Bearing mechanism and semiconductor process equipment

Abstract

The invention discloses a bearing mechanism and semiconductor process equipment, and relates to the field of semiconductors. A bearing mechanism is used for bearing wafers and comprises a bearing assembly, a lifting assembly and a driving assembly. The bearing assembly is provided with a first groove, and the lifting assembly is provided with a second groove; the driving assembly is arranged on the bearing assembly, the driving end of the driving assembly is connected with the lifting assembly, and the driving assembly is used for driving the lifting assembly to ascend and descend; in a first state, the second groove retracts relative to the first groove, so that the first groove bears the wafer; and in the second state, the second groove extends out relative to the first groove, so that the second groove bears the wafer. The semiconductor process equipment comprises the bearing mechanism. The problem that pollutants are likely to remain at the contact position of the wafer and the supporting structure can be solved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a supporting mechanism and semiconductor process equipment. Background Art

[0002] In the wafer tank wet cleaning equipment of the semiconductor industry, the transmission robot cyclically reciprocates and can transfer the wafer to other robotic arm lifting mechanisms. The robotic arm lifting mechanism can move or operate the wafer, immerse the wafer in the chemical solution, and clean the wafer from contaminants.

[0003] During the series of processes in which the robotic arm lifting mechanism moves up and down to soak the wafer in the chemical solution and take it out, the wafer is supported and fixed by the supporting structure on the robotic arm, and the contact position remains unchanged during the cleaning process. As a result, the position where the wafer contacts the supporting structure is difficult to contact the chemical solution, which can easily cause contaminants to remain at this position. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a supporting mechanism and semiconductor process equipment, which can solve the problem of residual contaminants easily remaining at the contact position between the wafer and the support structure.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] The embodiment of the present application provides a bearing mechanism for bearing a wafer, the bearing mechanism comprising: a bearing assembly, a lifting assembly and a driving assembly;

[0007] The bearing assembly has a first groove, and the lifting assembly has a second groove;

[0008] The driving assembly is arranged on the bearing assembly, and the driving end of the driving assembly is connected to the lifting assembly, so as to drive the lifting assembly to move upward and downward;

[0009] In a first state, the second groove is retracted relative to the first groove, so that the first groove carries the wafer;

[0010] In a second state, the second groove protrudes relative to the first groove, so that the second groove supports the wafer.

[0011] The embodiment of the present application also provides a semiconductor process equipment, including a transfer mechanism and the above-mentioned carrying mechanism;

[0012] The transfer end of the transfer mechanism is connected to the carrying mechanism.

[0013] In the embodiment of the present application, the bearing assembly can carry and limit the wafer through the first groove, so as to carry the wafer into the cleaning tank, so that the wafer contacts the cleaning liquid in the cleaning tank, thereby cleaning the dirt on the surface of the wafer; the lifting assembly can be driven to move up and down by the driving assembly, so that the lifting assembly carries and limits the wafer through the second groove. At the same time, the driving assembly drives the wafer to move up and down through the lifting assembly, so that the wafer is separated from the first groove, so that the position where the wafer contacts the first groove can contact the liquid in the cleaning tank to clean the dirt there. Based on this, the contact between the entire wafer and the liquid can be achieved, ensuring that the entire surface of the wafer can be cleaned by the liquid, thereby effectively avoiding the situation where dirt remains on the surface of the wafer, and ensuring the cleanliness of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A first structural schematic diagram of a carrying mechanism, a lifting mechanism and a wafer disclosed in an embodiment of the present application;

[0015] Figure 2 A second structural schematic diagram of the carrying mechanism, lifting mechanism and wafer disclosed in the embodiment of the present application;

[0016] Figure 3 It is a schematic diagram of the structure of the bearing assembly and the driving assembly disclosed in the embodiment of the present application;

[0017] Figure 4 A schematic diagram of the structure of the driving assembly and the supporting member disclosed in the embodiment of the present application;

[0018] Figure 5 It is a schematic diagram of the structure of a single-acting cylinder disclosed in an embodiment of the present application;

[0019] Figure 6 A schematic diagram of the structure of a bearing member or a supporting member disclosed in an embodiment of the present application;

[0020] Figure 7 A schematic diagram of a control circuit of a drive assembly disclosed in an embodiment of the present application;

[0021] Figure 8 This is a schematic diagram of a carrier disclosed in an embodiment of the present application in a state of supporting a wafer;

[0022] Fig. 9 A schematic diagram of a state in which a support member disclosed in an embodiment of the present application contacts a wafer;

[0023] Fig.10 This is a schematic diagram of the state in which the support member disclosed in the embodiment of the present application supports a wafer.

