Defect detection method and system for ceramic substrate

Abstract

The invention provides a defect detection method and system for a ceramic substrate, and the method comprises the steps: collecting an appearance image of a to-be-detected ceramic substrate based on an imaging device, carrying out the preprocessing and analysis of the appearance image, and determining a suspicious region; performing internal scanning on the suspicious area from multiple angles based on ultrasonic scanning, and dynamically receiving and analyzing ultrasonic echo signals after internal scanning to determine defect characteristics of the to-be-detected ceramic substrate; and recording and classifying the defect characteristics of the to-be-detected ceramic substrate, and labeling and displaying the defects of the to-be-detected ceramic substrate based on recording and classification results. Through combined detection of the surface and the interior of the to-be-detected ceramic substrate, the efficiency and the accuracy of defect detection of the ceramic substrate are improved, and the working performance and the reliability of the ceramic substrate are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of defect detection, and in particular to a defect detection method and system for a ceramic substrate. Background Art

[0002] With the rapid development of electronic technology, ceramic substrates are widely used in electronic equipment, integrated circuits and other fields due to their good electrical insulation, high thermal conductivity, high mechanical strength and other properties;

[0003] However, in the production process of ceramic substrates, various defects will inevitably occur due to the influence of factors such as raw materials and process conditions. Common defect types include surface defects, cracks, pores, bubbles, adhesion, dot scars, irregular scars, bumps, spots, dirt, etc. If these defects are not detected and handled in time, they may lead to reduced product performance and reliability, and even cause safety hazards;

[0004] Traditional defect detection mostly relies on experienced staff to conduct detection, which has problems such as low detection efficiency, low accuracy, and easy missed detection. Since it relies on the experience and attention of the inspectors, it is not only labor-intensive, but also difficult to ensure the consistency and reliability of the detection. As a result, the defect detection of ceramic substrates is limited and one-sided, which greatly reduces the detection effect;

[0005] Therefore, in order to overcome the above defects, the present invention provides a defect detection method and system for a ceramic substrate. Summary of the invention

[0006] The present invention provides a defect detection method and system for ceramic substrates, which are used to collect the appearance image of the ceramic substrate to be detected through an imaging device, and analyze the appearance image, so as to effectively determine the suspicious area on the ceramic substrate to be detected, which provides convenience for further defect detection. Secondly, the internal situation of the suspicious area is scanned by ultrasonic scanning, and the scanning result is analyzed, so as to accurately and effectively determine the specific defect characteristics when defects exist, which is convenient for determining the defect type and defect degree of the ceramic substrate to be detected. Finally, the obtained defect characteristics are recorded and classified. At the same time, the defects of the ceramic substrate to be detected are marked and displayed, which is convenient for management personnel to quickly and effectively view the ceramic substrate. Through the combined detection of the surface and the interior of the ceramic substrate to be detected, the efficiency and accuracy of the defect detection of the ceramic substrate are improved, and the working performance and reliability of the ceramic substrate are guaranteed.

[0007] The present invention provides a defect detection method for a ceramic substrate, comprising:

[0008] Step 1: Capture the appearance image of the ceramic substrate to be inspected based on an imaging device, pre-process and analyze the appearance image, and determine the suspicious area;

[0009] Step 2: Scan the suspicious area internally from multiple angles based on ultrasonic scanning, and dynamically receive and analyze the ultrasonic echo signal after the internal scanning to determine the defect characteristics of the ceramic substrate to be inspected;

[0010] Step 3: Record and classify the defect features of the ceramic substrate to be inspected, and annotate and display the defects of the ceramic substrate to be inspected based on the recording and classification results.

[0011] Preferably, a method for defect detection of a ceramic substrate, in step 1, collecting an appearance image of the ceramic substrate to be detected based on an imaging device, comprises:

[0012] Obtain the appearance posture of the ceramic substrate to be inspected, and provide position placement guidance for the ceramic substrate to be inspected based on the inspection area and appearance posture in the inspection platform;

[0013] Analyze the image acquisition requirements to obtain basic configuration parameters, and adapt the parameters of the imaging device based on the basic configuration parameters. At the same time, obtain the lighting conditions of the detection area in the detection platform based on the image acquisition requirements, and determine the distribution position and lighting parameters of the light source based on the lighting conditions;

[0014] The light source is configured based on the distribution position and the lighting parameters, and the imaging device is controlled based on the configuration result and the position placement guidance result to perform continuous multi-angle and multi-frequency image acquisition on the ceramic substrate to be inspected, so as to obtain the appearance image of the ceramic substrate to be inspected.

[0015] Preferably, a defect detection method for a ceramic substrate controls an imaging device to continuously capture multi-angle and multi-frequency images of a ceramic substrate to be detected, comprising:

[0016] Obtaining the appearance posture of the ceramic substrate to be inspected, and determining a single angle transformation value based on the appearance posture and image acquisition requirements;

[0017] At the same time, the image acquisition frequency of the imaging device at each angle is determined based on the image acquisition requirements, and the automatic triggering interval of the imaging device is configured based on the image acquisition frequency;

[0018] Based on the single angle transformation value of the imaging device and the configuration result of the automatic triggering interval, continuous multi-angle and multi-frequency image acquisition is performed on the ceramic substrate to be inspected.

[0019] Preferably, in a method for defect detection of a ceramic substrate, in step 1, preprocessing and analyzing the appearance image to determine the suspicious area includes:

[0020] Acquire the obtained appearance image, and divide the appearance image into regions based on a preset size window;

[0021] Extracting the pixel value of each pixel point in each area based on the area division result, and performing average processing on the pixel value of each pixel point in each area to obtain the average pixel;

[0022] The pixel value of the central pixel of each region is updated based on the mean pixel, and a denoised appearance image is obtained based on the update result;

[0023] Grayscale the denoised appearance image, and extract grayscale threshold distribution features based on the grayscale processing result;

[0024] Based on the gray threshold distribution characteristics, the gray threshold concentrated area in the denoised appearance image is stretched, and the multi-dimensional image features in the denoised appearance image are extracted based on the stretching processing result;

[0025] The multi-dimensional image features are input into the preset machine learning model for identification and analysis to obtain suspicious areas.

