Light electromagnetic-compatibility high-heat-dissipation composite material case

Abstract

The invention relates to the technical field of aerospace composite materials, in particular to a light electromagnetic compatibility high-heat-dissipation composite material case. The embodiment of the invention provides a light electromagnetic compatibility high-heat dissipation composite material case which comprises a case body composed of a plate body, the plate body is of a skin foam sandwich structure and comprises skins on the two sides and a foam sandwich in the middle, and solid blocks are pre-embedded in preset hole positions of the foam sandwich. The solid blocks are used for machining connecting holes so that different plate bodies can be connected in a matched mode through the connecting columns and the connecting holes. The skin is made of conductive materials, the case body comprises an equipment bin and a heat dissipation bin, the equipment bin and the heat dissipation bin are communicated through a heat dissipation channel, electronic equipment is installed in the equipment bin, the heat dissipation bin is provided with heat dissipation fins, the heat dissipation fins are connected with the electronic equipment through the heat dissipation channel, and the heat dissipation bin is provided with heat dissipation openings communicated with the outside. The embodiment of the invention provides a light electromagnetic compatibility high-heat dissipation composite material case which has the excellent performance of light weight, electromagnetic compatibility and high heat dissipation.

Description

Technical Field

[0001] The invention relates to the technical field of aerospace composite materials, and in particular to a lightweight, electromagnetically compatible, and highly heat-dissipating composite material chassis. Background Art

[0002] The electronic equipment chassis is an important part of the aircraft structure, and usually faces large mechanical environmental loads and complex and stringent electromagnetic compatibility and heat dissipation requirements. At the same time, the rapid development of modern aircraft technology has put forward new requirements for the lightweight structure of electronic equipment chassis. Using lightweight, high-strength fiber-reinforced resin-based composite materials instead of metal materials to manufacture electronic equipment chassis can achieve a significant weight reduction in the structure. However, the electrical conductivity and interlayer heat dissipation performance of traditional fiber-reinforced resin-based composite materials are far inferior to those of metal materials. Therefore, in the process of composite materialization of electronic equipment chassis products, its electromagnetic compatibility and heat dissipation problems must be solved. Summary of the invention

[0003] The embodiment of the present invention provides a lightweight electromagnetic compatible and high heat dissipation composite material chassis, which has the excellent performances of lightweight, electromagnetic compatibility and high heat dissipation.

[0004] The embodiment of the present invention provides a lightweight electromagnetic compatible high heat dissipation composite chassis, including a chassis body composed of a plate body, wherein the plate body is a skin foam sandwich structure, including skins on both sides and a foam sandwich in the middle, wherein the foam sandwich is pre-embedded with a solid block at a preset hole position, and the solid block is used to process a connection hole so that different plates can be matched and connected through a connection column and the connection hole;

[0005] The skin is made of conductive material, the chassis body includes an equipment compartment and a heat dissipation compartment, the equipment compartment and the heat dissipation compartment are connected through a heat dissipation channel, electronic equipment is installed in the equipment compartment, the heat dissipation compartment is provided with a heat sink, the heat sink is connected to the electronic equipment via the heat dissipation channel, and the heat dissipation compartment is provided with a heat dissipation port connected to the outside world.

[0006] In a possible design, the skin is made by laying out carbon fiber composite materials, the surface layer of the skin is carbon cloth prepreg, and the middle layer of the skin is unidirectional prepreg or carbon cloth prepreg.

[0007] In a possible design, the foam core is made of PMI foam.

[0008] In a possible design, the solid block is made of a carbon fiber composite material or a soft metal material.

[0009] In a possible design, the solid block is made of carbon fiber composite material, and the connecting hole is a through hole;

[0010] or,

[0011] The connecting hole is a threaded hole, and a wire thread sleeve is embedded in the threaded hole.

[0012] In a possible design, the solid block is made of soft metal, and the connecting hole is a threaded hole.

[0013] In a possible design, the skin is a conductive prepreg prepared by compounding nickel-plated carbon fiber and conductive resin.

[0014] In a possible design, the solid block is a conductive metal block, and two ends of the metal block are respectively bonded to two conductive skins to achieve electrical connection.

