An apparatus and method for disassembling, recycling and classifying electronic components of waste PCB boards

Abstract

The present invention provides a device and method for disassembling, recycling and classifying electronic components of waste PCB boards. Among them, the device for disassembling, recycling and classifying electronic components of waste PCB boards includes a frame, a grasping component, a conveying and heating component, a first vision component, a second vision component, a classification component and a controller; the conveying and heating component includes a chute unit, a clamping unit and a heating table; the chute unit includes a first guide plate, a second guide plate and a third guide plate; the classification component is used to classify various electronic components; when the back of the circuit board faces up, the controller controls the third guide plate to slide so that the two ends of the third chute are respectively docked with the first chute and the second chute; when the back of the circuit board faces down, the controller controls the third guide plate to slide so that the two ends of the fourth chute are respectively docked with the first chute and the second chute. Through the above structure, the whole disassembly process can be unmanned, reducing the harm of harmful gases to the human body and preventing the circuit board from being violently damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of recycling and reuse of waste electronic and electrical products, and in particular to a device and method for disassembling, recycling and classifying electronic components of waste printed circuit boards (PCBs). Background Art

[0002] Waste printed circuit boards (also known as printed circuit boards) are a complex and precise material composed of fiberglass-reinforced resin and various metals, which contain a large amount of heavy metal elements harmful to the environment and human health, such as tin, lead, cadmium, etc. These metal resources are extremely valuable and have high recycling value. When these circuit boards are discarded or improperly disposed of, these toxic substances may gradually seep into the soil and water sources, causing serious pollution to the ecosystem. These pollutants not only damage the health of the soil and the purity of the water quality, but may also enter the organisms through the food chain, ultimately threatening human health. In addition, the circuit boards also contain a large amount of plastics, glass and other organic substances, which can also be converted into new raw materials after appropriate treatment and applied in industrial production, thus realizing the recycling of resources. The key electronic components contained in waste circuit boards, such as CPUs, ROMs, etc., although they have been used, usually have a long service life and still maintain high functionality and reuse value.

[0003] In the prior art, to disassemble a PCB board, it is generally achieved by manual desoldering. In manual disassembly, workers usually use simple tools, such as soldering guns, hammers, etc., to separate various components and materials on the circuit board. These operations often involve heating and destructive treatments, resulting in the release of toxic substances in the circuit board into the air, generating harmful waste gases. Once these waste gases are inhaled by the human body, they may cause significant harm to human health. Summary of the Invention

[0004] In view of this, the present invention provides a device and method for disassembling, recycling and classifying electronic components of waste printed circuit boards to solve the technical problems that manual disassembly in the above background art will damage the waste printed circuit boards, release toxic substances in the circuit boards into the air, which will harm human health and is not conducive to environmental protection.

[0005] The technical solution of the present invention is realized as follows:

[0006] In a first aspect, the present invention provides a device for disassembling, recycling and classifying electronic components of waste printed circuit boards, including a frame, a grasping component, a conveying and heating component, a first vision component, a second vision component, a classification component and a controller, wherein:

[0007] The grasping component is installed on the frame and is used for grasping the circuit board and transferring it to the conveying and heating component;

[0008] The first vision component is installed on the frame and located above the grasping component, and is used to identify the first image information of the circuit board;

[0009] The conveying and heating component includes a chute unit, a clamping unit and a heating table; the chute unit is provided with a sliding track, and the chute unit includes a first guide plate, a second guide plate and a third guide plate located in the same vertical plane. The first guide plate is fixed on the frame and is provided with a first chute; the second guide plate is fixed on the frame and is horizontally provided with a second chute; the third guide plate is provided with a third chute and a fourth chute. The third chute is a horizontally arranged linear chute, and the fourth chute can turn the circuit board 180 degrees; the third guide plate is slidably installed on the frame in the vertical direction; the clamping unit is slidably connected to the sliding track and is used to make the back of the circuit board face the heating table and convey the circuit board below the heating table; the heating table is used to heat and decompose various electronic components on the circuit board and supply them to the sorting component;

[0010] The second vision component is installed on the frame and located above the sorting component, and is used to collect the second image information of the electronic components;

[0011] The sorting component is installed on the frame and is used to classify various electronic components according to the second image information;

[0012] The controller is electrically connected to the conveying and heating component, the first vision component, the second vision component and the sorting component respectively. The controller is used to judge whether the back of the circuit board is facing up according to the first image information, so as to control the third guide plate to have the following two states:

[0013] When it is judged that the back of the circuit board is facing up, the controller controls the third guide plate to slide until the two ends of the third chute are respectively docked with the first chute and the second chute. The first chute, the second chute and the third chute form the sliding track, and this is the first state at this time;

[0014] When it is judged that the back of the circuit board is facing down, the controller controls the third guide plate to slide until the two ends of the fourth chute are respectively docked with the first chute and the second chute. The first chute, the second chute and the fourth chute form the sliding track, and this is the second state at this time.

[0015] On the basis of the above technical solutions, preferably, the conveying and heating component further includes a linear guide rail installed on the frame;

[0016] The clamping unit includes clamping jaws, a first slider, a sliding shaft, a rotating shaft and a connecting plate. The clamping jaws are used to receive and clamp the circuit board sent by the grasping component. The first slider is slidably mounted on the linear guide. The rotating shaft is rotatably mounted on the first slider. One end of the rotating shaft is connected to the clamping jaws, and the other end of the rotating shaft is connected to the connecting plate. The sliding shaft is slidably mounted in the sliding track and connected to the connecting plate, and is used to make the back of the circuit board face the heating table and convey the circuit board below the heating table.

