Semiconductor material cutting device

Abstract

The present invention relates to a semiconductor material cutting device for cutting a semiconductor strip into individual semiconductor packages, and more particularly, to a semiconductor material cutting device for cutting semiconductor strips into individual semiconductor packages. Each of the sucker table, the drying block, the stacking table, the unit picker and the stacking table picker is provided with a sub-suite and a suite, wherein an air compression pipeline is formed in the sub-suite, and the suite is provided with a plurality of adsorption holes communicated with the sub-suite and is detachably installed on the sub-suite. The device further comprises a supply part for supplying the semiconductor material or supplying or recovering each kit and an injection rail for transferring the semiconductor material or the kit supplied from the supply part, the strip picker does not participate in the supply and recovery of the kit, and the unit picker is movably arranged between the injection rail and the drying block. The package is supplied or recovered to the injection rail, the suction cup table or the drying block, and the stacking table picker is movably arranged between the drying block and the stacking table and supplies or recovers the package to the drying block or the stacking table. According to the present invention, it is possible to automatically supply and collect kits such as a chuck table, a unit pick-up, a drying block, a stacking table pick-up, and a stacking table.

Description

Technical Field

[0001] The present invention relates to a semiconductor material cutting device for cutting semiconductor strips into individual semiconductor packages, and more particularly, to a semiconductor material cutting device that can automatically supply and recover a set of suction cup tables, unit pickers, drying blocks, stacking platform pickers, stacking platforms, etc. Background Art

[0002] A semiconductor material cutting device is a device that cuts packaged semiconductor strips into individual semiconductor packages. In addition to the simple process of cutting the semiconductor strips, it also performs a series of processes for cleaning and drying the cut semiconductor packages, and then classifying semiconductor packages with defects by inspecting the upper and lower surfaces. As a prior patent for this type of semiconductor material cutting device, there is Korean Publication Patent No. 10-2017-0026751 (hereinafter referred to as "Patent Document 1").

[0003] In the existing semiconductor material cutting device disclosed in Patent Document 1, in order to carry out subsequent processes on the cut semiconductor package, a suction cup table, a unit picker, a drying block, a stacking table, a stacking table picker, etc. adsorb the semiconductor strip or semiconductor package or transfer and convey it in an adsorbed state.

[0004] However, the semiconductor strips cut in the semiconductor material cutting device can have many types (Ball Grid Array (BGA), Land Grid Array (LGA), Quad Flat No-lead Package (QFN), etc.) and sizes according to their uses, and can be divided into various forms according to their functions. Therefore, the cut semiconductor packages also have various types, sizes, forms, etc. Therefore, in order to be able to process the above-mentioned semiconductor packages, it is necessary to perform the operation of replacing the kit for adsorbing the semiconductor package on the suction cup table, unit pickup, drying block, stacking table, stacking table pickup, etc. according to their types, sizes, forms, etc.

[0005] In the prior art, since the operator performs the kit replacement operation manually, the operator's mistake may cause the kit to be installed in the wrong way, which not only takes a long time to replace the kit, but also is cumbersome to manually replace the kit, and the accuracy of the kit installation is reduced, which may cause poor cutting.

[0006] Therefore, there is an urgent need to provide a semiconductor material cutting device that can shorten the time of kit replacement operations by automatically supplying and recovering kits of a suction cup table, a unit pickup, a drying block, a stacking table pickup, a stacking table, etc., thereby minimizing defects in semiconductor packages caused by incorrect kit installation.

[0007] Prior Art Literature

[0008] Patent Literature

[0009] Patent Document 1: Korean Publication of Invention Patent No. 10-2017-0026751 Summary of the invention

[0010] Technical issues

[0011] The object of the present invention is to provide a semiconductor material cutting device which can automatically supply and recover a set of a suction cup table, a unit picker, a drying block, a stacking table picker, a stacking table, etc.

[0012] Furthermore, the present invention aims to provide a semiconductor material cutting device that does not require additional structures and spaces when automatically supplying and recovering the kit, but can utilize a pickup already configured in the device to automatically supply or recover the kit.

[0013] Technical Solution

[0014] In order to solve the technical problem, a semiconductor material cutting device is provided, which includes: a suction cup table for fixing the semiconductor material to be cut into semiconductor packages; a drying block for drying the cut semiconductor packages; a stacking table for placing the dried semiconductor packages; a strip picker for picking up the semiconductor material to be cut and transferring it to the suction cup table; a unit picker for picking up the cut semiconductor packages in the suction cup table and transferring them to the drying block; and a stacking table picker for picking up the dried semiconductor packages in the drying block and transferring them to the stacking table, wherein the suction cup table, the drying block, the stacking table, the unit picker and the stacking table picker are They each have a sub-kit and a kit, the sub-kit is formed with an air pressure pipeline, the kit is formed with a plurality of adsorption holes connected to the sub-kit, and can be detachably installed on the sub-kit, and also include: a supply unit, which supplies the semiconductor material, or supplies or recovers each kit; and an entry rail, which transfers the semiconductor material or kit supplied from the supply unit, the unit picker can be movably arranged between the entry rail and the drying block, and supplies or recovers the kit to the entry rail, the suction cup table or the drying block, and the stacking platform picker can be movably arranged between the drying block and the stacking platform, and supplies or recovers the kit to the drying block or the stacking platform.

[0015] In addition, a semiconductor material cutting device is provided, which includes: a suction cup table, which fixes the semiconductor material to be cut into semiconductor packages; a drying block, which dries the cut semiconductor packages; a stacking table, which places the dried semiconductor packages; a strip picker, which picks up the semiconductor material to be cut and transfers it to the suction cup table; and a unit picker, which picks up the cut semiconductor packages in the suction cup table and transfers them to the drying block, wherein the suction cup table, the drying block, the stacking table and the unit picker respectively have a sub-assembly and a kit, wherein the sub-assembly is formed with an air pressure pipeline, and the kit is formed with a pressure pipe connected to the sub-assembly. The drying block is provided with a plurality of adsorption holes connected to each other and can be detachably mounted on the sub-kit, and also includes: a supply part for supplying the semiconductor material, or supplying or recovering each kit; and an entry rail for conveying the semiconductor material or kit supplied from the supply part, the unit picker is movably arranged between the entry rail and the drying block, and supplies or recovers the kit to the entry rail, the suction cup table or the drying block, the drying block is configured to be able to rotate in an upside-down manner, and can be moved to the upper part of the stacking platform, so that the drying block is reversed upside down and the kit is supplied or recovered on the stacking platform.

[0016] In which, a semiconductor material cutting device is provided, wherein the unit picker also includes a kit picker on one side, the kit picker supplies or recovers the kit to the entry rail and the suction cup table, and the sub-kit of the unit picker supplies or recovers the kit between the suction cup table and the drying block when the kit is removed.

[0017] In addition, a semiconductor material cutting device is provided, wherein the suction cup table is configured to be able to rotate in a clockwise direction or a counterclockwise direction on an XY plane, and when the suction cup table rotates in the same direction as the kit supplied to the rail, the kit picker picks up the kit transferred to the rail and transfers it to the suction cup table, and when the suction cup table rotates in the same direction as the sub-kit of the unit picker, the sub-kit of the unit picker picks up the kit transferred to the suction cup table.

[0018] In addition, a semiconductor material cutting device is provided, wherein the kit picker includes: a clamper for fixing or releasing the kit; and a positioning pin for being inserted into an insertion hole formed in the kit.