[0015] In one possible design, the heat sink includes a connecting plate and a plurality of heat dissipation teeth, the connecting plate is attached to the surface of the electronic device facing the heat dissipation bin, thermal grease is coated between the connecting plate and the electronic device, a plurality of heat dissipation teeth are vertically arranged on the surface of the connecting plate away from the electronic device, and a capillary structure is arranged on the inner wall of the heat dissipation teeth.

[0016] In a possible design, the heat dissipation port is provided with a fan.

[0017] Compared with the prior art, the present invention has at least the following beneficial effects:

[0018] In this embodiment, in order to further reduce the weight, the load-bearing structure is designed according to the stress characteristics of the product, and a thin-skin foam sandwich structure is adopted. The solid block built into the foam is used to achieve a stable connection between the plates. The skin made of conductive material improves the electromagnetic compatibility of the composite material box. In view of the problem of poor heat dissipation of the box, the present application solves the problem by providing a heat sink. Specifically, when the electronic equipment in the equipment compartment generates heat, the heat sink connected to the electronic equipment will guide the heat into the heat dissipation compartment. The main body of the heat sink is located in the heat dissipation compartment. After the heat sink guides the heat to the heat dissipation compartment, it is discharged through the heat dissipation port. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a structural schematic diagram of a lightweight electromagnetic compatible and high heat dissipation composite material chassis provided by an embodiment of the present invention;

[0021] Figure 2It is a partial structural schematic diagram of a lightweight electromagnetic compatible high heat dissipation composite material chassis provided by an embodiment of the present invention;

[0022] Figure 3 It is a schematic diagram of a heat dissipation structure of a lightweight electromagnetic compatible high heat dissipation composite material chassis provided by an embodiment of the present invention;

[0023] Figure 4 It is a partial schematic diagram of the heat dissipation structure of a lightweight electromagnetic compatible and high heat dissipation composite material chassis provided by an embodiment of the present invention.

[0024] In the figure:

[0025] 1-Skinning;

[0026] 2-Foam sandwich;

[0027] 3- solid block;

[0028] 4-conductive sealing strip;

[0029] 5- Equipment warehouse;

[0030] 6- heat dissipation chamber;

[0031] 7-Electronic equipment;

[0032] 8- heat sink;

[0033] 81-connecting plate;

[0034] 82- heat dissipation teeth;

[0035] 9- Fan. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0037] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present invention are described at the angles shown in the drawings and should not be understood as limiting the embodiments of the present invention. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0039] Please refer to Figures 1 to 4 The embodiment of the present invention provides a lightweight electromagnetic compatible high heat dissipation composite chassis, including a chassis body composed of a plate body, the plate body is a skin 1 foam sandwich 2 structure, including skins 1 on both sides and a foam sandwich 2 in the middle, the foam sandwich 2 is pre-embedded with a solid block 3 at a preset hole position, the solid block 3 is used to process a connection hole so that different plates can be connected through a connection column and a connection hole;

[0040] The skin 1 is made of conductive material, and the chassis body includes an equipment compartment 5 and a heat dissipation compartment 6. The equipment compartment 5 and the heat dissipation compartment 6 are connected through a heat dissipation channel. An electronic device 7 is installed in the equipment compartment 5. The heat dissipation compartment 6 is provided with a heat sink 8. The heat sink 8 is connected to the electronic device 7 via the heat dissipation channel. The heat dissipation compartment 6 is provided with a heat dissipation port connected to the outside world.

[0041] In this embodiment, in order to further reduce the weight, the load-bearing structure is designed according to the stress characteristics of the product, and a thin skin 1 and a foam sandwich 2 structure are adopted. The solid block 3 built into the foam is used to achieve a stable connection between the plates. The skin 1 made of conductive material improves the electromagnetic compatibility of the composite material box. In view of the problem of poor heat dissipation of the box, the present application solves the problem by providing a heat sink 8. Specifically, when the electronic equipment 7 in the equipment compartment 5 generates heat, the heat sink 8 connected to the electronic equipment 7 introduces the heat into the heat dissipation compartment 6. The main body of the heat sink 8 is located in the heat dissipation compartment 6. After the heat sink 8 introduces the heat to the heat dissipation compartment 6, it is discharged through the heat dissipation port.

