Flexible electronic material with humidity and heat management performance and preparation method thereof

Abstract

The invention discloses a flexible electronic material with heat and humidity management performance and a preparation method thereof, and the flexible electronic material with heat and humidity management performance comprises a flexible substrate and a gold layer deposited on the flexible substrate; the flexible substrate is provided with a one-way water delivery taper hole structure. According to the method, the gold layer is deposited on the surface of the flexible substrate, so that the flexible substrate has high conductivity and stability, excellent biocompatibility and reliable long-term use performance are provided, and the requirements of flexible electronic materials in various applications are met. And a one-way water delivery taper hole structure is arranged, so that the comfort and functionality of the material can be improved. The one-way water delivery property has remarkable advantages in application, so that the material has wearing comfort, the reliability of equipment is enhanced, and the environmental adaptability is relatively high.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible materials, and in particular to a flexible electronic material with moisture and heat management performance and a preparation method thereof. Background Art

[0002] Flexible electronic materials are a class of materials with good electronic properties and mechanical flexibility. They can maintain stable electronic functions under deformation conditions such as bending, folding or stretching.

[0003] Flexible electronic materials with moisture and heat management properties have shown great application potential in medical monitoring and rehabilitation therapy. Due to their unique softness and ductility, this material can seamlessly fit human skin, greatly improving wearing comfort. However, existing flexible electronic materials have the problem of poor material stretchability.

[0004] Therefore, the prior art needs to be further improved and enhanced. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the present invention provides a flexible electronic material with moisture and heat management performance and a preparation method thereof, aiming to solve the problem that the existing flexible electronic materials have poor stretchability and lack of moisture and heat management function.

[0006] The technical solution adopted by the present invention to solve the above technical problems is as follows:

[0007] In a first aspect, a flexible electronic material with moisture and heat management performance comprises: a flexible substrate and a gold layer deposited on the flexible substrate; the flexible substrate is provided with a conical hole structure for unidirectional water transport.

[0008] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. Through the following preferred technical solutions, the objectives and beneficial effects of the present invention can be better achieved and realized.

[0009] As a preferred technical solution, the flexible electronic material with moisture and heat management performance, wherein the flexible substrate contains polydimethylsiloxane or the material can be selected from aliphatic aromatic copolyester, SEBS.

[0010] As a preferred technical solution, the flexible electronic material with moisture and heat management performance is characterized in that the flexible substrate is filled with conductive fillers; the conductive fillers include carbon-based conductive materials, metal nanomaterials and conductive polymers.

[0011] As a preferred technical solution, in the flexible electronic material with moisture and heat management performance, the filling mass fraction of the conductive filler is 2.5%-4%.

[0012] As a preferred technical solution, in the flexible electronic material with moisture and heat management performance, the thickness of the gold layer is 100-200 nm.

[0013] In a second aspect, a method for preparing the flexible electronic material with moisture and heat management performance according to the first aspect, comprising:

[0014] preparing a flexible base material into a mixed solution;

[0015] The mixed solution is subjected to shaping treatment and punching treatment in sequence to obtain a flexible substrate with a conical hole structure for unidirectional water transport;

[0016] Gold is deposited on the surface of the flexible substrate having the conical hole structure for unidirectional water transport to obtain the flexible electronic material with moisture and heat management performance.

[0017] As a preferred technical solution, the flexible electronic material with moisture and heat management performance, wherein the flexible substrate material is prepared into a mixed solution, specifically comprising:

[0018] The flexible base material, the cross-linking agent and the organic solvent are mixed to obtain a mixed solution; wherein the mass ratio of the flexible base material to the cross-linking agent is 10-30:1;

[0019] Preferably, the organic solvent is selected from n-hexane 、 A type of cyclohexane.

