Germanium wafer taking and feeding device of wire cutting machine for cutting germanium wafers

Abstract

The invention discloses a wire cutting machine germanium wafer cutting taking and feeding device which comprises a workbench, XY translation modules, a clamp, a negative pressure taking mechanism, a wire cutting machine and a feeding device. The XY translation modules are symmetrically arranged on the left side and the right side of the workbench respectively; the XY translation modules on the left side and the right side are provided with a clamp capable of adjusting the clamping radius and a negative pressure piece taking mechanism respectively, the wire cutting machine is arranged between the clamp and the negative pressure piece taking mechanism, and the feeding device is arranged behind the negative pressure piece taking mechanism. The device can ensure that the circle center of the suction cup is always aligned with the axis of the germanium crystal bar when the wafer is taken, and meanwhile, the iris mechanism and the suction claw on the vacuum suction cup are matched, so that suction force borne by the germanium wafer can be uniformly distributed, and the situation that the germanium wafer is damaged due to non-uniform stress is avoided; after the germanium wafer is sucked, the PPU material taking mechanical arm can convey the germanium wafer to the conveying belt through the vacuum suction cup so that the germanium wafer can be conveyed to the next working section to be machined, the labor cost is reduced, and the machining efficiency is improved.

Description

Technical Field

[0001] The patent of this invention belongs to the technical field of germanium crystal material processing, and specifically relates to a wafer feeding device for cutting germanium wafers with a wire cutting machine. Background Art

[0002] In the production and processing of germanium products, the existing germanium crystal rod segmented sampling is to first glue the crystal rod to graphite with glue, and then place the crystal rod in the V-groove of the circular diamond wire saw after the glue is dry. Then, the circular diamond wire saw is used to cut the crystal rod to the graphite according to different thickness requirements, and then the crystal segments and samples are fished out after degumming in a solvent. The problems of this processing process are very prominent, and the efficiency is too low. The bonding step requires waiting for 4 hours to ensure that the glue is completely solidified, and the degumming step also takes more than 0.5 hours. There is a possibility of collision and fragmentation during the sheet fishing step. The use of graphite and degumming agent increases material costs and environmental costs.

[0003] Another method of sampling germanium crystal ingots by segmentation is to fix the crystal ingot with a clamp for clamping the crystal ingot, and then use a circular diamond wire cutting machine to segment the crystal ingot after the crystal ingot is clamped, and use a V-shaped groove to receive the cut crystal segments. However, when using this clamp fixing method to cut germanium wafer slices, once it falls into the V-shaped groove, the germanium wafer will fall to the processing surface, or fall and be damaged, causing damage to the diamond wire or germanium wafer on the equipment.

[0004] In view of this difficulty, the prior art has developed a wafer feeding device for cutting germanium wafers with an annular diamond wire cutting machine, such as the Chinese patent (CN211868257U). The device includes a pressure reducing valve, a vacuum generator, a reducer, a fixed plate with a base, a vacuum suction cup and a connecting pipeline. The air inlet of the pressure reducing valve is connected to the compressed air of the compressed air storage tank, the air outlet of the pressure reducing valve is connected to the inlet of the vacuum generator, the air outlet of the vacuum generator is connected to the outside, the vacuum port of the vacuum generator is connected to the reducer through a connecting pipeline, and the multiple outlets of the reducer are connected to multiple groups of vacuum suction cups fixed on the fixed plate with a base through connecting pipelines. The multiple groups of vacuum suction cups are evenly adsorbed on the end face of the germanium crystal rod to be cut. The device can flexibly take out germanium wafers through negative pressure, but the inventor found that this device still has the following defects: The suction cup of the device can only be used to take out germanium crystal rods of one diameter. The size of the suction cup cannot be adjusted according to germanium wafers of different diameters. Although the suction force can be adjusted to suck germanium wafers of different diameters, this will increase the risk of damage to the germanium wafer due to uneven force. At the same time, most of the germanium wafers cut from individual pieces are collected and transported manually, which not only increases processing costs but also reduces processing efficiency.

[0005] Therefore, this paper proposes a wafer feeding device for cutting germanium wafers using a wire cutting machine. Summary of the invention

[0006] In order to solve the above problems, the present invention provides a wafer taking and feeding device for cutting germanium wafers using a wire cutting machine, which can adapt to various diameters and realize automatic feeding.

