A device for deep cleaning of production boards

Abstract

The present invention provides a device for deep cleaning of production boards, the device comprising a main cleaning tank, a cleaning module, a pump and a filtering module; a nozzle assembly and an air duct assembly are arranged in the cleaning module, which can clean and dry the chemical solutions and impurities remaining on the production boards; a heating module and a cooling module are arranged in the main cleaning tank, which can accurately control the temperature of the cleaning liquid, and by adjusting the temperature, the dissolution capacity and cleaning effect of the cleaning liquid can be optimized, ensuring the optimal conditions in different cleaning stages, and realizing deep cleaning of the production boards; at the same time, setting different temperatures according to different processes for high-temperature cleaning can effectively improve the cleaning efficiency and reduce the cleaning time.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor production equipment, and in particular to a device for deep cleaning of production boards. Background Art

[0002] In the semiconductor manufacturing process, cleaning the production board after etching, electroplating and other processes are completed is a crucial step. The purpose of cleaning is to remove the residual chemicals and impurities on the production board to ensure the smooth progress of subsequent processes and the performance of the final product. The existing ordinary cleaning modules have some shortcomings in practical applications, mainly manifested as: poor cleaning effect on deep residual chemicals and impurities, and the residual chemicals or impurities that have not been thoroughly cleaned may be released in the subsequent process, causing a certain impact on the subsequent production process and reducing the product yield; the cleaning time is long, which prolongs the production cycle and reduces production efficiency. Summary of the invention

[0003] In order to solve the above-mentioned technical problems, the present application provides a device for deep cleaning of production plates, including a main cleaning tank, a cleaning module, a pump and a filtering module; the cleaning module, the pump and the filtering module are all arranged on the main cleaning tank; the pump is respectively connected with the filtering module and the main cleaning tank, and the cleaning module is respectively connected with the filtering module and the main cleaning tank to realize the circulation of the cleaning liquid; a heating module and a cooling module are arranged in the main cleaning tank to adjust the temperature of the cleaning liquid; the cleaning module includes a first cleaning tank arranged above the main cleaning tank and a second cleaning tank arranged above the first cleaning tank; a nozzle assembly is arranged in the first cleaning tank; and a duct assembly is arranged in the second cleaning tank.

[0004] In some embodiments of the present application, the nozzle assembly is divided into two groups, the two groups of nozzle assemblies are arranged opposite to each other, and the production plate is movably arranged between the two groups of nozzle assemblies.

[0005] In some embodiments of the present application, the nozzle assembly includes a plurality of nozzles spaced apart in a vertical direction; along the extension direction of the nozzle, the nozzle is provided with a plurality of nozzles spaced apart and facing the production plate.

[0006] In some embodiments of the present application, the cleaning module further includes an ultrasonic generator, and the ultrasonic generator is disposed outside the first cleaning tank; there are multiple ultrasonic generators, and the multiple ultrasonic generators are spaced apart and disposed between the nozzles.

[0007] In some embodiments of the present application, the nozzle rotates with the axis of the nozzle as the rotation center, so that the nozzle sprays within the range defined by the upper and lower ultrasonic generators.

[0008] In some embodiments of the present application, the air duct assembly is divided into two groups, and the two groups of air duct assemblies are arranged opposite to each other; the air duct assembly includes one or more air ducts arranged along the vertical direction; along the extension direction of the air duct, the air duct is provided with an air outlet facing the production board.

[0009] In some embodiments of the present application, the air outlet is in the shape of an elongated strip, and the air duct is externally connected to an air intake device.

[0010] In some embodiments of the present application, the cleaning module further includes a waterfall cleaning assembly disposed in the second cleaning tank, and the waterfall cleaning assembly is disposed below the air duct assembly.

[0011] In some embodiments of the present application, the spray ranges of two adjacent nozzles partially overlap.