[0017] On the basis of the above technical solution, preferably, the first chute includes a first horizontal chute, a first inclined chute and a second horizontal chute. The two ends of the first inclined chute are respectively connected to the first horizontal chute and the second horizontal chute. The second horizontal chute is arranged close to the third guide plate.

[0018] The fourth chute includes a third horizontal chute, a first arc chute, a fourth horizontal chute, a second arc chute and a fifth horizontal chute. The third horizontal chute is used to dock with the second horizontal chute. The first arc chute includes a first arc section and a second arc section with opposite centers of the circle. One end of the first arc section is tangent to the third horizontal chute, and the other end is smoothly connected to the second arc section in a transitional manner. The second arc section is tangent to the fourth horizontal chute. There is a distance between the fourth horizontal chute and the third horizontal chute in the vertical direction. The second arc chute is mirror-symmetrical to the first arc chute with respect to the vertical center line of the fourth horizontal chute. The fifth horizontal chute is collinear with the third horizontal chute.

[0019] On the basis of the above technical solution, preferably, the chute unit further includes a bottom plate. The bottom plate is mounted on the frame. The third guide plate is slidably mounted on the bottom plate. The bottom plate is provided with a first positioning groove and a second positioning groove in the vertical direction. The first positioning groove extends downward from the top surface of the bottom plate, and a first positioning hole is provided at the bottom of the first positioning groove. The second positioning groove extends upward from the bottom surface of the bottom plate, and a second positioning hole is provided at the bottom of the second positioning groove.

[0020] The conveying and heating component further includes a positioning unit. The positioning unit includes a first positioning pin and a second positioning pin. One end of the first positioning pin is connected to the third guide plate, and the other end is slidably arranged in the first positioning groove. One end of the second positioning pin is connected to the third guide plate, and the other end is slidably arranged in the second positioning groove.

[0021] In the first state, the first positioning pin is inserted into the first positioning hole to achieve locking.

[0022] In the second state, the second positioning pin is inserted into the second positioning hole to achieve locking.

[0023] Based on the above technical solutions, preferably, the first positioning pin includes a first pin head and a first pin shaft. The top surface of the first pin head is an inclined surface, and the bottom surface is a flat surface. The first pin shaft is connected to the side surface of the first pin head and is slidably installed on the third guide plate; the second positioning pin includes a second pin head and a second pin shaft. The bottom surface of the second pin head is an inclined surface, and the top surface is a flat surface. The second pin shaft is connected to the side surface of the second pin head and is slidably installed on the third guide plate;

[0024] The positioning unit further includes a first spring sleeved on the first pin shaft and a second spring sleeved on the second pin shaft. One end of the first spring is connected to the head of the first positioning pin, and the other end abuts against the third guide plate; one end of the second spring is connected to the head of the second positioning pin, and the other end abuts against the third guide plate.

[0025] Based on the above technical solutions, preferably, the conveying and heating assembly further includes a limiting unit. The limiting unit includes a first positioning block and a second positioning block installed on the second guide plate, and a first limiting block and a second limiting block installed on the third guide plate;

[0026] In the first state, the first positioning block abuts against the first limiting block;

[0027] In the second state, the second positioning block abuts against the second limiting block.

[0028] Based on the above technical solutions, preferably, the grasping assembly includes a sliding mechanism, a steering mechanism and a suction cup mechanism; the sliding mechanism is installed on the frame and is connected to the steering mechanism for driving the steering mechanism to move in the vertical direction; the suction cup mechanism is connected to the steering mechanism for sucking the circuit board and transferring it to the conveying and heating assembly, and for converting between a horizontal state and a vertical state under the drive of the steering mechanism.

[0029] Based on the above technical solutions, preferably, the sorting assembly includes a vibrating bowl, a lead screw sliding table module, a mechanical claw and a plurality of recycling bins; the vibrating bowl is located below the heating table for receiving the electronic components scattered after the circuit board is heated; the lead screw sliding table module is installed on the frame and is connected to the mechanical claw for driving the mechanical claw to move along the X-axis and the Y-axis; the mechanical claw is used for grasping the electronic components and placing them into different recycling bins according to the categories, and the mechanical claw can move in the Z-axis direction; the plurality of recycling bins are installed on the frame and are located on the side of the vibrating bowl.

[0030] Based on the above technical solutions, preferably, the lead screw slide module includes an X-axis slide and a Y-axis slide. The X-axis slide includes four first shaft seats, two first optical axes, two first linear bearings, and a first connecting rod. The four first shaft seats are installed on the frame in a rectangular array. The two ends of the first optical axis are respectively installed in two of the first shaft seats. The first linear bearings are installed on the first optical axis. The two ends of the first connecting rod are respectively connected to the two first linear bearings. The Y-axis slide includes four second shaft seats, two second optical axes, two second linear bearings, a double linear bearing, and a second connecting rod. The four second shaft seats are installed on the frame in a rectangular array. The two ends of the second optical axis are respectively installed in two of the second shaft seats. The second linear bearings are installed on the second optical axis. The two ends of the second connecting rod are respectively connected to the two second linear bearings. The double linear bearing is connected to both the first connecting rod and the second connecting rod, and the mechanical claw is connected to the double linear bearing.

