Splicing type brittle target material and welding method thereof

Abstract

The invention provides a splicing type brittle target material and a welding method thereof, and the welding method comprises the following steps: (1) placing at least three brittle target blanks at intervals, then filling the splicing parts with spacing pieces, and then fixing the side surfaces of the brittle target blanks to form a splicing type target blank; winding the outer surface of the spacing piece by adopting a sealing adhesive tape; (2) a back plate and the spliced target blank in the step (1) are preheated, then the welding faces of the back plate and the spliced target blank are subjected to first infiltration and second infiltration in sequence, then the back plate and the spliced target blank are buckled, and a target material to be welded is obtained; and (3) the target material to be welded in the step (2) is subjected to pressure welding, then the spacer and the sealing adhesive tape are removed, and the spliced brittle target material is obtained. According to the method, the size of the splicing seam between the target blanks is controlled through the spacing pieces, the sealing adhesive tape is adopted to wind the outer surfaces of the spacing pieces to seal the splicing seam, welding flux is fundamentally prevented from entering the splicing seam, the flatness of the target material after welding is improved, and then the yield is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of target material welding, and in particular relates to a spliced ​​brittle target material and a welding method thereof. Background Art

[0002] In recent years, with the rapid development of my country's integrated circuit industry, flat-panel displays have largely replaced the computer monitor and television market, which was originally dominated by cathode ray tubes. This will also greatly increase the market demand for thin film targets and target bonding. The sizes of flat-panel displays and conductive glass are quite large, and the width of conductive glass can even reach 3000mm. Therefore, the size of the required sputtering targets is also getting larger and larger. However, large-sized targets are prone to excessive internal stress during welding, resulting in deformation and bending of the targets after cooling, which affects the stability of the subsequent coating process and the quality of the film.

[0003] At present, in the process of target material production, welding is a common way to connect the target blank and the back plate. Among them, brazing is simple to operate and has low cost, making it the first choice for target material welding. When the target material is large in size, the target material will be deformed after welding and cooling due to the large difference in thermal expansion coefficients between the target blank and the back plate, and the internal stress will be too large after brazing, resulting in target material desoldering. Therefore, the large-sized target blank is divided into several small pieces for splicing, and the degree of deformation and internal stress are reduced after welding. During the splicing process, a gap must be left between the target materials. On the one hand, it is to avoid mutual squeezing between the target materials when the deformed back plate is corrected and adjusted after welding, causing the target material to break; on the other hand, it provides space for the thermal expansion of the target material during the coating process. However, the gap should not be too large. If the gap is too large, when the large-sized target obtained by welding is sputtered, high-energy particles will pass through the gap and bombard the surface of the back plate, causing coating contamination; in addition, if the gap is too large, air is likely to remain, making it difficult to evacuate, and the release of residual gas during the coating process will affect the quality of the coating. However, because a gap must be left in the target material during the splicing process, the solder can easily flow into the splicing during the welding process, resulting in a small amount of solder at the splicing, which cannot meet the subsequent use requirements and causes the target material to be scrapped.

[0004] Therefore, providing a new target material welding method to fundamentally solve the problem of solder entering the joint, while ensuring the welding bonding rate of the target material and the flatness after welding, is an issue that technical personnel in this field urgently need to solve. Summary of the invention

[0005] The object of the present invention is to provide a spliced ​​brittle target material and a welding method thereof, wherein the welding method ensures that the welding bonding rate of the spliced ​​target material is ≥99% and the flatness after welding is <0.3mm, and at the same time solves the problems of reduced welding strength after target material welding and solder entering the splicing seam.

[0006] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a welding method for a spliced ​​brittle target material, the welding method comprising the following steps:

[0008] (1) placing at least three brittle target blanks at intervals, then filling the spacers at the joints, and then fixing the sides of the brittle target blanks to form a spliced ​​target blank;

[0009] Using a sealing tape to wrap the outer surface of the spacer;

[0010] (2) preheating the back plate and the spliced ​​target blank described in step (1), and then sequentially performing a first infiltration and a second infiltration on the welding surfaces of the back plate and the spliced ​​target blank, and then buckling the back plate and the spliced ​​target blank to obtain a target material to be welded;

[0011] (3) Pressurize and weld the target material to be welded as described in step (2), and then remove the spacer and the sealing tape to obtain a spliced ​​brittle target material.

[0012] In the present invention, the brittle target blank mainly includes a ceramic target blank or a silicon alloy target blank.

[0013] In the present invention, the spliced ​​target blank and the back plate in step (2) are protected by a heat-resistant protective film in areas other than the welding surface, and then the heat-resistant protective film is removed after pressure welding. In addition, the present invention does not specifically limit the material of the heat-resistant protective film, and those skilled in the art can select it according to actual conditions.