[0020] As a preferred technical solution, the flexible electronic material with moisture and heat management performance, wherein the mixed solution is subjected to shaping treatment and punching treatment in sequence to obtain a flexible substrate with a conical hole structure for unidirectional water transport, specifically comprises:

[0021] Placing the mixed solution in a heating device, controlling the heating temperature and time, and shaping the mixed solution;

[0022] The formed product is laser-drilled to form a conical hole structure for one-way water transmission to obtain an intermediate;

[0023] The intermediate is subjected to plasma treatment to obtain the flexible substrate having a conical hole structure for unidirectional water transport.

[0024] As a preferred technical solution, in the method for preparing the flexible electronic material with moisture and heat management performance, the heating temperature is 60-80°C.

[0025] As a preferred technical solution, in the method for preparing the flexible electronic material with moisture and heat management performance, the amount of n-hexane added accounts for 10-20% of the total mass of the mixture formed by the flexible base material and the cross-linking agent.

[0026] Beneficial effects: Compared with the prior art, the present invention deposits a gold layer on the surface of a flexible substrate, which makes the flexible substrate highly conductive and stable while providing excellent biocompatibility and reliable long-term performance, meeting the needs of flexible electronic materials in a variety of applications. The conical hole structure for one-way water delivery can enhance the comfort and functionality of the material. One-way water delivery has significant advantages in application, making the material comfortable to wear, enhancing the reliability of the equipment, and having strong environmental adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of a flexible electronic material with moisture and heat management performance provided by the present invention;

[0028] Figure 2 It is a schematic flow chart of a method for preparing a flexible electronic material with moisture and heat management performance provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0029] The present invention provides a flexible electronic material with moisture and heat management performance and a preparation method thereof. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0030] It will be understood by those skilled in the art that, unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations. It should be understood that the term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0031] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with those in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0032] It should be understood that the sequence number and size of each step in this embodiment do not mean the order of execution, and the execution order of each process is determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of this application. All instruments used are commercially available products.

[0033] Combination Figure 1 The flexible electronic material with moisture and heat management performance provided by the present invention comprises: a flexible substrate 10 and a gold layer 20 deposited on the flexible substrate; the flexible substrate is provided with a conical hole structure 210 for one-way water supply. Among them, the use of a flexible material as a substrate can make the prepared electronic material have better stretchability and durability, and depositing a gold layer on the surface of the flexible substrate can make the material's resistance smaller and more uniform, thereby improving the sensitivity of signal transmission. The one-way water supply conical hole structure is provided to increase comfort and functionality.

[0034] In one implementation of the present invention, the flexible substrate 10 contains polydimethylsiloxane or the material can be selected (aliphatic aromatic copolyester Ecoflex is an aliphatic aromatic copolyester, as a room temperature curing silicone polymer, it has high stretchability and ductility, and is easy to be manufactured into a complex shape), SEBS (a linear three-block copolymer with polystyrene as the terminal segment and ethylene-butylene copolymer obtained by hydrogenation of polybutadiene as the middle elastic block, the full English name is Styrene Ethy l ene Buty l ene Styrene, referred to as SEBS). Among them, polydimethylsiloxane (Polydimethy lsil oxane, PDMS). PDMS is a viscous liquid in liquid state, commonly known as "dimethyl silicone oil" (dimeth i cone), which belongs to silicone oil substances. It is a mixture of organic siloxanes composed of chain structures with different polymerization degrees, and its end groups and side groups are all hydrocarbon groups (such as methyl, ethyl, phenyl, etc.). In general, silicone oil presents the characteristics of colorless, odorless, non-toxic, and low-volatility liquid. When PDMS cures, it transforms into a unique silicone that is non-toxic, hydrophobic, chemically inert, non-flammable, transparent, and elastic.

[0035] PDMS is a flexible electronic material with moisture and heat management properties. It has the following characteristics: simple and fast preparation process, material cost is much lower than traditional silicon wafers, excellent light transmittance, outstanding biocompatibility, easy bonding with a variety of materials at room temperature, and high structural flexibility due to its low Young's modulus.

[0036] In one implementation of the present invention, the flexible substrate is filled with conductive fillers, which include carbon-based conductive materials, metal nanomaterials, and conductive polymers. By filling the flexible substrate with conductive fillers, the flexible substrate layer can have kΩ-level conductivity at room temperature.

