. In order to avoid affecting the display layer 120, the spacing between the buffer layer 300 and the display layer 120 can be limited.

[0086] Optionally, the distance between the buffer layer 300 and the display layer 120 is greater than or equal to 0.3 mm. For example, the distance between the buffer layer 300 and the display layer 120 can be equal to any one of 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm. The specific selection can be based on the size of the cover structure 130 in the border area NA.

[0087] Optionally, the positive projection of the buffer layer 300 on the functional film layer 100 is a strip structure, and along the direction X perpendicular to the thickness direction of the display module, the width D of the buffer layer 300 is greater than or equal to 0.3 mm, and the width D of the buffer layer 300 should not be too small to reduce the area of ​​direct contact between the cover structure 130 and the adhesive layer 200, and improve the film peeling problem. Optionally, the width D of the buffer layer 300 can be equal to any one of 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm.

[0088] See also Figure 5 and Figure 6In some optional embodiments, there are multiple buffer layers 300, the functional film layer 100 includes multiple first film layers 10, and a buffer layer 300 is provided between each first film layer 10 and the adhesive layer 200, that is, the buffer layers 300 can be respectively provided at different positions.

[0089] Optionally, along a thickness direction Y of the display module, the display module includes a stacked support structure layer 110 , a display layer 120 , and a cover structure 130 , and both the support structure layer 110 and the cover structure 130 include a first film layer 10 .

[0090] In the prior art, the adhesive layer 200 needs to be bonded to the supporting structure layer 110 and the cover structure 130 respectively. In order to avoid film peeling between the adhesive layer 200 and the supporting structure layer 110, and between the adhesive layer 200 and the cover structure 130, a buffer layer 300 needs to be provided between the supporting structure layer 110, the cover structure 130 and the adhesive layer 200 respectively, so as to improve the film peeling problem between the adhesive layer 200 and the supporting structure layer 110, and between the adhesive layer 200 and the cover structure 130.

[0091] Optionally, a buffer layer 300 is disposed between the metal layer 111 of the support structure layer 110 and the adhesive layer 200 , and a buffer layer 300 is disposed between the light shielding layer 132 of the cover structure 130 and the adhesive layer 200 .

[0092] See also Figure 5 In some optional embodiments, the plurality of buffer layers 300 include a first buffer layer 310 located between the support structure layer 110 and the adhesive layer 200, and the buffer layer 300 includes a second buffer layer 320 located between the cover structure 130 and the adhesive layer 200; the first buffer layer 310 and the second buffer layer 320 are arranged independently of each other, so that the first buffer layer 310 and the second buffer layer 320 can be prepared separately, and the first buffer layer 310 and the second buffer layer 320 can be prevented from influencing each other.

[0093] See also Figure 6 Alternatively, the first buffer layer 310 and the second buffer layer 320 are an integrated structure, and a connecting portion 330 is provided between the first buffer layer 310 and the second buffer layer 320 , and the connecting portion 330 at least partially covers the side of the supporting structure layer 110 and the display layer 120 facing the adhesive layer 200 .

[0094] It can be understood that the first buffer layer 310 and the second buffer layer 320 are connected as a whole through the connecting portion 330. Since the first buffer layer 310 is arranged between the supporting structure layer 110 and the adhesive layer 200, and the second buffer layer 320 is arranged between the cover structure 130 and the adhesive layer 200, in order to connect the first buffer layer 310 and the second buffer layer 320, the connecting portion 330 needs to be arranged along the supporting structure layer 110 and the display layer 120, so as to extend from the side of the supporting structure layer 110 away from the display layer 120 to the upper cover structure 130. And since the connecting portion 330 at least partially covers the side of the supporting structure layer 110 and the display layer 120 facing the adhesive layer 200, it is possible to make the side of the supporting structure layer 110 and the display layer 120 facing the adhesive layer 200 and the adhesive layer 200 not directly contact each other, thereby avoiding the problem of peeling between the side of the supporting structure layer 110 and the display layer 120 facing the adhesive layer 200 and the adhesive layer 200.