[0014] The welding method provided by the present invention reduces internal stress and reduces the risk of desoldering by splicing multiple target blanks, uses spacers to control the size of the splicing seams between the target blanks, and uses a sealing tape to wrap the outer surface of the spacer to seal the splicing seams, thereby fundamentally avoiding the problem of solder entering the splicing seams, avoiding the scrapping of the target material, and improving the flatness of the target material; then, the first infiltration and the second infiltration are performed on the welding surface of the back plate and the target blank in sequence, and the target material to be welded is obtained after buckling, and then pressurized welding is performed, thereby solving the problem of reduced welding strength after the target material is welded.

[0015] As a preferred technical solution of the present invention, the thickness of the spacer in step (1) is 0.1-0.3 mm, for example, it can be 0.12 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.24 mm, 0.25 mm, 0.26 mm or 0.28 mm, etc., but is not limited to the listed values, and other values ​​not listed within the above numerical range are also applicable.

[0016] Preferably, the spacer in step (1) comprises a silicone sheet.

[0017] In the present invention, the silicone sheet is selected because it has the advantages of high temperature resistance, good toughness, and not easy to break, and is therefore suitable for use as a spacer at the joint of the target blank.

[0018] As a preferred technical solution of the present invention, the thickness of the sealing tape in step (1) is 0.05-0.5 mm, for example, it can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm or 0.45 mm, etc., but is not limited to the listed values. Other values ​​not listed in the above numerical range are also applicable, preferably 0.05-0.1 mm.

[0019] Preferably, the width of the sealing tape in step (1) is ≤25 mm, for example, it can be 5 mm, 7 mm, 9 mm, 10 mm, 12 mm, 15 mm, 17 mm or 20 mm, etc., but is not limited to the listed values, and other values ​​not listed within the above numerical range are also applicable.

[0020] It is worth noting that the present invention uses a sealing tape with appropriate viscosity and thickness as a material for isolating solder, and uses the sealing tape to wrap around the spacer for a week to isolate the gap between the outside and the target blank, thereby fundamentally avoiding the problem of solder entering the joint, avoiding the scrapping of the target material, and improving the flatness of the target material.

[0021] Preferably, the fixing in step (1) is: fixing the side of the brittle target blank with tape or rope.

[0022] In the present invention, the specific material of the tape or rope for fixing the brittle target blank is not limited, as long as it does not melt at high temperature.

[0023] As a preferred technical solution of the present invention, the preheating in step (2) is carried out on a heating table.

[0024] Preferably, the preheating temperature is 190-240°C, for example, it can be 195°C, 200°C, 205°C, 210°C, 215°C, 220°C, 225°C, 230°C or 235°C, but is not limited to the listed values, and other unlisted values ​​within the above numerical range are also applicable.

[0025] In the present invention, in order to prevent the target blank from cracking due to an excessive temperature difference between the target blank and the heating stage, the initial temperature of the heating stage is ensured to be less than 40°C.

[0026] As a preferred technical solution of the present invention, the infiltration liquid used in the first infiltration and the second infiltration in step (2) is indium solder.

[0027] In the present invention, the purity of the indium solder is ≥99.99%.

[0028] Preferably, the indium solder is preheated at 180-220°C before use, for example, it can be 185°C, 190°C, 195°C, 200°C, 205°C, 210°C, 215°C, 220°C, 225°C, 230°C or 235°C, etc., but is not limited to the listed values, and other unlisted values ​​within the above numerical range are also applicable.

[0029] Preferably, the first infiltration and the second infiltration in step (2) are both performed on a heating table, and the heating temperature of the heating table is 190-240°C, for example, it can be 195°C, 200°C, 205°C, 210°C, 215°C, 220°C, 225°C, 230°C or 235°C, etc., but is not limited to the listed values, and other values ​​not listed within the above numerical range are also applicable.

[0030] As a preferred technical solution of the present invention, in step (2), the first infiltration is performed using a steel brush.

[0031] Preferably, in step (2), the second infiltration method is ultrasonic infiltration.

[0032] Preferably, the second infiltration time in step (2) is 25-35 min, for example, it can be 26 min, 27 min, 28 min, 29 min, 30 min, 31 min, 32 min, 33 min or 34 min, etc., but is not limited to the listed values, and other unlisted values ​​within the above numerical range are also applicable.

[0033] In the present invention, during the wetting process of the welding surface, the temperature difference between the target blank and other auxiliary tools needs to be controlled within 30° C. to prevent the target blank from cracking due to excessive temperature difference.

