Modular kit for chemical and / or electrolytic surface treatment of substrates

Abstract

The present invention relates to a module kit for the chemical and / or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for the chemical and / or electrolytic surface treatment of a substrate, and the use of such a module kit. The module kit includes a processing chamber, a first exchangeable dispensing unit for dispensing a first liquid on a substrate, and a second exchangeable dispensing unit for dispensing a second liquid on the substrate. The processing chamber is sized to receive the first exchangeable distribution unit or the second exchangeable distribution unit. The first exchangeable distribution unit and the second exchangeable distribution unit are each sized to receive a substrate. The process chamber includes a kit interface for supplying a first liquid or a second liquid. The first exchangeable dispensing unit includes a first inlet interface for a first liquid. The second exchangeable dispensing unit includes a second inlet interface for a second liquid. The kit interface, the first inlet interface, and the second inlet interface are configured for exchangeable cooperation between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.

Description

Technical Field

[0001] The invention relates to a module kit for chemical and / or electrolytic surface treatment of substrates, a platform assembly comprising such a module kit, a method for chemical and / or electrolytic surface treatment of substrates and the use of such a module kit. Background Art

[0002] Many industrial production processes - especially complex semiconductor production lines - require highly flexible processing equipment that can be adjusted to specific process requirements in a fast and uncomplicated manner. It is desirable that such adjustments can be performed without requiring major hardware changes to the equipment.

[0003] However, conventional modular processing equipment, particularly modular processing equipment used to manufacture semiconductor devices from silicon wafers by allowing multiple arrangements of independent processing modules in multiple track and / or branch configurations, cannot provide rapid adjustment of processing configurations based on the processing requirements of a single substrate. Summary of the invention

[0004]

[0006] Therefore, it may be desirable to provide an improved substrate processing system that includes a universal interface design that allows for rapid and highly reliable adjustments to the processing environment for a single substrate.

[0005] This problem is solved by the subject matter of the independent claims of the present invention, wherein further embodiments are incorporated in the dependent claims. It should be noted that the various aspects of the present disclosure described below apply to a module kit for chemical and / or electrolytic surface treatment of substrates, a platform assembly comprising such a module kit, a method for chemical and / or electrolytic surface treatment of substrates and the use of such a module kit.

[0006] According to the present invention, a modular kit for chemical and / or electrolytic surface treatment of substrates is presented. The modular kit includes: a processing chamber; a first exchangeable dispensing unit for dispensing a first liquid on the substrate; and a second exchangeable dispensing unit for dispensing a second liquid on the substrate. The processing chamber is sized to receive the first exchangeable dispensing unit or the second exchangeable dispensing unit. The first exchangeable dispensing unit and the second exchangeable dispensing unit are each sized to receive the substrate. The processing chamber includes a kit interface for supplying the first liquid or the second liquid. The first exchangeable dispensing unit includes a first inlet interface for the first liquid. The second exchangeable dispensing unit includes a second inlet interface for the second liquid. The kit interface, the first inlet interface and the second inlet interface are configured for exchangeable cooperation between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.

[0007] The modular kit according to the invention allows a flexible design of exchangeable process chambers. In other words, the modular kit allows easy modification of the exchangeable dispensing units within the process chambers based on the requirements of the substrate processing. Furthermore, the modular kit can be optimized for minimum space without the need to adjust the liquid supply means and the drain connections. Since the interface between the process chamber and the exchangeable dispensing unit can be standardized, a fast and easy exchange of the chambers can be achieved without the need to adjust the interface between the process chamber and the exchangeable dispensing unit.

[0008] The module kit can be suitable for forming a modular structure of several module kits. The module kit can be configured to perform chemical surface treatment and / or electrolytic surface treatment. Wet treatment such as chemical surface treatment and / or electrolytic surface treatment can allow high chemical selectivity, which can be achieved with various treatment liquids (e.g., acid, alkali, oxidant, etc.) or simple or complex mixtures thereof. In addition, wet treatment allows inherent simplicity of processing, scalability of processing to various types of substrates with various sizes and low operating costs.

[0009] The chemical and / or electrolytic surface treatment of the substrate may be any material deposition, zinc coating, chemical or electrochemical etching, cleaning, removal, anodic or pure chemical oxidation, metal separation treatment, etc. The substrate may include a conductor plate, a semiconductor substrate, a film substrate, a substantially plate-shaped metal or metallized workpiece, etc. At least one substrate may be held by a substrate holder and immersed in a process chamber for surface treatment.

[0010] The substrate holder can be configured to hold one or more substrates. Alternatively, two separate substrate holders fastening two separate substrates can be simultaneously inserted into or removed from the processing chamber via the openings of the processing chamber and the cover unit. The processing chamber can be adapted to receive or release the substrate holder parallel to the insertion direction of the exchangeable dispensing unit into the processing chamber. The two substrates to be processed in the processing chamber can have the same size and / or the same shape. However, they can have different sizes and / or different shapes.

[0011] The process chamber can be modular, which means that multiple process chambers can be connected to each other to provide a highly flexible substrate processing system. The process chamber can include materials that are compatible with the process chemicals (i.e., the first liquid and the second liquid) and the required processing conditions. The material can be PFA (perfluoroalkoxy alkane), quartz, PP (polypropylene), PE (polyethylene), Ta (tantalum), etc.

[0012] The processing chamber can be sized so that individual substrate processing can be performed commensurate with the size and / or shape of the substrate. The processing chamber can be configured to hold a processing fluid and / or electrolyte applied to the surface treatment. The processing fluid and / or electrolyte can be individually selected to be suitable for the intended application and / or the desired result of the surface treatment.

