Process chamber and semiconductor processing equipment

Abstract

The invention discloses a process chamber and semiconductor processing equipment, the process chamber comprises a chamber body, a coupling cylinder, a chamber top, a temperature control assembly and a sealing ring, the coupling cylinder is fixedly connected with the side wall of the chamber body, the chamber top is fixedly connected with the coupling cylinder, and the chamber body, the coupling cylinder and the chamber top define a process cavity; the temperature control assembly comprises a temperature control body and a limiting ring, at least one part of the temperature control body is arranged on the side, away from the coupling cylinder, of the top of the cavity in a stacked mode, the temperature control body is fixedly connected with the cavity body, and the limiting ring is fixed to the side, facing the top of the cavity, of the temperature control body and arranged outside the top of the cavity in a surrounding mode. The sealing ring is clamped between the inner side wall of the limiting ring and the outer side wall of the top of the cavity. In the process chamber, the risk of sealing failure basically does not exist between the temperature control assembly and the top of the chamber, so that external water vapor and impurities can be prevented from entering the process chamber to pollute the wafer.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a process chamber and semiconductor processing equipment. Background Art

[0002] Plasma etching is a common process in wafer processing and is usually carried out in specific semiconductor processing equipment. At present, semiconductor processing equipment includes a chamber top, and an air inlet can be set on the chamber top to transport process gas used to form plasma into the process chamber; at the same time, in order to prevent by-products generated during the process from adhering to the surface of the chamber top and falling off in the subsequent process to contaminate the processed wafer, a temperature control component is usually set on the outer top of the chamber top, and during the process, the chamber top is kept at a relatively high temperature.

[0003] like Figure 1 As shown, in the current semiconductor processing equipment, the temperature control component includes a heating part 411 located in the central area, and the heating part 411 is fixed to the side wall of the chamber body 100 through a plurality of cross beams 412, and a sealing ring 520 is arranged between the heating part 411 and the chamber top 310 to isolate the process chamber. Since the installation of the temperature control component and the chamber top is generally carried out under normal temperature conditions, when the temperature control component is heated to control the temperature, the temperature control component will inevitably expand due to the heat, and since the outer side of the temperature control component is fixedly connected to the process chamber, when the temperature control component expands, such as Figure 2 As shown, it will generate stress F along the radial direction and pointing to the center of the temperature control component, which will cause the heating part located in the central area of ​​the temperature control component to produce a displacement M, that is, the heating part is in an arched state relative to the top of the chamber, so that the sealing between the heating part and the top of the chamber fails due to the increase in the gap, and then the external water vapor and impurities A enter the process chamber to contaminate the wafer, which greatly reduces the yield rate of the wafer. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a process chamber and semiconductor processing equipment to solve the problem that the temperature control components and the chamber top in the current semiconductor processing equipment have a large risk of sealing failure, and then external water vapor and impurities enter the process chamber and contaminate the wafer.

[0005] In a first aspect, an embodiment of the present application discloses a chamber body, which includes a chamber body, a coupling cylinder, a chamber top, a temperature control component and a sealing ring, wherein the coupling cylinder is fixedly connected to a side wall of the chamber body, the chamber top is fixedly connected to the coupling cylinder, and the chamber body, the coupling cylinder and the chamber top form a process chamber;

[0006] The temperature control assembly includes a temperature control body and a limiting ring, at least a portion of the temperature control body is stacked on a side of the chamber top away from the coupling cylinder, and the temperature control body is fixedly connected to the chamber body, the limiting ring is fixed to a side of the temperature control body facing the chamber top, and the limiting ring is arranged around the outside of the chamber top, and the sealing ring is clamped between the inner side wall of the limiting ring and the outer side wall of the chamber top.

[0007] In a second aspect, an embodiment of the present application further discloses a semiconductor processing equipment, which includes the above-mentioned process chamber.

[0008] The present application discloses a process chamber, which includes a chamber body, a coupling cylinder, a chamber top and a temperature control component, wherein the coupling cylinder is fixed to the side wall of the chamber body, the chamber top is fixed to the coupling cylinder, and the chamber body, the coupling cylinder and the chamber top form a process chamber to provide a process environment for processed parts such as wafers.

