Chip management method and device, electronic equipment and computer storage medium
By building chip BOM and updating quantity information, the time-consuming and labor-consuming problem of chip information recording and maintenance in the existing technology is solved, and the automatic management and retrieval of chip information is realized, and data quality and vehicle production efficiency are improved.
Patent Information
- Application Number
- CN202411335199.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-01-17
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the prior art, the recording and maintenance of chip information is time-consuming and labor-intensive and the data quality is poor, so it is impossible to effectively count and manage materials from secondary suppliers, resulting in difficulty in maintaining chip information.
By obtaining the vehicle BOM design information of the vehicle to be assembled, building a chip BOM, recording the chip characteristic information and quantity information, and updating the quantity information based on the assembly information and production schedule, automatic recording and management of chip information is realized, and chip retrieval function is provided. .
The chip management process is simplified, the quality and management efficiency of chip information data are improved, and the smooth progress of vehicle production is ensured.
Smart Images

Figure CN119323322A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of production management, and in particular to a chip management method, device, electronic equipment and computer storage medium. Background Art
[0002] Due to different systems and configurations, cars have multiple controllers. Different controllers use different chip types, chip models, chip suppliers and other information. During vehicle generation, vehicle chips need to be managed uniformly to ensure a balance between chip supply and demand.
[0003] In the prior art, since the chip cannot exist as a separate functional part, it must be combined with other circuit boards, lines and other materials to form a controller assembly to realize its function. At the same time, since the manufacturers of the controller assemblies for each function are different, the types and quantities of chips used may also be different. Therefore, from the perspective of the vehicle BOM (bill of materials), the controller assembly is delivered by the first-tier supplier, and the chip is delivered by the second-tier supplier. The existing vehicle BOM cannot count the materials of the second-tier supplier, and the chips used in vehicle production can only be counted and maintained through manual records. Because car companies have multiple drive forms, multiple vehicle types, and multiple regulatory requirements in production, the use of chips is very complicated. When manually recording and maintaining chip information offline, data analysis is done through tables, and each processing requires a lot of energy and time. When there are design changes, the information is not updated in a timely manner, and the data quality is poor, making it difficult to maintain chip information.
[0004] It can be seen that the recording and maintenance of chip information in the prior art has technical problems of being time-consuming, labor-intensive and having poor data quality. Summary of the invention
[0005] In view of this, it is necessary to provide a chip management method, device, electronic device and computer storage medium to solve the technical problems in the prior art that the recording and maintenance of chip information is time-consuming, labor-intensive and has poor data quality.
[0006] In order to solve the above problems, the present invention provides a chip management method, comprising: Acquire design information of each vehicle to be assembled based on the vehicle BOM of each vehicle to be assembled, and acquire chip configuration information of each vehicle to be assembled based on the design information; Building a chip BOM based on the chip configuration information, wherein the chip BOM is used to record characteristic information and quantity information of each chip, and the characteristic information is used for chip retrieval; Based on the assembly information of the vehicle to be assembled, the quantity information in the chip BOM is updated, and a chip assembly plan is determined based on the production schedule of the vehicle to be assembled and the updated quantity information.
[0007] In a possible implementation, the acquiring design information of the vehicle to be assembled based on the vehicle BOM of the vehicle to be assembled, and acquiring chip configuration information of the vehicle to be assembled based on the design information, includes: Determining controller configuration information of the vehicle to be assembled based on the vehicle BOM of the vehicle to be assembled; Chip configuration information in each controller is determined based on the controller configuration information.
[0008] In a possible implementation, the chip BOM is constructed based on the chip configuration information, the chip BOM is used to record characteristic information and quantity information of each chip, and the characteristic information is used for chip retrieval, including: Based on the chip configuration information, obtaining chip information of the chip installed in each controller in each of the vehicles to be installed, wherein the chip information includes characteristic information and quantity information of the chip; A chip BOM independent of the vehicle BOM is constructed, wherein the chip BOM is used to record characteristic information and quantity information of each chip, wherein the chip BOM is provided with a characteristic information retrieval function for retrieving the corresponding chip based on the characteristic information.
[0009] In a possible implementation manner, updating the quantity information in the chip BOM based on the assembly information of the vehicle to be assembled includes: Determine the total assembly quantity of each chip based on assembly information of each vehicle to be assembled in the production system; The quantity information of each chip in the chip BOM is updated based on the total assembly quantity of each chip.
