System, method, device and equipment for checking defect detection precision of copper foil

Abstract

The invention provides a calibration system, method, device and equipment for copper foil defect detection precision. The calibration system comprises a copper foil production simulator, a defect detector and a processing module, the processing module is used for controlling a to-be-detected copper foil to move at a production speed, and a plurality of defective parts cut from a defective copper foil are attached to the surface of the to-be-detected copper foil; controlling a defect detector to collect each defect part attached to the copper foil to be detected at the production speed so as to obtain test defect data; comparing the test defect data with preset defect data measured before the defective copper foil is cut to obtain a verification result; and outputting a verification result. According to the method, the preset defect data can truly reflect the copper foil defect, the test defect data can reflect the copper foil defect detected by the defect detector at the normal production speed, and the detection precision of the defect detector can be effectively verified by comparing the test defect data with the preset defect data.

Description

Technical Field

[0001] The present application belongs to the technical field of copper foil production, and specifically, relates to a calibration system, method, device and equipment for copper foil defect detection accuracy. Background Art

[0002] Electrolytic copper foil is one of the most important materials in the electronics industry and is widely used in various fields such as printed circuit boards (PCBs), copper clad laminates (CCLs), and lithium-ion battery manufacturing. With the continuous development of the electronics industry, the quality requirements for electrolytic copper foil are getting higher and higher. Therefore, during the quality inspection process, copper foil products with surface defects that do not meet the requirements need to be eliminated.

[0003] In the prior art, the method for detecting the size and number of copper foil surface defects is to use a defect detector to perform defect detection on the copper foil output by the copper foil production machine at a normal production speed (generally more than ten meters to tens of meters per minute). However, before using the defect detector, it is necessary to calibrate the detection accuracy of the defect detector. Currently, the detection accuracy calibration of the defect detector selects the copper foil at rest or moving at a low speed for verification. However, considering that the copper foil defects are at the micron level, the ability of the defect detector to capture copper foil surface defects is different at different production speeds. In particular, the successful verification of the defect detector at rest or at a low speed does not mean that it can accurately capture copper foil defects at normal production speeds.

[0004] Therefore, how to verify the defect detection ability of the defect detector at the normal production speed of copper foil is very important for the control of copper foil production quality. Summary of the invention

[0005] In view of the above problems, the present application aims to provide a copper foil defect detection accuracy calibration system, method, device and equipment, which are used to solve the problem of calibration of copper foil defect accuracy of defect detector under normal production speed of copper foil, so as to improve the control effect of copper foil production quality.

[0006] In a first aspect, the present application provides a copper foil defect detection accuracy verification system, comprising: a copper foil production simulator, a defect detector, and a processing module; the processing module is used to:

[0007] Acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut;

[0008] Controlling the copper foil production simulator to make the copper foil to be tested move at a production speed, wherein the plurality of defective portions cut from the defective copper foil are attached to the surface of the copper foil to be tested;

[0009] At the production speed, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain test defect data;

[0010] Comparing the test defect data with the preset defect data to obtain a verification result;

[0011] The verification result is outputted.

[0012] In a possible embodiment, the copper foil production simulator includes:

[0013] a first guide roller and a first driving device, wherein the copper foil to be tested wound on the first guide roller is controlled by the first driving device to be unwound at a production speed;

[0014] The second guide roller and the second driving device are used to control the second guide roller to rewind the unwound copper foil to be tested at a production speed through the second driving device.

[0015] In a possible embodiment, the multiple defective parts attached to the copper foil to be tested are obtained by cutting circles of the same size from the defective copper foil.

[0016] In a second aspect, the present application further provides a method for verifying the accuracy of copper foil defect detection, which is applied to a processing module in any verification system of the first aspect, comprising:

[0017] Acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for the plurality of defective portions of the defective copper foil before being cut;

[0018] Controlling the copper foil production simulator to make the copper foil to be tested move at a production speed, wherein a plurality of defective portions cut from defective copper foils are attached to the surface of the copper foil to be tested;

[0019] At the production speed, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain test defect data;

[0020] Comparing the test defect data with the preset defect data to obtain a verification result;

[0021] The verification result is outputted.

[0022] In a possible embodiment, the copper foil production simulator includes: a first guide roller and a first driving device, a second guide roller and a second driving device;

[0023] Accordingly, controlling the copper foil production simulator so that the copper foil to be tested moves at a production speed includes:

[0024] The first driving device controls the copper foil to be tested wound on the first guide roller to be unwound at a production speed; and the second driving device controls the second guide roller to rewind the unwound copper foil to be tested at a production speed.