[0009] In addition, the temperature control body in the temperature control assembly is fixed to the chamber body, and at least a portion of the temperature control body is stacked on the side of the chamber top away from the coupling tube to provide heating and temperature control for the chamber top, thereby ensuring that the heating efficiency and heating uniformity of the chamber top are relatively good. The temperature control assembly is also provided with a limit ring fixed to the temperature control body. By making the limit ring surround the outer side of the chamber top, when the temperature control assembly heats the chamber top, if the chamber top and the temperature control body expand due to heat, the limit ring can limit each other with the chamber top in the radial direction, thereby preventing the temperature control body from arching away from the chamber top.

[0010] At the same time, since a sealing ring is sandwiched between the inner side wall of the limit ring and the outer side wall of the chamber top, the sealing ring between the limit ring and the chamber top can be squeezed after the chamber top and the temperature control body expand due to heat. This can further improve the sealing reliability between the limit ring and the chamber top, prevent the process chamber from communicating with the outside world through the gap between the temperature control body and the chamber top, ensure that the process environment in the process chamber is always relatively clean, and improve the yield rate of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0012] Figure 1 It is a schematic diagram of a part of the structure of a semiconductor processing equipment in the prior art;

[0013] Figure 2 A schematic diagram of sealing failure of semiconductor processing equipment in the prior art;

[0014] Figure 3 A schematic diagram of the structure of a process chamber disclosed in an embodiment of the present application;

[0015] Figure 4 This is a schematic diagram of the structure of a fixed ring in a process chamber disclosed in an embodiment of the present application;

[0016] Figure 5 Another structural schematic diagram of a fixing ring in a process chamber disclosed in an embodiment of the present application;

[0017] Figure 6 It is a top view of part of the structure in the process chamber disclosed in the embodiment of the present application.

[0018] Reference numerals:

[0019] 100-chamber body,

[0020] 200-coupling tube, 210-tube body, 220-flange,

[0021] 310- chamber top, 311- air inlet, 312- uniform flow chamber, 320- downward convex edge, 330- air inlet pipeline,

[0022] 400-temperature control assembly, 410-temperature control body, 411-heating unit, 412-connecting beam, 430-limiting ring, 440-control unit, 450-threaded connector,

[0023] 510-seal ring, 520-seal ring, 530-seal,

[0024] 610-fixing ring, 611-first through hole, 612-second through hole, 621-first connecting piece, 622-second connecting piece,

[0025] 710-base, 720-chuck, 730-isolation ring,

[0026] 810-coupling coil, 820-inductive coil,

[0027] 900-wafer. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0030] The embodiment of the present application discloses a process chamber, which includes a chamber body 100, a coupling cylinder 200, a chamber top 310, a temperature control component 400 and a sealing ring 510. Of course, the process chamber may also include a base 710, a chuck 720, an isolation ring 730, a coupling coil 810 and an induction coil 820 and other components. Figure 3 In the example, the chuck 720 is an electrostatic chuck, the chuck 720 is supported on the base 710, and the chuck 720 is connected to a DC power supply, an RF power supply, a cooling pipeline, etc. Those skilled in the art should understand that the chuck 720 can also be a mechanical chuck or a vacuum adsorption chuck. The wafer 900 is carried on the chuck 720, the isolation ring 730 surrounds the base 710, the coupling coil 810 surrounds the coupling cylinder 200, and the coupling coil 810 is connected to the RF power supply. The induction coil 820 is arranged between the temperature control component 400 and the chamber top 310 to ensure that the electrical connection between the two is relatively stable. Figure 3 In the example, an air inlet is provided on the top of the chamber, and the air inlet can be connected to the air source through an air inlet pipeline. In order to improve the uniformity of the air intake, the air inlet can specifically be a sprinkler head.

[0031] like Figure 3 As shown, in the process chamber disclosed in the embodiment of the present application, the coupling cylinder 200 is fixed to the side wall of the chamber body 100, the chamber top 310 is fixed to the coupling cylinder 200, and the chamber top 310, the coupling cylinder 200 and the chamber body 100 form a process chamber, and the wafer 900 and other processed parts can be arranged in the process chamber to perform the corresponding process. Specifically, the chamber body 100 and the chamber top 310 can form a reliable fixed connection relationship with the coupling cylinder 200 through threaded connectors such as bolts.