[0010] In a possible implementation manner, determining the total assembly quantity of each chip based on assembly information of each to-be-assembled vehicle in the production system includes: The total assembly quantity of the target chip is calculated using a chip total assembly quantity calculation formula, wherein the target chip has target characteristic information, and the chip total assembly quantity calculation formula is:
[0011] in, is the total assembly quantity of the target chip, M The number of models equipped with chips with target characteristic information, P The number of chips with target characteristic information used for a single vehicle model, Q is the assembly quantity of a single model,x% an assembly ratio of a target controller for assembling the chip having the target characteristic information, y% an assembly ratio of assembling the target chip for the target controller; The total number of chips required for a single vehicle model is calculated using the chip calculation formula for a single vehicle model. The chip calculation formula for a single vehicle model is:
[0012] in, The total number of chips that need to be assembled for the target vehicle model, N The number of chip types that need to be installed for the target vehicle model, U The number of vehicles equipped with each chip, W is the production quantity of the target model, i% is the proportion of each controller in the bicycle, j% is the proportion of each chip in each controller.
[0013] In a possible implementation manner, updating the quantity information in the chip BOM based on the assembly information of the vehicle to be assembled includes: The inventory quantity of each chip in the chip BOM is updated based on the usage quantity of each chip and the quantity information in the chip BOM.
[0014] In a possible implementation manner, determining the chip assembly plan based on the production schedule of the vehicle to be assembled and the updated quantity information includes: Calculating the total required quantity of the target chips based on the production schedule of the vehicle to be assembled and the target quantity of chips used by the vehicle to be assembled; When the total demand quantity of the target chip is greater than the inventory quantity of the target chip in the chip BOM, a candidate chip is used to replace the target chip, wherein the candidate chip has the same function as the target chip.
[0015] The present invention also provides a chip management device, comprising: A chip configuration information acquisition module, used to acquire design information of each vehicle to be assembled based on the vehicle BOM of each vehicle to be assembled, and acquire chip configuration information of each vehicle to be assembled based on the design information; A chip BOM building module, used to build a chip BOM based on the chip configuration information, wherein the chip BOM is used to record the characteristic information and quantity information of each chip, and the characteristic information is used for chip retrieval; The chip management module is used to update the quantity information in the chip BOM based on the assembly information of the vehicle to be assembled, and determine the chip assembly plan based on the production schedule of the vehicle to be assembled and the updated quantity information.
[0016] The present invention also provides an electronic device, comprising a memory and a processor, wherein: The memory is used to store programs; The processor is coupled to the memory and is used to execute the program stored in the memory to implement the steps in the chip management method described in any one of the above embodiments.
[0017] The present invention also provides a computer-readable storage medium for storing a computer-readable program or instruction, which, when executed by a processor, can implement the steps of the chip management method described in any of the above embodiments.
[0018] The beneficial effects of the present invention are as follows: the chip management method provided by the present invention obtains the design information of each vehicle to be assembled according to the whole vehicle BOM of the vehicle to be assembled, and obtains the chip configuration information of each vehicle to be assembled based on the design information of each vehicle to be assembled, constructs a chip BOM based on the chip configuration information, and records the characteristic information and quantity information of each chip, wherein the characteristic information can be used for chip retrieval; further, the quantity information of each chip in the chip BOM can be updated based on the assembly information of the vehicle to be assembled, and the chip assembly plan can be determined based on the production schedule of the vehicle to be assembled and the updated quantity information, so as to ensure the whole vehicle production. The present invention provides a chip BOM, which can realize automatic recording and management of chip information, and provides a chip retrieval function, so that chip management is simpler and the quality of chip information data is higher. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
[0020] FIG1 is a schematic flow chart of a chip management method provided by an embodiment of the present invention; Figure 2 A schematic diagram of a process for obtaining chip configuration information provided by an embodiment of the present invention; Figure 3 A schematic diagram of a chip BOM construction method provided by an embodiment of the present invention; Figure 4 A possible chip BOM table and characteristic information representation schematic diagram provided by an embodiment of the present invention; Figure 5 A schematic diagram of a chip BOM update method provided by an embodiment of the present invention; Figure 6A schematic diagram of a flow chart of a production scheduling optimization method provided by an embodiment of the present invention; Figure 7 A schematic diagram of the structure of a chip management device provided by an embodiment of the present invention; Figure 8 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0021] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.