[0013] Thus, the processing chamber can include a universal design to allow flexible surface treatment of substrates. At the same time, individual substrate treatments in the universal processing chamber can be achieved by changing the exchangeable distribution units. In other words, the processing chamber can be configured to receive one of a variety of exchangeable distribution units suitable for the intended substrate treatment.

[0014] In addition to the substrate to be processed, the processing chamber can be configured to receive one of the first exchangeable dispensing unit and the second exchangeable dispensing unit. The first exchangeable dispensing unit can be configured to provide a first liquid in the processing chamber, and the second exchangeable dispensing unit can be configured to provide a second liquid in the processing chamber. The first liquid and the second liquid can be the same or different from each other. The first liquid and / or the second liquid can be a processing fluid, a rinsing fluid and / or an electrolyte applied to the surface treatment of the substrate.

[0015] The substrate treated by the first liquid may be different from the substrate treated by the second liquid. Alternatively, the same substrate may be treated first by the first liquid, and then by the second liquid. Furthermore, the same substrate may be treated first by the first liquid, and then by the second liquid, without exchanging the exchangeable dispensing unit.

[0016] Preferably, the first exchangeable dispensing unit or the second exchangeable dispensing unit may be inserted into the process chamber before the substrate is inserted or immersed in the process chamber.

[0017] The term "interchangeable cooperation" may be understood as meaning that each of the first dispensing unit and the second dispensing unit may be releasably connected to the processing chamber based on the processing liquid to be applied in the upcoming surface treatment of the substrate. In other words, if the first exchangeable dispensing unit is removed from the processing chamber, the second exchangeable dispensing unit may be inserted into the processing chamber without any modification or adjustment of the interface. Therefore, exchangeable cooperation may also refer to an exchangeable connection, an exchangeable interface, a universal interface, etc.

[0018] When the substrate is immersed in the processing chamber, the first exchangeable dispensing unit can face the substrate to be processed. In order to uniformly provide the first liquid on the surface of the substrate, the size and / or shape of the first exchangeable dispensing unit can be adapted to the size and / or shape of the substrate to be processed. Similarly, when the substrate is immersed in the processing chamber, the second exchangeable dispensing unit can face the substrate to be processed. In order to uniformly provide the second liquid on the surface of the substrate, the size and / or shape of the first exchangeable dispensing unit can be adapted to the size and / or shape of the substrate to be processed.

[0019] The first exchangeable dispensing unit and / or the second exchangeable dispensing unit may include a plurality of orifices for distributing the process fluid and / or electrolyte from its interior to the process chamber and / or the substrate. The orifices may include, for example, nozzles, injection holes, and the like.

[0020] The kit interface arranged at the processing chamber can be connected to a first liquid reservoir configured for supplying a first liquid. Therefore, the first liquid can be supplied from the kit interface to a plurality of orifices of the first exchangeable dispensing unit via the first inlet interface. Alternatively, the kit interface arranged at the processing chamber can be connected to a second liquid reservoir configured for supplying a second liquid. Therefore, the second liquid can be supplied from the kit interface to a plurality of orifices of the second exchangeable dispensing unit via the second inlet interface.

[0021] Thus, the kit interface, the first inlet interface and the plurality of orifices of the first exchangeable dispensing unit may form a passage for a first liquid. Likewise, the kit interface, the second inlet interface and the plurality of orifices of the second exchangeable dispensing unit may form another passage for a second liquid. The first inlet interface and the second inlet interface may be adapted to flexibly change the passage for the first liquid or the second liquid based on the process to be performed on the surface of the substrate.

[0022] In an example, the exchangeable cooperation does not require changing the conduits in the process chamber, the first exchangeable dispensing unit or the second exchangeable dispensing unit. The term conduit may be understood as a separate tube or conduit connecting the process chamber and the first exchangeable dispensing unit or connecting the process chamber and the second exchangeable dispensing unit.

[0023] By directly coupling the kit interface of the process chamber with the first inlet interface of the first exchangeable dispensing unit for supplying the first liquid or the second inlet interface of the second exchangeable dispensing unit for supplying the second liquid, a fast and simple exchangeable cooperation can be achieved. Thus, it is easy to change the exchangeable dispensing unit based on application-, process- and / or liquid-specific requirements.

[0024] In an example, the kit interface, the first inlet interface and the second inlet interface are also configured to transfer power and / or data interchangeably between the kit interface and the first inlet interface or between the kit interface and the second inlet interface. In other words, the kit interface, the first inlet interface and the second inlet interface can allow not only chemical liquid supply but also electrical and / or data communication between them by means of standardized connections. Standardized electrical connections and / or data connections can facilitate changes in the interchangeable dispensing unit.

[0025] In an example, the exchangeable transmission does not require changes to the electrical or data connections in the processing chamber, the first exchangeable distribution unit, or the second exchangeable distribution unit. Therefore, any complex piping and / or cabling between the processing chamber and the exchangeable distribution unit can be avoided, while ensuring reliable fluid, electrical, and / or information connectivity between them. Therefore, replacing the first exchangeable distribution unit by the second exchangeable distribution unit in the processing chamber may not affect the exchangeable transmission of power and / or data.

[0026] In an example, the exchangeable cooperation, electrical connection and / or data connection between the kit interface and the first inlet interface or between the kit interface and the second inlet interface is a plug-and-play cooperation or connection. The term "plug-and-play" may be understood to mean that the first exchangeable dispensing unit and / or the second exchangeable dispensing unit may be used immediately when the first exchangeable dispensing unit and / or the second exchangeable dispensing unit is connected to the process chamber.