[0095] See also Figure 1 Optionally, the orthographic projection of the buffer layer 300 on the functional film layer 100 is an annular structure, which can be a closed annular structure or a semi-closed annular structure, that is, an annular structure with an opening. For example, the orthographic projection of the buffer layer 300 on the functional film layer 100 is a non-closed annular structure. The specific selection can be made according to the specific structure of the display module. The buffer layer 300 corresponding to the cover plate structure 130 and the buffer layer 300 corresponding to the metal layer 111 can both adopt an annular structure for easy setting.

[0096] Alternatively, if space permits, the buffer layer 300 may also be provided on the entire surface, that is, the buffer layer 300 is provided as a whole layer. For example, when the buffer layer 300 is provided on the side of the metal layer 111 away from the display layer 120, due to ample space, the buffer layer 300 may be provided as a whole layer. Of course, if the buffer layer 300 interferes with other components or film layers of the display module, the shape of the buffer layer 300 may be adjusted accordingly to achieve avoidance.

[0097] See also Figure 1 and Figure 7 In some optional embodiments, the buffer layer 300 includes an avoidance opening K, the display layer 120 includes a display portion and a bending portion connected to the display portion, the bending portion is at least partially bent to the side of the supporting structure layer 110 away from the display portion, and along the thickness direction Y of the display module, the avoidance opening K at least partially overlaps with the bending portion.

[0098] It can be understood that since the bending portion at least partially needs to be bent to the side of the supporting structure layer 110 away from the display portion, the supporting structure layer 110 usually does not directly contact the adhesive layer 200. Therefore, the buffer layer 300 may not be set corresponding to the bending portion, that is, the first buffer layer 310 located in the metal layer 111 may be set with an avoidance opening K to avoid the bending portion. The specific size and shape of the avoidance opening K needs to be set according to the size and shape of the corresponding bending portion. Optionally, the size of the avoidance opening K is larger than the size of the bending portion to facilitate the setting of the bending portion.

[0099] Optionally, the bent portion is at least partially located at the avoidance opening K.

[0100] Optionally, the display module further includes a circuit board 400, the circuit board 400 is electrically connected to the bending portion, and the circuit board 400 is used to drive and control the luminous display of the display portion.

[0101] Optionally, a shielding adhesive layer 500 is provided on the side of the circuit board 400 away from the display portion and on the side of the bending portion away from the display portion to prevent external signals from affecting signal transmission of the circuit board 400 or the bending portion.

[0102] Optionally, a second back bearing layer B2 and a padding block 600 are further provided between the bending portion and the supporting structure layer 110 , and the padding block 600 is provided on a side of the second back bearing layer B2 away from the bending portion.

[0103] See also Figure 1 In some optional embodiments, the border area NA includes a straight edge area ZA and a corner area BA adjacent to the straight edge area ZA, and the buffer layer 300 is at least disposed in the corner area BA.

[0104] It should be noted that the film layer in the corner area BA of the display module can be bent. The inventors have found that during reliability testing, the deformation of the cover structure 130 and the adhesive layer 200 in the corner area BA is the largest, and the film peeling problem is prone to occur. Therefore, in this embodiment, a buffer layer 300 can be set at least in the corner area BA to avoid the problem of film peeling between the cover structure 130 and the adhesive layer 200 located in the corner area BA.

[0105] Optionally, the first film layer 10 includes an internal area XA and an edge area YA surrounding the internal area XA. Along the thickness direction Y of the display module, the positive projection of the buffer layer 300 on the first film layer 10 is located in the edge area YA. It can be understood that since the adhesive layer 200 is usually arranged corresponding to the edge of the display module and does not contact the internal area XA of the first film layer 10, the buffer layer 300 can be arranged in the edge area YA to avoid peeling of the first film layer 10 and the adhesive layer 200 in the edge area YA.