[0022] Reference to an "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0023] A specific embodiment of the present invention, as Figure 1 As shown, a chip management method is disclosed, including: S101, obtaining design information of each vehicle to be assembled based on the vehicle BOM of each vehicle to be assembled, and obtaining chip configuration information of each vehicle to be assembled based on the design information; S102, constructing a chip BOM based on the chip configuration information, where the chip BOM is used to record the characteristic information and quantity information of each chip, and the characteristic information is used for chip retrieval; S103, based on the assembly information of the vehicle to be assembled, updating the quantity information in the chip BOM, and determining the chip assembly plan based on the production schedule of the vehicle to be assembled and the updated quantity information.
[0024] In the embodiment of the present invention, from the development process, the existing vehicle enterprises will only design the whole vehicle to the system components level during the design stage. The controller supplier can only be purchased and selected after the whole vehicle design is completed. Only at this time can the controller solution of the supplier and the number and information of the internal chips be known. Therefore, for the vehicle to be assembled, it is necessary to obtain the design information according to the whole vehicle BOM, and then determine the chip configuration information of the vehicle to be assembled based on the design information combined with the data of the procurement system. Optionally, each vehicle to be assembled refers to a vehicle with a production schedule, which can be a vehicle that has been launched, a vehicle that is being pre-sold, or a vehicle that has not been launched but has a launch plan. When the vehicle to be assembled is designed, the whole vehicle BOM will contain all the design information of the vehicle to be assembled, such as the controller information used in each vehicle to be assembled, and the function information of each controller, etc. Specifically, in order to ensure the integrity of the chip information, the design information of all models of the car company can be obtained, and the chip configuration information can be determined based on the design information.
[0025] Furthermore, the chip configuration information includes the characteristic information and quantity information of the chip, wherein the characteristic information of the chip refers to information used to indicate a certain characteristic of the chip, such as the type of chip, function, whether it is an imported chip, safety level, power, function, etc. The characteristic information of the chip can be set according to the actual situation. Generally, there are dozens or hundreds of settings for the characteristic information of the chip. These characteristic information can be directly obtained through the data provided by the chip supplier, and the chip can be retrieved according to the characteristic information; the quantity information of the chip can include the number of chips used in each vehicle model, the inventory number of the chip, the total usage of the chip in a certain period of time in the past, and other information related to the number of chips, which can also be set according to the actual situation. In an embodiment of the present invention, based on the characteristic information and quantity information of each chip, a chip BOM for displaying the characteristic information and quantity information is constructed. The chip BOM is independent of the vehicle BOM and can be embedded in the vehicle BOM for display.
[0026] Furthermore, after the chip BOM is constructed, the usage quantity of each chip is determined based on the assembly information of the vehicle to be assembled, and the quantity information of each chip in the chip BOM is updated based on the usage quantity to maintain the real-time performance of the chip BOM data.
[0027] The chip management method provided by the present invention obtains the design information of each vehicle to be assembled according to the whole vehicle BOM of the vehicle to be assembled, and obtains the chip configuration information of each vehicle to be assembled based on the design information of each vehicle to be assembled, constructs the chip BOM based on the chip configuration information, and records the characteristic information and quantity information of each chip, wherein the characteristic information can be used for chip retrieval; further, based on the assembly information of the vehicle to be assembled, the quantity information of each chip in the chip BOM can be updated, and the chip assembly plan can be determined based on the production schedule of the vehicle to be assembled and the updated quantity information, so as to ensure the whole vehicle production. The present invention provides a chip BOM, which can realize automatic recording and management of chip information, and provides a chip retrieval function, so that chip management is simpler and the quality of chip information data is higher.
[0028] As a possible implementation mode of the present invention, in this implementation mode, Figure 2 As shown, the design information of the vehicle to be assembled is obtained based on the vehicle BOM of the vehicle to be assembled, and the chip configuration information of the vehicle to be assembled is obtained based on the design information, including: S201, determining controller configuration information of the vehicle to be assembled based on the vehicle BOM of the vehicle to be assembled; S202: Determine chip configuration information in each controller based on the controller configuration information.
