Micro-channel heat dissipation structure with secondary branches and radiator

Abstract

The heat dissipation structure with the secondary branches is provided for solving the problem that an existing micro-channel heat dissipation system is insufficient in efficiency, an internal heat dissipation channel is in a wavy line shape, notches are formed in a channel interlayer every certain length to form the secondary branches, and the height of the channel interlayer is smaller than the overall height of the heat dissipation channel. Due to the design that the secondary branches and the channel interlayer are low in height, mixing of cooling media is promoted, the heat exchange intensity in the micro-channel is improved, and balance of heat transfer and pressure drop is achieved by changing relevant design parameters.

Description

Technical Field

[0001] The present invention belongs to the field of microchannel heat dissipation technology. The internal heat dissipation channel is wavy, and the channel interlayer is arranged with notches at regular intervals to form secondary branches. The height of the channel interlayer is less than the overall height of the heat dissipation channel. The secondary branch passage and the open space above the microchannel promote the mixing of the cooling medium, thereby improving heat transfer. Background Art

[0002] With the development of microelectronics technology, the integration of chips is constantly improving, and traditional heat dissipation methods are difficult to meet the needs. Microchannels have been widely used as an important component of heat sinks. Currently, there are optimization solutions in the form of various cross-sectional shapes and built-in plug-ins. These optimized designs have improved the heat dissipation capacity to a certain extent, but they have also brought about an increase in pressure drop, increasing the burden on the system, and the disadvantage of uneven temperature distribution inside the microchannel also limits the application of microchannel heat sinks. Summary of the invention

[0003] Based on this, in view of the low heat exchange capacity and uneven internal temperature distribution of the existing microchannel structure, the present invention provides a wavy microchannel heat dissipation structure design with secondary branches. The designed microchannel is wavy as a whole, the channel partition is arranged with notches and the density of the notches increases along the channel direction, and the channel partition height is less than the overall height.

[0004] The specific technical solutions are:

[0005] A microchannel heat dissipation structure with secondary branches comprises a partition plate forming a single microchannel in a heat dissipation channel, wherein the partition plate forms a secondary branch structure by arranging notches.

[0006] Furthermore, the partition is wavy, so that the cooling medium flowing through forms Dean vortices.

[0007] Furthermore, the shape of the wave line is determined by the equation y=a·sin(b·x), where y is the vertical coordinate of the contour, x is the horizontal coordinate of the contour, the starting point is the coordinate origin; and a and b are the magnification coefficients of the curve.

[0008] Furthermore, the height of the partition is smaller than the overall height of the heat dissipation channel, and an open space is formed at the top to promote mixing of the cooling medium.

[0009] Furthermore, along the heat dissipation channel, the gaps on the partition plate, namely the secondary branches, gradually become denser as they approach the outlet position, so as to adapt to the increase in the temperature at the end of the microchannel.

[0010] Furthermore, by adjusting the width d and the angle θ of the notch, a balance between heat dissipation and power consumption is achieved; the value range of d is 1 to 2 mm, and the value range of θ is 25 to 90°.

[0011] The present invention also provides a radiator, which adopts the above-mentioned microchannel heat dissipation structure.

[0012] Different from the existing technology, the beneficial effects of the present invention are:

[0013] Compared with ordinary straight microchannels, wavy microchannels can produce an effect similar to Dean vortex, enhancing the flow mixing of a single microchannel. The secondary branch structure produces a cutting effect on the flowing cooling medium, creating a recirculation area at the notch. The height of the channel baffle is less than the overall height, forming an open space above the channel to enhance the flow mixing of the entire channel. The enhancement of flow mixing improves local heat transfer, thereby improving heat dissipation efficiency. By changing the width and angle of the secondary branch notch, a balance between heat dissipation and power consumption is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A side view schematic diagram of the microchannel heat dissipation structure design of the present invention.

[0015] Figure 2 A schematic top view of the microchannel heat dissipation structure design of the present invention. DETAILED DESCRIPTION

[0016] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. It should be noted that the embodiments can be implemented in a variety of ways and should not be understood as being limited to the embodiments described herein. The purpose of providing the following embodiments is to more comprehensively demonstrate the concept of the present invention to those skilled in the art.

