A flip chip mounting device, system and method

Abstract

The application provides a flip-chip mounting device, comprising a linear module, a rotary motor installed on the linear module, a turnover head connected with the rotary motor through a rotating shaft, a voice coil motor fixing seat, an air nozzle lifting plate and an air nozzle fixing seat included in the turnover head, the voice coil motor fixing seat being fixed with the rotating shaft, the voice coil motor fixing seat being connected with the air nozzle lifting plate through a cross roller linear guide rail, the air nozzle lifting plate being fixed with the air nozzle fixing seat, a voice coil motor being installed in the voice coil motor fixing seat, a moving head of the voice coil motor being fixed with the air nozzle lifting plate, an air nozzle extending along a height direction being installed in the air nozzle fixing seat, and the air nozzle lifting plate driving the air nozzle fixing seat and the air nozzle to reciprocate along the height direction when the moving head of the voice coil motor drives the air nozzle lifting plate to reciprocate along the height direction. The application improves the control precision of the chip mounting force.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, and particularly relates to a chip flip mounting device, a chip flip mounting system and a chip flip mounting method. BACKGROUND

[0002] Chip mounting in a semiconductor industry packaging process is a key link of chip packaging. Common chip mounting includes chip upright mounting and chip flip mounting.

[0003] Chip upright mounting is to mount a chip back on a PCB, as shown in FIG. 1. A pin J is punched on a front surface of a chip D, and the chip D is mounted on a PCB P with the chip back facing up, and the pin J is connected to the PCB P through a wire W. Figure 1

[0004] Chip flip mounting is to mount a chip front surface on a PCB, as shown in FIG. 2. A pin J is punched on a front surface of a chip D, and the chip D is mounted on a PCB P with the chip back facing up, and the pin J is connected to the PCB P through a solder point S. Figure 2

[0005] Whether it is chip upright mounting or chip flip mounting, a chip is usually adsorbed by a mounting device, and then placed on a PCB for mounting.

[0006] In the prior art, a chip flip mounting device adsorbs a chip, and then flips the chip by 180°, and then places the chip on a PCB. However, in the process of placing the chip on the PCB, the stroke of a gas nozzle adsorbing the chip is difficult to control, and the mounting force is uncontrollable, which can easily cause the chip to be damaged during mounting, and the mounting precision is not high.

[0007] Moreover, the existing chip flip mounting device has a large structure and mass, which affects the running speed of the mounting device, thereby affecting the chip mounting speed, and leading to low chip mounting efficiency. SUMMARY

[0008] The present application provides a chip flip mounting device, a chip flip mounting system and a chip flip mounting method to solve the technical problem that the stroke of a gas nozzle adsorbing a chip is difficult to control, the mounting force is uncontrollable, the chip is easily damaged during mounting, and the mounting precision is not high.

[0009] One aspect of the present application is to provide a chip flip mounting device, which comprises a straight line module extending along a length direction;

[0010] A rotary motor is mounted on one side of the straight line module along a width direction; and the rotary motor is connected to a flipping head through a rotary shaft.

[0011] ​​The linear module is used to drive the rotary motor and the flip head to reciprocate along the length direction; the rotary motor is used to drive the flip head to rotate around the axis of the rotating shaft;

[0012] Wherein, the flip head at least includes a voice coil motor fixing seat, an air nozzle lifting plate and an air nozzle fixing seat;

[0013] The voice coil motor fixing seat is fixed to the rotating shaft, the voice coil motor fixing seat is connected to the air nozzle lifting plate via a cross roller linear guide, and the air nozzle lifting plate is fixed to the air nozzle fixing seat;

[0014] A voice coil motor is installed in the voice coil motor fixing seat; the moving head of the voice coil motor is fixed to the air nozzle lifting plate to drive the air nozzle lifting plate to reciprocate in the height direction;

[0015] An air nozzle extending in the height direction is installed in the air nozzle fixing seat; when the moving head of the voice coil motor drives the air nozzle lifting plate to reciprocate in the height direction, the air nozzle lifting plate drives the air nozzle fixing seat and the air nozzle to reciprocate in the height direction.

[0016] In a preferred embodiment, a first air extraction channel is provided in the voice coil motor fixing seat, one end of the first air extraction channel is connected to the air extraction port, and the other end of the first air extraction channel is provided with a first air port;

[0017] A second air extraction channel is provided in the air nozzle fixing seat, one end of the second air extraction channel is connected to the air nozzle, and a second air port is installed at the other end of the second air extraction channel;

[0018] The first air port and the second air port are connected via a ventilation hose.