[0007] In order to achieve the above technical effects, the present invention is implemented through the following technical solutions: a wafer feeding device for cutting germanium wafers with a wire cutting machine, comprising a workbench, an XY translation module, a fixture, a negative pressure wafer taking mechanism, a wire cutting machine, and a feeding device, wherein the left and right sides of the workbench are symmetrically provided with XY translation modules, and the left and right sides of the XY translation modules are respectively installed with a fixture with adjustable clamping radius and a negative pressure wafer taking mechanism, the wire cutting machine is arranged between the fixture and the negative pressure wafer taking mechanism, and the feeding device is arranged behind the negative pressure wafer taking mechanism; the negative pressure wafer taking device also includes a vacuum suction cup with adjustable suction radius and a liftable base, the vacuum suction cup is installed on a rotating shaft in the middle of the upper side of the base and the front end of the rotating shaft is connected to a driving motor A, and the driving motor A is installed on the side of the upper end of the base; the feeding device also includes a PPU material taking manipulator and a conveyor belt, the PPU material taking manipulator is installed behind the negative pressure wafer taking mechanism, and the conveyor belt is installed above and behind the PPU material taking manipulator and its upper surface is parallel to the upper surface of the vacuum suction cup in a horizontal state.

[0008] Preferably, the fixture further comprises a fixed clamp seat, a limiting clamp seat and a translation stage. The fixed clamp seat is fixedly mounted on the XY translation module via a bolt hole structure, and the limiting clamp seat is mounted on the translation stage above the XY translation module.

[0009] Preferably, the fixed clamp seat and the limiting clamp seat both include a lower clamp seat, a limiting slide rod, an upper clamp seat and a limiting card. A limiting slide rod is provided on the top of the lower clamp seat, and an upper clamp seat is slidably installed on the limiting slide rod. A limiting card is installed on the top of the upper clamp seat, which can lock the slide rod to prevent the upper clamp seat from sliding.

[0010] Preferably, rubber pads are provided on the inner sides of the lower clamping seat and the upper clamping seat.

[0011] Preferably, the vacuum suction cup also includes a flange, a joint, a suction cup, an iris mechanism, and a suction claw. The flange is installed on the rotating shaft in the middle of the upper side of the base. The joint A is installed at the rear end of the flange and is connected to the vacuum generator, the pressure reducing valve, and the gas tank in sequence through a pipeline. The suction cup is installed at the front end of the flange, and an iris mechanism is installed on the outside of the suction cup. A suction claw with an adjustable suction radius is installed in the iris mechanism.

[0012] Preferably, the iris mechanism also includes a sun gear groove, a large gear, a planetary gear groove, a pinion gear, an axle, a rack, a suction claw, an L-shaped slide groove, and a drive motor B. A sun gear groove and three sets of planetary gear grooves are provided on the back side of the suction cup. The large gear is rotatably installed in the sun gear groove, and the pinion gear is installed on the axle in the planetary gear groove. The pinion gear is meshed with the large gear on the side facing the back side of the suction cup. An L-shaped slide groove is provided on the front side of the suction cup, and a rack is slidably installed in the L-shaped slide groove and meshed with the pinion gear on the side facing the front side of the suction cup. A suction claw is provided on the rack, and the drive motor B is installed above the flange and its driving end is connected to the wheel surface of the pinion gear.

[0013] Preferably, a joint B is provided on the outer side of the suction claw, and the joint B is connected to the joint A through a pipeline.

[0014] Preferably, a vacuum suction cup is provided on the material picking end of the PPU material picking robot.

[0015] The beneficial effects of the present invention are: The fixture and negative pressure wafer picking mechanism in the device are installed on the XY translation module, so that when picking up the wafer, the center of the suction cup is always aligned with the axis of the germanium crystal rod. At the same time, the iris mechanism and suction claws on the vacuum suction cup can make the suction force on the germanium wafer evenly distributed, avoiding the situation where the germanium wafer is damaged due to uneven force. After sucking the germanium wafer, the vacuum suction cup is driven by the drive motor A to turn upward, and then the PPU material picking robot sends the germanium wafer to the conveyor belt through the vacuum suction cup so that it can be sent to the next section for processing. It can be seen that the device reduces labor costs through automatic control mechanisms and also speeds up processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for describing the embodiment are briefly introduced below. Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