[0037] In the present invention, the carbon-based conductive material is selected from one or more of carbon nanotubes, graphene and carbon black; the metal nanomaterial is silver nanowire or gold nanowire; the conductive polymer is polyaniline, two-dimensional metal carbide, two-dimensional metal nitride or two-dimensional metal carbonitride. Among them, carbon nanotubes have better conductivity than other carbon-based conductive materials at the same filling amount, are simpler to prepare than other types of materials, have better thermal stability and mechanical stability, and are easier to disperse in flexible substrates. The filling mass fraction of the conductive filler is 2.5%-4%, such as 2.5%, 3%, 3.5%, 4%. When it is below 2.5%, the concentration of carbon nanotubes is too low, resulting in unsatisfactory conductivity of the lower layer. When it is above 4%, the conductivity will be improved, but the dispersion time will be longer.

[0038] In the present invention, a layer of gold (Au) is uniformly plated on the surface of a flexible substrate having a conical hole structure for unidirectional water supply by sputtering technology. Sputtering gold is selected instead of other metals, which can provide excellent biocompatibility and reliable long-term performance while ensuring high conductivity and stability, and meet the needs of flexible electronic materials in various applications.

[0039] Based on the same inventive concept, Figure 2 The present invention also provides a method for preparing the above-mentioned flexible electronic material with moisture and heat management performance, comprising:

[0040] S10, preparing a flexible base material into a mixed solution.

[0041] Specifically, a flexible base material such as polydimethylsiloxane, a cross-linking agent, a conductive filler and n-hexane are mixed and dispersed evenly to obtain a mixed solution. The mass ratio of the flexible base material to the cross-linking agent is 10-30:1, such as 10:1, 20:1, 30:1, etc. The added mass fraction of the conductive filler is 2.5%-4%, and the amount of n-hexane added is 10% to 20% relative to the total mass of the mixture. In this process, n-hexane plays a role in reducing the viscosity of the mixture, promoting the uniform dispersion of the conductive filler, and preventing the aggregation of the conductive filler, and can evaporate rapidly in the subsequent processing process without affecting the final performance of the material. The temperature and time are strictly controlled during the stirring process, and ultrasonic treatment is used to further disperse the conductive filler.

[0042] S20, sequentially performing shaping treatment and punching treatment on the mixed solution to obtain a flexible substrate with a conical hole structure for unidirectional water transport.

[0043] Specifically, the mixed material is placed in a high temperature environment for shaping, and a temperature control system is used to ensure the resistance consistency of the material. For example, after curing at 60°C in a vacuum oven for 1 hour, the material is laser punched. The material is laser punched to give it the required air permeability and unidirectional water transport. Laser drilling technology achieves unidirectional water transport by precisely controlling the aperture and arrangement of the cone holes, so that water can be effectively drained from one direction, while forming greater resistance in the opposite direction. Unidirectional water transport is achieved by precisely controlling the shape and size of the cone holes, such as using a conical microporous structure that makes it easier for water to flow in one direction and more difficult to flow in the opposite direction.

[0044] In one implementation of the present invention, after laser drilling, plasma treatment is performed on the material to increase the surface energy of the material, further improving its air permeability and one-way water transport. Plasma treatment changes the chemical properties and microstructure of the material surface, enhances the one-way water transport effect, and improves the comfort and functionality of the material.

[0045] S30, depositing gold on the surface of the flexible substrate having a pore structure for one-way water transport to obtain the flexible electronic material having moisture and heat management performance.

[0046] Specifically, a layer of gold can be deposited on a flexible substrate after laser drilling and plasma treatment through sputtering technology. While ensuring high conductivity and stability, it also provides excellent biocompatibility and reliable long-term performance, meeting the needs of flexible electronic materials in a variety of applications.