[0106] See also Figure 1 The embodiment of the present invention further provides a display module, having a display area AA and a frame area NA at least partially arranged around the display area AA, the display module comprising: a functional film layer 100, comprising a display layer 120 and a support structure layer 110 arranged on the side of the display layer 120 away from the light emitting surface, the support structure layer 110 comprising a first film layer 10; the display layer 120 comprising a driving circuit layer and a light emitting layer, the driving circuit layer being located between the supporting structure layer 110 and the light emitting layer; an adhesive layer 200, at least partially arranged in the frame area NA, And at least part of it is arranged on one side of the first film layer 10 along the thickness direction of the display module. Along the thickness direction Y of the display module, the first film layer 10 includes a first surface F1 facing the adhesive layer 200, and a buffer layer 300 is arranged between the first surface F1 and the adhesive layer 200. The buffer layer 300 is in contact with the first surface F1 and the adhesive layer 200 respectively. The elastic modulus of the material of the buffer layer 300 is smaller than the elastic modulus of the material of the first film layer 10, and the elastic modulus of the material of the buffer layer 300 is smaller than the elastic modulus of the material of the adhesive layer 200.

[0107] The display module provided by the embodiment of the present invention includes a functional film layer 100, a viscous layer 200 and a buffer layer 300. The supporting structure layer 110 includes a first film layer 10. The elastic modulus of the material of the buffer layer 300 is smaller than the elastic modulus of the material of the first film layer 10 and the viscous layer 200. The elastic modulus is a physical quantity that describes the ability of a material to resist deformation. The smaller the elastic modulus of a material, the easier it is to deform. Since the buffer layer 300 is disposed on the first surface F1 of the first film layer 10 of the supporting structure layer 110 and the viscous layer 200, the buffer layer 300 is disposed on the first surface F1 of the first film layer 10 of the supporting structure layer 110 and the viscous layer 200. 00, when the first film layer 10 and the adhesive layer 200 are deformed, the portion where the buffer layer 300 contacts the first film layer 10 deforms along with the first film layer 10, and the portion where the buffer layer 300 contacts the adhesive layer 200 deforms along with the adhesive layer 200. That is, the difference in deformation between the first film layer 10 and the adhesive layer 200 is eliminated by setting the buffer layer 300, thereby avoiding the generation of additional stress, thereby avoiding the first film layer 10 and the adhesive layer 200 from peeling off, or the adhesive layer 200 from cracking, thereby improving the performance of the display module.

[0108] Optionally, the supporting structure layer 110 includes a metal layer 111, and the surface of the metal layer 111 facing away from the display layer 120 is a first surface F1. The buffer layer 300 is arranged between the metal layer 111 and the adhesive layer 200. The material of the metal layer 111 may include copper, that is, the metal layer 111 may use a copper foil layer. Since the thermal expansion coefficient of the material of the metal layer 111 is 16.8μm / (m*℃), and the thermal expansion coefficient of the glue used for the adhesive layer 200 is generally greater than 100μm / (m*℃), the difference between the two is large, resulting in a large difference in the amount of thermal deformation generated by the metal layer 111 and the adhesive layer 200. Therefore, in this embodiment, a buffer layer 300 is arranged between the metal layer 111 and the adhesive layer 200 to reduce the risk of film peeling caused by the deformation difference between the first film layer 10 and the adhesive layer 200, thereby effectively improving the reliability of the display module.

[0109] In this embodiment, the metal layer 111 is used to support the display layer 120. On the other hand, since copper has good thermal conductivity, the metal layer 111 can improve the heat dissipation effect of the display module and avoid heat accumulation. Of course, the support structure layer 110 can also use a film layer of other materials to achieve support and heat dissipation, for example, a film layer of other metal materials can also be used.

[0110] Optionally, the supporting structure layer 110 further includes at least one foam layer and a glue layer disposed between the display layer 120 and the metal layer 111 to achieve buffering and protection for the display layer 120 and prevent the display layer 120 from being damaged.

[0111] Optionally, the elastic modulus of the material of the metal layer 111 is greater than or equal to 50 GPa, while the elastic modulus of the material of the adhesive layer 200 is generally smaller than the elastic modulus of the material of the metal layer 111. For example, the elastic modulus of the material of the adhesive layer 200 is greater than or equal to 500 MPa, that is, the metal layer 111 is not easily deformed relative to the adhesive layer 200.

