Workpiece processing device, process equipment and workpiece processing method

By adopting the threaded matching structure of the carrier and the support and the gas pipeline system in the semiconductor device process equipment, the multi-dimensional movement of the workpiece is achieved, which solves the problem of low efficiency of multi-dimensional movement in the existing technology and improves the efficiency and stability of workpiece processing.

CN119340251BActive Publication Date: 2025-09-26BEIJING E TOWN SEMICON TECH CO LTD
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Patent Information

Application Number
CN202411449679.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-16
Publication Date
2025-09-26
Estimated Expiration
2044-10-16

AI Technical Summary

Technical Problem

In existing semiconductor device processing equipment, it is difficult to achieve multi-dimensional motion efficiently, resulting in low workpiece processing efficiency.

Method used

The threaded matching structure of the bearing part and the supporting part is adopted, combined with the gas pipeline system, and the multi-dimensional movement of the bearing part is realized through the gas force, including rotational rise, rotational descent, translation, etc. The multi-dimensional movement of the workpiece is realized by utilizing the matching of the internal thread segment and the external thread segment and the push of the gas nozzle.

Benefits of technology

It realizes efficient multi-dimensional movement of workpieces, improves the efficiency and stability of workpiece processing, and adapts to different process requirements.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present disclosure provides a workpiece processing device, process equipment and workpiece processing method, which relate to the field of semiconductor processing. The workpiece processing device includes: a carrier, the carrier includes a tray and a sleeve, the sleeve is connected to the lower surface of the tray away from the workpiece; the sleeve has a first center hole, the first center hole has an internal thread section and a non-thread section, and the internal thread section is arranged near the lower end of the first center hole; a support member, the support member includes a base plate and a bushing, the bushing is connected to the upper surface of the base plate, and the outer side surface of the bushing away from the central axis of the workpiece processing device has an external thread section; a first air inlet line, the gas flowing out of the first air inlet line is used to lift the carrier upward; a second air inlet line and a third air inlet line, the gas flowing out of the second air inlet line is used to push the carrier to rotate in a first direction, and the gas flowing out of the third air inlet line is used to push the carrier to rotate in a second direction, the second direction being opposite to the first direction. The present disclosure can achieve multi-dimensional movement.
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Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor processing technology, and in particular to a workpiece processing device, process equipment, and a workpiece processing method. Background Art

[0002] In the process equipment for manufacturing semiconductor devices, how to solve multi-dimensional motion is one of the topics currently being studied. Summary of the Invention

[0003] The present disclosure provides a workpiece processing device, process equipment, and a workpiece processing method.

[0004] According to one aspect of the present disclosure, a workpiece processing device is provided, comprising: a carrier, the carrier comprising a tray and a sleeve, the tray being used to carry the workpiece, the sleeve being connected to the lower surface of the tray facing away from the workpiece; the sleeve having a first center hole, the first center hole having an internal threaded section and a non-threaded section, the internal threaded section being arranged near the lower end of the first center hole; the inner side surface of the internal threaded section facing the central axis of the workpiece processing device is protruded inwardly relative to the inner side surface of the non-threaded section; a support member, the support member comprising a base plate and a bushing, the bushing being connected to the upper surface of the base plate, the bushing facing away from the workpiece The outer side surface of the central axis of the processing device has an external thread section, and the external thread of the external thread section can cooperate with the internal thread of the internal thread section; a first air inlet pipeline, the gas flowing out of the first air inlet pipeline is used to lift the supporting part upward; wherein, after the internal thread section is separated from the external thread end, the gas flowing out of the first air inlet pipeline is used to keep the supporting part in the target position; a second air inlet pipeline and a third air inlet pipeline, the gas flowing out of the second air inlet pipeline is used to push the supporting part to rotate in a first direction, and the gas flowing out of the third air inlet pipeline is used to push the supporting part to rotate in a second direction, and the second direction is opposite to the first direction.

[0005] In some embodiments, the workpiece processing device further includes: a center pin, the center pin including a rod body and a head, the rod body is fixedly disposed in the second center hole of the bushing, the head is connected to the upper end of the rod body, the cross-sectional area of ​​the head is larger than the cross-sectional area of ​​the rod body, and the head is located in the first center hole.

[0006] In some embodiments, the head is used to limit the support member from further upward movement when the support member moves upward to an upper limit position.

[0007] In some embodiments, the workpiece processing device further includes: a first bracket, in which a first ball is installed; the first bracket is connected to the part of the sleeve close to the internal thread segment and one of the heads; the first ball is used to roll in contact with the part of the sleeve close to the internal thread segment and the other one of the heads when the support member is located at the upper limit position.

[0008] In some embodiments, the distance between the outer side of the head and the inner side of the non-threaded segment is smaller than the distance between the outer side of the externally threaded segment and the inner side of the non-threaded segment, so that the center pin guides the movement of the carrier.

[0009] In some embodiments, the workpiece processing device further includes: a second bracket, which is connected to one of the parts of the head and sleeve located in the non-threaded section; a second ball is installed in the second bracket, and the second ball is in rolling contact with the other part of the part of the head and sleeve located in the non-threaded section.

