Array element leading-out structure of ultrasonic probe, sound head and ultrasonic probe

Abstract

An array element leading-out structure of an ultrasonic probe, a sound head and the ultrasonic probe are characterized in that each pair of second leading-out pieces in the array element leading-out structure is electrically connected through a connecting part, and on a reference surface perpendicular to a third direction, a first gap between sub-arrays is at least partially overlapped with orthographic projection of the connecting part on the reference surface; according to the embodiment of the invention, the proportion of the area (called the conductive switching area) for arranging the first conductive switching part on the sub-electric adapter can be larger, that is, compared with the existing structure, under the condition of the same width, the electric adapter disclosed by the embodiment has the wider conductive switching area, so that the first conductive switching part of the electric adapter can be prevented from being cut when the sub-array is cut and manufactured, and the production efficiency of the sub-array is improved. And the electric adapter can meet the leading-out requirement of the sub-array with smaller width, so that more array elements can be arranged in the array element layer with the same width.

Description

Ultrasonic probe array element lead structure, acoustic head and ultrasonic probe Technical Field

[0001] The present application relates to an ultrasonic probe, and in particular to an array element lead structure, an acoustic head and an ultrasonic probe. Background Art

[0002] In an ultrasound probe's transducer, the positive lead of a single array element requires the use of an FPC (flexible printed circuit board). For example, in a multi-dimensional array transducer, it typically consists of an element layer (a piezoelectric material layer or a wafer layer) and a flexible printed circuit board. The element layer typically has multiple elements arranged in an array, while the flexible printed circuit board comprises a transfer layer (also known as a large gold surface) and a lead assembly (also known as a routing layer). The transfer layer has multiple electrical adapters, each corresponding to an array element. The upper portion of the electrical adapter makes electrical contact with the positive electrode of the corresponding sub-array, while the lower portion is electrically connected to the corresponding lead in the lead assembly via a conductive via, thereby leading the positive electrode of the array element out through the lead below the electrical adapter.

[0003] To improve the performance of the ultrasonic transducer, each array element can be further cut into at least two sub-arrays, with a first gap formed between the sub-arrays. Typically, when processing the sub-arrays, the piezoelectric material is first applied to the transfer layer of the flexible printed circuit board. The piezoelectric material and the transfer layer are then cut together using a machine to form the array elements and the corresponding electrical adapters. The array elements and the corresponding electrical adapters are then further cut to form the separated sub-arrays and their corresponding sub-electrical adapters.

[0004] With the development of high-resolution transducers, more array elements need to be set under the array element layer of the same area, which gradually reduces the size of a single array element. In particular, when the array element has two sub-arrays, the size (i.e., width) of a single sub-array in the direction perpendicular to the extension direction of the first gap is narrower, which also causes the width of the sub-electrical adapter corresponding to the sub-array to become narrower, further limiting the width of the conductive transfer area on the sub-electrical adapter. In addition, due to the influence of the processing technology, the aperture of the conductive through-hole cannot be further reduced after reaching the limit size. Once the width of the conductive transfer area on the sub-electrical adapter is smaller than the setting requirement of the conductive through-hole, it is very easy to cut into the conductive through-hole on the sub-electrical adapter, causing the electrical connection to fail. Therefore, after the number of array elements in the multi-dimensional array transducer reaches the limit value, the array element width cannot be further reduced, and it is difficult to design a larger number of array elements, thereby affecting the progress of the multi-dimensional array transducer. Technical issues

[0005] The present application mainly provides an array element lead-out structure of an ultrasonic probe, an acoustic head and an ultrasonic probe, to demonstrate a new array element lead-out structure. Technical Solutions

[0006] Based on the above objectives, an embodiment of the present application provides an array element extraction structure of an ultrasound probe, including:

[0007] an array element layer, the array element layer comprising a plurality of array element groups arranged along a first direction, the array element groups comprising n array elements arranged along a second direction, where n is an odd number greater than or equal to 3; the array elements being divided into at least two sub-arrays by a first gap; wherein the array elements in the array element group are divided into at least a first array element located in the middle and at least one pair of second array elements, each pair of second array elements being arranged on opposite sides of the first array element in the second direction;

[0008] and a flexible circuit board, the flexible circuit board having a transfer layer and a lead-out component, the array element layer, the transfer layer and the lead-out component are arranged along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other;

[0009] The switching layer comprises a plurality of electrical switching component groups arranged along a first direction, and the electrical switching component groups comprise a plurality of electrical switching components arranged along a second direction, wherein the electrical switching components of each electrical switching component group are respectively in contact with and electrically connected to the positive electrodes of the array elements in the corresponding array element group;

[0010] The lead assembly comprises a plurality of lead member groups arranged along a first direction, the lead member groups comprising a plurality of lead members, the lead members comprising at least a first lead member and at least a pair of second lead members, the first lead member being electrically connected to a corresponding first array element via a corresponding electrical adapter, and each pair of second lead members being electrically connected to a pair of second array elements via a corresponding electrical adapter; the lead members being configured to be electrically connected to a positive signal circuit of a control unit to input a positive signal to the corresponding array element;

[0011] The electrical adapter is provided with a first conductive adapter portion, and the lead-out member is provided with a second conductive adapter portion. The first conductive adapter portion and the corresponding second conductive adapter portion are stacked and electrically connected in the stacking direction to electrically connect the electrical adapter and the corresponding lead-out member; each pair of second lead-out members is electrically connected via a connecting portion, and on a reference plane perpendicular to the third direction, the orthographic projection of the first gap and the orthographic projection of the connecting portion at least partially overlap, and the second conductive adapter portion on the first lead-out member between each pair of second lead-out members and the orthographic projection of the corresponding first conductive adapter portion on the reference plane are distributed on both sides of the orthographic projection of the connecting portion.

[0012] In one embodiment, at least one other lead-out member is interposed between at least one pair of second lead-out members, and the other lead-out member includes the first lead-out member, the first adapter lead-out member and / or the second adapter lead-out member, and the other lead-out member has a second gap, and the connecting portion passes through the corresponding second gap.

[0013] In one embodiment, the orthographic projection of the first gap on the reference plane does not exceed the orthographic projection of the second gap on the reference plane in the first direction.

[0014] In one embodiment, the position differences between the second array elements in the same pair and the first array element are the same.

[0015] In one embodiment, n is equal to 3, and the electrical adapter of the electrical adapter group is divided into at least a first electrical adapter and a pair of second electrical adapters located on both sides of the first electrical adapter, and the first electrical adapter and the second electrical adapter are respectively in contact with and electrically connected to the positive poles of the corresponding first array element and the second array element; the lead-out members of the lead-out member group are divided into at least a first lead-out member and a pair of second lead-out members located on both sides of the first lead-out member, and the first lead-out member and the second lead-out member are electrically connected to the corresponding first electrical adapter and the second electrical adapter.

[0016] In one embodiment, the first electrical adapter and the second electrical adapter have conductive contact areas that are in contact with corresponding sub-arrays; in one group of the electrical adapters, at least one of the second electrical adapters has a first extension portion located outside its conductive contact area, and the first extension portion is electrically connected to the corresponding conductive contact area; in the second electrical adapter having the first extension portion, its first extension portion is provided with a first conductive adapter portion.

[0017] In one embodiment, the first electrical adapter and the second electrical adapter are divided into a plurality of sub-electrical adapters, each of which corresponds to the sub-arrays one by one, and each of the sub-electrical adapters has the conductive contact area.

[0018] In one embodiment, the first lead-out member and the second lead-out member are provided with a second conductive transition portion, and the second conductive transition portion is electrically connected to the corresponding first conductive transition portion; wherein, at least one of the second lead-out members has a second extension portion corresponding to the first extension portion; in the second lead-out member having the second extension portion, its second extension portion is provided with a second conductive transition portion.

[0019] In one embodiment, the first extension portion and the second extension portion are bent in a direction away from the array element layer.

[0020] In one embodiment, the second extension portion has an electrical external connection structure, and the electrical external connection structure is used to be electrically connected to the positive signal circuit.