[0019] In a preferred embodiment, a connecting plate is provided on one side of the linear module along the width direction, and the rotary motor is fixed on the connecting plate of the linear module;

[0020] A flip head detection sensor is installed on the connecting plate of the linear module; the flip head detection sensor is used to detect the rotation angle of the rotating shaft, thereby detecting the rotation angle of the flip head.

[0021] In a preferred embodiment, the output shaft of the rotating motor is connected to a coupling, the coupling is fixed to one end of the rotating shaft, and the other end of the rotating shaft is connected to the flip head; a bearing is installed on the outer periphery of the rotating shaft.

[0022] Another aspect of the present invention is to provide a flip chip mounting system, the mounting system comprising an upper mounting device and a lower mounting device arranged in a height direction;

[0023] The upper layer mounting device and the lower layer mounting device have the same structure, and both are a chip flip mounting device provided by the present invention.

[0024] Another aspect of the present invention is to provide a chip flip-chip method, which uses a chip flip-chip mounting system provided by the present invention to perform flip-chip mounting, comprising:

[0025] S1, the air nozzle of the lower placement device moves along the length direction to the top of the chip front;

[0026] S2, the air nozzle of the lower placement device moves downward in the height direction so that the air nozzle contacts the front of the chip, and the air nozzle of the lower placement device is vacuumed to absorb the front of the chip;

[0027] S3, the nozzle of the lower placement device rotates 180°, driving the chip to rotate 180°;

[0028] S4, the air nozzle of the upper placement device moves along the length direction to above the back side of the chip;

[0029] S5, the air nozzle of the upper placement device moves downward in the height direction so that the air nozzle contacts the back of the chip;

[0030] The air nozzle of the upper placement device draws vacuum to adsorb the back of the chip; the air nozzle of the lower placement device breaks the vacuum to release the adsorption on the front of the chip;

[0031] S6, the air nozzle of the upper placement device moves upward in the height direction, driving the chip upward, so that the chip leaves the air nozzle of the lower placement device;

[0032] S7, the air nozzle of the upper placement device moves along the length direction to the top of the PCB board, so that the front of the chip faces the PCB board;

[0033] The air nozzle of the upper placement device moves downward in the height direction, driving the chip downward so that the front side of the chip is placed on the PCB board.

[0034] In a preferred embodiment, in step S1, the linear module of the lower placement device drives the rotary motor and the flip head of the lower placement device to move along the length direction, so that the air nozzle of the lower placement device moves along the length direction to above the front surface of the chip;

[0035] In step S2, the flip head of the lower layer placement device drives the air nozzle of the lower layer placement device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the lower layer placement device contacts the front surface of the chip;

[0036] The vacuum generator vacuums the exhaust port of the lower mounting device, and vacuums the air nozzle of the lower mounting device through the first exhaust channel, the first air port, the ventilation hose, the second air port and the second exhaust channel. The air nozzle of the lower mounting device adsorbs the front of the chip.

[0037] In a preferred embodiment, in step S3, the rotating motor of the lower-layer mounting device drives the flip head of the lower-layer mounting device to rotate 180° around the axis of the rotation shaft, and the flip head of the lower-layer mounting device drives the air nozzle of the lower-layer mounting device to rotate 180°, so that the chip rotates 180°.

[0038] In a preferred embodiment, in step S4, the linear module of the upper placement device drives the rotary motor and the flip head of the upper placement device to move along the length direction, so that the air nozzle of the upper placement device moves along the length direction to above the back side of the chip;

[0039] In step S5, the flip head of the upper placement device drives the air nozzle of the upper placement device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the upper placement device contacts the back side of the chip;

[0040] The vacuum generator evacuates the air outlet of the upper placement device, and evacuates the air nozzle of the upper placement device through the first air extraction channel, the first air port, the ventilation hose, the second air port, and the second air extraction channel. The air nozzle of the upper placement device adsorbs the back of the chip.

[0041] The vacuum generator breaks the vacuum at the exhaust port of the lower placement device, and the air nozzle of the lower placement device breaks the vacuum to release the adsorption on the front side of the chip.