[0012] In some embodiments of the present application, the waterfall cleaning assembly includes a box body and a pipe assembly; the pipe assembly is arranged in the box body, and an outlet for liquid to flow out is provided on the pipe assembly; the box body includes a bottom wall, a top wall, a first side wall and a second side wall; the second side wall is movably arranged between the top wall and the bottom wall, so that the box body forms an upper opening or a lower opening.

[0013] Compared with the prior art, the present invention has the following advantages and beneficial effects: the device for deep cleaning of production boards of the present application includes a main cleaning tank, a cleaning module, a pump and a filtering module; a nozzle assembly and an air duct assembly are provided in the cleaning module, which can clean and dry the chemical solutions and impurities remaining on the production boards; a heating module and a cooling module are provided in the main cleaning tank, which can accurately control the temperature of the cleaning liquid, and by adjusting the temperature, the dissolution capacity and cleaning effect of the cleaning liquid can be optimized to ensure the optimal conditions in different cleaning stages and realize deep cleaning of the production boards; at the same time, setting different temperatures according to different processes for high-temperature cleaning can effectively improve the cleaning efficiency and reduce the cleaning time.

[0014] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings constituting a part of this document are used to provide a further understanding of this document. The exemplary embodiments and descriptions of this document are used to explain this document and do not constitute an improper limitation on this document. In the accompanying drawings:

[0016] Figure 1 is a schematic structural diagram of a device for deep cleaning of a production plate provided by an exemplary embodiment of the present application;

[0017] Figure 2is a front view of an apparatus for deep cleaning of a production plate provided by an exemplary embodiment of the present application;

[0018] Figure 3 is a schematic diagram of an apparatus for deep cleaning of a production plate provided by an exemplary embodiment of the present application;

[0019] Figure 4 is a schematic structural diagram of a waterfall cleaning assembly provided by an exemplary embodiment of the present application;

[0020] Figure 5 is a cross-sectional view of a waterfall cleaning assembly provided by an exemplary embodiment of the present application.

[0021] In the figure:

[0022] 100, main cleaning tank; 200, cleaning module; 300, pump; 400, filtration module;

[0023] 101. Heating module; 102. Cooling module; 201. First cleaning tank; 202. Second cleaning tank; 203. Spray pipe assembly; 204. Air duct assembly; 205. Waterfall cleaning assembly; 2051. Pipe assembly; 2052. Box body; 2052a. Top wall; 2052b. Bottom wall; 2052c. First side wall; 2052d. Second side wall; 206. Ultrasonic generator. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. It should be noted that, in the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other arbitrarily.

[0025] In the semiconductor manufacturing process, cleaning the production board after etching, electroplating and other processes are completed is a crucial step. The purpose of cleaning is to remove the residual chemicals and impurities on the production board to ensure the smooth progress of subsequent processes and the performance of the final product. The existing ordinary cleaning modules have some shortcomings in practical applications, mainly manifested as: poor cleaning effect on deep residual chemicals and impurities, and the residual chemicals or impurities that have not been thoroughly cleaned may be released in the subsequent process, causing a certain impact on the subsequent production process and reducing the product yield; the cleaning time is long, which prolongs the production cycle and reduces production efficiency.

[0026] Based on this, an exemplary embodiment of the present application provides a device for deep cleaning of production boards, which includes a main cleaning tank, a cleaning module, a pump and a filtration module. The cleaning module is used to clean and dry residual chemicals and impurities on the production boards. A heating module and a cooling module are provided in the main cleaning tank, which can accurately control the temperature of the cleaning liquid. By adjusting the temperature, the dissolution capacity and cleaning effect of the cleaning liquid can be optimized to ensure the optimal conditions in different cleaning stages and achieve deep cleaning of the production boards. At the same time, setting different temperatures according to different processes for high-temperature cleaning can effectively improve the cleaning efficiency and reduce the cleaning time.