[0017] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 For the present invention Figure 1 A partial schematic diagram of the middle part; Figure 3 It is a front view of the present invention; Figure 4 For the present invention Figure 3 Middle B is a cross-sectional schematic diagram; Figure 5 For the present invention Figure 4 A partial schematic diagram of C in the middle; Figure 6 It is a left side view of the present invention; Figure 7For the present invention Figure 6 A partial schematic diagram of D in the middle; Figure 8 For the present invention Figure 6 Middle E is a schematic cross-sectional view; Fig. 9 For the present invention Figure 8 Middle F is a schematic cross-sectional view; In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Workbench; 2. XY translation module; 3. Wire cutting machine; 4. Base; 5. Rotating shaft; 6. Drive motor A; 7. Fixed clamp seat; 8. Limit clamp seat; 9. Translation table; 10. Lower clamp seat; 11. Limit slide bar; 12. Upper clamp seat; 13. Limit card; 14. Rubber pad; 15. Flange; 16. Connector A; 17. Suction cup; 18. Suction claw; 19. Sun gear groove; 20. Big gear; 21. Planetary gear groove; 22. Pinion; 23. Wheel axle; 24. Rack; 25. L-shaped slide; 26. Drive motor B; 27. Connector B; 28. PPU material taking robot; 29. ​​Conveyor belt. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0019] like Figures 1 to 9 As shown, the prior art in this embodiment has the following problems: the inventor found that there is a wafer feeding device for cutting germanium wafers by a circular diamond wire saw disclosed in the prior art, such as the Chinese patent (CN211868257U), which can flexibly take out germanium wafers through negative pressure, but the inventor found that the device also has the following defects: the suction cup of the device can only be used for taking out germanium crystal rods of one diameter, and it is impossible to adjust the size of the suction cup according to germanium wafers of different diameters. Although the size of the suction force can be adjusted to suck germanium wafers of different diameters, this will increase the risk of damage to the germanium wafer due to uneven force; at the same time, most of the germanium wafers cut by a single sign are collected and transported manually, which not only increases the processing cost, but also reduces the processing efficiency. .

[0020] Therefore, the inventor provides a wafer feeding device for cutting germanium wafers with a wire cutting machine 3, comprising a workbench 1, an XY translation module 2, a fixture, a negative pressure wafer taking mechanism, a wire cutting machine 3, and a feeding device, wherein the XY translation modules 2 are symmetrically arranged on the left and right sides of the workbench 1, and the XY translation modules 2 on the left and right sides are respectively installed with a fixture with adjustable clamping radius and a negative pressure wafer taking mechanism, the wire cutting machine 3 is arranged between the fixture and the negative pressure wafer taking mechanism, and the feeding device is arranged behind the negative pressure wafer taking mechanism; the negative pressure wafer taking device also includes It includes a vacuum suction cup 17 with an adjustable suction radius and a liftable base 4. The vacuum suction cup 17 is installed on the rotating shaft 5 in the middle of the upper side of the base 4 and the front end of the rotating shaft 5 is connected to the driving motor A6, and the driving motor A6 is installed on the upper side of the base 4; the feeding device also includes a PPU material picking robot 28 and a conveyor belt 29. The PPU material picking robot 28 is installed behind the negative pressure film picking mechanism, and the conveyor belt 29 is installed above and behind the PPU material picking robot 28 and its upper surface is parallel to the upper surface of the vacuum suction cup 17 in a horizontal state.

[0021] The effect is as follows: the clamp and negative pressure film taking mechanism in the device are installed on the XY translation module 2, so that when taking the film, the center of the suction cup 17 is always aligned with the axis of the germanium crystal rod, and at the same time, the iris mechanism and the suction claw 18 on the vacuum suction cup 17 can make the suction force on the germanium wafer evenly distributed, avoiding the situation where the germanium wafer is damaged due to uneven force; after cutting, the vacuum suction cup 17 is driven by the drive motor A6 to turn upward, and then the PPU material taking robot 28 sends the germanium wafer to the conveyor belt 29 through the vacuum suction cup 17 so that it can be sent to the next section for processing. It can be seen that the device reduces labor costs through automatic control mechanisms and also speeds up processing efficiency.

[0022] Furthermore, the fixture also includes a fixed clamp seat 7, a limiting clamp seat 8, and a translation stage 9. The fixed clamp seat 7 is fixedly installed on the XY translation module 2 through a bolt hole structure, and the limiting clamp seat 8 is installed on the translation stage 9 above the XY translation module 2. When in use, the germanium crystal rod is first placed between the fixed clamp seat 7 and the limiting clamp seat 8, and then the XY translation module 2 is controlled to drive the translation stage 9 and drive the limiting clamp seat 8 to move toward the fixed clamp seat 7, thereby clamping the germanium crystal rod.