[0010] In some embodiments, the carrier further includes: a plurality of ribs, wherein the ribs are connected to the lower surface of the tray, and the ribs are connected to the outer side surface of the sleeve, and the plurality of ribs are spaced and evenly distributed along the outer circumference of the sleeve.

[0011] In some embodiments, the second air intake line is connected to a second nozzle, the third air intake line is connected to a third nozzle, and the fluids flowing out of the second nozzle and the third nozzle can act on the ribs respectively.

[0012] In some embodiments, the orthographic projections of the second nozzle and the third nozzle on the first projection plane are both located below the orthographic projection of the tray on the first projection plane; the first projection plane is parallel to the central axis of the tray; the orthographic projections of the second nozzle and the third nozzle on the second projection plane are located outside the tray on the second projection plane; the second projection plane is parallel to the lower surface of the tray; and in the second projection plane, the minimum distance between the orthographic projection of the second nozzle and the orthographic projection of the third nozzle is smaller than the size of the orthographic projection of the tray along the corresponding direction.

[0013] In some embodiments, the second nozzle and the third nozzle are symmetrically arranged; the axial direction of the second nozzle is arranged parallel to the axial direction of the third nozzle.

[0014] In some embodiments, the first air inlet pipe is connected to a plurality of first nozzles, and the plurality of first nozzles are distributed at intervals; the orthographic projections of the plurality of first nozzles on the first projection plane are all located below the orthographic projection of the rib on the first projection plane; the first projection plane is parallel to the central axis of the tray; the orthographic projections of the plurality of first nozzles on the second projection plane are located in the orthographic projection of the tray on the second projection plane; the second projection plane is parallel to the lower surface of the tray.

[0015] In some embodiments, a material of at least one of the carrier, the support, the first air inlet line, the second air inlet line, and the third air inlet line includes quartz.

[0016] According to another aspect of the present disclosure, a process equipment is provided, comprising: a workpiece processing device as described in any one of the above items.

[0017] According to another aspect of the present disclosure, a workpiece processing method based on the aforementioned workpiece processing device is provided, comprising:

[0018] Transferring the workpiece to the top of the carrier;

[0019] When the internal thread section and the external thread section are in a mating state, air is ventilated into the second air inlet pipeline, so that a first force provided by the gas in the second air inlet pipeline can push the bearing member to rotate in a first direction, and the bearing member can also move upward relative to the support member;

[0020] Ventilating the first air inlet line so that the lifting force provided by the gas in the first air inlet line can push the carrier and the workpiece upward relative to the support member until the carrier moves to and maintains a target position; wherein, when the carrier is at the target position, the internal thread segment and the external thread segment are in a separated state;

[0021] Ventilating the second air inlet pipe and the third air inlet pipe so that the rotation speed of the carrier in the first direction gradually decreases until the carrier stops rotating;

[0022] Air is ventilated into the second air inlet line so that a second force provided by the second air inlet line can propel the carrier to rotate in a first direction and process the workpiece; or air is ventilated into the third air inlet line so that a third force provided by the third air inlet line can propel the carrier to rotate in a second direction, which is opposite to the first direction, and process the workpiece;

[0023] After the workpiece is processed, air is supplied to the second air inlet pipe and the third air inlet pipe to gradually reduce the rotation speed of the carrier until the carrier stops rotating;

[0024] Stopping ventilation into the first air inlet pipe, so that the bearing member can move downward under the action of its own gravity;

[0025] When the internal thread section and the external thread section are in a mating state, air is ventilated into the third air inlet pipeline so that the fourth force provided by the third air inlet pipeline can push the supporting member to rotate in the second direction, and the supporting member can also move downward relative to the support member.

[0026] The workpiece processing device provided in this embodiment can realize multi-dimensional motion.

[0027] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are provided to facilitate a better understanding of the present invention and do not constitute a limitation of the present disclosure.

[0029] Figure 1 is a structural schematic diagram of a workpiece processing device according to an embodiment of the present disclosure (when the carrier is in the initial position);

[0030] Figure 2 is a structural schematic diagram of a bearing member and a supporting member according to an embodiment of the present disclosure;

[0031] Figure 3 2 is a schematic structural diagram of a workpiece processing device according to an embodiment of the present disclosure (when the carrier is located at the upper limit position);

[0032] Figure 4 is a schematic diagram of the relative positions of the carrier, the second air intake pipe, and the third air intake pipe according to an embodiment of the present disclosure;

[0033] Figure 5 is a structural schematic diagram of a workpiece processing device according to another embodiment of the present disclosure;

[0034] Figure 6 It is a flowchart of a workpiece processing method according to an embodiment of the present disclosure.

[0035] Explanation of the reference numerals: 100-carrying member; 110-tray; 120-sleeve; 121-first center hole; 121a-non-threaded section; 121b-inner threaded section; 122-first bracket; 123-first ball; 130-support column; 140-rib; 200-support member; 210-base plate; 220-bushing; 221-external threaded section; 222-second center hole; 300-first air inlet line; 400-second air inlet line; 500-third air inlet line; 600-workpiece; 700-center pin; 710-rod; 720-head; 730-second ball. DETAILED DESCRIPTION

[0036] The following description of exemplary embodiments of the present disclosure is made in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding. These details should be considered as merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0037] For ease of description, the direction toward the central axis of the workpiece processing device will be taken as the inner direction, the direction of the support toward the workpiece will be taken as the upper direction, and the direction of the support away from the workpiece (that is, the direction of gravity of the workpiece) will be taken as the lower direction.