[0029] In an embodiment of the present invention, when obtaining chip configuration information based on the design information of the vehicle to be assembled, it is necessary to obtain the controller design information of the vehicle to be assembled in the vehicle BOM. The controller design information includes the type and quantity information of the controller used by each vehicle, as well as the supplier information of each controller. Then, based on the controller information provided by the supplier in the procurement system, the chip configuration information in each controller is determined, and then the chip configuration information of each vehicle to be assembled is determined. Furthermore, the chip configuration information of all vehicle models is summarized to determine the location information of all chips, based on which a relatively complete chip BOM can be established.
[0030] In an embodiment of the present invention, for each controller, the procurement system can provide the supplier information of the controller, and the supplier can provide the chip configuration information of the controller. Based on this, by combining with the procurement system, the chip BOM can realize the management and control of the materials of the secondary supplier.
[0031] Further, such as Figure 3 As shown, a chip BOM is constructed based on the chip configuration information. The chip BOM is used to record the characteristic information and quantity information of each chip. The characteristic information is used for chip retrieval, including: S301, acquiring chip information of chips installed in each controller in each to-be-installed vehicle based on chip configuration information, the chip information including characteristic information and quantity information of the chip; S302, constructing a chip BOM independent of the vehicle BOM, wherein the chip BOM is used to record the characteristic information and quantity information of each chip, wherein the chip BOM is provided with a characteristic information retrieval function for retrieving the corresponding chip based on the characteristic information.
[0032] In the embodiment of the present invention, the chip information of the chips installed in each controller may be the type information and quantity information of the chips used in each controller, and further includes the characteristic information of each chip. For example, corresponding to controller A, the chips used include chip B and chip C, wherein chip B is an imported control chip, chip C is a domestic sensing chip, the number of chip B used is 1, and the number of chip C used is 3. The above is only a possible implementation of the present invention. In actual production, the characteristic information and quantity information of the chips in the controller can be more complex to more comprehensively display the chip configuration information.
[0033] Furthermore, for each controller of each vehicle model, after obtaining its chip information, a chip BOM independent of the vehicle BOM is constructed, such as Figure 4 The figure shows a possible example of a chip BOM table and feature information table. The chip BOM will display the feature information of the chip, such as chip category, signal, packaging method, brand information, whether it is domestically produced, etc., and provide a feature information retrieval function. Users can search for the corresponding chip in the chip BOM through the feature information words.
[0034] The chip BOM provided by the embodiment of the present invention is independent of the vehicle BOM, and the chip data can be independently recorded and managed.
[0035] As a possible implementation mode of the present invention, in this implementation mode, Figure 5 As shown, based on the assembly information of the vehicle to be assembled, the quantity information in the chip BOM is updated, including: S501, determining the total assembly quantity of each chip based on assembly information of each vehicle to be assembled in the production system; S502: Update the quantity information of each chip in the chip BOM based on the total assembly quantity of each chip.
[0036] In an embodiment of the present invention, when maintaining the data in the chip BOM, the quantity information of the chips is mainly maintained, and the total assembly quantity of each chip can be determined based on the assembly data of various vehicles. Specifically, when the quantity information of the chips in the chip BOM is updated, the quantity information corresponding to different characteristic information will also be updated synchronously. Based on this, the chip BOM can realize real-time update of the quantity information of chips with different characteristic information.
[0037] Furthermore, the total assembly quantity of each chip is determined based on the assembly information of each vehicle to be assembled in the production system, including: The total assembly quantity of the target chip is calculated using the total assembly quantity calculation formula, where the target chip has target characteristic information, and the total assembly quantity calculation formula is:
[0038] in, is the total assembly quantity of the target chip, M The number of models equipped with chips with target characteristic information, P The number of chips with target characteristic information used for a single vehicle model, Q is the assembly quantity of a single model, x% The assembly ratio of the target controller for assembling the chip with the target characteristic information, y% Assembly ratio of target chip for target controller; The total number of chips required for a single vehicle model is calculated using the chip calculation formula for a single vehicle model. The chip calculation formula for a single vehicle model is:
[0039] in, The total number of chips that need to be assembled for the target vehicle model, N The number of chip types that need to be installed for the target vehicle model, U The number of vehicles equipped with each chip, W is the production quantity of the target model, i% is the proportion of each controller in the bicycle, j% is the proportion of each chip in each controller.
