Wafer labeling machine for semiconductor production

Abstract

The invention relates to a wafer labeling machine for semiconductor production, which relates to the field of semiconductor processing and comprises a base, a rotary labeling assembly and a transportation re-pressing assembly. The base has a preset operation height and operation size and can carry out corresponding bearing and positioning supporting operations. The rotating labeling assembly comprises a rotating limiting unit which is arranged on the surface of the working face of the base, has the preset working height and supporting force and can conduct corresponding rotating adjusting work. And the pressing and labeling unit is arranged on the surface of the working surface of the base, a preset working distance is reserved between the pressing and labeling unit and the rotary clamping unit, and the pressing and labeling unit can perform corresponding labeling operation. The conveying and re-pressing assembly comprises a supporting and positioning unit which is arranged on the surface of the working face of the base and has the preset working size and supporting force, and a preset working distance is reserved between the supporting and positioning unit and the pressing and labeling unit. And the plurality of rotating re-pressing units are arranged on the surface of the working surface of the supporting and positioning unit and can carry out corresponding re-pressing operation. The multiple rotary re-pressing units are distributed on the surface of the working face of the supporting and positioning unit in multiple rows, and the multiple rows of rotary re-pressing units are distributed in an array staggered mode. By means of the conveying negative pressure assembly, the labels can be subjected to re-pressing treatment while the labeled wafers are conveyed and discharged, and the phenomenon that the edges of the labels are warped is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and in particular to a wafer labeling machine for semiconductor production. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. After high-purity polycrystalline silicon is dissolved, silicon crystal seeds are added, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches. The main processing methods of wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. At the same time, the reduction in feature size has increased the impact of the number of particles in the air on the quality and reliability of the wafer after processing during wafer processing, and with the improvement of cleanliness, new data characteristics have also emerged in the number of particles. In the production and processing of wafers, it is necessary to assist in labeling the stored or semi-processed wafers to facilitate the recording and observation of the role, production date and processing progress of the wafers.

[0003] Traditional semiconductor wafer labeling devices directly carry out subsequent unloading operations after completing the labeling operation, or detect the labeling status through imaging detection. They are unable to make timely adjustments to the labeling operation status, and are prone to label edge warping. Summary of the invention

[0004] Purpose of the invention: To provide a wafer labeling machine for semiconductor production to solve the above problems existing in the prior art.

[0005] Technical solution: A wafer labeling machine for semiconductor production includes three components: a base, a rotating labeling component and a transport and re-pressing component.

[0006] Wherein, the base has a predetermined working height and working size, and can perform corresponding bearing and positioning support operations;

[0007] The rotary labeling assembly includes a rotary limit unit placed on the working surface of the base, having a predetermined working height and supporting force, and capable of performing corresponding rotary adjustment operations; a pressing labeling unit placed on the working surface of the base, with a predetermined working distance between the pressing labeling unit and the rotary clamping unit, capable of performing corresponding labeling operations;

[0008] The transport and re-pressing assembly comprises a support and positioning unit which is placed on the working surface of the base, has a predetermined working size and supporting force, and has a predetermined working distance with the pressing and labeling unit; and a plurality of rotating re-pressing units which are placed on the working surface of the support and positioning unit and can perform corresponding re-pressing operations;

[0009] There are multiple rotating re-pressing units, which are distributed in multiple rows on the working surface of the supporting and positioning unit, and the multiple rows of rotating re-pressing units are staggeredly distributed in an array.

[0010] In a further embodiment, the rotation limiting unit includes two components: a supporting and pushing part and a rotation limiting part. The supporting and pushing part is placed on the working surface of the base, has a predetermined working height and supporting force, and can perform corresponding pushing and loading operations. The rotation limiting part is placed on the working surface of the base, and has a predetermined working distance with the supporting and pushing part, and can perform corresponding limiting and rotation adjustment operations.

[0011] In a further embodiment, the supporting and pushing part includes three components: a support column, a support plate, and a telescopic push rod. The support column is placed on the working surface of the base, has a predetermined working height and supporting force, and is multiple and symmetrically distributed on the working surface of the base, and can perform corresponding support and limiting operations. The support plate is connected to the support column, has a predetermined working size and bearing space, and multiple support columns are connected to perform corresponding supporting operations. The telescopic push rod is placed on the working surface of the support plate, has a predetermined working length and telescopicity, and a corresponding push plate is provided at one end, which can perform telescopic adjustment operations within a predetermined range.