[0038] Figure 1 is a structural schematic diagram of a workpiece processing device according to an embodiment of the present disclosure (when the carrier is in the initial position); Figure 2 is a structural schematic diagram of a bearing member and a supporting member according to an embodiment of the present disclosure; Figure 3 2 is a schematic structural diagram of a workpiece processing device according to an embodiment of the present disclosure (when the carrier is located at the upper limit position); Figure 4 Schematic diagram of the relative positions of the carrier, the second air intake pipe and the third air intake pipe according to an embodiment of the present disclosure. Figures 1 to 3 A sectional view taken along a plane passing through the central axis of the workpiece processing device; Figure 4 Schematic diagram of the carrier, the second air intake pipe and the third air intake pipe when viewed from bottom to top.

[0039] This embodiment provides a workpiece processing device, including: a carrier 100 , a support member 200 , a first air intake pipeline 300 , a second air intake pipeline 400 , and a third air intake pipeline 500 .

[0040] The carrier 100 is used to support a workpiece 600, which may include a wafer or other semiconductor device. The carrier 100 may be cylindrical or prismatic. For ease of description, the cylindrical carrier 100 will be used as an example. To facilitate structural compactness, the carrier 100 may be stepped, with the upper portion of the carrier 100 being larger than the lower portion.

[0041] Illustratively, the carrier 100 includes a tray 110 and a sleeve 120. The tray 110 is used to support the workpiece 600. The sleeve 120 is connected to the lower surface of the tray 110 facing away from the workpiece 600. The sleeve 120 can be integrally formed with the tray 110, and the diameter of the tray 110 is larger than the diameter of the sleeve 120. The sleeve 120 has a first center hole 121, the opening of which is located at the lower end surface of the tray 110. The first center hole 121 extends into the tray 110 and penetrates the tray 110, or the first center hole 121 penetrates the sleeve 120, or the first center hole 121 can be a blind hole.

[0042] The first center hole 121 includes an internal thread segment 121b and a non-thread segment 121a. The internal thread segment 121b is located below the non-thread segment 121a, so that the internal thread segment 121b is arranged close to the lower end of the first center hole 121. The axial length of the internal thread segment 121b along the workpiece processing device can be set according to actual needs. The ratio between the length of the internal thread segment 121b and the length of the first center hole 121 can be greater than or equal to 0.24 and less than or equal to 0.36; for example, the ratio between the length of the non-thread segment 121a and the length of the first center hole 121 can be 0.24 or 0.26 or 0.28 or 0.30 or 0.32 or 0.34 or 0.36, or a ratio between any two of the above.

[0043] Optionally, the inner side surface of the internal thread segment 121 b protrudes inwardly from the inner side surface of the non-thread segment 121 a , so as to ensure that the carrier 100 can continue to move upward after the internal thread segment 121 b is separated from the external thread segment 221 .

[0044] In other embodiments, the inner wall of the first central hole 121 may be provided with internal threads, that is, the first central hole 121 is an internal thread section 121b.

[0045] The carrier 100 may further include support columns 130 for supporting the workpiece 600 to reduce the contact area between the workpiece 600 and the carrier 100. A plurality of support columns 130 may be provided, each of which is connected to the tray 110. At least three support columns 130 may be spaced apart along the circumference of the tray 110.

[0046] Optionally, the support column 130 is a lifting pin; the upper surface of the tray 110 is provided with a fixing hole, and the portion of the lifting pin near the lower end is fixed in the fixing hole. In other examples, the support column 130 can be a cylinder, and the cylinder can be provided integrally with the tray 110.

[0047] Support member 200 includes a base plate 210 and a bushing 220. Base plate 210 is used to secure the workpiece processing device to a predetermined mounting position. For example, base plate 210 secures the workpiece processing device to a reaction chamber. Bushing 220 is connected to the upper surface of base plate 210. Base plate 210 and bushing 220 can be integrally formed, or fixedly connected by bonding, screwing, or plugging.

[0048] The outer side of the bushing 220 has an externally threaded section 221. The external threads of the externally threaded section 221 can mate with the internal threads of the internally threaded section 121b. Under external force, the internally threaded section 121b and the externally threaded section 221 can cooperate to achieve rotational upward and downward movement of the tray 110. The externally threaded section 221 is located near the upper end of the bushing 220. The axial height of the externally threaded section 221 can be equal to the height of the bushing 220, or the height of the externally threaded section 221 can be less than the height of the bushing 220.

[0049] The bushing 220 may have a second center hole 222, and the central axis of the second center hole 222 may coincide with the central axis of the first center hole 121, so that a center pin 700 is set in the second center hole 222, and the first center hole 121 and the second center hole 222 are ensured to be coaxial by the center pin 700; in other examples, the bushing 220 may also be a cylinder.