[0042] In a preferred embodiment, in step S6, the flip head of the upper placement device drives the air nozzle of the upper placement device upward in the height direction through the moving head of the voice coil motor, driving the chip upward, so that the chip leaves the air nozzle of the lower placement device;

[0043] In step S7, the linear module of the upper placement device drives the rotary motor and the flip head of the upper placement device to move along the length direction, driving the air nozzle of the upper placement device to move along the length direction to above the PCB board so that the front of the chip faces the PCB board;

[0044] The flip head of the upper placement device drives the air nozzle of the upper placement device to move downward in the height direction through the moving head of the voice coil motor, driving the chip downward so that the front side of the chip can be placed on the PCB board.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] The present invention proposes a chip flip-chip mounting device, system and chip flip-chip mounting method, wherein the flip head adopts a voice coil motor fixing seat, and the air nozzle lifting plate is connected by a cross-roller linear guide rail, the air nozzle lifting plate is fixed to the air nozzle fixing seat, and the voice coil motor is installed in the voice coil motor fixing seat of the flip head, the moving head of the voice coil motor is fixed to the air nozzle lifting plate, and the air nozzle is installed in the air nozzle fixing seat, and the movement stroke of the air nozzle in the height direction is controlled by the voice coil motor, and the movement stroke of the air nozzle in the height direction is reduced, thereby reducing the movement space of the air nozzle in the height direction, improving the control accuracy of the chip mounting force, and reducing the damage to the chip during mounting, while making the overall structure of the mounting device smaller and more compact, the mounting device runs fast, the chip mounting speed is fast, and the chip mounting efficiency is high.

[0047] The present invention proposes a chip flip-chip mounting device, system and chip flip-chip mounting method. Since a voice coil motor is used to control the movement stroke of an air nozzle in the height direction, the movement space of the air nozzle in the height direction is relatively small. A first air exhaust channel is opened in the voice coil motor fixing seat, and a second air exhaust channel is opened in the air nozzle fixing seat. The first air exhaust channel and the second air exhaust channel are connected through a first air port, a second air port, and a ventilation hose between the first air port and the second air port. A gas passage is cleverly provided between the voice coil motor fixing seat and the air nozzle fixing seat to avoid adding an additional gas pipeline for vacuuming the air nozzle, thereby effectively avoiding interference between the gas pipeline of the lower-layer mounting device and the flip head of the upper-layer mounting device during the rotation of the flip head of the lower-layer mounting device.

[0048] The present invention proposes a chip flip-chip mounting device, system and chip flip-chip mounting method. The air nozzle stroke for adsorbing the chip is controllable, and the mounting force is controllable, which effectively reduces chip damage during mounting, has high mounting accuracy, and the overall structure of the mounting device is more compact. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0050] Figure 1 This is a schematic diagram of the chip's structure.

[0051] Figure 2 It is a schematic diagram of the chip flip chip structure.

[0052] Figure 3 The present invention is a front view schematic diagram of the arrangement of an upper layer mounting device and a lower layer mounting device of a flip chip mounting system.

[0053] Figure 4 It is a structural schematic diagram of a chip flip-chip mounting device of the present invention.

[0054] Figure 5 yes Figure 4 Cross-sectional view in the AA direction.

[0055] Figure 6 This is an enlarged view of the flip head of the present invention ( Figure 5 (enlarged view of the dotted circle in the middle).

[0056] Figure 7 It is a schematic diagram showing the air nozzle of the lower layer mounting device of the present invention moving to the top of the chip front surface.

[0057] Figure 8 It is a schematic diagram of the front side of the chip being adsorbed by the air nozzle of the lower layer mounting device of the present invention.

[0058] Figure 9 It is a schematic diagram of the air nozzle of the lower layer mounting device of the present invention driving the chip to rotate 180 degrees.

[0059] Figure 10 It is a schematic diagram showing the air nozzle of the upper mounting device of the present invention moving to the top of the back side of the chip.

[0060] Figure 11 It is a schematic diagram of the air nozzle of the upper layer mounting device of the present invention adsorbing the back side of the chip.

[0061] Figure 12 It is a schematic diagram of the air nozzle of the chip leaving the lower layer mounting device of the present invention.

[0062] Figure 13 It is a schematic diagram of mounting the front side of the chip of the present invention on the PCB board. DETAILED DESCRIPTION

[0063] In order to make the above and other features and advantages of the present invention more clear, the present invention is further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art and are only exemplary and not restrictive.

[0064] Combine Figures 1 to 6 According to an embodiment of the present invention, a flip chip mounting system includes an upper mounting device T1 and a lower mounting device T2 arranged along a height direction.

