Inspection method

Abstract

This inspection method inspects an inspection object of a first substrate, and comprises: a step (a) in which the first substrate having a first electrode is prepared; (b) preparing a second substrate having a second electrode, a third electrode, and a bonding portion; (c) bonding the first substrate and the second substrate by means of an adhesive so that the bonding portion is sandwiched therebetween, thereby electrically contacting the first electrode and the second electrode and forming a sealed space between the first substrate and the second substrate; a step (d) in which the adhesive is cured; a step (e) for inspecting the object to be inspected; and a step (f) in which the first substrate is peeled from the second substrate, in which the bonding strength of the adhesive to the first substrate is higher than the bonding strength of the adhesive to the second substrate when the first substrate is peeled from the second substrate in the step (f).

Description

Technical Field

[0001] The present invention relates to an inspection method. Background Art

[0002] For example, Patent Documents 1 and 2 disclose a housing including a wafer (inspection substrate) and a probe card (contact substrate).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-194856

[0006] Patent Document 2: Japanese Patent Application Publication No. 2020-198354 Summary of the invention

[0007] Technical problem to be solved by the invention

[0008] The present invention provides an inspection method capable of efficiently reusing a contact substrate.

[0009] Technical solutions for solving technical problems

[0010] According to one embodiment of the present invention, there is provided an inspection method for inspecting an inspection object possessed by a first substrate, comprising: step (a), preparing the first substrate, the first substrate having a first electrode connected to the inspection object; step (b), preparing a second substrate, the second substrate having a second electrode and a bonding portion formed on a first main surface, and a third electrode formed on a second main surface on the opposite side of the first main surface and electrically connected to the second electrode; step (c), bonding the first substrate and the second substrate by an adhesive in a manner such that the bonding portion is sandwiched in between, so that the first electrode is electrically contacted with the second electrode and a closed space is formed between the first substrate and the second substrate; step (d), curing the adhesive; step (e), inspecting the inspection object; and step (f), peeling the first substrate from the second substrate, wherein in the step (f), when the first substrate is peeled from the second substrate, the bonding strength of the adhesive to the first substrate is higher than the bonding strength of the adhesive to the second substrate.

[0011] Effects of the Invention

[0012] The present invention provides an inspection method capable of efficiently reusing a contact substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a diagram showing an example of the overall configuration of the inspection system according to the present embodiment.

[0014] Figure 2 It is a cross-sectional view of a housing used in the inspection system of this embodiment.

[0015] Figure 3 It is a flowchart of the inspection method of this embodiment.

[0016] Figure 4 It is a diagram for explaining the inspection method of this embodiment.

[0017] Figure 5 It is a diagram for explaining the inspection method of this embodiment.

[0018] Figure 6 It is a diagram for explaining the inspection method of this embodiment.

[0019] Figure 7 It is a diagram for explaining the inspection method of this embodiment.

[0020] Figure 8 It is a diagram for explaining the inspection method of this embodiment.

[0021] Fig. 9 It is a diagram for explaining the inspection method of this embodiment.

[0022] Fig.10 It is a diagram for explaining the inspection method of this embodiment.

[0023] Fig.11 It is a diagram for explaining a modified example of the inspection method of the present embodiment. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments will be described with reference to the drawings. Note that the present invention is not limited to these examples, but is indicated by the scope of the invention, and is intended to include all modifications within the meaning and scope equivalent to the scope of the invention.

[0025] In addition, in the descriptions and drawings of the various embodiments, for components having substantially the same or corresponding functional components, repeated descriptions are sometimes omitted by marking the same or corresponding reference numerals. In addition, for ease of understanding, the scales of the various parts in the drawings are sometimes different from the actual ones.

[0026] First, the overall structure of the inspection system for inspection is described. The inspection system is a system that provides electrical signals to multiple devices under test (DUT) formed on the object to be inspected to inspect various electrical characteristics of the devices. The object to be inspected is, for example, a substrate such as a semiconductor wafer (hereinafter referred to as a "wafer").

[0027] Figure 1 FIG. 1 is a diagram showing an example of the overall structure of the inspection system. Figure 1As shown, the inspection system 1 includes a plurality of inspection units 100 , a conveying system 200 and a management device 300 .

[0028] The plurality of inspection units 100 are arranged in the left-right direction ( Figure 1 X direction) and front-back direction ( Figure 1 The inspection unit 100 includes a plurality of inspection devices 110 and a cooler 120.

