Batch type packaging method of LED lamp and LED lamp
By adopting the flip process in the packaging process of LED lamps, the diffusion powder layer and the phosphor layer are bonded and baked at a specific temperature to form a reflective wall, the problems of complex process and time-consuming cutting in the prior art are solved, and the problem of "complexity in the process" and time-consuming cutting is realized. Efficient and convenient LED light packaging and optical performance improvement.
Patent Information
- Application Number
- CN202411411042.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-01-14
AI Technical Summary
The batch packaging method of existing LED lamps is complex in technology and time-consuming and laborious in cutting, making it difficult to achieve efficient and convenient production.
The diffusion powder layer and phosphor layer are bonded respectively under the environment of 95℃-105℃ and 140℃-160℃, and baked at 140℃-160℃, filled with non-transparent glue to form a reflective wall, realizing the flip LED process , no substrate installation and cutting is required, only the cured colloid is required.
The packaging process of LED lamps is simplified, time-saving and labor-saving, improving cutting efficiency, ensuring the optical performance and uniformity of LED lamps, and reducing the complexity of substrate cutting.
Smart Images
Figure CN119317256A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of LED lamps, and in particular to a batch packaging method of LED lamps and LED lamps. Background Art
[0002] LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Generally speaking, the tube core of discrete devices is sealed in the package body, and the main function of the package is to protect the tube core and complete the electrical interconnection. LED packaging is to complete the output of electrical signals, protect the normal operation of the tube core, and output visible light. It has both electrical and optical parameter design and technical requirements.
[0003] At present, LED packaging technology generally uses ceramic substrates and brackets for packaging. For example, multiple LED lamps are first welded on the substrate, and then non-transparent white glue, phosphor layer, diffusion powder layer are laid in sequence, and then baked. Such a process is relatively complicated, and when cutting the substrate, due to its high hardness, the cutting operation is time-consuming and laborious. Summary of the invention
[0004] The purpose of the present invention is to improve the problem that the existing batch packaging method of LED lamps has a relatively complicated process flow and the cutting operation is time-consuming and labor-intensive, and to provide a batch packaging method of LED lamps.
[0005] The technical solutions to achieve the above objectives include the following:
[0006] The batch packaging method of LED lamps comprises the following steps:
[0007] In an environment of 95℃-105℃, the diffusion powder layer is bonded to the support plate so that the support plate has a first finished surface, and glue is applied on the first finished surface.
[0008] In an environment of 140° C.-160° C., bonding the phosphor layer to the first finished surface, forming a second finished surface on the phosphor layer, and baking in the environment of 140° C.-160° C. for 5.5 to 6.5 hours;
[0009] Bonding a plurality of LED chips on the second finished surface, with a gap between two adjacent LED chips, and baking them at 140° C. to 160° C. for 3.5 to 4.5 hours;
[0010] The gap is filled with non-transparent white glue, which contacts the side wall of the LED chip. After the non-transparent white glue is cured, a reflective wall is formed, and the packaging operation of multiple LED lamps is completed.
[0011] In one embodiment, the diffusion powder layer includes a mixture of a plurality of granular structures and a transparent adhesive, and the plurality of granular structures and the transparent adhesive are uniformly mixed;
[0012] The granular structure is silicon dioxide, and the volume ratio of silicon dioxide to transparent glue is 2.5:16 to 3.5:18.
[0013] In one embodiment, the volume ratio of the silicon dioxide to the transparent adhesive is 3:17.
[0014] In one embodiment, before bonding the diffusion powder layer to the support plate, a double-sided pyrolytic film is coated on the support plate.
[0015] In one embodiment, after the packaging operation of the plurality of LED lamps is completed, the plurality of LED lamps are baked at 180° C. to 200° C. for 12 seconds to 18 seconds to separate the plurality of LED lamps from the support plate.
[0016] In one embodiment, after the plurality of LED lamps are separated from the support plate, a photoelectric test is performed on the plurality of LED lamps;
[0017] After the photoelectric test is passed, the plurality of LED lamps are cut at the gap to obtain a single LED lamp.
[0018] In one embodiment, the bonding operation is performed under vacuum conditions.
[0019] In one embodiment, the phosphor layer includes a mixture of phosphor and transparent glue.
[0020] The present invention further provides an LED lamp, comprising a diffusion powder layer, a fluorescent powder layer, an LED chip, and two sets of reflective walls, wherein the two sets of reflective walls are respectively attached to the two side walls of the LED chip, and the upper end surface of the reflective wall and the upper end surface of the LED chip are arranged on the same plane;
[0021] The fluorescent powder layer and the diffusion powder layer are sequentially laid on the upper end surface of the LED chip and cover the upper end surface of the LED chip.