[0023] Furthermore, the fixed clamp seat 7 and the limiting clamp seat 8 both include a lower clamp seat 10, a limiting slide bar 11, an upper clamp seat 12, and a limiting card 13. A limiting slide bar 11 is arranged on the top of the lower clamp seat 10, and an upper clamp seat 12 is slidably mounted on the limiting slide bar 11. A limiting card 13 which can lock the slide bar so that the upper clamp seat 12 does not slide is installed on the top of the upper clamp seat 12; this structure can be used to adapt to germanium crystal rods of various diameters. When the diameter of the germanium crystal rod is too large, the limiting slide bar 11 can be loosened and the upper clamp seat 12 can be moved upward, so that the clamping radius of the clamp seat can be increased, and vice versa.

[0024] Furthermore, rubber pads 14 are provided inside the lower clamping seat 10 and the upper clamping seat 12; the rubber pads 14 in this structure can be made of hard rubber with a rough surface, so that the germanium crystal rod can be clamped without damaging the rod body.

[0025] Furthermore, the vacuum suction cup 17 also includes a flange 15, a joint A16, a suction cup 17, an iris mechanism, and a suction claw 18. The flange 15 is installed on the rotating shaft 5 in the middle of the upper side of the base 4. The joint A16 is installed at the rear end of the flange 15 and is connected to the vacuum generator, the pressure reducing valve, and the gas tank (these three structures are not shown in the figure) in sequence through pipelines. The suction cup 17 is installed at the front end of the flange 15, and an iris mechanism is installed on the outer side of the suction cup 17. The suction claw 18 with an adjustable suction radius is installed in the iris mechanism; the structure is provided with a suction claw 18 on the suction cup 17, and the suction radius can be adjusted by the iris mechanism. In this way, the suction range of the suction cup 17 can be adjusted according to the germanium wafers of different diameters to avoid the germanium wafers being damaged due to uneven force.

[0026] Furthermore, the iris mechanism also includes a sun gear groove 19, a large gear 20, a planetary gear groove 21, a pinion 22, a wheel shaft 23, a rack 24, a suction claw 18, an L-shaped slide groove 25, and a drive motor B26. The back side of the suction cup 17 is provided with a sun gear groove 19 and three sets of planetary gear grooves 21. The large gear 20 is rotatably mounted in the sun gear groove 19. The pinion 22 is mounted on the wheel shaft 23 in the planetary gear groove 21. The pinion 22 is meshed with the large gear 20 toward the back side of the suction cup 17. The front side of the suction cup 17 is provided with an L-shaped slide groove 25, and a gear slidably mounted in the L-shaped slide groove 25. The gear 22 is meshed with a rack 24 on one side of the positive side of the suction cup 17, and a suction claw 18 is provided on the rack 24. The driving motor B26 is installed above the flange 15 and its driving end is connected to the wheel surface of the pinion 22. In this structure, the driving motor B26 can drive one of the pinions 22 to rotate, so that it drives the large gear 20 to rotate, so that the other two groups of pinions 22 can be driven to rotate synchronously, and then the pinion 22 drives the rack 24 to slide in the L-shaped slide groove 25. Because the suction claw 18 is provided on the rack 24, the suction range of the suction claw 18 on the suction cup 17 can be changed.

[0027] Furthermore, a joint B27 is provided on the outer side of the suction claw 18, and the joint B27 is connected to the joint A16 through a pipeline.

[0028] Furthermore, a vacuum suction cup 17 is provided on the material picking end of the PPU material picking robot 28 .

[0029] The working principle of the present invention is as follows: when the device is used, the germanium crystal rod is first placed between the fixed clamp seat 7 and the limit clamp seat 8, and then the XY translation module 2 is controlled to drive the translation table 9 and drive the limit clamp seat 8 to move toward the fixed clamp seat 7, thereby clamping the germanium crystal rod; then, by controlling the XY translation module 2 on the right side, the negative pressure chip taking mechanism is aligned with the end face of the germanium crystal rod and sucked, and then cutting is performed. After the cutting is completed, the drive motor A6 drives the vacuum suction cup 17 to turn upward, and then the PPU material taking robot 28 sends the germanium chip to the conveyor belt 29 through the vacuum suction cup 17 so that it can be sent to the next section for processing. It can be seen that the device can reduce labor costs through automatic control mechanisms and also speed up processing efficiency.

