A temperature sensor with heat dissipation function

Abstract

The present invention relates to the technical field of temperature sensors, and specifically to a temperature sensor with a heat dissipation function, comprising a sensor body, the sensor body comprising a sensor housing and a temperature sensing device arranged in the housing, the sensor housing comprising an upper shell, a deformable shell in the middle, and a lower shell; the deformable shell comprises a first deformable shell and a second deformable shell, and multiple groups of heat dissipating elements are evenly arranged along the side of the first deformable shell, each group of heat dissipating elements comprises at least two heat dissipating fins with adjacent surfaces overlapping, and the sensor body further comprises a deformable bracket; by providing the deformable bracket and the deformable shell, the deformable bracket can drive the deformable shell to bend, and the heat dissipating elements arranged on the side of the deformable shell are composed of multiple groups of heat dissipating fins overlapping, and when the deformable shell is bent, the heat dissipating fins will separate and fork, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature sensors, in particular to a temperature sensor with a heat dissipation function. Background Art

[0002] A temperature sensor is a device that senses temperature changes and converts the temperature signal into an output electrical signal (such as voltage, current) or other signal form. Its basic principles are based on various physical effects. For example, a liquid thermometer, based on the principle of thermal expansion and contraction, uses the change in volume of a liquid (such as mercury) as the temperature changes to indicate the temperature. Thermistor temperature sensors, on the other hand, operate based on the property that the resistance of a material changes with temperature. As the temperature rises, the resistance of a negative temperature coefficient (NTC) thermistor decreases, while the resistance of a positive temperature coefficient (PTC) thermistor increases. By measuring this change in resistance, the temperature can be inferred.

[0003] The temperature sensor needs to sense the external temperature based on the temperature sensing head, and then convert the temperature signal into an electrical signal output for the user to observe. In order to ensure that the temperature sensing head can sense the temperature normally, the sensor also needs to dissipate heat to ensure that the temperature difference between the air entering the sensor and the outside of the sensor is not too large. If the heat dissipation effect is poor, it will not only affect the detection accuracy of the sensor, but also cause problems when the temperature sensing head is used in a high temperature environment. Excessive heat dissipation will also cause a large temperature difference between the inside and outside. The speed of the temperature sensing head to perceive the temperature may not keep up with the speed of the ambient temperature rising, resulting in a delayed response and an inability to give accurate temperature readings in time. This is especially important when measuring temperature continuously. However, the temperature sensor in the prior art relies on the heat dissipation groove opened on the outside of the shell or the protruding heat sink. The fixed heat dissipation effect cannot dissipate heat quickly under high temperature conditions, which will affect the insufficient sensing accuracy of the temperature sensing head and will affect the service life of the temperature sensing head in the long run.

[0004] In view of this, in order to overcome the above technical problems, the present invention proposes a temperature sensor with heat dissipation function, which solves the above technical problems. Summary of the Invention

[0005] In order to make up for the shortcomings of the existing technology, the present invention proposes a temperature sensor with heat dissipation function. The present invention can achieve good air convection and rapid heat dissipation by increasing the heat dissipation area and the spacing between the heat dissipation elements. In addition, the heat dissipation element is a stacked heat sink structure, which forms an angle when unfolded to disturb the flow, thereby solving the problem in the existing technology that the heat dissipation structure of the temperature sensor cannot be changed.

[0006] The technical solution adopted by the present invention to solve its technical problem is:

[0007] A temperature sensor with a heat dissipation function includes a sensor body, the sensor body includes a sensor housing and a temperature sensing device arranged in the housing, the sensor housing includes an upper shell, a deformable shell in the middle part, and a lower shell;

[0008] The deformable housing includes a first deformable housing and a second deformable housing. A plurality of heat sinks are evenly arranged along the side of the first deformable housing. Each heat sink includes at least two heat sinks with adjacent surfaces overlapping. The sensor body also includes a deformable bracket.

[0009] The deformable bracket includes a first bracket with both ends arranged on the inner walls of the upper shell and the lower shell, and a second bracket embedded in the inner wall of the first deformable shell. When the temperature inside the shell rises, the second bracket will drive the plate surface of the first deformable shell to bend and expand along the overlapping surface of the heat sink on the first deformable shell to increase the heat dissipation area.