[0034] As a preferred technical solution of the present invention, when performing the pressure welding described in step (3), the heating table is turned off.

[0035] Preferably, the pressurized welding method in step (3) is: a press block is independently placed at the center of each brittle target blank to be welded for pressurized welding.

[0036] Preferably, the weight of the briquette is 8-12 kg, for example, it can be 8.5 kg, 9 kg, 9.5 kg, 10 kg, 10.5 kg, 11 kg or 11.5 kg, etc., but it is not limited to the listed values, and other values ​​not listed in the above numerical range are also applicable.

[0037] In the present invention, after a pressing block is placed at the center of each brittle target blank to be welded, excess solder in the contact surface between the side surface of the back plate and the spliced ​​target blank is scraped off.

[0038] It is worth noting that the weight of the pressing block needs to be controlled within an appropriate range. If the weight of the pressing block on each brittle target blank to be welded is too small, it cannot provide sufficient pressure to ensure that the solder fully flows and fills the weld, which reduces the flatness and welding bonding rate of the spliced ​​brittle target material. If the weight of the pressing block on each brittle target blank to be welded is too large, it is easy to cause deformation of the target material, which reduces the flatness and welding bonding rate of the spliced ​​brittle target material.

[0039] As a preferred technical solution of the present invention, the temperature for removing the spacer and the sealing tape in step (3) is 20-30°C, for example, it can be 21°C, 22°C, 23°C, 24°C, 25°C, 26°C, 27°C, 28°C or 29°C, etc., but is not limited to the listed values, and other values ​​not listed within the above numerical range are also applicable.

[0040] As a preferred technical solution of the present invention, the welding method comprises the following steps:

[0041] (1) Place at least three brittle target blanks at intervals, then fill the joints with a spacer sheet with a thickness of 0.1-0.3 mm, and then fix the sides of the brittle target blanks with tape or rope to form a spliced ​​target blank;

[0042] Using a sealing tape with a thickness of 0.05-0.5 mm and a width of ≤25 mm to wrap the outer surface of the spacer;

[0043] (2) preheating the back plate and the spliced ​​target blank described in step (1) on a heating table at 190-240° C., and then sequentially performing a first infiltration and a second infiltration on the welding surfaces of the back plate and the spliced ​​target blank, and then buckling the back plate and the spliced ​​target blank to obtain a target material to be welded;

[0044] The infiltration liquid used in the first infiltration and the second infiltration is indium solder; the indium solder is preheated at 180-220° C. before use;

[0045] The first infiltration and the second infiltration are both performed on a heating table at 190-240°C;

[0046] The first infiltration is performed using a steel brush; the second infiltration is ultrasonic infiltration for 25-35 minutes;

[0047] (3) Turn off the heating table, and then independently place a pressing block weighing 8-12 kg at the center of each brittle target blank to be welded in step (2) for pressure welding, and then remove the spacer and the sealing tape at 20-30°C to obtain a spliced ​​brittle target.

[0048] In a second aspect, the present invention provides a spliced ​​brittle target material, wherein the spliced ​​brittle target material is made by the welding method described in the first aspect;

[0049] The flatness of the spliced ​​brittle target material is less than 0.3 mm, for example, it can be 0.28 mm, 0.25 mm, 0.22 mm, 0.2 mm, 0.18 mm, 0.15 mm, 0.12 mm or 0.1 mm, etc., but is not limited to the listed values, and other values ​​not listed within the above numerical range are also applicable.

[0050] Compared with the prior art, the present invention has the following beneficial effects:

[0051] (1) The spliced ​​brittle target material and welding method provided by the present invention use a spacer to control the size of the splicing seam between the target blanks, and use a sealing tape to wrap the outer surface of the spacer to seal the splicing seam, thereby fundamentally preventing solder from entering the splicing seam and preventing the target material from being scrapped, thereby improving the flatness of the target material after welding and thereby improving the yield rate;

[0052] (2) The spliced ​​brittle target material and the welding method thereof provided by the present invention have a welding bonding rate of ≥99% and a flatness after welding of <0.3 mm, and at the same time solve the problems of reduced welding strength after target material welding and solder entering the splicing seam. DETAILED DESCRIPTION

[0053] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0054] Example 1

[0055] This embodiment provides a welding method for a spliced ​​brittle target material, the welding method comprising the following steps:

[0056] (1) Place three brittle target blanks at intervals, then fill the joints with a 0.18 mm thick silicone sheet, and then fix the sides of the brittle target blanks with heat-resistant ropes to form a spliced ​​target blank;