[0019] Among them, a semiconductor material cutting device is provided, wherein an escape groove is formed on the entry rail for allowing a clamper arranged on the kit picker to escape.

[0020] In addition, a semiconductor material cutting device is provided, wherein the unit picker includes: a first drive unit, which causes the kit picker to be raised and lowered; and a second drive unit, which causes the sub-kit to be raised and lowered, wherein the second drive unit causes the kit picker and the sub-kit to be raised and lowered together, and the first drive unit causes the kit picker to be raised and lowered so that the kit picker descends during the transfer between the entry rail and the suction cup table, and the kit picker rises during the transfer between the suction cup table and the drying block.

[0021] In which, a semiconductor material cutting device is provided, wherein the first driving part is a cylinder, and the second driving part is a motor. When the kit picker picks up the kit on the rail, the first driving part lowers the kit picker. After the kit picker picks up the kit, the second driving part raises the kit picker and the sub-kit together while maintaining the descending state of the first driving part. When the kit picker transfers the kit to the suction cup table, the second driving part lowers the kit picker and the sub-kit together while maintaining the descending state of the first driving part. After the kit is transferred to the suction cup table, the first driving part raises the kit picker, and the second driving part raises the kit picker and the sub-kit together.

[0022] In addition, a semiconductor material cutting device is provided, wherein the sub-assembly has a receiving groove for receiving the assembly inside, the assembly is inserted and installed on the upper surface of the receiving groove of the sub-assembly, and a plurality of insertion holes are formed in the assembly.

[0023] In addition, a semiconductor material cutting device is provided, wherein a plurality of insertion holes are formed in the long side direction and the short side direction of the kit, and positioning pins are respectively formed at corresponding positions of the suction cup table, the drying block, the stacking table, the unit pickup, and the sub-kit of the stacking table pickup, so that the positioning pins can be inserted into the insertion holes formed in the long side direction among the plurality of insertion holes formed in the kit.

[0024] In which, a semiconductor material cutting device is provided, wherein the positioning pins of each of the suction cup table, the drying block, the stacking table, the unit pickup and the sub-kit of the stacking table pickup are formed at a position lower than the depth of the insertion hole of the kit, so that the positioning pins of the suction cup table, the drying block, the stacking table, the unit pickup or the sub-kit of the stacking table pickup for transferring the kit are inserted at one end of each insertion hole of the kit, and the positioning pins of the suction cup table, the drying block, the stacking table, the unit pickup or the sub-kit of the stacking table pickup for receiving the kit are inserted at the other end of each insertion hole of the kit.

[0025] In addition, a semiconductor material cutting device is provided, wherein a plurality of insertion holes are formed in the long side direction and the short side direction of the kit, and positioning pins are respectively formed at corresponding positions of the suction cup table, the drying block, the stacking table and the sub-kit of the unit picker, so that the positioning pins can be inserted into the insertion holes formed in the long side direction among the plurality of insertion holes formed in the kit.

[0026] In which, a semiconductor material cutting device is provided, wherein the positioning pins of each of the suction cup table, the drying block, the stacking table and the sub-kit of the unit pickup are formed at a position lower than the depth of the insertion hole of the kit, so that the positioning pins of the suction cup table, the drying block, the stacking table or the sub-kit of the unit pickup for transferring the kit are inserted at one end of each insertion hole of the kit, and the positioning pins of the suction cup table, the drying block, the stacking table or the sub-kit of the unit pickup for receiving the kit are inserted at the other end of each insertion hole of the kit.

[0027] In addition, a semiconductor material cutting device is provided, wherein the suction cup table, the drying block, the stacking table, the unit pickup and the stacking table pickup respectively include: a positioning pin formed at a corresponding position so as to be inserted into an insertion hole formed in the kit; and a clamp to fix or release the kit.

[0028] In addition, a semiconductor material cutting device is provided, wherein the suction cup table, the drying block, the stacking table and the unit picker respectively include: a positioning pin formed at a corresponding position so as to be inserted into an insertion hole formed in the kit; and a clamp to fix or release the kit.

[0029] Technical Effects

[0030] The semiconductor material cutting device according to the present invention utilizes a suction cup table, a unit pickup, a drying block, a stacking table pickup, a stacking table and other basic structures to transfer the kit, thereby showing an excellent effect of being able to automatically supply and recover the kit.

[0031] Furthermore, according to the semiconductor material cutting device of the present invention, when supplying and recovering the kit, the unit pickup, stacking platform pickup, etc. provided in the semiconductor material cutting device can be used to transfer the kit. Therefore, there is no need to set up additional mechanical parts and no additional space is required for kit exchange. It has the advantage of structurally and spatially simple exchange of kits.

[0032] Furthermore, according to the semiconductor material cutting device of the present invention, if the strip picker is to supply and recover the kit, the strip picker itself also needs to be configured to be exchangeable by the kit. However, the strip picker according to the present invention does not exchange the kit, so its structure can be simplified and the time corresponding to the kit exchange can be shortened, and there is no need for conversion, which has the effect of simplifying its structure.

[0033] According to the semiconductor material cutting device of the present invention, if the strip picker is to supply and recover the kit without exchanging the kit, in order to protect the adsorption pad formed on the strip picker, the adsorption pad needs to be configured to be able to dodge upward, but when adsorbing the semiconductor material, an offset in the size of the gap for the adsorption pad to dodge will occur. Therefore, the present invention focuses on the strip picker not participating in the supply or recovery of the kit, but performing the original function of the strip picker to accurately transfer the semiconductor strip to the suction cup table. Therefore, it has the effect of allowing the strip picker to be used exclusively for transferring the semiconductor strip to the suction cup table.

[0034] Furthermore, according to the semiconductor material cutting device of the present invention, the strip picker does not need a carrying kit and the clamping structure for clamping the kit can be omitted in the strip picker, thereby simplifying the structure of the strip picker and enabling easy changes when changing the vacuum area of ​​the strip picker in order to process special materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 FIG. 1 is a plan view schematically showing the structure of an embodiment of a semiconductor material cutting device according to the present invention.

[0036] Figure 2 It is shown from Figure 1 The semiconductor material cutting apparatus is shown as a front view of a process in which a supply kit is supplied from a supply portion to a chuck stage.

[0037] Figure 3 It is a schematic diagram Figure 1 A top view of an embodiment of a kit for supplying and recovering semiconductor material cutting apparatus is shown. Figure 3 (a)) and side view ( Figure 3 (b)).

[0038] Figure 4 It is a schematic diagram Figure 1 A top view of one embodiment of a sub-assembly of a assembly installed in a semiconductor material cutting apparatus is shown ( Figure 4 (a)), main view ( Figure 4 (b)) and side view ( Figure 4 (c)).

[0039] Figure 5(a) is Figure 1 The semiconductor material cutting device shown in the figure has a kit picked up by a kit picker of a unit picker. Figure 5 (b) is a schematic diagram showing Figure 1 A top view of a state in which a kit is picked up in a sub-kit of a unit picker of a semiconductor material cutting device is shown.

[0040] Figure 6 It is a schematic diagram Figure 1 A front view of a kit picker of a mid-unit picker picking up a kit supplied into a rail.

[0041] Figure 7 The schematic diagram shows Figure 6 A situation in which the kit picker of the unit picker transfers the clamped kit to the suction cup table.

[0042] Figure 8 Schematic showing sub-assembly picking of a unit picker Figure 7 The kit is transferred to the suction cup table.