[0022] In one embodiment, the width of the phosphor layer is equal to that of the diffusion powder layer, and the width of the phosphor layer or the diffusion powder layer is equal to the sum of the widths of the two sets of reflection walls and the LED chip.
[0023] The technical solution provided by the present invention has the following advantages and effects:
[0024] In the packaging process of the LED lamp, a diffusion powder layer and a fluorescent powder layer are laid first, and then the LED chip and reflective white glue are laid to realize the flip-chip LED process. In the flip-chip process, there is no need to install the LED chip on the substrate, and there is no need to cut the substrate. When cutting multiple LED lamps 100, only the solidified colloid needs to be cut, making the cutting process time-saving and labor-saving and more convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The accompanying drawings herein show specific examples of the technical solutions described in the present invention, and together with the specific implementation methods, constitute a part of the specification, and are used to explain the technical solutions, principles and effects of the present invention.
[0026] Unless otherwise specified or defined, the same reference numerals in different drawings represent the same or similar technical features, and the same or similar technical features may also be represented by different reference numerals.
[0027] Figure 1 FIG. 1 is a schematic diagram of a batch packaging method for LED lamps in one embodiment of the present invention. Figure 1 ;
[0028] Figure 2 FIG. 1 is a schematic diagram of a batch packaging method for LED lamps in one embodiment of the present invention. Figure 2 ;
[0029] Figure 3 is a schematic diagram of the structure of an LED lamp in one embodiment of the present invention;
[0030] Description of reference numerals:
[0031] 100. LED lamp; 1. LED chip; 2. Reflection wall; 3. Phosphor layer; 4. Diffusing powder layer; 10. Center test point; 20. Surrounding test points. DETAILED DESCRIPTION
[0032] In order to facilitate the understanding of the present invention, specific embodiments of the present invention will be described in more detail below with reference to the accompanying drawings.
[0033] Unless otherwise specified or defined, the "first, second..." used in this article is merely used to distinguish names and does not represent a specific quantity or order.
[0034] Unless specifically stated or defined otherwise, the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0035] It should be noted that when a component is considered to be "fixed to" another component, it can be directly fixed to the other component or there can be a central component; when an component is considered to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time; when an component is considered to be "installed on" another component, it can be directly installed on the other component or there can be a central component at the same time. When an component is considered to be "set on" another component, it can be directly set on the other component or there can be a central component at the same time.
[0036] The present invention proposes a batch packaging method of LED lamps 100, such as Figure 3 As shown, the following steps are included:
[0037] Step 1: In an environment of 95°C-105°C, adhere the diffusion powder layer 4 to the support plate so that the support plate has a first finished surface, and apply glue on the first finished surface.
[0038] Step 2: in an environment of 140° C.-160° C., bonding the phosphor layer 3 to the first finished surface, forming a second finished surface on the phosphor layer 3, and baking in an environment of 140° C.-160° C. for 5.5 to 6.5 hours;
[0039] Step 3: bonding a plurality of LED chips 1 on the second finished surface, with a gap between two adjacent LED chips 1, and baking at 140° C. to 160° C. for 3.5 to 4.5 hours;
[0040] Step 4: Fill the gap with non-transparent white glue, so that the non-transparent white glue contacts the side wall of the LED chip 1 . After the non-transparent white glue is cured, a reflective wall 2 is formed, and the packaging operation of multiple LED lamps 100 is completed.
[0041] Specifically, the packaging method is for packaging LED lamps 100 without substrates. Since the LED lamps 100 belong to the later process steps, during the entire packaging process, the side walls of the LED chip 1 can be used as a limiting part, so that the non-transparent white glue can be filled between the two LED chips 1. The non-transparent white glue forms a reflective wall 2 after solidification. The reflective wall 2 is used to reflect the light of the LED chip 1, to prevent the light of the LED chip 1 from being absorbed, to prevent the light loss of the LED chip 1, and to diffuse the light of the LED chip 1 toward the phosphor layer 3 and the diffusion powder layer 4. Moreover, after the packaging is completed, the diffusion powder layer 4 can be separated from the support plate so that the support plate can be reused. In this process, it is only necessary to process in sequence according to the above steps, thereby simplifying the process flow. Since the LED chip 1 is used as the limiting part, the height of the reflective wall 2 is completely based on the height of the LED chip 1, and the phosphor layer 3 and the diffusion powder layer 4 are both paved in a through manner. After cutting multiple LED chips 1, the uniformity of the finished surface of each LED chip 1 remains consistent.