[0027] Since the exchangeable cooperation does not require changes in the pipes, electrical connections or data connections in the process chamber, the first exchangeable distribution unit or the second exchangeable distribution unit when replacing the exchangeable distribution unit, a plug-and-play cooperation or connection is available. Therefore, the first exchangeable distribution unit can be ready for use directly after the first inlet interface is connected to the kit interface, and / or the second exchangeable distribution unit can be ready for use directly after the second inlet interface is connected to the kit interface. Therefore, a fast and uncomplicated installation of the module kit in a manufacturing environment can be achieved.

[0028] In an example, the kit interface may be connected to an etching liquid supply device for providing a first liquid or may be connected to a different etching or plating liquid supply device for providing a second liquid. The first liquid may be an etching liquid, and the second liquid may be a different etching liquid or plating liquid. The kit interface may be suitable for being connected to both the etching liquid supply device and the different etching or plating liquid supply devices at the same time. Therefore, the kit interface may be able to deliver the etching liquid to the processing chamber via the first inlet interface and / or deliver different etching or plating liquids to the processing chamber via the second inlet interface.

[0029] The module kit can be configured for thin metal layer etching process, which requires highly controllable etching rate and high etching uniformity on the entire surface of the substrate. Therefore, the substrate can be soaked in the first liquid provided via the first exchangeable distribution unit, which can be used to fill the chamber with the first liquid before soaking the substrate, so that the diffusion boundary layer established on the substrate can be used to carry out etching process under the diffusion rate of the controlled reactive substance. In addition, the boundary layer can be made thinner in a controlled manner by providing a second liquid via a second exchangeable distribution unit, wherein the second liquid can be a liquid different from the first liquid or the same liquid. The first liquid provided in the chamber before the substrate is soaked can also be provided by the liquid inlet at the bottom of the treatment chamber. In addition, the treatment chamber can be equipped with an overflow and recirculation system, thereby allowing the first liquid and / or the second liquid to be continuously recirculated by, for example, a pumping system, and the pumping system potentially includes a liquid filtration, purification and / or re-regulation system.

[0030] The module kit can also be configured to electroplate the surface of the substrate. During electroplating, the substrate can be treated purely chemically by applying an ionic fluid or electrochemically by applying an electrolyte and an electric current (i.e., electroplating). The substrate can also be electrically connected to a power supply system, wherein a second material in the system known to those skilled in the art acts as a counter electrode, which can act as an anode and / or a cathode.

[0031] In an example, the first exchangeable dispensing unit and / or the second exchangeable dispensing unit comprises a nozzle for spraying the first liquid or the second liquid onto the substrate and / or a spray hole for infiltrating the first liquid or the second liquid onto the substrate. The nozzle or the spray hole can be arranged at the first exchangeable dispensing unit and / or the second exchangeable dispensing unit so that the first liquid and / or the second liquid can be reliably and evenly distributed on the surface of the substrate to be processed. For example, the nozzle or the spray hole can be evenly spaced apart from each other in the vertical direction, the horizontal direction, and the radial direction of the first exchangeable dispensing unit and / or the second exchangeable dispensing unit.

[0032] The first exchangeable dispensing unit and / or the second exchangeable dispensing unit may comprise two dispensing elements, which may be arranged parallel to each other. Each of the dispensing elements may be configured independently of one another for spray application or immersion application. The substrate holder, i.e. the substrate to be processed, may be inserted or withdrawn between the dispensing elements.

[0033] For spray application, the first exchangeable dispensing unit and / or the second exchangeable dispensing unit may include a plurality of spray bars for dispersing the first liquid spray and / or the second liquid spray in the processing chamber. Preferably, each spray bar may include a plurality of nozzles for spraying the first liquid spray and / or the second liquid spray in a direction relative to the surface of the substrate to be processed. The spray bars may be arranged in a vertical direction or a horizontal direction relative to the processing chamber.

[0034] For immersion application, each of the first exchangeable distribution unit and / or the second exchangeable distribution unit may include a distribution body. The distribution body may be formed as a frame or solid surface including a plurality of injection holes for distributing the first liquid and / or the second liquid in the processing chamber. For example, the distribution body may be plate-shaped. The injection holes may extend from the interior of the distribution body to an active surface of the distribution body facing the substrate to be processed.

[0035] Preferably, a plurality of injection holes can be arranged at or in the distribution body such that when the substrate is immersed in the process chamber, the injection holes are at least inclined or oriented in a vertical direction relative to the surface of the substrate to be processed. Alternatively or additionally, the injection holes can be arranged at the first exchangeable distribution unit and / or the second exchangeable distribution unit with a specific arrangement pattern. Thus, the liquid distribution area of ​​the injection holes on or in the distribution body can be adapted to the size and / or shape of the substrate to be processed. In particular, the distribution body can be part of a high speed plate (HSP) system.

[0036] In an example, the first exchangeable dispensing unit and the second exchangeable dispensing unit can both be configured for spray application. Alternatively, the first exchangeable dispensing unit and the second exchangeable dispensing unit can both be configured for immersion application. In addition, the first exchangeable dispensing unit can be configured for spray application, and the second exchangeable dispensing unit can be configured for immersion application, and vice versa. In addition, the dispensing elements of each exchangeable dispensing unit can be formed symmetrically or differently from each other.

[0037] In an example, the module kit is arranged for a vertically arranged substrate holder and / or surface treatment of a substrate. In other words, the module kit can be configured to receive a substrate in a vertical direction relative to a processing chamber. Since the substrate can preferably be held by a substrate holder, the substrate holder can be inserted into or removed from the processing chamber in a vertical direction. The substrate holder may include several chuck elements for holding large-sized substrates. Therefore, easy handling of the substrate can be achieved, and a compact configuration of the module kit can be achieved.