[0043] Description of Reference Numerals

[0044] 1000: Semiconductor material cutting device;

[0045] 100: Supply Department;

[0046] 200: Entering orbit;

[0047] 210: Avoidance slot;

[0048] 300: strip picker;

[0049] 400: unit picker;

[0050] 410: Kit Pickup;

[0051] 420: Sub-kit;

[0052] 500: Suction cup table;

[0053] 550: cutting part;

[0054] 600: Cleaning department;

[0055] 700: Drying block;

[0056] 800: Loading platform picker;

[0057] 900: loading platform;

[0058] K: Kit DETAILED DESCRIPTION

[0059] Below, the preferred embodiments of the present invention are described in detail. However, the present invention is not limited to the embodiments described herein, and can also be embodied in other forms. On the contrary, the embodiments introduced here are provided to make the disclosed content thorough and complete, and to fully convey the idea of ​​the present invention to those skilled in the art. Within the scope of the entire specification, the same reference numerals represent the same constituent elements.

[0060] Figure 1 It is a top view schematically showing the structure of one embodiment of the semiconductor material cutting device according to the present invention.

[0061] like Figure 1 As shown, a semiconductor material cutting device 1000 according to an embodiment of the present invention comprises: a suction cup table 500 for fixing the semiconductor material to be cut into semiconductor packages; a drying block 700 for drying the cut semiconductor packages; a stacking table 900 for placing the dried semiconductor packages; a strip picker 300 for picking up the semiconductor material to be cut and transferring it to the suction cup table; a unit picker 400 for picking up the cut semiconductor packages in the suction cup table 500 and transferring them to the stacking table 900; a strip picker 300 for picking up the semiconductor material to be cut and transferring it to the suction cup table; a unit picker 400 for picking up the cut semiconductor packages in the suction cup table 500 and transferring them to the stacking table 900; a strip picker 300 for picking up the cut semiconductor packages in the suction cup table 500 and transferring them to the stacking table 900; a strip picker 300 for picking up the cut semiconductor materials in the suction cup table 500 and transferring them to the stacking table 900; a strip picker 300 for picking up the cut semiconductor packages ... The drying block 700; and the stacking platform picker 800, which is used to pick up the semiconductor package dried in the drying block 700 and transfer it to the stacking platform 900, the suction cup table 500, the drying block 700, the stacking platform 900, the unit picker 400 and the stacking platform picker 800 are respectively equipped with a sub-kit and a kit K, the sub-kit is formed with an air pressure pipeline, and the kit K is formed with a plurality of adsorption holes connected to the sub-kit and can be detachably installed on the sub-kit.

[0062] Furthermore, the semiconductor material cutting device 1000 according to the present invention further includes: a supply unit 100 for supplying the semiconductor material, or for supplying or recovering each kit; and an inlet rail 200 for receiving the semiconductor material or kit delivered by the supply unit 100. At this time, the unit picker 400 is disposed between the inlet rail 200 and the drying block 700 and can be moved, and supplies a kit to the inlet rail 200, the suction cup table 500 or the drying block 700 or recovers the kit, and the stacking table picker 800 is disposed between the drying block 700 and the stacking table 900 and can be moved, and supplies a kit to the drying block or the stacking table or recovers the kit.

[0063] In the semiconductor material cutting device of the present invention, the suction cup stage 500, the drying block 700, the stacking stage 900, the unit picker 400, and the stacking stage picker 800 respectively have a sub-assembly and a kit, the sub-assembly is formed with an air pressure pipeline, and the kit is formed with a plurality of adsorption holes connected to the sub-assembly and is detachably mounted on the sub-assembly. Therefore, when air pressure is transmitted from the air pressure generator, the air pressure is transmitted to the adsorption holes of the kit detachable from the sub-assembly, so that the semiconductor material and the semiconductor package can be adsorbed.

[0064] Kit K is configured to be replaceable from a sub-kit, so that a corresponding semiconductor package can be provided according to the type, form and size of the semiconductor package. Therefore, according to the type, form and size of the semiconductor package, the kit can be configured as a group corresponding to the type, form and size of the semiconductor package, and multiple kits stacked in a kit lock box can be the same group. The meaning of configuring as the same group means that as a group that can handle the same semiconductor package, it only differs in the type of kit (suction cup table kit, unit pickup kit, drying block kit, stacking table pickup kit, stacking table kit).

[0065] In addition, the kit K can be divided into a supply kit and a recovery kit. In the present invention, the supply kit refers to a kit to be combined with the sub-kit of the suction cup table 500, the unit picker 400, the drying block 700, the stacking table picker 800 and the stacking table 900, that is, a kit to be newly installed, and the recovery kit refers to a kit after the kit installed on the sub-kit of the suction cup table 500, the unit picker 400, the drying block 700, the stacking table picker 800 and the stacking table 900 is separated, that is, a kit to be recovered.

[0066] When replacing the kit K, the kits installed on the respective sub-kits are separated and respectively collected into the kit gate box, and then the kits to be newly installed on the respective sub-kits are received from the kit gate box and installed.

[0067] Therefore, the supply kit may be a new kit that supplies a new kit to a sub-kit that was vacated when the equipment was set up, or a replacement kit that is newly installed as needed when the type of material changes or the kit is damaged and needs to be replaced.

[0068] Hereinafter, the semiconductor material cutting device of the present invention will be described in detail with reference to the drawings.

[0069] First, the function of the supply unit 100 is to supply semiconductor materials to be cut, or to supply or recover each kit K. The supply unit may have a plurality of gate boxes for stacking semiconductor materials or kits, and the semiconductor materials or kits drawn out from the gate boxes are transferred through the entry track 200. The semiconductor materials or kits stacked on the gate boxes are supplied to the entry track 200 by a pusher provided in the supply unit or a gripper 310 provided on one side of the strip picker 300.

[0070] Furthermore, the strip picker 300 is configured to be able to move along the X-axis direction between the entry track 200 and the suction cup stage 500, and to perform the function of picking up the semiconductor material supplied to the entry track 200 and transferring it to the suction cup stage 500. A vision device for checking the alignment state of the semiconductor material supplied to the entry track 200 is provided on one side of the strip picker 300. After the strip picker uses the vision device to check the alignment state of the semiconductor material before being cut, it uses the adsorption pad formed on the bottom surface of the strip picker to pick up the semiconductor material for alignment, so that the aligned semiconductor material on the suction cup stage can be placed in the correct position. At this time, the alignment information of the vision device is used in the alignment of the semiconductor material. When there is an alignment error, the strip picker and the suction cup stage move relative to each other to transfer the semiconductor material to the correct position of the suction cup stage. Since the strip picker picks up the semiconductor material in the substrate unit, it does not need to be replaced even if the type of semiconductor material changes.

[0071] In addition, the suction cup stage 500 receives the semiconductor material picked up by the strip picker 300 and adsorbs the lower surface of the semiconductor material, and is configured to be movable along the Y-axis direction and to rotate clockwise or counterclockwise on the XY plane. The semiconductor material transferred to the suction cup stage 500 is cut into a plurality of semiconductor packages by the cutting unit 550. At this time, the cutting unit 550 may have a blade that cuts the semiconductor material into individual semiconductor packages by high-speed rotation, and may also have a laser cutting machine that separates the semiconductor material into individual semiconductor packages by irradiating laser.