[0050] The gas flowing out of the first air inlet conduit 300 can be sprayed toward the lower surface of the tray 110, thereby lifting the carrier 100 upward. After the internal thread segment 121b separates from the external thread end, the gas flowing out of the first air inlet conduit 300 is used to continue moving the carrier 100 to the target position and maintain the carrier 100 at the target position. The target position can be set according to actual needs; when the carrier 100 is in the target position, the internal thread segment 121b is separated from the external thread segment 221.

[0051] The layout of the first air inlet pipe can be configured according to actual needs. The first air inlet pipe can be connected to one or more first nozzles (not shown in the figure), the axial direction of which can be parallel to the central axis of the workpiece processing device. If there are multiple first nozzles, they can be evenly distributed to improve the stability of the movement of the carrier 100. In other examples, the axial direction of the first nozzle can also form an acute angle with the central axis of the workpiece processing device.

[0052] The gas flowing out of the second air inlet pipeline 400 is used to push the carrier 100 to rotate in a first direction, and the gas flowing out of the third air inlet pipeline 500 is used to push the carrier 100 to rotate in a second direction, which is opposite to the first direction.

[0053] The routing of the second air intake line 400 and the third air intake line 500 can be configured according to actual needs. The second air intake line 400 is connected to a second nozzle (not shown), and the third air intake line 500 is connected to a third nozzle (not shown). The gases ejected from both the second and third nozzles can act on the support 100. When one of the second and third air intake lines 400 and 500 is ventilated, the support 100 can rotate in the corresponding direction, either at an accelerated speed, at a constant speed, or at a decelerated speed. When both the second and third air intake lines 400 and 500 are ventilated simultaneously, the support 100 decelerates and can quickly stop rotating.

[0054] One of the first direction and the second direction is a clockwise direction, and the other is a counterclockwise direction. For example, the first direction is a clockwise direction, and the second direction is a counterclockwise direction. For another example, the first direction is a counterclockwise direction, and the second direction is a clockwise direction.

[0055] In some examples, the carrier 100 also includes a rib 140, which is located on the lower side of the tray 110. The rib 140 can be connected to at least one of the tray 110 and the sleeve 120, so that the gas sprayed from the second nozzle or the third nozzle can act on the rib 140, thereby driving the carrier 100 to rotate.

[0056] In other examples, the tray 110 may be provided with a guide groove, the notch of which is located on the lower surface of the tray 110 , and the gas ejected from the second nozzle or the third nozzle can be blown into the guide groove and generate a force to push the carrier 100 to rotate.

[0057] Optionally, the material of at least one of the carrier 100, the support 200, the first air inlet pipe 300, the second air inlet pipe 400 and the third air inlet pipe 500 includes quartz, thereby improving the high temperature resistance and light transmittance of the workpiece processing device and reducing the weight of the workpiece processing device.

[0058] In some examples, the carrier 100, support member 200, first air inlet conduit 300, second air inlet conduit 400, and third air inlet conduit 500 may all be made of quartz. In other examples, the carrier 100 and support member 200 are made of quartz; the material of the first air inlet conduit 300, second air inlet conduit 400, and third air inlet conduit 500 can be selected according to actual needs, such as rubber or plastic.

[0059] The process for processing a workpiece 600 using the workpiece processing device of this embodiment can be as follows: When the carrier 100 is in its initial position and the internally threaded segment 121b is engaged with the externally threaded segment 221, air is supplied to the second air inlet pipe. Due to the gas flowing from the second air inlet pipe and the meshing of the internally threaded segments 121b and 121b, the carrier 100 can rotate and rise relative to the support member 200. During this process, air can be supplied to the first air inlet pipe to enable the carrier 100 to rise more quickly; in other examples, air can be omitted. It is understood that if air is supplied to the first air inlet pipe.

[0060] When the internally threaded section 121b and the externally threaded section 221 switch from a mated state to a disengaged state, air is supplied to the first air inlet pipe. The air flowing out of the first air inlet pipe propels the tray 110, allowing the carrier 100 to continue ascending to its target position. When the internally threaded section 121b and the externally threaded section 221 are disengaged, air can continue to be supplied to the second air inlet pipe to ensure the stability of the carrier 100 during movement. In other examples, air supply to the second air inlet pipe can also be stopped. During the ascending process, the carrier 100 can lift the workpiece 600 being transported by the robot.

[0061] After the support member 100 reaches the target position, air is continuously ventilated into the first air inlet pipe, allowing the gas flowing out of the first air inlet pipe to overcome the gravity of the support member 100, thereby maintaining the support member 100 in the target position. Then, air is ventilated into the third air inlet pipe, so that both the second and third air inlet pipes are ventilated, causing the support member 100 to decelerate and quickly stop rotating.

[0062] Depending on the process requirements, air is ventilated into the second air inlet line 400 or the third air inlet line 500, causing the carrier 100 to push the workpiece 600 to rotate at the required speed until the process is completed. During this process, the first air inlet line 300 is in a ventilated state to maintain the carrier 100 in the target position.