[0065] like Figure 3 As shown, a flip-chip placement system of the present invention is arranged along the height direction with an upper placement device T1 and a lower placement device T2. The upper placement device T1 is fixed to the mounting plate M, and the lower placement device T2 is fixed to the mounting plate M. The upper placement device T1 is located directly above the lower placement device T2.

[0066] The upper and lower mounting devices T1 and T2 of a flip-chip placement system of the present invention have the same structure, and both employ the flip-chip placement device provided by the present invention. The upper and lower mounting devices T1 and T2 have the same structure, and the flip-chip placement device provided by the present invention will be described below using the lower mounting device T2 as an example.

[0067] Combine Figures 4 to 6 According to an embodiment of the present invention, a flip-chip mounting device is provided. In order to make the present invention more clearly described, the length direction, width direction and height direction that are orthogonal to each other are defined, such as Figure 4 and Figure 5 shown.

[0068] The present invention provides a flip chip placement device, comprising a linear module 1 extending in the longitudinal direction. A rotary motor 3 is mounted on one side of the linear module 1 in the width direction. The rotary motor 3 is connected to a flip head 7 via a rotary shaft 6.

[0069] The linear module 1 is used to drive the rotary motor 3 and the flip head 7 to reciprocate along the length direction. The rotary motor 3 is used to drive the flip head 7 to rotate around the axis of the rotating shaft 6 (such as Figure 4 (as indicated by arrow a).

[0070] Specifically, a connecting plate 2 is provided on one side of the linear module 1 along the width direction, and the rotary motor 3 (rotary motor 3 body) is fixed on the connecting plate 2 of the linear module 1 .

[0071] The output shaft of the rotary motor 3 is connected to the coupling 4 . The coupling 4 is fixed to one end of the rotary shaft 6 . The other end of the rotary shaft 6 is connected to the flip head 7 .

[0072] Furthermore, a bearing 8 is installed on the outer periphery of the rotating shaft 6 , and the bearing 8 is fixed on the connecting plate 2 of the linear module 1 through the bearing seat 5 .

[0073] A flip head detection sensor 9 is mounted on the connecting plate 2 of the linear module 1. The flip head detection sensor 9 is used to detect the rotation angle of the rotating shaft 6, thereby detecting the rotation angle of the flip head 7.

[0074] Combine Figures 4 to 6 According to an embodiment of the present invention, the flip head 7 at least includes a voice coil motor fixing seat 701 , an air nozzle lifting plate 702 and an air nozzle fixing seat 704 .

[0075] The voice coil motor fixing seat 701 is fixed to the rotating shaft 6 , so that the rotating motor 3 is connected to the flip head 7 through the rotating shaft 6 .

[0076] The voice coil motor fixing seat 701 and the air nozzle lifting plate 702 are connected through a cross roller linear guide 703. Figure 4 As shown. The air nozzle lifting plate 702 is fixed to the air nozzle fixing seat 704. Figure 4 、 Figure 5 and Figure 6 shown.

[0077] like Figure 5 and Figure 6 As shown, according to an embodiment of the present invention, a voice coil motor 707 is installed in a voice coil motor fixing seat 701; a moving head 7071 of the voice coil motor 707 is fixed to the air nozzle lifting plate 702 to drive the air nozzle lifting plate 702 to reciprocate along the height direction.

[0078] Specifically, the base of the voice coil motor 707 is fixed to the voice coil motor fixing seat 701 , and the moving head 7071 of the voice coil motor 707 is fixed to the air nozzle lifting plate 702 .

[0079] According to an embodiment of the present invention, an air nozzle 705 extending in the height direction is installed in the air nozzle fixing seat 704. When the moving head 7071 of the voice coil motor 707 drives the air nozzle lifting plate 702 to reciprocate in the height direction, the air nozzle lifting plate 702 drives the air nozzle fixing seat 704 and the air nozzle 705 to reciprocate in the height direction. Figure 6 shown.