[0112] Optionally, the elastic modulus of the material of the buffer layer 300 is less than or equal to 50 MPa, which is much smaller than the elastic modulus of the material of the metal layer 111 and the adhesive layer 200 , so that the buffer layer 300 can be deformed together with the metal layer 111 and the adhesive layer 200 .

[0113] In some optional embodiments, along the direction X perpendicular to the thickness direction of the display module, the width D of the buffer layer 300 is greater than or equal to 0.6 mm, specifically, the width between the metal layer 111 and the adhesive layer 200 is greater than or equal to 0.6 mm, and the buffer layer 300 can be arranged flush with the end of the metal layer 111 facing the adhesive layer 200, for example, along the direction X perpendicular to the thickness direction of the display module, the metal layer 111 includes a first side surface C1 close to the adhesive layer 200, and the buffer layer 300 includes a second side surface C2 close to the adhesive layer 200, and along the thickness direction Y of the display module, the first side surface C1 and the second side surface C2 are flush. That is, the buffer layer 300 just covers the partial surface of the metal layer 111 close to the adhesive layer 200, so that the surface of the metal layer 111 facing away from the display layer 120 will not directly contact the adhesive layer 200, thereby avoiding the problem of film peeling.

[0114] Optionally, along the thickness direction Y of the display module, the thickness H of the buffer layer 300 is greater than or equal to 50 μm and less than or equal to 300 μm.

[0115] It is understandable that the thickness H of the buffer layer 300 should not be too small, otherwise it cannot absorb the deformation of the first film layer 10 and the adhesive layer 200, nor should it be too large, otherwise it may affect the overall thickness of the display module. Optionally, along the thickness direction Y of the display module, the thickness H of the buffer layer 300 can be equal to any one of 50μm, 100μm, 150μm, 200μm, 250μm, and 300μm.

[0116] See also Figure 5 or Figure 6 In some optional embodiments, the functional film layer 100 further includes a cover structure 130 disposed on the side of the light-emitting layer away from the driving circuit layer, and a buffer layer 300 is disposed between the cover structure 130 and the adhesive layer 200 in the frame area NA;

[0117] In this embodiment, a buffer layer 300 is provided between the cover structure 130 and the adhesive layer 200 , so that the buffer layer 300 plays a buffering role and reduces the risk of film peeling caused by the deformation difference between the first film layer 10 and the adhesive layer 200 .

[0118] Optionally, the cover plate structure 130 includes a cover plate 131 and a shading layer 132 located on the side of the cover plate 131 facing the adhesive layer 200, and the shading layer 132 is located in the border area NA, the surface of the side of the shading layer 132 facing the adhesive layer 200 is a first surface F1, and the buffer layer 300 is arranged between the shading layer 132 and the adhesive layer 200.

[0119] It can be understood that the light shielding layer 132 is provided in the frame area NA to shield light and avoid the appearance of bright edge lines. Since the light shielding layer 132 is provided on the lower surface of the cover plate 131, the buffer layer 300 needs to be provided between the light shielding layer 132 and the adhesive layer 200. Considering that the thickness of the light shielding layer 132 is relatively small, the influence of the light shielding layer 132 on the deformation of the buffer layer 300 can be approximately regarded as the influence of the cover plate 131 on the buffer layer 300. That is, the difference in thermal deformation between the cover plate 131 and the adhesive layer 200 needs to be improved by providing the buffer layer 300.

[0120] Optionally, the material of the light shielding layer 132 includes ink.

[0121] Optionally, the elastic modulus of the material of the cover plate 131 is greater than or equal to 70 GPa. For example, the cover plate 131 can be made of a rigid material, such as glass, which has a relatively low cost.

[0122] In some optional embodiments, along a direction X perpendicular to the thickness direction of the display module, the buffer layer 300 and the display layer 120 are spaced apart from each other;

[0123] It can be understood that when the buffer layer 300 is arranged between the cover structure 130 and the adhesive layer 200, since the buffer layer 300 is also arranged in the border area NA, it is at least partially located on the side of the display layer 120. In order to avoid affecting the display layer 120, the spacing between the buffer layer 300 and the display layer 120 can be limited.