[0057] A sealing tape with a thickness of 0.1 mm and a width of 15 mm is used to wrap the outer surface of the silicone sheet in one circle;

[0058] (2) coating the spliced ​​target blank and the oxygen-free copper back plate with a heat-resistant protective film except for the welding surface, and then preheating the oxygen-free copper back plate and the spliced ​​target blank described in step (1) on a heating platform at 200° C., wherein the initial temperature of the heating platform is 30° C.; then performing the first infiltration and the second infiltration on the welding surfaces of the oxygen-free copper back plate and the spliced ​​target blank in sequence, and then buckling the oxygen-free copper back plate with the spliced ​​target blank to obtain a target material to be welded;

[0059] The infiltration liquid used in the first infiltration and the second infiltration is an indium solder with a purity of 99.995%; the indium solder is preheated at 200° C. before use;

[0060] The first infiltration and the second infiltration are both performed on a heating table at 200°C;

[0061] The first infiltration is performed using a steel brush; the second infiltration is ultrasonic infiltration for 30 minutes;

[0062] (3) Turn off the heating table, and then independently place a pressing block weighing 10 kg at the center of each brittle target blank to be welded in step (2) for pressure welding, and then remove the silicone sheet, sealing tape and heat-resistant protective film at 25°C to obtain a spliced ​​brittle target.

[0063] Example 2

[0064] This embodiment provides a welding method for a spliced ​​brittle target material, the welding method comprising the following steps:

[0065] (1) Place five brittle target blanks at intervals, then fill the joints with a 0.25 mm thick silicone sheet, and then fix the sides of the brittle target blanks with tape to form a spliced ​​target blank;

[0066] A sealing tape with a thickness of 0.08 mm and a width of 20 mm is used to wrap the outer surface of the silicone sheet in one circle;

[0067] (2) coating the spliced ​​target blank and the oxygen-free copper back plate with a heat-resistant protective film except for the welding surface, and then preheating the oxygen-free copper back plate and the spliced ​​target blank described in step (1) on a heating platform at 220° C., wherein the initial temperature of the heating platform is 30° C.; then performing the first infiltration and the second infiltration on the welding surfaces of the oxygen-free copper back plate and the spliced ​​target blank in sequence, and then buckling the oxygen-free copper back plate with the spliced ​​target blank to obtain a target material to be welded;

[0068] The infiltration liquid used in the first infiltration and the second infiltration is an indium solder with a purity of 99.99%; the indium solder is preheated at 200° C. before use;

[0069] The first infiltration and the second infiltration were both performed on a heating table at 220°C;

[0070] The first infiltration is performed using a steel brush; the second infiltration is ultrasonic infiltration for 28 minutes;

[0071] (3) Turn off the heating table, and then independently place a pressing block weighing 12 kg at the center of each brittle target blank to be welded in step (2) for pressure welding, and then remove the silicone sheet, sealing tape and heat-resistant protective film at 30°C to obtain a spliced ​​brittle target.

[0072] Example 3

[0073] This embodiment provides a welding method for a spliced ​​brittle target material, the welding method comprising the following steps:

[0074] (1) Place five brittle target blanks at intervals, then fill the joints with a 0.1 mm thick silicone sheet, and then fix the sides of the brittle target blanks with tape to form a spliced ​​target blank;

[0075] A sealing tape with a thickness of 0.05 mm and a width of 10 mm is used to wrap the outer surface of the silicone sheet in one circle;

[0076] (2) coating the spliced ​​target blank and the oxygen-free copper back plate with a heat-resistant protective film except for the welding surface, and then preheating the oxygen-free copper back plate and the spliced ​​target blank described in step (1) on a heating platform at 190° C., wherein the initial temperature of the heating platform is 30° C.; then performing the first infiltration and the second infiltration on the welding surfaces of the oxygen-free copper back plate and the spliced ​​target blank in sequence, and then buckling the oxygen-free copper back plate with the spliced ​​target blank to obtain a target material to be welded;

[0077] The infiltration liquid used in the first infiltration and the second infiltration is an indium solder with a purity of 99.99%; the indium solder is preheated at 190° C. before use;

[0078] The first infiltration and the second infiltration were both performed on a heating table at 190°C;

[0079] The first infiltration is performed using a steel brush; the second infiltration is ultrasonic infiltration for 35 minutes;

[0080] (3) Turn off the heating table, and then independently place a pressing block weighing 8 kg at the center of each brittle target blank to be welded in the target material to be welded in step (2) for pressure welding, and then remove the silicone sheet, sealing tape and heat-resistant protective film at 20°C to obtain a spliced ​​brittle target material.