[0026] Preferably, in a method for defect detection of a ceramic substrate, in step 1, preprocessing and analyzing the appearance image to determine the suspicious area includes:

[0027] Obtaining the obtained suspicious area, and delineating the suspicious area on the ceramic substrate to be inspected based on the delineation mark;

[0028] Based on the delineation results, a global scan is performed on the ceramic substrate to be inspected to obtain a scanned image, and the scanned image is visualized in a preset coordinate system;

[0029] Based on the visual display result, the circled mark is aligned with the size mark in the preset coordinate system, and the position coordinates and distribution range of the suspicious area on the ceramic substrate to be inspected are obtained based on the alignment result;

[0030] An internal scanning guidance report is generated based on the location coordinates and distribution range, and the internal scanning guidance report is fed back to the management terminal.

[0031] Preferably, in a defect detection method for a ceramic substrate, in step 2, an internal scan of a suspicious area is performed from multiple angles based on ultrasonic scanning, and an ultrasonic echo signal after the internal scan is dynamically received and analyzed to determine the defect characteristics of the ceramic substrate to be detected, including:

[0032] Obtain the material properties of the ceramic substrate, analyze the material properties of the ceramic substrate based on the ultrasonic scanning knowledge system, and determine the ultrasonic frequency required for defect detection of the ceramic substrate;

[0033] Determine a horizontal position movement sequence of the ultrasonic transmitter during the detection process based on the detection requirements, and determine the relative distances between the ultrasonic transmitter and the ceramic substrate to be detected at different detection positions based on the horizontal position movement sequence;

[0034] Determine the ultrasonic time window at different detection positions based on the propagation speed and relative distance of the ultrasonic wave;

[0035] Based on the ultrasonic transmitter, ultrasonic signals are sequentially transmitted to the suspicious areas in the ceramic substrate to be detected according to the horizontal position movement sequence, and the ultrasonic echo signals at each detection position are distinguished and received based on the ultrasonic time window;

[0036] Preprocessing the ultrasonic echo signal at each detection position based on the differentiated receiving result, and displaying the preprocessed ultrasonic echo signal in waveform;

[0037] Determine the waveform amplitude and time series information at each detection position based on the waveform display result, and determine the ultrasonic echo signal strength at each detection position based on the waveform amplitude and time series information;

[0038] Extracting the relative position coordinates of each detection position relative to the suspicious area, and generating an ultrasonic feature image based on the relative position coordinates and the corresponding ultrasonic echo signal intensity, and generating a corresponding grayscale value level based on the ultrasonic echo signal intensity, and grayscale mapping the grayscale value level in the ultrasonic feature image to obtain a target ultrasonic feature image;

[0039] Acquire an ultrasonic characteristic image of a standard non-defective ceramic substrate, and compare the ultrasonic characteristic image of the standard non-defective ceramic substrate with a target ultrasonic characteristic image of the ceramic substrate to be inspected;

[0040] The defect characteristics of the ceramic substrate to be inspected are determined based on the comparison results.

[0041] Preferably, in a defect detection method for a ceramic substrate, in step 3, the defect features of the ceramic substrate to be detected are recorded and classified, and the defects of the ceramic substrate to be detected are annotated and displayed based on the recording and classification results, including:

[0042] Obtaining the defect features of the ceramic substrate to be inspected, and matching the defect features with multi-dimensional defect features under known defect types one by one;

[0043] Determine the defect type corresponding to the defect feature of the ceramic substrate to be inspected based on the one-to-one matching results, and at the same time, evaluate the defect feature based on a preset evaluation model to obtain the defect level of the ceramic substrate to be inspected;

[0044] Dispatching the position coordinates of the suspicious area on the ceramic substrate to be inspected, and correcting the position coordinates of the suspicious area on the ceramic substrate to be inspected based on the defect characteristics to obtain the position representation of the defect;

[0045] The defect type, defect level and position characteristics corresponding to the defect characteristics of the ceramic substrate to be inspected are recorded.

[0046] Preferably, in a method for defect detection of a ceramic substrate, in step 3, the defects of the ceramic substrate to be detected are marked and displayed based on the recording and classification results, including:

[0047] Obtaining the record and classification results of the defect features of the ceramic substrate, and generating a multi-dimensional mark identification of the defect features based on the record and classification results;

[0048] The defects of the ceramic substrate to be inspected are marked and displayed based on multi-dimensional marking.

[0049] The present invention provides a defect detection system for a ceramic substrate, comprising:

[0050] A suspicious area determination module is used to collect the appearance image of the ceramic substrate to be inspected based on an imaging device, and pre-process and analyze the appearance image to determine the suspicious area;

[0051] A defect detection module is used to perform internal scanning of the suspicious area from multiple angles based on ultrasonic scanning, and dynamically receive and analyze the ultrasonic echo signal after the internal scanning to determine the defect characteristics of the ceramic substrate to be detected;

[0052] The recording and marking module is used to record and classify the defect characteristics of the ceramic substrate to be inspected, and to mark and display the defects of the ceramic substrate to be inspected based on the recording and classification results.

[0053] Preferably, a defect detection system for a ceramic substrate, a suspicious area determination module, comprises:

[0054] A guidance unit, used to obtain the appearance posture of the ceramic substrate to be inspected, and to provide guidance on the position of the ceramic substrate to be inspected based on the inspection area and the appearance posture in the inspection platform;

[0055] A configuration unit is used to analyze the image acquisition requirements, obtain basic configuration parameters, and perform parameter adaptation on the imaging device based on the basic configuration parameters. At the same time, it obtains the lighting conditions of the detection area in the detection platform based on the image acquisition requirements, and determines the distribution position and lighting parameters of the light source based on the lighting conditions;

[0056] The image acquisition unit is used to configure the light source based on the distribution position and lighting parameters, and control the imaging device to perform continuous multi-angle and multi-frequency image acquisition on the ceramic substrate to be inspected based on the configuration result and the position placement guidance result to obtain the appearance image of the ceramic substrate to be inspected.