[0032] Of course, in the process of assembling the process chamber, the interconnected parts can form a sealed matching relationship by setting a sealing gasket or the like. Specifically, a sealing member 530 such as a sealing gasket can be provided between the chamber body 100 and the coupling cylinder 200, and a sealing member 530 such as a sealing gasket can also be provided between the chamber top 310 and the coupling cylinder 200, so as to ensure that the chamber body 100, the coupling cylinder 200 and the chamber top 310 can form a closed process chamber. In addition, an air inlet 311 can be provided on the chamber top 310, and the shower head is connected to the air inlet 311 to ensure that the process gas can be transported into the process chamber through the air inlet 311.

[0033] In addition, the process chamber includes a temperature control component 400, which specifically includes a temperature control body 410 and a limit ring 430. The temperature control component 400 is used to provide heating and temperature control so that the chamber top 310 can be heated, thereby preventing the surface of the chamber top 310 from being adhered to by-products generated during the process, and the by-products from falling off during subsequent processes and contaminating the wafer.

[0034] In detail, in the temperature control assembly 400, the temperature control body 410 is a device that actually provides temperature control. By arranging a device with heat generation capability such as a resistance wire in the temperature control body 410, and making the temperature control body 410 as a whole formed of a heat-conducting material, it can be ensured that the temperature control body 410 has the ability to heat the chamber top 310. In addition, by making at least a portion of the temperature control body 410 stacked on the side of the chamber top 310 away from the coupling cylinder 200, the relative area between the temperature control body 410 and the chamber top 310 is large, which can ensure that the heating efficiency and heating uniformity of the chamber top 310 are relatively high; at the same time, this also makes the temperature control assembly 400 as a whole located outside the process chamber, thereby preventing the temperature control assembly 400 from having an adverse effect on the cleanliness of the process chamber.

[0035] The temperature control body 410 is fixedly connected to the chamber body 100, so that the entire temperature control assembly 400 can form a stable assembly relationship with the chamber body 100. Specifically, the temperature control body 410 can be covered on the chamber body 100, and Figure 6 As shown, threaded connectors 450 such as bolts can be used to fix the outer edge of the temperature control body 410 on the chamber body 100, thereby achieving the purpose of fixing the temperature control body 410 and the chamber body 100.

[0036] As described above, the temperature control assembly 400 includes a limiting ring 430, such as Figure 3As shown, the limit ring 430 is fixed on the side of the temperature control body 410 facing the chamber top 310, and after the temperature control component 400 and the chamber top 310 form an assembly relationship, the limit ring 430 can be arranged around the outside of the chamber top 310; and, in order to prevent the external space of the process chamber from communicating with the internal space of the process chamber through the air inlet hole 311 on the chamber top 310, the sealing ring 510 is clamped between the inner side wall of the limit ring 430 and the outer side wall of the chamber top 310, so that the temperature control body 410 and the chamber top 310 can form a relatively closed cavity, which can be used as a transfer chamber for process gases, and by connecting the spray head connected to the air inlet line 330 to the transfer chamber, the process gases in the air inlet line 330 can be mixed in the transfer chamber and then transported to the process chamber through the air inlet hole 311 on the chamber top 310.

[0037] In more detail, the temperature control body 410 is provided with an air inlet hole, one end of which can be connected to the air inlet pipe 330, and the other end of which can be connected to a spray head. By making the chamber top 310 include a flow equalizer plate, the flow equalizer plate is provided with multiple air inlet holes 311, so that a flow equalizer cavity can be formed between the flow equalizer plate and the temperature control body 410, so that the process gas sent into the flow equalizer cavity through the spray head can be mixed more evenly in the flow equalizer cavity.

[0038] In addition, in order to ensure that the uniform flow cavity formed between the temperature control body 410 and the uniform flow plate is relatively well sealed, a sealing ring 520 may be provided between the two, and the sealing ring 520 may be formed of an elastic plastic material. In addition, the induction coil 820 may also be provided between the temperature control body 410 and the uniform flow plate, and the induction coil 820 may be located outside the sealing ring 520.

[0039] Specifically, the limit ring 430 and the temperature control body 410 can be formed in a separate or integrated manner, and the inner diameter of the limit ring 430 can be determined according to actual parameters such as the outer diameter of the chamber top 310, and the parameters such as the wall thickness of the limit ring 430 can be flexibly selected according to actual needs, which is not limited herein. In addition, the temperature control component 400 may include a control unit 440, and the specific heating condition of the temperature control body 410 is controlled by the control unit 440.