[0040] In the embodiment of the present invention, different calculations can be used based on the different chip information that needs to be counted. Based on the above two calculation formulas, when it is necessary to calculate the chip data of different characteristic information, it can be based on the above two calculation logics, through the counting and extraction of fields such as attributes, and then through segmented summation or integration. Based on this, a certain characteristic or a combination of multiple characteristics in the chip characteristics can be used to count the proportion of chips that meet the relevant characteristic requirements, and all controller chips mounted on a certain vehicle model can be queried and indexed, and the proportion of chips that meet the relevant characteristic requirements can be counted based on one or more chip characteristics. Furthermore, all controllers using the same chip name can be regressively indexed through chip characteristics.
[0041] Furthermore, based on the assembly information of the vehicle to be assembled, the quantity information in the chip BOM is updated, including: Update the inventory quantity of each chip in the chip BOM based on the usage quantity of each chip and the quantity information in the chip BOM.
[0042] In an embodiment of the present invention, in certain special cases, quantity control may occur for certain chips, especially imported chips. Therefore, when chip BOM is used to count and manage chip information, chip inventory is more important data, and the inventory quantity of each chip in the chip BOM can be updated based on the practical data of each chip.
[0043] Further, such as Figure 6 As shown, the chip assembly plan is determined based on the production schedule of the vehicle to be assembled and the updated quantity information, including: S601, calculating the total required quantity of target chips based on the production schedule of the vehicle to be assembled and the target quantity of chips used by the vehicle to be assembled; S602: When the total demand quantity of the target chip is greater than the inventory quantity of the target chip in the chip BOM, a candidate chip is used to replace the target chip, wherein the candidate chip has the same function as the target chip.
[0044] In an embodiment of the present invention, in order to ensure the production of complete vehicles, for the vehicles that have been scheduled for production, the total number of target chips required is calculated based on the number of target chips used by each vehicle in the production schedule, and the inventory number of the target chip is obtained in the chip BOM. When the total number of target chips required is greater than the inventory number of the target chip in the chip BOM, the target chip is replaced by a candidate chip, wherein the candidate chip has the same function as the target chip. Specifically, for example, for a scheduled vehicle, the production schedule is 5,000 vehicles, and each vehicle uses 2 target chips A, then 10,000 target chips A are required, but by querying the data in the chip BOM, the inventory number of target chip A is only 80,000, then based on the characteristic information of the target chip A, the domestic chip B that can replace chip A can be found in the chip BOM, and the production schedule is modified. For the 1,000 vehicles in the production schedule, the imported chip A is replaced by the domestic chip B to ensure the normal production of the vehicle.
[0045] The embodiment of the present invention manages chip inventory through chip BOM. When the chip demand in the production schedule exceeds the inventory, a replacement plan is given in time to ensure the normal progress of vehicle production.
[0046] In order to better implement the chip management method in the embodiment of the present invention, based on the chip management method, correspondingly, Figure 7 As shown, the embodiment of the present invention further provides a chip management device, and the chip management device 700 includes: The chip configuration information acquisition module 701 is used to acquire the design information of each vehicle to be assembled based on the vehicle BOM of each vehicle to be assembled, and acquire the chip configuration information of each vehicle to be assembled based on the design information; A chip BOM building module 702 is used to build a chip BOM based on chip configuration information. The chip BOM is used to record characteristic information and quantity information of each chip. The characteristic information is used for chip retrieval. The chip management module 703 is used to update the quantity information in the chip BOM based on the assembly information of the vehicle to be assembled, and determine the chip assembly plan based on the production schedule of the vehicle to be assembled and the updated quantity information.
[0047] The chip management device 700 provided in the above embodiment can implement the technical solution described in the above chip management method embodiment. The specific implementation principles of the above modules or units can refer to the corresponding contents in the above chip management method embodiment, which will not be repeated here.
[0048] The chip management device provided by the present invention obtains the design information of each vehicle to be assembled according to the whole vehicle BOM of the vehicle to be assembled, and obtains the chip configuration information of each vehicle to be assembled based on the design information of each vehicle to be assembled, constructs a chip BOM based on the chip configuration information, and records the characteristic information and quantity information of each chip, wherein the characteristic information can be used for chip retrieval; further, based on the assembly information of the vehicle to be assembled, the quantity information of each chip in the chip BOM can be updated, and the chip assembly plan can be determined based on the production schedule of the vehicle to be assembled and the updated quantity information, so as to ensure the whole vehicle production. The present invention provides a chip BOM that can realize automatic recording and management of chip information, and provides a chip retrieval function, so that chip management is simpler and the quality of chip information data is higher.