[0012] In a further embodiment, the rotation limiting part includes three components: a limiting column, a rotating column and an adsorption limiting disk. The limiting column is placed on the working surface of the base, and a predetermined working distance is left between the limiting column and the supporting and pushing part, and the limiting column has a predetermined working height, and can perform corresponding positioning and bearing operations. The rotating column is rotatably connected to the limiting column, has a predetermined working size and supporting force, and can perform all-round rotation adjustment operations. The adsorption limiting disk is connected to the rotating column, has a predetermined working size, and a plurality of vacuum suction cups are provided on the working surface, which can follow the rotation adjustment of the rotating column to adjust the corresponding working direction.

[0013] In a further embodiment, the pressing labeling unit includes three components: a supporting roller, a connecting plate and a movable labeling unit. The supporting roller is placed on the working surface of the base, has a predetermined working height and supporting force, and has a predetermined working distance with the rotation limiting unit. The connecting plate is connected to the supporting roller, has a predetermined working size and supporting force, and can perform corresponding connecting and positioning operations. The movable labeling unit is movably connected to the working surface of the connecting plate, has a predetermined working size, and can perform a predetermined range of movable adjustment operations along the working surface of the connecting plate.

[0014] In a further embodiment, the mobile labeling unit includes three components: a mobile plate, a telescopic adjustment rod and a labeling plate. The mobile plate is slidably connected to the working surface of the connecting plate, has a predetermined working size, can perform corresponding load-bearing and connecting operations, and can perform sliding adjustment operations within a predetermined range along the working surface of the connecting plate. The telescopic adjustment rod is connected to the mobile plate, has a predetermined working length and elasticity, can follow the sliding adjustment of the mobile plate to adjust the corresponding working position, and can perform telescopic adjustment operations within a predetermined range. The labeling plate is connected to the telescopic adjustment rod, has a predetermined working size, and can follow the telescopic adjustment of the telescopic adjustment rod to adjust the corresponding working position.

[0015] In a further embodiment, the support and positioning unit includes four components: a sliding rail, a sliding block, a connecting column and a positioning plate. The sliding rail is placed on the working surface of the base, has a predetermined working size and supporting force, and can perform corresponding load-bearing and position-limiting operations. The sliding block is placed on the working surface of the sliding rail, has a predetermined working size and supporting force, and can perform sliding adjustment operations within a predetermined range along the working surface of the sliding rail. The connecting column is placed on the working surface of the sliding block, has a predetermined working height and supporting force, and is in multiple numbers and symmetrically distributed on the working surface of the sliding block, and can perform corresponding support and connection operations. The positioning plate is connected to the connecting column through a movable connection block, has a predetermined working size and supporting force, and can perform corresponding load-bearing and position-limiting operations.

[0016] In a further embodiment, the rotating and re-pressing unit includes two components: a rotating roller and a re-pressing roller. The rotating roller is rotatably connected to the working surface of the positioning plate, has a predetermined working size and supporting force, and can perform all-round rotating adjustment operations. The re-pressing roller is sleeved outside the rotating roller, has a predetermined working size, and can perform corresponding rotating operations synchronously with the rotation adjustment of the rotating roller.

[0017] In a further embodiment, a locking block is provided on the lower wall surface of the working direction of the adsorption limit plate, and the locking block is provided with a recessed locking groove; a locking auxiliary part is provided on the working surface of the base corresponding to the working position of the adsorption limit plate; the locking auxiliary part includes an auxiliary block and a movable alignment block, and the auxiliary block is placed on the working surface of the base and can perform corresponding bearing and limiting operations; the movable alignment block is slidably connected to the working surface of the auxiliary block, and the operating size is adapted to the size of the locking groove provided by the locking block.