[0031] In a second aspect, the present invention provides a method for disassembling, recycling, and classifying electronic components of waste PCB boards, using the device for disassembling, recycling, and classifying electronic components of waste PCB boards described in the first aspect, including:

[0032] Step S1: The controller controls the clamping unit to clamp the circuit board. The controller determines whether the back of the circuit board is facing up according to the first image information. If it is determined that the back of the circuit board is facing up, steps S2 - S3 are executed; if it is determined that the back of the circuit board is facing down, steps S4 - S5 are executed;

[0033] Step S2: The controller controls the third guide plate to slide so that the two ends of the third chute are respectively docked with the first chute and the second chute, and the clamping unit slides along the first chute, the third chute, and the second chute in sequence;

[0034] Step S3: After the heating table heats and decomposes various electronic components on the circuit board, the controller classifies various electronic components according to the second image information, and controls the classification component to place various components separately according to their categories;

[0035] Step S4: The controller controls the third guide plate to slide so that the two ends of the fourth chute are respectively docked with the first chute and the second chute, and the clamping unit slides along the first chute, the fourth chute, and the second chute in sequence, turning the circuit board 180 degrees so that its back faces the heating table;

[0036] Step S5: After the heating table heats and decomposes various electronic components on the circuit board, the controller classifies various electronic components according to the second image information, and controls the classification component to place various components separately according to their categories.

[0037] The electronic component disassembly, recycling and classification device and method for waste PCB boards of the present invention have the following beneficial effects compared with the prior art:

[0038] (1) When the back side of the circuit board faces up, the controller controls the third guide plate to slide to both ends of the third chute to be respectively docked with the first chute and the second chute; when the back side of the circuit board faces down, the controller controls the third guide plate to slide to both ends of the fourth chute to be respectively docked with the first chute and the second chute, and the circuit board is flipped 180 degrees through the fourth chute; through the above structure, no matter whether the back side of the circuit board faces up or down, finally the back side of the circuit board can face the heating table, realizing unmanned operation in the whole disassembly process, reducing the harm of harmful gases to the human body, and not violently damaging the circuit board, and can also improve the efficiency of disassembly and recycling;

[0039] (2) The first slider is slidably installed on the linear guide rail, the rotating shaft is rotatably installed on the first slider, one end of the rotating shaft is connected with the clamping jaw, and the other end of the rotating shaft is connected with the connecting plate; the sliding shaft is slidably installed in the sliding track and is connected with the connecting plate; the above structure forms a crank first slider structure. During the process of the sliding shaft sliding in the sliding track, the rotating shaft can rotate or not rotate, so as to realize the choice of flipping the circuit board 180 degrees or not, ensuring that no matter whether the back side of the circuit board faces up or down, finally the back side of the circuit board can face the heating table;

[0040] (3) The first chute includes a first horizontal groove, a first inclined groove and a second horizontal groove. Both ends of the first inclined groove are respectively connected with the first horizontal groove and the second horizontal groove. The second horizontal groove is arranged close to the third guide plate. After the sliding shaft slides to the end of the first chute, it can rotate 90 degrees to switch the circuit board from the vertical state to the horizontal state;

[0041] The fourth chute includes a third horizontal groove, a first arc groove, a fourth horizontal groove, a second arc groove and a fifth horizontal groove; the third horizontal groove is used for docking with the second horizontal groove; the first arc groove includes a first arc section and a second arc section with opposite centers. One end of the first arc section is tangent to the third horizontal groove, and the other end is smoothly connected to the second arc section in a smooth transition. The second arc section is tangent to the fourth horizontal groove; there is a distance between the fourth horizontal groove and the third horizontal groove in the vertical direction; the second arc groove is symmetric to the first arc groove with respect to the vertical center line of the fourth horizontal groove; the fifth horizontal groove is collinear with the third horizontal groove; through the above smooth transition structure, the sliding shaft can slide more smoothly in the fourth chute, improving the reliability of the device;

[0042] (4) One end of the first positioning pin is connected to the third guide plate, and the other end is slidably arranged in the first positioning groove; one end of the second positioning pin is connected to the third guide plate, and the other end is slidably arranged in the second positioning groove; in the first state, the first positioning pin is inserted into the first positioning hole to achieve locking and position it, which can facilitate the two ends of the third chute to be respectively docked with the first chute and the second chute; in the second state, the second positioning pin is inserted into the second positioning hole to achieve locking, which is convenient for the two ends of the fourth chute to be respectively docked with the first chute and the second chute; through the above structure, the positioning accuracy can be improved, alignment is facilitated, and the reliability and stability of the device are improved;

[0043] (5) In the first state, the first positioning block abuts against the first limiting block to limit the third guide plate from sliding down further; in the second state, the second positioning block abuts against the second limiting block to limit the third guide plate from sliding up further; through the above structure for limiting, the reliability and stability of the device can be further improved. Description of the Drawings

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0045] Figure 1 Is a three-dimensional view of the waste PCB board electronic component disassembly, recycling and classification device in the embodiment of the present invention;

[0046] Figure 2 Is a side view of the waste PCB board electronic component disassembly, recycling and classification device in the embodiment of the present invention;

[0047] Figure 3 Is a three-dimensional view of the grasping component in the embodiment of the present invention;

[0048] Figure 4 Is a three-dimensional view of the conveying and heating component in the embodiment of the present invention;

[0049] Figure 5 Is a three-dimensional Figure 1 ;

[0050] Figure 6 Is a three-dimensional Figure 2 ;

[0051] Figure 7Isometric view of the first guide plate in the embodiment of the present invention;

[0052] Figure 8 Isometric view of the third guide plate and the parts mounted thereon in the embodiment of the present invention;

[0053] Figure 9 Isometric view of the third guide plate in the embodiment of the present invention;

[0054] Figure 10 Isometric view of the second guide plate in the embodiment of the present invention;

[0055] Figure 11 Isometric view of the bottom plate in the embodiment of the present invention;

[0056] Figure 12 Isometric view of the clamping unit in the embodiment of the present invention;

[0057] Figure 13 Isometric view of the sorting component in the embodiment of the present invention.