[0021] In one embodiment, the first lead-out member has at least two first sub-lead-out members, a second gap is formed between the first sub-lead-out members, and the connecting portion passes through the second gap; the first sub-lead-out member has a third extension portion, and the third extension portion of each first sub-lead-out member extends from the side of the second lead-out member to the outside of the end portion of the second extension portion and is electrically connected to each other to form an electrical external connection structure, and the electrical external connection structure is used to be electrically connected to the positive signal circuit.

[0022] In one embodiment, there are two first sub-lead-out members, and the two first sub-lead-out members are symmetrical about the second gap.

[0023] In one embodiment, in the lead-out member group, at least one lead-out member is a first adapter lead-out member, the first adapter lead-out member is arranged on a side of the first lead-out member away from the first electrical adapter member, and is electrically connected to the first lead-out member, the first adapter lead-out member and the second lead-out member respectively have an electrical external connection structure, and the electrical external connection structure is used to be electrically connected to the positive signal circuit.

[0024] In one embodiment, n is greater than or equal to 5, and the electrical adapters of each electrical adapter group correspond one-to-one to the array elements of one array element group; the lead elements in the lead element group are arranged in at least m layers along the third direction, where m=(n+1) / 2; wherein the layer of lead elements closest to the electrical adapter group is the first layer, and the layer of lead elements farthest from the electrical adapter group is the mth layer;

[0025] The first layer of lead-out components includes a first lead-out component, and the first lead-out component is electrically connected to a corresponding electrical adapter component;

[0026] In the first to the (m-1)th layers, each layer of lead-out components has a pair of second lead-out components, and the second lead-out components of the first layer of lead-out components are electrically connected to the first conductive transition portions of the corresponding electrical transition components; in the second to the (m-1)th layers, the second lead-out components in each layer are electrically connected to the corresponding electrical transition components through the corresponding second transition lead-out components of the previous layer;

[0027] In the 2nd to the mth layers, each layer of lead-out parts has a first adapter lead-out part, which is electrically connected to each first adapter lead-out part in the lower layer, and at least one second lead-out part and at least one first adapter lead-out part in each pair of second lead-out parts can be electrically connected to the positive signal circuit.

[0028] In one embodiment, in at least one layer of lead-out members, the connecting portion between a pair of the second lead-out members passes through the second gap of the first lead-out member and / or the first transition lead-out member.

[0029] In one embodiment, in at least one layer of lead-out members, the second lead-out member has a second extension portion, an outer end portion of the second extension portion is located outside the array element layer, and the outer end portion is provided with the electrical external connection structure.

[0030] In one embodiment, in at least one layer of lead-out members, at least one pair of second adapter lead-out members are relatively arranged on both sides of a pair of second lead-out members, and the second extension portion of the second lead-out member passes through the corresponding second adapter lead-out member and extends outside the array element layer.

[0031] In one embodiment, in at least one layer of lead-out components, the second transfer lead-out component has a fourth extension portion, the fourth extension portion is located outside the array element layer, and the fourth extension portion is provided with the electrical external connection structure.

[0032] In one embodiment, n=5, and the array element group has one first array element and two pairs of second array elements;

[0033] The m=3, the first layer of lead-out components comprises a first lead-out component, a pair of second lead-out components, and a pair of second adapter lead-out components. The second lead-out components are disposed on opposite sides of the first lead-out component, and the second adapter lead-out components are disposed on opposite sides of the pair of second lead-out components. The second lead-out component and the second adapter lead-out component are each electrically connected to a corresponding second array element.

[0034] The second layer of lead-out components comprises a first transfer lead-out component and a pair of second lead-out components, wherein the second lead-out components are electrically connected to the second transfer lead-out components of the first layer, so as to be electrically connected to the corresponding second array element through the second transfer lead-out components;

[0035] The third-layer lead-out component has a first transfer lead-out component, the first transfer lead-out component of the third layer is electrically connected to the first transfer lead-out component of the second layer, and the first transfer lead-out component of the third layer has the electrical external connection structure.

[0036] In one embodiment, a first insulating layer is provided between the transfer layer and the lead-out component;

[0037] And / or, a second insulating layer is provided between the lead-out parts of each layer of the lead-out assembly.

[0038] In one embodiment, a negative electrode lead-out structure is further included, wherein the negative electrode lead-out structure is electrically connected to the negative electrode of the array element, and the negative electrode lead-out member is used to electrically connect the negative electrode of the array element to the negative electrode signal circuit of the control unit.

[0039] In one embodiment, in the array element group, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.4 mm, and the width of a single sub-array in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm; or, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.33 mm, and the width of a single sub-array in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.14 mm. Beneficial effects

[0040] Based on the above purpose, an embodiment of the present application provides an acoustic head of an ultrasound probe, including a backing, a matching layer, a lens, and an array element lead-out structure as shown in any of the above items, wherein the flexible circuit board is arranged on the backing, the matching layer is located on the array element layer, and the lens is arranged on the matching layer.

[0041] Based on the above purpose, an embodiment of the present application provides an ultrasound probe, including an acoustic head having an array element extraction structure as shown above.

[0042] According to the array element lead-out structure of the above embodiment, each pair of second lead-out elements is electrically connected via a connecting portion. On a projection plane perpendicular to the third direction, the orthographic projection of the first gap between the sub-arrays at least partially overlaps with the orthographic projection of the connecting portion. Because the area of ​​the electrical adapter opposite the corresponding first gap is typically not provided with a first conductive transition portion (e.g., a conductive via), aligning the connecting portion at least partially with this area allows a larger area on the sub-electrical adapter for providing the first conductive transition portion (referred to as the conductive transition area). That is, compared to existing structures, under conditions of the same width, the electrical adapter of this embodiment has a wider conductive transition area. This not only avoids cutting into the first conductive transition portion of the electrical adapter during sub-array fabrication, but also enables the electrical adapter to meet the lead-out requirements of sub-arrays of smaller width, thereby enabling the placement of more array elements within an array element layer of the same width. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] FIG1 is a schematic diagram of the appearance structure of an acoustic head in one embodiment of the present application;

[0044] FIG2 is a schematic cross-sectional view of an acoustic head in one embodiment of the present application;

[0045] FIG3 is an exploded schematic diagram of an array element layer, a transfer layer, and a lead-out assembly in the stacking direction in one embodiment of the present application, showing an insulating substrate layer in a flexible circuit board;

[0046] FIG4 is a schematic structural diagram of an array element layer, a transfer layer, and an extraction component in one embodiment of the present application. In order to facilitate visualization of the corresponding relationship between the transfer layer and the extraction component, the insulating substrate layer is omitted in the figure;

[0047] FIG5 is an exploded schematic diagram of an array element layer and a transfer layer in one embodiment of the present application, in which the insulating substrate layer is omitted;

[0048] FIG6 is a schematic diagram showing the distribution of lead-out components in one embodiment of the present application;

[0049] FIG7 is a schematic structural diagram of an array element layer, a transfer layer, and an output assembly in one embodiment of the present application. In order to facilitate visualization of the corresponding relationship between the array element layer, the transfer layer, and the output assembly, the insulating substrate layer is omitted in the figure;

[0050] FIG8 is a side view of the structure of an array element layer, a transfer layer, and an output component in one embodiment of the present application;

[0051] FIG9 is an exploded schematic diagram of an array element layer, a transfer layer, and a lead-out assembly in the stacking direction in one embodiment of the present application, with the insulating substrate layer omitted in the figure;

[0052] FIG10 is a schematic structural diagram of a first layer lead-out member in an embodiment of the present invention;

[0053] FIG11 is a schematic structural diagram of a second layer lead-out member in an embodiment of the present invention;

[0054] FIG12 is a schematic structural diagram of a third layer lead-out member in an embodiment of the present invention;

[0055] 13 and 14 are schematic diagrams of the structure in two different perspectives when the negative electrode of the array element is led out through copper foil in one embodiment of the present application;

[0056] 15 and 16 are schematic structural diagrams from two different perspectives when the negative electrode of an array element is led out through copper foil in one embodiment of the present application;

[0057] FIG17 is a schematic diagram of a structure in which the negative electrode of an array element is led out through a conductive layer in one embodiment of the present application;

[0058] FIG18 is a schematic diagram showing a connection portion between the second lead-out members passing from the side of the first lead-out member in one embodiment;

[0059] FIG19 is a cross-sectional schematic diagram of an embodiment of the present application in which an array element layer, a switching layer, and a lead-out assembly are in cooperation. Modes for Carrying Out the Invention

[0060] The present application is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0061] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0062] Component numbers used herein, such as "first" and "second," are used solely to distinguish the components being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0063] This application provides an ultrasound probe that can be used in various types of ultrasound equipment. Referring to Figures 1 and 2 , in some embodiments, the ultrasound probe comprises an acoustic head 1 and a main control unit (not shown). The acoustic head 1 is primarily used to transmit ultrasonic signals toward a subject and receive reflected ultrasonic signals. The main control unit is electrically connected to the acoustic head 1 to control signal transmission and reception, among other things.