[0029] Each of the inspection devices 110 receives the housing 5 conveyed by the cassette unit 220 described later, and inspects the electrical characteristics of each DUT formed on the inspection substrate 10. Each of the inspection devices 110 includes a controller 116 that controls the overall operation of the inspection device 110. The housing 5 will be described later.

[0030] The cooler 120 cools the workstations by supplying a refrigerant such as cooling water to the refrigerant flow paths of the workstations provided in the plurality of inspection devices 110. Figure 1 In the example of FIG. 1 , one cooler 120 is provided for each of the four inspection devices 110 . However, the cooler 120 may be provided for each of the inspection devices 110 .

[0031] The conveying system 200 includes a plurality of loading units 210 and a plurality of box units 220 .

[0032] The plurality of loading units 210 are respectively arranged in the same plane in the front-to-back direction ( Figure 1 Each loading unit 210 includes a FOUP storage stack 211, a probe card storage stack 212, a needle polishing unit 213, a housing storage stack 214, a loading and unloading unit 215, and a conveying unit 216.

[0033] The FOUP storage stack 211 is an area for storing a transport container (FOUP: Front Opening Unified Pod) storing a plurality of inspection substrates 10. The FOUP storage stack 211 is provided with, for example, a plurality of storage racks for storing FOUPs. FOUPs are transported to the FOUP storage stack 211 from outside the inspection system 1. The FOUP storage stack 211 can be reached by a transport device 216a of a transport unit 216 described later.

[0034] The probe card storage stack 212 is an area for storing a plurality of contact substrates 20. The probe card storage stack 212 is provided with, for example, a plurality of storage racks for storing the contact substrates 20. The contact substrates 20 are transported to the probe card storage stack 212 from outside the inspection system 1. The probe card storage stack 212 can be reached by a transport device 216a of a transport unit 216 described later.

[0035] The needle polishing section 213 is an area for polishing the tip of the probe that contacts the substrate 20 and repairing the probe to which dust etc. are attached. For example, a needle polishing plate for polishing the tip of the probe is provided in the needle polishing section 213. The needle polishing section 213 can be reached by a conveying device 216a of the conveying section 216 described later.

[0036] The shell storage stack 214 is an area for storing a plurality of shells 5. The shell storage stack 214 is provided with, for example, a plurality of storage racks for storing the shells 5. The shells 5 formed by the loading and unloading section 215 and the shells 5 inspected by the inspection unit 100 are stored in the shell storage stack 214. The shell storage stack 214 can be reached by a conveying device 216a of the conveying section 216 and a cassette unit 220 described later.

[0037] The loading and unloading section 215 is a housing 5 in which the inspection substrate 10 and the contact substrate 20 are formed as one body, and the housing 5 is separated into regions of the inspection substrate 10 and the contact substrate 20. In the loading and unloading section 215, the inspection substrate 10 is held on the stage by adsorption by an aligner, and the corresponding probes of the contact substrate 20 are brought into contact with and connected to the respective electrodes of the plurality of DUTs, thereby forming the housing 5. In addition, in the loading and unloading section 215, the inspection substrate 10 and the contact substrate 20, which are formed as one body as the housing 5, are separated. The loading and unloading section 215 can be reached by a conveying device 216a of a conveying section 216 described later.

[0038] The transport section 216 is an area for transporting the housing 5, the inspection substrate 10, and the contact substrate 20 between the areas. The transport section 216 is provided with a transport device 216a for transporting the housing 5, the inspection substrate 10, and the contact substrate 20. The transport device 216a holds the housing 5, the inspection substrate 10, and the contact substrate 20 and transports them between the areas. For example, the transport device 216a transports the housing 5 between the loading and unloading section 215 and the housing storage stack 214. In addition, the transport device 216a transports the inspection substrate 10 between the FOUP storage stack 211 and the loading and unloading section 215. In addition, the transport device 216a transports the contact substrate 20 between the probe card storage stack 212, the needle grinding section 213, and the loading and unloading section 215.

[0039] Each of the plurality of cassette units 220 is a mobile unit that stores a plurality of housings 5 ​​and supplies the housings 5 ​​to the plurality of inspection units 100. Figure 1 In the example, each of the plurality of box units 220 transports the shell 5 between the shell storage stack 214 of the loading unit 210 and the workbench 111 of the inspection device 110. The box unit 220 is, for example, an automated guided vehicle (AGV). The box unit 220 moves autonomously along a guide line 225 such as a magnetic tape laid on the ground.