[0025] In a possible embodiment, at the production speed, controlling the defect detector to collect various defective parts attached to the surface of the copper foil to be tested to obtain test defect data includes:

[0026] Controlling the defect detector to collect first surface defect data of a defective portion on the first surface of the copper foil to be tested under the production speed, wherein the defective portion on the first surface of the copper foil to be tested is formed by cutting a part of the defective portion on the defective copper foil and attaching it to the first surface;

[0027] Controlling the defect detector to collect second surface defect data of the defect to be tested on the second surface of the copper foil to be tested under the production speed, wherein the defect portion of the second surface of the copper foil to be tested is formed by cutting another defect portion of the defective copper foil and attaching it to the second surface;

[0028] Test defect data is determined according to the first surface defect data and the second surface defect data.

[0029] In a possible embodiment, the production speed includes a first speed value and a second speed value, wherein the first speed value is not equal to the second speed value;

[0030] Correspondingly, at the production speed, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain test defect data includes:

[0031] At the first speed value, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain first defect data;

[0032] At the second speed value, controlling the defect detector to collect each defect portion attached on the surface of the copper foil to be tested to obtain second defect data;

[0033] The test defect data is generated according to the first defect data and the second defect data.

[0034] In a third aspect, the present application also provides a device for verifying the accuracy of copper foil defect detection, comprising:

[0035] A first acquisition module is used to acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut;

[0036] A speed control module, used for controlling the copper foil production simulator to make the copper foil to be tested move at a production speed, wherein a plurality of defective parts cut from defective copper foils are attached to the surface of the copper foil to be tested;

[0037] A second acquisition module is used to control the defect detector to collect various defective parts attached on the surface of the copper foil to be tested at the production speed to obtain test defect data;

[0038] A comparison module, used for comparing the test defect data with the preset defect data to obtain a verification result;

[0039] An output module is used to output the verification result.

[0040] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising: a processor, and a memory communicatively connected to the processor;

[0041] The memory stores computer-executable instructions;

[0042] The processor executes the computer-executable instructions stored in the memory to implement the method in any possible implementation manner of the first aspect.

[0043] In a fifth aspect, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer execution instructions, and when the computer execution instructions are executed by a processor, they are used to implement the method in any possible implementation manner of the above-mentioned first aspect.

[0044] The present application provides a copper foil defect detection accuracy verification system, method, device and equipment. The copper foil defect detection accuracy verification system provided by the present application first pre-collects defective copper foil containing defective parts to obtain preset defect data, then cuts the defective parts on the defective copper foil onto the surface of the copper foil to be tested, then controls the copper foil production simulator to make the copper foil to be tested move at the production speed, and at the production speed, controls the defect detector to collect the defective parts attached on the surface of the copper foil to be tested, thereby obtaining test defect data, then compares the test defect data with the preset defect data, obtains the verification result according to the comparison result, and outputs the verification result. Since the preset defect data can truly reflect the number and size data of the defective parts, the test defect data obtained by the defect detector is compared with the preset defect data, and according to the error size, it can be judged whether the accuracy of the defect detector in detecting copper foil defects at the normal production speed of the copper foil is accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0046] Figure 1 A schematic diagram of the structure of a copper foil defect detection accuracy verification system provided in an embodiment of the present application;

[0047] Figure 2 A schematic diagram of a copper foil defect detection accuracy verification system module provided in an embodiment of the present application;

[0048] Figure 3 A flow chart of a method for verifying copper foil defect detection accuracy provided in an embodiment of the present application;

[0049] Figure 4 A flow chart of another method for verifying copper foil defect detection accuracy provided in an embodiment of the present application;

[0050] Figure 5 A flow chart of another method for verifying copper foil defect detection accuracy provided in an embodiment of the present application;

[0051] Figure 6 A schematic diagram of the structure of a device for verifying copper foil defect detection accuracy provided in an embodiment of the present application;

[0052] Figure 7 A hardware structure diagram of an electronic device provided in an embodiment of the present application.

[0053] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments.

[0054] Description of reference numerals:

[0055] 110-copper foil production simulator; 111-copper foil to be tested; 112-defective part; 113-first guide roller; 114-second guide roller; 120-defect detector; 130-processing module;

[0056] 601 - first acquisition module; 602 - speed control module; 603 - second acquisition module; 604 - comparison module; 605 - output module. DETAILED DESCRIPTION

[0057] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0058] In the embodiments of the present application, words such as "first" and "second" are used to distinguish the same or similar items with substantially the same functions and effects. Those skilled in the art can understand that words such as "first" and "second" do not limit the quantity and execution order, and words such as "first" and "second" do not necessarily limit the difference.

[0059] It should be noted that in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way. In the embodiments of the present application, "at least one" refers to one or more, and "more than one" refers to two or more.

[0060] It should be noted that the “at…” in the embodiments of the present application may be the instant when a certain situation occurs, or may be a period of time after the occurrence of a certain situation, and the embodiments of the present application do not specifically limit this.