[0058] Explanation of reference numerals: 1 - frame, 2 - grasping component, 3 - conveying and heating component, 4 - sorting component;

[0059] 100 - conveyor belt;

[0060] 11 - linear guide rail;

[0061] 21 - sliding mechanism, 211 - lead screw slider, 212 - steering arm, 213 - lead screw, 214 - drive shaft, 215 - limit base, 22 - steering mechanism, 23 - suction cup mechanism;

[0062] 31 - chute unit, 301 - sliding track, 311 - first guide plate, 3111 - first chute, 31111 - first horizontal groove, 31112 - first inclined groove, 31113 - second horizontal groove, 312 - second guide plate, 3121 - second chute; 313 - third guide plate, 3131 - third chute, 3132 - fourth chute, 31321 - third horizontal groove, 31322 - first arc groove, 31323 - fourth horizontal groove, 31324 - second arc groove, 31325 - fifth horizontal groove, 3133 - second slider, 314 - bottom plate, 3141 - vertical guide rail, 3142 - first positioning groove, 3143 - second positioning groove, 3144 - first positioning hole, 3145 - second positioning hole; 315 - first motor;

[0063] 32 - clamping unit, 321 - clamping jaw, 322 - first slider, 323 - sliding shaft, 324 - rotating shaft, 325 - connecting plate;

[0064] 33 - heating table;

[0065] 34 - Positioning unit, 341 - First positioning pin, 3411 - First pin head, 3412 - First pin shaft, 342 - Second positioning pin, 3421 - Second pin head, 3422 - Second pin shaft, 343 - First spring, 344 - Second spring;

[0066] 35 - Limiting unit, 351 - First positioning block, 352 - Second positioning block, 353 - First limiting block, 354 - Second limiting block;

[0067] 41 - Vibration bowl, 42 - Lead screw slide module, 421 - X - axis slide, 4211 - First shaft seat, 4212 - First optical axis, 4213 - First linear bearing, 4214 - First connecting rod, 422 - Y - axis slide, 4221 - Second shaft seat, 4222 - Second optical axis, 4223 - Second linear bearing, 4224 - Double linear bearing, 4225 - Second connecting rod, 43 - Mechanical claw, 44 - Recycling bin. Specific embodiments

[0068] Next, in combination with the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0069] Referring to Figures 1 - 13 As shown, in the first - aspect embodiment of the present invention, a disassembling, recycling and sorting device for electronic components of waste PCB boards is proposed, including a frame 1, a grasping component 2, a conveying and heating component 3, a first vision component, a second vision component, a sorting component 4 and a controller, wherein:

[0070] The grasping component 2 is installed on the frame 1 and is used to grasp the circuit board and transfer it to the conveying and heating component 3; the circuit board can be conveyed by a conveyor belt 100, and the grasping component 2 grasps the circuit board from the conveyor belt 100;

[0071] The first vision component is installed on the frame 1 and is located above the grasping component 2, and is used to identify the first image information of the circuit board;

[0072] The transfer heating component 3 includes a chute unit 31, a clamping unit 32, and a heating table 33; the chute unit 31 is provided with a sliding track 301, and the chute unit 31 includes a first guide plate 311, a second guide plate 312, and a third guide plate 313 located in the same vertical plane. The first guide plate 311 is fixed to the frame 1 and is provided with a first chute 3111; the second guide plate 312 is fixed to the frame 1 and is horizontally provided with a second chute 3121; the third guide plate 313 is provided with a third chute 3131 and a fourth chute 3132. The third chute 3131 is above the fourth chute 3132. The third chute 3131 is a horizontally arranged straight chute, and the fourth chute 3132 can flip the circuit board 180 degrees; the third guide plate 313 is slidably mounted on the frame 1 in the vertical direction; the clamping unit 32 is slidably connected to the sliding track 301 and is used to make the back of the circuit board face the heating table 33 and convey the circuit board below the heating table 33; the heating table 33 is used to heat and decompose various electronic components on the circuit board and supply them to the sorting component 4;

[0073] The second vision component is mounted on the frame 1 and is located above the sorting component 4, and is used to collect the second image information of the electronic components;

[0074] The sorting component 4 is mounted on the frame 1 and is used to classify various electronic components according to the second image information;

[0075] The controller is electrically connected to the transfer heating component 3, the first vision component, the second vision component, and the sorting component 4 respectively. The controller is used to judge whether the back of the circuit board is facing up according to the first image information, so as to control the third guide plate 313 to have the following two states:

[0076] When it is judged that the back of the circuit board is facing up, the controller controls the third guide plate 313 to slide until the two ends of the third chute 3131 are respectively docked with the first chute 3111 and the second chute 3121. The first chute 3111, the second chute 3121, and the third chute 3131 form the sliding track 301. At this time, it is in the first state;

[0077] When it is judged that the back of the circuit board is facing down, the controller controls the third guide plate 313 to slide until the two ends of the fourth chute 3132 are respectively docked with the first chute 3111 and the second chute 3121. The first chute 3111, the second chute 3121, and the fourth chute 3132 form the sliding track 301. At this time, it is in the second state.

[0078] For the electronic component disassembling, recycling and sorting device for waste PCB boards proposed in this embodiment, when the back of the circuit board faces upward, the controller controls the third guide plate 313 to slide until both ends of the third chute 3131 are respectively docked with the first chute 3111 and the second chute 3121; when the back of the circuit board faces downward, the controller controls the third guide plate 313 to slide until both ends of the fourth chute 3132 are respectively docked with the first chute 3111 and the second chute 3121, and the circuit board is flipped 180 degrees through the fourth chute 3132; through the above structure, regardless of whether the back of the circuit board faces upward or downward, finally the back of the circuit board can face the heating table 33, realizing unmanned operation in the whole disassembly process, reducing the harm of harmful gases to the human body, and not violently damaging the circuit board, and also improving the efficiency of disassembly and recycling.