[0063] After the process is completed, air is ventilated into the second air inlet line 400 and the third air inlet line 500 to decelerate the rotation of the carrier 100 and stop the rotation relatively quickly. In addition, the first air inlet line 300 is in a ventilated state to keep the carrier 100 at the target position.

[0064] After the manipulator moves to the bottom of the workpiece 600, air is supplied to the third air inlet pipeline 500, and air is stopped to the first air inlet pipeline 300 and the second air inlet pipeline 400. Under the action of the weight of the carrier 100 itself, the carrier 100 will fall and transfer the workpiece 600 to the manipulator; when the internal thread segment 121b and the external thread segment 221 are in a mating state, the carrier 100 can rotate and descend under the gas provided by the third air inlet pipeline 500 and the meshing action of the internal thread segment 121b and the external thread segment 221 until the carrier 100 moves to the initial position.

[0065] The workpiece processing device provided in this embodiment can realize the rotational upward movement of the carrier 100 by utilizing the cooperation of the internal thread segment 121b in the carrier 100 and the external thread segment 221 in the support 200, combined with the force provided by the gas in the second air inlet pipe 400; after the internal thread segment 121b is separated from the external thread segment 221, the first air inlet pipe 300 can be used to realize the upward movement of the carrier 100; after the carrier 100 moves to the target position, the second air inlet pipe 400 or the third air inlet pipe 500 can be used to realize the rotational movement of the carrier 100 to perform process treatment on the workpiece 600; after the process treatment is completed, the cooperation of the internal thread segment 121b in the carrier 100 and the external thread segment 221 in the support 200, combined with the force provided by the third air inlet pipe 500, can realize the downward movement of the carrier 100, thereby, this embodiment can realize multi-dimensional movement.

[0066] In some embodiments, the workpiece handling device further includes a center pin 700, which is used to guide the carrier 100 to move in a direction parallel to the central axis of the workpiece handling device, or to rotate about the direction parallel to the central axis of the workpiece handling device. Optionally, the first center hole 121 and the second center hole 222 are coaxially arranged, and the center pin 700 is used to ensure that the first center hole 121 and the second center hole 222 are coaxial; wherein the central axis of the second center hole 222 can coincide with the central axis of the workpiece handling device.

[0067] Illustratively, the center pin 700 includes a rod body 710 and a head 720. The rod body 710 is fixedly disposed in the second center hole 222. The head 720 is connected to the upper end of the rod body 710. The cross-sectional area of ​​the head 720 is larger than the cross-sectional area of ​​the rod body 710. The head 720 is located in the first center hole 121. Optionally, the rod body 710 and the head 720 are both cylindrical, the diameter of the rod body 710 is smaller than the diameter of the head 720, and the rod body 710 and the head 720 are coaxially disposed.

[0068] The head 720 is used to define the upper limit position of the carrier 100; when the carrier 100 reaches the upper limit position, its upward movement ceases. Specifically, the head 720 is used to limit further upward movement of the carrier 100 when it reaches the upper limit position. When the carrier 100 reaches the upper limit position, the lower end surface of the head 720 may directly or indirectly contact the upper end surface of the internally threaded segment 121b; in the case of indirect contact, the two may contact via rolling contact via balls.

[0069] In some examples, the workpiece handling device further includes a first bracket 122, in which a first ball bearing 123 is mounted. The first bracket 122 can be fixed to the upper end of the internally threaded section 121b and is annular in shape. The hollow portion of the first bracket 122 is configured to accommodate the center pin 700. The first ball bearing 123 is configured to roll in contact with the lower end surface of the head 720 when the carrier 100 is at the upper limit position, thereby reducing friction loss.

[0070] At least one of the first bracket 122 and the first ball 123 is made of sapphire. For example, both the first bracket 122 and the first ball 123 are made of sapphire (or corundum), or the first bracket 122 is made of quartz and the first ball 123 is made of sapphire, or the first bracket 122 is made of sapphire and the first ball 123 is made of quartz. The first bracket 122 can be fixedly connected to the internally threaded section 121b by bonding or fastening, or the first bracket 122 and the internally threaded section 121b are integrally provided. The first ball 123 is rotatably disposed in the first bracket 122.

[0071] In other examples, the first bracket 122 is connected to the head 720; the first ball 123 is configured to roll with the internal thread segment 121b when the carrier 100 is at the upper limit position. The first bracket 122 can be fixedly connected to the head 720 by bonding or fastening, or the first bracket 122 and the head 720 can be integrally formed.

[0072] In some examples, to prevent radial relative movement between the bushing 220 and the sleeve 120, the distance between the head 720 and the inner wall of the non-threaded segment 121a of the first central hole 121 can be relatively small. For example, the distance between the outer edge of the head 720 and the inner wall of the non-threaded segment 121a is smaller than the distance between the outer edge of the bushing 220 and the inner wall of the non-threaded segment 121a. This ensures that the internally threaded segment 121b smoothly engages with the externally threaded segment 221 during downward movement of the bearing 100.

[0073] In order to avoid radial relative movement between the bushing 220 and the sleeve 120 and reduce friction loss, the head 720 and the inner wall of the non-threaded section 121 a may be arranged to be in rolling contact.