[0042] In one embodiment of the present invention, the skin 1 is made by laying carbon fiber composite materials, the surface layer of the skin 1 is carbon cloth prepreg, and the middle layer of the skin 1 is unidirectional prepreg or carbon cloth prepreg. Specifically, the ply sequence is designed according to the stress characteristics of the product, and generally quasi-isotropic plies are used, such as [45 / -45]n[0 / 45 / 90 / -45]n[0 / 90]n or [45 / -45]n[0 / 90]n.

[0043] In some embodiments of the present invention, the foam core 2 is made of PMI foam. The strength and density are prioritized according to the load and weight of the product. Generally, the compression strength is ≥1Mpa, and the density is 110Kg / m3 or 75Kg / m3.

[0044] In one embodiment of the present invention, the solid block 3 is made of a carbon fiber composite material or a soft metal material, for example, an aluminum alloy.

[0045] In one embodiment of the present invention, the solid block 3 is made of carbon fiber composite material, and the connecting hole is a through hole;

[0046] or,

[0047] The connection hole is a threaded hole, and the threaded hole is inlaid with a wire screw sleeve. The wire screw sleeve can improve the strength and service life of the thread.

[0048] In one embodiment of the present invention, the solid block 3 is made of soft metal, and the connecting hole is a threaded hole.

[0049] In one embodiment of the present invention, the skin 1 is a conductive prepreg prepared by compounding nickel-plated carbon fiber with a conductive resin.

[0050] The operating frequency of the integrated electronic device 7 is extremely complex, with an operating frequency of 150KHz-18GHz, and the electromagnetic compatibility design is extremely difficult. For the chassis of the electronic device 7, the electromagnetic compatibility design is generally achieved by shielding and grounding.

[0051] When designing the shield, the poor interlayer conductivity of fiber-reinforced resin-based composite materials is taken into consideration. Generally, the surface metallization method is adopted, usually including laying copper mesh, spraying conductive paint, flame spraying and other solutions. The chassis of the electronic equipment 7 is a box-shaped structure with a complex shape and a relatively large bending angle in some areas. The copper mesh is easy to break when laid during molding, and the sprayed conductive paint and flame sprayed materials are not wear-resistant after repeated disassembly. Therefore, for the chassis of the electronic equipment 7 with complex shapes, nickel-plated carbon fiber and conductive resin with conductive fillers can be used. The nickel-plated carbon fiber and the conductive resin are compounded into nickel-plated carbon fiber conductive prepreg for use. The skin 1 is made of conductive prepreg and is a carbon fiber reinforced electromagnetic protection composite chassis with a shielding effectiveness greater than 40dB (150kHz~18GHz).

[0052] In one embodiment of the present invention, the solid block 3 is a conductive metal block, and two ends of the metal block are respectively attached to two conductive skins 1 to achieve electrical connection.

[0053] When designing the grounding, a grounding pole should be designed. In this application, the grounding pole can be designed as a metal embedded block, which is directly attached to the skin 1 made of conductive prepreg to achieve electrical connection. In addition, a conductive sealing strip 4 can be provided to increase the conductive performance.

[0054] Please refer to Figure 3 and Figure 4 In one embodiment of the present invention, the heat sink 8 includes a connecting plate 81 and a plurality of heat dissipation teeth 82. The connecting plate 81 is attached to the surface of the electronic device 7 facing the heat dissipation chamber 6. Thermal conductive silicone grease is coated between the connecting plate 81 and the electronic device 7. A plurality of heat dissipation teeth 82 are vertically arranged on the surface of the connecting plate 81 away from the electronic device 7. A capillary structure is arranged on the inner wall of the heat dissipation teeth 82.

[0055] The function integration of electronic equipment 7 is getting higher and higher, and the heat flux density is also increasing. Heat dissipation has become one of the biggest problems of the electronic equipment 7 chassis. When solving the heat dissipation of the electronic equipment 7 chassis, air cooling is generally used. Due to the poor thermal conductivity between the layers of carbon fiber composite materials, we designed a temperature radiator 8. The heat generating device is in direct contact with the temperature radiator 8, and the heat is dissipated by taking away the heat when the cooling air passes through the surface of the heat dissipation fins.