[0024] Description of reference numerals:

[0025] 100-carrying mechanism;

[0026] 110-bearing assembly; 111-base member; 1111-first plate; 1112-second plate; 112-bearing member; 1121-first groove; 113-fixing frame; 1131-first half frame unit; 1132-second half frame unit; 114-first fastener; 115-second fastener;

[0027] 120-lifting assembly; 121-supporting member; 1211-second groove;

[0028] 130-driving assembly; 131-driving unit; 1311-cylinder; 1312-piston rod; 1313-spring; 1314-partition plate; 1315-exhaust hole; 1316-intake hole; 132-air circuit; 133-solenoid valve; 134-PLC; 135-cable; 136-multi-way terminal;

[0029] 200-lifting mechanism;

[0030] 300-wafer. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0033] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0034] refer to Figures 1 to 10, the embodiment of the present application discloses a bearing mechanism 100 for bearing a wafer 300. Under some working conditions, the bearing mechanism 100 can be driven to move by other mechanisms, and the bearing mechanism 100 can drive the wafer 300 to move. For example, the wafer 300 can be moved to a cleaning tank to clean the dirt on the surface. Of course, other working conditions can also be met. The disclosed bearing mechanism 100 includes a bearing assembly 110, a lifting assembly 120, and a driving assembly 130.

[0035] The bearing assembly 110 is a basic component, which can not only be used to bear the wafer 300, but also provide an installation foundation for the lifting assembly 120, the driving assembly 130, etc. In some embodiments, the driving assembly 130 is provided on the bearing assembly 110, and the driving end of the driving assembly 130 is connected to the lifting assembly 120, and is used to drive the lifting assembly 120 to rise and fall. Exemplarily, the driving assembly 130 can be installed on the bearing assembly 110 to ensure the stability of the driving assembly 130, wherein the installation form can adopt a fixed connection form, such as welding, riveting, bonding, etc., and can also adopt a detachable connection form, such as clamping, screwing, etc.

[0036] In addition, the driving end of the driving assembly 130 can move along the lifting direction, so as to drive the lifting assembly 120 to move in the lifting direction, and the lifting assembly 120 drives the wafer 300 to move synchronously in the lifting direction. The lifting direction can be a vertical direction, and of course, it can also form a certain angle with the vertical direction, as long as it meets the actual working conditions.

[0037] In order to carry the wafer 300, the carrying assembly 110 may have a first groove 1121, through which the wafer 300 can be carried and the wafer 300 can be limited to prevent the wafer 300 from moving at will. In some embodiments, the carrying assembly 110 may have multiple first grooves 1121 to carry multiple wafers 300 at the same time, thereby improving the carrying efficiency of the wafer 300.

[0038] Among them, the first groove 1121 can accommodate and limit the edge of the wafer 300. Exemplarily, the first groove 1121 can be an arc groove, and the diameter of the arc groove can be slightly larger than the diameter of the wafer 300, so that the edge of the wafer 300 can be placed in the arc groove. In addition, the groove width of the first groove 1121 can be slightly wider than the thickness of the wafer 300, which is convenient for the edge of the wafer 300 to be placed in the first groove 1121, and the side walls on both sides can be used to limit the wafer 300 to prevent the wafer 300 from tilting.

[0039] The lifting assembly 120 may have a second groove 1211, through which the wafer 300 can also be carried and limited to prevent the wafer 300 from moving at will. At the same time, the lifting assembly 120 can also drive the wafer 300 to move up and down through the second groove 1211, and ensure that the wafer 300 will not move at will during the lifting process. In some embodiments, the lifting assembly 120 may have multiple second grooves 1211 to facilitate the simultaneous carrying and lifting of multiple wafers 300, thereby improving the carrying and lifting efficiency of the wafer 300.

[0040] Among them, the second groove 1211 can accommodate and limit the edge of the wafer 300. Exemplarily, the second groove 1211 can be an arc groove, and the diameter of the arc groove can be slightly larger than the diameter of the wafer 300, so that the edge of the wafer 300 can be placed in the arc groove. In addition, the groove width of the second groove 1211 can be slightly wider than the thickness of the wafer 300, which is convenient for the edge of the wafer 300 to be placed in the second groove 1211, and the wafer 300 can be limited by the side walls on both sides to prevent the wafer 300 from tilting.

[0041] In some embodiments, the first groove 1121 and the second groove 1211 are spaced apart from each other in the circumferential direction of the wafer 300 and are aligned with each other so that the edge of the wafer 300 can be respectively placed in the first groove 1121 and the second groove 1211. In addition, in the lifting direction, the second groove 1211 can be higher than the first groove 1121, so that the wafer 300 is carried by the second groove 1211 and the wafer 300 is separated from the first groove 1121; or, the second groove 1211 is lower than the first groove 1121, so that the wafer 300 is carried by the first groove 1121 and the wafer 300 is separated from the second groove 1211.

[0042] Since the driving assembly 130 can drive the lifting assembly 120 to rise and fall, in the first state, the second groove 1211 retracts relative to the first groove 1121, so that the first groove 1121 carries the wafer 300; in the second state, the second groove 1211 extends relative to the first groove 1121, so that the second groove 1211 carries the wafer 300. It should be noted here that in the first state, the second groove 1211 is in a retracted state (or a descending state), at which time, the wafer 300 is supported and limited by the first groove 1121; in the second state, the second groove 1211 is in an extended state (or a raised state), and lifts up the wafer 300, at which time, the wafer 300 is supported and limited by the second groove 1211, and is separated from the first groove 1121.