[0124] Optionally, the distance between the buffer layer 300 and the display layer 120 is greater than or equal to 0.3 mm. For example, the distance between the buffer layer 300 and the display layer 120 can be equal to any one of 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm. The specific selection can be based on the size of the cover structure 130 in the border area NA.

[0125] Optionally, along the direction X perpendicular to the thickness direction of the display module, the width D of the buffer layer 300 is greater than or equal to 0.3 mm, and the width D of the buffer layer 300 should not be too small to reduce the area of ​​direct contact between the cover structure 130 and the adhesive layer 200 and improve the film peeling problem. Optionally, the width D of the buffer layer 300 can be equal to any one of 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm.

[0126] In some optional embodiments, before preparing the adhesive layer 200, the surface of the film layer that needs to contact the adhesive layer 200, such as the surface of the buffer layer 300 facing the adhesive layer 200, can be processed by a plasma treatment process to reduce the water drop angle of the corresponding film layer surface, thereby increasing the bonding effect between the adhesive layer 200 and the corresponding film layer to avoid falling off.

[0127] See also Figure 8 An embodiment of the present invention further provides a display device, the display device includes a middle frame structure 700, the middle frame structure 700 includes a receiving space, the display module is at least partially located in the receiving space, and the display module is the display module in any of the above embodiments.

[0128] Optionally, the adhesive layer 200 in the display module may be connected to the middle frame structure 700 .

[0129] Optionally, the middle frame structure 700 includes a bottom plate 710 and a side plate 720 connected to each other, and the bottom plate 710 and the side plate 720 enclose a receiving space; the display device also includes a structural adhesive 800, and the structural adhesive 800 includes a first adhesive portion 810 and a second adhesive portion 820 connected to each other, the first adhesive portion 810 is arranged between the bottom plate 710 and the adhesive layer 200, and the second adhesive portion 820 is arranged between the side plate 720 and the adhesive layer 200.

[0130] In this embodiment, the structural adhesive 800 is configured as a first adhesive portion 810 and a second adhesive portion 820 that are connected. Since the shape of the adhesive layer 200 is easier to control, the first adhesive portion 810 and the second adhesive portion 820 are respectively connected to the adhesive layer 200 to avoid a larger border width caused by direct contact between the structural adhesive 800 and other film layers of the display module, thereby reducing the border width of the display device.

[0131] Optionally, the cross-sectional area of ​​the second adhesive portion 820 gradually decreases from the direction of the bottom plate 710 toward the display module, so as to increase the disposition space of the adhesive layer 200 and reduce the influence of the second adhesive portion 820 on the frame width.

[0132] The display device provided by the embodiment of the present invention has the technical effects of the technical solution of the display module in any of the above embodiments, and the explanations of the structures and terms that are the same as or corresponding to the above embodiments are not repeated here.

[0133] The display device provided in the embodiment of the present application can be applied to a mobile phone, or it can be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present application does not make any special limitations on this.

[0134] The above are only specific implementation methods of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

[0135] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

Claims

1. A display module, characterized in that: The display module has a display area and a frame area at least partially surrounding the display area, and includes: A functional film layer, wherein the functional film layer comprises a first film layer; The adhesive layer is at least partially arranged in the frame area, and at least partially arranged on one side of the first film layer along the thickness direction of the display module. Along the thickness direction of the display module, the first film layer includes a first surface facing the adhesive layer, and a buffer layer is arranged between the first surface and the adhesive layer. The elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the first film layer, and the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the adhesive layer.

2. The display module according to claim 1, characterized in that: Along the thickness direction of the display module, the functional film layer includes a display layer and a support structure layer arranged on a side of the display layer away from the light emitting surface, and the support structure layer includes the first film layer.

