FPC circuit board manufacturing method

Abstract

The invention discloses an FPC circuit board manufacturing method. The FPC circuit board manufacturing method comprises the following steps of 1, cutting a copper foil substrate with a fixed size; 2, drilling a through hole, blackening a conduction line, and plating copper; 3, coating an anti-light agent, and carrying out line imaging; 4, covering a layer of protective film, and then pressing; 5, rust prevention treatment of a surface plating layer; 6, auxiliary materials are pasted on the dust removal workbench according to the requirements of customers; seventhly, the positioning hole is punched into a through hole through optical positioning separation, and follow-up appearance punching is facilitated; and 8, carrying out shape punch forming, and inspecting to obtain a finished product. The invention belongs to the technical field of FPC (flexible printed circuit) board manufacturing, and particularly relates to an FPC board manufacturing method which is characterized in that an artificial hand penetrates through an elastic band from an isolation oversleeve for operation, a dust isolation plate is arranged to reduce entering of dust, an electrostatic adsorption sticker is arranged to adsorb dust, and for non-successful adsorption, the dust is blown to the direction of an adhesive sticker through a fan, so that the dust is prevented from falling off. And finally, the dust is adhered to the non-setting adhesive, so that the effect of reducing the influence of dust on production is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of FPC circuit board manufacturing, and in particular relates to a method for manufacturing an FPC circuit board. Background Art

[0002] Flexible circuit boards are printed circuits made of flexible insulating substrates. Flexible circuits provide excellent electrical properties, can meet the design needs of smaller and higher density installations, and also help reduce assembly processes and enhance reliability. They can be bent, wound, and folded freely, and can withstand millions of dynamic bends without damaging the wires. Flexible circuit boards are mainly used in the connection parts of electronic products. Compared with hard boards, they are smaller in size, lighter in weight, and can be bent and flexed.

[0003] With the explosive growth of wearable devices, flexible displays and smart devices, the demand for flexible circuit boards has increased significantly. In the context of electronic products pursuing light, thin, short and small designs, ultra-thin and stretchable flexible circuit boards contain huge opportunities and promote the further development of related equipment. FPC circuit boards need to go through multiple processes during the production process.

[0004] Among them, during the production process of FPC circuit boards, the surface dust needs to be cleaned and manual patching is also required. Manual dust cleaning is inefficient and easily brings dust, affecting operation and product quality. Summary of the invention

[0005] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the present invention is to provide a device and method for treating the dust generated in the production process of FPC circuit boards, as well as the problem that the dust caused by artificial shoes affects the operation and product quality.

[0006] The technical solution adopted by the present invention is as follows: A method for manufacturing an FPC circuit board comprises the following steps:

[0007] Step 1: Fix the copper foil raw material on the cutting machine roller. During the feeding process of the copper foil material, it is cut into copper foil substrates of fixed size by the cutting knife;

[0008] Step 2: Drill through holes for circuit connection to facilitate subsequent blackening of the conductive circuit and subsequent copper plating;

[0009] Step 3: Apply light-resistance agent and perform circuit imaging;

[0010] Step 4: Cover the copper foil circuit with a layer of protective film and then press it to prevent the circuit from oxidation or short circuit;

[0011] Step 5: The exposed part of the FPC conductor needs to be treated with surface coating to prevent rust;

[0012] Step 6: Paste the auxiliary materials on the dust removal workbench according to customer requirements;

[0013] Step 7: Use optical positioning to punch the positioning hole into a through hole to facilitate subsequent shape punching;

[0014] Step 8: The shape is stamped and the finished product is obtained after inspection.

[0015] Furthermore, the circuit imaging includes exposure, development and etching, and is formed on a copper foil substrate using a photoresist method, and the circuit is transferred to a dry film using UV light, and the unreacted dry film is removed with an alkaline solution. The reacted dry film forms a molecular structure that is insoluble in the alkaline solution, and the copper foil not protected by the dry film is removed with an etching solution.

[0016] Furthermore, the surface coating anti-rust treatment adopts one of gold plating, tin spraying, tin-lead electroplating, pure tin electroplating and tin plating.

[0017] Furthermore, the dust removal workbench includes a workbench, a dust isolation component and a dust recovery component, the dust isolation component and the dust recovery component are respectively arranged on the workbench, the dust isolation component includes a dust isolation plate, and the dust isolation plate is provided with an isolation sleeve, the dust recovery component includes an electrostatic adsorption sticker, a fan and a self-adhesive sticker, the electrostatic adsorption sticker is laid on the workbench, and the fan and the self-adhesive sticker are respectively arranged on the two side walls of the workbench.

[0018] Furthermore, an observation window is provided on the dust isolation plate.

[0019] Furthermore, the isolation sleeve is provided with an elastic band.

[0020] Furthermore, a protective grille is provided on the outer side of the fan.

[0021] After adopting the above technical solution, the beneficial effects of the present invention are as follows:

[0022] The operation is performed by passing the artificial hand through the isolation sleeve through the elastic band, and a dust isolation plate is set to reduce the entry of dust. The dust is adsorbed by an electrostatic adsorption sticker. For dust that is not successfully adsorbed, the fan is used to blow the dust in the direction of the sticker, and finally the dust is adhered to the sticker to achieve the effect of reducing the impact of dust on production. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A flow chart of a method for manufacturing an FPC circuit board proposed by the present invention;

[0024] Figure 2 This is a schematic diagram of the overall structure of a dust removal workbench used in a method for manufacturing an FPC circuit board proposed by the present invention;

[0025] Figure 3This is a structural schematic diagram from another angle of a dust removal workbench used in the FPC circuit board manufacturing method proposed by the present invention.