[0043] In the embodiment of the present application, the bearing assembly 110 can carry and limit the wafer 300 through the first groove 1121, so as to carry the wafer 300 into the cleaning tank, so that the wafer 300 contacts the cleaning liquid in the cleaning tank, thereby cleaning the dirt on the surface of the wafer 300; the driving assembly 130 can drive the lifting assembly 120 to move up and down, so that the lifting assembly 120 carries and limits the wafer 300 through the second groove 1211. At the same time, the driving assembly 130 drives the wafer 300 to move up and down through the lifting assembly 120, so that the wafer 300 is separated from the first groove 1121, so that the position where the wafer 300 contacts the first groove 1121 can contact the liquid in the cleaning tank to clean the dirt there. Based on this, the entire wafer 300 can be in contact with the liquid, ensuring that the entire surface of the wafer 300 can be cleaned by the liquid, thereby effectively avoiding the situation where dirt remains on the surface of the wafer 300, and ensuring the cleanliness of the wafer 300.

[0044] refer to Figure 1 In some embodiments, the bearing assembly 110 may include a base member 111 and a plurality of bearing members 112. The plurality of bearing members 112 are respectively disposed on the base member 111 and are arranged at intervals in the first direction. Each bearing member 112 may be provided with a first groove 1121. Through this arrangement, the bearing and position limiting of the wafer 300 can be achieved through the first grooves 1121 of each of the plurality of bearing members 112 to ensure the stability of the wafer 300. Under actual working conditions, the edge of the wafer 300 can be placed in the first grooves 1121 correspondingly disposed on the plurality of bearing members 112. On the one hand, the wafer 300 is jointly supported by the plurality of bearing members 112. On the other hand, the bearing and position limiting of the wafer 300 can be achieved through the first grooves 1121 of each of the plurality of bearing members 112.

[0045] Each bearing member 112 extends along a second direction, wherein the second direction forms a preset angle with the first direction, and the preset angle can be selected according to actual working conditions, such as 30°, 45°, 60°, 90°, 150°, 180°, etc. In some embodiments, the second direction is perpendicular to the first direction.

[0046] Exemplarily, the support member 112 may be a long strip-shaped structure, such as a long strip board, a long strip rod, a long strip block, etc., and the specific form is not limited.

[0047] Each carrier 112 is provided with a plurality of first grooves 1121 , and the plurality of first grooves 1121 are arranged at intervals along the second direction, so as to carry and limit a plurality of wafers 300 through the plurality of first grooves 1121 .

[0048] In order to enable multiple carriers 112 to carry and limit the same wafer 300 at the same time, in the embodiment of the present application, the multiple first grooves 1121 of any two adjacent carriers 112 are arranged in a one-to-one correspondence, that is, the first grooves 1121 of the multiple carriers 112 at the same position in the second direction are aligned in sequence along the first direction to form a groove channel. In this way, the edge of the wafer 300 can be simultaneously placed in the first grooves 1121 of the multiple carriers 112 at the same position in the second direction, so that the wafer 300 can be jointly carried and limited by the multiple first grooves 1121 to further improve the stability of the wafer 300.

[0049] Since each carrier 112 is provided with a plurality of first grooves 1121 in the second direction, a plurality of groove channels can be formed in the second direction, so that a plurality of wafers 300 can be jointly supported and limited.

[0050] In other embodiments, the supporting component 110 may also include a base member 111, and the first groove 1121 is directly opened in the base member 111. In this form, the wafer 300 can also be supported and contained, and the number of components can be reduced, which can reduce the complexity of the structure to a certain extent.

[0051] In order to adapt to the arc edge of the wafer 300, the base member 111 can be a concave plate member, which is provided with an inner concave surface, and the multiple carriers 112 are respectively connected to the inner concave surface. Since the inner concave surface is not a plane, the bottom of the first groove 1121 of each of the multiple carriers 112 is not located in the same plane, but is a concave surface. In this way, the arc edge of the wafer 300 can be surrounded by the multiple carriers 112 to a certain extent, thereby effectively preventing the wafer 300 from rolling relative to the carrier 112 or even detaching from the carrier 112, thereby ensuring the circumferential stability of the wafer 300.

[0052] Exemplarily, the number of the carriers 112 may be two, three, or even more. Of course, the more the number of the carriers 112 is, the more obvious the circumferential limiting effect on the wafer 300 is, and accordingly, the better the stability of the wafer 300 is.

[0053] In addition, when the first groove 1121 of the carrier 112 is an arc-shaped groove, the carrier 112 can also be set as one. In this form, the arc-shaped groove can also adapt to the arc-shaped edge of the wafer 300 and have a better limiting effect on the wafer 300.

[0054] The above-mentioned concave surface may include various forms: a concave arc surface, a concave bent surface, etc., which can be selected according to actual working conditions.