[0061] In order to clearly describe the technical solutions of the embodiments of the present application, some terms and technologies involved in the embodiments of the present application are briefly introduced below:

[0062] Copper foil defects: During the production process of electrolytic copper foil, due to bubbles, impurities in the plating solution or unstable current, there are defects such as pinholes, bubbles, burrs, particles, etc. that reduce the sealing and conductivity of the copper foil. The size of the copper foil defects is basically at the micron level.

[0063] Defect detector: This application specifically refers to equipment used to detect copper foil defects, which currently mainly include visual inspection and optical inspection. Visual inspection uses industrial-grade cameras to collect copper foil surface images during the production process, and then uses corresponding image processing algorithms to extract defect edges to detect copper foil defects; optical inspection uses ultraviolet light, visible light and other light sources to scan the copper foil surface during the production process, and identifies defects through changes in reflected light, such as X-ray inspection.

[0064] During the production process, the copper foil processing machine can produce copper foil at a speed of more than ten meters to several tens of meters per minute. The existing technology mainly adopts visual inspection equipment suitable for large-scale production environment to complete copper foil defect detection. In the selection of industrial-grade cameras, CCD (Charge Coupled Device) cameras are currently mainly used as the core of image acquisition equipment. Therefore, this type of detection equipment can also be called CCD defect detector. The copper foil defect data is collected by the CCD defect detector. When the number and size of defects exceed the preset range, it can be judged that the copper foil quality does not meet the production standards.

[0065] Since different production environments will affect the accuracy of CCD defect detectors, in actual applications, in order to verify whether the accuracy of CCD defect detectors is accurate, it is necessary to calibrate the detection accuracy before use. Only when the detection accuracy meets the requirements can the detector be put into use.

[0066] In order to achieve the above-mentioned purpose, the embodiments of the present application provide a method, device, equipment and storage medium for verifying the accuracy of copper foil defect detection. Since the verification result of the defect detector under static or low-speed conditions cannot reflect the detection accuracy of copper foil defects at normal speed, the present application compares the test defect data collected at the normal production speed of the copper foil to be tested with the precise defect data (preset defect data) measured by the defective copper foil, and can judge whether the accuracy of the defect detector in detecting copper foil defects at the normal production speed of the copper foil is accurate according to the error size.

[0067] Figure 1 A schematic diagram of the structure of a copper foil defect detection accuracy verification system provided in an embodiment of the present application. Figure 2 This is a schematic diagram of a copper foil defect detection accuracy verification system module provided in an embodiment of the present application. Figure 1 and Figure 2 As shown, a copper foil defect detection accuracy verification system includes: a copper foil production simulator 110, a defect detector 120 and a processing module 130.

[0068] The processing module 130 is used to: obtain pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut; control the copper foil production simulator 110 to make the copper foil to be tested 111 move at a production speed, wherein a plurality of defective parts 112 cut from the defective copper foil are attached to the surface of the copper foil to be tested 111; at the production speed, control the defect detector 120 to collect each defective part 112 attached to the surface of the copper foil to be tested 111 to obtain test defect data; compare the test defect data with the preset defect data to obtain a verification result; and finally output the verification result.

[0069] The verification system in the above embodiment controls the movement of the copper foil 111 to be tested in the copper foil production simulator 110, thereby collecting the test defect data of the defective part 112, and then compares the test defect data with the preset defect data to understand whether the detection accuracy of the defect detector 120 meets the current detection requirements.

[0070] In another embodiment, the copper foil production simulator 110 includes: a first guide roller 113 and a first driving device (not shown in the figure), a second guide roller 114 and a second driving device (not shown in the figure). The processing module 130 controls the copper foil 111 to be tested, which is wound on the first guide roller 113, to be unwound at the production speed through the first driving device; the processing module 130 also controls the second guide roller 114 to rewind the unwound copper foil 111 to be tested at the production speed through the second driving device. The copper foil production simulator 110 defined in the above embodiment can provide an effective output speed of the copper foil to be tested.

[0071] In another embodiment, the plurality of defective portions 112 attached to the copper foil to be tested 111 are obtained by cutting the defective copper foil in circles of the same size. The above embodiment can conveniently cut the defective portions 112 on the defective copper foil to the copper foil to be tested 111 according to the same standard by the same cutting equipment, thereby improving the verification efficiency.

[0072] Figure 3 This is a flow chart of a method for verifying the accuracy of copper foil defect detection provided in an embodiment of the present application. Figure 3 As shown, a copper foil defect detection accuracy verification method can be applied to Figure 2 In the processing module shown, the verification method of the copper foil defect detection accuracy specifically includes:

[0073] S301: Acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut;

[0074] In the embodiment of the present application, the selected defective copper foil has multiple defective parts, and these defects are mainly common copper foil defects such as pinholes, bubbles, burrs, particles, etc. Before verification, it is necessary to accurately measure the defective parts on the defective copper foil through a metallographic microscope to obtain preset defect data, where the preset defect data includes the number of defective parts and the size of the defective parts.