[0040] The management device 300 controls the operation of the plurality of cassette units 220 based on the position information of the plurality of cassette units 220 measured by a positioning device (not shown). For example, the management device 300 determines which cassette unit 220 is to be sent to the inspection device 110 based on the position information of the plurality of cassette units 220 measured by the positioning device. As an example, the cassette unit 220 located closest to the inspection device 110 as the target is sent to the inspection device 110.

[0041] In addition, the management device 300 calculates the optimal path when conveying the shell 5 for the determined cassette unit 220, and operates the cassette unit 220 using the optimal path. In addition, the management device 300 may obtain the number of shells 5 stored in each cassette unit 220, and control the operation of the plurality of cassette units 220 based on the obtained number of shells 5. As an example, the cassette unit 220 having a larger number of shells 5 obtained is operated preferentially.

[0042] The type of the positioning device is not limited as long as it can measure the position information of each of the multiple box units 220. As the positioning device, for example, there may be multiple position detection sensors that are provided on the guide line 225 and can detect the passage of the box unit 220. In addition, as the positioning device, a GNSS (Global Navigation Satellite System) receiver may also be used. The GNSS receiver is, for example, mounted on each box unit 220, and receives positioning signals from GNSS satellites represented by GPS (Global Positioning System) satellites to obtain the position information of the box unit 220.

[0043] [case]

[0044] Next, a configuration example of the housing 5 will be described. Figure 2 It is a diagram showing an example of the housing 5 . Figure 2 2 is a cross-sectional view showing the housing 5. The housing 5 includes an inspection substrate 10 and a contact substrate 20. The inspection substrate 10 and the contact substrate 20 are bonded together by an adhesive 30.

[0045] The inspection substrate 10 is, for example, a semiconductor substrate such as a silicon substrate or a silicon carbide substrate. A plurality of devices under inspection (DUTs) are formed on the inspection substrate 10. Each DUT includes an electrode pad 11.

[0046] A plurality of electrode pads 11 are formed on the first main surface 10A of the inspection substrate 10. The electrode pads 11 are respectively formed of metals such as aluminum (Al) and copper (Cu). The electrode pads 11 each have a surface where the metal constituting the electrode pad 11 is exposed by removing insulating layers such as oxide films through surface treatment. A metal bump may be formed on each electrode pad 11, or a metal bump may be formed instead of the electrode pad 11. In the case where a metal bump is formed instead of the electrode pad 11, the metal bump has a surface where the metal constituting the metal bump is exposed by removing insulating layers such as oxide films through surface treatment. The plurality of electrode pads 11 are arranged at a first pitch P1. The first pitch P1 is, for example, less than 10 microns.

[0047] The contact substrate 20 is bonded to the inspection substrate 10 by an adhesive 30. The contact substrate 20 preferably has the same thermal expansion coefficient as the inspection substrate 10. By making the contact substrate 20 have the same thermal expansion coefficient as the inspection substrate 10, it is possible to suppress the positional deviation between the electrode pad 11 and the contact portion 21 when the temperature of the housing 5 changes. The contact substrate 20 is preferably formed of the same material as the inspection substrate 10, for example, a semiconductor substrate such as a silicon substrate or a silicon carbide substrate. In addition, the contact substrate 20 can also be composed of a glass substrate having the same thermal expansion coefficient as the inspection substrate 10, or a substrate in which a semiconductor substrate and a glass substrate are stacked. The contact substrate 20 has a plurality of contact portions 21, a plurality of electrode pads 22, a plurality of wirings 23, an internal circuit 24, a plurality of wirings 25, and an insulating layer 26.

[0048] A plurality of contact portions 21 are formed on the first main surface 20A. The first main surface 20A is a surface opposite to the first main surface 10A of the inspection substrate 10. The plurality of contact portions 21 are arranged at the same pitch as the plurality of electrode pads 11. The plurality of contact portions 21 are arranged at the same pitch as the plurality of electrode pads 11, and the contact portions 21 are electrically contacted with the corresponding electrode pads 11, respectively. The contact portions 21 are formed of a conductive material such as copper (Cu) or carbon (C).

