Multi-size compatible wafer platform for mercury CV doping concentration detection

Abstract

The invention discloses a multi-size wafer compatible platform for mercury CV doping concentration detection, and the platform comprises a carrying platform which is provided with a plurality of annular grooves which are concentrically arranged, each annular groove corresponds to the size of a to-be-detected wafer of one specification size, and each annular groove is internally provided with a plurality of blind holes in the circumferential direction; and the plurality of wafer bearing columns are detachably embedded into the blind holes of the annular grooves with the same specification and size as the to-be-detected wafers, the top ends of the wafer bearing columns are higher than the upper surface of the carrying platform, and the wafer bearing columns are used for bearing the to-be-detected wafers. When to-be-detected wafers of different specifications and sizes are switched and tested, the platform does not need to be disassembled and replaced, only the wafer bearing columns need to be disassembled and moved, time and labor are saved, platforms of multiple sizes do not need to be prepared, cost is saved, the to-be-detected wafers can be supported through the wafer bearing columns so as to reduce contact between the front faces of the wafers and the carrying platform, and the testing efficiency is improved. Defects on the surface of the wafer caused by contact can be reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and in particular, relates to a compatible multi-size wafer platform for mercury CV doping concentration detection. Background Art

[0002] Mercury CV (Capacitance-Voltage) doping concentration detection is a technology that uses the Schottky barrier capacitance CV characteristics to test the doping concentration, which can provide important information about the doping concentration of semiconductor materials. At present, there are two modes of mercury CV doping concentration test equipment: upper mercury mode and lower mercury mode. Among them, the lower mercury mode requires the wafer to be tested to be placed face down. In order to reduce the contact between the front of the wafer and the carrier platform, the method of hollowing out the lower part of the area where the wafer is placed on the carrier platform is generally used to reduce the contact between the front of the wafer and the carrier platform. However, the above method requires the carrier platform to be replaced every time a wafer of a different size is changed for testing, which is very inefficient. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a compatible multi-size wafer platform for mercury CV doping concentration detection, aiming to test wafers of different specifications and sizes with only one wafer platform.

[0004] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a compatible multi-size wafer platform for mercury CV doping concentration detection, comprising: a loading platform, on which a plurality of concentrically arranged annular grooves are provided, and each of the annular grooves corresponds to a size of a wafer to be detected, and each of the annular grooves has a plurality of blind holes circumferentially provided therein; a wafer supporting column, wherein a plurality of the wafer supporting columns are detachably embedded in the blind holes of the annular grooves of the same size as the wafer to be detected, and the top of the wafer supporting column is higher than the upper surface of the loading platform, and the wafer supporting column is used to carry the wafer to be detected.

[0005] Preferably, the width of the annular groove is 3.5 mm.

[0006] Preferably, six blind holes are evenly arranged in each annular groove at an angle of 60°.

[0007] Preferably, the blind hole is a circular hole with a diameter of 3 mm.

[0008] Preferably, the wafer supporting column is a cylinder.

[0009] Preferably, after the wafer supporting column is embedded in the blind hole, the top end of the wafer supporting column is 1 mm higher than the upper surface of the loading platform.

[0010] The present invention adopts the above technical solution, which has the following advantages: 1. When switching to test wafers of different specifications and sizes, the present invention does not need to disassemble and replace the platform, but only needs to remove the wafer supporting column, which saves time and effort, and does not need to prepare platforms of multiple sizes, thus saving costs.

[0011] 2. The present invention can support the wafer to be inspected by using the wafer supporting column to reduce the contact between the front side of the wafer and the loading platform, thereby reducing the defects on the wafer surface caused by the contact. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Throughout the accompanying drawings, the same reference numerals are used to represent the same components. In the accompanying drawings: Figure 1 A schematic diagram of a three-dimensional structure of a multi-size wafer platform provided by an embodiment of the present invention; Figure 2 A schematic diagram of the planar structure of a multi-size wafer platform provided in this embodiment of the present invention; Figure 3 A usage status diagram of the compatible multi-size wafer platform provided in this embodiment of the present invention.