[0018] Beneficial effects: The present invention relates to a wafer labeling machine for semiconductor production, which relates to the field of semiconductor processing, and includes a base, a rotating labeling component, and a transport and re-pressing component. The base has a predetermined working height and working size, and can perform corresponding bearing and positioning support operations. The rotating labeling component includes a rotating limit unit placed on the working surface of the base, which has a predetermined working height and supporting force, and can perform corresponding rotation adjustment operations; a pressing labeling unit placed on the working surface of the base, which has a predetermined working distance with the rotating clamping unit, and can perform corresponding labeling operations. The transport and re-pressing component includes a supporting and positioning unit placed on the working surface of the base, which has a predetermined working size and supporting force, and has a predetermined working distance with the pressing labeling unit; and a rotating re-pressing unit placed on the working surface of the supporting and positioning unit, which is in multiple numbers and can perform corresponding re-pressing operations. There are multiple rotating re-pressing units, which are distributed in multiple rows on the working surface of the supporting and positioning unit, and the multiple rows of rotating re-pressing units are staggered in an array. The present invention can perform a re-pressure process on the labels while transporting and unloading the wafers after labeling by means of the provided transport negative pressure component, thereby avoiding the phenomenon of label edge warping. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the present invention as a whole.

[0020] Figure 2 Schematic diagram of some components of the present invention.

[0021] Figure 3 This is a schematic diagram from another viewing angle of the present invention.

[0022] Figure 4 It is an enlarged schematic diagram of some components of the present invention.

[0023] The reference numerals in the figure are: base 1, support column 2, supporting plate 3, telescopic push rod 4, push plate 5, limit column 6, rotating column 7, adsorption limit plate 8, vacuum suction cup 9, support roller 10, connecting plate 11, mobile labeling part 12, mobile plate 121, telescopic adjustment rod 122, labeling plate 123, rotating roller 13, re-pressing roller 14, positioning block 15, auxiliary block 16, mobile alignment block 17, sliding rail 18, sliding block 19, connecting column 20, positioning plate 21, mobile connecting block 22, and transverse moving column 23. DETAILED DESCRIPTION

[0024] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0025] The applicant believes that the traditional semiconductor wafer labeling device directly carries out the subsequent unloading operation after completing the labeling operation, or detects the labeling situation through imaging detection. It is unable to make timely adjustments to the labeling operation status, and the label edge warping phenomenon is prone to occur.

[0026] To this end, the applicant designed a wafer labeling machine for semiconductor production. Through the provided transport negative pressure component, the label can be re-pressurized while the wafers after labeling are transported and unloaded, thereby avoiding the phenomenon of label warping.

[0027] The semiconductor wafer labeling machine involved in the present invention mainly includes three components: a base 1, a rotating labeling component and a transport and re-pressing component. Among them, the base 1 has a predetermined working height and working size, and can perform corresponding bearing and positioning support operations. The rotating labeling component includes a rotating limit unit placed on the working surface of the base 1, which has a predetermined working height and supporting force, and can perform corresponding rotation adjustment operations; a pressing labeling unit placed on the working surface of the base 1, with a predetermined working distance between the rotating clamping unit and the pressing labeling unit, and can perform corresponding labeling operations. The transport and re-pressing component includes a supporting and positioning unit placed on the working surface of the base 1, with a predetermined working size and supporting force, and with a predetermined working distance between the pressing labeling unit; and a rotating re-pressing unit placed on the working surface of the supporting and positioning unit, and there are multiple rotating re-pressing units that can perform corresponding re-pressing operations. There are multiple rotating re-pressing units, which are distributed in multiple rows on the working surface of the supporting and positioning unit, and the multiple rows of rotating re-pressing units are staggered in an array.

[0028] The rotation limiting unit includes two components: a supporting and pushing part and a rotation limiting part. The supporting and pushing part is placed on the working surface of the base 1, has a predetermined working height and supporting force, and can perform corresponding pushing and loading operations. The rotation limiting part is placed on the working surface of the base 1, and has a predetermined working distance between it and the supporting and pushing part, and can perform corresponding limiting and rotation adjustment operations.

[0029] The supporting and pushing part includes three components: a supporting column 2, a supporting plate 3 and a telescopic push rod 4. The supporting column 2 is placed on the working surface of the base 1, has a predetermined working height and supporting force, and is multiple and symmetrically distributed on the working surface of the base 1, and can perform corresponding support and limiting operations. The supporting plate 3 is connected to the supporting column 2, has a predetermined working size and bearing space, and connects multiple supporting columns 2 to perform corresponding supporting operations. The telescopic push rod 4 is placed on the working surface of the supporting plate 3, has a predetermined working length and elasticity, and is provided with a corresponding push plate 5 at one end, which can perform telescopic adjustment operations within a predetermined range. In the later operation process, the wafer that needs to be labeled can be placed on the working surface of the supporting plate 3, and then the push plate 5 is driven by the telescopic adjustment of the telescopic push rod 4 to push and load the wafer placed on the working surface of the supporting plate 3.