[0055] refer to Figure 1 and Figure 2In some embodiments, the base member 111 may include a first plate 1111 and a second plate 1112, wherein the first plate 1111 is connected to the second plate 1112 and is arranged at an obtuse angle, and the plate surface of the first plate 1111 and the plate surface of the second plate 1112 form the above-mentioned concave surface. Exemplarily, the obtuse angle between the first plate 1111 and the second plate 1112 may range from 100° to 170°, for example, including 100°, 120°, 135°, 150°, 170°, etc. When the diameter of the wafer 300 is small, a smaller obtuse angle may be selected, and when the diameter of the wafer 300 is large, a larger obtuse angle may be selected. Of course, the base member 111 may also be a whole plate, or include three plates, four plates, etc., and the specific method is not limited.

[0056] Furthermore, one end of the first plate 1111 away from the second plate 1112 is connected to a bearing member 112, one end of the second plate 1112 away from the first plate 1111 is connected to a bearing member 112, and a bearing member 112 is connected to the connection between the first plate 1111 and the second plate 1112. Based on this configuration, the three bearing members 112 can form three supports for the wafer 300, thereby improving the stability of the wafer 300.

[0057] In addition to the three locations where the supporting devices are arranged, at least one supporting member 112 can be arranged between the two ends of the first plate 1111 along the first direction, and at least one supporting member 112 can also be arranged between the two ends of the second plate 1112 along the first direction. In this way, more supports can be formed for the wafer 300, thereby further improving the stability of the wafer 300.

[0058] refer to Figure 1 In order to install the driving assembly 130, the bearing assembly 110 may further include a fixing frame 113, which is connected to the side of the base member 111 away from the bearing member 112. In actual working conditions, when the lifting direction is vertical, the bearing member 112 may be located at the upper part of the base member 111, and the fixing member may be connected to the lower part of the base member 111. This arrangement can not only install the fixing frame 113, but also prevent the fixing frame 113 from interfering with the bearing and limiting of the wafer 300 by the bearing member 112.

[0059] In addition, the fixing frame 113 can be fixedly connected to the base member 111, such as by welding, bonding, riveting, etc., and can also be detachably connected to the base member 111, such as by screwing, clamping, plugging, etc.

[0060] The driving assembly 130 is connected to the fixing frame 113, and the driving end of the driving assembly 130 passes through the base member 111 and is connected to the lifting assembly 120 located on the same side of the base member 111 as the carrier member 112. Through this arrangement, the driving assembly 130 is installed to ensure its stability, and the driving assembly 130 can also be connected to the lifting assembly 120 to facilitate driving the lifting assembly 120 to rise and fall. In addition, the driving assembly 130 and the lifting assembly 120 are located on opposite sides of the base member 111 to prevent the driving assembly 130 from interfering with the lifting assembly 120's support and position limiting of the wafer 300.

[0061] Exemplarily, the base member 111 may be provided with an escape space, such as a through hole, a through slot, etc., so that the driving end of the driving assembly 130 can pass through the base frame.

[0062] refer to Figure 1 and Figure 3 In some embodiments, the fixing frame 113 may include a first half frame unit 1131 and a second half frame unit 1132. The first half frame unit 1131 and the second half frame unit 1132 are symmetrically arranged in the second direction and are matched and connected in the second direction to form a receiving space therebetween. At least part of the driving assembly 130 is disposed in the receiving space. It should be noted that the shapes of the first half frame unit 1131 and the second half frame unit 1132 are substantially the same, that is, the first half frame unit 1131 and the second half frame unit 1132 are formed by splitting the fixing frame 113 into two halves.

[0063] The accommodation space between the first half frame unit 1131 and the second half frame unit 1132 can provide installation space for the driving assembly 130. In addition, the driving assembly 130 can also be connected to at least one of the first half frame unit 1131 and the second half frame unit 1132, so as to ensure the stability of the installation of the driving assembly 130 and prevent the fixing frame 113 from interfering with the connection between the driving assembly 130 and the lifting assembly 120. Of course, the driving assembly 130 can also be connected to the base member 111 to ensure its installation stability.

[0064] In order to realize the connection between the fixing frame 113 and the bearing assembly 110, in the present application, the first half frame unit 1131 and the second half frame unit 1132 can be respectively provided with a first mounting hole, and correspondingly, the base member 111 and / or the bearing member 112 can be provided with a second mounting hole, so that the fixing frame 113 is connected to the bearing assembly 110 by the first fastener 114 penetrating the first mounting hole and the corresponding second mounting hole, so as to ensure the stability of the fixing frame 113, such as Figure 3 As shown. Exemplarily, the first mounting hole may be a common through hole, the second mounting hole may be a threaded hole, and the first fastener 114 may be a screw or a stud for easy assembly and disassembly.