[0064] Referring to Figures 1 and 2 , in some embodiments, the acoustic head 1 includes a lens 100, a matching layer 200, an element layer 300, a flexible circuit board 400, and a backing layer 500. The lens 100, matching layer 200, element layer 300, flexible circuit board 400, and backing layer 500 are stacked. The element layer 300 can be used to transmit and receive ultrasonic signals. The matching layer 200 is a layer of acoustic material applied to the radiating surface of the element layer 300 to achieve acoustic characteristic impedance matching between the element layer 300 and the sound transmission medium, ensuring good sound energy transmission. The lens 100 can contact the object being detected and transmit ultrasonic signal waves. The backing layer 500 absorbs unwanted sound waves radiated from the back of the element layer 300 and also serves as a support structure for other components of the acoustic head 1. The specific structure of the acoustic head 1, except for the improved structure described in this embodiment, can refer to various existing ultrasonic probes and will not be described in further detail here.

[0065] The main control unit needs to be electrically connected to the array elements in the acoustic head 1 to achieve electrical signal transmission, such as sending excitation signals to the array elements and receiving signals recovered by the array elements. The main control unit can use various main control circuits capable of controlling the acoustic head 1. The main control circuit can be provided on one or more control circuit boards, which can be PCBs or FPCBs. Typically, the main control unit is provided separately from the acoustic head 1, and the acoustic head 1 leads the array elements inside it through corresponding array element lead-out structures and is electrically connected to the main control unit. The main control unit has a positive signal circuit and a negative signal circuit. The positive signal circuit is used to electrically connect to the electrical external connection structure for positive lead-out in the array element lead-out structure, and the negative signal circuit is used to electrically connect to the electrical external connection structure for negative lead-out in the array element lead-out structure.

[0066] The array element lead-out structure is used to realize the positive and negative lead-out of the array element. Referring to Figures 2-4 and 7-9, in some embodiments, the array element lead-out structure includes an array element layer 300 and a flexible circuit board 400.

[0067] Referring to Figure 3 , in some embodiments, the array element layer 300 includes multiple array element groups 301 arranged along a first direction. Specifically, referring to Figures 3 and 7 , in some embodiments, array elements located in the same column along a second direction are referred to as an array element group 301. The number of array element groups 301 can be set based on the desired functions and effects of the acoustic head 1.

[0068] The array element group 301 has n array elements arranged along the second direction. The number n varies in the acoustic head 1 of different types of ultrasonic probes. For example, in some embodiments, the acoustic head 1 is an acoustic head 1 of a multi-dimensional ultrasonic probe, and n is an odd number greater than or equal to 3. Referring to Figures 3 and 9 , in some embodiments, the array elements in the array element group 301 are divided into at least a first array element 310 located in the middle and at least one pair of second array elements 320, with each pair of second array elements 320 arranged oppositely on either side of the first array element 310 in the second direction. Typically, the positive terminals of each pair of second array elements 320 are electrically connected together and electrically connected to the main control unit as a whole. Depending on different needs and functions, in different embodiments of the acoustic head 1, each array element group 301 may have one or more pairs of second array elements 320, wherein the size, shape, or dimensions of each second array element in each pair may be the same or different.

[0069] 3 , in one embodiment, n is equal to 3, i.e., the array element group 301 has three array elements arranged along the second direction. Each array element group 301 has a pair of second array elements 320 located on either side of the first array element 310 in the second direction.

[0070] In some other embodiments, n is greater than or equal to 5, meaning that the array element group 301 has five or more array elements (e.g., 310, 320) arranged along the second direction. When each array element group 301 has two or more pairs of second array elements 320, the position difference between each pair of second array elements 320 and the first array element 310 is the same. The position difference between each pair of second array elements 320 and the first array element 310 is the same, meaning that, with the first array element 310 as the reference position, the two second array elements 320 in the same pair have the same position relative to the first array element 310, measured from the first array element 310 in the second direction. For example, referring to Figures 7 and 9, in one embodiment, the array element group 301 has five array elements arranged along the second direction. The center array element is the first array element 310, and the four array elements on either side of the first array element 310 are divided into two groups. Specifically, referring to FIG. 7 , the elements of the same element group 301 are divided into 1st, 2nd, 3rd, 4th, and 5th positions from the left side of the figure. The 3rd position element is the first element 310. The 2nd and 4th position elements each have a position difference of 1 from the first element 310, and the two elements form a pair of second elements 320. The 1st and 5th position elements each have a position difference of 2 from the first element 310, and the two elements form a pair of second elements 320.

[0071] Of course, in some embodiments, the position differences between the same group of second array elements 320 and the first array elements 310 may also be different.

[0072] To improve the performance of the ultrasonic transducer, each array element is divided into at least two sub-arrays by a first gap 303. This first gap 303 can be cut using appropriate manufacturing equipment. Of course, in other embodiments, these sub-arrays can also be processed separately and then arranged to form the first gap 303. Referring to Figures 3 and 7, in some embodiments, each array element has two sub-arrays 302. However, in other embodiments, each array element can also have three or more sub-arrays 302.

[0073] To facilitate electrical connection to the main control unit by leading out the positive electrode of each subarray 302, as shown in Figures 3 and 9 , the flexible printed circuit board 400 includes a transition layer 410 and a lead assembly 420. An insulating substrate layer is disposed between the transition layer 410 and the lead assembly 420 (the insulating substrate layer is omitted in Figure 9 to more easily illustrate the corresponding relationship between the transition layer 410 and the lead assembly 420). The transition layer 410 and the lead assembly 420 can be disposed on the corresponding insulating substrate layer by printing, coating, or other processes. The insulating substrate layer provides support and insulation for the transition layer 410 and the lead assembly 420. The insulating substrate layer between the transition layer 410 and the lead assembly 420 is a first insulating layer 430. When the lead assembly 420 has at least two layers of lead elements, each layer of lead elements can be disposed on a corresponding insulating substrate layer, with the lead elements of adjacent layers being insulated and separated by the corresponding insulating substrate layers. The insulating base material layer between each layer of the lead-out components of the lead-out assembly 420 is the second insulating layer 440 .

[0074] Furthermore, the array element layer 300, the transition layer 410, and the lead assembly 420 are arranged along a third direction. Referring to Figures 3, 7, and 9, in some embodiments, the first, second, and third directions are perpendicular to each other. The third direction simply refers to the stacking direction of the array element layer 300, the transition layer 410, and the lead assembly 420, but does not necessarily require the array element layer 300, the transition layer 410, and the lead assembly 420 to be arranged perpendicular to the third direction (i.e., the plane formed by the first and second directions). For example, in the embodiment shown in Figure 3, after the transition layer 410 and the lead assembly 420 extend in a direction perpendicular to the third direction, a portion thereof may be bent along the third direction. Alternatively, in the embodiment shown in Figure 9, after the lead assembly 420 extends in a direction perpendicular to the third direction, a portion thereof may be bent along the third direction.

[0075] Referring to Figures 3 and 9 , in some embodiments, the transition layer 410 comprises multiple electrical adapter groups 401 arranged along a first direction. Each electrical adapter group 401 is positioned opposite a corresponding array element group 301. Each electrical adapter group 401 comprises multiple electrical adapters (e.g., 411, 412) arranged along a second direction, aligned with the arrangement of the array elements within the same array element group 301. Each electrical adapter in each electrical adapter group 401 contacts and electrically connects to the positive electrode of the corresponding array element within the corresponding array element group 301. The electrical adapters are made of a conductive material, such as a metal surface printed, coated, or otherwise deposited on a corresponding insulating substrate layer. The electrical adapters are directly bonded to the corresponding array element to achieve a conductive connection. Of course, other conventional methods can also be used to achieve a conductive connection between the electrical adapters and the corresponding array element.