[0080] The flip head 7 of the present invention utilizes a voice coil motor mounting base 701 and a nozzle lift plate 702 connected via a cross-roller linear guide 703. The nozzle lift plate 702 is fixed to the nozzle mounting base 704. A voice coil motor 707 is mounted within the voice coil motor mounting base 701. A moving head 7071 of the voice coil motor 707 is fixed to the nozzle lift plate 702. An air nozzle 705 is mounted within the air nozzle mounting base 704. The moving head 7071 of the voice coil motor 707 controls the vertical travel of the air nozzle 705. Because the moving head 7071 of the voice coil motor 707 has a relatively small travel distance, the vertical travel of the air nozzle 705 is reduced, thereby reducing the vertical travel space of the air nozzle 705. The present invention utilizes the small travel distance of the moving head 7071 of the voice coil motor 707 to reduce the vertical travel of the air nozzle 705, thereby reducing the pressing force of the air nozzle 705 on the chip, improving the control accuracy of the chip placement force, and reducing chip damage during placement.

[0081] The flip head 7 of the present invention adopts a voice coil motor fixing seat 701 and an air nozzle lifting plate 702 connected by a cross roller linear guide 703. The air nozzle lifting plate 702 is fixed to the air nozzle fixing seat 704. A voice coil motor 707 is installed in the voice coil motor fixing seat 701. The moving head 7071 of the voice coil motor 707 is fixed to the air nozzle lifting plate 702. The air nozzle 705 is installed in the air nozzle fixing seat 704. The moving head 7071 of the voice coil motor 707 controls the movement stroke of the air nozzle 705 in the height direction, so that the overall structure of the mounting device is reduced and the overall structure of the mounting device is more compact.

[0082] like Figure 4 and Figure 6 As shown, according to an embodiment of the present invention, a first air extraction channel 7011 is opened in the voice coil motor fixing seat 701 , one end of the first air extraction channel 7011 is connected to the air extraction port 706 , and the other end of the first air extraction channel 7011 is installed with a first air port 708 .

[0083] A second air extraction channel 7041 is provided in the air nozzle fixing base 704. One end of the second air extraction channel 7041 is connected to the air nozzle 705, and the other end of the second air extraction channel 7041 is provided with a second air port 709. The first air port 708 and the second air port 709 are connected by an air hose (not shown).

[0084] When the moving head 7071 of the voice coil motor 707 drives the air nozzle lifting plate 702 to reciprocate along the height direction, the air nozzle lifting plate 702 drives the air nozzle fixing seat 704 and the air nozzle 705 to reciprocate along the height direction. During the reciprocating movement of the air nozzle fixing seat 704 along the height direction, relative movement occurs between the first air port 708 and the second air port 709.

[0085] When the vacuum port 706 is evacuated, the air nozzle 705 is evacuated through the first air extraction channel 7011, the first air port 708, the ventilation hose (not shown in the figure), the second air port 709 and the second air extraction channel 704, so that the air nozzle 705 adsorbs the chip.

[0086] Since the present invention adopts the voice coil motor 707 to control the movement stroke of the air nozzle 705 in the height direction, the movement space of the air nozzle 705 in the height direction is relatively small. By opening a first air exhaust channel 7011 in the voice coil motor fixing seat 701 and a second air exhaust channel 7041 in the air nozzle fixing seat 704, the first air exhaust channel 7011 and the second air exhaust channel 7041 are connected through the first air port 708, the second air port 709, and the ventilation hose between the first air port 708 and the second air port 709. A gas passage is cleverly provided between the voice coil motor fixing seat 701 and the air nozzle fixing seat 704, avoiding the addition of an additional gas pipeline for vacuuming the air nozzle 705, thereby effectively avoiding the gas pipeline of the lower-layer mounting device T2 from interfering with the flip head 7 of the upper-layer mounting device T1 during the rotation of the flip head 7 of the lower-layer mounting device T2.

[0087] Combine Figure 3 、 Figures 7 to 13 According to an embodiment of the present invention, a method for flip-chip mounting is provided, wherein a flip-chip mounting system provided by the present invention is used to perform flip-chip mounting, comprising:

[0088] In step S1 , the air nozzle 705 of the lower layer placement device T2 moves along the length direction to above the front surface of the chip D.

[0089] Specifically, the pin J is punched on the front of the chip D. The linear module 1 of the lower placement device T2 drives the rotary motor 3 and the flip head 7 of the lower placement device T2 to move along the length direction, so that the air nozzle 705 of the lower placement device T2 moves along the length direction to the top of the front of the chip D, as shown in FIG. Figure 7 shown

[0090] In step S2 , the air nozzle 705 of the lower placement device T2 moves downward in the height direction so that the air nozzle 705 contacts the front surface of the chip D, and the air nozzle 705 of the lower placement device T2 is vacuumed to absorb the front surface of the chip D.