[0030] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer feeding device for cutting germanium wafers using a wire cutting machine (3), characterized in that: The invention comprises a workbench (1), an XY translation module (2), a fixture, a negative pressure film taking mechanism, a wire cutting machine (3), and a feeding device. The XY translation module (2) is symmetrically arranged on the left and right sides of the workbench (1). The XY translation modules (2) on the left and right sides are respectively installed with a fixture with an adjustable clamping radius and a negative pressure film taking mechanism. The wire cutting machine (3) is arranged between the fixture and the negative pressure film taking mechanism. The feeding device is arranged behind the negative pressure film taking mechanism. The negative pressure film taking mechanism also includes a vacuum suction cup (17) with an adjustable suction radius, a liftable A base (4), a vacuum suction cup (17) is installed on a rotating shaft (5) in the middle of the upper side of the base (4), and the front end of the rotating shaft (5) is connected to a drive motor A (6), and the drive motor A (6) is installed on the side of the upper end of the base (4); the feeding device also includes a PPU material picking robot (28) and a conveyor belt (29), the PPU material picking robot (28) is installed behind the negative pressure sheet picking mechanism, and the conveyor belt (29) is installed above and behind the PPU material picking robot (28) and its upper surface is parallel to the upper surface of the vacuum suction cup (17) in a horizontal state.

2. The device for taking out and feeding germanium wafers by a wire cutting machine (3) according to claim 1, characterized in that: The fixture further comprises a fixed clamp seat (7), a limiting clamp seat (8), and a translation stage (9). The fixed clamp seat (7) is fixedly mounted on the XY translation module (2) through a bolt hole structure, and the limiting clamp seat (8) is mounted on the translation stage (9) above the XY translation module (2).

3. The wafer feeding device for cutting germanium wafers by a wire cutting machine (3) according to claim 2, characterized in that: The fixed clamp seat (7) and the limiting clamp seat (8) both include a lower clamp seat (10), a limiting slide bar (11), an upper clamp seat (12), and a limiting card (13). A limiting slide bar (11) is provided on the top of the lower clamp seat (10), an upper clamp seat (12) is slidably mounted on the limiting slide bar (11), and a limiting card (13) is installed on the top of the upper clamp seat (12) for locking the slide bar so that the upper clamp seat (12) does not slide.

4. The device for taking out and feeding germanium wafers by a wire cutting machine (3) according to claim 3, characterized in that: Rubber pads (14) are provided on the inner sides of the lower clamping seat (10) and the upper clamping seat (12).

5. The wafer feeding device for cutting germanium wafers by a wire cutting machine (3) according to claim 1, characterized in that: The vacuum suction cup (17) further comprises a flange (15), a joint, a suction cup (17), an iris mechanism, and a suction claw (18). The flange (15) is mounted on the rotating shaft (5) in the middle of the upper side of the base (4). The joint A (16) is mounted on the rear end of the flange (15) and is connected to the vacuum generator, the pressure reducing valve, and the gas tank in sequence through a pipeline. The suction cup (17) is mounted on the front end of the flange (15). The iris mechanism is mounted on the outer side of the suction cup (17), and a suction claw (18) with an adjustable suction radius is mounted in the iris mechanism.

6. The wafer feeding device for cutting germanium wafers by a wire cutting machine (3) according to claim 5, characterized in that: The iris mechanism further comprises a sun gear groove (19), a large gear (20), a planetary gear groove (21), a small gear (22), a wheel shaft (23), a rack (24), a suction claw (18), an L-shaped slide groove (25), and a drive motor B (26). A sun gear groove (19) and three sets of planetary gear grooves (21) are provided on the back side of the suction cup (17). The large gear (20) is rotatably mounted in the sun gear groove (19), and the small gear (22) is mounted on the wheel shaft (23) in the planetary gear groove (21). 3), the small gear (22) is meshed with the large gear (20) on the side facing the back of the suction cup (17), an L-shaped groove (25) is provided on the positive side of the suction cup (17), a rack (24) is slidably installed in the L-shaped groove (25) and is meshed with the small gear (22) on the side facing the positive side of the suction cup (17), a suction claw (18) is provided on the rack (24), and a driving motor B (26) is installed above the flange (15) and its driving end is connected to the wheel surface of the small gear (22).

7. The wafer feeding device for cutting germanium wafers by a wire cutting machine (3) according to claim 6, characterized in that: A connector B (27) is provided on the outer side of the suction claw (18), and the connector B (27) is connected to the connector A (16) through a pipe.

8. The wafer feeding device for cutting germanium wafers by a wire cutting machine (3) according to claim 1, characterized in that: A vacuum suction cup (17) is provided on the material taking end of the PPU material taking manipulator (28).

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