[0038] In an example, the processing chamber comprises an opening for receiving the first exchangeable dispensing unit or the second exchangeable dispensing unit, wherein the opening is arranged at the top surface of the processing chamber. In other words, the first exchangeable dispensing unit or the second exchangeable dispensing unit can also be inserted into or removed from the processing chamber in a vertical direction through the opening. Since the opening is arranged at the top surface of the processing chamber, the processing of both the exchangeable dispensing unit and the substrate can be easily aligned with each other.

[0039] In an example, the module kit may further include a cover unit arranged at the top surface of the module kit, the cover unit including a cover configured for insertion and / or extraction of a substrate holder. The cover unit may include a single cover element or two separate cover elements. The cover unit may include an opening that may be aligned with an opening of the processing chamber to provide a passage for a substrate holder or a substrate to enter the processing chamber. The cover unit may be configured to prevent any contamination of the interior of the processing chamber and / or to avoid toxic or corrosive chemical fumes from escaping the processing chamber. The cover unit may also be movable between an open position and a closed position.

[0040] In an example, the cover unit may include an exhaust device. The exhaust device may be integrated in the cover unit and configured to move the chemical vapors out of the process chamber into a storage area where the chemical vapors may be handled in accordance with health, safety and environmental standards.

[0041] In an example, the first exchangeable dispensing unit is sized for a first substrate and the second exchangeable dispensing unit is sized for a second substrate, the second substrate being larger than the first substrate.

[0042] The first substrate inserted into the process chamber can face the first exchangeable dispensing unit, and the second substrate later immersed in the process chamber can face the second exchangeable dispensing unit. Therefore, if the first substrate is larger than the second substrate, the first exchangeable dispensing unit for the first liquid can also be larger than the second exchangeable dispensing unit for the second liquid. In addition, if the second substrate is larger than the first substrate, the second exchangeable dispensing unit for the second liquid can also be larger than the first exchangeable dispensing unit for the first liquid.

[0043] Additionally or alternatively, the liquid distribution area defined by the area of ​​the nozzle or the spray hole at or within the first or second exchangeable dispensing unit may also be adjusted relative to the size of the substrate to be processed. Thus, if the first substrate is larger than the second substrate, the liquid distribution area of ​​the first exchangeable dispensing unit for the first liquid may also be larger than the liquid distribution area of ​​the second exchangeable dispensing unit for the second liquid. Furthermore, if the second substrate is larger than the first substrate, the liquid distribution area of ​​the second exchangeable dispensing unit for the second liquid may also be larger than the liquid distribution area of ​​the first exchangeable dispensing unit for the first liquid.

[0044] Thus, chemical and / or electrolytic surface treatment of individual substrates can be achieved.

[0045] In an example, the module kit further comprises a substrate size adjustment element for aligning the first exchangeable dispensing unit or the second exchangeable dispensing unit with a substrate of a specific size. The substrate size adjustment element can be configured to receive information about the size or shape of the substrate to be processed and select a suitable exchangeable dispensing unit for the substrate. Thus, the first exchangeable dispensing unit or the second exchangeable dispensing unit can be selected to be suitable for a separate substrate to be processed.

[0046] In an example, the module kit further comprises a shaking unit configured to shake a substrate holder for the substrate in at least one of three possible directions. The shaking unit can be arranged at the substrate holder or at the top surface of the module kit to adjust the position of the substrate holder, i.e., the substrate, when the substrate is inserted into the processing chamber. The shaking unit can adjust the position in the vertical direction, the horizontal direction, and / or the lateral direction to optimize the position of the substrate relative to the first exchangeable dispensing unit or the second exchangeable dispensing unit, thereby improving the quality of the surface treatment.

[0047] In an example, the module kit also includes an anode. For electrochemical surface treatment of a substrate, the anode can be arranged in a treatment chamber. If the treatment chamber contains an electrolyte provided via a first exchangeable distribution unit or a second exchangeable distribution unit, the current distribution can be directed from the anode toward the surface of the substrate to be treated, wherein the substrate can act as a cathode. The anode can be made soluble or insoluble in the first liquid and / or the second liquid. The anode can be arranged in a manner such that the anode does not interfere with the liquid flow distribution between the exchangeable distribution unit and the substrate.

[0048] In an example, the processing chamber further comprises a temperature control unit, an electromagnetic radiation source, an ultrasound unit and / or a liquid outlet. The temperature control unit can be configured to control the temperature of the processing chamber, in particular the temperature of the first liquid, the second liquid and / or a mixture thereof. The temperature control unit can include an infrared radiation source, a heat exchanger, etc. Specifically, the electromagnetic radiation source can be configured not only for temperature control, but also for photon-induced etching (e.g., by utilizing UV light).

[0049] The ultrasonic unit may include, for example, an ultrasonic transducer, and it may be configured to promote agitation of the liquid in the treatment chamber at a frequency range from a few Hz to millions of Hz. The liquid outlet is configured to discharge the treatment liquid from the treatment chamber after the chemical and / or electrolytic surface treatment of the substrate. Therefore, the liquid outlet may preferably be arranged at the bottom side of the treatment chamber.

[0050] According to the present invention, a platform assembly for chemical and / or electrolytic surface treatment of substrates is presented. The platform assembly includes a first module kit and an equipment platform as described above. The first module kit includes a first kit interface, and the equipment platform includes a platform interface. The platform interface and the first kit interface are configured for interchangeable cooperation between the first kit interface and the platform interface. The platform assembly can allow the module kit to be quickly and instantly changed according to process-specific requirements.