[0072] The unit picker 400 picks up the semiconductor packages cut in the cutting section and transfers them to the drying block via the cleaning section 600. To this end, the unit picker 400 is configured to absorb the upper surfaces of the plurality of semiconductor packages cut on the suction cup table 500 and can be lifted and lowered and transferred in the horizontal direction.

[0073] In the present invention, the unit picker 400 further includes a kit picker 410 on one side. The kit picker 410 performs the function of supplying the kit of the entry track 200 to the suction cup stage 500, or recovering the kit of the suction cup stage 500 to the entry track 200. That is, in the present invention, the unit picker 400 includes: the kit picker 410 for clamping the kit and transferring it from the entry track 200 to the suction cup stage 500; and the sub-kit 420 for adsorbing and picking up the semiconductor package, or clamping the kit and transferring it from the suction cup stage 500 to the drying block 700.

[0074] Furthermore, the unit picker 400 has a first driving unit for lifting the kit picker 410 and a second driving unit for lifting the sub-kit, and the second driving unit lifts the kit picker 410 and the sub-kit 420 together. In this case, the first driving unit may be a cylinder 412, and the second driving unit may be a motor.

[0075] Specifically, the kit picker 410 includes a pick-up head 411 for clamping the kit and a cylinder 412 for lifting the pick-up head 411. The pick-up head 411 has a clamper 411a for clamping the kit and a positioning pin 411b for aligning the position of the clamped kit on the lower surface. Similarly, the sub-kit 420 has a clamper 421 for clamping the kit and a positioning pin 422 for inserting into an insertion hole formed on the kit in order to align the position of the clamped kit on its lower surface.

[0076] In particular, one side of the cylinder 412 of the kit picker 410 is coupled to the sub-kit 420, and a motor for driving the sub-kit 420 to rise and fall is disposed inside the sub-kit 420. Therefore, during the kit replacement operation, when the sub-kit 420 rises and falls with the drive of the motor, the kit picker 410 will also rise and fall together.

[0077] In addition, during the kit replacement operation, the cylinder 412 provided in the kit picker 410 lowers the kit picker 410 so that the lower surface of the pickup head 411 is located at a position lower than the lower surface of the sub-kit 420. During the semiconductor material cutting process, since the kit picker 410 is not needed, in order to eliminate the interference caused by the kit picker 410 and allow the sub-kit 420 to smoothly perform the operation, the cylinder 412 provided in the kit picker 410 raises the kit picker 410 so that the lower surface of the pickup head 411 is located at a position relatively higher than the lower surface of the sub-kit 420. Therefore, the relative height between the lower surface of the pickup head 411 and the lower surface of the sub-kit 420 is adjusted by the cylinder 412, and the precise height of the pickup head 411 is adjusted by the motor of the sub-kit 420, so that it is not necessary to additionally provide a plurality of motors for closely adjusting the height of the kit pickup portion.

[0078] A vertical wall is formed on the entry rail protrusion, and the vertical wall can minimize misalignment when supplying semiconductor materials and kits.

[0079] When the kit picker supplies a kit to the entry rail or recovers a kit, when the kit is clamped by the clamp 411a provided on the kit picker, the clamp 411a may be stuck by the vertical wall and the clamping is hindered. Therefore, an avoidance groove 210 is provided on the entry rail for avoiding the clamp provided on the kit picker.

[0080] Specifically, the entry rail 200 is formed by a pair of support lines that are spaced apart from each other, the pair of support lines are movably arranged in a manner of approaching or moving away from each other, and each support line is provided with a vertical wall symmetrically formed in a "∟" shape, so as to guide the set to avoid derailment from the entry rail 200. And, when the set picker 410 picks up the set placed on the entry rail 200, the gripper 411a provided on the picking head 411 uses the avoidance groove 210 provided on the vertical wall of the entry rail to avoid interference with the entry rail 200.

[0081] In addition, the cleaning unit 600 is disposed between the suction cup stage 500 and the drying block 700 and performs the function of cleaning the lower surface of the semiconductor package picked up by the unit picker 400, and can use air pressure, water, a brush, etc. to remove foreign matter from the semiconductor package.

[0082] The drying block 700 allows the semiconductor package cleaned in the cleaning part 600 to be transferred from the unit picker 400, and adsorbs and dries the semiconductor package. At this time, the drying block 700 may be equipped with a heating member therein, and the semiconductor package may be dried by the heating member.

[0083] Also, the stacking stage picker 800 is movably disposed between the drying block 700 and the stacking stage 900 , picks up the semiconductor packages dried in the drying block 700 and transfers them to the stacking stage 900 .

[0084] The loading platform 900 is configured to transfer and place the semiconductor packages dried in the drying block 700 , and is movably provided. There may be one, two or more loading platforms 900 , and the loading platform 900 may be rotatable as required.

[0085] Below, refer to Figures 2 to 8 The following describes a method for installing and replacing a kit of a semiconductor material cutting device according to the present invention.

[0086] Figure 3 (a) is a top view of the kit. Figure 3 (b) is a side view of the kit. Figure 3 As shown, a plurality of insertion holes are formed in the long side direction and the short side direction of the kit. Specifically, insertion holes a and a' are provided in the long side direction of the kit for inserting the positioning pins of the sub-kit, and insertion holes b and b' are provided in the short side direction of the kit for inserting the positioning pins 411a provided on the picking head 411 of the kit picker 410. In addition, clamp grooves c and c' for fastening the clamp of the kit picker 410 are provided on both sides of the short side direction of the kit, and clamp grooves d and d' for fastening the clamps of the sub-kit 420 of the unit picker and the stacking platform picker 800. In addition, fixing grooves e and e' for inserting the clamp 512 for fixing or releasing the kit are also provided on the suction cup table, the unit picker, the drying block, the stacking platform, and the stacking platform picker.

[0087] Figure 4 (a) is a top view of the sub-assembly. Figure 4 (b) is the main view of the sub-assembly. Figure 4 (c) is a side view of the sub-assembly. Figure 4 As shown, the sub-kit is provided with a receiving groove for receiving the kit at the center thereof, and is provided with a positioning pin 511 and clamps 512, 512'. The positioning pin 511 is formed to protrude at a corresponding position so as to be able to be inserted into the insertion holes a, a' formed in the long side direction among the multiple insertion holes formed on the kit, and the clamps 512, 512' fix or release the kit.

[0088] at this time, Figure 4 The sub-assembly shown is an example of a semiconductor material cutting device, which can be a sub-assembly of a chuck table, and can also be a sub-assembly of a drying block or a stacking table.

[0089] In addition, if Figure 5As shown in (a), the kit picker is provided with positioning pins 411b, 411b' and clamps 411a, 411a'. In order to be able to be inserted into the insertion holes b, b' formed in the short side direction among the multiple insertion holes formed on the kit, the positioning pins 411b, 411b' are protruded at positions corresponding to the insertion holes b, b', and the clamps 411a, 411a' are connected to the clamp grooves c, c' of the kit to fix or release the kit.

[0090] The aforementioned suction cup table 500, unit picker 400, drying block 700, stacking platform picker 800, and stacking platform 900 respectively have a sub-kit and a kit, wherein the sub-kit is formed with an air compressor pipeline, and the kit is formed with a plurality of adsorption holes connected to the air compressor pipeline of the sub-kit, and can be detachably installed in a receiving groove set on the sub-kit.