[0076] Referring to Figures 3 and 9 , in some embodiments, to correspond to sub-arrays 302, the electrical adapter may include multiple sub-electrical adapters 413. Each sub-electrical adapter 413 corresponds one-to-one with a sub-array 302. Each sub-electrical adapter 413 has a conductive contact area and, through the conductive contact area, makes conductive contact with the positive electrode of the corresponding sub-array 302. The term "multiple" refers to more than two. Referring to Figures 3 and 9 , in some embodiments, each electrical adapter includes two sub-electrical adapters 413. Adjacent sub-electrical adapters 413 may be separated by a third gap 415. This third gap 415 may or may not extend through the electrical adapter.

[0077] Referring to Figures 3-6 and 7-12, in some embodiments, the lead assembly 420 includes multiple lead groups 402 arranged along a first direction. Each lead group 402 includes multiple leads (e.g., 421, 422, 428, 429, etc.), which can be arranged in a single layer or multiple layers. Within a single lead group 402, the leads are divided into at least a first lead 421 and at least one pair of second leads 422. The first lead 421 is electrically connected to a corresponding first array element 310 via a corresponding electrical adapter, and each pair of second lead 422 is electrically connected to a pair of second array elements 320 via a corresponding electrical adapter. The leads are configured to electrically connect to the positive signal circuit of the main control unit to input positive signals to the corresponding array element.

[0078] In particular, please refer to Figures 3-6 and 7-12. In some embodiments, the electrical adapter is provided with a first conductive transition portion 414, and the lead-out member is provided with a second conductive transition portion 423. The first conductive transition portion 414 and the corresponding second conductive transition portion 423 are stacked and aligned in the stacking direction and electrically connected to electrically connect the electrical adapter to the corresponding lead-out member. Please refer to Figure 3. A third conductive transition portion 431 may also be provided on the corresponding insulating substrate layer to achieve electrical connection between the first conductive transition portion 414 and the second conductive transition portion 423, as well as to achieve electrical connection between the second conductive transition portions 423 in lead-out members of different layers. Depending on the position of the first conductive transition portion 414 and the second conductive transition portion 423, their stacking direction is also different. For example, in the embodiment shown in Figure 9, the first conductive transition portion 414 and the second conductive transition portion 423 are stacked along a third direction. In the embodiment shown in FIG. 3 , a portion of the first conductive transition portion 414 and the second conductive transition portion 423 are stacked along the third direction, and a portion of the first conductive transition portion 414 and the second conductive transition portion 423 are stacked along the second direction.

[0079] In the embodiments shown in Figures 3 and 9, the first conductive transition portion 414, the second conductive transition portion 423, and the third conductive transition portion 431 are conductive through-holes. The conductive through-holes corresponding to the first conductive transition portion 414, the second conductive transition portion 423, and the third conductive transition portion 431 are coaxially arranged and are filled with conductive material to achieve conductive connection. Of course, in other embodiments, the first conductive transition portion 414, the second conductive transition portion 423, and the third conductive transition portion 431 can also adopt other structures that can achieve electrical conductivity between stacked objects, for example, the first conductive transition portion 414, the second conductive transition portion 423, and the third conductive transition portion 431 are columnar conductive structures.

[0080] To electrically connect the positive electrodes of a pair of second array elements 320 into a single entity, referring to Figures 6 and 9 , in some embodiments, each pair of second lead members 422 is electrically connected via a connecting portion 424 . At least one other lead member is disposed between at least one pair of second lead members 422. Depending on the number of lead member layers and the number of lead members, this other lead member may include a first lead member 421, a first adapter lead member 428, and / or a second adapter lead member 429. For example, referring to Figure 6 , in this embodiment, a first lead member 421 is disposed between the pair of second lead members 422, and the connecting portion 424 between the pair of second lead members 422 passes through the first lead member 421. In other embodiments, another pair of second lead members 422, a first adapter lead member 428, and / or a second adapter lead member 429 (the first adapter lead member 428 and / or the second adapter lead member 429 will be described in detail later) may be disposed between a pair of second lead members 422, with the connecting portion 424 between the pair of second lead members 422 passing through the other lead member. For example, referring to FIG. 9 , in some embodiments, a first lead member 421, a first adapter lead member 428, and / or a second adapter lead member 429 may be disposed between a pair of second lead members 422.

[0081] In this embodiment, the area on the electrical adapter where the first conductive transition portion 414 can be effectively disposed is referred to as the conductive transition area. Referring to Figures 3 and 19 , in some embodiments, to avoid damaging the first conductive transition portion 414 when cutting the sub-array 302, the conductive transition area should be positioned away from the cutting location (i.e., the location directly opposite the first gap 303). Furthermore, the first conductive transition portion 414 of the electrical adapter must be aligned with the second conductive transition portion 423 of the corresponding lead element in the stacking direction. Therefore, the first conductive transition portion 414 on the electrical adapter can only be disposed in an area that completely overlaps with the corresponding lead element. Therefore, the position of the lead element also affects the position and width of the conductive transition area on the electrical adapter (in this embodiment, width refers to the dimension in the first direction, length refers to the dimension in the second direction, and thickness refers to the dimension in the third direction).

[0082] To ensure reliable electrical connection between the sub-electrical adapter and the corresponding lead-out member below, each sub-electrical adapter has a conductive via, and these vias must be positioned away from the cutting position (i.e., the position directly opposite the first gap) to prevent damage to the conductive vias during cutting, which could affect the electrical connection between the sub-electrical adapter and the corresponding lead-out member below. Furthermore, the conductive vias of the sub-electrical adapter and the corresponding lead-out member must be aligned in the stacking direction. Therefore, the conductive vias on the sub-electrical adapter can only be located in an area that completely overlaps with the corresponding lead-out member. In other words, the location of the first gap and the area of ​​the lead-out member define the area on the sub-electrical adapter where the conductive vias can be located (referred to as the conductive transfer area).

[0083] Because some lead components in the lead assembly need to pass over other lead components for electrical connection, these lead components are connected by connecting portions. Other lead components located along the connecting portion must leave space for the connecting portion to pass through. This results in the narrowing of these other lead components, and in turn, the narrowing of the conductive transition area on the corresponding sub-electrical adapter. When the sub-array width is large enough, the width of this conductive transition area is much larger than the required conductive via arrangement. Therefore, when cutting the sub-array, the machining process can be controlled with precision to avoid cutting into the conductive vias on the sub-electrical adapter.

[0084] However, with the development of high-resolution transducers, more array elements need to be set under the array element layer of the same area, which gradually reduces the size of a single array element. In particular, when the array element has two sub-arrays, the size (i.e., width) of a single sub-array in the direction perpendicular to the extension direction of the first gap is narrower, which also causes the width of the sub-electrical adapter corresponding to the sub-array to become narrower, further limiting the width of the conductive transfer area on the sub-electrical adapter. In addition, due to the influence of the processing technology, the aperture of the conductive through-hole cannot be further reduced after reaching the limit size. Once the width of the conductive transfer area on the sub-electrical adapter is less than the setting requirement of the conductive through-hole, it is very easy to cut into the conductive through-hole on the sub-electrical adapter, causing the electrical connection to fail. Therefore, after the number of array elements in the multi-dimensional array transducer reaches the limit value, the array element width cannot be further reduced, making it difficult to design a larger number of array elements, thereby affecting the progress of the multi-dimensional array transducer. The above technical problem is described below in conjunction with Figure 18, so that the technical solution of the present application can be used to understand the creative work of solving the above technical problems.

[0085] Referring to Figure 18 , in some embodiments, the connecting portion 424 of a pair of second lead elements 422 bypasses the centrally located first lead element 421. To avoid this connecting portion 424, the first lead element 421 deviates to one side in the first direction, causing the conductive transition area on the electrical adapter to also deviate to the same side. The conductive transition area on the sub-electrical adapter 413 corresponding to the side where the connecting portion 424 is located (indicated by the dashed box A in Figure 18 ) is compressed, and the first conductive transition portion 414 can only be positioned within this dashed box A. Areas outside of this dashed box A on the sub-electrical adapter 413 cannot accommodate the first conductive transition portion 414, resulting in waste. Due to process limitations, the width of the first conductive transition portion 414 cannot be further reduced after reaching its maximum size. If the sub-array 302 and the corresponding sub-electrical adapter 413 are sufficiently wide, sufficient space for the first conductive transition portion 414 can still be ensured. However, with the development of high-resolution transducers, when a larger number of sub-arrays 302 and sub-electrical adapters 413 are required under the array element layer 300 of the same area, it is difficult to ensure that the sub-electrical adapter 413 has sufficient space to dispose the first conductive adapter 414 under the structure shown in this embodiment.