[0075] After completing the collection of the preset defect data, all defective parts are cut out separately and used to be attached to different positions of the copper foil to be tested. Here, only attaching to the same surface is considered.

[0076] It should be noted that the defective part needs to be completely placed within the cut part when cutting. Considering the size of the defective part, a circle of appropriate size can be selected to cut all defective parts, so as to ensure that the cut parts are of the same size. Of course, other graphics of the same size can also be selected to cut the defective parts, such as squares and triangles, or they can be cut without following graphics of the same size.

[0077] S302: Controlling the copper foil production simulator so that the copper foil to be tested moves at a production speed, wherein a plurality of defective portions cut from defective copper foils are attached to the surface of the copper foil to be tested;

[0078] In the embodiment of the present application, after the defective part is cut, it needs to be attached to the surface of the same side of the copper foil to be tested. The copper foil production simulator can make the copper foil to be tested with the defective part attached move at the production speed, thereby simulating the production output process of the copper foil. The production speed here refers to the normal speed range that can be operated during the copper foil production process, which is generally more than ten meters to tens of meters per minute. Therefore, the copper foil production simulator can control the copper foil to be tested to move at any speed within the range of the production speed. In this embodiment, only a constant speed is selected as the production speed to control the movement of the copper foil to be tested.

[0079] It should be noted that the multiple defective parts cut from the defective copper foil can be directly attached to the surface of the copper foil to be tested, or circles of the same size can be cut from the copper foil to be tested and then the cut parts can be filled into the defective circles.

[0080] In a specific implementation, the copper foil production simulator includes: a first guide roller and a first driving device located at the unwinding end, and a second guide roller and a second driving device located at the winding end.

[0081] Correspondingly, the copper foil production simulator is controlled so that the copper foil to be tested moves at a production speed, including: controlling the copper foil to be tested wound on the first guide roller to be unwound at the production speed through the first driving device; and controlling the second guide roller to rewind the unwound copper foil to be tested at the production speed through the second driving device.

[0082] S303: at the production speed, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain test defect data;

[0083] Under the condition that the copper foil to be tested moves at the production speed, the defect detector is controlled to collect all defective parts of the copper foil to be tested as it passes. When the copper foil to be tested with defective parts has finished moving, the defect collector obtains the test defect data on the copper foil to be tested. The test defect data here includes the number of defective parts collected for the copper foil to be tested and the size of the defective parts.

[0084] S304: Compare the test defect data with the preset defect data to obtain a verification result;

[0085] The preset defect data is collected manually through a metallographic microscope, so it can basically reflect the real defect data of the defective part. However, the number and size of the defective parts collected by the defect detector are not necessarily exactly the same as the preset defect data. Therefore, in order to verify the accuracy and precision of the defect collector, it is necessary to compare the test defect data with the preset defect data to obtain the verification result.

[0086] Generally speaking, the defect detector has high requirements for the number of defect parts, and relatively low requirements for the size of defect parts. In the embodiment of the present application, when the error between the number of defect parts in the test defect data and the number of defect parts in the preset defect data does not exceed 1%, and the error between the size of the defect parts in the test defect data and the size of the defect parts in the preset defect data does not exceed 30%, it can be considered that the defect detector has met the requirements for the detection accuracy of copper foil defects, so the defect detector can be used to detect copper foil defects in the normal production process of copper foil.

[0087] S305: Output the verification result.

[0088] When the test defect data is compared with the preset defect data and meets the requirements, a prompt indicating that the detector is qualified can be output, otherwise an output indicating that the detector is unqualified can be output.

[0089] As for the output mode of the verification result, it can be in the form of audio, video and / or picture.

[0090] In the above embodiment, the preset defect data of the defective copper foil is first obtained, and then the defective portion of the defective copper foil is cut onto the copper foil to be tested, and then the movement of the copper foil to be tested is controlled, and the defect detector is controlled to collect the defective portion on the copper foil to be tested to obtain the test defect data, and then the test defect data is compared with the preset defect data, so that the detection accuracy of the defect detector can be determined, which is beneficial to the defect detection in the normal production process of the copper foil, thereby reducing the outflow of defective products.

[0091] Figure 4 Another method for checking the accuracy of copper foil defect detection provided in this embodiment is a flow chart. Figure 3 On the basis of the illustrated embodiment, the verification method for the copper foil defect detection accuracy is improved.