[0042] In addition, in the packaging process of the LED lamp 100, the diffusion powder layer 4 and the fluorescent powder layer 3 are laid first, and then the LED chip 1 and the reflective white glue are laid to realize the flip-chip LED process. In the flip-chip process, there is no need to install the LED chip 1 on the substrate, and there is no need to cut the substrate. When cutting multiple LED lamps 100, only the solidified colloid needs to be cut, making the cutting process time-saving and labor-saving and more convenient.
[0043] In some embodiments, the diffusion powder layer 4 includes a mixture of multiple granular structures and transparent glue, and the multiple granular structures are uniformly mixed with the transparent glue; specifically, the main function of the diffusion powder layer 4 is to increase the scattering and transmission of light, cover the light source and the dazzling light source, and make the light softer, more beautiful and elegant. It can effectively improve the effect of LED lighting and provide a more comfortable visual experience. The granular structure is silicon dioxide, and the volume ratio of silicon dioxide to transparent glue is 2.5:16 to 3.5:18; specifically, silicon dioxide is a transparent structure, and the particle size of the granular silicon dioxide is small, which can provide a more delicate light scattering effect, but may reduce the transmittance; the light diffusion powder with a larger particle size has a relatively coarse scattering effect, but the transmittance may be higher. Therefore, the proportion of silicon dioxide in the diffusion powder will affect the diffusion and transmittance of light.
[0044] In some embodiments, the volume ratio of silicon dioxide to transparent glue is 3:17. Specifically, in terms of the performance parameters of the LED lamp 100, the lumen and uniformity of the LED lamp 100 are relatively important parameter values. The volume ratio of silicon dioxide to transparent glue is 3:17, and it can be deduced that the proportion of silicon dioxide to the total volume of the diffusion powder is 15%; the proportion of 15% is derived based on the lumen and uniformity values of the LED lamp 100.
[0045] Specifically, Figure 1 As shown, when the proportion of silica in the diffusion powder is adjusted from 14% to 15%, the lumen decreases by 0.56%, and when the proportion of silica in the diffusion powder is adjusted from 15% to 16%, the lumen decreases by 2.25%. It can be seen that when the proportion of silica is adjusted from 15% to 16%, the lumen decreases significantly. Without considering the uniformity, the smaller the proportion of silica, the greater the lumen value of the diffusion powder layer 4.
[0046] In the experiment of uniformity of LED lamp 100, nine test points were used to test the uniformity of LED lamp 100 according to the proportion of silicon dioxide of 14%, 15%, and 16%. The uniformity value of each test point is the illuminance measured at the point at a distance of 1m from the light source under the illuminance meter CL-200A; Figure 2 As shown, in this test, there is a central test point 10 and eight peripheral test points 20. The light source is placed on the central test point 10, and then the value of each test point is counted.
[0047] Then, three groups of tests were conducted for each silica percentage, and the uniformity of each point was the percentage of the uniformity of the center point. Then the average value of each ratio was obtained, and the values were referred to the following test table 1. Table 1 shows the three groups of test values for silica percentages of 14%, 15%, and 16%.
[0048]
[0049]
[0050] Table 1
[0051] Referring to the test value of 14% silica, when the central illumination is 12.2, the central uniformity value is 100%; the test value of 15% silica, when the central illumination is 11.8, the central uniformity value is 100%; the test value of 16% silica, when the central illumination is 10.1, the central uniformity value is 100%. It can be seen that the smaller the silica proportion value, the smaller the average uniformity of the diffuse powder layer 4, and the greater the average central illumination value; and the larger the silica proportion value, the greater the average uniformity of the diffuse powder layer 4, and the smaller the average central illumination value.
[0052] By referring to the following Table 2, Table 2 shows the uniformity and center illumination average of 14%, 15%, and 16%.
[0053] Silica content Uniformity (mean) Center illumination (mean) 14％ 40.34％ 12.2 15％ 45.88％ 11.8 16％ 46.78％ 10.1
[0054] Table 2
[0055] The following conclusions were drawn from the above test data and lumen illumination test: When the proportion of silica was adjusted from 14% to 15%, the uniformity increased by 5.5%, and when the proportion of silica was adjusted from 15% to 16%, the uniformity increased by 0.9%; when the proportion of silica was adjusted from 14% to 15%, the central illumination decreased by 0.3, and when the proportion of silica was adjusted from 15% to 16%, the central illumination decreased by 1.7. Figure 1 From the perspective of lumen illumination, when the proportion of diffusion powder is adjusted from 15% to 16%, the lumen value decreases significantly. The lumen value represents the physical unit of luminous flux. The larger the value, the brighter the LED lamp. Therefore, the illumination and uniformity are significantly improved with a 15% silica proportion, and the brightness decreases less.