[0040] The sealing ring 510 can be formed of a material with good elasticity such as rubber, and the diameter and other dimensions of the sealing ring 510 are determined by the dimensions of the radial gap between the limiting ring 430 and the chamber top 310, to ensure that the sealing ring 510 can seal the gap between the inner side wall of the limiting ring 430 and the outer side wall of the chamber top 310 after being installed between the two, thereby preventing the inside and outside of the process chamber from being connected through the air inlet 311 on the chamber top 310.

[0041] The present application discloses a process chamber, which includes a chamber body 100, a coupling cylinder 200, a chamber top 310 and a temperature control component 400, wherein the coupling cylinder 200 is fixed to the side wall of the chamber body 100, the chamber top 310 is fixed to the coupling cylinder 200, and the chamber body 100, the coupling cylinder 200 and the chamber top 310 form a process chamber to provide a process environment for processed parts such as wafers.

[0042] In addition, the temperature control body 410 in the temperature control component 400 is fixed to the chamber body 100, and at least a part of it is stacked on the side of the chamber top 310 away from the coupling cylinder 200 to provide heating and temperature control for the chamber top 310, thereby ensuring that the heating efficiency and heating uniformity of the chamber top 310 are relatively good. The temperature control component 400 is also provided with a limiting ring 430 fixed to the temperature control body 410. By making the limiting ring 430 surround the outer side of the chamber top 310, when the temperature control component 400 heats the chamber top 310, if the chamber top 310 and the temperature control body 410 expand due to heat, the limiting ring 430 can limit each other with the chamber top 310 in the radial direction, thereby preventing the temperature control body 410 from arching away from the chamber top 310.

[0043] At the same time, since a sealing ring 510 is sandwiched between the inner side wall of the limiting ring 430 and the outer side wall of the chamber top 310, when the chamber top 310 and the temperature control body 410 are heated and expanded, the sealing ring 510 between the limiting ring 430 and the chamber top 310 can be squeezed (such as Figure 3 The force F on the limit ring 430 and the chamber top 310 can further improve the sealing reliability between the limit ring 430 and the chamber top 310, prevent the process chamber from communicating with the outside world through the gap between the temperature control body 410 and the chamber top 310, ensure that the process environment in the process chamber is always relatively clean, and improve the yield rate of the wafer.

[0044] As described above, the coupling cylinder 200 can be fixed on the side wall of the chamber body 100, and the chamber top 310 can be fixed on the coupling cylinder 200, so that the three of them enclose a process chamber. Specifically, the chamber body 100 and the chamber top 310 can be connected to the coupling cylinder 200 by means of bolts and other connectors. In another embodiment of the present application, a relatively fixed relationship can be indirectly formed between the coupling cylinder 200 and the chamber top 310 by means of a fixing ring 610 to prevent the chamber top 310 from stretching the coupling cylinder when it expands due to heat, which will affect the structural strength and service life of the coupling cylinder when used for a long time.

[0045] In detail, the coupling cylinder 200 includes a cylinder body 210 and a flange 220, and the flange 220 is connected to the outer periphery of the cylinder body 210. The cylinder body 210 can be a cylinder, and the cylinder body 210 is fixedly connected to the chamber body 100, so that the entire coupling cylinder 200 can form a fixed connection relationship with the chamber body 100. Specifically, the flange 220 and the cylinder body 210 can be formed in an integral molding manner to improve the structural stability of the coupling cylinder 200.

[0046] In order to reduce the difficulty of connection between the top of the cavity and the temperature control, a lower flange 320 is provided on the side of the chamber top 310 facing the barrel body 210, and the lower flange 320 is arranged around the flange 220. In this case, the sealing ring can be clamped between the limiting ring 430 and the lower flange 320, thereby improving the installation reliability of the sealing ring.

[0047] Based on this, the process chamber may further include a fixing ring 610, such as Figure 3 As shown, the fixing ring 610 is arranged on the side of the flange 220 away from the chamber top 310, the lower flange 320 and the limiting ring 430 are both fixedly connected to the fixing ring 610, and the flange 220 is clamped between the chamber top 310 and the fixing ring 610. Specifically, the limiting ring 430 and the lower flange 320 can form a fixed connection relationship with the fixing ring 610 through a connecting piece such as a bolt or a screw, so that the lower flange 320 can form a stable fixed connection relationship with the temperature control component 400 through the fixing ring 610.