[0049] A plurality of electrode pads 22 are formed on the second main surface 20B. The second main surface 20B is the surface on the opposite side of the first main surface 20A. The plurality of electrode pads 22 are arranged at a second pitch P2. The second pitch P2 is a pitch greater than the first pitch P1, for example, in the range of 50 micrometers to 500 micrometers. Figure 2 In the figure, for convenience of explanation, the second pitch P2 is represented by the same pitch as the first pitch P1. The electrode pad 22 is electrically connected to the contact portion 21 via the wiring 23. The electrode pad 22 is formed of a metal such as aluminum (Al) and copper (Cu). The electrode pad 22 can also be formed by plating a metal such as gold (Au).

[0050] The plurality of wirings 23 electrically connect the plurality of electrode pads 22 and the internal circuit 24. The wirings 23 are each formed of a metal such as copper (Cu). In addition, the plurality of wirings 25 electrically connect the plurality of contact portions 21 and the internal circuit 24. The wirings 25 are each formed of a metal such as copper (Cu).

[0051] The internal circuit 24 may include, for example, a through-silicon via (TSV), a redistribution layer (RDL), a through-glass via (TGV), etc. The internal circuit 24 includes TSV, RDL, TGV, etc., so that the internal circuit 24 can be used to rewire the plurality of contact portions 21 and electrically connect them to the plurality of electrode pads 22. By rewiring the plurality of contact portions 21 and electrically connecting them to the plurality of electrode pads 22 using the internal circuit 24, the pitch of the plurality of electrode pads 22 can be further increased.

[0052] The insulating layer 26 is formed on the first main surface 20A. The insulating layer 26 is formed to cover a region of the first main surface 20A where the contact portion 21 is not formed. The insulating layer 26 is formed of an insulating material such as silicon oxide (SiO 2 ) or polyimide (PI (polyimide)).

[0053] The insulating layer 26 includes a bonding portion 26a. The bonding portion 26a is formed at the peripheral portion of the first main surface 20A. The bonding portion 26a protrudes from the surface of the insulating layer 26 toward the inspection substrate 10. The bonding portion 26a is bonded to the first main surface 10A of the inspection substrate 10 by an adhesive 30, and a closed space S is formed between the inspection substrate 10 and the contact substrate 20.

[0054] The portion where the electrode pad 11 contacts the contact portion 21 is surrounded by a closed space S. The closed space S is preferably maintained in a reduced pressure atmosphere or an inert gas atmosphere. By maintaining the closed space S in a reduced pressure atmosphere or an inert gas atmosphere, the plurality of electrode pads 11 are prevented from being exposed to the atmosphere. Since the plurality of electrode pads 11 can be prevented from being exposed to the atmosphere, oxidation of the surfaces of the plurality of electrode pads 11 can be suppressed. That is, the generation of a natural oxide film on the surfaces of the plurality of electrode pads 11 can be suppressed. In addition, the bonding portion 26a may be separate from the insulating layer 26, or may be formed of a material different from the insulating layer 26.

[0055] The adhesive 30 bonds the inspection substrate 10 and the contact substrate 20. The adhesive 30 is, for example, a photocurable resin that is cured by ultraviolet rays. In addition, the adhesive 30 is a resin that can be peeled off by heating. For example, an adhesive whose adhesive strength is reduced by heating the adhesive cured by ultraviolet rays at a temperature of 200° C. or more for 10 minutes may be used as the adhesive 30.

[0056] [Inspection method]

[0057] A method for inspecting the inspection substrate 10 according to the present embodiment will be described. Figure 3 1 is a flowchart for explaining the inspection method of the inspection substrate 10 according to the present embodiment. Figures 4 to 10 1 is a diagram for explaining the inspection method of the inspection substrate 10 according to the present embodiment. Figures 4 to 10 1 is a cross-sectional view of the inspection substrate 10, the contact substrate 20, and the mounting table 215a.

[0058] (Step S10)

[0059] First, the inspection substrate 10 is prepared (inspection substrate preparation step). The inspection substrate 10 is transported from the FOUP storage stack 211 to the loading and unloading section 215 by the transport device 216 a of the transport section 216 . Then, the inspection substrate 10 is placed on the mounting table 215 a of the loading and unloading section 215 . Figure 4 This is a diagram showing a state where the inspection substrate 10 is placed on the placement table 215 a of the loading and unloading section 215 .