[0051] The equipment platform can be adapted to allow rapid and highly reliable adjustment of the processing environment for a single substrate, which can be achieved by standardizing the platform interface and the kit interface. Therefore, the cooperation of the platform interface and the first kit interface can be formed to be interchangeable, which can facilitate the change of the module kit.

[0052] The equipment platform may provide one or more liquid inlets and outlets, power supplies, data communications, etc. Thus, once the module kit is mounted at the equipment platform via the kit interface and the platform interface, the module kit can be connected to all necessary supplies or communications for performing substrate processing.

[0053] In an example, the platform component further includes a second module suite having a second suite interface, wherein the platform interface, the first suite interface, and the second suite interface are configured for interchangeable cooperation between the platform interface and the first suite interface or the second suite interface.

[0054] In an example, an equipment platform includes a number of platform interfaces configured for interchangeable cooperation with a number of kit interfaces of a number of module kits simultaneously.

[0055] The equipment platform can be suitable for installing two or more module kits for performing surface treatment. In other words, the equipment platform can include two or more platform interfaces to connect to the kit interface of each module kit. The platform interface and the kit interface can include a standardized structure so that each collaboration of the platform interface and the kit interface can be formed to be exchangeable. The processing chamber of each module kit can be configured to perform a separate substrate process. Therefore, each module kit can include the same or different exchangeable distribution units.

[0056] The equipment platform may provide one or more liquid inlets and outlets, power supply means, data communication means, etc. In addition, the equipment platform may be able to perform overall control of the module kit. Thus, while reliable supply connections and / or communications may be ensured, the exchange of one or more module kits may also be facilitated.

[0057] In an example, the interchangeable collaboration does not require changes to the equipment platform and / or the plumbing, electrical connections, and / or data connections in the module kit. Standardized kit interfaces and platform interfaces can facilitate changes to the module kit. Therefore, changes to the module kit based on application-, process-, and / or liquid-specific requirements can also be facilitated.

[0058] In an example, the interchangeable cooperation, electrical connection and / or data connection between the equipment platform and the module kit, in particular between the platform interface and the kit interface, may be a plug-and-play cooperation or connection.

[0059] In an example, each platform interface and each kit interface may together form a supply interface. The supply interface may be formed by a plug-and-play collaboration between the kit interface and the platform interface. This may enable rapid exchange of process chambers in the case of a specific process requiring exchange of process chambers rather than just exchange of exchangeable dispensing units. This may be necessary, for example, in the case of chemicals that require the use of chambers made of different materials for chemical compatibility and safety.

[0060] According to the present invention, a method for chemical and / or electrolytic surface treatment of a substrate is presented. The method comprises:

[0061] - dispensing a first liquid on a first substrate arranged in a first exchangeable dispensing unit, wherein the first exchangeable dispensing unit is inserted into a process chamber and wherein a first inlet interface of the first exchangeable dispensing unit cooperates with a kit interface of the process chamber,

[0062] - removing the first substrate from the first exchangeable dispensing unit,

[0063] - removing the first exchangeable dispensing unit from the process chamber,

[0064] - inserting the second exchangeable dispensing unit into the processing chamber,

[0065] - connecting the kit interface of the process chamber to the second inlet interface of the second exchangeable dispensing unit,

[0066] - inserting the second base plate into the second exchangeable dispensing unit, and

[0067] - Dispensing a second liquid on the second substrate.

[0068] The kit interface, the first inlet interface and the second inlet interface are configured for interchangeable cooperation between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.The first substrate and the second substrate may be one and the same substrate or two substrates.

[0069] Thus, a quick and easy adjustment of the module set based on application-, process- and / or liquid-specific requirements can be ensured.

[0070] According to the invention, a use of a module kit as described above is presented. The module kit is suitable for chemical and / or electrolytic surface treatment of substrates having a width in the range of 500 mm to 1700 mm and a length in the range of 505 mm to 2000 mm, preferably a width in the range of 1300 mm to 1700 mm and a length in the range of 1600 mm to 2000 mm, or a width in the range of 500 mm to 520 mm and a length in the range of 505 mm to 525 mm.

[0071] Since the first exchangeable dispensing unit and / or the second exchangeable dispensing unit can be dimensioned relative to the size and / or shape of the substrate to be processed, the module kit can be flexibly applied to a wide range of substrate sizes. In particular, the module kit can also be adapted for surface treatment of large substrates.

[0072] It should be noted that the above embodiments can be combined with each other independently of the aspects involved. Thus, the method can be combined with structural features, and likewise, the system can be combined with the features described above in relation to the method.

[0073] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] Exemplary embodiments of the present invention will be described below with reference to the following drawings.

[0075] Figure 1 An embodiment of a platform assembly for chemical and / or electrolytic surface treatment of substrates according to the invention is shown schematically and exemplarily.

[0076] Figure 2An embodiment of a module kit according to the invention for the chemical and / or electrolytic surface treatment of substrates is shown schematically and exemplarily.

[0077] Figure 3 An embodiment of a module kit according to the invention for the chemical and / or electrolytic surface treatment of substrates is shown schematically and exemplarily.