[0049] like Figure 8 As shown, the present invention also provides an electronic device 800. The electronic device 800 includes a processor 801, a memory 802 and a display 803. Figure 8 Only some components of the electronic device 800 are shown, but it should be understood that it is not required to implement all of the components shown, and more or fewer components may be implemented instead.
[0050] In some embodiments, the processor 801 may be a central processing unit (CPU), a microprocessor or other data processing chip, used to run program codes or process data stored in the memory 802, such as the chip management method of the present invention.
[0051] In some embodiments, the processor 801 may be a single server or a server group. The server group may be centralized or distributed. In some embodiments, the processor 801 may be local or remote. In some embodiments, the processor 801 may be implemented in a cloud platform. In some embodiments, the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an internal cloud, a multi-cloud, etc., or any combination thereof.
[0052] In some embodiments, the memory 802 may be an internal storage unit of the electronic device 800, such as a hard disk or memory of the electronic device 800. In other embodiments, the memory 802 may also be an external storage device of the electronic device 800, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc., equipped on the electronic device 800.
[0053] Furthermore, the memory 802 may include both an internal storage unit of the electronic device 800 and an external storage device. The memory 802 is used to store application software installed in the electronic device 800 and various data.
[0054] In some embodiments, the display 803 may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (Organic Light-Emitting Diode) touch device, etc. The display 803 is used to display information of the electronic device 800 and to display a visual user interface. The components 801-803 of the electronic device 800 communicate with each other via a system bus.
[0055] In some embodiments, when the processor 801 executes the chip management program in the memory 802, the following steps may be implemented: Acquire design information of each vehicle to be assembled based on the vehicle BOM of each vehicle to be assembled, and acquire chip configuration information of each vehicle to be assembled based on the design information; Build a chip BOM based on chip configuration information. The chip BOM is used to record the characteristic information and quantity information of each chip. The characteristic information is used for chip retrieval. Based on the assembly information of the vehicle to be assembled, the quantity information in the chip BOM is updated, and the chip assembly plan is determined based on the production schedule of the vehicle to be assembled and the updated quantity information.
[0056] It should be understood that: when the processor 801 executes the chip management program in the memory 802, in addition to the above functions, other functions can also be implemented. For details, please refer to the description of the corresponding method embodiment above.
[0057] Furthermore, the embodiment of the present invention does not specifically limit the type of the electronic device 800 mentioned, and the electronic device 800 may be a portable electronic device such as a mobile phone, a tablet computer, a personal digital assistant (PDA), a wearable device, a laptop computer, etc. Exemplary embodiments of portable electronic devices include but are not limited to portable electronic devices equipped with IOS, Android, Microsoft or other operating systems. The above-mentioned portable electronic devices may also be other portable electronic devices, such as a laptop computer with a touch-sensitive surface (e.g., a touch panel). It should also be understood that in some other embodiments of the present invention, the electronic device 800 may not be a portable electronic device, but a desktop computer with a touch-sensitive surface (e.g., a touch panel).
[0058] Correspondingly, an embodiment of the present invention also provides a computer-readable storage medium, which is used to store computer-readable programs or instructions. When the program or instructions are executed by a processor, it can implement the steps or functions of the chip management method provided in the above-mentioned method embodiments.
[0059] Those skilled in the art will appreciate that all or part of the processes of the above-mentioned embodiments can be implemented by instructing related hardware through a computer program, and the program can be stored in a computer-readable storage medium, wherein the computer-readable storage medium is a disk, an optical disk, a read-only storage memory, or a random access memory, etc.
[0060] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.
Claims
1. A chip management method, characterized in that: include: Acquire design information of each vehicle to be assembled based on the vehicle BOM of each vehicle to be assembled, and acquire chip configuration information of each vehicle to be assembled based on the design information; Building a chip BOM based on the chip configuration information, wherein the chip BOM is used to record characteristic information and quantity information of each chip, and the characteristic information is used for chip retrieval; Based on the assembly information of the vehicle to be assembled, the quantity information in the chip BOM is updated, and a chip assembly plan is determined based on the production schedule of the vehicle to be assembled and the updated quantity information.