3. The display module according to claim 2, characterized in that: The supporting structure layer includes a metal layer, and the metal layer is the first film layer; Preferably, along the direction in which the metal layer approaches the display layer, the support structure layer further includes a first bonding layer, a foam layer and a second bonding layer which are located between the metal layer and the display layer and are arranged in sequence; Preferably, the elastic modulus of the material of the metal layer is greater than or equal to 50 GPa; Preferably, the elastic modulus of the material of the buffer layer is less than or equal to 50 MPa; Preferably, the elastic modulus of the material of the adhesive layer is greater than or equal to 500 MPa; Preferably, the material of the metal layer includes copper; Preferably, the material of the buffer layer includes polyurethane.

4. The display module according to claim 2, characterized in that: The orthographic projection of the buffer layer on the functional film layer is a strip-shaped structure; The width of the buffer layer is greater than or equal to 0.6 mm; the width direction of the buffer layer is perpendicular to the thickness direction of the display module; Preferably, along the thickness direction of the display module, the thickness of the buffer layer is greater than or equal to 50 μm and less than or equal to 300 μm.

5. The display module according to claim 2, characterized in that: Along a direction perpendicular to the thickness direction of the display module, the adhesive layer is located on a side of the inner edge of the buffer layer away from the display area; Preferably, along a direction perpendicular to the thickness direction of the display module, part of the adhesive layer is located on the outside of the supporting structure layer; along a direction perpendicular to the thickness direction of the display module, the first film layer includes a first side surface close to the adhesive layer, and the buffer layer includes a second side surface close to the adhesive layer; the first side surface and the second side surface are flush with each other.

6. The display module according to claim 1, characterized in that: Along the thickness direction of the display module, the functional film layer includes a display layer and a cover plate structure arranged on the light-emitting side of the display layer, and the cover plate structure includes the first film layer.

7. The display module according to claim 6, characterized in that: The cover plate structure includes a cover plate and a light shielding layer located on a side of the cover plate facing the adhesive layer, and the light shielding layer is located in the frame area, a surface of the light shielding layer facing the adhesive layer is the first surface, and the buffer layer is provided between the light shielding layer and the adhesive layer; the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the cover plate, and the cover plate and the light shielding layer form the first film layer; or, the cover plate structure includes a cover plate, and the cover plate is the first film layer; Preferably, the material of the light-shielding layer includes ink; Preferably, the elastic modulus of the material of the cover plate is greater than or equal to 70 GPa.

8. The display module according to claim 6, characterized in that: Along a direction perpendicular to the thickness direction of the display module, at least a portion of the first film layer is located outside the display layer, and the buffer layer is in contact with a portion of the first film layer located outside the display layer.

9. The display module according to claim 6, characterized in that: Along a direction perpendicular to the thickness direction of the display module, the buffer layer is located outside the display layer, and along a direction perpendicular to the thickness direction of the display module, the buffer layer and the display layer are spaced apart; Preferably, the distance between the buffer layer and the display layer is greater than or equal to 0.3 mm; Preferably, the orthographic projection of the buffer layer on the functional film layer is a strip-shaped structure, and along a direction perpendicular to the thickness direction of the display module, the width of the buffer layer is greater than or equal to 0.3 mm.

10. The display module according to claim 1, characterized in that: The number of the buffer layers is multiple, the functional film layer includes multiple first film layers, and the buffer layer is provided between each of the first film layers and the adhesive layer; Preferably, along the thickness direction of the display module, the display module comprises a supporting structure layer, a display layer and a cover plate structure which are stacked, and both the supporting structure layer and the cover plate structure comprise the first film layer.

11. The display module according to claim 10, characterized in that: The plurality of buffer layers include a first buffer layer located between the support structure layer and the adhesive layer, and the buffer layer includes a second buffer layer located between the cover structure and the adhesive layer; The first buffer layer and the second buffer layer are provided independently of each other; or, The first buffer layer and the second buffer layer are an integrated structure. A connecting portion is provided between the first buffer layer and the second buffer layer. The connecting portion at least partially covers the side surfaces of the supporting structure layer and the display layer facing the adhesive layer.

12. The display module according to claim 1, characterized in that: The orthographic projection of the buffer layer on the functional film layer is a strip-shaped structure; or, the buffer layer is disposed on the entire surface; Preferably, the orthographic projection of the buffer layer on the functional film layer is a ring-shaped structure; Preferably, the orthographic projection of the buffer layer on the functional film layer is a non-closed annular structure.