[0010] Preferably, the temperature sensing device includes a temperature sensing head, the lower end of the temperature sensing head is coupled to a temperature sensing element, and a wire is led along the end of the temperature sensing element, and the wire is used to connect to a thermistor.

[0011] Preferably, the upper shell includes a front surface of the upper shell and a side surface of the upper shell, and a plurality of ventilation holes are provided along the front surface of the upper shell, and the air outlet positions of the ventilation holes are directly opposite to the temperature sensing head.

[0012] Preferably, the distance between two adjacent groups of heat dissipating elements at room temperature is D1, and the distance changes to D2 at high temperature, and D2 is greater than D1.

[0013] Preferably, the heat sink includes a first heat sink and a second heat sink, the first heat sink and the second heat sink are arranged in parallel, and the first heat sink and the second heat sink will expand as the first deformable shell bends at high temperatures.

[0014] Preferably, the heat sink comprises a third heat sink, a fourth heat sink and a fifth heat sink, and the three groups of heat sinks are arranged in parallel at room temperature.

[0015] Preferably, both ends of the fifth heat sink are hinged to the side surfaces of the third heat sink and the fourth heat sink respectively.

[0016] Preferably, one end of the fifth heat sink is hinged to the end of the third heat sink, and the other end is hinged to the middle of the fourth heat sink.

[0017] Preferably, the deformable bracket is a memory alloy.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The present invention is provided with a deformable bracket and a deformable shell. The deformable bracket can drive the deformable shell to bend. The heat dissipation element arranged on the side of the deformable shell is composed of multiple groups of heat dissipation fins. When the deformable shell bends, the heat dissipation fins will separate and fork, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0020] 2. The present invention increases the distance between the heat dissipating elements provided on the side of the shell when the deformable shell is bent, thereby increasing the convection heat transfer coefficient and the heat dissipation efficiency.

[0021] 3. The present invention forms an angle by separating and forking the heat sinks, and the angle is an acute angle. The air flow rate in the channel will change, so that the heat sink has a certain turbulent effect, increases the residence time of the cold air and the heat sink surface, and improves the efficiency of convective heat exchange. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the cross-sectional structure of the present invention;

[0024] Figure 3 This is a schematic diagram of the first deformable shell in the first embodiment of the present invention at room temperature;

[0025] Figure 4 This is a schematic diagram of the three-dimensional structure of the first deformable shell in a high-temperature state in the first embodiment of the present invention;

[0026] Figure 5 2 is a schematic diagram of the first deformable shell in a high-temperature state in the first embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the first deformable shell in a normal temperature state in the second embodiment of the present invention;

[0028] Figure 7 2 is a schematic diagram of a first deformable shell in a high-temperature state in a second embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the deformed bracket at room temperature;

[0030] Figure 9 This is a schematic diagram of the high-temperature state of the deformed bracket;

[0031] Figure 10 It is a schematic diagram of the installation structure of the deformation bracket and the inner wall of the sensor housing.

[0032] In the figure: 10, sensor housing; 101, front of upper housing; 101a, vent; 102, first deformable housing; 102a, heat sink; 102a1, first heat sink; 102a2, second heat sink; 102a3, third heat sink; 102a4, fourth heat sink; 102a5, fifth heat sink; 103, lower housing; 104, second deformable housing; 105, side of upper housing; 20, temperature sensing device; 201, temperature sensing head; 202, temperature sensing element; 203, wire; 30, deformable bracket; 301, first bracket; 302, second bracket. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0034] First embodiment:

[0035] like Figure 1-Figure 2 As shown, a temperature sensor with a heat dissipation function according to the present invention includes a sensor body, which includes an external sensor housing 10 and an internal temperature sensing device 20. The sensor housing 10 also includes an upper housing at the upper end, a deformable housing in the middle part, and a lower housing 103 at the lower end. The deformable housing can be deformed, and the upper and lower ends of the deformable housing are fixedly connected to the upper housing and the lower housing 103 respectively. The upper housing includes an upper housing front 101 and an upper housing side 105. A vent 101a for air intake is also provided along the upper housing front 101. External air can enter the temperature sensing device 20 in the housing through the vent 101a to perform temperature measurement.

[0036] The temperature sensing device 20 includes a temperature sensing head 201, a temperature sensing element 202 disposed at the lower end of the temperature sensing head 201, and a wire 203 disposed at the end of the temperature sensing element 202. The wire 203 is used to connect to a thermistor. A gap is provided between the temperature sensing head 201 and the top of the upper housing to prevent the temperature sensing head 201 from being pressed when the upper housing is deformed.