[0086] Regarding the problem caused by the embodiment shown in FIG. 18 , please refer to FIG. 19 . In some embodiments, on a reference plane perpendicular to the third direction, the orthographic projection of the first gap 303 and the orthographic projection of the connecting portion 424 at least partially overlap. The area on the electrical adapter corresponding to the first gap 303 and the area corresponding to the connecting portion 424 are both areas where the first conductive transition portion 414 cannot be set. In this embodiment, by at least partially overlapping the orthographic projection of the first gap 303 and the orthographic projection of the connecting portion 424 in the width direction, the area on the electrical adapter corresponding to the first gap 303 and the area corresponding to the connecting portion 424 at least partially overlap in the width direction. This can increase the proportion of the conductive transition area on the sub-electrical adapter 413. That is, compared to the embodiment shown in FIG. 18 , under the same width condition, the electrical adapter has a wider conductive transition area, which can avoid cutting the first conductive transition portion 414 of the electrical adapter when cutting and manufacturing the sub-array 302, and can also enable the electrical adapter to meet the lead-out requirements of the sub-array 302 with a smaller width, thereby arranging a larger number of array elements in the array element layer 300 of the same width.

[0087] Furthermore, after adopting the structure shown in the above embodiment, in some embodiments, in the array element group 301, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.4 mm, that is, the value range is [0.2 mm, 0.4 mm], and the width of a single sub-array 302 in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm, that is, the value range is [0.07 mm, 0.17 mm]. Alternatively, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.33 mm, that is, the value range is [0.2 mm, 0.33 mm], and the width of a single sub-array 302 in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.14 mm, that is, the value range is [0.07 mm, 0.14 mm]. In some embodiments, in the electrical adapter group 401, the width of the sub-electrical adapter 413 in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm, that is, the value range is [0.07 mm, 0.17 mm]; or the width of the sub-electrical adapter 413 in the first direction is greater than or equal to 0.107 mm and less than or equal to 0.14 mm, that is, the value range is [0.107 mm, 0.14 mm].

[0088] 3 , 9 , and 19 , in some embodiments, the orthographic projections of the second conductive transition portion 423 and the corresponding first conductive transition portion 414 on the lead member between each pair of second lead members 422 on a reference plane are both distributed on both sides of the orthographic projection of the connection portion 424 of the lead member, thereby ensuring reliable electrical connection between the second conductive transition portion 423 and the corresponding first conductive transition portion 414. Furthermore, the orthographic projections of the second conductive transition portion 423 and the corresponding first conductive transition portion 414 on the lead member between each pair of second lead members 422 on the reference plane are both distributed on both sides of the orthographic projection of the first gap 303 on the corresponding electrical transition member of the lead member, thereby preventing the corresponding first conductive transition portion 414 from being cut when the first gap 303 is cut.

[0089] Furthermore, the first gap 303 is usually cut by the array element. Correspondingly, the connecting portion 424 of a pair of second lead-out members 422 usually needs to pass through the middle of the other lead-out members located between the pair of second lead-out members 422. Therefore, please refer to Figure 6. In some embodiments, the other lead-out members usually have a second gap 425, and the connecting portion 424 passes through the corresponding second gap 425.

[0090] Specifically, referring to FIG. 3 , in some embodiments, the other lead-out member is a first lead-out member 421 having a second gap 425 , and a pair of connecting portions 424 of the second lead-out members 422 pass through the second gap 425 of the first lead-out member 421 .

[0091] Referring to FIG. 9 , in some embodiments, in the first-layer lead-out member 420 a , the other lead-out member between a pair of second lead-out members 422 is a first lead-out member 421 having a second gap 425 , and the connecting portion 424 of the pair of second lead-out members 422 passes through the second gap 425 of the first lead-out member 421 . In the second-layer lead-out member 420 b , the other lead-out member between another pair of second lead-out members 422 is a first adapter lead-out member 428 , which has a second gap 425 , and the connecting portion 424 of the pair of second lead-out members 422 passes through the second gap 425 of the first adapter lead-out member 428 .

[0092] In addition, in other embodiments, the other lead-out members between a pair of second lead-out members 422 may also be other second lead-out members.

[0093] Further, referring to FIG. 19 , in some embodiments, the orthographic projection of the first gap 303 on the reference plane does not exceed the orthographic projection of the second gap 425 on the reference plane in the first direction. That is, the first gap 303 falls within the area corresponding to the second gap 425 in the third direction, thereby maximizing the proportion of the conductive transition area on the electrical transition.

[0094] Further, referring to Figures 3-6, in some embodiments, n is equal to 3, meaning that each array element group 301 has three array elements arranged along the second direction. The electrical adapters of the electrical adapter group 401 include at least a first electrical adapter 411 and a pair of second electrical adapters 412 located on either side of the first electrical adapter 411. The first electrical adapter 411 and the second electrical adapter 412 respectively contact and electrically connect with the positive electrodes of the corresponding first array element 310 and second array element 320. This electrical connection can be achieved through direct conductive contact or other electrical connection methods known in the art. Correspondingly, the lead members of the lead member group 402 include at least a first lead member 421 and a pair of second lead members 422 located on either side of the first lead member 421. The first lead member 421 and the second lead member 422 are electrically connected to the corresponding first electrical adapter 411 and the second electrical adapter 412. That is, the first lead-out member 421 is electrically connected to the first electrical adapter 411 , and one second lead-out member 422 is electrically connected to one second electrical adapter 412 .

[0095] The first electrical adapter 411 and the second electrical adapter 412 have conductive contact areas that are in contact with the corresponding sub-arrays 302 . The first electrical adapter 411 and the second electrical adapter 412 can be electrically connected to the corresponding sub-arrays 302 through the conductive contact areas.

[0096] Further, please refer to Figure 6. In some embodiments, since the second lead-out member 422 passes through the middle of the first lead-out member 421, the first lead-out member 421 has at least two first sub-lead-out members 427, and there is a second gap 425 between the first sub-lead-out members 427, and the connecting portion 424 passes through the second gap 425.

[0097] Further, please refer to Figure 6. In some embodiments, there are two first sub-lead-out parts 427, and the two first sub-lead-out parts 427 are symmetrical about the second gap 425, so that the widths of the conductive transfer areas on the two first sub-electrical adapters 413 corresponding to the first sub-lead-out parts 427 are equal or close, so that each conductive transfer area can be maximized to set the first conductive transfer part 414.

[0098] Further, referring to FIG6 , in some embodiments, in order to lead out the first sub-lead-out member 427 and electrically connect it to the main control unit, the two first sub-lead-out members 427 extend from both sides of a second lead-out member 422. Specifically, the first sub-lead-out member 427 has a third extension portion 4211, and the third extension portion 4211 of each first sub-lead-out member 427 extends from the side of the second lead-out member 422.

[0099] The second lead member 422, located between the two third extensions 4211, has a narrower width due to the influence of the third extensions 4211. To facilitate better docking between the second lead member 422 located between the two third extensions 4211 and the corresponding second electrical adapter 412, as shown in FIG6 , in some embodiments, the second lead member 422 located between the two third extensions 4211 has a second extension 4221. This second extension 4221 is electrically connected to the main body of the second lead member 422. The second extension 4221 can be integrally formed (e.g., printed or coated to form a one-piece structure) or manufactured separately and then electrically connected. Referring to FIG3 and FIG6 , in some embodiments, in the corresponding electrical adapter assembly 401, the second electrical adapter 412 corresponding to the second lead member 422 having the second extension 4221 has a first extension 4121 located outside its conductive contact area. This first extension 4121 corresponds to the second extension 4221 of the second adapter. The first extension 4121 is electrically connected to the corresponding conductive contact area. The two can be integrally formed (e.g., printed or coated into a one-piece structure) or manufactured separately and then electrically connected. The first extension 4121 is provided with a first conductive transition portion 414, and the second extension 4221 has a second conductive connection portion 423. This achieves an electrically conductive connection between the first extension 4121 and the second extension 4221. This allows the second lead 422, located between the two third extensions 4211, to meet smaller width requirements, accommodating a narrower sub-array 302 design.