[0056] In some embodiments, before the diffusion powder layer 4 is bonded to the support plate, a double-sided pyrolytic film is applied to the support plate. Specifically, the application of the pyrolytic film can bring multiple benefits during the demoulding process. First, it can reduce friction, making the product smoother during demoulding and reducing mold wear. Secondly, the pyrolytic film can improve the demoulding effect, reduce the demoulding force, and reduce the risk of mold damage. Finally, it can also extend the service life of the mold, protect the mold surface, and reduce friction and wear. The role of the pyrolytic film in demoulding is to eliminate its adhesive force by heating, thereby easily peeling off the material on the mold. The pyrolytic film is a special film that has adhesive force at room temperature, but the adhesive force disappears as long as it is heated, so that the film can be easily peeled off from the mold. This feature is particularly important in the manufacturing process of electronic components because it can realize automated operation, simplify the process, and save manpower.
[0057] Preferably, after the packaging operation of the multiple LED lamps 100 is completed, the multiple LED lamps 100 are baked at 180°C to 200°C for 12s to 18s to perform a pyrolysis operation on the multiple LED lamps 100. After the pyrolysis operation is completed, the multiple LED lamps 100 are separated from the support plate. Specifically, the multiple LED lamps 100 are baked at 190°C for 15s, so that the double-sided pyrolysis film between the support plate and the diffusion powder layer 4 is pyrolyzed and foamed, and loses its viscosity, thereby causing the product to fall off the iron plate; moreover, the pyrolysis temperature of the double-sided pyrolysis film is higher than the temperature of the packaging process, so as to avoid the pyrolysis effect of the double-sided pyrolysis film during the packaging process, and to avoid the support plate and the diffusion powder layer 4 from falling off prematurely.
[0058] Preferably, after the multiple LED lamps 100 are separated from the support plate, a photoelectric test is performed on the multiple LED lamps 100; after the photoelectric test is qualified, the multiple LED lamps 100 are cut at the gaps to obtain a single LED lamp 100.
[0059] In some embodiments, the bonding operation is performed under vacuum conditions. The reasons for vacuum processing in the LED packaging process mainly include reducing pollution, improving welding quality and controlling the reaction process. First, the vacuum environment can minimize the falling of particles such as dust, which is for the smaller the line width of the LED chip 1, the more likely the particles will cause failure defects. In the LED packaging process, it is very important to keep the environment clean, because any tiny particles may affect the performance and life of the LED. Secondly, the vacuum environment can improve the welding quality. In a vacuum state, the temperature control of the welding area is more precise, avoiding component damage caused by overheating. In addition, the vacuum environment can effectively avoid oxidation, pollution and other problems, and ensure the quality of welding. Finally, the vacuum environment is conducive to controlling the reaction process. In the LED packaging process, many chemical reactions such as etching and coating need to be carried out in a vacuum environment to reduce the impact of substances in the environment on the reaction, thereby improving the quality and controllability of the reaction.
[0060] Preferably, the phosphor layer 3 includes a mixture of phosphor and transparent glue. The application of phosphor in LED is mainly reflected in the following aspects: light color conversion and light mixing: phosphor is used in a single LED chip 1, and light color conversion and light mixing are performed by combining with different types of fluorescent materials. This is a convenient and cost-effective method to achieve white light LED. In addition, the performance parameters of phosphor such as luminous efficiency, color temperature and color coordinates directly affect the overall performance of LED. Extending the life of LED: Highly stable phosphor can extend the service life of LED and reduce maintenance costs. The synthesis method of phosphor and the optimization of performance parameters are of great significance to improving the performance of LED lighting technology.
[0061] The present invention also provides an LED lamp 100, such as Figure 3 As shown, it includes a diffusion powder layer 4, a phosphor layer 3, an LED chip 1, and two sets of reflection walls 2. The two sets of reflection walls 2 are respectively attached to the two side walls of the LED chip 1, and the upper end surface of the reflection wall 2 and the upper end surface of the LED chip 1 are arranged on the same plane; the phosphor layer 3 and the diffusion powder layer 4 are sequentially laid on the upper end surface of the LED chip 1 and cover the upper end surface of the LED chip 1. Specifically, the reflection wall 2 is arranged on both sides of the LED chip 1, the LED chip 1 is used to emit light after conducting electricity, and the reflection wall 2 is used to reflect light, so that the light generated by the LED chip 1 is emitted toward the phosphor dust and the diffusion powder layer 4 in sequence.