[0037] The deformable housing includes a first deformable housing 102 and a second deformable housing 104. The first deformable housing 102 and the second deformable housing 104 are adjacent to each other and fixedly connected to form a cube. A plurality of heat dissipation elements 102a are evenly arranged along the side of the first deformable housing 102 for heat dissipation.

[0038] like Figure 3As shown, the end of the heat sink 102a is fixedly arranged on the first deformable shell 102, and the inner wall of the first deformable shell 102 is further provided with a deformable bracket 30, which is a memory alloy. The memory alloy can be trained to change from straight to bent at high temperature, such as bending the alloy into a desired shape at high temperature, and then cooling it while maintaining the bent state. This process can make the alloy remember the bent shape at high temperature, and when heated again, it will return to the bent state. If the crystal structure and internal stress of the alloy are adjusted during the cooling process, so that it can become straight at low temperature, this realizes the characteristics of bending at high temperature and straightening at low temperature. Since the memory alloy is a material in the prior art, it will not be described in detail in this article. When the deformable bracket 30 is in the low temperature state, its shape is as follows Figure 9 As shown, when in a high temperature state, the deformable bracket 30 is affected by the high temperature and returns to its original shape. Figure 8 As shown;

[0039] Among them, such as Figure 10 As shown, the deformable bracket 30 includes a first bracket 301 fixedly mounted on the inner wall of the upper shell, and a second bracket 302 fixedly arranged on the inner wall of the first deformable shell 102. When the temperature inside the shell is too high, the second bracket 302 part will be deformed to Figure 8 In this case, the first deformable shell 102 is deformed under the action of the second bracket 302. Figure 4 or Figure 5 The bend shown;

[0040] Among them, such as Figure 3 As shown, at normal temperature, since the second bracket 302 does not deform, the first deformable shell 102 is in a straight plate shape, and the distance between the heat sinks 102a is D1. Figure 5 As shown, when the temperature is high, the second bracket 302 will drive the first deformable shell 102 into a curved state. At this time, the spacing between the heat sinks 102a is selected as D2. Due to the curvature of the plate surface, D2 is required to be greater than D1. From the perspective of convective heat transfer, when the number of heat sinks 102a remains unchanged, appropriately increasing the spacing between the heat sinks can allow air to flow more freely between the heat sinks, thereby improving the convective heat transfer coefficient. The convective heat transfer amount is proportional to the convective heat transfer coefficient, thereby increasing the heat dissipation efficiency. When the temperature inside the shell is too high, the heat of the shell can be conducted and dissipated through this structure.

[0041] In addition, if Figure 5 As shown, the heat sink 102a includes two overlapping first heat sinks 102a1 and second heat sinks 102a2. When the first deformable shell 102 bends, the overlapping surfaces of the first heat sink 102a1 and the second heat sink 102a2 are opened, so that the heat exchange area is increased. Figure 3and Figure 5 In comparison, Figure 3 The heat dissipation area is defined as heat dissipation surface 1, and Figure 5 Since the overlapping surface of the first heat sink 102a1 and the second heat sink 102a2 is separated, a new heat dissipation area is created, which is defined as the heat dissipation surface 2. In this case, the heat dissipation area is increased, that is, the heat dissipation efficiency is improved.

[0042] In addition, if Figure 5 As shown, an angle a is formed between the first heat sink 102a1 and the second heat sink 102a2. The angle a is an acute angle. When a smaller angle a exists between the heat sinks 102a, the air will be gradually guided to change direction when flowing through the channel between the heat sinks 102a. As the air flows along the channel, the width of the channel gradually changes (due to the existence of the angle a), and the air flow rate will also change. This change will cause a certain amount of turbulence in the air, thereby enhancing the mixing of the air and the surface of the heat sink 102a. During the flow process, the air will continuously collide with and mix with the surface of the heat sink 102a, thereby improving the efficiency of convective heat transfer.

[0043] Therefore, by deforming the surface of the first deformable shell 102, a turbulent flow function can be achieved through the heat dissipation area, air convection, and the angle generated between the heat dissipation element 102a, which can greatly improve the heat dissipation efficiency and reduce the temperature inside the shell. When the temperature returns to normal, the first deformable shell 102 is driven by the second bracket 302 to return to a straight surface, achieving normal heat dissipation, ensuring that the air temperature inside and outside the shell is not unbalanced, which is beneficial for the temperature sensing head 201 to sense the air temperature.