[0092] like Figure 4 As shown, a method for verifying the accuracy of copper foil defect detection includes:

[0093] S401: Acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut;

[0094] In the embodiment of the present application, this step can refer to the description of step S301 and will not be repeated here.

[0095] It should be noted that in Figure 1 In the embodiment shown, the defective parts are all attached to the surface of one side of the copper foil to be tested, and the defect detector is only set on this side. However, in the normal production process of copper foil, defects are likely to appear on both sides of the copper foil. Therefore, in this step, considering the actual situation, the cut defective parts can be scattered and attached to the two surfaces of the copper foil to be tested for verification.

[0096] S402: Controlling the copper foil production simulator so that the copper foil to be tested moves at a production speed, wherein a plurality of defective portions cut from defective copper foils are attached to the surface of the copper foil to be tested;

[0097] In the embodiment of the present application, this step can refer to the description of step S302 and will not be repeated here.

[0098] S403: controlling the defect detector to collect first surface defect data of a defective portion on a first surface of the copper foil to be tested under the production speed, wherein the defective portion on the first surface of the copper foil to be tested is formed by cutting a part of the defective portion on the defective copper foil and attaching it to the first surface;

[0099] S404: controlling the defect detector to collect second surface defect data of the defect to be tested on the second surface of the copper foil to be tested under the production speed, wherein the defect portion of the second surface of the copper foil to be tested is formed by cutting another defect portion of the defective copper foil and attaching it to the second surface;

[0100] In steps S403 and S404, since the defective parts are attached to the two surfaces of the copper foil to be tested, it is considered to collect the test defect data through two steps. However, the two steps can be performed one after the other or simultaneously.

[0101] When step S403 and step S404 are executed one after another, there is only one defect detector. Then in step S403, the copper foil production simulator is first controlled to make the copper foil to be tested move once at a constant production speed, and the defect detector is controlled to collect multiple defective parts on the surface of the corresponding side to obtain the first defect data; then the position of the defect detector is adjusted so that it can be aligned with the other side of the copper foil to be tested. In step S404, the copper foil production simulator is controlled again to make the copper foil to be tested move once at the same production speed, and at this time, the same defect detector is still controlled to collect multiple defective parts on the surface of the other side to obtain the second defect data. It should be noted that in this case, the result will not be affected if step S403 and step S404 are executed in reverse order.

[0102] When steps S403 and S404 are executed simultaneously, a defect detector is provided, one on each side of the copper foil to be tested, so as to facilitate simultaneous detection of defective parts. At this time, it is only necessary to control the copper foil production simulator to make the copper foil to be tested move once at a constant production speed, and at the same time control the two defect detectors to collect the defective parts of the corresponding side surface respectively, so as to obtain the first defect data and the second defect data.

[0103] In the specific production process, since the copper foil flows out at one time during the production process, considering the time cost, the defect detectors are distributed on both sides of the copper foil to simultaneously detect the defects of the copper foil on each side of the defect. Therefore, in the verification process, it is naturally prioritized to set up a defect detector on both sides of the copper foil to be tested, and collect the test defect data of the first surface and the second surface at the same time.

[0104] S405: Determine test defect data according to the first surface defect data and the second surface defect data;

[0105] Since the defective parts are dispersed on the two sides of the copper foil to be tested, the test defect data obtained by summing the first surface defect data and the second surface defect number can reflect the detection result of the defective parts on the copper foil to be tested under the defect detector.

[0106] S406: Compare the test defect data with the preset defect data to obtain a verification result;

[0107] S407: Output the verification result.

[0108] In the embodiment of the present application, the above two steps can be described as steps S304 and S305 respectively, and will not be repeated here.

[0109] In the above embodiment, since the defective parts are cut and scattered on the two sides of the copper foil to be tested, they can better reflect the defect distribution law in the copper foil production process. Therefore, the sum of the collected first surface defect data and the second surface defect data can better reflect the actual defect detection level of the defect detector, which makes the verification process of the copper foil defect detection accuracy more reasonable.

[0110] Figure 5 Another method for checking the accuracy of copper foil defect detection provided in this embodiment is a flow chart. Figure 3 On the basis of the embodiment shown, the verification method of copper foil defect detection accuracy is improved. Figure 5 As shown, a method for verifying the accuracy of copper foil defect detection includes:

[0111] S501: Acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut;

[0112] In the embodiment of the present application, this step can refer to the description of step S301 and will not be repeated here.

[0113] exist Figure 3 In the shown embodiment, the processing module only controls the copper foil production simulator to move once. In order to avoid the problem of large errors that may occur during detection due to only detection, in the embodiment of the present application, the processing module needs to control the copper foil production simulator so that the copper foil to be tested moves twice at a first speed value and a second speed value respectively, wherein the first speed value and the second speed value both belong to the production speed range, and the two speed values ​​are different. Different speed values ​​are selected to verify whether different speeds will have a significant impact on the defect data under normal production speed.