2. The chip management method according to claim 1, characterized in that: The step of acquiring design information of the vehicle to be assembled based on the vehicle BOM of the vehicle to be assembled, and acquiring chip configuration information of the vehicle to be assembled based on the design information, includes: Determining controller configuration information of the vehicle to be assembled based on the vehicle BOM of the vehicle to be assembled; Chip configuration information in each controller is determined based on the controller configuration information.
3. The chip management method according to claim 1, characterized in that: The chip BOM is constructed based on the chip configuration information, and the chip BOM is used to record the characteristic information and quantity information of each chip, and the characteristic information is used for chip retrieval, including: Based on the chip configuration information, obtaining chip information of the chip installed in each controller in each of the vehicles to be installed, wherein the chip information includes characteristic information and quantity information of the chip; A chip BOM independent of the vehicle BOM is constructed, wherein the chip BOM is used to record characteristic information and quantity information of each chip, wherein the chip BOM is provided with a characteristic information retrieval function for retrieving the corresponding chip based on the characteristic information.
4. The chip management method according to claim 3, characterized in that: The updating of the quantity information in the chip BOM based on the assembly information of the vehicle to be assembled includes: Determine the total assembly quantity of each chip based on assembly information of each vehicle to be assembled in the production system; The quantity information of each chip in the chip BOM is updated based on the total assembly quantity of each chip.
5. The chip management method according to claim 4, characterized in that: The method of determining the total assembly quantity of each chip based on the assembly information of each vehicle to be assembled in the production system includes: The total assembly quantity of the target chip is calculated using a chip total assembly quantity calculation formula, wherein the target chip has target characteristic information, and the chip total assembly quantity calculation formula is: in, is the total assembly quantity of the target chip, M The number of models equipped with chips with target characteristic information, P The number of chips with target characteristic information used for a single vehicle model, Q is the assembly quantity of a single model, x% an assembly ratio of a target controller for assembling the chip having the target characteristic information, y% an assembly ratio of assembling the target chip for the target controller; The total number of chips required for a single vehicle model is calculated using the chip calculation formula for a single vehicle model. The chip calculation formula for a single vehicle model is: in, The total number of chips that need to be assembled for the target vehicle model, N The number of chip types that need to be installed for the target vehicle model, U The number of vehicles equipped with each chip, W is the production quantity of the target model, i% is the proportion of each controller in the bicycle, j% is the proportion of each chip in each controller.
6. The chip management method according to claim 5, characterized in that: The updating of the quantity information in the chip BOM based on the assembly information of the vehicle to be assembled includes: The inventory quantity of each chip in the chip BOM is updated based on the usage quantity of each chip and the quantity information in the chip BOM.
7. The chip management method according to claim 6, characterized in that: The step of determining a chip assembly plan based on the production schedule of the vehicle to be assembled and the updated quantity information includes: Calculating the total required quantity of the target chips based on the production schedule of the vehicle to be assembled and the target quantity of chips used by the vehicle to be assembled; When the total demand quantity of the target chip is greater than the inventory quantity of the target chip in the chip BOM, a candidate chip is used to replace the target chip, wherein the candidate chip has the same function as the target chip.
8. A chip management device, characterized in that: include: A chip configuration information acquisition module, used to acquire design information of each vehicle to be assembled based on the vehicle BOM of each vehicle to be assembled, and to acquire chip configuration information of each vehicle to be assembled based on the design information; A chip BOM building module, used to build a chip BOM based on the chip configuration information, wherein the chip BOM is used to record the characteristic information and quantity information of each chip, and the characteristic information is used for chip retrieval; The chip management module is used to update the quantity information in the chip BOM based on the assembly information of the vehicle to be assembled, and determine the chip assembly plan based on the production schedule of the vehicle to be assembled and the updated quantity information.
9. An electronic device, characterized in that: comprising a memory and a processor, wherein: The memory is used to store programs; The processor is coupled to the memory and is used to execute the program stored in the memory to implement the steps of the chip management method described in any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that: Used to store computer-readable programs or instructions, which, when executed by a processor, can implement the steps of the chip management method described in any one of claims 1 to 7.
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