[0027] An exemplary embodiment of the present application provides a device for deep cleaning of production boards, such as Figure 1 and 2 As shown, the device includes a main cleaning tank 100, a cleaning module 200, a pump 300 and a filtering module 400; the cleaning module 200, the pump 300 and the filtering module 400 are all arranged on the main cleaning tank 100; the cleaning module 200 is used to clean and dry the chemical solution and impurities remaining on the production board, the pump 300 is connected to the filtering module 400 and the main cleaning tank 100 through pipes and valves, and the cleaning module 200 is connected to the filtering module 400 and the main cleaning tank 100 through pipes and valves to realize the circulation of the cleaning liquid and control the flow rate and pressure of the cleaning liquid. Preferably, the cleaning liquid used in this solution can be deionized water. The main cleaning tank 100 is provided with a heating module 101 and a cooling module 102. The heating module 101 can heat the cleaning liquid to increase the temperature of the cleaning liquid; the cooling module 102 can cool the cleaning liquid to reduce the temperature of the cleaning liquid. The main cleaning tank 100 is also provided with a temperature sensor for measuring the temperature of the cleaning liquid; the heating module 101 and the cooling module 102 work together to control and adjust the temperature of the cleaning liquid so that the cleaning liquid is always kept within a preset temperature range, and accurate temperature control of the cleaning liquid is achieved. By adjusting the temperature, the dissolution capacity and cleaning effect of the cleaning liquid can be optimized, ensuring the optimal conditions at different cleaning stages, and achieving deep cleaning of the production board. Exemplarily, when the temperature range is between 20°C and 80°C, the requirements for deep cleaning of the production board in most processes in the semiconductor manufacturing process can be met. In this way, according to different processes, different temperatures are set for high-temperature cleaning, which can effectively improve the cleaning efficiency and reduce the cleaning time.

[0028] In one embodiment, the cleaning module 200 includes a first cleaning tank 201 disposed above the main cleaning tank 100 and a second cleaning tank 202 disposed above the first cleaning tank 201; the first cleaning tank 201, the second cleaning tank 202, and the main cleaning tank 100 are interconnected. A nozzle assembly 203 is disposed in the first cleaning tank 201; the nozzle assembly 203 is divided into two groups, and the two groups of nozzle assemblies 203 are disposed opposite to each other, and the production board is movably disposed between the two groups of nozzle assemblies 203, so that both sides of the production board can be cleaned at the same time. Figure 3 As shown, the nozzle assembly 203 includes a plurality of nozzles arranged at intervals in the vertical direction; preferably, in the vertical direction, each nozzle is arranged at equal intervals; each nozzle is horizontally arranged in the second cleaning tank 202. Along the extension direction of the nozzle, a plurality of nozzles arranged at intervals and with nozzles facing the production board are arranged on the nozzle; preferably, the nozzles are arranged at equal intervals, and each nozzle forms a spray area with a preset range. In order to fully clean the production board, the spray ranges of two adjacent nozzles can be controlled to overlap partially by controlling the flow rate and pressure, so that the production board is cross-sprayed to improve the cleaning effect.

[0029] For example, Figure 1 As shown, the cleaning module 200 also includes an ultrasonic generator 206, which is arranged outside the first cleaning tank 201 and extends in the horizontal direction; there are multiple ultrasonic generators 206, and multiple ultrasonic generators 206 are arranged between the nozzles at intervals. In this way, the ultrasonic generator 206 arranged between each nozzle can generate high-frequency vibration, so that countless tiny bubbles are formed in the cleaning liquid in the first cleaning tank 201 and the second cleaning tank 202 and the liquid sprayed by the nozzle. The bubbles generate strong shock waves and local high pressure during the growth and rupture process, thereby effectively removing the residues and impurities on the surface of the production board and in the tiny pores, which can improve the cleaning efficiency and shorten the cleaning time. At the same time, by adjusting the frequency of the ultrasonic wave, the cleaning can be optimized for different types of residues and impurities, and the cleaning effect can be improved; by real-time monitoring of the frequency and power of the ultrasonic wave by the control unit, the stability and consistency of the cleaning process can be ensured, ensuring that each cleaning can meet the same standards and improve the product yield.