[0079] In some embodiments, the conveying and heating assembly 3 further includes a linear guide rail 11 installed on the frame 1; the clamping unit 32 includes a clamping jaw 321, a first slider 322, a sliding shaft 323, a rotating shaft 324 and a connecting plate 325. The clamping jaw 321 is used to receive and clamp the circuit board sent by the grasping assembly 2. The first slider 322 is slidably installed on the linear guide rail 11. The rotating shaft 324 is rotatably installed on the first slider 322. One end of the rotating shaft 324 is connected to the clamping jaw 321, and the other end of the rotating shaft 324 is connected to the connecting plate 325. The sliding shaft 323 is slidably installed in the sliding track 301 and is connected to the connecting plate 325, and is used to make the back of the circuit board face the heating table 33 and convey the circuit board below the heating table 33. By the first slider 322 being slidably installed on the linear guide rail 11, the rotating shaft 324 being rotatably installed on the first slider 322, one end of the rotating shaft 324 being connected to the clamping jaw 321, and the other end of the rotating shaft 324 being connected to the connecting plate 325; the sliding shaft 323 being slidably installed in the sliding track 301 and being connected to the connecting plate 325; the above structure forms a crank and first slider 322 structure. During the process of the sliding shaft 323 sliding in the sliding track 301, the rotating shaft 324 can rotate or not rotate, so as to realize the choice of flipping the circuit board 180 degrees or not, ensuring that regardless of whether the back of the circuit board faces upward or downward, finally the back of the circuit board can face the heating table 33.

[0080] In some embodiments, the first sliding groove 3111 includes a first horizontal groove 31111, a first inclined groove 31112, and a second horizontal groove 31113. The two ends of the first inclined groove 31112 are respectively connected to the first horizontal groove 31111 and the second horizontal groove 31113, and the second horizontal groove 31113 is disposed close to the third guide plate 313. After the sliding shaft 323 slides to the end in the first sliding groove 3111, it can rotate 90 degrees to switch the circuit board from a vertical state to a horizontal state. When the circuit board is in the vertical state, it is convenient to dock with the clamping jaw 321. After rotating to the horizontal state, it is convenient to be conveyed under the heating table 33 for heating.

[0081] The fourth sliding groove 3132 includes a third horizontal groove 31321, a first arc groove 31322, a fourth horizontal groove 31323, a second arc groove 31324, and a fifth horizontal groove 31325. The third horizontal groove 31321 is used to dock with the second horizontal groove 31113. The first arc groove 31322 includes a first arc segment and a second arc segment with opposite centers. One end of the first arc segment is tangent to the third horizontal groove 31321, and the other end is smoothly and transitionally connected to the second arc segment. The second arc segment is tangent to the fourth horizontal groove 31323. The fourth horizontal groove 31323 and the third horizontal groove 31321 are spaced apart in the vertical direction. The second arc groove 31324 is mirror-symmetrical to the first arc groove 31322 with respect to the vertical center line of the fourth horizontal groove 31323. The fifth horizontal groove 31325 is collinear with the third horizontal groove 31321. Through the arrangement of the first arc groove 31322 and the second arc groove 31324, a smooth transition is made between the third horizontal groove 31321 and the fourth horizontal groove 31323, and between the fourth horizontal groove 31323 and the fifth horizontal groove 31325, so that the sliding shaft 323 can slide more smoothly in the fourth sliding groove 3132, avoiding jamming at the transition position and improving the reliability of the device.

[0082] In some embodiments, the chute unit 31 further includes a bottom plate 314 which is mounted on the frame 1. The third guide plate 313 is slidably mounted on the bottom plate 314. A vertical guide rail 3141 is provided on the bottom plate 314. The third guide plate 313 is provided with a second slider 3133 which is slidably mounted on the vertical guide rail 3141. The second slider 3133 can be driven to move by the first motor 315 through a tendon cord. The bottom plate 314 is provided with a first positioning groove 3142 and a second positioning groove 3143 in the vertical direction. The first positioning groove 3142 extends downward from the top surface of the bottom plate 314 and a first positioning hole 3144 is provided at the bottom of the first positioning groove 3142. The second positioning groove 3143 extends upward from the bottom surface of the bottom plate 314 and a second positioning hole 3145 is provided at the bottom of the second positioning groove 3143. The transfer heating assembly 3 further includes a positioning unit 34 which includes a first positioning pin 341 and a second positioning pin 342. One end of the first positioning pin 341 is connected to the third guide plate 313 and the other end is slidably disposed in the first positioning groove 3142. One end of the second positioning pin 342 is connected to the third guide plate 313 and the other end is slidably disposed in the second positioning groove 3143.

[0083] In the first state, the first positioning pin 341 is inserted into the first positioning hole 3144 to achieve locking and position it, which can facilitate the docking of the two ends of the third chute 3131 with the first chute 3111 and the second chute 3121 respectively. In the second state, the second positioning pin 342 is inserted into the second positioning hole 3145 to achieve locking, which is convenient for the two ends of the fourth chute 3132 to be respectively docked with the first chute 3111 and the second chute 3121. Through the above structure, the positioning accuracy can be improved, alignment is facilitated, and the reliability and stability of the device can be improved.