[0056] The temperature equalizing plate heat sink 8 is a heat dissipation device with a capillary structure on the inner wall. When heat is conducted from the heat source to the evaporation zone, the working fluid in the cavity begins to vaporize and absorb heat. The gas phase working fluid condenses and releases heat in the lower temperature area inside the heat pipe. The condensed liquid phase working fluid returns to the heat source under the action of capillary force or gravity, thereby realizing rapid diffusion and transfer of heat.

[0057] The heat dissipation structure design is shown as follows Figure 3 and Figure 4 As shown, the heat dissipation requirements are met by changing the air volume, adjusting the air duct width, optimizing the heat dissipation teeth 82 and other designs. The heat generated by the equipment is transferred to the temperature-averaging heat sink 8 through the thermal grease, and finally the heat on the surface of the heat sink 8 is taken away by the cooling air, so that the equipment is in a stable thermal environment for normal operation.

[0058] In one embodiment of the present invention, the heat dissipation port is provided with a fan 9 .

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A lightweight, electromagnetically compatible, high heat dissipation composite chassis, characterized in that: The chassis body comprises a plate body, wherein the plate body is a skin-foam sandwich structure, including skins on both sides and a foam sandwich in the middle, wherein the foam sandwich is pre-embedded with a solid block at a preset hole position, and the solid block is used for processing a connecting hole so that different plates can be connected through a connecting column and the connecting hole; The skin is made of conductive material, the chassis body includes an equipment compartment and a heat dissipation compartment, the equipment compartment and the heat dissipation compartment are connected through a heat dissipation channel, electronic equipment is installed in the equipment compartment, the heat dissipation compartment is provided with a heat sink, the heat sink is connected to the electronic equipment via the heat dissipation channel, and the heat dissipation compartment is provided with a heat dissipation port connected to the outside world.

2. The composite material chassis according to claim 1, characterized in that: The skin is made by laying carbon fiber composite materials, the surface layer of the skin is carbon cloth prepreg, and the middle layer of the skin is unidirectional prepreg or carbon cloth prepreg. The ply sequence is designed according to the stress characteristics of the product, and generally quasi-isotropic ply is adopted, such as [45 / -45]n[0 / 45 / 90 / -45]n[0 / 90]n or [45 / -45]n[0 / 90]n.

3. The composite material chassis according to claim 1, characterized in that: The foam sandwich is made of PMI foam. The strength and density are prioritized according to the load and weight of the product. Generally, the compression strength is ≥1Mpa and the density is 110Kg / m 3 or 75Kg / m 3 .

4. The composite material chassis according to claim 1, characterized in that: The solid block is made of a carbon fiber composite material or a soft metal material, for example, an aluminum alloy.

5. The composite material chassis according to claim 4, characterized in that: The solid block is made of carbon fiber composite material, and the connecting hole is a through hole; or, The connecting hole is a threaded hole, and the threaded hole is inlaid with a wire screw sleeve, thereby improving the strength and service life of the thread.

6. The composite material chassis according to claim 4, characterized in that: The solid block is made of soft metal, and the connecting hole is a threaded hole.

7. The composite material chassis according to claim 1, characterized in that: The skin is a conductive prepreg prepared by compounding nickel-plated carbon fiber and conductive resin.

8. The composite material chassis according to claim 1, characterized in that: The solid block is a conductive metal block, and two ends of the metal block are respectively attached to two conductive skins to achieve electrical connection.

9. The composite material chassis according to claim 1, characterized in that: The heat sink includes a connecting plate and a plurality of heat dissipation teeth. The connecting plate is attached to the surface of the electronic device facing the heat dissipation bin. Thermal grease is coated between the connecting plate and the electronic device. A plurality of heat dissipation teeth are vertically arranged on the surface of the connecting plate away from the electronic device. A capillary structure is arranged on the inner wall of the heat dissipation teeth.

10. The composite material chassis according to claim 1, characterized in that: The heat dissipation port is provided with a fan.

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