[0062] Preferably, the width of the phosphor layer 3 is equal to that of the diffusion powder layer 4, and the width of the phosphor layer 3 or the diffusion powder layer 4 is equal to the sum of the widths of the two sets of reflection walls 2 and the LED chip 1. Specifically, the phosphor layer 3 and the diffusion powder layer 4 completely cover the LED chip 1 and the two sets of reflection walls 2, so that the light generated by the LED chip 1 is directly reflected toward the phosphor layer 3 or the diffusion powder layer 4 after being reflected by the reflection wall 2, further improving the brightness and uniformity of the light of the LED lamp 100.
[0063] When quoting drawing descriptions, new features that appear are described; in order to avoid repeated quotations of drawings resulting in less concise descriptions, features that have been described clearly will not be quoted in the drawings one by one.
[0064] The purpose of the above embodiments is to exemplarily reproduce and deduce the technical solution of the present invention, and to fully describe the technical solution, purpose and effect of the present invention. Its purpose is to make the public understand the disclosed content of the present invention more thoroughly and comprehensively, and it does not limit the scope of protection of the present invention.
[0065] The above embodiments are not exhaustive enumerations of the present invention, and there may be multiple other implementations not listed. Any replacement and improvement made without violating the concept of the present invention shall fall within the protection scope of the present invention.
Claims
1. A batch packaging method for LED lamps, characterized in that: The following steps are involved: In an environment of 95℃-105℃, the diffusion powder layer is bonded to the support plate so that the support plate has a first finished surface, and glue is applied on the first finished surface. In an environment of 140° C.-160° C., bonding the phosphor layer to the first finished surface, forming a second finished surface on the phosphor layer, and baking in the environment of 140° C.-160° C. for 5.5 to 6.5 hours; Bonding a plurality of LED chips on the second finished surface, with a gap between two adjacent LED chips, and baking them at 140° C. to 160° C. for 3.5 to 4.5 hours; The gap is filled with non-transparent white glue, which contacts the side wall of the LED chip. After the non-transparent white glue is cured, a reflective wall is formed, and the packaging operation of multiple LED lamps is completed.
2. The batch packaging method of LED lamps according to claim 1, characterized in that: The diffusion powder layer includes a mixture of a plurality of granular structures and transparent glue, and the plurality of granular structures and the transparent glue are uniformly mixed; The granular structure is silicon dioxide, and the volume ratio of silicon dioxide to transparent glue is 2.5:16 to 3.5:
18.
3. The batch packaging method of LED lamps according to claim 2, characterized in that: The volume ratio of the silicon dioxide to the transparent adhesive is 3:
17.
4. The batch packaging method of LED lamps according to claim 1, characterized in that: Before bonding the diffusion powder layer to the support plate, a double-sided pyrolytic film is coated on the support plate.
5. The batch packaging method of LED lamps according to claim 4, characterized in that: After the packaging operation of the plurality of LED lamps is completed, the plurality of LED lamps are baked at 180° C. to 200° C. for 12 seconds to 18 seconds to separate the plurality of LED lamps from the support plate.
6. The batch packaging method of LED lamps according to claim 5, characterized in that: After the plurality of LED lamps are separated from the support plate, performing a photoelectric test on the plurality of LED lamps; After the photoelectric test is passed, the plurality of LED lamps are cut at the gap to obtain a single LED lamp.
7. The batch packaging method of LED lamps according to any one of claims 1 to 6, characterized in that: The bonding operation is performed under vacuum conditions.
8. The batch packaging method of LED lamps according to any one of claims 1 to 6, characterized in that: The fluorescent powder layer includes a mixture of fluorescent powder and transparent glue.
9. LED lamp, characterized in that, It comprises a diffusion powder layer, a fluorescent powder layer, an LED chip, and two sets of reflective walls, wherein the two sets of reflective walls are respectively attached to the two side walls of the LED chip, and the upper end surface of the reflective wall and the upper end surface of the LED chip are arranged on the same plane; The fluorescent powder layer and the diffusion powder layer are sequentially laid on the upper end surface of the LED chip and cover the upper end surface of the LED chip.
10. The LED lamp according to claim 9, characterized in that: The width of the fluorescent powder layer is equal to that of the diffusion powder layer, and the width of the fluorescent powder layer or the diffusion powder layer is equal to the sum of the widths of the two groups of reflection walls and the LED chip.