[0026] Figure 4 A cross-sectional view of a dust removal workbench used in a method for manufacturing an FPC circuit board proposed by the present invention;

[0027] Figure 5 for Figure 4 A partial enlarged view of part A.

[0028] Among them, 1. workbench, 2. dust isolation component, 3. dust recovery component, 4. dust isolation plate, 5. isolation sleeve, 6. observation window, 7. elastic band, 8. electrostatic adsorption sticker, 9. fan, 10. sticker, 11. protective grille.

[0029] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] Embodiment 1:

[0032] A method for manufacturing an FPC circuit board comprises the following steps:

[0033] Step 1: Fix the copper foil raw material on the cutting machine roller. During the feeding process of the copper foil material, it is cut into copper foil substrates of fixed size by the cutting knife;

[0034] Step 2: Drill through holes for circuit connection to facilitate subsequent blackening of the conductive circuit and subsequent copper plating;

[0035] Step 3: Apply light-resist agent and perform circuit imaging. Circuit imaging includes exposure, development and etching. Use photoresist to form on the copper foil substrate. Use UV light to transfer the circuit to the dry film. Use alkaline solution to remove the unreacted dry film. The reacted dry film forms a molecular structure that is insoluble in alkaline solution. Use etching solution to remove the copper foil not protected by the dry film.

[0036] Step 4: Cover the copper foil circuit with a layer of protective film and then press it to prevent the circuit from oxidation or short circuit;

[0037] Step 5: The exposed part of the FPC conductor needs to be treated with surface coating for rust prevention. The surface coating for rust prevention is treated with one of gold plating, tin spraying, tin-lead electroplating, pure tin electroplating and tin plating.

[0038] Step 6: Paste the auxiliary materials on the dust removal workbench according to customer requirements;

[0039] Step 7: Use optical positioning to punch the positioning hole into a through hole to facilitate subsequent shape punching;

[0040] Step 8: The shape is stamped and the finished product is obtained after inspection.

[0041] In order to reduce the impact of dust on preparation, the dust removal workbench includes a workbench 1, a dust isolation component 2 and a dust recovery component 3. The dust isolation component 2 and the dust recovery component 3 are respectively arranged on the workbench 1. The dust isolation component 2 includes a dust isolation plate 4. The dust isolation plate 4 is provided with an isolation sleeve 5, which can further isolate the dust brought by the employees. The dust recovery component 3 includes an electrostatic adsorption sticker 8, a fan 9 and a self-adhesive sticker 10. The electrostatic adsorption sticker 8 is laid on the workbench 1. The fan 9 and the self-adhesive sticker 10 are respectively arranged on the two side walls of the workbench 1, which can adsorb the dust already on the production line. For the convenience of observation, an observation window 6 is provided on the dust isolation plate 4. In order to further isolate the dust, an elastic band 7 is provided on the isolation sleeve 5, and a protective grille 11 is provided on the outside of the fan 9.

[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0044] The present invention and its implementation methods are described above, and such description is not restrictive, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design structures and embodiments similar to the technical solution without creativity, which should all fall within the protection scope of the present invention.

Claims

1. A method for manufacturing an FPC circuit board, characterized in that: The steps include: Step 1: Fix the copper foil raw material on the cutting machine roller. During the feeding process of the copper foil material, it is cut into copper foil substrates of fixed size by the cutting knife; Step 2: Drill through holes for circuit connection to facilitate subsequent blackening of the conductive circuit and subsequent copper plating; Step 3: Apply light-resistance agent and perform circuit imaging; Step 4: Cover the copper foil circuit with a layer of protective film and then press it to prevent the circuit from oxidation or short circuit; Step 5: The exposed part of the FPC conductor needs to be treated with surface coating to prevent rust; Step 6: Paste the auxiliary materials on the dust removal workbench according to customer requirements; Step 7: Use optical positioning to punch the positioning hole into a through hole to facilitate subsequent shape punching; Step 8: The shape is stamped and the finished product is obtained after inspection.

2. A method for manufacturing an FPC circuit board according to claim 1, characterized in that: The circuit imaging includes exposure, development and etching. It is formed on a copper foil substrate using a photoresist method, and the circuit is transferred to a dry film using UV light. The unreacted dry film is removed with an alkaline solution, and the reacted dry film forms a molecular structure that is insoluble in the alkaline solution. The copper foil not protected by the dry film is removed with an etching solution.

3. A method for manufacturing an FPC circuit board according to claim 1, characterized in that: The surface coating anti-rust treatment adopts one of gold plating, tin spraying, tin-lead electroplating, pure tin electroplating and tin plating.

4. The dust removal workbench used in the FPC circuit board manufacturing method according to claim 1, characterized in that: It includes a workbench, a dust isolation component and a dust recovery component, the dust isolation component and the dust recovery component are respectively arranged on the workbench, the dust isolation component includes a dust isolation plate, the dust isolation plate is provided with an isolation sleeve, the dust recovery component includes an electrostatic adsorption sticker, a fan and a self-adhesive sticker, the electrostatic adsorption sticker is laid on the workbench, and the fan and the self-adhesive sticker are respectively arranged on the two side walls of the workbench.

5. The dust removal workbench used in the FPC circuit board manufacturing method according to claim 4, characterized in that: The dust isolation plate is provided with an observation window.

6. The dust removal workbench used in the FPC circuit board manufacturing method according to claim 4, characterized in that: An elastic band is arranged on the isolation sleeve.

7. The dust removal workbench used in the FPC circuit board manufacturing method according to claim 5, characterized in that: A protective grille is arranged on the outside of the fan.

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