[0114] Specifically, the defect data collection method for two tests with different speed values ​​is as follows:

[0115] S502: Control the copper foil production simulator so that the copper foil to be tested moves at a first speed value;

[0116] In this step, in order to reflect the difference between the first speed value and the second speed value, a lower production speed may be selected as the first speed value, such as 15 m / min.

[0117] S503: at a first speed value, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain first defect data;

[0118] In this step, after the copper foil to be tested has completely passed through the defect detector, the first defect data at the first speed value can be obtained.

[0119] Thereafter, in order to obtain the second defect data at the second speed value, it is necessary to transfer the copper foil to be tested on the second guide roller to the first guide roller. For example, you can choose to directly exchange the two guide rollers, or control the second guide roller as the unwinding end and the first guide roller as the winding end, and rewind the copper foil to be tested on the second guide roller onto the first guide roller.

[0120] S504: Control the copper foil production simulator so that the copper foil to be tested moves at a second speed value;

[0121] After the copper foil to be tested is again at the end of the original first guide roller, the copper foil production simulator can be controlled again to make the copper foil to be tested move at the second speed value. The second speed value can select a higher production speed, such as 30 meters / minute.

[0122] S405: at a second speed value, controlling the defect detector to collect each defect portion attached on the surface of the copper foil to be tested, and obtaining second defect data;

[0123] When the copper foil to be tested completely passes through the defect detector again, the second defect data at the second speed value can be obtained.

[0124] It should be noted that the order of steps S502 to S503 and steps S504 to S505 can be exchanged without affecting the result, which is essentially equivalent to changing the first speed value and the second speed value.

[0125] S506: Generate test defect data according to the first defect data and the second defect data.

[0126] Generally speaking, if the difference between the first defect data and the second defect data is not obvious, it can basically be explained that the detection effect of the defect detector at different speed values ​​under the production speed is equivalent. At this time, it can be considered that there is no abnormality in the first defect data and the second defect data. At this time, the test defect data can be obtained by averaging the first defect data and the second defect data.

[0127] If it is found that there is a large gap between the first defect data and the second defect data, it means that there is a problem with the defect detection result. At this time, re-detection is required, or a third speed value can be added to detect again to obtain the third defect data, and then the two defect data with relatively close data are selected for processing to obtain the test defect data.

[0128] S507: Compare the test defect data with the preset defect data to obtain a verification result;

[0129] S508: Output the verification result.

[0130] In the embodiment of the present application, the above two steps can be described as steps S304 and S305 respectively, and will not be repeated here.

[0131] In the above embodiment, the defect data is detected at two different speed values, which is conducive to avoiding the possibility of errors in the test room data, thereby reducing the impact of abnormal data on the verification results during the detection process, and can effectively verify the detection accuracy of the defect detector. Of course, during the verification process, more speed values ​​can also be selected for detection according to actual conditions.

[0132] Figure 6 This is a schematic diagram of a copper foil defect detection accuracy verification device provided by an embodiment of the present application. The device may be in the form of software and / or hardware. Figure 1 and Figure 2 A copper foil defect detection accuracy verification device includes: a first acquisition module 601, a speed control module 602, a second acquisition module 603, a comparison module 604 and an output module 605.

[0133] A first acquisition module 601 is used to acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut;

[0134] The speed control module 602 is used to control the copper foil production simulation 110 so that the copper foil to be tested 111 moves at the production speed, wherein a plurality of defective parts cut from defective copper foil are attached to the surface of the copper foil to be tested 111;

[0135] The second acquisition module 603 is used to control the defect detector 120 to collect each defect part 112 attached to the surface of the copper foil 111 to be tested at the production speed to obtain test defect data;

[0136] The comparison module 604 is used to compare the test defect data with the preset defect data to obtain a verification result;

[0137] The output module 605 is used to output the verification result.

[0138] In some embodiments, the copper foil production simulator 110 includes: a first guide roller 113 and a first driving device, a second guide roller 114 and a second driving device.

[0139] Accordingly, the speed control module 602 is specifically configured as follows:

[0140] The first driving device controls the copper foil 111 to be tested, which is wound on the first guide roller 113, to be unwound at a production speed; and the second driving device controls the second guide roller 114 to rewind the unwound copper foil 111 to be tested at a production speed.