[0057] Compared with the prior art, the present invention has the following beneficial effects:

[0058] 1. The appearance image of the ceramic substrate to be inspected is collected by an imaging device, and the appearance image is analyzed to effectively determine the suspicious area on the ceramic substrate to be inspected, which provides convenience for further defect detection. Secondly, the internal situation of the suspicious area is scanned by ultrasonic scanning, and the scanning results are analyzed to accurately and effectively determine the specific defect characteristics when defects exist, which is convenient for determining the defect type and degree of the ceramic substrate to be inspected. Finally, the obtained defect characteristics are recorded and classified. At the same time, the defects of the ceramic substrate to be inspected are marked and displayed, which is convenient for management personnel to quickly and effectively view the ceramic substrate. Through the combined detection of the surface and interior of the ceramic substrate to be inspected, the efficiency and accuracy of the defect detection of the ceramic substrate are improved, and the working performance and reliability of the ceramic substrate are guaranteed.

[0059] 2. By determining the appearance posture of the ceramic substrate to be inspected, the placement guidance of the ceramic substrate to be inspected is realized according to the inspection area and appearance posture in the inspection platform. Secondly, the image acquisition requirements are analyzed to determine the lighting conditions of the imaging device and the inspection area in the inspection platform, so as to realize the effective configuration of the distribution position and lighting parameters of the imaging device and the light source, which provides traversal and guarantee for image acquisition. Finally, according to the configuration results, continuous multi-angle and multi-frequency image acquisition is performed on the ceramic substrate to be inspected, so as to realize the effective acquisition of the appearance image of the ceramic substrate to be inspected, which provides a reliable basis for determining whether there are defects in the ceramic substrate to be inspected.

[0060] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures specifically pointed out in this application document.

[0061] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0063] Figure 1is a flow chart of a defect detection method for a ceramic substrate in an embodiment of the present invention;

[0064] Figure 2 This is a flow chart of step 1 in a defect detection method for a ceramic substrate according to an embodiment of the present invention;

[0065] Figure 3 4 is a structural diagram of a defect detection system for a ceramic substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0066] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0067] Embodiment 1:

[0068] This embodiment provides a method for detecting defects in a ceramic substrate. Figure 1 As shown, including:

[0069] Step 1: Capture the appearance image of the ceramic substrate to be inspected based on an imaging device, pre-process and analyze the appearance image, and determine the suspicious area;

[0070] Step 2: Scan the suspicious area internally from multiple angles based on ultrasonic scanning, and dynamically receive and analyze the ultrasonic echo signal after the internal scanning to determine the defect characteristics of the ceramic substrate to be inspected;

[0071] Step 3: Record and classify the defect features of the ceramic substrate to be inspected, and annotate and display the defects of the ceramic substrate to be inspected based on the recording and classification results.

[0072] In this embodiment, the imaging device is pre-set, and may be, for example, a device with an imaging function such as a camera.

[0073] In this embodiment, the ceramic substrate to be inspected refers to a sample that needs to be inspected for defects, wherein the ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double sides) of an aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent soft solderability and high adhesion strength, and can be etched with various patterns like a PCB board, and has a large current carrying capacity.

[0074] In this embodiment, the appearance image refers to the result obtained by collecting images of the surface of the ceramic substrate to be inspected by an imaging device, and is used to characterize the appearance of the ceramic substrate to be inspected.

[0075] In this embodiment, preprocessing refers to performing operations such as denoising and contrast enhancement on the appearance image to highlight possible defect areas.

[0076] In this embodiment, the suspicious area refers to an area that is determined to have possible defects after analyzing the appearance image.

[0077] In this embodiment, the purpose of performing internal scanning of the suspicious area from multiple angles based on ultrasonic scanning is to obtain the internal structure of the suspicious area in the ceramic substrate to be inspected from different angles, thereby facilitating the determination of whether there are defects and the specific conditions of the defects.

[0078] In this embodiment, the defect feature refers to the defect type and specific situation of the ceramic substrate to be inspected, for example, it may be defects such as cracks, the size of the cracks, and the presence of holes.

[0079] In this embodiment, the marking display refers to marking the defective area on the ceramic substrate to be inspected, so as to facilitate relevant personnel to effectively check the defect conditions of the ceramic substrate.

[0080] The working principle and beneficial effects of the above technical solution are: the appearance image of the ceramic substrate to be inspected is collected by an imaging device, and the appearance image is analyzed to effectively determine the suspicious area on the ceramic substrate to be inspected, which provides convenience for further defect detection; secondly, the internal situation of the suspicious area is scanned by ultrasonic scanning, and the scanning results are analyzed to accurately and effectively determine the specific defect characteristics when defects exist, which is convenient for determining the defect type and degree of the ceramic substrate to be inspected; finally, the obtained defect characteristics are recorded and classified, and at the same time, the defects of the ceramic substrate to be inspected are marked and displayed, which is convenient for management personnel to quickly and effectively view the ceramic substrate; through the combined detection of the surface and the interior of the ceramic substrate to be inspected, the efficiency and accuracy of the defect detection of the ceramic substrate are improved, and the working performance and reliability of the ceramic substrate are guaranteed.