[0091] In the present invention, a corresponding kit can also be installed on a sub-kit during the initial setting of the semiconductor material cutting device 1000. When the type of semiconductor package to be processed changes, the installed kit is separated from the sub-kit and recovered to enable the corresponding semiconductor package to be processed. Subsequently, an exchange kit with specifications for processing the corresponding semiconductor package needs to be supplied to be installed on the sub-kit.

[0092] To this end, the semiconductor material cutting device 1000 of the present invention is additionally provided with a kit gate box in the supply part for receiving semiconductor materials, and the kits to be supplied to the unit picker 400, the suction cup stage 500, the drying block 700, the stacking stage picker 800 and the stacking stage 900 are stacked in the kit gate box. Such a kit gate box is provided in plurality so as to be able to process semiconductor packages different from each other, and kits for processing semiconductor packages of the same type are stacked in each kit gate box.

[0093] At this time, the kit gate box is provided with a kit gate box filled with kits and a blank kit gate box emptied of kits, and the blank kit gate box can be used for recycling. Of course, in the case of no additional recycling gate box, during the initial setting, when the kit to be installed is supplied from the gate box and the gate box is emptied, the corresponding gate box can be used as a gate box for kit recycling.

[0094] Figure 2 It is shown from Figure 1 A front view of a process of supplying a semiconductor material cutting device to a suction cup table supply kit is shown.

[0095] like Figure 2As shown, the kits adapted to the semiconductor package to be manufactured in the semiconductor material cutting device 1000 are stacked in groups in the kit lock box, and the groups are stacked in sequence from the top with a stacking table kit, a stacking table pickup kit, a drying block kit, a unit pickup kit, and a suction cup table kit.

[0096] In order to lead out the kit from the kit gate box to the entry rail or to introduce the kit transferred to the entry rail into the kit gate box, an additional pusher and a driving part may be provided, or a gripper 310 provided at one side of the strip picker may be used.

[0097] Taking the case where the gripper 310 disposed on one side of the strip picker 300 is used to receive the kit as an example, the gripper 310 of the strip picker is used to move any one of the kits stacked in the kit gate box to the top of the entry rail 200 .

[0098] The operation of confirming the information of the kit transmitted to the track using a visual device provided on one side of the strip picker can be performed separately. For this purpose, an identification mark capable of identifying the kit information is provided on the upper surface of the kit.

[0099] By using a visual device to identify the identification mark set on the upper surface of the kit, it is possible to confirm the specifications of the kit to be supplied, information on the semiconductor materials that can be processed, whether the size information is correct, what kind of kit it is, where the kit is to be installed, and other kit information, so as to provide the corresponding kit information to the unit picker, drying block or stacking platform picker. It can also be checked whether the kit that is consistent with the installation sequence related to each sub-kit is delivered.

[0100] The identification mark may be a barcode, QR code or the like, or may be configured to confirm the information of the package in an RFID manner instead of recognizing the identification mark based on a visual device.

[0101] In addition, when transferring the kit to the entry rail, the unit picker 400 clamps the kit placed above the entry rail 200 and places the kit in a receiving groove provided on the sub-kit of the suction cup table 500 .

[0102] When the unit picker is rotatably arranged, the unit picker rotates in accordance with the direction of the kit supplied on the inlet rail and picks up the kit, and then places the kit in a receiving groove on the sub-kit arranged on the suction cup table.

[0103] If the unit picker cannot rotate, Figure 2 and Figure 5 As shown, a kit picker is additionally provided on one side of the unit picker, and the picking direction is changed by rotating the suction cup table so that the unit picker can pick up.

[0104] like Figure 6As shown, when a kit is supplied to the orbit, the kit picker picks up the supplied kit as shown in FIG. Figure 5 When the kit picker 410 picks up the kit, the positioning pins 411b, 411b' provided on the pick-up head 411 are inserted into the insertion holes b, b' provided in the short side direction of the kit, respectively, so that when the kit is aligned, the clamps 411a, 411a' provided on the pick-up head 411 are fastened to the grooves c, c' provided on both sides of the kit, thereby being able to stably fix the kit.

[0105] Then, if Figure 7 As shown in FIG. 1 , in a state where the suction cup table rotates in the same direction as the kit supplied to the inlet rail, the kit picker transfers the picked-up kit to the suction cup table. In the semiconductor material cutting device of the present invention, since the suction cup table can rotate in the clockwise direction or the counterclockwise direction on the XY plane, as shown in FIG. Figure 8 As shown, when the suction cup stage rotates in the same direction as the sub-assembly of the unit picker, the sub-assembly of the unit picker picks up the assembly transferred to the suction cup stage.

[0106] Figure 5 This is the case where the sub-assembly 420 of the unit picker 400 picks up the assembly. When the sub-assembly 420 clamps the assembly, the positioning pins 422, 422' provided on the lower surface are respectively inserted into the insertion holes a, a' provided in the long side direction of the assembly, so that when the assembly is aligned, the clamps 411, 411' are fastened to the grooves d, d' provided on the two side surfaces of the assembly, thereby stably fixing the assembly.

[0107] In the present invention, the kit picker and sub-kit of the unit picker are respectively arranged in a liftable manner, and are explained in conjunction with their lifting and lowering actions. When the kit picker is used to pick up the kit and transfer the kit, the cylinder 412 of the kit picker operates to keep the kit picker in a descending state, and when controlling the height of the kit picker or the height of the sub-kit of the unit picker, precise control is performed through the motor of the sub-kit.

[0108] First, when the kit picker picks up the kit from the entry rail, the kit picker is lowered by the cylinder. After the kit picker picks up the kit, the motor raises the kit picker and the sub-kit together while the cylinder is kept in the lowered state, thereby separating the kit from the entry rail. At this time, a pair of support wires constituting the entry rail 200 can be pulled away from each other. In this state, the kit picker 410 is kept in the lowered state by the cylinder, and the motor of the sub-kit lowers the kit picker and the sub-kit together, thereby transferring the clamped kit to the suction cup table 500 arranged at the lower end. Among them, although the case where the kit picker is driven by the cylinder to descend when picking up the kit from the entry rail is described as an example, the kit picker can also be lowered by the cylinder until it reaches the position adjacent to the kit, and the motor is used to move precisely until it reaches the position in contact with the kit.

[0109] When the kit picker transfers the kit to the suction cup table, the motor of the sub-kit lowers the kit picker and the sub-kit together while the cylinder holds the kit picker in a lowered state. After the kit is transferred to the suction cup table, the cylinder raises the kit picker and the motor of the sub-kit raises the kit picker and the sub-kit together.

[0110] After the kit is transferred, the raising of the kit picker based on the cylinder and the raising of the kit picker and the sub-kit based on the sub-kit motor can be performed simultaneously or sequentially.

[0111] After the kit is transferred from the kit picker to the suction cup table, the sub-kit of the unit picker is lowered by the motor of the sub-kit to pick up the kit transferred to the suction cup table, and after picking up, it is raised from the suction cup table by the motor of the sub-kit. At this time, the kit picked up on the sub-kit of the unit picker can be a kit of the unit picker, or a kit of the drying block, the stacking table picker, or the stacking table. If it is a kit of the drying block, the stacking table picker, or the stacking table, the unit picker transfers the picked up kit to the drying block, and the kit transferred to the drying block can also be installed on the stacking table or the stacking table picker by the stacking table picker.

[0112] The semiconductor material cutting device 1000 of the present invention can automatically supply and recover the kit through the aforementioned composition and structure.