[0091] Specifically, the flip head 7 of the lower-layer mounting device T2 drives the air nozzle fixing seat 704 and the air nozzle 705 of the lower-layer mounting device T2 to move downward in the height direction through the moving head 7071 of the voice coil motor 707, so that the air nozzle 705 of the lower-layer mounting device T2 contacts the front of the chip D.

[0092] The vacuum generator (not shown in the figure) evacuates the exhaust port 706 of the lower mounting device T2, and evacuates the air nozzle 705 of the lower mounting device T2 through the first exhaust channel 7011, the first air port 708, the ventilation hose, the second air port 709 and the second exhaust channel 7041 of the lower mounting device T2. The air nozzle 705 of the lower mounting device T2 adsorbs the front surface of the chip D. Figure 8 shown.

[0093] Step S3: The air nozzle 705 of the lower placement device T2 rotates 180°, driving the chip D to rotate 180°.

[0094] Specifically, the rotary motor 3 of the lower placement device T2 drives the flip head 7 of the lower placement device T2 to rotate 180° around the axis of the rotation shaft 6. The flip head 7 of the lower placement device T2 drives the air nozzle 705 of the lower placement device T2 to rotate 180°, so that the chip D rotates 180°. Figure 9 shown.

[0095] When the flip head 7 of the lower-layer mounting device T2 drives the air nozzle 705 of the lower-layer mounting device T2 to rotate 180°, the flip head detection sensor 9 of the lower-layer mounting device T2 detects the rotation angle of the rotating shaft 6 of the lower-layer mounting device T2, thereby detecting the rotation angle of the flip head 7, and further detecting the rotation angle of the air nozzle 705.

[0096] Step S4: The air nozzle 705 of the upper placement device T1 moves along the length direction to above the back surface of the chip D.

[0097] Specifically, the linear module 1 of the upper placement device T1 drives the rotary motor 3 and the flip head 7 of the upper placement device T1 to move along the length direction, so that the air nozzle 705 of the upper placement device T1 moves along the length direction to the top of the back of the chip D, as shown in FIG. Figure 10 shown.

[0098] Step S5: The air nozzle 705 of the upper placement device T1 moves downward in the height direction so that the air nozzle 705 contacts the back surface of the chip D;

[0099] The air nozzle 705 of the upper placement device T1 draws vacuum to adsorb the back of the chip D; the air nozzle 705 of the lower placement device T2 breaks the vacuum to release the adsorption on the front of the chip D.

[0100] Specifically, the flip head 7 of the upper placement device T1 drives the air nozzle fixing seat 704 and the air nozzle 705 of the upper placement device T1 to move downward in the height direction through the moving head 7071 of the voice coil motor 707, so that the air nozzle 705 of the upper placement device T1 contacts the back of the chip D.

[0101] The vacuum generator (not shown in the figure) evacuates the air outlet 706 of the upper mounting device T1, and evacuates the air nozzle 705 of the upper mounting device T1 through the first air extraction channel 7011, the first air outlet 708, the ventilation hose, the second air outlet 709 and the second air extraction channel 7041 of the upper mounting device T1. The air nozzle 705 of the upper mounting device T1 adsorbs the back of the chip D. Figure 11 shown.

[0102] The vacuum generator (not shown) breaks the vacuum in the exhaust port 706 of the lower placement device T2, and the air nozzle 705 of the lower placement device T2 breaks the vacuum, releasing the adsorption on the front surface of the chip D.

[0103] Step S6: The air nozzle 705 of the upper placement device T1 moves upward in the height direction, driving the chip D to move upward, so that the chip D leaves the air nozzle 705 of the lower placement device T2.

[0104] Specifically, the flip head 7 of the upper placement device T1 drives the air nozzle fixing seat 704 and the air nozzle 705 of the upper placement device T1 to move upward in the height direction through the moving head 7071 of the voice coil motor 707, driving the chip D to move upward, so that the chip D leaves the air nozzle 705 of the lower placement device T2. Figure 12 shown.

[0105] After the chip D leaves the air nozzle 705 of the lower placement device T2, the flip head 7 of the lower placement device T2 is reset.

[0106] Specifically, the rotating motor 3 of the lower-layer mounting device T2 drives the flip head 7 of the lower-layer mounting device T2 to rotate 180° in the opposite direction around the axis of the rotating shaft 6, and the flip head 7 of the lower-layer mounting device T2 drives the air nozzle 705 of the lower-layer mounting device T2 to rotate 180° in the opposite direction.