[0044] Second embodiment:

[0045] The difference from the first embodiment is that Figure 6-Figure 7 As shown, in order to increase the heat dissipation effect, the heat dissipation element 102a can also be configured as a third heat dissipation fin 102a3, a fourth heat dissipation fin 102a4 and a fifth heat dissipation fin 102a5;

[0046] like Figure 7 As shown, one end of the third heat sink 102a3 can be hinged to one end of the fifth heat sink 102a5, and the end of the fifth heat sink 102a5 away from the third heat sink 102a3 is hinged to the side of the fourth heat sink 102a4. When the third heat sink 102a3 and the fourth heat sink 102a4 are unfolded, the fifth heat sink 102a5 is as shown in FIG. Figure 7 As shown, it is unfolded, at this time the heat dissipation surface is larger, and the turbulence effect is better, which is more conducive to heat dissipation;

[0047] The number of groups of the heat dissipating elements 102a in the present invention may not be limited to two or three groups as described in the embodiment. If conditions permit, the number of groups of the heat dissipating elements 102a may be greater.

[0048] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as limiting the scope of protection of the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0049] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A temperature sensor with a heat dissipation function, comprising a sensor body, wherein the sensor body comprises a sensor housing (10) and a temperature sensing device (20) disposed within the housing, characterized in that: The sensor housing (10) comprises an upper shell, a deformable shell in the middle, and a lower shell (103). The deformable shell comprises a first deformable shell (102) and a second deformable shell (104); a plurality of groups of heat sinks (102a) are evenly arranged along the side of the first deformable shell (102); each group of heat sinks (102a) comprises at least two heat sinks with adjacent surfaces overlapping; and the sensor body further comprises a deformable bracket (30); The deformable bracket (30) comprises a first bracket (301) with two ends arranged on the inner walls of the upper shell and the lower shell (103), and a second bracket (302) embedded in the inner wall of the first deformable shell (102); when the temperature inside the shell rises, the heat sink (102a) is driven to expand only by the deformation of the deformable bracket (30), thereby increasing the heat dissipation area; The distance between two adjacent groups of heat sinks (102a) is D1 in a normal temperature state, and changes to D2 in a high temperature state, where D2 is greater than D1; The heat sink (102a) comprises a first heat sink (102a1) and a second heat sink (102a2), the first heat sink (102a1) and the second heat sink (102a2) being arranged in parallel, and the first heat sink (102a1) and the second heat sink (102a2) being unfolded as the first deformable shell (102) bends at high temperatures; an angle a is formed between the first heat sink (102a1) and the second heat sink (102a2), and the angle a is an acute angle to generate air turbulence; The heat dissipation element (102a) is unfolded synchronously with the deformation of the deformable bracket (30).

2. The temperature sensor with heat dissipation function according to claim 1, characterized in that: The temperature sensing device (20) comprises a temperature sensing head (201), the lower end of the temperature sensing head (201) is coupled to a temperature sensing element (202), and a wire (203) is led along the end of the temperature sensing element (202), and the wire (203) is used to connect a thermistor.

3. The temperature sensor with heat dissipation function according to claim 2, characterized in that: The upper shell comprises an upper shell front (101) and an upper shell side (105), and a plurality of ventilation openings (101a) are provided along the upper shell front (101), with the air outlet positions of the ventilation openings (101a) facing the temperature sensing head (201).

4. The temperature sensor with heat dissipation function according to claim 1, characterized in that: The heat sink (102a) comprises a third heat sink (102a3), a fourth heat sink (102a4) and a fifth heat sink (102a5), and the three groups of heat sinks are arranged in parallel at normal temperature.

5. The temperature sensor with heat dissipation function according to claim 4, characterized in that: Both ends of the fifth heat sink (102a5) are hingedly connected to the side surfaces of the third heat sink (102a3) and the fourth heat sink (102a4).

6. The temperature sensor with heat dissipation function according to claim 5, characterized in that: One end of the fifth heat sink (102a5) is hinged to the end of the third heat sink (102a3), and the other end is hinged to the middle of the fourth heat sink (102a4).

7. The temperature sensor with heat dissipation function according to claim 1, characterized in that: The deformable bracket (30) is a memory alloy.

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