[0048] More specifically, if Figure 4 As shown, the fixing ring 610 may be provided with a plurality of fixing holes 613, each of which may be a long hole, and the plurality of fixing holes 613 are spaced apart along the circumference of the fixing ring 610, and each of the fixing holes 613 is provided with a first connector 621 and a second connector 622, so that the limiting ring 430 can form a fixed connection relationship with the fixing ring 610 through the first connector 621, and the chamber top 310 can form a fixed connection relationship with the fixing ring 610 through the second connector 622, so as to ensure that the chamber top 310 and the limiting ring 430 can form a reliable fixed connection relationship. Wherein, the first connector 621 and the second connector 622 can both be threaded connectors such as screws or bolts, so as to ensure that the two have reliable connection capabilities.

[0049] When the technical solution disclosed in this embodiment is adopted, since there is no direct connection between the chamber top 310 and the coupling cylinder 200, even if the chamber top 310 and the temperature control body 410 expand due to heat, the device directly affected is the fixing ring 610. The fixing ring 610 can expand and deform accordingly with the chamber top 310 and the temperature control body 410, so that the thermal stress will basically not act on the coupling cylinder 200, thereby ensuring that the service life of the coupling cylinder 200 is relatively long.

[0050] In addition, when the above-mentioned technical solution is adopted, since the temperature control body 410 and the fixing ring 610 form a fixed connection relationship, it is also possible to provide a limiting effect for the temperature control body 410 in the vertical direction, thereby further preventing the temperature control body 410 from arching away from the chamber top 310 due to expansion during the heating process, thereby further improving the reliability of the sealing connection relationship between the limiting ring 430 and the chamber top 310.

[0051] As described above, the limiting ring 430 and the chamber top 310 can form a fixed connection relationship with the fixing ring 610 through connecting parts such as bolts or screws. In detail, a through hole can be set on the fixing ring 610, and a through hole or threaded hole can be set at the corresponding positions of the limiting ring 430 and the chamber top 310, so that the connecting parts passing through the through hole can cooperate with the through hole or threaded hole.

[0052] Furthermore, in order to make the fixed connection between the limiting ring 430 and the chamber top 310 and the fixing ring 610 more reliable, the limiting ring 430 and the chamber top 310 can be connected to the fixing ring 610 through multiple connecting parts, and the multiple connecting parts are distributed at intervals along the circumference of the fixing ring 610.

[0053] In detail, the fixing ring 610 may be provided with a plurality of first through holes 611, and the first through holes 611 may be circular holes, and the diameters thereof may be determined according to the size of the first connecting member 621. Figure 5 As shown, a plurality of first perforations 611 are distributed at intervals along the circumference of the fixing ring 610, and the limiting ring 430 is fixedly connected to the fixing ring 610 through a plurality of first connecting members 621 that pass through each first perforation 611 in a one-to-one correspondence, so that the connection stability between the limiting ring 430 and the fixing ring 610 at any position on its own circumference is relatively high. Specifically, the number of first perforations 611 can be selected according to parameters such as the diameter of the limiting ring 430, which is not limited here. More specifically, the plurality of first perforations 611 are evenly distributed along the circumference of the fixing ring 610, thereby further improving the reliability of the fixing relationship between the limiting ring 430 and the fixing ring 610.

[0054] Correspondingly, a plurality of second perforations 612 may be provided on the fixing ring 610. The second perforations 612 may also be circular holes, and the diameter of the second perforations 612 may be determined according to the size of the second connecting member 622. Affected by the relative position between the chamber top 310 and the limiting ring 430, each second perforation 612 is located on the side of the first perforation 611 close to the center of the fixing ring 610, that is, the second perforation 612 is located on the inner side of the first perforation 611.

[0055] like Figure 5As shown, the plurality of second through-holes 612 are distributed at intervals along the circumference of the fixing ring 610, and the plurality of second through-holes 612 can be evenly distributed along the circumference of the fixing ring 610. In the process of assembling the fixing ring 610 and the chamber top 310, the stop ring 430 can be fixedly connected to the fixing ring 610 through the plurality of second connecting members 622 that pass through each second through-hole 612 one by one, so that the connection stability between the chamber top 310 and the fixing ring 610 at any position on its circumference is relatively high. Similarly, the number of second through-holes 612 can be selected according to parameters such as the diameter of the stop ring 430, which is not limited here. As described above, the chamber top 310 can also be provided with a downwardly turned convex edge 320. In this case, the second connecting member 622 can be connected to the downwardly turned convex edge 320 of the chamber top 310.