[0065] In order to realize the connection between the first half frame unit 1131 and the second half frame unit 1132, thereby improving the strength and stability of the fixing frame 113, the first half frame unit 1131 can be provided with a third mounting hole, and the second half frame unit 1132 can be provided with a fourth mounting hole. The second fastener 115 is penetrated through the third mounting hole and the fourth mounting hole to realize the connection between the first half frame unit 1131 and the second half frame unit 1132. Figure 3 As shown. Exemplarily, at least one of the third mounting hole and the fourth mounting hole is a threaded hole, and accordingly, the second fastener 115 is a screw or a stud for easy assembly and disassembly.

[0066] In other embodiments, the first half-frame unit 1131 and the supporting component 110 (specifically, the base component 111 and / or the supporting component 112) can also be fixedly connected to ensure the firmness of the connection; of course, the second half-frame unit 1132 and the supporting component 110 (specifically, the base component 111 and / or the supporting component 112) can be fixedly connected to ensure the firmness of the connection.

[0067] In some embodiments, the driving assembly 130 may include a driving unit 131 connected to the bearing assembly 110, and the driving unit 131 is connected to the support member 121 to drive the support member 121 to move up and down. In the embodiment of the present application, the driving unit 131 may include a telescopic driving member, a rotating driving member, or a translating driving member.

[0068] When the driving unit 131 includes a telescopic driving member, the telescopic movement of the telescopic driving member drives the support member 121 to move in the lifting direction, so that the wafer 300 is driven to be separated from the carrier 112 or placed on the carrier 112 by the support member 121. Exemplarily, the telescopic driving member can be a cylinder, a hydraulic cylinder, an electric cylinder, etc.

[0069] When the driving unit 131 includes a rotary driving member, the rotary motion of the rotary driving member is converted into the lifting motion of the support member 121, so that the wafer 300 is driven to be separated from the carrier 112 or placed on the carrier 112 by the support member 121. Exemplarily, the rotary driving member can be a motor, and in this case, a cam structure is connected to the rotating shaft of the motor, and the lifting of the support member 121 is achieved by the contact between the profile of the cam structure and the support member 121.

[0070] When the driving unit 131 includes a translation driving member, the translation movement of the translation driving member is converted into the lifting movement of the support member 121, so that the wafer 300 is driven to be separated from the carrier 112 or placed on the carrier 112 by the support member 121. Exemplarily, the translation driving member can be a rack, which is driven by a gear to translate, and a cam structure is connected to the rack. As the rack moves, the profile of the cam structure is driven to contact the support member 121 to realize the lifting of the support member 121.

[0071] In addition to the above-mentioned manner, the driving unit 131 may also adopt other forms, which are not specifically limited here.

[0072] In some embodiments, the driving unit 131 may be a cylinder, which includes a cylinder body 1311 and a piston rod 1312 that are matched and connected. Accordingly, the driving assembly 130 also includes an air circuit 132, which is connected to the cylinder body 1311, and the lifting assembly 120 is connected to the piston rod 1312. Through this arrangement, the air circuit 132 can pass pressurized gas into the cylinder, and under the action of the pressurized gas, the piston rod 1312 can be extended and retracted, so as to drive the support member 121 of the lifting assembly 120 to move up and down through the piston rod 1312. Exemplarily, the above-mentioned cylinder may be a double-acting cylinder or a single-acting cylinder.

[0073] When the driving assembly 130 includes one driving unit 131, the gas circuit 132 can be directly connected to the driving unit 131; when the driving assembly 130 includes multiple driving units 131, it is necessary to supply gas to the multiple driving units 131 through the gas circuit 132. In this case, the gas circuit 132 can be connected to a multi-way terminal 136, such as Figure 3 As shown, the pressure gas is divided into multiple streams through the multi-way terminal 136, so that each stream of pressure gas is respectively delivered to the cylinder 1311 of the corresponding drive unit 131. For example, the multi-way terminal 136 can be a three-way, a four-way, etc., which can be selected according to actual working conditions.

[0074] In order to control the gas circuit 132, the gas circuit 132 may also be provided with a solenoid valve 133, such as Figure 4 As shown, the solenoid valve 133 is used to switch the on and off of the gas circuit 132, or to adjust the flow rate of the pressurized gas in the gas circuit 132, so as to meet the supply demand of the pressurized gas under actual working conditions.

[0075] Furthermore, if Figure 4 and Figure 7 As shown, the solenoid valve 133 can be electrically connected to the PLC 134 via the cable 135 , so that a control signal can be sent to the solenoid valve 133 via the PLC 134 via the cable 135 to control the state of the solenoid valve 133 , thereby achieving control of the gas circuit 132 .

[0076] In a more specific embodiment, the cylinder may be a single-acting cylinder, and the piston rod 1312 of the single-acting cylinder may extend when the gas line 132 passes pressurized gas into the cylinder body 1311, and retract when the gas line 132 stops passing pressurized gas into the cylinder body 1311. Based on this, only one gas line 132 is required to realize the control of the movement of the cylinder.