[0113] In particular, the method for supplying the kit is to supply the kit to the stacking platform 900, the stacking platform picker 800, the drying block 700, the unit picker 400, and the suction cup table 500 in sequence, and the method for recovering the kit is to recover the kit in the opposite order of the suction cup table 500, the unit picker 400, the drying block 700, the stacking platform picker 800, and the stacking platform 900.

[0114] Specifically, in the method for supplying a kit, the process of supplying a kit to the loading platform 900 includes: using the gripper 310 provided on the strip picker 300 to lead the kit out of the kit lock box and transfer it to the rail 200 (first step); Figure 6 As shown, the kit picker 410 picks up the kit placed on the entry track 200 (the second step); Figure 7 As shown, the kit picker 410 transfers the kit to the suction cup table 500 (the third step); Figure 8 As shown, there is a step in which the sub-assembly 420 of the unit picker picks up the assembly transferred to the suction cup table 500 (the fourth step); a step in which the sub-assembly of the unit picker transfers the picked-up assembly and transfers it to the drying block 700 (the fifth step); a step in which the stacking platform picker 800 picks up the assembly transferred to the drying block 700 (the sixth step); and a step in which the stacking platform picker 800 transfers the picked-up assembly to the stacking platform 900 (the seventh step).

[0115] In addition, in the present invention, when picking up the kit, the table and the sub-kit of the pickup are respectively provided with positioning pins protruding for inserting into the insertion hole of the kit, and each positioning pin is inserted into the insertion hole formed in the long side direction of the insertion hole of the kit. Wherein, when transferring the kit, the positions of the positioning pins of the table and the pickup facing each other can be located at positions that can share the insertion hole of the kit to achieve accurate kit transfer, and at this time, the protruding height of the positioning pin can be lower than the height of the insertion hole. If the protruding height of the positioning pin is equal to or greater than the height of the insertion hole of the kit, the positioning pin will not be inserted into a certain pickup or table when transferring the kit.

[0116] Therefore, in the present invention, the protruding height of each positioning pin of the suction cup table, drying block, stacking table, unit picker, and stacking table picker is preferably lower than the depth of the kit insertion hole, and the protruding height of the positioning pin is preferably installed to reach half the depth of the kit insertion hole or less than half.

[0117] That is, a positioning pin of a sub-kit of a suction cup table, a drying block, a stacking table, a unit picker or a stacking table picker for transmitting the kit is inserted at one end of each insertion hole formed in the long side direction of the kit, and a positioning pin of a sub-kit of a suction cup table, a drying block, a stacking table, a unit picker or a stacking table picker for receiving the kit is inserted at the other end of each insertion hole of the kit.

[0118] Preferably, a positioning pin of a suction cup table, drying block or stacking table for transferring or receiving the kit is inserted at the lower end of the kit insertion hole, and a positioning pin of a sub-kit of a unit picker or stacking table picker for transferring or receiving the kit is inserted at the upper end of the kit insertion hole.

[0119] In this regard, Figure 8As shown in the enlarged view, when the sub-assembly 420 of the unit picker clamps the assembly placed on the suction cup table 500, the positioning pins 422 set on the lower surface of the sub-assembly 420 and inserted into the insertion holes a, a' of the assembly and the positioning pins 511 set on the sub-assembly 510 of the suction cup table 500 and inserted into the insertion holes a, a' of the assembly may collide or interfere with each other. Therefore, the sum of the heights of the positioning pins 422 of the sub-assembly 420 and the positioning pins 511 of the suction cup table sub-assembly 510 is preferably less than or equal to the height of the insertion holes a, a' of the assembly.

[0120] Further, in the method of supplying the kit, the process of supplying the kit to the stacking platform picker 800 is performed from the first step to the sixth step, the process of supplying the kit to the drying block 700 is performed from the first step to the fifth step, the process of supplying the kit to the sub-kit 420 of the unit picker 400 is performed from the first step to the fourth step, and the process of supplying the kit to the suction cup table 500 is performed from the first step to the third step.

[0121] In addition, the method of recovering the kit is performed in the reverse order of the method of supplying the kit. That is, in order to transfer the kit, in order to minimize damage to the kit, the kit can be removed from the sub-kit in the state where the kit is removed from the sub-kit, and the kit is removed from the suction cup table for transferring the kit as the first order. At this time, it includes: a first step of using the kit picker 410 to pick up the kit installed on the suction cup table 500 and place it on the entry track 200, and then using the gripper 310 set on the strip picker 300 to introduce the kit placed on the entry track 200 into the kit gate box; a second step of executing the first step after transferring the kit of the sub-kit 420 installed on the unit picker to the suction cup table 500; a third step of executing the second step after the sub-kit 420 of the unit picker clamps the kit installed on the drying block 700; a fourth step of executing the third step after transferring the kit installed on the stacking platform picker 800 to the drying block 700; and a fifth step of executing the third step after the stacking platform picker 800 picks up the kit installed on the stacking platform 900 and transfers it to the drying block 700.

[0122] For reference, the meaning of conveying a kit in the present invention includes not only the lexical meaning of conveying the kit but also the meaning of installing the kit into the sub-kit, which is accommodating the kit into the accommodating groove of the sub-kit.

[0123] In addition, the semiconductor material cutting device of the present invention can pick up the semiconductor package transferred to the drying block by the stacking platform picker 800 and transfer it to the stacking platform 900. However, if the stacking platform picker 800 is not provided, the semiconductor package stacked in the drying block 700 can be directly transferred to the stacking platform by the drying block.

[0124] To this end, as another embodiment of the present invention, the drying block is configured to be rotatable in an up-and-down reverse manner and to be movable to an upper portion of the loading platform.

[0125] When the drying block rotates 180 degrees, the upper and lower surfaces of the semiconductor material adsorbed to the drying block can be reversed and transferred to the loading platform. That is, when the drying block rotates 180 degrees and transfers the semiconductor package to the loading platform, the upper surface of the semiconductor package adsorbed to the drying block is in a state of facing downward, so that the semiconductor package reversed upside down is placed on the loading platform.

[0126] One embodiment of the present invention is a dead type in which the spherical surface of the semiconductor package stacked on the tray faces upward (embodiment 1), and another embodiment of the present invention is a live type in which the spherical surface of the semiconductor package stacked on the tray faces downward (embodiment 2).

[0127] According to another embodiment of the present invention, a semiconductor material cutting device includes: a suction cup table for fixing the semiconductor material to be cut into semiconductor packages; a drying block for drying the cut semiconductor packages; a stacking table for placing the dried semiconductor packages; a strip picker for picking up the semiconductor material to be cut and transferring it to the suction cup table; and a unit picker for picking up the cut semiconductor packages in the suction cup table and transferring them to the drying block, wherein the suction cup table, the drying block, the stacking table and the unit picker respectively have a sub-kit and a kit, the sub-kit is formed with an air pressure pipeline, and the kit is formed with a plurality of adsorption holes connected to the sub-kit and can be detachably mounted to the sub-kit.

[0128] Furthermore, it also includes: a supply unit, which supplies the semiconductor material, or supplies or recovers each kit; and an entry rail, which conveys the semiconductor material or kit supplied from the supply unit, the unit picker is movably arranged between the entry rail and the drying block, and supplies or recovers the kit to the entry rail, the suction cup table or the drying block, and the drying block is configured to be able to rotate in an upside-down manner and can be moved to the upper part of the stacking platform, so that the drying block is turned upside down on the stacking platform and the kit is supplied or recovered.