[0047] In the present invention, the flexible electronic material prepared above is connected to an electromyographic sensor, which can identify and record human electromyographic signals. The sensor interface ensures the stability and accuracy of signal transmission through optimized circuit design. Specifically, it includes low-noise amplifier circuit, filter circuit, high-precision analog-to-digital conversion, signal calibration and compensation, shielding design and power consumption optimization. Connect a resistor sensor to identify human movements through the resistance change of the material. The resistor sensor interface adopts a high-precision circuit, which can monitor and record resistance changes in real time and provide reliable data support. The electromyographic signal and resistance change data are collected through the multi-functional sensor interface, and the data is cleaned and standardized using a preprocessing algorithm to ensure data quality. Using a deep learning algorithm, the model is trained to identify and predict human movements. The model is trained with a large amount of data, has high accuracy and robustness, and can detect and predict human movements in real time.

[0048] The flexible electronic material with moisture and heat management performance of the present invention is further explained below through specific preparation examples.

[0049] Example 1

[0050] Polydimethylsiloxane (PDMS) and carbon nanotubes (CNT) were selected as the base materials. PDMS A material and B material were mixed in a common ratio of 10:1.

[0051] 2.5% CNT was added, and 10% n-hexane was added according to the total mass of the mixture for stirring. The temperature and time were strictly controlled during the stirring process, and the CNT was further dispersed by ultrasonic treatment to ensure the uniform distribution of the mixture.

[0052] The material was then cured in a vacuum oven at 60°C for 1 hour, and laser drilling was performed on the cured material. A 100nm thick gold (Au) layer was evenly sputtered on the surface of the shaped and punched material. Finally, Plasma treatment technology was used to increase the surface hydrophilicity of the material, resulting in a flexible electronic material with moisture and heat management performance.

[0053] Example 2

[0054] Polydimethylsiloxane (PDMS) and carbon nanotubes (CNT) were selected as the base materials. PDMS A material and B material were mixed in a common ratio of 20:1.

[0055] 3% by mass of CNTs were added, and 15% by mass of cyclohexane was added to the mixture for stirring. The temperature and time were strictly controlled during the stirring process, and the CNTs were further dispersed by ultrasonic treatment to ensure uniform distribution of the mixture.

[0056] The material was then cured in a vacuum oven at 70°C for 1 hour, and laser drilling was performed on the cured material. A 150nm thick gold (Au) layer was evenly sputtered on the surface of the shaped and punched material. Finally, Plasma treatment technology was used to increase the surface hydrophilicity of the material, resulting in a flexible electronic material with moisture and heat management performance.

[0057] Example 3

[0058] Polydimethylsiloxane (PDMS) and carbon nanotubes (CNT) were selected as the base materials. PDMS A material and B material were mixed in a common ratio of 30:1.

[0059] 4% CNT by mass was added, and 20% n-hexane was added according to the total mass of the mixture for stirring. The temperature and time were strictly controlled during the stirring process, and the CNT was further dispersed by ultrasonic treatment to ensure the uniform distribution of the mixture.

[0060] Then, the material was cured in a vacuum oven at 80°C for 1 hour, and laser drilling was performed on the cured material. A layer of gold (Au) with a thickness of 200 nm was evenly sputtered on the surface of the shaped and punched material. Finally, Plasma treatment technology was used to increase the surface hydrophilicity of the material, resulting in a flexible electronic material with moisture and heat management performance.

[0061] Example 4

[0062] Polydimethylsiloxane (PDMS) and carbon nanotubes (CNT) were selected as the base materials. PDMS A material and B material were mixed in a common ratio of 25:1.

[0063] 4% CNT by mass was added, and 15% n-hexane was added according to the total mass of the mixture for stirring. The temperature and time were strictly controlled during the stirring process, and the CNT was further dispersed by ultrasonic treatment to ensure the uniform distribution of the mixture.

[0064] Then, the material was cured in a vacuum oven at 75°C for 1 hour, and the cured material was laser-drilled. A layer of gold (Au) with a thickness of 200 nm was evenly sputtered on the surface of the shaped and drilled material. Finally, Plasma treatment technology was used to increase the surface hydrophilicity of the material, resulting in a flexible electronic material with moisture and heat management performance.