[0078] Figures 4a to 4d An embodiment of an exchangeable dispensing unit of a modular kit according to the invention is shown schematically and exemplarily. DETAILED DESCRIPTION

[0079] Figure 1 A platform assembly 1 for chemical and / or electrolytic surface treatment of a substrate is shown. The chemical and / or electrolytic surface treatment of the substrate may be any material deposition, zinc coating, chemical or electrochemical etching, anodizing, metal separation treatment, etc. The substrate may include a conductor plate, a semiconductor substrate, a film substrate, a substantially plate-shaped metal or metallized workpiece, etc.

[0080] The platform assembly 1 includes an equipment platform 200 and three module kits 100. Each module kit 100 includes a kit interface 110, and the equipment platform 200 includes a platform interface 210 corresponding to each kit interface 110. Each platform interface 210 and the kit interface 110 together form a supply interface 11 (see also Figure 2 ). The platform interface 210 and the kit interface 110 are configured for interchangeable cooperation between them. The interchangeable cooperation does not require any changes in the pipes, electrical connections and / or data connections in the equipment platform 200 and / or the module kit 100 when changing one or more module kits 100. The platform interface 210 and the kit interface 110 may include a standardized interface structure so that each cooperation of the platform interface 210 and the kit interface 110 can be formed to be interchangeable.

[0081] like Figure 2 As shown, the module kit 100 is arranged for surface treatment of a vertically arranged substrate 41 held by a substrate holder 40. The module kit 100 is suitable for chemical and / or electrolytic surface treatment of substrates having a width in the range of 500 mm to 1700 mm and a length in the range of 505 mm to 2000 mm, preferably a width in the range of 1300 mm to 1700 mm and a length in the range of 1600 mm to 2000 mm, or a width in the range of 500 mm to 520 mm and a length in the range of 505 mm to 525 mm. The substrate holder 40 can be inserted into or removed from the process chamber 10 in a vertical direction, which allows a compact construction of the module kit 100.

[0082] Figure 3Such a module kit 100 is shown, which includes a process chamber 10, a first exchangeable dispensing unit 20 or a second exchangeable dispensing unit 20. The process chamber 10 includes an opening 12 at the top surface of the process chamber 10 for receiving the first exchangeable dispensing unit 20 and / or the second exchangeable dispensing unit 20. In other words, the process chamber 10 is sized for receiving the first exchangeable dispensing unit 20 and / or the second exchangeable dispensing unit 20.

[0083] The first exchangeable dispensing unit 20 is configured to dispense a first liquid on a substrate 41, and the second exchangeable dispensing unit 20 is configured to dispense a second liquid on the substrate 41. The first exchangeable dispensing unit 20 and the second exchangeable dispensing unit 20 are each sized to receive the substrate 41 in their internal cavity 24. The first exchangeable dispensing unit 20 and / or the second exchangeable dispensing unit 20 may include two dispensing elements 21, 22, which may be arranged parallel to each other. Each of the dispensing elements 21, 22 may be configured independently of each other for spray application or immersion application. The substrate holder 40, i.e. the substrate 41 to be processed, may be inserted and / or withdrawn between the two dispensing elements 21, 22.

[0084] The processing chamber 10 includes a kit interface 110 for supplying a first liquid or a second liquid. The first exchangeable dispensing unit 20 includes a first inlet interface 23 for the first liquid. The second exchangeable dispensing unit 20 includes a second inlet interface 23 for the second liquid. The kit interface 110 can be connectable to a platform interface 210, which is connected to an etching liquid supply (not shown) for providing the first liquid or a different etching or plating liquid supply (not shown) for providing the second liquid.

[0085] The kit interface 110, the first inlet interface 23 and the second inlet interface 23 are configured for exchangeable cooperation between the kit interface 110 and the first inlet interface 23 or between the kit interface 110 and the second inlet interface 23. Therefore, the exchangeable cooperation does not require changing the pipelines in the process chamber 10, the first exchangeable dispensing unit 20 or the second exchangeable dispensing unit 20.

[0086] The kit interface 110, the first inlet interface 23, and the second inlet interface 23 are also configured to exchangeably transmit power and / or data between the kit interface 110 and the first inlet interface 23 or between the kit interface 110 and the second inlet interface 23. Therefore, exchangeable transmission does not require changing the electrical connection or data connection in the process chamber 10, the first exchangeable distribution unit 20, or the second exchangeable distribution unit 20.

[0087] The exchangeable cooperation, electrical connection and / or data connection between the kit interface 110 and the first inlet interface 23 or between the kit interface 110 and the second inlet interface 23 can be a plug-and-play cooperation or connection. Thus, a quick and easy change of the liquid delivery system can be achieved without adjusting the interface between the process chamber 10 and the exchangeable dispensing unit 20, which can be modified specifically for the process.

[0088] Due to the standardization and plug-and-play of the platform interface 210 and the kit interface 110 forming the supply interface 11 , quick and easy changes of the universal chamber 10 are also possible.

[0089] The module kit 100 further comprises a cover unit 30 arranged at the top surface of the module kit 100, the cover unit 30 comprising a cover 31 configured for inserting and / or extracting a substrate holder 40. The substrate holder 40 is aligned with the cover 31 and allows the substrate 41 to be positioned between the dispensing elements 21, 22 of the first or second exchangeable dispensing unit 20 of the module kit 100.

[0090] The substrates to be processed in the treatment chamber 10 can have the same size and / or the same shape. However, they can also have different sizes and / or different shapes. Each substrate 41 inserted into the treatment chamber 10 can face the corresponding exchangeable dispensing unit 20. For example, the first exchangeable dispensing unit 20 can be sized for the first substrate, and the second exchangeable dispensing unit 20 can be sized for the second substrate, which is larger than the first substrate (it can also be smaller). Therefore, if the first substrate is smaller than the second substrate, the liquid distribution area of ​​the first exchangeable dispensing unit 20 for the first liquid can also be smaller than the liquid distribution area of ​​the second exchangeable dispensing unit 20 for the second liquid to improve the quality of the surface treatment.