[0107] When the flip head 7 of the lower-layer mounting device T2 drives the air nozzle 705 of the lower-layer mounting device T2 to rotate 180° in the opposite direction, the flip head detection sensor 9 of the lower-layer mounting device T2 detects the rotation angle of the rotating shaft 6 of the lower-layer mounting device T2, thereby detecting the rotation angle of the flip head 7, and further detecting the rotation angle of the air nozzle 705.

[0108] Afterwards, the flip head 7 of the lower-layer mounting device T2 drives the air nozzle fixing seat 704 and the air nozzle 705 of the lower-layer mounting device T2 to move upward in the height direction through the moving head 7071 of the voice coil motor 707, so that the air nozzle fixing seat 704 and the air nozzle 705 of the lower-layer mounting device T2 are reset.

[0109] In step S7 , the air nozzle 705 of the upper placement device T1 moves along the length direction to above the PCB board P, so that the front of the chip D faces the PCB board P.

[0110] The air nozzle 705 of the upper placement device T1 moves downward in the height direction, driving the chip D to move downward, so that the front surface of the chip D is placed on the PCB board P.

[0111] Specifically, the linear module 1 of the upper placement device T1 drives the rotary motor 3 and the flip head 7 of the upper placement device T1 to move along the length direction, driving the air nozzle 705 of the upper placement device T1 to move along the length direction to above the PCB board P, so that the front of the chip D faces the PCB board P.

[0112] The flip head 7 of the upper placement device T1 drives the air nozzle fixing seat 704 and the air nozzle 705 of the upper placement device T1 to move downward in the height direction through the moving head 7071 of the voice coil motor 707, driving the chip D to move downward, so that the front side of the chip D is placed on the PCB board P.

[0113] When the front side of chip D is mounted on PCB P, the flip head 7 of the upper mounting device T1 applies a mounting force to the chip D adsorbed by the air nozzle 705 of the upper mounting device T1 through the moving head 7071 of the voice coil motor 707, so that the pin J on the front side of chip D is connected to the solder joint S on PCB P, thereby completing the flip-chip mounting of chip D.

[0114] In the above embodiment, a chip flip-chip mounting system has two layers of mounting devices arranged along the height direction, namely an upper mounting device T1 and a lower mounting device T2. It should be understood that the above embodiment is only exemplary. In some embodiments, a chip flip-chip mounting system of the present invention has more layers of mounting devices arranged along the height direction. The mounting device on the lower layer rotates the adsorbed chip D 180° and transfers it to the mounting device on the upper layer. The front surface of the chip D is then mounted on the PCB board P by the mounting device on the upper layer.

[0115] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A flip chip placement device, characterized in that: The mounting device includes a linear module extending along the length direction; A rotary motor is installed on one side of the linear module along the width direction; the rotary motor is connected to a flip head via a rotating shaft; The linear module is used to drive the rotary motor and the flip head to reciprocate along the length direction; the rotary motor is used to drive the flip head to rotate around the axis of the rotating shaft; Wherein, the flip head at least includes a voice coil motor fixing seat, an air nozzle lifting plate and an air nozzle fixing seat; The voice coil motor fixing seat is fixed to the rotating shaft, the voice coil motor fixing seat is connected to the air nozzle lifting plate via a cross roller linear guide, and the air nozzle lifting plate is fixed to the air nozzle fixing seat; A voice coil motor is installed in the voice coil motor fixing seat; the moving head of the voice coil motor is fixed to the air nozzle lifting plate to drive the air nozzle lifting plate to reciprocate in the height direction; An air nozzle extending in the height direction is installed in the air nozzle fixing seat; when the moving head of the voice coil motor drives the air nozzle lifting plate to reciprocate in the height direction, the air nozzle lifting plate drives the air nozzle fixing seat and the air nozzle to reciprocate in the height direction.

2. The mounting device according to claim 1, wherein: A first air extraction channel is provided in the voice coil motor fixing seat, one end of the first air extraction channel is connected to the air extraction port, and the other end of the first air extraction channel is provided with a first air port; A second air extraction channel is provided in the air nozzle fixing seat, one end of the second air extraction channel is connected to the air nozzle, and a second air port is installed at the other end of the second air extraction channel; The first air port and the second air port are connected via a ventilation hose.