[0074] Figure 5 This is a structural diagram of a workpiece processing device according to another embodiment of the present disclosure. Figure 5 In some examples, the workpiece processing device further includes: a second bracket connected to the head 720; a second ball 730 is installed in the second bracket, and the second ball 730 is in rolling contact with the sleeve 120 located in the non-threaded section 121a.

[0075] At least one of the second bracket and the second ball 730 is made of sapphire. For example, both the second bracket and the second ball 730 are made of sapphire (or corundum), or the second bracket is made of quartz and the second ball 730 is made of sapphire, or the second bracket is made of sapphire and the second ball 730 is made of quartz. The second bracket can be fixedly connected to the head 720 by bonding or fastening. Alternatively, the first bracket 122 and the head 720 can be integrally provided. The second ball 730 is rotatably disposed in the second bracket.

[0076] In other examples, the second bracket is connected to the portion of the sleeve 120 located at the non-threaded section 121 a ; and the second ball 730 is in rolling contact with the head 720 .

[0077] In other examples, the side surface of the head 720 may also be set to be a spherical surface.

[0078] In some embodiments, the carrier 100 further includes a plurality of ribs 140 connected to the bottom surface of the tray 110 and the outer side of the sleeve 120. The ribs 140 are spaced and evenly distributed along the circumference of the sleeve 120. This improves the strength of the carrier 100. The number of ribs 140 can be two, three, four, six, eight, or more.

[0079] To facilitate the installation of the first nozzle, the dimension of the rib 140 along the axial direction of the workpiece processing device can be smaller than the dimension of the sleeve 120 along the same direction, that is, the lower end of the rib 140 is higher than the lower end of the sleeve 120. Exemplarily, the ratio of the height of the rib 140 to the height of the sleeve 120 can be 0.40, 0.42, 0.44, 0.46, 0.48, 0.50, 0.52, 0.54, 0.56, 0.58, or 0.60, or a ratio between any two of the above.

[0080] In order to reduce the difficulty of installing the second air intake pipe 400 and the third air intake pipe 500 and improve the pushing effect of the gas on the supporting component 100, the second air intake pipe 400 is connected to a second nozzle, and the third air intake pipe 500 is connected to a third nozzle, and the fluid flowing out from the second nozzle and the third nozzle can act on the rib 140 respectively, thereby pushing the supporting component 100 to rotate.

[0081] The orthographic projections of the second and third nozzles on the first projection plane are both located below the orthographic projection of the tray 110 on the first projection plane. The first projection plane is parallel to the central axis of the tray 110. The central axis of the tray 110 is parallel to the central axis of the workpiece processing device; optionally, the central axis of the tray 110 coincides with the central axis of the workpiece processing device.

[0082] The orthographic projections of the second nozzle and the third nozzle on the second projection plane are located outside the tray 110 ; the second projection plane is parallel to the lower surface of the tray 110 .

[0083] In the second projection plane, the minimum distance between the orthographic projection of the second nozzle and the orthographic projection of the third nozzle is less than the dimension of the orthographic projection of the tray 110 along the corresponding direction. For example, the minimum distance between the orthographic projection of the second nozzle and the orthographic projection of the third nozzle is less than the diameter of the orthographic projection of the tray 110. The ratio of this minimum distance to the diameter can be 0.64, 0.70, 0.75, 0.80, 0.85, 0.90, or 0.96, or a ratio between any two of the above values.

[0084] With the above arrangement, the gas ejected from the second nozzle or the third nozzle can be blown more toward the ribs 140 , and the second nozzle and the third nozzle can be prevented from interfering with the rotation of the carrier 100 .

[0085] In some examples, the second nozzle and the third nozzle are symmetrically arranged. The corresponding symmetry lines of the second and third nozzles are perpendicular to the central axis of the tray 110, and the line connecting the second and third nozzles facing one end of the tray 110 is perpendicular to the central axis of the tray 110. In other examples, the second and third nozzles can be arranged asymmetrically to reduce the difficulty of installing the second or third nozzle and to avoid other components.

[0086] In some examples, the axial direction of the second nozzle is parallel to the axial direction of the third nozzle. Both the axial directions of the second nozzle and the axial direction of the third nozzle are parallel to the horizontal direction. For example, the axial direction of the second nozzle is perpendicular to the line connecting the second and third nozzles toward one end of the tray 110. In other examples, the axial direction of the second nozzle and the axial direction of the third nozzle may intersect to reduce the difficulty of installing the second or third nozzle and to avoid other components.

[0087] In some examples, the first air inlet pipe is connected to a plurality of first nozzles. The plurality of first nozzles may be spaced and evenly distributed along a predetermined circumference, the diameter of the predetermined circumference being smaller than the diameter of the tray 110. The orthographic projections of the plurality of first nozzles on the first projection plane are all located below the orthographic projection of the rib 140 on the first projection plane; the first projection plane is parallel to the central axis of the tray 110; the orthographic projections of the plurality of first nozzles on the second projection plane are located within the orthographic projection of the tray 110 on the second projection plane; and the second projection plane is parallel to the bottom surface of the tray 110.