[0030] In one embodiment, a driving unit and a transmission mechanism are further provided outside the cleaning module 200. The transmission mechanism is connected to the driving unit and the nozzle to realize that the nozzle rotates with the axis of the nozzle as the rotation center, so that the nozzle sprays within the range limited by the upper and lower ultrasonic generators 206, ensuring that the cleaning liquid is sprayed evenly to every corner of the production board, thereby improving the cleaning effect; at the same time, the rotary sweeping spray can cover a larger area, reduce the time of a single spray, and speed up the cleaning speed. Under the action of the control system, the pressure of the liquid spray is adjusted to make the nozzle spray at high pressure, which can effectively remove the residues and impurities generated on the production board and further improve the cleaning effect.

[0031] An air duct assembly 204 is arranged in the second cleaning tank 202; the air duct assembly 204 is divided into two groups, and the two groups of air duct assemblies 204 are arranged opposite to each other; the air duct assembly 204 includes one or more air ducts arranged along the vertical direction; along the extension direction of the air duct, the air duct is provided with an air outlet facing the production board, preferably, the air outlet is in the shape of a long strip, and its length is greater than the width of the production board, and the air duct is externally connected to an air intake device, and compressed air can be introduced into the air duct so as to blow air to the entire surface of the production board to achieve drying of the production board.

[0032] The cleaning module 200 also includes a waterfall cleaning component 205 disposed in the second cleaning tank 202, and the waterfall cleaning component 205 is disposed below the air duct component 204. The waterfall cleaning component 205 can flush the production board with a large flow rate to achieve the purpose of removing impurities on the production board. In the solution of the present application, the air duct component 204 implements the first-level cleaning of the production board, the waterfall cleaning component 205 is located above the nozzle component 203, and implements the second-level cleaning of the production board. The nozzle component 203 implements the third-level cleaning of the production board. Through the multi-level cleaning and ultrasonic generator 206 arranged in sequence, the cleaning effect can be effectively improved.

[0033] like Figure 4 and 5As shown, the waterfall cleaning assembly 205 includes a box body 2052 and a pipe assembly 2051; the pipe assembly 2051 is arranged in the box body 2052 and extends along the length direction of the box body 2052. One end of the pipe assembly 2051 is connected to the filter module 400 so as to provide filtered cleaning liquid into the pipe assembly 2051. The pipe assembly 2051 is provided with an outlet for liquid to flow out. The box body 2052 includes a fixed bottom wall 2052b, a top wall 2052a, a first side wall 2052c, and a second side wall 2052d; the second side wall 2052d is movably arranged between the top wall 2052a and the bottom wall 2052b, so that the box body 2052 forms an upper opening or a lower opening. For example, a slide groove and a stopper are arranged on the first side wall 2052c, and the second side wall 2052d can be slidably arranged in the slide groove and form an upper opening or a lower opening under the block of the stopper. According to different process requirements, the upper opening or the lower opening can be selected. When the box body 2052 is formed as Figure 5 When the lower opening is shown, the liquid level flowing out through the tube assembly 2051 is higher than the lower opening. At this time, the liquid inside the box body 2052 is ejected from the lower opening at a certain preset pressure, which is suitable for working conditions with a higher degree of cleanliness. By adjusting the flow rate of the liquid in the tube assembly 2051, the pressure and flow rate of the liquid ejected at the lower outlet can be adjusted to achieve a stable pressure effect. When the upper opening is formed on the box body 2052, at this time, the liquid level inside the box body 2052 exceeds the upper opening, and the liquid can flow out from the upper opening. At this time, the liquid inside the box body 2052 flows out in a pressure-free state, which is suitable for conditions with a slightly lower degree of cleanliness.

[0034] Preferably, Figure 5 As shown, the box body 2052 has a bottom wall inclined downward, so that the liquid can be sprayed onto the production board at a certain inclined angle. At the same time, under the action of gravity, the flow rate of the liquid can be accelerated, and the spraying distance of the liquid can be extended to prevent the production board from being far away from the waterfall cleaning component 205 and causing inadequate cleaning.