[0030] The rotation limiting part includes three components: a limiting column 6, a rotating column 7 and an adsorption limiting disk 8. The limiting column 6 is placed on the working surface of the base 1, and a predetermined working distance is left between it and the supporting pusher part, and it has a predetermined working height, and can perform corresponding positioning and bearing operations. The rotating column 7 is rotatably connected to the limiting column 6, has a predetermined working size and supporting force, and can perform all-round rotation adjustment operations. The adsorption limiting disk 8 is connected to the rotating column 7, has a predetermined working size, and a plurality of vacuum suction cups 9 are provided on the working surface, which can be adjusted in the corresponding working direction following the rotation adjustment of the rotating column 7. In the later operation process, when the wafer is pushed to the working surface of the adsorption limiting disk 8 by the push plate 5, the vacuum suction cup 9 will perform vacuum adsorption and limiting on the wafer disk, and then the rotating column 7 can drive the adsorption limiting disk 8 as a whole to perform corresponding rotation adjustment through rotation adjustment, and then drive the wafer to adjust the corresponding working angle.

[0031] The press labeling unit includes three components: a support roller 10, a connection plate 11, and a movable labeling unit 12. The support roller 10 is placed on the working surface of the base 1, has a predetermined working height and supporting force, and has a predetermined working distance with the rotation limit unit. The connection plate 11 is connected to the support roller 10, has a predetermined working size and supporting force, and can perform corresponding connection and positioning operations. The movable labeling unit 12 is movably connected to the working surface of the connection plate 11, has a predetermined working size, and can perform a predetermined range of movable adjustment operations along the working surface of the connection plate 11.

[0032] The mobile labeling unit 12 includes three components: a mobile plate 121, a telescopic adjustment rod 122, and a labeling plate 123. The mobile plate 121 is slidably connected to the working surface of the connecting plate 11, has a predetermined working size, can perform corresponding load-bearing and connection operations, and can perform sliding adjustment operations within a predetermined range along the working surface of the connecting plate 11. The telescopic adjustment rod 122 is connected to the mobile plate 121, has a predetermined working length and elasticity, can follow the sliding adjustment of the mobile plate 121 to adjust the corresponding working position, and can perform telescopic adjustment operations within a predetermined range. The labeling plate 123 is connected to the telescopic adjustment rod 122, has a predetermined working size, and can follow the telescopic adjustment of the telescopic adjustment rod 122 to adjust the corresponding working position. In the later operation process, the telescopic adjustment rod 122 can be driven to adjust the corresponding working position through the sliding adjustment of the mobile unit, and then the labeling plate 123 can be driven to adjust the corresponding working position as a whole. After being moved and adjusted to the corresponding working position, the labeling plate 123 is further driven to approach the wafer through the telescopic adjustment of the telescopic adjustment rod 122 to complete the corresponding labeling operation on the wafer. The labeling plate 123 can be a hollow shell with a corresponding label roll built in, and the label can be continuously loaded by rotating. For details, please refer to the existing labeling machine structure, which is a prior art and will not be described in detail in this application.

[0033] The support and positioning unit includes four components: a sliding rail 18, a sliding block 19, a connecting column 20 and a positioning plate 21. The sliding rail 18 is placed on the working surface of the base 1, has a predetermined working size and supporting force, and can perform corresponding load-bearing and position-limiting operations. The sliding block 19 is placed on the working surface of the sliding rail 18, has a predetermined working size and supporting force, and can perform sliding adjustment operations within a predetermined range along the working surface of the sliding rail 18. The connecting column 20 is placed on the working surface of the sliding block 19, has a predetermined working height and supporting force, and is multiple and symmetrically distributed on the working surface of the sliding block 19, and can perform corresponding support and connection operations. The positioning plate 21 is connected to the connecting column 20 through a mobile connection block 22, has a predetermined working size and supporting force, and can perform corresponding load-bearing and position-limiting operations. In the later operation process, the sliding adjustment of the sliding block 19 can drive the connecting column 20 and the positioning plate 21 to adjust the corresponding working position as a whole. In a further preferred embodiment, the movable connecting block 22 is slidably connected to the working surface of the connecting column 20, and can be slid and adjusted accordingly along the working surface of the connecting column 20, so that the overall working height of the positioning plate 21 can be flexibly adjusted. The positioning plate 21 is connected to the movable connecting block 22 through a lateral movable column 23, and the lateral movable column 23 passes through the movable connecting block 22, has a predetermined working length, and is movably connected to the movable connecting block 22, and can be adjusted within a predetermined range, so that the positioning plate 21 can be moved to a corresponding working position as a whole, and the rotating re-pressing unit can be moved to a corresponding working position as a whole, so as to facilitate label re-pressing operations for wafers of different working sizes.