[0017] Embodiment 1

[0018] Figure 1 101 is a schematic side view of a wavy microchannel with secondary branches in an embodiment of the present invention. 101 is the outer wall of the microchannel, 102 is the microchannel baffle, and 201 is the chip layer. The cooling medium enters from the inlet, absorbs the heat of the chip layer and flows out from the outlet. The overall height of the microchannel h w is 12mm, the microchannel partition height h c The thickness is 10 mm, that is, 2 mm of space is left at the top for mixing of the cooling medium.

[0019] Figure 2 : is a top view schematic diagram of a wavy microchannel with secondary branches in an embodiment of the present invention. The microchannel profile is wavy, and the profile curve is determined by the following equation:

[0020] y = a·sin(b·x)

[0021] Where y is the vertical coordinate of the profile, x is the horizontal coordinate of the profile, and the starting point is the origin of the coordinates. a and b are the magnification coefficients of the curve. In this example, a is 0.3 and b is 0.8. When the cooling medium passes through the wavy microchannel, the curvature effect produces the Dean vortex phenomenon, which improves the heat transfer performance of the cooling medium. The microchannel baffle is arranged with notches along the channel direction to form secondary branches. As it approaches the outlet position, the secondary branches gradually become denser. Figure 1 As shown, there are 5 notches on the microchannel partition, and the microchannel partition is segmented into 25, 7.5, 5, 3, 1, and 5 mm from the inlet. After the cooling medium flows through the secondary branch, a recirculation area is formed, which promotes flow mixing and can make the temperature distribution in the microchannel, especially in the direction perpendicular to the flow channel, more uniform. The width d of the secondary branch in the entire microchannel is constant. When d is small, the heat transfer effect is better and the average temperature in the microchannel is lower, but the corresponding pressure drop will also increase, and the heat dissipation power consumption will increase. In this example, d is 2 mm. The size of the recirculation area is also affected by the secondary branch angle θ. A larger angle can produce a larger recirculation area and flow resistance, improve heat transfer performance, but it will also bring a larger pressure drop. In this example, θ is 90°.

[0022] In summary, in the above-mentioned embodiment of the present invention, a wavy heat dissipation structure with secondary branches is designed, the microchannel is wavy as a whole, the microchannel partition is lower than the overall channel height to leave an open space at the top, and the microchannel partition is arranged with a fixed width of notches along the channel direction to form a secondary branch with a certain angle, and the notches are more dense as they approach the outlet position. The wavy shape, open space and secondary branch structure are used to enhance the flow and mixing of the cooling medium inside the microchannel, improve the heat exchange intensity and temperature uniformity in the microchannel, thereby enhancing the heat dissipation capacity and stability of the heat dissipation system. At the same time, by controlling the width and angle of the secondary branch, a balance between heat dissipation and power consumption can be achieved for a specific heat dissipation system.

[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications and substitutions may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A microchannel heat dissipation structure with secondary branches, characterized in that: The invention comprises a partition plate which forms a single micro-channel in a heat dissipation channel, and the partition plate forms a secondary branch structure by arranging notches.

2. The microchannel heat dissipation structure with secondary branches according to claim 1, characterized in that: The partition is wavy in shape, so that the cooling medium flowing through it forms Dean vortices.

3. The microchannel heat dissipation structure with secondary branches according to claim 2, characterized in that: The shape of the wave line is determined by the equation y=a·sin(b·x), where y is the vertical coordinate of the contour, x is the horizontal coordinate of the contour, the starting point is the coordinate origin; a and b are the magnification coefficients of the curve.

4. The microchannel heat dissipation structure with secondary branches according to claim 1, characterized in that: The height of the partition is smaller than the overall height of the heat dissipation channel, and an open space is formed at the top to promote mixing of the cooling medium.

5. The microchannel heat dissipation structure with secondary branches according to claim 1, characterized in that: Along the heat dissipation channel, the gaps on the partition plate, namely the secondary branches, gradually become denser as they approach the outlet position, so as to adapt to the increase in the temperature at the end of the microchannel.

6. The microchannel heat dissipation structure with secondary branches according to claim 1, characterized in that: The balance between heat dissipation and power consumption is achieved by adjusting the width d and the angle θ of the notch; the value range of d is 1 to 2 mm, and the value range of θ is 25 to 90°.

7. A radiator, characterized in that: The microchannel heat dissipation structure according to any one of claims 1 to 6 is adopted.

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