[0129] The first embodiment and the second embodiment of the present invention have almost the same structure as the semiconductor material cutting device, except that there is a difference in the stacking direction of the semiconductor package, which results in the drying block replacing the stacking platform pick-up structure and directly transferring the semiconductor package to the stacking platform in a reversed state with the upper and lower surfaces inverted. Therefore, repeated description thereof is omitted.

[0130] A drying block according to a second embodiment of the present invention includes: a base provided with a chamber to provide air pressure for vacuum adsorption of a semiconductor package; a sub-assembly formed with through holes fastened to each of the upper and lower surfaces of the base and used to transmit air pressure from the chamber, and detachably arranged on the upper and lower surfaces to accommodate a replaceable assembly; a clamp installed on one side of the sub-assembly to fix or release the assembly from the sub-assembly; a rotating member rotatably arranged to reverse the upper and lower surfaces of the base and the sub-assembly; and a moving frame arranged on one side of the rotating member to move the sub-assembly in a direction so that it is located on the upper part of the stacking platform.

[0131] The drying block can be moved to the upper side of the stacking table and the rotating component of the drying block can be rotated to install the stacking table kit to the sub-kit of the stacking table in a state where the kit of the drying block is removed from the sub-kit and the kit of the stacking table is installed in the sub-kit of the drying block. The drying block can also be moved to the upper side of the stacking table and the rotating component of the drying block can be rotated to clamp the kit of the stacking table from the sub-kit of the stacking table in a state where the kit of the drying block is removed from the sub-kit of the drying block, thereby installing the kit of the stacking table in the sub-kit of the drying block for recovery.

[0132] In the second embodiment of the present invention, similarly to the first embodiment, each sub-assembly of the suction cup table, the drying block, the stacking table, and the unit picker has a positioning pin protruding so as to be inserted into the insertion hole of the assembly when picking up the assembly, and each positioning pin of the sub-assembly is inserted into the insertion hole formed in the long side direction of the insertion hole of the assembly.

[0133] Therefore, in the second embodiment, the protruding height of each positioning pin of the sub-kit of the suction cup table, drying block, stacking table, and unit picker is lower than the depth of the kit insertion hole, and the sum of the heights of the positioning pins of each sub-kit formed on the transferred object and the received object is preferably equal to or less than the height of the insertion hole of the kit.

[0134] In a second embodiment of the present invention, a positioning pin of a sub-kit of a suction cup table, a drying block, a stacking table or a unit picker for conveying the kit is inserted at one end of each insertion hole formed in the long side direction of the kit, and a positioning pin of a sub-kit of a suction cup table, a drying block, a stacking table or a unit picker for receiving the kit is inserted at the other end of each insertion hole of the kit.

[0135] Preferably, a positioning pin of a sub-assembly of a suction cup table, a drying block or a stacking table for transferring or receiving a kit is inserted at the lower end of the kit insertion hole, and a positioning pin of a sub-assembly of a unit picker or a drying block for transferring or receiving a kit is inserted at the upper end of the kit insertion hole. At this time, since the drying block is configured to be rotatable in an up-and-down reverse manner, the positioning pin of the sub-assembly of the drying block can be inserted into either side of the upper end and the lower end of the kit insertion hole.

[0136] In the second embodiment of the present invention, since the drying block is a rotating type, the drying block rotates and directly transfers the kits on the stacking table. Therefore, the kits on the stacking table are stacked and supplied in the kit gate box with the suction surface of the stacking table sucking the semiconductor package facing downward, and when collected, the kits on the stacking table are also transferred to the drying block with the suction surface of the stacking table sucking the semiconductor package facing downward.

[0137] That is, the stacking platform kit needs to be transferred to the drying block in an inverted state, and then the stacking platform kit can be transferred from the drying block to the stacking platform in an inverted state, so that the stacking platform kit can be installed with its adsorption surface for adsorbing the semiconductor package facing upward.

[0138] The method for supplying or recovering a kit in the second embodiment of the present invention is the same except that the operation of supplying and recovering the kit to the stacking platform is performed by a rotatable drying block instead of a stacking platform picker, so repeated description thereof is omitted.

[0139] According to the first and second embodiments of the present invention, the semiconductor material cutting device can automatically supply and recover the kit by transferring the kit using basic structures such as a unit pickup, a drying block or a stacking platform pickup. When supplying and recovering the kit, there is no need to set up additional additional mechanism parts or additional space corresponding to the kit exchange.

[0140] In particular, if a strip picker that does not require conversion is enabled to carry a kit, the strip picker itself needs to be configured to be exchangeable by a kit. In such a case, an additional kit needs to be supplied and recovered, which increases the time required to exchange the kit. Compared with a one-piece structure, the precision of the strip picker is reduced due to the conversion, and in order to set the kit interchangeably, the structure of the strip picker will inevitably become complicated. However, according to the strip picker of the present invention, without exchanging the kit, the kit picker of the unit picker can be used to transfer or recover the kit from the rail to the suction cup table, so that the structure of the strip picker can be simplified, the time corresponding to the kit exchange can be shortened, and the effect of simplifying the structure is achieved without the need for conversion.

[0141] Furthermore, if the strip picker is to supply the kit to the suction cup table or recover it to the rail without exchanging the kit itself, an additional clamp for picking up the kit needs to be installed on the strip picker, and the adsorption pad configured in the strip picker for adsorbing the semiconductor material needs to be configured to be able to hide to the upper side of the strip picker to prevent it from being pressed or rubbed against the jig and causing damage.

[0142] However, in order to make the suction pad of the strip picker evade upward, a gap is inevitably formed between the strip picker body and the suction pad, which will have an effect on the precision when the strip picker absorbs the semiconductor material. That is, when the strip picker is supplied or recovered, when the semiconductor material is absorbed, a deviation will occur according to the size of the gap for the suction pad to evade, so the picking precision of the strip picker may be reduced.

[0143] In particular, in a semiconductor material cutting device, it is important to align the semiconductor material before conveying so that the predetermined cutting line enters the blade avoidance groove of the suction cup table, thereby ensuring the picking accuracy of the strip picker. If the picking accuracy is not ensured, problems such as reduced cutting quality and damage to the suction cup table may occur.

[0144] Therefore, in the present invention, the strip picker does not participate in the supply or recovery of the kit, but focuses on performing the original function of the strip picker, that is, precisely transferring the semiconductor strip to the suction cup table, thereby using a dedicated strip picker, and enabling the kit picker arranged on one side of the unit picker to perform the function of the strip picker, so that the kit transferred to the rail can be transferred to the suction cup table, and the strip picker is configured to be compatible with a variety of materials, thereby minimizing replacement.

[0145] Therefore, the semiconductor material cutting device of the present invention utilizes the kit picker of the unit picker to supply and recover the kit from the entry rail to the suction cup table, and utilizes the sub-kit of the unit picker to supply and recover the kit from the suction cup table to the drying block. When the kit is converted, the strip picker does not need to carry the kit and the clamping structure for clamping the kit can be omitted in the strip picker, so that when the adsorption area of ​​the strip picker needs to be changed when special materials need to be processed, the structure of the strip picker can be simplified.

[0146] The above description is made with reference to the preferred embodiments of the present invention, but those skilled in the art may make various modifications and changes to the present invention without departing from the concept and scope of the present invention as described in the attached claims. Therefore, if the implementation of the modification basically includes the constituent elements of the claims of the present invention, it shall be considered to fall within the technical scope of the present invention.