[0081] Embodiment 2:

[0082] Based on Example 1, this example provides a method for detecting defects of a ceramic substrate, such as Figure 2 As shown, in step 1, the appearance image of the ceramic substrate to be inspected is collected based on an imaging device, including:

[0083] Step 101: obtaining the appearance posture of the ceramic substrate to be inspected, and providing position placement guidance for the ceramic substrate to be inspected based on the inspection area and the appearance posture in the inspection platform;

[0084] Step 102: Analyze the image acquisition requirements to obtain basic configuration parameters, and perform parameter adaptation on the imaging device based on the basic configuration parameters. At the same time, obtain the lighting conditions of the detection area in the detection platform based on the image acquisition requirements, and determine the distribution position and lighting parameters of the light source based on the lighting conditions.

[0085] Step 103: configuring the light source based on the distribution position and the lighting parameters, and controlling the imaging device to perform continuous multi-angle and multi-frequency image acquisition on the ceramic substrate to be inspected based on the configuration result and the position placement guidance result to obtain the appearance image of the ceramic substrate to be inspected.

[0086] In this embodiment, the appearance posture refers to information such as the size and shape of the ceramic substrate to be inspected.

[0087] In this embodiment, the detection area in the detection platform is pre-set and is specifically used for placing the ceramic substrate to be detected.

[0088] In this embodiment, the position placement guidance refers to guiding the placement angle of the ceramic substrate to be inspected in the inspection area of ​​the inspection platform, etc., in order to ensure accurate and effective image acquisition of the ceramic substrate to be inspected.

[0089] In this embodiment, the basic configuration parameters refer to specific limited values ​​for parameter configuration of the imaging device determined after analyzing the image acquisition requirements, including resolution and the like.

[0090] In this embodiment, the lighting condition refers to information such as the location of the light source and the brightness level that needs to be achieved.

[0091] In this embodiment, the lighting parameter refers to the specific light brightness that needs to be provided.

[0092] In this embodiment, the continuous multi-angle and multi-frequency image acquisition refers to performing multiple image acquisitions on the ceramic substrate to be inspected at different angles, that is, acquiring at least two appearance images at different angles.

[0093] The working principle and beneficial effects of the above technical solution are: by determining the appearance posture of the ceramic substrate to be inspected, the placement guidance of the ceramic substrate to be inspected is achieved according to the inspection area and the appearance posture in the inspection platform; secondly, the image acquisition requirements are analyzed to determine the lighting conditions of the imaging device and the inspection area in the inspection platform, so as to achieve effective configuration of the distribution position and lighting parameters of the imaging device and the light source, providing traversal and guarantee for image acquisition; finally, according to the configuration results, continuous multi-angle and multi-frequency image acquisition is performed on the ceramic substrate to be inspected, so as to achieve effective acquisition of the appearance image of the ceramic substrate to be inspected, providing a reliable basis for determining whether there are defects in the ceramic substrate to be inspected.

[0094] Embodiment 3:

[0095] Based on Example 2, this embodiment provides a method for defect detection of a ceramic substrate, which controls an imaging device to continuously capture multi-angle and multi-frequency images of a ceramic substrate to be detected, including:

[0096] Obtaining the appearance posture of the ceramic substrate to be inspected, and determining a single angle transformation value based on the appearance posture and image acquisition requirements;

[0097] At the same time, the image acquisition frequency of the imaging device at each angle is determined based on the image acquisition requirements, and the automatic triggering interval of the imaging device is configured based on the image acquisition frequency;

[0098] Based on the single angle transformation value of the imaging device and the configuration result of the automatic triggering interval, continuous multi-angle and multi-frequency image acquisition is performed on the ceramic substrate to be inspected.

[0099] In this embodiment, the single angle change value refers to a specific value corresponding to each angle change, for example, each change may be five degrees.

[0100] In this embodiment, the image acquisition frequency refers to the number of images that the imaging device needs to acquire at each angle.

[0101] In this embodiment, the automatic triggering interval refers to the time interval between each automatic image acquisition by the imaging device.

[0102] The working principle and beneficial effects of the above technical solution are: by analyzing the appearance posture and image acquisition requirements, the single angle change value can be effectively determined. At the same time, the image acquisition frequency at each angle is determined, and the imaging device can be effectively configured with parameters according to the single angle change value and the image acquisition frequency, thereby ensuring the comprehensiveness and reliability of image acquisition of the ceramic substrate to be inspected.

[0103] Embodiment 4:

[0104] Based on Example 1, this embodiment provides a defect detection method for a ceramic substrate. In step 1, the appearance image is preprocessed and analyzed to determine the suspicious area, including:

[0105] Acquire the obtained appearance image, and divide the appearance image into regions based on a preset size window;

[0106] Extracting the pixel value of each pixel point in each area based on the area division result, and performing average processing on the pixel value of each pixel point in each area to obtain the average pixel;

[0107] The pixel value of the central pixel of each region is updated based on the mean pixel, and a denoised appearance image is obtained based on the update result;

[0108] Grayscale the denoised appearance image, and extract grayscale threshold distribution features based on the grayscale processing result;

[0109] Based on the gray threshold distribution characteristics, the gray threshold concentrated area in the denoised appearance image is stretched, and the multi-dimensional image features in the denoised appearance image are extracted based on the stretching processing result;

[0110] The multi-dimensional image features are input into the preset machine learning model for identification and analysis to obtain suspicious areas.

[0111] In this embodiment, the preset size window is set in advance and is used to divide the appearance image into regions.

[0112] In this embodiment, the mean pixel refers to the mean value of the pixel value of each region obtained by performing mean processing on the pixel values ​​of each pixel point in each region.

[0113] In this embodiment, the central pixel refers to a pixel point at the central position of each area.

[0114] In this embodiment, the denoised appearance image refers to a regional image obtained by updating the pixel value of the central pixel of each region by using the mean pixel, thereby removing the image noise in each image region.

[0115] In this embodiment, the grayscale threshold distribution feature refers to the distribution of the grayscale value of each pixel in the denoised image.