[0088] Through the above arrangement, the gas blown out by the first nozzle can be blown more toward the tray 110 , and the first nozzle can be prevented from interfering with the rotation of the carrier 100 .

[0089] This embodiment further provides a process apparatus comprising a workpiece handling device as described in any of the aforementioned embodiments. Optionally, the process apparatus further comprises a chamber, wherein the workpiece is located within the interior space of the chamber. The bottom plate of the support member in the workpiece handling device can be configured to sealably engage with the lower end of the chamber; alternatively, the carrier and support member in the workpiece handling device can also be located within the interior space of the chamber.

[0090] Please refer to Figure 6 This embodiment also provides a workpiece processing method, which is implemented based on the workpiece processing device in any of the above embodiments. The same points as the above embodiments are not repeated in this embodiment. The workpiece processing method of this embodiment includes:

[0091] S601, transferring the workpiece to the top of the carrier;

[0092] S602: When the internal thread segment and the external thread segment are in a mating state, air is ventilated into the second air inlet pipeline, so that a first force provided by the gas in the second air inlet pipeline can push the bearing member to rotate in a first direction, and the bearing member can also move upward relative to the support member;

[0093] S603, ventilating the first air inlet line so that the lifting force provided by the air in the first air inlet line can push the carrier and the workpiece upward relative to the support member until the carrier moves to and maintains a target position; wherein, when the carrier is at the target position, the internal thread section and the external thread section are in a separated state;

[0094] S604, ventilating the second air inlet pipe and the third air inlet pipe so that the rotation speed of the carrier in the first direction gradually decreases until the carrier stops rotating;

[0095] S605: Ventilate the second air inlet line so that a second force provided by the second air inlet line can propel the carrier to rotate in the first direction and process the workpiece; or ventilate the third air inlet line so that a third force provided by the third air inlet line can propel the carrier to rotate in a second direction opposite to the first direction and process the workpiece;

[0096] S606: After the workpiece is processed, air is supplied to the second air inlet pipe and the third air inlet pipe to gradually reduce the rotation speed of the carrier until the carrier stops rotating;

[0097] S607, stopping ventilation into the first air inlet pipe, so that the bearing member can move downward under the action of its own gravity;

[0098] S608. When the internal thread section and the external thread section are in a mating state, air is ventilated into the third air inlet pipeline so that the fourth force provided by the third air inlet pipeline can push the bearing member to rotate in the second direction, and the bearing member can also move downward relative to the support member.

[0099] In step S602 and step S603, during the upward movement of the carrier, the carrier will support the workpiece and continue to move upward until it reaches the target position. In step S602, air may be ventilated into the first air inlet line or not.

[0100] In steps S603 to S606 , the carrier is maintained at the target position, and the first air intake line is maintained in a ventilated state.

[0101] In step S604 and step S606, after the carrier stops rotating, ventilation to the second air inlet pipe and the third air inlet pipe is stopped.

[0102] In step S607, when the manipulator moves to the bottom of the workpiece, the ventilation to the first air inlet pipeline is stopped. In this step, the ventilation to the third air inlet pipeline may be started, or the ventilation to the third pipeline may not be started.

[0103] In step S607 and step S608, the workpiece is transferred to the robot arm during the downward movement of the carrier. When the carrier moves to the initial position, the ventilation to the third air inlet pipe is stopped.

[0104] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0105] In the description of the present disclosure, it should be understood that the terms "center", "length", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0106] In addition, the terms "first" and "second" used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined in the embodiments of the present disclosure with terms such as "first" and "second" can explicitly or implicitly indicate that the embodiment includes at least one such feature. In the description of the present disclosure, the word "plurality" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.

[0107] In this disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed," "connected," "connect," and "fixed" appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integral connection. It can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication between two elements, or the interaction between two elements. For those skilled in the art, the specific meanings of the above terms in this disclosure can be understood based on the specific implementation.

[0108] In the present disclosure, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0109] Although the embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are illustrative and are not to be construed as limitations on the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A workpiece processing device, comprising: A carrier, the carrier comprising a tray and a sleeve, the tray being used to carry a workpiece, the sleeve being connected to a lower surface of the tray facing away from the workpiece; the sleeve having a first center hole, the first center hole having an internally threaded section and a non-threaded section, the internally threaded section being disposed proximate to a lower end of the first center hole; an inner side surface of the internally threaded section, facing the central axis of the workpiece processing device, being protruded inwardly relative to an inner side surface of the non-threaded section; A support member, the support member comprising a base plate and a bushing, the bushing being connected to the upper surface of the base plate, the outer side of the bushing facing away from the central axis of the workpiece processing device having an external thread section, the external thread of the external thread section being capable of cooperating with the internal thread of the internal thread section; a first air inlet line, wherein the gas flowing out of the first air inlet line is used to lift the carrier upward; wherein, after the carrier moves to the point where the internal thread section is separated from the external thread end, the gas flowing out of the first air inlet line is used to maintain the carrier at a target position; The second air inlet pipeline and the third air inlet pipeline, the gas flowing out of the second air inlet pipeline is used to push the support to rotate along the first direction, and the gas flowing out of the third air inlet pipeline is used to push the support to rotate along the second direction, and the second direction is opposite to the first direction.