[0060] (Step S20)

[0061] Next, the contact substrate 20 is prepared (contact substrate preparation step). The contact substrate 20 is transported from the probe card stocker 212 to the loading and unloading section 215 by the transport device 216 a of the transport section 216 .

[0062] (Step S30)

[0063] Next, the inspection substrate 10 and the contact substrate 20 are bonded together using the adhesive 30 (a step of bonding the inspection substrate and the contact substrate together using the adhesive).

[0064] First, a surface treatment is performed as a pre-treatment for bonding on a region 10r of the first main surface 10A of the inspection substrate 10 that contacts the bonding portion 26a of the contact substrate 20. The surface treatment is, for example, a plasma activation treatment or a coupling treatment. The surface treatment is a treatment for improving the bonding strength of the adhesive 30 on the inspection substrate 10. Figure 5 1 is a diagram showing a state where a surface treatment is performed on a region 10r of the inspection substrate 10. Figure 5 In the figure, the area where the surface treatment is performed is indicated by a wavy line.

[0065] By performing the surface treatment on the region 10r of the inspection substrate 10, the bonding strength of the adhesive 30 to the inspection substrate 10 is increased. By increasing the bonding strength of the adhesive 30 in the region 10r of the inspection substrate 10, when the contact substrate 20 is peeled off from the inspection substrate 10, the bonding strength of the adhesive 30 to the inspection substrate 10 is higher than the bonding strength of the adhesive 30 to the contact substrate 20. Therefore, when the contact substrate 20 is peeled off from the inspection substrate 10, it is possible to suppress the adhesive from adhering to the contact substrate 20.

[0066] Next, the adhesive 30 is applied to the region 10 r of the first main surface 10A of the inspection substrate 10 which is in contact with the bonding portion 26 a of the contact substrate 20 . Figure 6 The figure shows a state where the adhesive 30 is applied to the region 10 r of the inspection substrate 10 .

[0067] Then, the contact substrate 20 is arranged so that the first main surface 20A of the contact substrate 20 faces the first main surface 10A of the inspection substrate 10 . Figure 7 1 is a diagram showing a state in which the first main surface 20A of the contact substrate 20 is opposite to the first main surface 10A of the inspection substrate 10. The contact substrate 20 is arranged on the upper part of the inspection substrate 10 by, for example, a robot arm. The contact substrate 20 is aligned in a manner that the electrode pad 11 and the contact portion 21 corresponding to the electrode pad 11 are in contact.

[0068] Then, the contact substrate 20 is passed to Figure 7 The contact substrate 20 moves in the direction of arrow A, and is placed onto the inspection substrate 10. Figure 8 1 shows a state where the contact substrate 20 is placed on the inspection substrate 10. By placing the contact substrate 20 on the inspection substrate 10, the inspection substrate 10 and the contact substrate 20 are bonded to each other with the bonding portion 26a interposed therebetween by the adhesive 30. In addition, by placing the contact substrate 20 on the inspection substrate 10, a closed space S is formed.

[0069] (Step S40)

[0070] Next, the adhesive 30 is irradiated with ultraviolet rays from an external light source to cure the adhesive 30 (the step of curing the adhesive). Figure 8 The UV irradiation is performed by the arrow UV. The adhesive 30 is cured, and the assembly of the housing 5 is completed. The assembled housing 5 is transported from the loading and unloading section 215 to the housing storage stack 214 by the transport device 216a of the transport section 216.

[0071] (Step S50)

[0072] Next, the inspection substrate 10 is inspected using the housing 5 (a step of inspecting the inspection substrate). The housing 5 stored in the housing storage stack 214 is transported to the inspection device 110 by the cassette unit 220. In the inspection device 110, the inspection substrate 10 is inspected.

[0073] The housing 5 is transported to the inspection device 110, and the electrical characteristics of the plurality of DUTs formed on the inspection substrate 10 are inspected. Specifically, first, the inspection device 110 makes a probe (not shown) electrically contact the electrode pad 22 of the contact substrate 20. Next, the inspection device 110 supplies an electrical signal to the plurality of DUTs formed on the inspection substrate 10 via the probe, the electrode pad 22, the wiring 23, the internal circuit 24, the wiring 25, the contact portion 21, and the electrode pad 11, to inspect the electrical characteristics of the plurality of DUTs.