[0116] In this embodiment, stretching processing refers to dispersing processing of grayscale threshold concentrated areas, with the purpose of enhancing the contrast of the image. Assuming that the grayscale range of the original image is [a, b], it is stretched to a new range [c, d] through linear transformation, thereby achieving contrast enhancement.

[0117] In this embodiment, the multi-dimensional image features refer to the image features contained in the denoised appearance image, for example, the shape and size of the ceramic substrate recorded in the image.

[0118] In this embodiment, the preset machine learning model is trained in advance and is used to identify suspicious areas in the denoised appearance image.

[0119] The working principle and beneficial effects of the above technical solution are: dividing the appearance image into regions through a preset size window, and determining the pixel value of each pixel in each region after the division, and performing mean processing on the pixel value of each pixel in each region, so as to update the pixel value of the central pixel of each region according to the mean pixel obtained after the mean processing, so as to achieve accurate and effective denoising of the appearance image; secondly, graying the obtained denoised appearance image, and stretching the gray threshold concentrated area, so as to achieve effective contrast enhancement of the denoised appearance image; finally, inputting the processed image into a preset machine learning model for identification and analysis, so as to achieve accurate and effective determination of suspicious areas, and provide reliable guarantee for defect detection of ceramic substrates.

[0120] Embodiment 5:

[0121] Based on Example 1, this embodiment provides a defect detection method for a ceramic substrate. In step 1, the appearance image is preprocessed and analyzed to determine the suspicious area, including:

[0122] Obtaining the obtained suspicious area, and delineating the suspicious area on the ceramic substrate to be inspected based on the delineation mark;

[0123] Based on the delineation results, a global scan is performed on the ceramic substrate to be inspected to obtain a scanned image, and the scanned image is visualized in a preset coordinate system;

[0124] Based on the visual display result, the circled mark is aligned with the size mark in the preset coordinate system, and the position coordinates and distribution range of the suspicious area on the ceramic substrate to be inspected are obtained based on the alignment result;

[0125] An internal scanning guidance report is generated based on the location coordinates and distribution range, and the internal scanning guidance report is fed back to the management terminal.

[0126] In this embodiment, the delimiting mark refers to a symbol that can delimit and mark an area.

[0127] In this embodiment, the scanned image refers to image information obtained after a global scan of the ceramic substrate to be inspected.

[0128] In this embodiment, the preset coordinate system is set in advance and is used to visualize the scanned image.

[0129] In this embodiment, the size mark refers to the marking points corresponding to different sizes that are set in advance in the preset coordinate system.

[0130] The working principle and beneficial effects of the above technical solution are: by circling and marking the suspicious area, and performing a global scan of the ceramic substrate to be inspected based on the circling and marking results, accurate and effective acquisition of the scanned image is achieved; secondly, the scanned image is visualized in a preset coordinate system to lock the position coordinates and distribution range of the suspicious area on the ceramic substrate to be inspected; finally, an internal scanning guidance report is generated based on the position coordinates and distribution range, and the internal scanning guidance report is fed back to the management terminal for notification, so as to effectively understand the specific situation of the suspicious area on the ceramic substrate to be inspected.

[0131] Embodiment 6:

[0132] Based on Example 1, this embodiment provides a method for defect detection of a ceramic substrate. In step 2, the suspicious area is internally scanned from multiple angles based on ultrasonic scanning, and the ultrasonic echo signal after the internal scanning is dynamically received and analyzed to determine the defect characteristics of the ceramic substrate to be detected, including:

[0133] Obtain the material properties of the ceramic substrate, analyze the material properties of the ceramic substrate based on the ultrasonic scanning knowledge system, and determine the ultrasonic frequency required for defect detection of the ceramic substrate;

[0134] Determine a horizontal position movement sequence of the ultrasonic transmitter during the detection process based on the detection requirements, and determine the relative distances between the ultrasonic transmitter and the ceramic substrate to be detected at different detection positions based on the horizontal position movement sequence;

[0135] Determine the ultrasonic time window at different detection positions based on the propagation speed and relative distance of the ultrasonic wave;

[0136] Based on the ultrasonic transmitter, ultrasonic signals are sequentially transmitted to the suspicious areas in the ceramic substrate to be detected according to the horizontal position movement sequence, and the ultrasonic echo signals at each detection position are distinguished and received based on the ultrasonic time window;

[0137] Preprocessing the ultrasonic echo signal at each detection position based on the differentiated receiving result, and displaying the preprocessed ultrasonic echo signal in waveform;

[0138] Determine the waveform amplitude and time series information at each detection position based on the waveform display result, and determine the ultrasonic echo signal strength at each detection position based on the waveform amplitude and time series information;

[0139] Extracting the relative position coordinates of each detection position relative to the suspicious area, and generating an ultrasonic feature image based on the relative position coordinates and the corresponding ultrasonic echo signal intensity, and generating a corresponding grayscale value level based on the ultrasonic echo signal intensity, and grayscale mapping the grayscale value level in the ultrasonic feature image to obtain a target ultrasonic feature image;

[0140] Acquire an ultrasonic characteristic image of a standard non-defective ceramic substrate, and compare the ultrasonic characteristic image of the standard non-defective ceramic substrate with a target ultrasonic characteristic image of the ceramic substrate to be inspected;

[0141] The defect characteristics of the ceramic substrate to be inspected are determined based on the comparison results.

[0142] In this embodiment, the material attribute refers to the material and material type of the ceramic substrate.

[0143] In this embodiment, the ultrasonic scanning knowledge system is known in advance and is a collection of all knowledge related to ultrasonic scanning.

[0144] In this embodiment, the horizontal position movement sequence refers to the corresponding movement trajectory of the ultrasonic transmitter when performing detection, and the purpose is to ensure that a comprehensive ultrasonic detection can be performed on the ceramic substrate to be detected.

[0145] In this embodiment, the relative distance refers to the distance between the ultrasonic transmitter and the ceramic substrate to be detected at different positions when the ultrasonic transmitter is moving.