[0034] The rotating re-pressing unit includes two components: a rotating roller 13 and a re-pressing roller 14. The rotating roller 13 is rotatably connected to the working surface of the positioning plate 21, has a predetermined working size and supporting force, and can perform all-round rotation adjustment operations. The re-pressing roller 14 is sleeved on the outside of the rotating roller 13, has a predetermined working size, and can synchronously perform corresponding rotation operations following the rotation adjustment of the rotating roller 13. In the later operation process, the rotation of the rotating roller 13 can drive the re-pressing roller 14 to perform corresponding rotation adjustment operations, and then the label placed on the working surface of the wafer can be re-pressed. At the same time, since there are multiple rotating re-pressing units, in the later operation process, multiple rotating rollers 13 rotate synchronously in the same direction, and then drive multiple re-pressing rollers 14 to rotate synchronously in the same direction, so that the wafer can be re-pressed while transporting and unloading.

[0035] A locking block 15 is provided on the lower wall surface of the working direction of the adsorption limit plate 8, and the locking block 15 is provided with a recessed locking groove; a locking auxiliary part is provided on the working surface of the base 1 corresponding to the working position of the adsorption limit plate 8; the locking auxiliary part includes an auxiliary block 16 and a movable alignment block 17, and the auxiliary block 16 is placed on the working surface of the base 1, and can perform corresponding bearing and limiting operations; the movable alignment block 17 is slidably connected to the working surface of the auxiliary block 16, and the operating size is adapted to the size of the locking groove provided by the locking block 15. In the later operation process, when the adsorption limit plate 8 needs to perform corresponding rotation adjustment operation, the movable alignment block 17 slides to one side for adjustment, thereby causing the operation movement trajectory to be misaligned with the locking block 15. Then, when the adsorption limit plate 8 completes the corresponding rotation adjustment, the movable alignment block 17 slides and resets again, and can be clamped in the locking groove provided in the locking block 15, thereby realizing the corresponding alignment correction and locking fixing operation.

[0036] Each component in the present application can be driven by a corresponding motor, which is a prior art and will not be described in detail in the present application.

[0037] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes may be made to it in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A wafer labeling machine for semiconductor production, characterized in that include: The base has a predetermined working height and working size, and can perform corresponding load-bearing and positioning support operations; The rotating labeling assembly includes a rotating limit unit placed on the working surface of the base, having a predetermined working height and supporting force, and capable of performing corresponding rotating adjustment operations; and a pressing labeling unit placed on the working surface of the base, with a predetermined working distance between the pressing labeling unit and the rotating clamping unit, capable of performing corresponding labeling operations; The transport and re-pressing assembly comprises a support and positioning unit placed on the working surface of the base, having a predetermined working size and supporting force, and having a predetermined working distance between the support and labeling unit; and a plurality of rotating re-pressing units placed on the working surface of the support and positioning unit, which can perform corresponding re-pressing operations; There are multiple rotating re-pressing units, which are distributed in multiple rows on the working surface of the supporting and positioning unit, and the multiple rows of rotating re-pressing units are staggeredly distributed in an array.

2. A semiconductor production wafer labeling machine according to claim 1, characterized in that: The rotation limiting unit comprises: The supporting and pushing part is placed on the working surface of the base, has a predetermined working height and supporting force, and can perform corresponding pushing and loading operations; The rotation limiting part is placed on the working surface of the base and has a predetermined working distance with the supporting and pushing part, so that corresponding limiting and rotation adjustment operations can be performed.