[0056] As described above, during the process of the temperature control body 410 heating the chamber top 310, both will expand due to the heat, and since the temperature control body 410 and the chamber top 310 are directly fixedly connected to the fixing ring 610, during the process of the temperature control body 410 and the chamber top 310 expanding due to the heat, Figure 3 As shown, the thermal stress F of the two will act on the fixing ring 610, causing the fixing ring 610 to deform accordingly, which will have an adverse effect on the installation stability of the chamber top 310 and the temperature control body 410.

[0057] Based on the above situation, if Figure 5 As shown, each first through hole 611 can be a long hole, and each first through hole 611 can extend along the line connecting the first connecting piece 621 penetrating the first through hole 611 and the center of the fixing ring 610. For example, if the first through hole 611 is located on the left side of the center of the fixing ring 610, and the first connecting piece 621 is arranged in the first through hole 611, the extending direction of the first through hole 611 is the left and right direction of the fixing ring 610, and the extending direction of the first through hole 611 passes through the center of the fixing ring 610. Similarly, the other first through holes 611 on the fixing ring 610 are arranged in this way, so that after the temperature control body 410 expands in its own radial direction due to heating, the temperature control body 410 can drive the multiple first connecting pieces 621 to move relative to the fixing ring 610 in the corresponding first through holes 611, thereby preventing the temperature control body 410 from expanding and applying thermal stress to the fixing ring 610, which has an adverse effect on the connection reliability between the temperature control body 410 and the fixing ring 610.

[0058] Correspondingly, each second through hole 612 is a long hole, and each second through hole 612 extends along the direction of the line connecting the second connecting piece 622 penetrating the second through hole 612 and the center of the fixing ring 610, so that when the chamber top 310 is heated and expands along its own radial direction, the chamber top 310 can drive multiple second connecting pieces 622 to move relative to the fixing ring 610 in the corresponding second through hole 612, thereby preventing the chamber top 310 from expanding due to heat and applying thermal stress to the fixing ring 610, which has an adverse effect on the connection reliability between the heating element and the fixing ring 610.

[0059] Based on the above embodiment, optionally, the number of the first through-holes 611 and the second through-holes 612 are different. In a specific embodiment of the present application, Figure 5 As shown, the number of the first perforations 611 and the second perforations 612 can be the same, and the plurality of first perforations 611 and the plurality of second perforations 612 are arranged in groups corresponding to each other, and the connecting line of the first perforations 611 and the second perforations 612 arranged in groups passes through the center of the fixing ring 610, so that when the chamber top 310 and the temperature control body 410 are heated and expand along their own radial directions, the two move in the same direction relative to the fixing ring 610, further improving the reliability of the vertical fixing relationship between the chamber top 310 and the temperature control body 410 and the fixing ring 610.

[0060] Temperature control body 410 As described above, the temperature control body 410 can be fixedly connected to the chamber body 100 by a threaded connector 450 such as a bolt. Specifically, the temperature control body 410 can be a plate-shaped structural member, and its outer edge is connected to the chamber body 100. In another embodiment of the present application, in order to reduce the weight of the temperature control body 410 and reduce the probability of damage due to thermal expansion, optionally, as Figure 6 As shown, the temperature control body 410 includes a heating part 411 and a plurality of connecting beams 412, and the plurality of connecting beams 412 are arranged at intervals along the circumference of the limit ring 430, and the first end of each connecting beam 412 is fixed to the heating part 411, and the second end of each connecting beam 412 is fixed to the chamber body 100. This allows the thermal stress generated by the expansion of the heating part 411 during the heating process to act on the plurality of connecting beams 412 arranged at intervals from each other, which makes the overall stress of the entire temperature control body 410 relatively dispersed, further preventing the temperature control body 410 from deforming such as arching relative to the chamber top 310 when expanding.