2. The workpiece processing device according to claim 1, further comprising: A center pin, comprising a rod body and a head, wherein the rod body is fixedly disposed in the second center hole of the bushing, the head is connected to the upper end of the rod body, the cross-sectional area of ​​the head is greater than the cross-sectional area of ​​the rod body, and the head is located in the first center hole.

3. The workpiece processing device according to claim 2, wherein: The head is used to limit the support member from continuing to move upward when the support member moves upward to the upper limit position.

4. The workpiece processing device according to claim 3, further comprising: a first bracket, wherein a first ball is mounted in the first bracket; The first bracket is connected to a portion of the sleeve close to the internal thread section and one of the head; The first ball is used for rolling contact with the other of the portion of the sleeve close to the internal thread section and the head when the bearing member is located at the upper limit position.

5. The workpiece processing device according to claim 2, wherein: The distance between the outer side surface of the head and the inner side surface of the non-threaded segment is smaller than the distance between the outer side surface of the externally threaded segment and the inner side surface of the non-threaded segment, so that the center pin can guide the movement of the carrier.

6. The workpiece processing device according to claim 2, further comprising: a second bracket connected to the head and one of the portions of the sleeve located in the non-threaded section; A second ball is mounted in the second bracket, and the second ball is in rolling contact with the other of the head and the sleeve in the non-threaded section.

7. The workpiece processing device according to claim 1, wherein: The carrier also includes: a plurality of ribs, the ribs are connected to the lower surface of the tray, the ribs are connected to the outer side surface of the sleeve, and the plurality of ribs are spaced and evenly distributed along the outer circumference of the sleeve.

8. The workpiece processing device according to claim 7, wherein: The second air intake line is connected to a second nozzle, the third air intake line is connected to a third nozzle, and the fluids flowing out of the second nozzle and the third nozzle can act on the ribs respectively.

9. The workpiece processing device according to claim 8, wherein: The orthographic projections of the second nozzle and the third nozzle on the first projection plane are both located below the orthographic projection of the tray on the first projection plane; the first projection plane is parallel to the central axis of the tray; The orthographic projections of the second nozzle and the third nozzle on the second projection plane are located outside the tray on the second projection plane; the second projection plane is parallel to the lower surface of the tray; and in the second projection plane, the minimum distance between the orthographic projection of the second nozzle and the orthographic projection of the third nozzle is smaller than the dimension of the orthographic projection of the tray along the corresponding direction.

10. The workpiece processing device according to claim 8, wherein: The second nozzle and the third nozzle are symmetrically arranged; The axial direction of the second nozzle is arranged parallel to the axial direction of the third nozzle.

11. The workpiece processing device according to claim 7, wherein: The first air inlet pipe is connected to a plurality of first nozzles, and the plurality of first nozzles are distributed at intervals; The orthographic projections of the plurality of first nozzles on the first projection plane are all located below the orthographic projection of the rib on the first projection plane; The first projection plane is parallel to the central axis of the tray; The orthographic projections of the plurality of first nozzles on the second projection plane are located in the orthographic projection of the tray on the second projection plane; The second projection surface is parallel to the lower surface of the tray.

12. The workpiece processing device according to any one of claims 1 to 11, wherein: The material of at least one of the bearing member, the supporting member, the first air intake pipeline, the second air intake pipeline and the third air intake pipeline includes: quartz.

13. A process equipment comprising: A workpiece processing device according to any one of claims 1 to 12.

14. A workpiece processing method based on the workpiece processing device according to any one of claims 1 to 12, comprising: Transferring the workpiece to the top of the carrier; When the internal thread section and the external thread section are in a mating state, air is ventilated into the second air inlet pipeline, so that a first force provided by the gas in the second air inlet pipeline can push the bearing member to rotate in a first direction, and the bearing member can also move upward relative to the support member; Ventilating the first air inlet line so that the lifting force provided by the gas in the first air inlet line can push the carrier and the workpiece upward relative to the support member until the carrier moves to and maintains a target position; wherein, when the carrier is at the target position, the internal thread segment and the external thread segment are in a separated state; Ventilating the second air inlet pipe and the third air inlet pipe so that the rotation speed of the carrier in the first direction gradually decreases until the carrier stops rotating; Air is ventilated into the second air inlet line so that a second force provided by the second air inlet line can propel the carrier to rotate in a first direction and process the workpiece; or air is ventilated into the third air inlet line so that a third force provided by the third air inlet line can propel the carrier to rotate in a second direction, which is opposite to the first direction, and process the workpiece; After the workpiece is processed, air is supplied to the second air inlet pipe and the third air inlet pipe to gradually reduce the rotation speed of the carrier until the carrier stops rotating; Stopping ventilation into the first air inlet pipe, so that the bearing member can move downward under the action of its own gravity; When the internal thread section and the external thread section are in a mating state, air is ventilated into the third air inlet pipeline so that the fourth force provided by the third air inlet pipeline can push the supporting member to rotate in the second direction, and the supporting member can also move downward relative to the support member.

Citation Information

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