3. A semiconductor production wafer labeling machine according to claim 2, characterized in that: The supporting and pushing part comprises: A support column is placed on the working surface of the base, has a predetermined working height and supporting force, and is multiple and symmetrically distributed on the working surface of the base, and can perform corresponding supporting and limiting operations; A support plate connected to the support column, having a predetermined operation size and bearing space, and connecting a plurality of the support columns to perform corresponding supporting operations; The telescopic push rod is placed on the working surface of the supporting plate, has a predetermined working length and telescopicity, and is provided with a corresponding push plate at one end, which can perform telescopic adjustment operations within a predetermined range.

4. A semiconductor production wafer labeling machine according to claim 2, characterized in that: The rotation limiting portion comprises: The limiting column is placed on the working surface of the base, and has a predetermined working distance with the supporting and pushing part, and has a predetermined working height, and can perform corresponding positioning and bearing operations; A rotating column is rotatably connected to the limit column, has a predetermined operating size and supporting force, and can perform all-round rotation adjustment operations; The adsorption limit plate is connected to the rotating column and has a predetermined working size. A plurality of vacuum suction cups are arranged on the working surface, which can be adjusted to the corresponding working direction following the rotation adjustment of the rotating column.

5. The semiconductor wafer labeling machine according to claim 1, characterized in that: The press labeling unit comprises: A support roller is placed on the working surface of the base, has a predetermined working height and supporting force, and has a predetermined working distance with the rotation limiting unit; A connecting plate, connected to the supporting roller, has a predetermined operating size and supporting force, and can perform corresponding connecting and positioning operations; The movable labeling part is movably connected to the working surface of the connecting plate, has a predetermined working size, and can perform movable adjustment operations within a predetermined range along the working surface of the connecting plate.

6. A semiconductor production wafer labeling machine according to claim 5, characterized in that: The mobile labeling unit comprises: The movable plate is slidably connected to the working surface of the connecting plate, has a predetermined working size, can perform corresponding load-bearing and connecting operations, and can perform sliding adjustment operations within a predetermined range along the working surface of the connecting plate; A telescopic adjustment rod is connected to the movable plate, has a predetermined working length and telescopicity, can be adjusted to a corresponding working position following the sliding adjustment of the movable plate, and can perform telescopic adjustment operations within a predetermined range; The labeling plate is connected to the telescopic adjustment rod, has a predetermined working size, and can be adjusted to a corresponding working position following the telescopic adjustment of the telescopic adjustment rod.

7. A semiconductor production wafer labeling machine according to claim 1, characterized in that: The supporting and positioning unit comprises: The sliding rail is placed on the working surface of the base, has a predetermined working size and supporting force, and can perform corresponding load-bearing and position-limiting operations; A sliding block is placed on the working surface of the sliding rail, has a predetermined working size and supporting force, and can perform a sliding adjustment operation within a predetermined range along the working surface of the sliding rail; A connecting column is placed on the working surface of the sliding block, has a predetermined working height and supporting force, and is in multiple numbers and symmetrically distributed on the working surface of the sliding block, and can perform corresponding supporting and connecting operations; The positioning plate is connected to the connecting column through a movable connecting block, has a predetermined operating size and supporting force, and can perform corresponding bearing and limiting operations.

8. A semiconductor production wafer labeling machine according to claim 7, characterized in that: The rotary re-pressing unit comprises: A rotating roller, rotatably connected to the working surface of the positioning plate, having a predetermined working size and supporting force, and capable of performing all-round rotating adjustment operations; The re-pressing roller is sleeved outside the rotating roller, has a predetermined operation size, and can synchronously perform corresponding rotating operations following the rotation adjustment of the rotating roller.

9. The semiconductor production wafer labeling machine according to claim 4, characterized in that: A locking block is provided on the lower wall surface of the working direction of the adsorption limit plate, and the locking block is provided with a recessed locking groove; a locking auxiliary part is provided on the working surface of the base corresponding to the working position of the adsorption limit plate; the locking auxiliary part includes an auxiliary block and a movable alignment block, and the auxiliary block is placed on the working surface of the base and can perform corresponding bearing and limiting operations; the movable alignment block is slidably connected to the working surface of the auxiliary block, and the operating size is adapted to the size of the locking groove provided by the locking block.

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