[0100] 3-6 , in some embodiments, the first extension portion 4121 and the second extension portion 4221 are both bent and extended along a third direction away from the array element layer 300 , and extend to the periphery of the backing layer 500 . This fully utilizes the space around the backing layer 500 and does not affect the thickness of the lens 100 , the matching layer 200 , the array element layer 300 , the flexible circuit board 400 , and the backing layer 500 in the stacking direction.

[0101] Of course, in other embodiments, at least one second electrical adapter 412 may have a first extension 4121 located outside its conductive contact region, and correspondingly, at least one second lead 422 may have a second extension 4221. For example, in some embodiments, a second lead 422 that is opposite to the side of the first lead 421 on which the third extension 4211 is provided may also have a second extension 4221, and the second electrical adapter 412 corresponding to the second lead 422 may also have a first extension 4121. The first extension 4121 and the second extension 4221 are used to electrically connect the second lead 422 to the second electrical adapter 412.

[0102] 3-6 , in some embodiments, when a second extension portion 4221 is provided, the second lead-out member 422 without the second extension portion 4221 may be provided with an electrical external connection structure 4222 . The electrical external connection structure 4222 is configured to electrically connect to a positive signal circuit, thereby electrically connecting the sub-array 302 of the second array element 320 corresponding to the two second lead-out members 422 to the positive signal circuit.

[0103] Of course, in other embodiments, the electrical external connection structure for electrically connecting the second lead-out member 422 may also be provided on the second extension portion 4221 .

[0104] Referring to Figure 6 , in some embodiments, the third extension portion 4211 may extend beyond the end of the second extension portion 4221 and be electrically connected to each other to form an electrical external connection structure. This electrical external connection structure is used to electrically connect to the positive signal circuit, thereby electrically connecting the subarray 302 of the first array element 310 corresponding to the first lead 421 to the positive signal circuit. Of course, in other embodiments, the two third extension portions 4211 may not be connected together, but may be separated from each other and each have an electrical external connection structure for electrically connecting to the positive signal circuit.

[0105] Furthermore, in some other embodiments, the first lead member 421 may not have the third extension portion 4211. That is, the first lead member 421 is isolated and disposed between a pair of second lead members 422, and does not extend from a side of the second lead member 422 on the same layer. For example, in some embodiments, at least one lead member in the lead member assembly 402 is a first adapter lead member 428. The first adapter lead member 428 is disposed on a side of the first lead member 421 facing away from the first electrical adapter 411 and is electrically connected to the first lead member 421. The first adapter lead member 428 has an electrical external connection structure for electrically connecting to a positive signal circuit. Specifically, at least one first adapter lead-out member 428 (similar to the structure shown in FIG9 ) is further provided below the first lead-out member 421 (below along the third direction). The first adapter lead-out member 428 is electrically connected to the first lead-out member 421 in the third direction via the second conductive adapter portion 423 . The first adapter lead-out member 428 has a fifth extension portion 4281 , which extends from below the first lead-out member 421 and the second lead-out member 422 , for example, to the peripheral side of the backing layer 500 . The fifth extension portion 4281 has an electrical external connection structure for electrically connecting to the positive signal circuit, thereby electrically connecting the subarray 302 of the first array element 310 corresponding to the first lead-out member 421 to the positive signal circuit.

[0106] Furthermore, in some embodiments, n is greater than or equal to 5, that is, each array element group 301 has more than 5 array elements arranged along the second direction. The electrical adapters in each electrical adapter group 401 correspond one-to-one to the array elements in one array element group 301, that is, the number of electrical adapters in each electrical adapter group 401 is equal to the number of array elements in each array element group 301. The lead elements in the lead element group 402 are arranged in at least m layers along the third direction, where m = (n+1) / 2. Of course, each layer of lead elements is provided on a corresponding insulating substrate layer and is insulated and separated by the insulating substrate layer. Along the third direction, the layer of lead elements closest to the electrical adapter group 401 is the first layer, and the layer of lead elements farthest from the electrical adapter group is the mth layer.

[0107] The first lead-out component 421 is provided in the first layer of lead-out components, and the first lead-out component 421 is electrically connected to the corresponding electrical adapter component, specifically by adopting the methods shown in the above embodiments.

[0108] In layers 1 through (m-1), each layer of lead-out components has a pair of second lead-out components 422. The second lead-out components 422 of the first layer of lead-out components are electrically connected to the first conductive transition portion 414 of the corresponding electrical transition component. In layers 2 through (m-1), the second lead-out components 422 in each layer are electrically connected to the corresponding electrical transition component via the corresponding second transition lead-out component 429 of the previous layer.

[0109] In the second to mth layers, each layer of lead-out components has a first adapter lead-out component 428. The first lead-out component 421 is electrically connected to each first adapter lead-out component 428 in the lower layer. At least one second lead-out component 422 and at least one first adapter lead-out component 428 in each pair of second lead-out components 422 can be electrically connected to the positive signal circuit of the main control unit, thereby realizing the lead-out of the positive electrode of the sub-array 302.

[0110] In some embodiments, in at least one layer of lead-out members, the connecting portion 424 between a pair of second lead-out members 422 passes through the second gap 425 of the first lead-out member 421 and / or the first transition lead-out member 428 .

[0111] In some embodiments, in at least one layer of lead-out members, the second lead-out member 422 has a second extension portion 4221, and the outer end portion of the second extension portion 4221 is located outside the array element layer 300. The outer end portion is provided with an electrical external connection structure, and the electrical external connection structure can be conductively connected to the positive signal circuit of the main control unit.

[0112] In some embodiments, in at least one layer of lead-out members, at least one pair of second adapter lead-out members 429 are relatively arranged on both sides of a pair of second lead-out members 422, and the second extension portion 4221 of the second lead-out member 422 passes through the corresponding second adapter lead-out member 429 and extends outside the array element layer 300.

[0113] In some embodiments, in at least one layer of lead-out components, the second adapter lead-out component 429 has a fourth extension portion 4291, which is located outside the array element layer 300. The fourth extension portion 4291 is provided with an electrical external connection structure, which can be conductively connected to the positive signal circuit of the main control unit.

[0114] Specifically, referring to Figures 7-12, in some embodiments, n is equal to 5, meaning that each array element group 301 has five array elements (e.g., 310, 320) arranged along the second direction. Each electrical adapter group 401 has five electrical adapters (e.g., 411, 412), each electrically connected to a corresponding array element. The leads in each lead component group 402 are arranged in three layers along the third direction. To clearly illustrate the correspondence between the lead component 420 and the adapter layer 410, as well as between the lead components in each layer, the insulating substrate layer is omitted in the figures. Along the third direction, the layer of leads closest to the electrical adapter group 401 is the first layer, and the layer of leads farthest from the electrical adapter group is the third layer.

[0115] 9 and 10 , in some embodiments, the first layer of lead elements 420a includes a first lead element 421, a pair of second lead elements 422 located on either side of the first lead element 421, and a pair of second adapter lead elements 429 located on either side of the pair of second lead elements 422. The first lead element 421, the second lead element 422, and the second adapter lead element 429 are each conductively connected to a corresponding electrical adapter, and thus conductively connected to a corresponding sub-array 302. For specific connection methods, reference can be made to the conductive connection methods described in the aforementioned embodiments.

[0116] Referring to Figures 9 and 10, in some embodiments, in the first layer of lead-out members 420a, the first lead-out member 421 is electrically connected to the corresponding electrical adapter, and the connecting portion 424 of the pair of second lead-out members 422 passes through the first lead-out member 421 to electrically connect the pair of second lead-out members 422 into a whole. The pair of second adapter lead-out members 429 are used to electrically connect the corresponding electrical adapter to the second lead-out member 422 or the second adapter lead-out member 429 of the next layer.

[0117] 9 and 10 , in some embodiments, in the first-layer lead-out member 420 a , the pair of second lead-out members 422 are provided with second extension portions 4221 , and are conductively connected to the main control unit via the second extension portions 4221 .