[0061] Specifically, the heating portion 411 and the plurality of connecting beams 412 can be formed by separate molding, and the first ends of the plurality of connecting beams 412 can be fixedly connected to the outer periphery of the heating portion 411 by connecting members such as bolts or screws, and the second ends of the plurality of connecting beams 412 can be fixed to the side wall of the chamber body 100 by connecting members. In another embodiment of the present application, the heating portion 411 and the plurality of connecting beams 412 can be formed by integral molding to improve the connection reliability between the heating portion 411 and the connecting beams 412, so as to further prevent the temperature control body 410 from being damaged when it expands due to heat.

[0062] More specifically, the plurality of connecting beams 412 may be straight structural members, and in the process of arranging the connecting beams 412, the connecting beams 412 may be extended along the radial direction of the limiting ring 430. Figure 3 As shown, the second end of at least one connecting beam 412 can be set higher than its first end, and the connecting beam 412 can be set obliquely. That is, the second end of at least one connecting beam 412 located on the outside is higher than the first end located on the inside, and because the second end of the connecting beam 412 is fixedly connected to the chamber body 100, when the heat on the heating part 411 is transferred to the connecting beam 412, the connecting beam 412 can generate a force pointing from the second end to the first end. Since the second end is set higher than the first end, the connecting beam 412 can produce a downward pressure effect on the heating part 411, further preventing the heating part 411 from arching away from the chamber top 310 during the thermal expansion process, ensuring that the sealing reliability between the entire temperature control body 410 and the chamber top 310 is always relatively high.

[0063] In order to further enhance the effectiveness of the thermal stress of the connecting beam 412 acting on the heating portion 411 and pressing down the heating portion 411 when heated, as described above, the second end of at least one connecting beam 412 is arranged higher than the first end thereof. Figure 3 As shown, at least one of the aforementioned connecting beams 412 can be an arc-shaped structural member, and the connecting beam 412 can protrude in the direction close to the central axis of the heating portion 411. When the connecting beam 412 adopts the aforementioned technical solution, when the first end of the connecting beam 412 applies a force to the heating portion 411, the magnitude of the component of the force in the radial direction of the limiting ring 430 can be reduced, thereby increasing the magnitude of the component of the force in the axial direction of the limiting ring 430.

[0064] Furthermore, by designing the parameters of the arc-shaped connecting beam 412, the tangent of the first end of at least one connecting beam 412 can be parallel to the axial direction of the limiting ring 430 (i.e., the direction of the central axis of the limiting ring 430), that is, the first end of the connecting beam 412 extends in the vertical direction, which can further reduce or even eliminate the radial component of the force of the connecting beam 412 acting on the heating part 411 along the limiting ring 430, so that the direction of the force of the connecting beam 412 acting on the heating part 411 is the axial direction of the limiting ring 430, that is, the vertical downward direction, so as to further enhance the effect of the downward pressure provided by the connecting beam 412 to the heating part 411 when it expands due to heat, thereby maximizing the prevention of failure of the sealing relationship between the temperature control body 410 and the top 310 of the chamber.

[0065] More specifically, the structures of the connecting beams 412 in the temperature control body 410 can be made the same. In this case, each connecting beam 412 can provide a good downward pressure effect to the heating part 411 when it expands due to heat. Moreover, since the multiple connecting beams 412 are distributed at intervals along the circumference of the limit ring 430, the sealing relationship between the limit body and the chamber top 310 at any circumferential position of the limit ring 430 is relatively stable.

[0066] As described above, a sealing ring 510 is provided between the limiting ring 430 and the chamber top 310, so that the process chamber cannot communicate with the outside of the process chamber through the air inlet 311 on the chamber top 310. In order to further improve the sealing reliability of the process chamber, Figure 3 As shown, when the temperature control body 410 includes a heating portion 411 and a plurality of connecting beams 412, a sealing ring 520 can be provided between the heating portion 411 and the chamber top 310, so that the sealing effect of the process chamber is further improved by multiple sealing. The sealing ring 520 can be formed of materials such as rubber, and the specific size of the sealing ring 520 can be determined according to the size of the gap between the temperature control body 410 and the chamber top 310.

[0067] Based on the process chamber disclosed in any of the above embodiments, an embodiment of the present application further discloses a semiconductor processing equipment, which includes any of the above process chambers.