13. The display module according to claim 2, characterized in that: The buffer layer includes an avoidance opening; The display layer includes a display portion and a bending portion connected to the display portion, the bending portion is at least partially bent to a side of the support structure layer away from the display portion, and along the thickness direction of the display module, the avoidance opening at least partially overlaps with the bending portion; Preferably, the display module further includes a circuit board, and the circuit board is electrically connected to the bending portion.

14. The display module according to claim 1, characterized in that: The frame area includes a straight edge area and a corner area adjacent to the straight edge area, and the buffer layer is at least arranged in the corner area.

15. The display module according to claim 1, characterized in that: The first film layer includes an inner region and an edge region surrounding the inner region. Along the thickness direction of the display module, the orthographic projection of the buffer layer on the first film layer is located in the edge region.

16. A display module, characterized in that: The display module has a display area and a frame area at least partially surrounding the display area, and includes: The functional film layer comprises a display layer and a support structure layer arranged on the side of the display layer away from the light emitting surface, wherein the support structure layer comprises a first film layer; the display layer comprises a driving circuit layer and a light emitting layer, wherein the driving circuit layer is located between the supporting structure layer and the light emitting layer; The adhesive layer is at least partially arranged in the frame area, and at least partially arranged on one side of the first film layer along the thickness direction of the display module. Along the thickness direction of the display module, the first film layer includes a first surface facing the adhesive layer, and a buffer layer is arranged between the first surface and the adhesive layer. The buffer layer contacts the first surface and the adhesive layer respectively, and the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the first film layer, and the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the adhesive layer.

17. The display module according to claim 16, characterized in that: The supporting structure layer comprises a metal layer, a surface of the metal layer facing away from the display layer is the first surface, and the buffer layer is arranged between the metal layer and the adhesive layer; Preferably, the elastic modulus of the material of the metal layer is greater than or equal to 50 GPa; Preferably, the elastic modulus of the material of the buffer layer is less than or equal to 50 MPa; Preferably, the elastic modulus of the material of the adhesive layer is greater than or equal to 500 MPa; Preferably, the material of the metal layer includes copper; Preferably, the orthographic projection of the buffer layer on the functional film layer is a strip-shaped structure; Preferably, along a direction perpendicular to the thickness direction of the display module, the width of the buffer layer is greater than or equal to 0.6 mm; Preferably, along the thickness direction of the display module, the thickness of the buffer layer is greater than or equal to 50 μm and less than or equal to 300 μm.

18. The display module according to claim 17, characterized in that: The functional film layer further comprises a cover plate structure disposed on a side of the light emitting layer away from the driving circuit layer, and the buffer layer is disposed between the cover plate structure and the adhesive layer in the frame area; Preferably, the cover plate structure comprises a cover plate and a light shielding layer located on a side of the cover plate facing the adhesive layer, and the light shielding layer is located in the frame area, a surface of the light shielding layer facing the adhesive layer is the first surface, and the buffer layer is provided between the light shielding layer and the adhesive layer; the elastic modulus of the material of the buffer layer is smaller than the elastic modulus of the material of the cover plate; Preferably, the elastic modulus of the material of the cover plate is greater than or equal to 70 GPa.

19. A display device, characterized in that: The display device comprises a middle frame structure, the middle frame structure comprises a receiving space, the display module is at least partially located in the receiving space, and the display module is the display module according to any one of claims 1 to 18.

20. The display device according to claim 19, characterized in that The middle frame structure includes a bottom plate and side plates connected to each other, and the bottom plate and the side plates enclose the accommodation space; The display device further includes a structural adhesive, the structural adhesive including a first adhesive portion and a second adhesive portion connected to each other, the first adhesive portion being disposed between the bottom plate and the adhesive layer, and the second adhesive portion being disposed between the side plate and the adhesive layer; Preferably, from the direction of the bottom plate toward the display module, the cross-sectional area of ​​the second adhesive portion gradually decreases.

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