[0013] The reference numerals in the figures are as follows: 1-carrying platform; 2-wafer supporting column; 3-annular groove; 4-blind hole; 5-wafer to be tested. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical scheme and advantages of the present invention clearer, the specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0015] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0016] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0017] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0019] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0020] The compatible multi-size wafer platform for mercury CV doping concentration detection provided by the present invention includes: a loading platform, on which a plurality of concentrically arranged annular grooves are provided, and each annular groove corresponds to the size of a wafer to be detected of a specification size, and a plurality of blind holes are provided in each annular groove along the circumferential direction; a wafer bearing column, wherein a plurality of wafer bearing columns are detachably embedded in the blind holes of the annular grooves of the same specification size as the wafer to be detected, and the top of the wafer bearing column is higher than the upper surface of the loading platform, and the wafer bearing column is used to carry the wafer to be detected. When switching to test wafers to be detected of different specifications and sizes, the present invention does not need to disassemble and replace the platform, but only needs to remove and move the wafer bearing column, which saves time and labor, and does not need to prepare platforms of multiple sizes, which saves costs, and the wafer to be detected can be supported by the wafer bearing column to reduce the contact between the front of the wafer and the loading platform, which can reduce the defects on the wafer surface caused by contact.

[0021] Below, the compatible multi-size wafer platform for mercury CV doping concentration detection provided by the embodiment of the present invention is described in detail with reference to the accompanying drawings.

[0022] See also Figures 1 to 3 The compatible multi-size wafer platform for mercury CV doping concentration detection provided in this embodiment includes a loading platform 1 and a wafer supporting column 2. A plurality of concentrically arranged annular grooves 3 are provided on the loading platform 1, and each annular groove 3 corresponds to the size of a wafer 5 to be detected of a certain specification. A plurality of blind holes 4 for fixing the wafer supporting column 2 are provided in the circumferential direction in each annular groove 3; a plurality of wafer supporting columns 2 are detachably embedded in the blind holes 4 of the annular groove 3 of the same specification as the wafer 5 to be detected, and the top of the wafer supporting column 2 is higher than the upper surface of the loading platform 1, and the wafer supporting column 2 is used to carry the wafer 5 to be detected. Thus, the wafer 5 to be detected can be propped up by the wafer supporting column 2 to reduce the contact between the front of the wafer and the loading platform 1, and each time when the wafer 5 to be detected of different specifications is replaced for testing, it is only necessary to remove the wafer supporting column 2 to the position of the annular groove 3 of the corresponding specification.

[0023] In the above embodiment, preferably, the width of the annular groove 4 is 3.5 mm.

[0024] In the above embodiment, preferably, each annular groove 4 is provided with six blind holes 5 evenly spaced at an angle of 60°.

[0025] In the above embodiment, preferably, the blind hole 5 is a circular hole with a diameter of 3 mm.

[0026] In the above embodiment, preferably, the wafer supporting column 2 is a cylinder.

[0027] In the above embodiment, preferably, after the wafer supporting column 2 is embedded in the blind hole 4 , the top end of the wafer supporting column 2 is 1 mm higher than the upper surface of the loading platform 1 .

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A compatible multi-size wafer platform for mercury CV doping concentration detection, characterized in that: include: A loading platform, wherein a plurality of concentrically arranged annular grooves are formed on the loading platform, and each of the annular grooves corresponds to a size of a wafer to be inspected, and each of the annular grooves has a plurality of blind holes formed in the circumferential direction; Wafer supporting columns, multiple wafer supporting columns are detachably embedded in the blind holes of the annular groove with the same specifications and dimensions as the wafer to be inspected, and the top ends of the wafer supporting columns are higher than the upper surface of the loading platform, and the wafer supporting columns are used to carry the wafer to be inspected.

2. The compatible multi-size wafer platform according to claim 1, characterized in that: The width of the annular groove is 3.5 mm.

3. The compatible multi-size wafer platform according to claim 1, characterized in that: Each of the annular grooves has six blind holes evenly arranged at an angle of 60 degrees.

4. The compatible multi-size wafer platform according to claim 3, characterized in that: The blind hole is a circular hole with a diameter of 3 mm.

5. The compatible multi-size wafer platform according to claim 4, characterized in that: The wafer supporting column is a cylinder.

6. The compatible multi-size wafer platform according to any one of claims 1 to 5, characterized in that: After the wafer supporting column is embedded in the blind hole, the top end of the wafer supporting column is 1 mm higher than the upper surface of the loading platform.

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