[0091] Figures 4a to 4d Four examples of first and second exchangeable dispensing units 20 , 20 that facilitate reliable and uniform distribution of the first or second liquid onto the surface of a substrate 41 to be processed are shown.

[0092] like Figure 4a As shown, the exchangeable dispensing unit 20 includes two dispensing elements 21, 22, which are arranged parallel to each other and formed symmetrically. The exchangeable dispensing unit 20 may include a nozzle 27 for spraying the first liquid or the second liquid onto the substrate 41. The nozzle 27 may be arranged at a plurality of spray bars 26 oriented in the horizontal direction of the processing chamber 10. Alternatively, as Figure 4b As shown, the spray bar 26 may be arranged along the vertical direction of the treatment chamber 10 .

[0093] exist Figure 4cIn the embodiment, the exchangeable distribution unit 20 includes a spray hole 29 for applying the first liquid or the second liquid to the substrate 41. The spray hole 29 is arranged at or in the distribution body 28, so that when the substrate 41 is immersed in the processing chamber 10, the spray hole 29 is basically oriented in a vertical direction relative to the surface of the substrate 41 to be processed. Alternatively, the spray hole 29 can be arranged at an angle relative to the surface of the substrate 41 to be processed. The distribution body 28 can be part of a high speed plate (HSP) system. Figure 4c and Figure 4d As shown, the liquid distribution area formed by the plurality of spray holes 29 on or in the distribution body 28 can be adapted to the size of the substrate 41 to be processed.

[0094] Alternatively, the dispensing elements 21 , 22 of the exchangeable dispensing unit 20 can be formed differently or asymmetrically and comprise both the nozzles 27 for the spray application and the spray orifices 29 for the immersion application.

[0095] The processing chamber 10 may also include a temperature control unit (not shown) for controlling the temperature of the processing chamber 10 or the processing fluid, an electromagnetic radiation source (not shown) for photon-induced etching, an ultrasound unit (not shown) for promoting agitation of the liquid in the processing chamber 10, and / or a liquid outlet (not shown) for discharging the fluid out of the processing chamber 10.

[0096] Furthermore, the cover unit 30 comprises an exhaust device 32 which is configured to move the chemical vapors out of the process chamber 10 into a storage area where the chemical vapors can be handled in accordance with health, safety and environmental standards.

[0097] The module kit 100 also includes a substrate size adjustment element 14 for aligning the first exchangeable dispensing unit 20 or the second exchangeable dispensing unit 20 with a substrate of a specific size (see Figure 3 ).

[0098] The module kit 100 further includes a shaking unit 13 configured to shake a substrate holder 40 for a substrate 41 in at least one of three possible directions. The shaking unit 13 is arranged at the substrate holder 40 to adjust the position of the substrate holder 40, i.e., the substrate 41, when the substrate 41 is inserted into the process chamber 10. The shaking unit 13 can adjust the position of the substrate holder 40 in the vertical direction, the horizontal direction, and / or the lateral direction to optimize the position of the substrate 41 relative to the first exchangeable dispensing unit 20 or the second exchangeable dispensing unit 20.

[0099] The module set 100 is configured as a hybrid processing equipment that allows etching or (electro)plating of the substrate 41. Specifically, in order to perform electroplating, the module set 100 may also include an anode (not shown) in the process chamber 10. If the process chamber 10 contains an electrolyte provided via the first exchangeable dispensing unit 20 or the second exchangeable dispensing unit 20, the current distribution is directed from the anode toward the substrate surface to be processed, wherein the substrate 41 may act as a cathode.

[0100] Thus, the module kit 100 enables easy modification of the exchangeable dispensing unit 20 within the processing chamber 10 based on the requirements of substrate processing.

[0101] It must be noted that embodiments of the present disclosure are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims, while other embodiments are described with reference to apparatus type claims. However, from the above and following descriptions, a person skilled in the art will infer that, unless otherwise indicated, any combination of features related to different subject matters, in addition to any combination of features belonging to one type of subject matter, is also considered to be disclosed by the present application. However, all features can be combined to provide synergistic effects that exceed the simple superposition of features.

[0102] Although the present disclosure has been shown and described in detail in the drawings and the specification, such illustration and description are to be considered illustrative or exemplary rather than restrictive. The present disclosure is not limited to the disclosed embodiments. Other variations of the disclosed embodiments may be understood and implemented by those skilled in the art when practicing the claimed disclosure by studying the drawings, the present disclosure, and the dependent claims.

[0103] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A modular kit (100) for chemical and / or electrolytic surface treatment of a substrate (41), comprising: - a treatment chamber (10), - a first exchangeable dispensing unit (20) for dispensing a first liquid on said substrate (41), and - a second exchangeable dispensing unit (20) for dispensing a second liquid on said substrate (41), wherein the processing chamber (10) is dimensioned to receive the first exchangeable dispensing unit (20) or the second exchangeable dispensing unit (20), wherein the first exchangeable dispensing unit (20) and the second exchangeable dispensing unit (20) are each sized to receive the substrate (41), The processing chamber (10) comprises a kit interface (110) for supplying the first liquid or the second liquid. wherein the first exchangeable dispensing unit (20) comprises a first inlet interface (23) for the first liquid, wherein the second exchangeable dispensing unit (20) comprises a second inlet interface (23) for the second liquid, and The suite interface (110), the first inlet interface (23) and the second inlet interface (23) are configured for interchangeable collaboration between the suite interface (110) and the first inlet interface (23) or between the suite interface (110) and the second inlet interface (23).