[0141] In some embodiments, the second acquisition module 603 is specifically configured to:

[0142] Controlling the defect detector 120 to collect first surface defect data of a defect portion 112 on the first surface of the copper foil 111 to be tested under the production speed, wherein the defect portion 112 on the first surface of the copper foil 111 to be tested is formed by cutting a part of the defect portion 112 on the defective copper foil and attaching it to the first surface;

[0143] Controlling the defect detector 120 to collect second surface defect data of the defect to be tested on the second surface of the copper foil to be tested 111 under the production speed, wherein the defect portion 112 on the second surface of the copper foil to be tested 111 is formed by cutting and attaching another part of the defect portion 112 on the defective copper foil to the second surface;

[0144] The test defect data is determined based on the first surface defect data and the second surface defect data.

[0145] In some embodiments, the production speed includes a first speed value and a second speed value, wherein the first speed value is not equal to the second speed value, and the second acquisition module 603 may also be configured as follows:

[0146] At the first speed value, the defect detector 120 is controlled to collect each defect portion 112 attached to the surface of the copper foil 111 to be tested, and obtain first defect data;

[0147] At the second speed value, the defect detector 120 is controlled to collect each defect portion 112 attached to the surface of the copper foil 111 to be tested, and obtain second defect data;

[0148] Test defect data is generated according to the first defect data and the second defect data.

[0149] The verification device provided in the embodiment of the present application has the same implementation principle and technical effects as those in the aforementioned verification method embodiment. For the sake of brief description, for matters not mentioned in the device embodiment, reference can be made to the corresponding contents in the aforementioned verification method embodiment.

[0150] Figure 7 A hardware structure diagram of an electronic device provided in an embodiment of the present application. This embodiment provides an electronic device, comprising: at least one processor 701, and a memory 702 in communication with the at least one processor 701; the memory 702 stores computer-executable instructions; the processor 701 executes the computer-executable instructions stored in the memory 702 to implement the verification method described in any of the above embodiments.

[0151] Figure 7 The electronic device shown also includes a communication interface 703 and a communication bus 704, wherein the processor 701, the memory 702 and the communication interface 703 are connected to each other via the communication bus 704. The communication bus 704 can be divided into an address bus, a data bus, a control bus, etc. Figure 7 In the figure, only one thick line is used to represent the communication bus 704, but it does not mean that there is only one communication bus 704 or one type of communication bus 704. The processor 701 may also be called a controller, and there is no limitation on the name.

[0152] In the embodiment of the present application, the memory 702 stores instructions that can be executed by at least one processor 701. The at least one processor 701 can execute the verification method discussed above by executing the instructions stored in the memory 702. The processor 701 can implement Figure 7 The functions of each module in the device shown.

[0153] Among them, the processor 701 is the control center of the device, and can use various interfaces and lines to connect the various parts of the entire control device. By running or executing instructions stored in the memory 702 and calling data stored in the memory 702, the various functions of the device and process data, the device can be monitored as a whole.

[0154] In one possible design, the processor 701 may include one or more processing units, and the processor 701 may integrate an application processor and a modem processor, wherein the application processor mainly processes an operating system, a user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the modem processor may not be integrated into the processor 701. In some embodiments, the processor 701 and the memory 702 may be implemented on the same chip or on separate chips.

[0155] Processor 701 can be a general-purpose processor, such as a central processing unit (CPU), a digital signal processor, an application-specific integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component, and can implement or execute the various methods, steps and logic block diagrams disclosed in the embodiments of the present application. A general-purpose processor can be a microprocessor or any conventional processor, etc. The steps of the verification method disclosed in the embodiments of the present application can be directly embodied as a hardware processor to be executed, or a combination of hardware and software modules in the processor can be executed.

[0156] The memory 702 is a non-volatile computer-readable storage medium that can be used to store non-volatile software programs, non-volatile computer executable programs and modules. The memory 702 may include at least one type of storage medium, such as a flash memory, a hard disk, a multimedia card, a card-type memory, a random access memory (Random Access Memory, RAM), a static random access memory (Static Random Access Memory, SRAM), a programmable read-only memory (Programmable Read Only Memory, PROM), a read-only memory (Read Only Memory, ROM), an electrically erasable programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, EEPROM), a magnetic memory, a disk, an optical disk, etc. The memory 702 is any other medium that can be used to carry or store a desired program code in the form of an instruction or data structure and can be accessed by a computer, but is not limited thereto. The memory 702 in the embodiment of the present application can also be a circuit or any other device that can realize a storage function, for storing program instructions and / or data.

[0157] By programming the processor 701, the code corresponding to the verification method described in the above embodiment can be fixed into the chip, so that the chip can execute the verification method when it is running. Figure 3 The steps of the verification method of the embodiment shown are as follows: How to design and program the processor 701 is a technique well known to those skilled in the art and will not be described in detail here.

[0158] The embodiment of the present application also provides a computer-readable storage medium, in which a computer-executable instruction is stored, and when the computer-executable instruction is executed by a processor, it is used to implement the verification method described in any of the above embodiments, so it will not be repeated here. In addition, the description of the beneficial effects of the same method will not be repeated. For technical details not disclosed in the computer storage medium embodiment involved in the present invention, please refer to the description of the method embodiment of the present invention.