[0068] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0069] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A process chamber, characterized in that: It includes a chamber body, a coupling cylinder, a chamber top, a temperature control component and a sealing ring, wherein the coupling cylinder is fixedly connected to the side wall of the chamber body, the chamber top is fixedly connected to the coupling cylinder, and the chamber body, the coupling cylinder and the chamber top form a process chamber; The temperature control assembly includes a temperature control body and a limiting ring, at least a portion of the temperature control body is stacked on a side of the chamber top away from the coupling cylinder, and the temperature control body is fixedly connected to the chamber body, the limiting ring is fixed to a side of the temperature control body facing the chamber top, and the limiting ring is arranged around the outside of the chamber top, and the sealing ring is clamped between the inner side wall of the limiting ring and the outer side wall of the chamber top.

2. The process chamber according to claim 1, characterized in that: The temperature control body is provided with an air inlet through hole, the top of the chamber includes a flow equalizer plate, the flow equalizer plate is provided with a plurality of air inlet holes, and a flow equalizer cavity is formed between the flow equalizer plate and the temperature control body.

3. The process chamber according to claim 2, characterized in that: A sealing ring and / or an induction coil is provided between the temperature control body and the flow equalizer plate.

4. The process chamber according to claim 1, characterized in that: The coupling cylinder comprises a cylinder body and a flange connected to the outer periphery of the cylinder body, and the cylinder body is fixedly connected to the chamber body; A downward convex edge is provided on the side of the chamber top facing the barrel body, the downward convex edge is arranged around the flange, and the sealing ring is sandwiched between the limiting ring and the downward convex edge; The process chamber includes a fixing ring, which is arranged on the side of the flange away from the chamber top, the lower flange convex edge and the limiting ring are fixedly connected to the fixing ring, and the flange is clamped between the chamber top and the fixing ring.

5. The process chamber according to claim 4, characterized in that: The fixing ring is provided with a plurality of fixing holes, and the plurality of fixing holes are spaced apart along the circumference of the fixing ring, and each of the fixing holes is provided with a first connecting member and a second connecting member, wherein the first connecting member is used for fixing the limit ring and the fixing ring, and the second connecting member is used for fixing the top of the chamber and the fixing ring.

6. The process chamber according to claim 4, characterized in that: The fixing ring is provided with a plurality of first through-holes, which are spaced apart along the circumference of the fixing ring, and each of the first through-holes is provided with a first connecting piece corresponding to each other, so as to fix the limiting ring and the fixing ring; The fixing ring is provided with a plurality of second through holes, which are spaced apart along the circumference of the fixing ring, and each of the second through holes is provided with a second connecting piece corresponding to each other to fix the chamber top and the fixing ring.

7. The process chamber according to claim 6, characterized in that: Each of the first through holes is a long hole, and each of the first through holes extends along a line connecting the first connecting member penetrating the first through hole and the center of the fixing ring; Each of the second through holes is a long hole, and each of the second through holes extends along a line connecting the second connecting member penetrating the second through hole and the center of the fixing ring.

8. The process chamber according to claim 7, characterized in that: The plurality of first through holes and the plurality of second through holes are arranged in groups in a one-to-one correspondence, and a connecting line of the first through holes and the second through holes arranged in groups passes through the center of the fixing ring.

9. The process chamber according to claim 1, characterized in that: The temperature control body includes a heating part and a plurality of connecting beams, wherein the plurality of connecting beams are arranged at intervals along the circumference of the limiting ring, the first end of each connecting beam is fixed to the heating part, and the second end of each connecting beam is fixed to the chamber body.

10. The process chamber according to claim 9, characterized in that: A sealing ring is provided between the heating portion and the top of the chamber.

11. The process chamber according to claim 9, characterized in that: The second end of at least one of the connecting beams is arranged higher than the first end thereof, and the connecting beam is arranged obliquely.

12. The process chamber according to claim 11, characterized in that: At least one of the connecting cross beams, whose second end is higher than the first end, is an arc-shaped structural member and protrudes toward a direction close to the central axis of the limiting ring.

13. The process chamber according to claim 12, characterized in that: The tangent direction of the first end of at least one of the arc-shaped connecting beams is parallel to the central axis of the limiting ring. 14 . The process chamber according to claim 9 , wherein the heating portion and the plurality of connecting beams are formed in an integrally formed manner.

15. A semiconductor processing equipment, characterized in that: The process chamber comprises the process chamber described in claims 1-14.

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