[0146] In this embodiment, the ultrasonic time window is used to characterize the time series corresponding to the ultrasonic waves at different positions, so that the ultrasonic waves at different positions can be distinguished according to the ultrasonic time window.

[0147] In this embodiment, the ultrasonic echo signal refers to a reflected signal that is bounced back after the ultrasonic signal contacts the ceramic substrate to be inspected.

[0148] In this embodiment, the preprocessing refers to performing processing such as denoising and gain amplification on the ultrasonic echo signal.

[0149] In this embodiment, the waveform display is performed by using an oscilloscope to display the pre-processed ultrasonic echo signal.

[0150] In this embodiment, the waveform amplitude refers to the value size corresponding to the waveform at different positions.

[0151] In this embodiment, the ultrasonic echo signal strength refers to the signal strength of the ultrasonic echo signal. The purpose is to generate an ultrasonic feature image according to the signal strength. Different intensities represent different detection features.

[0152] In this embodiment, the ultrasonic characteristic image refers to the result of converting the ultrasonic signal detection result into an image and visually displaying the detection result carried by the ultrasonic signal.

[0153] In this embodiment, the gray value level is generated according to the intensity of the ultrasonic echo signal. The greater the intensity, the greater the corresponding gray value, thereby achieving effective detection of defective areas and non-defective areas.

[0154] In this embodiment, grayscale mapping refers to representing the grayscale value level corresponding to the corresponding position in the ultrasonic feature image according to the detection position.

[0155] In this embodiment, the target ultrasonic characteristic image refers to the result obtained by converting the ultrasonic echo signal into the ultrasonic characteristic image and generating corresponding gray value levels of different ultrasonic echo signal intensities and representing them in the ultrasonic characteristic image.

[0156] The working principle and beneficial effects of the above technical scheme are: by analyzing the material properties of the ceramic substrate, the ultrasonic frequency required for defect detection of the ceramic substrate can be accurately and effectively determined, so that the ultrasonic transmitter is controlled to transmit an ultrasonic signal to the ceramic substrate to be detected according to the ultrasonic frequency, so as to detect whether there are defects inside the substrate to be detected; secondly, the ultrasonic echo signal of the ultrasonic signal is received and preprocessed, and the ultrasonic echo signal is converted into a corresponding target ultrasonic feature image according to the preprocessing result, so as to realize accurate and effective visualization of the detection result; finally, the obtained target ultrasonic feature image is compared with the ultrasonic feature image of a standard defect-free ceramic substrate, so as to realize accurate and effective determination of the defect characteristics of the ceramic substrate to be detected, thereby ensuring the reliability and comprehensiveness of defect detection of the ceramic substrate.

[0157] Embodiment 7:

[0158] Based on Example 1, this embodiment provides a defect detection method for a ceramic substrate. In step 3, the defect features of the ceramic substrate to be detected are recorded and classified, and the defects of the ceramic substrate to be detected are annotated and displayed based on the recording and classification results, including:

[0159] Obtaining the defect features of the ceramic substrate to be inspected, and matching the defect features with multi-dimensional defect features under known defect types one by one;

[0160] Determine the defect type corresponding to the defect feature of the ceramic substrate to be inspected based on the one-to-one matching results, and at the same time, evaluate the defect feature based on a preset evaluation model to obtain the defect level of the ceramic substrate to be inspected;

[0161] Dispatching the position coordinates of the suspicious area on the ceramic substrate to be inspected, and correcting the position coordinates of the suspicious area on the ceramic substrate to be inspected based on the defect characteristics to obtain the position representation of the defect;

[0162] The defect type, defect level and position characteristics corresponding to the defect characteristics of the ceramic substrate to be inspected are recorded.

[0163] In this embodiment, the multi-dimensional defect characteristics under the known defect type refer to defects of various different phenomena unique to different defect types.

[0164] In this embodiment, the preset evaluation model is trained in advance and is used to evaluate the defect characteristics of the ceramic substrate to be inspected, in order to determine the defect level of the ceramic substrate to be inspected.

[0165] In this embodiment, the position characterization refers to the specific position of the finally determined detectable area on the ceramic substrate to be inspected.

[0166] The working principle and beneficial effect of the above technical solution are: by analyzing the defect characteristics of the ceramic substrate to be inspected, the defect type, defect level and location characterization of the ceramic substrate to be inspected can be effectively determined and recorded, thereby facilitating the management personnel to effectively understand the specific situation of the ceramic substrate to be inspected.

[0167] Embodiment 8:

[0168] Based on Example 1, this example provides a method for defect detection of a ceramic substrate. In step 3, the defects of the ceramic substrate to be detected are marked and displayed based on the recording and classification results, including:

[0169] Obtaining the record and classification results of the defect features of the ceramic substrate, and generating a multi-dimensional mark identification of the defect features based on the record and classification results;

[0170] The defects of the ceramic substrate to be inspected are marked and displayed based on multi-dimensional marking.

[0171] In this embodiment, the multi-dimensional marking mark is a symbol used to identify and distinguish the types and positions of the defect features of the ceramic substrate to be inspected.

[0172] The working principle and beneficial effects of the above technical solution are: by recording and classifying the results, a multi-dimensional mark identification of the defect characteristics is generated, and the defects of the ceramic substrate to be inspected are marked and displayed according to the multi-dimensional mark identification, so as to lock the final inspection results and facilitate the management personnel to effectively manage the defect results.

[0173] Embodiment 9:

[0174] This embodiment provides a defect detection system for a ceramic substrate. Figure 3 As shown, including:

[0175] A suspicious area determination module is used to collect the appearance image of the ceramic substrate to be inspected based on an imaging device, and pre-process and analyze the appearance image to determine the suspicious area;

[0176] A defect detection module is used to perform internal scanning of the suspicious area from multiple angles based on ultrasonic scanning, and dynamically receive and analyze the ultrasonic echo signal after the internal scanning to determine the defect characteristics of the ceramic substrate to be detected;

[0177] The recording and marking module is used to record and classify the defect characteristics of the ceramic substrate to be inspected, and to mark and display the defects of the ceramic substrate to be inspected based on the recording and classification results.