[0065] In summary, the present invention discloses a flexible electronic material with moisture and heat management performance and a preparation method thereof, wherein the flexible electronic material with moisture and heat management performance comprises: a flexible substrate and a gold layer deposited on the flexible substrate; the flexible substrate is provided with a one-way water-transmitting conical hole structure. By depositing a layer of gold on the surface of the flexible substrate, not only the conductivity of the material is significantly improved, the stability and reliability of the electronic device during long-term use are ensured, but also the biocompatibility of the material is greatly enhanced. This biocompatibility is particularly important for flexible electronic devices that are in direct contact with human skin, which can reduce skin irritation and allergic reactions and improve the user experience. In addition, the deposition of the gold layer also gives the flexible substrate excellent corrosion resistance and oxidation resistance, which means that the material can maintain performance without attenuation under various environmental conditions, extending the service life of the device. This is of great significance for flexible electronic devices that need to work in extreme environments, such as military, aerospace, and deep-sea exploration. By setting a one-way water-transmitting conical hole structure, one-way transmission of water is achieved. In practical applications, this one-way water transmission brings to flexible electronic materials, reducing the discomfort caused by long-term wearing and improving the comfort of users. This enables flexible electronic materials to adapt to changing environmental conditions and maintain stable performance whether in high humidity or dry environments.

[0066] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A flexible electronic material with moisture and heat management performance, characterized in that: include: a flexible substrate and a gold layer deposited on the flexible substrate; The flexible base is provided with a cone hole structure for unidirectional water transmission.

2. The flexible electronic material with moisture and heat management performance according to claim 1, characterized in that: The flexible substrate contains polydimethylsiloxane, aliphatic aromatic copolyester, or SEBS.

3. The flexible electronic material with moisture and heat management performance according to claim 1, characterized in that: The flexible substrate is filled with conductive fillers; the conductive fillers include carbon-based conductive materials, metal nanomaterials and conductive polymers.

4. The flexible electronic material with moisture and heat management performance according to claim 3, characterized in that: The filling mass fraction of the conductive filler is 2.5%-4%.

5. The flexible electronic material with moisture and heat management performance according to claim 1, characterized in that: The thickness of the gold layer is 100-200 nm.

6. A method for preparing the flexible electronic material with moisture and heat management performance according to claim 1, characterized in that: include: preparing a flexible base material into a mixed solution; The mixed solution is subjected to shaping treatment and punching treatment in sequence to obtain a flexible substrate with a conical hole structure for unidirectional water transport; Gold is deposited on the surface of the flexible substrate having the conical hole structure for unidirectional water transport to obtain the flexible electronic material with moisture and heat management performance.

7. The flexible electronic material with moisture and heat management performance according to claim 6, characterized in that: The step of preparing the flexible substrate material into a mixed solution specifically comprises: The flexible base material, the cross-linking agent, the conductive filler and the organic solvent are mixed to obtain a mixed solution; wherein the mass ratio of the flexible base material to the cross-linking agent is 10-30:1; Preferably, the organic solvent is n-hexane or cyclohexane.

8. The flexible electronic material with moisture and heat management performance according to claim 6, characterized in that: The mixed solution is subjected to shaping treatment and punching treatment in sequence to obtain a flexible substrate with a conical hole structure having one-way water transport, specifically comprising: Placing the mixed solution in a heating device, controlling the heating temperature and time, and shaping the mixed solution; The formed product is laser-drilled to form a conical hole structure for one-way water transmission to obtain an intermediate; The intermediate is subjected to plasma treatment to obtain the flexible substrate having a pore structure for unidirectional water transport.

9. The method for preparing a flexible electronic material with moisture and heat management performance according to claim 8, characterized in that: The heating temperature is 60-80℃.

10. The method for preparing a flexible electronic material with moisture and heat management performance according to claim 7, characterized in that: The amount of the organic solvent added is 10-20% of the total mass of the mixture formed by the flexible base material and the cross-linking agent.

Images