[0118] In some embodiments, the second extension portion 4221 may be bent and extended along the third direction and away from the transfer layer 410 .

[0119] In some embodiments, in the first-layer lead-out member 420a, the second extension portion 4221 of the second lead-out member 422 passes through the corresponding second adapter lead-out member 429 and extends outside the array element layer 300, for example, to the peripheral space of the backing layer 500, to facilitate conductive connection with the main control unit.

[0120] Referring to Figures 9 and 11 , in some embodiments, the second-layer lead-out member 420b includes a first adapter lead-out member 428 and a pair of second lead-out members 422. The first adapter lead-out member 428 is conductively connected to the first-layer first lead-out member 421. The pair of second lead-out members 422 are conductively connected to the pair of second adapter lead-out members 429 on the first layer, thereby conductively connecting the pair of second lead-out members 422 to corresponding array elements. The connecting portion 424 between the pair of second lead-out members 422 passes through the first adapter lead-out member 428. The pair of second lead-out members 422 have a second extension portion 4221 that extends beyond the array element layer 300, for example, to the surrounding space of the backing layer 500, to facilitate conductive connection with the main control unit.

[0121] Referring to Figures 9-11, in some embodiments, the second transfer lead-out member 429 of the first layer can be electrically connected to the second lead-out member 422 of the second layer via the second conductive transfer portion 423 thereon. In some embodiments, the second transfer lead-out member 429 of the first layer can also have a fourth extension portion 4291. This fourth extension portion 4291 extends beyond the array element layer 300, for example, to the surrounding space of the backing layer 500, thereby electrically connecting to the second extension portion 4221. The electrical external connection structure for leading out the second lead-out member 422 of the second layer can be disposed on the second extension portion 4221 of the second lead-out member 422, or on the fourth extension portion 4291 of the second transfer lead-out member 429 of the first layer.

[0122] Referring to Figures 9-12, in some embodiments, the second transfer lead-out member 429 of the first layer is divided into two parts by the second extension portion 4221 of the second lead-out member 422. The two parts each have a fourth extension portion 4291. The two fourth extension portions 4291 can be connected as a whole or provided separately. When the fourth extension portion 4291 is provided, the second extension portion 4221 of the second lead-out member 422 of the first layer can be led out through the sixth extension portion 4292 provided on the third layer. The second extension portion 4221 and the sixth extension portion 4292 can be conductively connected via the second conductive transfer portion 423, and then conductively connected to the main control unit via the sixth extension portion 4292.

[0123] 9 and 12 , in some embodiments, the third-layer lead-out member 420 c includes a first transfer lead-out member 428 , which is conductively connected to the first transfer lead-out member 428 of the second layer to ultimately lead out the first lead-out member 421 .

[0124] 9 and 12 , in some embodiments, the first transfer lead-out member 428 of the third layer lead-out member has a fifth extension portion 4281 , which extends beyond the array element layer 300 , for example, to the peripheral space of the backing layer 500 , to facilitate conductive connection with the main control unit.

[0125] The above describes the method for leading out the positive electrode of an array element in the array element lead-out structure. In some embodiments, the array element lead-out structure further includes a negative electrode lead-out structure electrically connected to the negative electrode of the array element. The negative electrode lead-out member is used to electrically connect the negative electrode of the array element to the negative electrode signal circuit of the main control unit. This negative electrode lead-out structure can be implemented using existing technology or some new structure.

[0126] Referring to Figures 2, 13, and 14, in some embodiments, the negative electrode lead structure 600 is a conductive sheet 610, such as copper foil. This conductive sheet 610 is electrically connected to the negative electrode signal circuit of the main control unit. This conductive sheet 610 covers the negative electrode side of the array element of the array element layer 300 (the side of the array element facing away from the flexible printed circuit board 400). This conductive sheet 610 is electrically connected to the negative electrode of the array element and extends to the side of the flexible printed circuit board 400 where the first extension portion 4121 is not provided, to prevent conductive contact with the first extension portion 4121 and the resulting short circuit.

[0127] Referring to Figures 15 and 16 , in some embodiments, the negative electrode lead structure 600 is a conductive sheet 610, such as copper foil. This conductive sheet 610 covers the negative electrode side of the array element of the array element layer 300 (the side of the array element facing away from the flexible printed circuit board 400). This conductive sheet 610 is electrically connected to the negative electrode of the array element. To prevent the conductive sheet 610 from forming a conductive contact with the first extension portion 4121 and causing a short circuit, an insulating layer 630 is provided over the first extension portion 4121. In this case, the conductive sheet 610 can extend to either the side of the flexible printed circuit board 400 where the first extension portion 4121 is not provided or the side where the insulating layer 630 is provided.

[0128] Referring to Figure 17 , in some embodiments, the array element layer 300 may further include a waste array element 330 disposed on the outermost side. This waste array element 330 is electrically connected to the negative side of the other array elements via a conductive coating 620 (e.g., a gold-plated layer). The negative electrode lead structure 600 is electrically connected to the negative electrode signal circuit of the main control unit via the waste array element 330 and the conductive coating 620.

[0129] This document is described with reference to various exemplary embodiments. However, those skilled in the art will recognize that changes and modifications may be made to the exemplary embodiments without departing from the scope of this document. For example, the various operational steps and components used to perform the operational steps may be implemented in different ways (e.g., one or more steps may be deleted, modified, or incorporated into other steps) depending on the specific application or any number of cost functions associated with the operation of the system.

[0130] Although the principles of this invention have been shown in various embodiments, many modifications of structure, arrangement, proportion, elements, materials and components that are particularly suitable for specific environments and operational requirements can be used without departing from the principles and scope of this invention. The above modifications and other changes or amendments are intended to be included within the scope of this invention.

[0131] The foregoing detailed description has been described with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes can be made without departing from the scope of this disclosure. Therefore, the consideration of this disclosure will be illustrative rather than restrictive, and all such modifications will be included within its scope. Similarly, the advantages, other advantages and solutions to the problems of the various embodiments have been described above. However, the benefits, advantages, solutions to the problems and any elements that can produce these, or make them more specific, should not be interpreted as critical, necessary or essential. The term "comprising" and any other variants used in this article are all non-exclusive inclusions, so that a process, method, article or device that includes a list of elements includes not only these elements, but also other elements that are not explicitly listed or do not belong to the process, method, system, article or device. In addition, the term "coupling" and any other variants used in this article refer to physical connections, electrical connections, magnetic connections, optical connections, communication connections, functional connections and / or any other connections.

[0132] Those skilled in the art will recognize that many changes can be made to the details of the above embodiments without departing from the basic principles of the present application. Therefore, the scope of the present application should be determined based on the following claims.

Claims

1. An array element lead structure of an ultrasonic probe, characterized in that: include: an array element layer, the array element layer comprising a plurality of array element groups arranged along a first direction, the array element groups comprising n array elements arranged along a second direction, where n is an odd number greater than or equal to 3; the array elements being divided into at least two sub-arrays by a first gap; wherein the array elements in the array element group are divided into at least a first array element located in the middle and at least one pair of second array elements, each pair of second array elements being arranged on opposite sides of the first array element in the second direction; and a flexible circuit board, the flexible circuit board having a transfer layer and a lead-out component, the array element layer, the transfer layer and the lead-out component are arranged along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other; The switching layer comprises a plurality of electrical switching component groups arranged along a first direction, and the electrical switching component groups comprise a plurality of electrical switching components arranged along a second direction, wherein the electrical switching components of each electrical switching component group are respectively in contact with and electrically connected to the positive electrodes of the array elements in the corresponding array element group; The lead assembly comprises a plurality of lead member groups arranged along a first direction, the lead member groups comprising a plurality of lead members, the lead members comprising at least a first lead member and at least a pair of second lead members, the first lead member being electrically connected to a corresponding first array element via a corresponding electrical adapter, and each pair of second lead members being electrically connected to a pair of second array elements via a corresponding electrical adapter; the lead members being configured to be electrically connected to a positive signal circuit of a control unit to input a positive signal to the corresponding array element; The electrical adapter is provided with a first conductive adapter portion, and the lead-out member is provided with a second conductive adapter portion. The first conductive adapter portion and the corresponding second conductive adapter portion are stacked and electrically connected in the stacking direction to electrically connect the electrical adapter and the corresponding lead-out member; each pair of second lead-out members is electrically connected via a connecting portion, and on a reference plane perpendicular to the third direction, the orthographic projection of the first gap and the orthographic projection of the connecting portion at least partially overlap, and the second conductive adapter portion on the first lead-out member between each pair of second lead-out members and the orthographic projection of the corresponding first conductive adapter portion on the reference plane are distributed on both sides of the orthographic projection of the connecting portion.