[0178] The working principle and beneficial effects of the above technical solution are: the appearance image of the ceramic substrate to be inspected is collected by an imaging device, and the appearance image is analyzed to effectively determine the suspicious area on the ceramic substrate to be inspected, which provides convenience for further defect detection; secondly, the internal situation of the suspicious area is scanned by ultrasonic scanning, and the scanning results are analyzed to accurately and effectively determine the specific defect characteristics when defects exist, which is convenient for determining the defect type and degree of the ceramic substrate to be inspected; finally, the obtained defect characteristics are recorded and classified, and at the same time, the defects of the ceramic substrate to be inspected are marked and displayed, which is convenient for management personnel to quickly and effectively view the ceramic substrate; through the combined detection of the surface and the interior of the ceramic substrate to be inspected, the efficiency and accuracy of the defect detection of the ceramic substrate are improved, and the working performance and reliability of the ceramic substrate are guaranteed.

[0179] Embodiment 10:

[0180] Based on Example 9, this embodiment provides a defect detection system for a ceramic substrate, a suspicious area determination module, including:

[0181] A guidance unit, used to obtain the appearance posture of the ceramic substrate to be inspected, and to provide guidance on the position of the ceramic substrate to be inspected based on the inspection area and the appearance posture in the inspection platform;

[0182] A configuration unit is used to analyze the image acquisition requirements, obtain basic configuration parameters, and perform parameter adaptation on the imaging device based on the basic configuration parameters. At the same time, it obtains the lighting conditions of the detection area in the detection platform based on the image acquisition requirements, and determines the distribution position and lighting parameters of the light source based on the lighting conditions;

[0183] The image acquisition unit is used to configure the light source based on the distribution position and lighting parameters, and control the imaging device to perform continuous multi-angle and multi-frequency image acquisition on the ceramic substrate to be inspected based on the configuration result and the position placement guidance result to obtain the appearance image of the ceramic substrate to be inspected.

[0184] The working principle and beneficial effects of the above technical solution are: by determining the appearance posture of the ceramic substrate to be inspected, the placement guidance of the ceramic substrate to be inspected is achieved according to the inspection area and the appearance posture in the inspection platform; secondly, the image acquisition requirements are analyzed to determine the lighting conditions of the imaging device and the inspection area in the inspection platform, so as to achieve effective configuration of the distribution position and lighting parameters of the imaging device and the light source, providing traversal and guarantee for image acquisition; finally, according to the configuration results, continuous multi-angle and multi-frequency image acquisition is performed on the ceramic substrate to be inspected, so as to achieve effective acquisition of the appearance image of the ceramic substrate to be inspected, providing a reliable basis for determining whether there are defects in the ceramic substrate to be inspected.

[0185] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for defect detection of a ceramic substrate, characterized in that: include: Step 1: Capture the appearance image of the ceramic substrate to be inspected based on an imaging device, pre-process and analyze the appearance image, and determine the suspicious area; Step 2: Scan the suspicious area internally from multiple angles based on ultrasonic scanning, and dynamically receive and analyze the ultrasonic echo signal after the internal scanning to determine the defect characteristics of the ceramic substrate to be inspected; Step 3: Record and classify the defect features of the ceramic substrate to be inspected, and annotate and display the defects of the ceramic substrate to be inspected based on the recording and classification results.

2. A defect detection method for a ceramic substrate according to claim 1, characterized in that: In step 1, an appearance image of the ceramic substrate to be inspected is collected based on an imaging device, including: Obtain the appearance posture of the ceramic substrate to be inspected, and provide position placement guidance for the ceramic substrate to be inspected based on the inspection area and appearance posture in the inspection platform; Analyze the image acquisition requirements to obtain basic configuration parameters, and adapt the parameters of the imaging device based on the basic configuration parameters. At the same time, obtain the lighting conditions of the detection area in the detection platform based on the image acquisition requirements, and determine the distribution position and lighting parameters of the light source based on the lighting conditions; The light source is configured based on the distribution position and the lighting parameters, and the imaging device is controlled based on the configuration result and the position placement guidance result to perform continuous multi-angle and multi-frequency image acquisition on the ceramic substrate to be inspected, so as to obtain the appearance image of the ceramic substrate to be inspected.

3. A defect detection method for a ceramic substrate according to claim 2, characterized in that: Controlling the imaging device to continuously collect multi-angle and multi-frequency images of the ceramic substrate to be inspected, including: Obtaining the appearance posture of the ceramic substrate to be inspected, and determining a single angle transformation value based on the appearance posture and image acquisition requirements; At the same time, the image acquisition frequency of the imaging device at each angle is determined based on the image acquisition requirements, and the automatic triggering interval of the imaging device is configured based on the image acquisition frequency; Based on the single angle transformation value of the imaging device and the configuration result of the automatic triggering interval, continuous multi-angle and multi-frequency image acquisition is performed on the ceramic substrate to be inspected.

4. The defect detection method of a ceramic substrate according to claim 1, characterized in that: In step 1, the appearance image is preprocessed and analyzed to determine suspicious areas, including: Acquire the obtained appearance image, and divide the appearance image into regions based on a preset size window; Extracting the pixel value of each pixel point in each area based on the area division result, and performing average processing on the pixel value of each pixel point in each area to obtain the average pixel; The pixel value of the central pixel of each region is updated based on the mean pixel, and a denoised appearance image is obtained based on the update result; Grayscale the denoised appearance image, and extract grayscale threshold distribution features based on the grayscale processing result; Based on the gray threshold distribution characteristics, the gray threshold concentrated area in the denoised appearance image is stretched, and the multi-dimensional image features in the denoised appearance image are extracted based on the stretching processing result; The multi-dimensional image features are input into the preset machine learning model for identification and analysis to obtain suspicious areas.