[0035] After the electroplating, etching and other processes are completed, the production board is first washed with ordinary water, and then the production board is clamped by a clamp and assisted by a lifting mechanism to place the production board from the top of the second cleaning tank 202 into the cleaning module 200, so that the production board can be subjected to multi-level and deep cleaning by the waterfall cleaning component 205, the nozzle component 203, and the ultrasonic generator 206. At the same time, according to the different processes and requirements involved in the production board to be cleaned, the production board is kept in the cleaning module 200 for different cleaning times. After the preset time, the production board is taken out of the cleaning module 200 under the clamping of the clamp and the action of the lifting mechanism. During the rising process of the production board, the waterfall cleaning component 205, the nozzle component 203, and the ultrasonic generator 206 still clean the production board, and the air duct component 204 blows air to the production board to remove moisture from the production board and dry the production board.

[0036] In this application, the terms "comprises", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such article or device. In the absence of more restrictions, the elements defined by the sentence "comprising..." do not exclude the presence of other identical elements in the article or device comprising the elements.

[0037] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0038] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the intention of the present application also includes these modifications and variations.

Claims

1. A device for deep cleaning of production boards, characterized in that: It comprises a main cleaning tank, a cleaning module, a pump and a filtering module; the cleaning module, the pump and the filtering module are all arranged on the main cleaning tank; the pump is communicated with the filtering module and the main cleaning tank respectively, and the cleaning module is communicated with the filtering module and the main cleaning tank respectively to realize the circulation of the cleaning liquid; a heating module and a cooling module are arranged in the main cleaning tank to adjust the temperature of the cleaning liquid; the cleaning module comprises a first cleaning tank arranged above the main cleaning tank, a second cleaning tank arranged above the first cleaning tank and an ultrasonic generator arranged outside the first cleaning tank; a nozzle assembly is arranged in the first cleaning tank; an air duct assembly and a waterfall cleaning assembly are arranged in the second cleaning tank; two groups of the air duct assemblies are arranged oppositely; The nozzle assembly includes a plurality of nozzles spaced apart in a vertical direction; a driving unit and a transmission mechanism are disposed outside the cleaning module; the transmission mechanism is connected to the driving unit and the nozzle; the nozzle rotates with the axis of the nozzle as the rotation center; Along the extension direction of the nozzle pipe, the nozzle pipe is provided with a plurality of nozzles arranged at intervals and with nozzles facing the production plate; A plurality of ultrasonic generators are arranged at intervals between the nozzles.

2. The device for deep cleaning of production boards according to claim 1, characterized in that: The nozzle assemblies are divided into two groups, the two groups of nozzle assemblies are arranged opposite to each other, and the production plate is movably arranged between the two groups of nozzle assemblies.

3. The device for deep cleaning of production boards according to claim 1, characterized in that: The nozzle sprays within the range defined by the upper and lower ultrasonic generators.

4. The device for deep cleaning of production boards according to claim 1, characterized in that: The air duct assembly is divided into two groups; the air duct assembly includes one or more air ducts arranged along the vertical direction; along the extension direction of the air duct, the air duct is provided with an air outlet facing the production board.

5. The device for deep cleaning of production boards according to claim 4, characterized in that: The air outlet is in the shape of an elongated strip, and the air duct is externally connected to an air intake device.

6. The device for deep cleaning of production boards according to claim 1, characterized in that: The waterfall cleaning assembly is arranged below the air duct assembly.

7. The device for deep cleaning of production boards according to claim 1, characterized in that: The spray ranges of two adjacent nozzles partially overlap.

8. The device for deep cleaning of production boards according to claim 6, characterized in that: The waterfall cleaning assembly includes a box body and a pipe assembly; the pipe assembly is arranged in the box body, and an outlet for liquid to flow out is arranged on the pipe assembly; the box body includes a bottom wall, a top wall, a first side wall and a second side wall; the second side wall is movably arranged between the top wall and the bottom wall, so that the box body forms an upper opening or a lower opening.

Images