[0077] It should be noted here that, under actual working conditions, the lifting assembly 120 can move up and down in the vertical direction, and accordingly, the single-acting cylinder extends in the vertical direction. In this case, when the gas circuit 132 introduces pressurized gas into the cylinder body 1311, the pressurized gas overcomes the gravity of the support member 121 and the piston rod 1312, so that the piston rod 1312 drives the support member 121 to rise, so as to support the wafer 300 through the support member 121, thereby separating the wafer 300 from the carrier 112; when the gas circuit 132 stops introducing pressurized gas into the cylinder body 1311, under the action of the gravity of the support member 121 and the piston rod 1312, the piston rod 1312 retracts, causing the support member 121 to descend, so as to facilitate placing the wafer 300 on the carrier 112.

[0078] refer to Figure 5 In the embodiment of the present application, the cylinder may further include a partition 1314, wherein the cylinder body 1311 is provided with an inner cavity, an air inlet hole 1316 and an exhaust hole 1315, the partition 1314 is movably arranged in the inner cavity and divides the inner cavity into a first chamber and a second chamber, the air inlet hole 1316 is communicated with the first chamber, the exhaust hole 1315 is communicated with the second chamber, and one end of the piston rod 1312 extends to the second chamber and is connected to the partition 1314.

[0079] With this arrangement, when pressurized gas is introduced into the air inlet 1316, the partition 1314 moves from the first chamber to the second chamber, and accordingly, the gas in the second chamber is discharged outwardly through the exhaust hole 1315, so that the partition 1314 can drive the piston rod 1312 to extend, and the piston rod 1312 can lift the support member 121; when pressurized gas is introduced into the exhaust hole 1315, the partition 1314 moves from the second chamber to the first chamber, and accordingly, the gas in the first chamber is discharged outwardly through the air inlet 1316, so that the partition 1314 can drive the piston rod 1312 to retract, and the piston rod 1312 can drive the support member 121 to return. It should be noted here that this type of cylinder is a double-acting cylinder.

[0080] When the cylinder is a double-acting cylinder, when pressurized gas is introduced into the air inlet 1316, the partition 1314 moves from the first chamber to the second chamber, and accordingly, the gas in the second chamber is discharged outwardly through the exhaust hole 1315. In this way, the piston rod 1312 can be extended through the partition 1314, and the support member 121 can be lifted by the piston rod 1312; when the pressure gas is stopped from being introduced into the first chamber, under the action of gravity, the partition 1314 moves from the second chamber to the first chamber, and accordingly, the gas in the first chamber is discharged outwardly through the air inlet 1316. In this way, the piston rod 1312 can be retracted through the partition 1314, and the support member 121 can be lowered by the piston rod 1312.

[0081] In the case where the cylinder is a single-acting cylinder, in order to make the piston rod 1312 more easily return, the cylinder may further include a spring 1313, such as Figure 5 As shown, the spring 1313 is sleeved on the outside of the piston rod 1312, and one end of the spring 1313 is connected to the side wall of the second chamber away from the first chamber, and the other end of the spring 1313 is connected to the partition 1314. Based on this arrangement, under the elastic force of the spring 1313, the partition 1314 can drive the piston to move from the second chamber to the first chamber, so that the piston rod 1312 is easier to return. It should be noted here that the spring 1313 here is a compression spring.

[0082] Of course, spring 1313 can also be a tension spring. In this case, one end of spring 1313 is connected to the side wall of the first chamber facing away from the second chamber, and the other end of spring 1313 is connected to partition 1314. In this case, the elastic force of spring 1313 can also promote the piston rod 1312 to return.

[0083] In order to improve the stability of the wafer 300 during the lifting process, the lifting assembly 120 may include a plurality of support members 121, which are arranged at intervals in the first direction, and each support member 121 is provided with a second groove 1211. Through this arrangement, the wafer 300 can be supported and limited by the respective second grooves 1211 of the plurality of support members 121 to ensure the stability of the wafer 300. Under actual working conditions, the edge of the wafer 300 can be placed in the second grooves 1211 corresponding to the plurality of support members 121. On the one hand, the wafer 300 is jointly supported by the plurality of support members 121, and on the other hand, the wafer 300 is supported and limited by the respective second grooves 1211 of the plurality of support members 121.

[0084] Each support member 121 extends along a second direction, wherein the second direction forms a preset angle with the first direction, and the preset angle can be selected according to actual working conditions, such as 30°, 45°, 60°, 90°, 150°, 180°, etc. In some embodiments, the second direction is perpendicular to the first direction.

[0085] Exemplarily, the support member 121 may be a long strip-shaped structure, such as a long strip board, a long strip rod, a long strip block, etc., and the specific form is not limited.

[0086] Each support member 121 is provided with a plurality of second grooves 1211 , and the plurality of second grooves 1211 are arranged at intervals along the second direction, so as to carry and limit a plurality of wafers 300 through the plurality of second grooves 1211 .

[0087] In order to enable multiple support members 121 to support and limit the same wafer 300 at the same time, in the embodiment of the present application, the multiple second grooves 1211 of any two adjacent support members 121 are arranged in a one-to-one correspondence, that is, in the second direction, the second grooves 1211 of the multiple support members 121 at the same position are aligned in sequence along the first direction to form a groove channel. In this way, the edge of the wafer 300 can be simultaneously placed in the second grooves 1211 of the multiple support members 121 at the same position in the second direction, so that the wafer 300 can be jointly supported and limited by the multiple second grooves 1211 to further improve the stability of the wafer 300.