[0159] In some possible implementations, various aspects of the verification method provided by the present application may also be implemented in the form of a program product, which includes a program code. When the program product is run on an apparatus, the program code is used to enable the control device to execute the steps of the verification method according to various exemplary implementations of the present application described above in this specification.

[0160] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0161] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0162] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0163] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0164] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A copper foil defect detection accuracy verification system, characterized in that: include: Copper foil production simulator, defect detector and processing module; the processing module is used for: Acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut; Controlling the copper foil production simulator to make the copper foil to be tested move at a production speed, wherein the surface of the copper foil to be tested is provided with the plurality of defective portions cut from the defective copper foil; At the production speed, controlling the defect detector to collect various defective parts attached to the surface of the copper foil to be tested to obtain test defect data; Comparing the test defect data with the preset defect data to obtain a verification result; The verification result is outputted.

2. The verification system according to claim 1, characterized in that: The copper foil production simulator comprises: a first guide roller and a first driving device, wherein the copper foil to be tested wound on the first guide roller is controlled by the first driving device to be unwound at a production speed; The second guide roller and the second driving device are used to control the second guide roller to rewind the unwound copper foil to be tested at a production speed through the second driving device.

3. The verification system according to claim 1, characterized in that: The multiple defective parts attached to the copper foil to be tested are obtained by cutting circles of the same size from the defective copper foil.

4. A method for verifying the accuracy of copper foil defect detection, characterized in that: The processing module used in the verification system according to claim 1 comprises: Acquire pre-collected preset defect data, wherein the preset defect data is measured using a metallographic microscope for the plurality of defective portions of the defective copper foil before it is cut; Controlling the copper foil production simulator to make the copper foil to be tested move at a production speed, wherein a plurality of defective portions cut from defective copper foils are attached to the surface of the copper foil to be tested; At the production speed, controlling the defect detector to collect various defective parts attached to the surface of the copper foil to be tested to obtain test defect data; Comparing the test defect data with the preset defect data to obtain a verification result; The verification result is outputted.

5. The verification method according to claim 4, characterized in that: The copper foil production simulator comprises: a first guide roller and a first driving device, a second guide roller and a second driving device; Accordingly, controlling the copper foil production simulator so that the copper foil to be tested moves at a production speed includes: The first driving device controls the copper foil to be tested wound on the first guide roller to be unwound at a production speed; and the second driving device controls the second guide roller to rewind the unwound copper foil to be tested at a production speed.

6. The verification method according to claim 4, characterized in that: At the production speed, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain test defect data includes: Controlling the defect detector to collect first surface defect data of a defective portion on the first surface of the copper foil to be tested under the production speed, wherein the defective portion on the first surface of the copper foil to be tested is formed by cutting a part of the defective portion on the defective copper foil and attaching it to the first surface; Controlling the defect detector to collect second surface defect data of the defect to be tested on the second surface of the copper foil to be tested under the production speed, wherein the defect portion of the second surface of the copper foil to be tested is formed by cutting another defect portion of the defective copper foil and attaching it to the second surface; Test defect data is determined according to the first surface defect data and the second surface defect data.

7. The verification method according to claim 4, characterized in that: The production speed includes a first speed value and a second speed value, wherein the first speed value is not equal to the second speed value; Correspondingly, at the production speed, controlling the defect detector to collect various defective parts attached to the surface of the copper foil to be tested to obtain test defect data includes: At the first speed value, controlling the defect detector to collect various defective parts attached on the surface of the copper foil to be tested to obtain first defect data; At the second speed value, controlling the defect detector to collect each defect portion attached on the surface of the copper foil to be tested to obtain second defect data; The test defect data is generated according to the first defect data and the second defect data.

8. A device for checking the accuracy of copper foil defect detection, characterized in that: include: A first acquisition module is used to acquire pre-collected preset defect data, wherein the preset defect data is measured by using a metallographic microscope for multiple defective parts of the defective copper foil before it is cut; A speed control module, used for controlling the copper foil production simulator to make the copper foil to be tested move at a production speed, wherein a plurality of defective parts cut from defective copper foils are attached to the surface of the copper foil to be tested; A second acquisition module is used to control the defect detector to collect various defective parts attached on the surface of the copper foil to be tested at the production speed to obtain test defect data; A comparison module, used for comparing the test defect data with the preset defect data to obtain a verification result; An output module is used to output the verification result.

9. An electronic device, characterized in that: include: at least one processor, and a memory communicatively coupled to the at least one processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method according to any one of claims 4 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, which are used to implement the method according to any one of claims 4 to 7 when executed by a processor.

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