[0074] The electrode pads 22 of the contact substrate 20 are formed at a larger pitch than the electrode pads 11 of the inspection substrate 10. By forming the electrode pads 22 of the contact substrate 20 at a larger pitch than the electrode pads 11 of the inspection substrate 10, when inspecting the electrical characteristics of a plurality of DUTs, it is possible to perform position alignment between the probes of the inspection device 110 and the electrode pads 22 by rough alignment. Since the position alignment between the probes of the inspection device 110 and the electrode pads 22 can be performed by rough alignment, it is not necessary to provide a position alignment mechanism for performing high-precision position alignment in the inspection device.

[0075] The housing 5 including the inspected inspection substrate 10 is transported by the box unit 220 to the housing storage stack 214 .

[0076] (Step S60)

[0077] The housing 5 including the inspection substrate 10 after inspection is peeled off from the contact substrate 20 in the loading and unloading section 215 (a step of peeling the inspection substrate from the contact substrate). The housing 5 including the inspection substrate 10 after inspection is transported from the housing storage stack 214 to the loading and unloading section 215 by the transport device 216a of the transport section 216. The transported housing 5 is placed on the placement table 215a. Fig. 9 This is a diagram showing a state where the housing 5 after inspection is placed on the placement table 215a.

[0078] In the loading and unloading section 215, heat is applied to the housing 5 from the side in contact with the substrate 20. Fig. 9 As shown by arrow HT, heat is applied from the contact substrate 20 side of the housing 5. The bonding strength of the adhesive 30 decreases when heat is applied. By applying heat from the contact substrate 20 side, when the contact substrate 20 is peeled off from the inspection substrate 10, the bonding strength of the adhesive 30 to the inspection substrate 10 is higher than the bonding strength of the adhesive 30 to the contact substrate 20.

[0079] After heating, the contact substrate 20 is peeled off from the inspection substrate 10 . Fig.10 1 is a diagram showing a state where the contact substrate 20 is peeled off from the inspection substrate 10. The contact substrate 20 is peeled off from the inspection substrate 10 by, for example, a robot arm. Fig.10 The contact substrate 20 moves in the direction of the arrow B. The contact substrate 20 is peeled off from the inspection substrate 10 by moving in the direction of the arrow B, that is, in the direction away from the inspection substrate 10.

[0080] As described above, when the contact substrate 20 is peeled off from the inspection substrate 10, the adhesive 30 has a higher bonding strength to the inspection substrate 10 than to the contact substrate 20, so the adhesive 30 remains on the inspection substrate 10. On the other hand, the adhesive 30 does not remain on the contact substrate 20.

[0081] The contact substrate 20 is peeled off from the inspection substrate 10, and the inspection substrate 10 is separated from the contact substrate 20. The separated inspection substrate 10 is sent to the next step. The separated contact substrate 20 is reused when the contact portion 21 is cleaned and another inspection substrate 10 is inspected.

[0082] According to the inspection method of the present embodiment, when the contact substrate 20 is peeled off from the inspection substrate 10, the adhesive strength of the adhesive 30 to the inspection substrate 10 is higher than the adhesive strength of the adhesive 30 to the contact substrate 20. Therefore, according to the inspection method of the present embodiment, when the contact substrate 20 is peeled off from the inspection substrate 10, since the adhesive 30 remains on the inspection substrate 10, it is possible to suppress the adhesive 30 from being attached to the contact substrate 20.

[0083] When the contact substrate 20 is peeled off from the inspection substrate 10, the adhesive 30 is prevented from adhering to the contact substrate 20, so that the step of cleaning the contact substrate 20 is not required, and the contact substrate 20 can be efficiently reused. In addition, although the adhesive 30 is attached to the inspection substrate 10, since the inspection substrate 10 is finally cut, there is no problem even if the adhesive 30 is attached.

[0084] In the inspection method of this embodiment, when the contact substrate 20 is peeled off from the inspection substrate 10, the following processes (A) and (B) are performed in order to make the bonding strength of the adhesive 30 to the inspection substrate 10 higher than the bonding strength of the adhesive 30 to the contact substrate 20. (A) In step S30, the surface treatment is performed on the area 10r of the first main surface 10A of the inspection substrate 10 that contacts the bonding portion 26a of the contact substrate 20. (B) In step S60, heat is applied to the housing 5 from the contact substrate 20 side.