[0088] Furthermore, the multiple second grooves 1211 of the support member 121 are arranged in one-to-one correspondence with the first grooves 1121 of the carrier 112, so that the same wafer 300 can be jointly supported by each second groove 1211 of the support member 121 and the corresponding first groove 1121 of the carrier 112, so that the same wafer 300 can be supported by the second grooves 1211 of the multiple support members 121 and separated from the corresponding first groove 1121.

[0089] Since each support member 121 is provided with a plurality of second grooves 1211 in the second direction, a plurality of groove channels can be formed in the second direction, so that a plurality of wafers 300 can be supported and limited together.

[0090] In some embodiments, the bottom of the second groove 1211 of each of the multiple support members 121 is not located in the same plane, but is a concave surface. In this way, the multiple support members 121 can have a certain surrounding effect on the arc edge of the wafer 300, thereby effectively preventing the wafer 300 from rolling relative to the support member 121 or even detaching from the support member 121, thereby ensuring the circumferential stability of the wafer 300.

[0091] Exemplarily, the number of the support members 121 may be two, three, or even more. Of course, the more the number of the support members 121 is, the more obvious the circumferential limiting effect on the wafer 300 is, and accordingly, the better the stability of the wafer 300 is.

[0092] In addition, when the second groove 1211 of the support member 121 is an arc-shaped groove, the support member 121 can also be set as one. In this form, the arc-shaped groove can also adapt to the arc-shaped edge of the wafer 300 and have a better limiting effect on the wafer 300.

[0093] In order to improve the stability of supporting the wafer 300, at least one supporting member 121 is provided between every two adjacent supporting members 112 among the multiple supporting members 112. In this way, the wafer 300 can be stably and steadily supported by the multiple supporting members 112, and the at least one supporting member 121 between every two adjacent supporting members 112 can increase the contact area with the wafer 300, thereby also ensuring the stability of supporting the wafer 300.

[0094] In the embodiment of the present application, when the lifting assembly 120 includes a plurality of support members 121, the plurality of support members 121 may be connected to the same driving unit 131 to be driven by the same driving unit 131. Of course, the plurality of support members 121 may also be connected to the plurality of driving units 131 respectively, so that each driving unit 131 drives the corresponding support member 121 to move.

[0095] In the embodiment of the present application, under normal circumstances, the wafer 300 can be supported by the carrier 112 of the carrier assembly 110, and the edge of the wafer can be accommodated and limited by the first groove 1121 to ensure the stability of the wafer 300; in the process of cleaning the wafer, the wafer 300 can be lifted from the carrier 112 by the support 121, so that the edge of the wafer 300 is separated from the first groove 1121 and enters the second groove 1211, and the edge of the wafer 300 can be accommodated and limited by the second groove 1211 to ensure the stability of the wafer 300. Compared with the carrier 112 carrying the wafer 300, the support of the wafer 300 by the support 121 changes the position of the carrier 112 carrying the wafer 300, so as to facilitate the cleaning of the position where the carrier 112 carries the wafer, thereby achieving comprehensive cleaning of the wafer 300 and ensuring the cleanliness of the wafer 300.

[0096] refer to Figures 1 to 10Based on the above-mentioned carrying mechanism 100, the embodiment of the present application also discloses a semiconductor process equipment, including a transfer mechanism and the above-mentioned carrying mechanism 100, and the transfer end of the transfer mechanism is connected to the carrying mechanism 100, so that the entire carrying mechanism 100 can be driven to move through the transfer mechanism, so as to facilitate the transfer of the wafer 300 located on the carrying mechanism 100.

[0097] The transfer mechanism may be a lifting mechanism 200, which can drive the carrying mechanism 100 to move up and down. Of course, the transfer mechanism may also be a translation mechanism, which can drive the carrying mechanism 100 to move horizontally. In addition, the transfer mechanism may also be any other component that can drive the carrying mechanism to move, which is not specifically limited here.

[0098] Under some working conditions, the lifting mechanism 200 can drive the supporting mechanism 100 and the wafer 300 into the cleaning tank to clean the dirt on the surface of the wafer 300; and the driving component 130 can drive the lifting component 120 to rise and fall, and the lifting component 120 can drive the wafer 300 to separate from the supporting component 110, so that the area of ​​the wafer 300 covered by the supporting component 110 can contact the chemical solution in the cleaning tank, thereby achieving cleaning of the entire surface of the wafer 300 to prevent dirt from remaining and ensure the cleanliness of the wafer 300.

[0099] To sum up, in the embodiment of the present application, during the cleaning process of the wafer 300, the carrying position of the wafer 300 can be changed so that the contact position between the wafer 300 and the carrier 112 is exposed to the chemical solution in the cleaning tank, thereby achieving all-round cleaning of the wafer 300 and ensuring the cleanliness of the wafer 300.