2. The module kit (100) according to claim 1, wherein: The exchangeable cooperation does not require changes to the conduits in the process chamber (10), the first exchangeable dispensing unit (20) or the second exchangeable dispensing unit (20).

3. The module kit (100) according to one of the preceding claims, wherein: The kit interface (110), the first inlet interface (23) and the second inlet interface (23) are also configured to exchangeably transmit power and / or data between the kit interface (110) and the first inlet interface (23) or between the kit interface (110) and the second inlet interface (23).

4. Module kit (100) according to the preceding claim, wherein: The exchangeable transfer does not require changes to electrical or data connections in the process chamber (10), the first exchangeable distribution unit (20), or the second exchangeable distribution unit (20).

5. The module kit (100) according to one of the preceding claims, wherein: The exchangeable cooperation, the electrical connection and / or the data connection between the kit interface (110) and the first inlet interface (23) or between the kit interface (110) and the second inlet interface (23) is a plug-and-play cooperation or connection.

6. The module kit (100) according to one of the preceding claims, wherein: The kit interface (110) is connectable to an etching liquid supply for providing the first liquid and / or is connectable to a different etching or plating liquid supply for providing the second liquid.

7. The module kit (100) according to one of the preceding claims, wherein: The first exchangeable dispensing unit (20) and / or the second exchangeable dispensing unit (20) comprises a nozzle (27) for spraying the first liquid or the second liquid onto the substrate (41) and / or a spray hole (29) for applying the first liquid or the second liquid to the substrate (41) by immersion.

8. The module kit (100) according to one of the preceding claims, wherein: The module kit (100) is arranged for surface treatment of a vertically arranged substrate holder (40) and / or substrate (41).

9. The module kit (100) according to one of the preceding claims, wherein: The process chamber (10) comprises an opening (12) for receiving the first exchangeable dispensing unit (20) or the second exchangeable dispensing unit (20), wherein the opening is arranged at a top surface of the process chamber (10).

10. The module kit (100) according to one of the preceding claims, wherein: The first exchangeable dispensing unit (20) is dimensioned for a first substrate, and the second exchangeable dispensing unit (20) is dimensioned for a second substrate, the second substrate being larger than the first substrate.

11. The module kit (100) according to one of the preceding claims, further comprising a substrate size adjustment element (14) for aligning the first exchangeable dispensing unit (20) or the second exchangeable dispensing unit (20) to a substrate of a specific size.

12. The module kit (100) according to one of the preceding claims, further comprising a shaking unit (13) configured to shake a substrate holder (40) for the substrate (41) in at least one of three possible directions.

13. Module kit (100) according to one of the preceding claims, further comprising an anode.

14. The module kit (100) according to one of the preceding claims, wherein: The treatment chamber (10) further comprises a temperature control unit, an electromagnetic radiation source, an ultrasound unit and / or a liquid outlet.

15. A platform assembly (1) for chemical and / or electrolytic surface treatment of a substrate (41), comprising: - a first module kit (100) according to one of the preceding claims, and - Equipment platform (200), Wherein, the equipment platform (200) comprises a platform interface (210), The platform interface (210) and the first kit interface (110) of the first module kit (100) are configured for interchangeable collaboration between the first kit interface (110) and the platform interface (210).

16. The platform assembly (1) according to the preceding claim, further comprising a second module assembly (100) having a second assembly interface (110), wherein: The platform interface (210), the first suite interface (110), and the second suite interface (110) are configured for interchangeable cooperation between the platform interface (210) and the first suite interface (110) or the second suite interface (110).

17. The platform assembly (1) according to claim 15 or 16, wherein: The interchangeable collaboration does not require changes to plumbing, electrical connections, and / or data connections in the equipment platform (200) and / or the module suite (100).

18. Platform assembly (1) according to one of claims 15 to 17, wherein: The equipment platform (200) includes a plurality of platform interfaces (210) configured to simultaneously and interchangeably cooperate with a plurality of kit interfaces (110) of a plurality of module kits (100).

19. A method for chemical and / or electrolytic surface treatment of a substrate (41), comprising: - dispensing a first liquid on a first substrate arranged in a first exchangeable dispensing unit (20), wherein the first exchangeable dispensing unit (20) is inserted into a process chamber (10), and wherein a first inlet interface (23) of the first exchangeable dispensing unit (20) cooperates with a kit interface (110) of the process chamber (10), - removing said first substrate from said first exchangeable dispensing unit (20), - removing the first exchangeable dispensing unit (20) from the process chamber (10), - inserting a second exchangeable dispensing unit (20) into said processing chamber (10), - connecting the kit interface (110) of the process chamber (10) to the second inlet interface (23) of the second exchangeable dispensing unit (20), - inserting a second substrate into said second exchangeable dispensing unit (20), and - dispensing a second liquid on said second substrate, The suite interface (110), the first inlet interface (23) and the second inlet interface (23) are configured for interchangeable collaboration between the suite interface (110) and the first inlet interface (23) or between the suite interface (110) and the second inlet interface (23).

20. Use of a modular kit (100) for chemical and / or electrolytic surface treatment of a substrate (41) according to one of claims 1 to 14, wherein the substrate has a width in the range of 500 mm to 1700 mm and a length in the range of 505 mm to 2000 mm, preferably a width in the range of 1300 mm to 1700 mm and a length in the range of 1600 mm to 2000 mm, or a width in the range of 500 mm to 520 mm and a length in the range of 505 mm to 525 mm.

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