[0084] In some embodiments, the first positioning pin 341 includes a first pin head 3411 and a first pin shaft 3412, the top surface of the first pin head 3411 is an inclined surface, and the bottom surface is a plane, the first pin shaft 3412 is connected to the side of the first pin head 3411 and is slidably installed on the third guide plate 313; the second positioning pin 342 includes a second pin head 3421 and a second pin shaft 3422, the bottom surface of the second pin head 3421 is an inclined surface, and the top surface is a plane, the second pin shaft 3422 is connected to the second pin head 34 21 is connected to the side and slidably installed on the third guide plate 313; the positioning unit 34 also includes a first spring 343 sleeved on the first pin shaft 3412 and a second spring 344 sleeved on the second pin shaft 3422, one end of the first spring 343 is connected to the head of the first positioning pin 341, and the other end abuts on the third guide plate 313; one end of the second spring 344 is connected to the head of the second positioning pin 342, and the other end abuts on the third guide plate 313. Because the top surface of the first pin head 3411 is an inclined surface and the bottom surface is a plane, after the first pin head 3411 is inserted into the first positioning hole 3144, the bottom surface of the first pin head 3411 contacts the bottom surface of the first positioning hole 3144, limiting the first positioning pin 341 from continuing to slide downward along the first positioning groove 3142, and when the third guide plate 313 slides upward, the top surface of the first pin head 3411 is an inclined surface, so that the first pin head 3411 can slide upward out of the first positioning hole 3144; the principle of the second positioning pin 342 is the same as the first positioning pin 341. Through the above structure, while ensuring that it can be positioned, it can be smoothly disengaged when it is out of the positioning position.

[0085] In some embodiments, the conveying heating assembly 3 also includes a limiting unit 35, and the limiting unit 35 includes a first positioning block 351 and a second positioning block 352 installed on the second guide plate 312, and the first positioning block 351 is located above the second positioning block 352, and a first limiting block 353 and a second limiting block 354 installed on the third guide plate 313, and the first limiting block 353 is located above the second limiting block 354; in the first state, the first positioning block 351 abuts against the first limiting block 353, and the upper surface of the first positioning block 351 is in contact with the lower surface of the first limiting block 353; in the second state, the second positioning block 352 abuts against the second limiting block 354, and the lower surface of the second positioning block 352 is in contact with the lower surface of the second limiting block 354. In the first state, the first positioning block 351 abuts against the first limiting block 353 to limit the third guide plate 313 from continuing to slide down; in the second state, the second positioning block 352 abuts against the second limiting block 354 to limit the third guide plate 313 from continuing to slide up; the above structure is used to limit the position, which can further improve the reliability and stability of the device.

[0086] In some embodiments, in order to improve the heating decomposition efficiency, two sets of the conveying and heating assembly 3 (excluding the heating table 33) may be provided. By conveying two circuit boards to the lower side of the heating table 33 and heating them, the heating decomposition efficiency can be improved, thereby improving the recovery efficiency.

[0087] In some embodiments, the grasping assembly 2 includes a sliding mechanism 21, a steering mechanism 22, and a suction cup mechanism 23; the sliding mechanism 21 is installed on the frame 1 and connected to the steering mechanism 22 for driving the steering mechanism 22 to move in the vertical direction; the suction cup mechanism 23 is connected to the steering mechanism 22 for sucking the circuit board and transferring it to the conveying and heating assembly 3, and for converting between the horizontal state and the vertical state under the drive of the steering mechanism 22. The sliding mechanism 21 includes a lead screw slider 211. One end of the steering mechanism 22 is connected to the steering arm 212 of the lead screw slider 211. The lead screw slider 211 is provided with a lead screw 213 and a drive shaft 214 through holes. A limit base 215 is installed at the lower end of the lead screw 213 to limit the sliding of the lead screw slider 211. The rotation of the lead screw 213 drives the lead screw slider 211 to move up and down, and the rotation of the steering arm 212 drives the rotation of the steering mechanism 22. The suction cup mechanism 23 can be converted between the horizontal state and the vertical state depending on the steering mechanism 22.

[0088] In some embodiments, the sorting assembly 4 includes a vibrating disk 41, a lead screw sliding table module 42, a mechanical claw 43, and a plurality of recycling bins 44; the vibrating disk 41 is located below the heating table 33 for receiving the electronic components scattered after the circuit board is heated; the lead screw sliding table module 42 is installed on the frame 1 and connected to the mechanical claw 43 for driving the mechanical claw 43 to move along the X-axis and the Y-axis; the mechanical claw 43 is used for grasping the electronic components and placing them into different recycling bins 44 according to the categories, and the mechanical claw 43 can move along the Z-axis direction; the plurality of recycling bins 44 are installed on the frame 1 and located on the side of the vibrating disk 41.

[0089] In some embodiments, the lead screw slide module 42 includes an X-axis slide 421 and a Y-axis slide 422. The X-axis slide 421 includes four first shaft seats 4211, two first optical shafts 4212, two first linear bearings 4213, and a first connecting rod 4214. The four first shaft seats 4211 are mounted on the frame 1 in a rectangular array. The two ends of the first optical shaft 4212 are respectively mounted in two of the first shaft seats 4211. The first linear bearing 4213 is mounted on the first optical shaft 4212. The two ends of the first connecting rod 4214 are respectively connected to the two first linear bearings 4213. The Y-axis slide 422 includes four second shaft seats 4221, two second optical shafts 4222, two second linear bearings 4223, a double linear bearing 4224, and a second connecting rod 4225. The four second shaft seats 4221 are mounted on the frame 1 in a rectangular array. The two ends of the second optical shaft 4222 are respectively mounted in two of the second shaft seats 4221. The second linear bearing 4223 is mounted on the second optical shaft 4222. The two ends of the second connecting rod 4225 are respectively connected to the two second linear bearings 4223. The double linear bearing 4224 is connected to both the first connecting rod 4214 and the second connecting rod 4225, and the mechanical claw 43 is connected to the double linear bearing 4224. The vibrating disk 41 receives the electronic components dropped from above. Through visual recognition, the lead screw slide module 42 and the mechanical claw 43 cooperate to achieve three-dimensional movement in the X, Y, and Z directions, pick up the electronic components, and classify and place them into the respective recycling bins 44.