2. The array element extraction structure according to claim 1, wherein: At least one other lead-out member is arranged between at least one pair of second lead-out members, and the other lead-out member includes the first lead-out member, the first transition lead-out member and / or the second transition lead-out member. The other lead-out member has a second gap, and the connecting portion passes through the corresponding second gap.

3. The array element extraction structure according to claim 2, wherein: An orthographic projection of the first gap on the reference plane does not exceed an orthographic projection of the second gap on the reference plane in the first direction.

4. The array element extraction structure according to claim 1, wherein: The position differences between the second array elements of the same pair and the first array element are the same.

5. The array element extraction structure according to claim 1, wherein: wherein n is equal to 3, the electrical adapter of the electrical adapter group is divided into at least a first electrical adapter and a pair of second electrical adapters provided on either side of the first electrical adapter, the first electrical adapter and the second electrical adapter respectively contacting and electrically connecting the positive electrodes of the corresponding first array element and the second array element; The lead-out members of the lead-out member group are divided into at least a first lead-out member and a pair of second lead-out members located on both sides of the first lead-out member, and the first lead-out member and the second lead-out member are electrically connected to the corresponding first electrical adapter and the second electrical adapter.

6. The array element extraction structure according to claim 5, wherein: The first electrical adapter and the second electrical adapter have conductive contact areas that contact the corresponding sub-arrays; in one of the electrical adapter groups, at least one of the second electrical adapters has a first extension located outside its conductive contact area, and the first extension is electrically connected to the corresponding conductive contact area; in the second electrical adapter having the first extension, its first extension is provided with a first conductive adapter.

7. The array element extraction structure according to claim 6, wherein: The first electrical adapter and the second electrical adapter are divided into a plurality of sub-electrical adapters, each of which corresponds to the sub-arrays one by one, and each of the sub-electrical adapters has the conductive contact area.

8. The array element extraction structure according to claim 6, wherein: The first lead-out member and the second lead-out member are provided with a second conductive transition portion, and the second conductive transition portion is electrically connected to the corresponding first conductive transition portion; wherein, at least one of the second lead-out members has a second extension portion corresponding to the first extension portion; in the second lead-out member having the second extension portion, its second extension portion is provided with a second conductive transition portion.

9. The array element extraction structure according to claim 8, wherein: The first extension portion and the second extension portion are bent in a direction away from the array element layer.

10. The array element extraction structure according to claim 8, wherein: The second extension portion has an electrical external connection structure, and the electrical external connection structure is used to be electrically connected to the positive signal circuit.

11. The array element extraction structure according to claim 8, wherein: The first lead-out member has at least two first sub-lead-out members, a second gap is formed between the first sub-lead-out members, and the connecting portion passes through the second gap; the first sub-lead-out member has a third extension portion, and the third extension portion of each first sub-lead-out member extends from the side of the second lead-out member to the outside of the end portion of the second extension portion and is electrically connected to each other to form an electrical external connection structure, and the electrical external connection structure is used to be electrically connected to the positive signal circuit.

12. The array element extraction structure according to claim 11, wherein: There are two first sub-lead-out members, and the two first sub-lead-out members are symmetrical with respect to the second gap.

13. The array element extraction structure according to claim 4, wherein: In the lead-out member group, at least one lead-out member is a first adapter lead-out member, the first adapter lead-out member is arranged on the side of the first lead-out member away from the first electrical adapter member, and is electrically connected to the first lead-out member, the first adapter lead-out member and the second lead-out member respectively have an electrical external connection structure, and the electrical external connection structure is used to be electrically connected to the positive signal circuit.

14. The array element extraction structure according to claim 1, wherein: The n is greater than or equal to 5, and the electrical adapters of each group of the electrical adapters correspond one-to-one to the array elements of a group of the array elements; the lead elements in the lead element group are arranged in at least m layers along the third direction, where m=(n+1) / 2; the layer of lead elements closest to the electrical adapter group is the first layer, and the layer of lead elements farthest from the electrical adapter group is the mth layer; The first layer of lead-out components includes a first lead-out component, and the first lead-out component is electrically connected to a corresponding electrical adapter component; In the first to the (m-1)th layers, each layer of lead-out components has a pair of second lead-out components, and the second lead-out components of the first layer of lead-out components are electrically connected to the first conductive transition portions of the corresponding electrical transition components; in the second to the (m-1)th layers, the second lead-out components in each layer are electrically connected to the corresponding electrical transition components through the corresponding second transition lead-out components of the previous layer; In the 2nd to the mth layers, each layer of lead-out parts has a first adapter lead-out part, which is electrically connected to each first adapter lead-out part in the lower layer, and at least one second lead-out part and at least one first adapter lead-out part in each pair of second lead-out parts can be electrically connected to the positive signal circuit.

15. The array element extraction structure according to claim 14, wherein: In at least one layer of lead-out members, the connecting portion between a pair of the second lead-out members passes through the second gap of the first lead-out member and / or the first transition lead-out member.

16. The array element extraction structure according to claim 14, wherein: In at least one layer of lead-out components, the second lead-out component has a second extension portion, an outer end portion of the second extension portion is located outside the array element layer, and the outer end portion is provided with the electrical external connection structure.

17. The array element extraction structure according to claim 16, wherein: In at least one layer of lead-out members, at least one pair of second adapter lead-out members are relatively arranged on both sides of a pair of second lead-out members, and the second extension portions of the second lead-out members pass through the corresponding second adapter lead-out members and extend outside the array element layer.

18. The array element extraction structure according to claim 17, wherein: In at least one layer of lead-out components, the second transfer lead-out component has a fourth extension portion, the fourth extension portion is located outside the array element layer, and the fourth extension portion is provided with the electrical external connection structure.

19. The array element extraction structure according to claim 14, wherein: When n=5, the array element group has one first array element and two pairs of second array elements; The m=3, the first layer of lead-out components comprises a first lead-out component, a pair of second lead-out components, and a pair of second adapter lead-out components. The second lead-out components are disposed on opposite sides of the first lead-out component, and the second adapter lead-out components are disposed on opposite sides of the pair of second lead-out components. The second lead-out component and the second adapter lead-out component are each electrically connected to a corresponding second array element. The second layer of lead-out components comprises a first transfer lead-out component and a pair of second lead-out components, wherein the second lead-out components are electrically connected to the second transfer lead-out components of the first layer, so as to be electrically connected to the corresponding second array element through the second transfer lead-out components; The third-layer lead-out component has a first transfer lead-out component, the first transfer lead-out component of the third layer is electrically connected to the first transfer lead-out component of the second layer, and the first transfer lead-out component of the third layer has the electrical external connection structure.

20. The array element extraction structure according to any one of claims 1 to 19, characterized in that: A first insulating layer is provided between the transfer layer and the lead-out component; And / or, a second insulating layer is provided between the lead-out parts of each layer of the lead-out assembly.

21. The array element extraction structure according to any one of claims 1 to 20, wherein: It also includes a negative electrode lead-out structure, which is electrically connected to the negative electrode of the array element. The negative electrode lead-out member is used to electrically connect the negative electrode of the array element to the negative electrode signal circuit of the control unit.

22. The array element extraction structure according to any one of claims 1 to 21, wherein: In the array element group, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.4 mm, and the width of a single sub-array in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm; or, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.33 mm, and the width of a single sub-array in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.14 mm.

23. An ultrasonic probe head, characterized in that: It comprises a backing, a matching layer, a lens and the array element lead-out structure as claimed in any one of claims 1 to 22, wherein the flexible circuit board is arranged on the backing, the matching layer is located on the array element layer, and the lens is arranged on the matching layer.

24. An ultrasonic probe, characterized in that: The acoustic head comprises an acoustic head having an array element extraction structure as shown in any one of claims 1-22.

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