Claims

1. A semiconductor material cutting device, characterized in that: include: A suction cup table to fix the semiconductor material cut into semiconductor packages; A drying block for drying the cut semiconductor packages; A stacking platform on which the semiconductor package to be dried is placed; a strip picker for picking up semiconductor material to be cut and transferring it to the chuck table; a unit picker, picking up the cut semiconductor package in the suction cup table and transferring it to the drying block; as well as A stacking platform picker picks up the dried semiconductor package in the drying block and transfers it to the stacking platform, The suction cup stage, the drying block, the stacking stage, the unit picker, and the stacking stage picker each have a sub-assembly and a kit, the sub-assembly is formed with an air pressure pipeline, the kit is formed with a plurality of adsorption holes communicating with the sub-assembly, and is detachably mounted to the sub-assembly, Also includes: A supply department, which supplies the semiconductor material, or supplies or recovers each kit; as well as into the orbit, conveying the semiconductor material or the kit supplied from the supply part, The unit picker is movably disposed between the entry rail and the drying block and supplies or retrieves the kit to the entry rail, the suction cup table or the drying block. The stacking platform picker is movably disposed between the drying block and the stacking platform, and supplies or retrieves a kit to the drying block or the stacking platform.

2. A semiconductor material cutting device, characterized in that: include: A suction cup table to fix the semiconductor material cut into semiconductor packages; A drying block for drying the cut semiconductor packages; A stacking platform on which the semiconductor package to be dried is placed; a strip picker for picking up semiconductor material to be cut and transferring it to the chuck table; as well as a unit picker, which picks up the cut semiconductor package in the suction cup stage and transfers it to the drying block, The suction cup table, the drying block, the stacking table and the unit picker respectively have a sub-assembly and a kit, the sub-assembly is formed with an air pressure pipeline, the kit is formed with a plurality of adsorption holes connected with the sub-assembly and is detachably mounted to the sub-assembly, Also includes: A supply unit, used for supplying the semiconductor material, or supplying or recovering each kit; as well as into orbit, delivering the semiconductor material or kit supplied from the supply unit, The unit picker is movably disposed between the entry rail and the drying block and supplies or retrieves the kit to the entry rail, the suction cup table or the drying block. The drying block is configured to be rotatable in an upside-down manner and to be moved to an upper portion of the loading platform so that the drying block is turned upside down on the loading platform and the kit is supplied or recovered.

3. The semiconductor material cutting device according to claim 1 or 2, characterized in that: The unit picker also includes a kit picker on one side, The kit picker supplies or recovers the kit to the entry rail and the suction cup stage, The sub-kit of the unit picker supplies or recovers the kit between the suction cup stage and the drying block in a state where the kit is removed.

4. The semiconductor material cutting device according to claim 3, characterized in that: The suction cup table is configured to be able to rotate clockwise or counterclockwise on the XY plane. The kit picker picks up the kit transferred to the entry rail and transfers it to the suction cup table in a state where the suction cup table rotates in the same direction as the kit supplied to the entry rail. In a state where the suction cup stage rotates in the same direction as the sub-assembly of the unit picker, the sub-assembly of the unit picker picks up the assembly transferred to the suction cup stage.

5. The semiconductor material cutting device according to claim 3, characterized in that: The kit picker includes: a holder to secure or release the kit; and The positioning pin is configured to be inserted into an insertion hole formed in the sleeve.

6. The semiconductor material cutting device according to claim 5, characterized in that: The entry rail is formed with an escape groove for allowing a gripper provided on the kit picker to escape.

7. The semiconductor material cutting device according to claim 3, characterized in that: The unit picker comprises: A first driving unit causes the kit picker to move up and down; and The second driving unit causes the sub-assembly to move up and down. The second driving unit causes the kit picker and the sub-kit to move up and down together. The first driving unit moves the kit picker up and down so that the kit picker descends during the transfer between the entry rail and the suction cup table, and ascends during the transfer between the suction cup table and the drying block.

8. The semiconductor material cutting device according to claim 7, characterized in that: The first driving part is a cylinder, The second driving unit is a motor, When the kit picker picks up the kit on the entry rail, the first driving unit lowers the kit picker. After the kit picker picks up the kit, the second driving unit raises the kit picker and the sub-kit together while the first driving unit is kept in the lowered state. When the kit picker transfers the kit to the suction cup stage, the second driving unit lowers the kit picker and the sub-kit together while maintaining the lowered state of the first driving unit. After the kit is transferred to the suction cup table, the first driving unit causes the kit picker to rise, and the second driving unit causes the kit picker and the sub-kit to rise together.

9. The semiconductor material cutting device according to claim 1 or 2, characterized in that: The sub-assembly has a receiving groove for receiving the assembly inside, and the assembly is inserted and installed on the upper surface of the receiving groove of the sub-assembly. A plurality of insertion holes are formed in the sleeve.

10. The semiconductor material cutting device according to claim 1, characterized in that: A plurality of insertion holes are formed in the long side direction and the short side direction of the kit. Positioning pins are respectively formed at corresponding positions of the suction cup table, the drying block, the stacking table, the unit picker, and the sub-kit of the stacking table picker, so that the positioning pins can be inserted into the insertion holes formed in the long side direction among the multiple insertion holes formed in the kit.

11. The semiconductor material cutting device according to claim 10, characterized in that: The positioning pins of each of the suction cup stage, the drying block, the stacking stage, the unit picker, and the sub-assembly of the stacking stage picker are formed at a position lower than the depth of the insertion hole of the assembly, A positioning pin of the suction cup table, the drying block, the stacking table, the unit picker or the sub-kit of the stacking table picker for transferring the kit is inserted into one end of each insertion hole of the kit, And a positioning pin of a sub-kit of the suction cup table, the drying block, the stacking table, the unit picker or the stacking table picker for receiving the kit is inserted into the other end of each insertion hole of the kit.

12. The semiconductor material cutting device according to claim 2, characterized in that: A plurality of insertion holes are formed in the long side direction and the short side direction of the kit. Positioning pins are formed at corresponding positions of the suction cup stage, the drying block, the stacking stage and the sub-assembly of the unit picker, respectively, so that the positioning pins can be inserted into the insertion holes formed in the long side direction among the multiple insertion holes formed in the assembly.

13. The semiconductor material cutting device according to claim 12, characterized in that: The positioning pins of each of the sub-assemblies of the suction cup stage, the drying block, the stacking stage, and the unit picker are formed at a position lower than the depth of the insertion hole of the assembly, A positioning pin of a sub-assembly of the suction cup table, the drying block, the stacking table or the unit picker for conveying the assembly is inserted into one end of each insertion hole of the assembly, And a positioning pin of a sub-assembly of the suction cup table, the drying block, the stacking table or the unit picker for receiving the assembly is inserted into the other end of each insertion hole of the assembly.

14. The semiconductor material cutting device according to claim 1, characterized in that: The suction cup stage, the drying block, the stacking stage, the unit picker and the stacking stage picker respectively include: a positioning pin formed at a corresponding position so as to be insertable into an insertion hole formed in the sleeve; and A clamp is provided to secure or release the kit.

15. The semiconductor material cutting device according to claim 2, characterized in that: The suction cup table, the drying block, the stacking table and the unit picker respectively include: a positioning pin formed at a corresponding position so as to be insertable into an insertion hole formed in the sleeve; and A clamp is provided to secure or release the kit.

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