[0090] In a second aspect embodiment of the present invention, a method for disassembling, recycling, and classifying electronic components of waste PCB boards is provided. Using the waste PCB board electronic component disassembling, recycling, and classifying device described in the first aspect, it includes:

[0091] Step S1: The controller controls the clamping unit 32 to clamp the circuit board. The controller determines whether the back of the circuit board is facing up according to the first image information. If it is determined that the back of the circuit board is facing up, steps S2 - S3 are executed; if it is determined that the back of the circuit board is facing down, steps S4 - S5 are executed;

[0092] Step S2: The controller controls the third guide plate 313 to slide until the two ends of the third chute 3131 are respectively butted against the first chute 3111 and the second chute 3121, and the clamping unit 32 slides along the first chute 3111, the third chute 3131, and the second chute 3121 in sequence;

[0093] Step S3: After the heating table 33 heats and decomposes various electronic components on the circuit board, the controller classifies the various electronic components according to the second image information, and controls the classification component 4 to place the various components separately according to the categories;

[0094] Step S4: The controller controls the third guide plate 313 to slide until both ends of the fourth chute 3132 are respectively docked with the first chute 3111 and the second chute 3121. The clamping unit 32 slides successively along the first chute 3111, the fourth chute 3132, and the second chute 3121 to turn the circuit board by 180 degrees so that its back faces the heating table 33.

[0095] Step S5: After the heating table 33 heats and decomposes various electronic components on the circuit board, the controller classifies the various electronic components according to the second image information, and controls the classification component 4 to place the various components separately according to their categories.

[0096] For the method for disassembling, recycling, and classifying electronic components of waste PCB boards provided by the embodiments of the present invention, regardless of whether the back of the circuit board faces up or down, the back of the circuit board can finally face the heating table 33, realizing unmanned operation throughout the disassembly process, reducing the harm of harmful gases to the human body, and not violently damaging the circuit board, and can also improve the efficiency of disassembly and recycling.

[0097] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A device for disassembling, recycling and classifying electronic components of waste PCB boards, characterized in that, It includes a frame, a grasping component, a conveying and heating component, a first vision component, a second vision component, a sorting component and a controller, where: The grasping component is installed on the frame and is used to grasp the circuit board and transfer it to the conveying and heating component; The first vision component is installed on the frame and above the grasping component and is used to identify the first image information of the circuit board; The conveying and heating component includes a chute unit, a clamping unit and a heating table; the chute unit sets a sliding track. The chute unit includes a first guide plate, a second guide plate and a third guide plate in the same vertical plane. The first guide plate is fixed on the frame and is provided with a first chute; the second guide plate is fixed on the frame and is horizontally provided with a second chute; the third guide plate is provided with a third chute and a fourth chute. The third chute is a horizontally arranged linear chute, and the fourth chute can flip the circuit board 180 degrees; the third guide plate is slidably installed on the frame in the vertical direction; the clamping unit is slidably connected to the sliding track and is used to make the back of the circuit board face the heating table and convey the circuit board below the heating table; the heating table is used to heat and decompose various electronic components on the circuit board and supply them to the sorting component; The second vision component is installed on the frame and above the sorting component and is used to collect the second image information of the electronic components; The sorting component is installed on the frame and is used to classify various electronic components according to the second image information; The controller is electrically connected to the conveying and heating component, the first vision component, the second vision component and the sorting component respectively. The controller is used to judge whether the back of the circuit board is facing up according to the first image information, so as to control the third guide plate to have the following two states: When it is judged that the back of the circuit board is facing up, the controller controls the third guide plate to slide until the two ends of the third chute are respectively docked with the first chute and the second chute. The first chute, the second chute and the third chute form the sliding track, and at this time it is in the first state; When it is judged that the back of the circuit board is facing down, the controller controls the third guide plate to slide until the two ends of the fourth chute are respectively docked with the first chute and the second chute. The first chute, the second chute and the fourth chute form the sliding track, and at this time it is in the second state.

2. The device for disassembling, recycling and classifying electronic components of waste PCB boards according to claim 1, wherein The conveying and heating component further includes a linear guide rail installed on the frame; The clamping unit includes a clamping jaw, a first slider, a sliding shaft, a rotating shaft and a connecting plate. The clamping jaw is used to receive and clamp the circuit board sent by the grasping component. The first slider is slidably installed on the linear guide rail. The rotating shaft is rotatably installed on the first slider. One end of the rotating shaft is connected to the clamping jaw, and the other end of the rotating shaft is connected to the connecting plate; the sliding shaft is slidably installed in the sliding track and is connected to the connecting plate and is used to make the back of the circuit board face the heating table and convey the circuit board below the heating table.

3. The waste PCB board electronic component disassembly, recycling and sorting device according to claim 1, characterized in that, The first chute includes a first horizontal groove, a first inclined groove, and a second horizontal groove. The two ends of the first inclined groove are respectively connected to the first horizontal groove and the second horizontal groove, and the second horizontal groove is arranged close to the third guide plate. The fourth chute includes a third horizontal groove, a first arc groove, a fourth horizontal groove, a second arc groove, and a fifth horizontal groove. The third horizontal groove is used to dock with the second horizontal groove. The first arc groove includes a first arc section and a second arc section with opposite centers. One end of the first arc section is tangent to the third horizontal groove, and the other end is smoothly connected to the second arc section by a smooth transition. The second arc section is tangent to the fourth horizontal groove. There is a distance between the fourth horizontal groove and the third horizontal groove in the vertical direction. The second arc groove is mirror-symmetrical to the first arc groove about the vertical center line of the fourth horizontal groove. The fifth horizontal groove is collinear with the third horizontal groove.