[0100] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A carrying mechanism for carrying a wafer (300), characterized in that: The bearing mechanism (100) comprises: a bearing assembly (110), a lifting assembly (120) and a driving assembly (130); The bearing assembly (110) has a first groove (1121), and the lifting assembly (120) has a second groove (1211); The driving component (130) is arranged on the bearing component (110), and a driving end of the driving component (130) is connected to the lifting component (120) for driving the lifting component (120) to move upward and downward; In a first state, the second groove (1211) retracts relative to the first groove (1121), so that the first groove (1121) carries the wafer (300); In the second state, the second groove (1211) extends relative to the first groove (1121) so that the second groove (1211) supports the wafer (300).

2. The supporting mechanism according to claim 1, characterized in that: The bearing assembly (110) comprises a base member (111) and a plurality of bearing members (112) respectively arranged on the base member (111), wherein the plurality of bearing members (112) are arranged at intervals in a first direction; Each of the supporting members (112) extends along the second direction and is provided with a plurality of the first grooves (1121) arranged at intervals along the second direction, and the plurality of the first grooves (1121) of any two adjacent supporting members (112) are arranged in a one-to-one correspondence.

3. The supporting mechanism according to claim 2, characterized in that: The base member (111) is a concave plate member, the concave plate member is provided with an inner concave surface, and the plurality of bearing members (112) are respectively connected to the inner concave surface.

4. The supporting mechanism according to claim 3, characterized in that: The base member (111) comprises a first plate (1111) and a second plate (1112) connected to each other, the first plate (1111) and the second plate (1112) being arranged at an obtuse angle, and the plate surface of the first plate (1111) and the plate surface of the second plate (1112) forming the inner concave surface; The end of the first plate (1111) facing away from the second plate (1112) is connected to the bearing member (112), the end of the second plate (1112) facing away from the first plate (1111) is connected to the bearing member (112), and the connection between the first plate (1111) and the second plate (1112) is connected to the bearing member (112).

5. The supporting mechanism according to any one of claims 2 to 4, characterized in that: The bearing assembly (110) further comprises a fixing frame (113), wherein the fixing frame (113) is connected to a side of the base member (111) facing away from the bearing member (112); The driving assembly (130) is connected to the fixing frame (113), and a driving end of the driving assembly (130) passes through the base member (111) and is connected to the lifting assembly (120) located on the same side of the base member (111) as the bearing member (112).

6. The supporting mechanism according to claim 5, characterized in that: The fixing frame (113) comprises a first half frame unit (1131) and a second half frame unit (1132) which are symmetrical to each other in the second direction; The first half frame unit (1131) and the second half frame unit (1132) are connected in cooperation with each other in the second direction, and a receiving space is formed therebetween, and at least a part of the driving assembly (130) is arranged in the receiving space.

7. The supporting mechanism according to claim 1, characterized in that: The driving assembly (130) comprises a driving unit (131) connected to the bearing assembly (110), and the driving unit (131) comprises a telescopic driving member, a rotating driving member or a translatory driving member.

8. The supporting mechanism according to claim 7, characterized in that: The driving unit (131) is a cylinder, and the cylinder comprises a cylinder body (1311) and a piston rod (1312) that are matched and connected; The driving assembly (130) further comprises an air circuit (132), wherein the air circuit (132) is connected to the cylinder body (1311), and the lifting assembly (120) is connected to the piston rod (1312).

9. The supporting mechanism according to claim 8, characterized in that: The cylinder also includes a spring (1313) and a partition (1314); The cylinder body (1311) is provided with an inner cavity, an air inlet hole (1316) and an air outlet hole (1315); the partition plate (1314) is movably arranged in the inner cavity and divides the inner cavity into a first chamber and a second chamber; the air inlet hole (1316) is communicated with the first chamber, and the air outlet hole (1315) is communicated with the second chamber; One end of the piston rod (1312) extends to the second chamber and is connected to the partition (1314); The spring (1313) is sleeved on the outside of the piston rod (1312), and one end of the spring (1313) is connected to the side wall of the second chamber facing away from the first chamber, and the other end of the spring (1313) is connected to the partition (1314).

10. The supporting mechanism according to claim 2, characterized in that: The lifting assembly (120) comprises a plurality of support members (121), and the plurality of support members (121) are arranged at intervals in a first direction; Each of the support members (121) extends along the second direction and is provided with a plurality of second grooves (1211) arranged at intervals along the second direction, and the plurality of second grooves (1211) of the support member (121) and the first grooves (1121) of the bearing member (112) are arranged in a one-to-one correspondence.

11. The supporting mechanism according to claim 10, characterized in that: At least one supporting member (121) is provided between every two adjacent supporting members (112) among the plurality of supporting members (112).

12. A semiconductor process equipment, characterized in that: It comprises a transfer mechanism and a carrying mechanism (100) as claimed in any one of claims 1 to 11; The transfer end of the transfer mechanism is connected to the carrying mechanism (100).

Images