3. The mounting device according to claim 1, wherein: A connecting plate is provided on one side of the linear module along the width direction, and the rotary motor is fixed on the connecting plate of the linear module; A flip head detection sensor is installed on the connecting plate of the linear module; the flip head detection sensor is used to detect the rotation angle of the rotating shaft, thereby detecting the rotation angle of the flip head.

4. The mounting device according to claim 1, wherein: The output shaft of the rotating motor is connected to a coupling, the coupling is fixed to one end of the rotating shaft, and the other end of the rotating shaft is connected to the flip head; a bearing is installed on the outer periphery of the rotating shaft.

5. A flip chip placement system, characterized in that: The placement system includes an upper placement device and a lower placement device arranged in a height direction; The upper layer mounting device and the lower layer mounting device have the same structure and are both a flip chip mounting device as claimed in any one of claims 1 to 4.

6. A chip flipping method, characterized in that: The method uses the flip-chip mounting system of claim 5 to perform flip-chip mounting, comprising: S1, the air nozzle of the lower placement device moves along the length direction to the top of the chip front; S2, the air nozzle of the lower placement device moves downward in the height direction so that the air nozzle contacts the front of the chip, and the air nozzle of the lower placement device is vacuumed to absorb the front of the chip; S3, the nozzle of the lower placement device rotates 180°, driving the chip to rotate 180°; S4, the air nozzle of the upper placement device moves along the length direction to above the back side of the chip; S5, the air nozzle of the upper placement device moves downward in the height direction so that the air nozzle contacts the back of the chip; The air nozzle of the upper placement device draws vacuum to adsorb the back of the chip; the air nozzle of the lower placement device breaks the vacuum to release the adsorption on the front of the chip; S6, the air nozzle of the upper placement device moves upward in the height direction, driving the chip upward, so that the chip leaves the air nozzle of the lower placement device; S7, the air nozzle of the upper placement device moves along the length direction to the top of the PCB board, so that the front of the chip faces the PCB board; The air nozzle of the upper placement device moves downward in the height direction, driving the chip downward so that the front side of the chip is placed on the PCB board.

7. The method according to claim 6, characterized in that In step S1, the linear module of the lower placement device drives the rotary motor and the flip head of the lower placement device to move along the length direction, so that the air nozzle of the lower placement device moves along the length direction to above the front surface of the chip; In step S2, the flip head of the lower layer placement device drives the air nozzle of the lower layer placement device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the lower layer placement device contacts the front surface of the chip; The vacuum generator vacuums the exhaust port of the lower mounting device, and vacuums the air nozzle of the lower mounting device through the first exhaust channel, the first air port, the ventilation hose, the second air port and the second exhaust channel. The air nozzle of the lower mounting device adsorbs the front of the chip.

8. The method according to claim 6, characterized in that In step S3, the rotary motor of the lower placement device drives the flip head of the lower placement device to rotate 180° around the axis of the rotation shaft. The flip head of the lower placement device drives the air nozzle of the lower placement device to rotate 180°, so that the chip rotates 180°.

9. The method according to claim 6, characterized in that In step S4, the linear module of the upper placement device drives the rotary motor and the flip head of the upper placement device to move along the length direction, so that the air nozzle of the upper placement device moves along the length direction to above the back side of the chip; In step S5, the flip head of the upper placement device drives the air nozzle of the upper placement device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the upper placement device contacts the back side of the chip; The vacuum generator evacuates the air outlet of the upper placement device, and evacuates the air nozzle of the upper placement device through the first air extraction channel, the first air port, the ventilation hose, the second air port, and the second air extraction channel. The air nozzle of the upper placement device adsorbs the back of the chip. The vacuum generator breaks the vacuum at the exhaust port of the lower placement device, and the air nozzle of the lower placement device breaks the vacuum to release the adsorption on the front side of the chip.

10. The method according to claim 6, characterized in that In step S6, the flip head of the upper placement device drives the air nozzle of the upper placement device upward in the height direction through the moving head of the voice coil motor, driving the chip upward, so that the chip leaves the air nozzle of the lower placement device; In step S7, the linear module of the upper placement device drives the rotary motor and the flip head of the upper placement device to move along the length direction, driving the air nozzle of the upper placement device to move along the length direction to above the PCB board so that the front of the chip faces the PCB board; The flip head of the upper placement device drives the air nozzle of the upper placement device to move downward in the height direction through the moving head of the voice coil motor, driving the chip downward so that the front side of the chip can be placed on the PCB board.

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