4. The electronic component disassembling, recycling and sorting device for waste PCB boards according to claim 3, characterized in that, The chute unit further includes a bottom plate, which is installed on the frame. The third guide plate is slidably installed on the bottom plate. The bottom plate is provided with a first positioning groove and a second positioning groove in the vertical direction. The first positioning groove extends downward from the top surface of the bottom plate, and a first positioning hole is provided at the bottom of the first positioning groove. The second positioning groove extends upward from the bottom surface of the bottom plate, and a second positioning hole is provided at the bottom of the second positioning groove. The conveying and heating assembly further includes a positioning unit, which includes a first positioning pin and a second positioning pin. One end of the first positioning pin is connected to the third guide plate, and the other end is slidably arranged in the first positioning groove. One end of the second positioning pin is connected to the third guide plate, and the other end is slidably arranged in the second positioning groove. In the first state, the first positioning pin is inserted into the first positioning hole to achieve locking. In the second state, the second positioning pin is inserted into the second positioning hole to achieve locking.

5. The electronic component disassembly, recycling and classification device for waste PCB boards according to claim 4, characterized in that, The first positioning pin includes a first pin head and a first pin shaft. The top surface of the first pin head is an inclined surface and the bottom surface is a flat surface. The first pin shaft is connected to the side surface of the first pin head and is slidably installed on the third guide plate. The second positioning pin includes a second pin head and a second pin shaft. The bottom surface of the second pin head is an inclined surface and the top surface is a flat surface. The second pin shaft is connected to the side surface of the second pin head and is slidably installed on the third guide plate. The positioning unit further includes a first spring sleeved on the first pin shaft and a second spring sleeved on the second pin shaft. One end of the first spring is connected to the head of the first positioning pin, and the other end abuts against the third guide plate. One end of the second spring is connected to the head of the second positioning pin, and the other end abuts against the third guide plate.

6. The electronic component disassembling, recycling and sorting device for waste PCB boards according to claim 5, wherein, The conveying and heating assembly further includes a limiting unit, which includes a first positioning block and a second positioning block installed on the second guide plate, and a first limiting block and a second limiting block installed on the third guide plate. In the first state, the first positioning block abuts against the first limiting block. In the second state, the second positioning block abuts against the second limiting block.

7. The electronic component disassembly, recycling and classification device for waste PCB boards according to claim 1, wherein, The grasping component includes a sliding mechanism, a steering mechanism, and a suction cup mechanism; the sliding mechanism is installed on the frame and connected to the steering mechanism, and is used to drive the steering mechanism to move in the vertical direction; the suction cup mechanism is connected to the steering mechanism, and is used to suck the circuit board and transfer it to the conveying and heating component, and is used to switch between the horizontal state and the vertical state under the drive of the steering mechanism.

8. The electronic component disassembly, recycling and classification device for waste PCB boards according to claim 1, wherein, The sorting component includes a vibrating bowl, a lead screw slide table module, a mechanical claw, and a plurality of recycling bins; the vibrating bowl is located below the heating table and is used to receive the electronic components scattered after the circuit board is heated; the lead screw slide table module is installed on the frame and connected to the mechanical claw, and is used to drive the mechanical claw to move along the X-axis and Y-axis; the mechanical claw is used to grasp the electronic components and place them in different recycling bins according to the category, and the mechanical claw can move along the Z-axis direction; the plurality of recycling bins are installed on the frame and are located on the side of the vibrating bowl.

9. The electronic component disassembly, recycling and sorting device for waste PCB boards according to claim 8, wherein, The lead screw slide table module includes an X-axis slide table and a Y-axis slide table. The X-axis slide table includes four first shaft seats, two first optical axes, two first linear bearings, and a first connecting rod. The four first shaft seats are installed on the frame in a rectangular array. The two ends of the first optical axis are respectively installed in two of the first shaft seats. The first linear bearings are installed on the first optical axis. The two ends of the first connecting rod are respectively connected to the two first linear bearings. The Y-axis slide table includes four second shaft seats, two second optical axes, two second linear bearings, a double linear bearing, and a second connecting rod. The four second shaft seats are installed on the frame in a rectangular array. The two ends of the second optical axis are respectively installed in two of the second shaft seats. The second linear bearings are installed on the second optical axis. The two ends of the second connecting rod are respectively connected to the two second linear bearings. The double linear bearing is connected to both the first connecting rod and the second connecting rod, and the mechanical claw is connected to the double linear bearing.

10. A method for disassembling, recycling and classifying electronic components of waste PCB boards, using the waste PCB board electronic component disassembling, recycling and classifying device described in any one of claims 1-9, characterized in that, Including: Step S1: The controller controls the clamping unit to clamp the circuit board. The controller judges whether the back of the circuit board is facing up according to the first image information. If it is judged that the back of the circuit board is facing up, steps S2-S3 are executed; if it is judged that the back of the circuit board is facing down, steps S4-S5 are executed. Step S2: The controller controls the third guide plate to slide to both ends of the third chute to be respectively docked with the first chute and the second chute, and the clamping unit slides along the first chute, the third chute, and the second chute in sequence. Step S3: After the heating table heats and decomposes various electronic components on the circuit board, the controller classifies various electronic components according to the second image information, and controls the sorting component to place various components separately according to the category. Step S4: The controller controls the third guide plate to slide to both ends of the fourth chute to be respectively docked with the first chute and the second chute, and the clamping unit slides along the first chute, the fourth chute, and the second chute in sequence to turn the circuit board 180 degrees so that its back faces the heating table. Step S5: After the heating stage heats and decomposes various electronic components on the circuit board, the controller classifies the various electronic components according to the second image information, and controls the sorting component to place the various components separately according to their categories.

Images