[0085] In addition, the present invention is not limited to the case where the processing of (A) and (B) is performed as in the inspection method of the present embodiment. For example, in the inspection method, when the contact substrate 20 is peeled off from the inspection substrate 10, in order to make the bonding strength of the adhesive 30 to the inspection substrate 10 higher than the bonding strength of the adhesive 30 to the contact substrate 20, either of the above (A) and (B) may be performed.

[0086] Furthermore, when the contact substrate 20 is peeled off from the inspection substrate 10, the type of adhesive 30 may be appropriately selected so that the adhesive strength of the adhesive 30 to the inspection substrate 10 is higher than the adhesive strength of the adhesive 30 to the contact substrate 20. That is, as the adhesive 30, an adhesive having a higher adhesive strength to the inspection substrate 10 than to the bonding portion 26a of the contact substrate 20 may be used. In addition, in addition to using this adhesive, at least one of the above (A) and (B) may be combined.

[0087] In addition, the inspection substrate 10 is an example of a first substrate, and the contact substrate 20 is an example of a second substrate. The plurality of devices under inspection (DUTs) in the inspection substrate 10 are an example of an inspection object. The electrode pad 11 is an example of a first electrode, the contact portion 21 is an example of a second electrode, and the electrode pad 22 is an example of a third electrode.

[0088] In step S30 of the inspection method of this embodiment, the region 10 r of the inspection substrate 10 is surface treated. However, the region 26 r of the bonding portion 26 a of the contact substrate 20 that contacts the first main surface 10A of the inspection substrate 10 may be surface treated. Fig.11 FIG. 2 is a diagram showing a state where a surface treatment is performed on a region 26r in a contact substrate 20. The surface treatment is, for example, a rough surface treatment. The surface treatment is a treatment for weakening the bonding strength of the adhesive 30 to the contact substrate 20.

[0089] The inspection system and inspection method of the present embodiment disclosed herein are illustrative in all aspects and are not restrictive. The above-mentioned embodiments can be modified and improved in various ways without departing from the scope of the invention and its gist. The matters described in the above-mentioned multiple embodiments can also obtain other structures within the scope of non-contradiction, and can be combined within the scope of non-contradiction.

[0090] This application claims the priority of basic patent application No. 2022-105056 filed with the Japan Patent Office on June 29, 2022, the entire contents of which are incorporated herein by reference.

[0091] Description of Reference Numerals

[0092] 5 Shell

[0093] 10. Check the substrate

[0094] 10A first main surface

[0095] 10r area

[0096] 11 electrode pads

[0097] 20Contact substrate

[0098] 20A first main surface

[0099] 20B Second main surface

[0100] 21 Contact Department

[0101] 22 electrode pads

[0102] 23 Wiring

[0103] 24 Internal Circuit

[0104] 25 Wiring

[0105] 26 Insulation layer

[0106] 26a Joint

[0107] 26r area

[0108] 30 Adhesive

[0109] S confined space.

Claims

1. An inspection method, characterized in that: The inspection method inspects an inspection object on the first substrate, including: Step (a), preparing a first substrate, wherein the first substrate has a first electrode connected to the inspection object; Step (b), preparing a second substrate, the second substrate having a second electrode and a bonding portion formed on a first main surface, and a third electrode formed on a second main surface opposite to the first main surface and electrically connected to the second electrode; Step (c), bonding the first substrate and the second substrate by using an adhesive in a manner of sandwiching the bonding portion, so that the first electrode and the second electrode are in electrical contact and a closed space is formed between the first substrate and the second substrate; Step (d), curing the adhesive; Step (e), inspecting the inspection object; and Step (f), peeling the first substrate from the second substrate, In the step (f), when the first substrate is peeled off from the second substrate, the adhesive strength of the adhesive to the first substrate is higher than the adhesive strength of the adhesive to the second substrate.

2. The inspection method according to claim 1, characterized in that: In the step (c), the first substrate or the bonding portion is subjected to a surface treatment so that the bonding strength of the adhesive to the first substrate is higher than the bonding strength of the adhesive to the second substrate.

3. The inspection method according to claim 2, characterized in that: In the step (f), the second substrate is heated when the first substrate is peeled off from the second substrate.

4. The inspection method according to claim 1, characterized in that: In the step (f), the second substrate is heated when the first substrate is peeled off from the second substrate.

5. The inspection method according to any one of claims 1 to 4, characterized in that: The adhesive strength of the adhesive to the first substrate is higher than the adhesive strength of the adhesive to the second substrate.

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