5. The defect detection method of a ceramic substrate according to claim 1, characterized in that: In step 1, the appearance image is preprocessed and analyzed to determine suspicious areas, including: Obtaining the obtained suspicious area, and delineating the suspicious area on the ceramic substrate to be inspected based on the delineation mark; Based on the delineation results, a global scan is performed on the ceramic substrate to be inspected to obtain a scanned image, and the scanned image is visualized in a preset coordinate system; Based on the visual display result, the circled mark is aligned with the size mark in the preset coordinate system, and the position coordinates and distribution range of the suspicious area on the ceramic substrate to be inspected are obtained based on the alignment result; An internal scanning guidance report is generated based on the location coordinates and distribution range, and the internal scanning guidance report is fed back to the management terminal.

6. The defect detection method of a ceramic substrate according to claim 1, characterized in that: In step 2, the suspicious area is internally scanned from multiple angles based on ultrasonic scanning, and the ultrasonic echo signal after the internal scanning is dynamically received and analyzed to determine the defect characteristics of the ceramic substrate to be inspected, including: Obtain the material properties of the ceramic substrate, analyze the material properties of the ceramic substrate based on the ultrasonic scanning knowledge system, and determine the ultrasonic frequency required for defect detection of the ceramic substrate; Determine a horizontal position movement sequence of the ultrasonic transmitter during the detection process based on the detection requirements, and determine the relative distances between the ultrasonic transmitter and the ceramic substrate to be detected at different detection positions based on the horizontal position movement sequence; Determine the ultrasonic time window at different detection positions based on the propagation speed and relative distance of the ultrasonic wave; Based on the ultrasonic transmitter, ultrasonic signals are sequentially transmitted to the suspicious areas in the ceramic substrate to be detected according to the horizontal position movement sequence, and the ultrasonic echo signals at each detection position are distinguished and received based on the ultrasonic time window; Preprocessing the ultrasonic echo signal at each detection position based on the differentiated receiving result, and displaying the preprocessed ultrasonic echo signal in waveform; Determine the waveform amplitude and time series information at each detection position based on the waveform display result, and determine the ultrasonic echo signal strength at each detection position based on the waveform amplitude and time series information; Extracting the relative position coordinates of each detection position relative to the suspicious area, and generating an ultrasonic feature image based on the relative position coordinates and the corresponding ultrasonic echo signal intensity, and generating a corresponding grayscale value level based on the ultrasonic echo signal intensity, and grayscale mapping the grayscale value level in the ultrasonic feature image to obtain a target ultrasonic feature image; Acquire an ultrasonic characteristic image of a standard non-defective ceramic substrate, and compare the ultrasonic characteristic image of the standard non-defective ceramic substrate with a target ultrasonic characteristic image of the ceramic substrate to be inspected; The defect characteristics of the ceramic substrate to be inspected are determined based on the comparison results.

7. The defect detection method of a ceramic substrate according to claim 1, characterized in that: In step 3, the defect features of the ceramic substrate to be inspected are recorded and classified, and the defects of the ceramic substrate to be inspected are annotated and displayed based on the recording and classification results, including: Obtaining the defect features of the ceramic substrate to be inspected, and matching the defect features with multi-dimensional defect features under known defect types one by one; Determine the defect type corresponding to the defect feature of the ceramic substrate to be inspected based on the one-to-one matching results, and at the same time, evaluate the defect feature based on a preset evaluation model to obtain the defect level of the ceramic substrate to be inspected; Dispatching the position coordinates of the suspicious area on the ceramic substrate to be inspected, and correcting the position coordinates of the suspicious area on the ceramic substrate to be inspected based on the defect characteristics to obtain the position representation of the defect; The defect type, defect level and position characteristics corresponding to the defect characteristics of the ceramic substrate to be inspected are recorded.

8. The defect detection method of a ceramic substrate according to claim 1, characterized in that: In step 3, the defects of the ceramic substrate to be inspected are marked and displayed based on the recording and classification results, including: Obtaining the record and classification results of the defect features of the ceramic substrate, and generating a multi-dimensional mark identification of the defect features based on the record and classification results; The defects of the ceramic substrate to be inspected are marked and displayed based on multi-dimensional marking.

9. A defect detection system for a ceramic substrate, characterized in that: include: A suspicious area determination module is used to collect the appearance image of the ceramic substrate to be inspected based on an imaging device, and pre-process and analyze the appearance image to determine the suspicious area; A defect detection module is used to perform internal scanning of the suspicious area from multiple angles based on ultrasonic scanning, and dynamically receive and analyze the ultrasonic echo signal after the internal scanning to determine the defect characteristics of the ceramic substrate to be detected; The recording and marking module is used to record and classify the defect characteristics of the ceramic substrate to be inspected, and to mark and display the defects of the ceramic substrate to be inspected based on the recording and classification results.

10. A defect detection system for a ceramic substrate according to claim 9, characterized in that: Suspicious area determination module, including: A guidance unit, used to obtain the appearance posture of the ceramic substrate to be inspected, and to provide guidance on the position of the ceramic substrate to be inspected based on the inspection area and the appearance posture in the inspection platform; A configuration unit is used to analyze the image acquisition requirements, obtain basic configuration parameters, and perform parameter adaptation on the imaging device based on the basic configuration parameters. At the same time, it obtains the lighting conditions of the detection area in the detection platform based on the image acquisition requirements, and determines the distribution position and lighting parameters of the light source based on the lighting conditions; The image acquisition unit is used to configure the light source based on the distribution position and lighting parameters, and control the imaging device to perform continuous multi-angle and multi-frequency image acquisition on the ceramic substrate to be inspected based on the configuration result and the position placement guidance result to obtain the appearance image of the ceramic substrate to be inspected.

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