[0081] Example 4

[0082] This embodiment provides a welding method for a spliced ​​brittle target material. Except that the "silicone sheet" in step (1) is replaced by a "plastic sheet", other conditions are the same as those in Example 1.

[0083] Example 5

[0084] This embodiment provides a welding method for a spliced ​​brittle target material. Except that the temperature of the heating table in step (2) is 170° C., other conditions are the same as those in Example 1.

[0085] Example 6

[0086] This embodiment provides a welding method for a spliced ​​brittle target material. Except that the temperature of the heating table in step (2) is 270° C., other conditions are the same as those in Embodiment 1.

[0087] Comparative Example 1

[0088] This comparative example provides a welding method for a spliced ​​brittle target material. Except that in step (1) the sealing tape is not used to wrap the outer surface of the silicone sheet, other conditions are the same as those in Example 1.

[0089] Comparative Example 2

[0090] This comparative example provides a welding method for a spliced ​​brittle target material. Except that in step (1), the sealing tape is not used to wrap the outer surface of the silicone sheet in one circle, but the sealing tape is used to stick the interface between the upper surface of the brittle target blank and the silicone sheet, other conditions are the same as those in Example 1.

[0091] The spliced ​​brittle target materials obtained in the above-mentioned embodiment and comparative example were tested for flatness and welding bonding rate. The flatness was detected by three coordinates, and the welding bonding rate was detected by an ultrasonic flaw detector. The test results are shown in Table 1.

[0092] Table 1

[0093]

[0094]

[0095] From Table 1 we can draw several conclusions:

[0096] (1) The welding method provided in Examples 1-3 of the present invention has a flatness of less than 0.3 mm and a welding bonding rate of more than 99% for the obtained spliced ​​brittle target material, and solves the problem of reduced welding strength after target material welding and solder entering the splicing seam;

[0097] (2) By comparing Example 1 with Example 4, it can be seen that when a plastic sheet is used to fill the joint seam, although it also helps to maintain the flatness of the target material, its effect is far lower than that of a silicone sheet, which reduces the flatness and welding bonding rate of the jointed brittle target material;

[0098] (3) By comparing Example 1 with Examples 5-6, it can be seen that when the temperature of the heating stage in step (2) is too low, the solder fluidity is insufficient, and it is difficult to fully fill the weld, resulting in a decrease in the flatness and welding bonding rate of the spliced ​​brittle target material; when the temperature of the heating stage in step (2) is too high, the solder flows excessively, which may cause the solder to overflow, resulting in insufficient solder at the weld, and also affecting the precise control of the spliced ​​seam, resulting in a decrease in the flatness and welding bonding rate of the spliced ​​brittle target material;

[0099] (4) By comparing Example 1 with Comparative Examples 1-2, it can be seen that when the sealing tape is not used to wrap around the outer surface of the silicone sheet or the sealing tape is only pasted on the interface between the upper surface of the brittle target blank and the spacer, it fails to isolate the outside from the target blank joint, resulting in solder entering the joint during the welding process, causing the flatness of the spliced ​​brittle target material to decrease.

[0100] The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above-mentioned embodiments, but the present invention is not limited to the above-mentioned detailed structural features, that is, it does not mean that the present invention must rely on the above-mentioned detailed structural features to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of the components selected by the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A welding method for spliced ​​brittle target material, characterized in that: The welding method comprises the following steps: (1) placing at least three brittle target blanks at intervals, then filling the spacers at the joints, and then fixing the sides of the brittle target blanks to form a spliced ​​target blank; Using a sealing tape to wrap the outer surface of the spacer; (2) preheating the back plate and the spliced ​​target blank described in step (1), and then sequentially performing a first infiltration and a second infiltration on the welding surfaces of the back plate and the spliced ​​target blank, and then buckling the back plate and the spliced ​​target blank to obtain a target material to be welded; (3) Pressurize and weld the target material to be welded as described in step (2), and then remove the spacer and the sealing tape to obtain a spliced ​​brittle target material.

2. The welding method according to claim 1, characterized in that: The thickness of the spacer in step (1) is 0.1-0.3 mm; Preferably, the spacer in step (1) comprises a silicone sheet.

3. The welding method according to claim 1 or 2, characterized in that: The thickness of the sealing tape in step (1) is 0.05-0.5 mm, preferably 0.05-0.1 mm; Preferably, the width of the sealing tape in step (1) is ≤25 mm; Preferably, the fixing in step (1) is: fixing the side of the brittle target blank with tape or rope.

4. The welding method according to any one of claims 1 to 3, characterized in that: The preheating in step (2) is performed on a heating table; Preferably, the preheating temperature is 190-240°C.

5. The welding method according to any one of claims 1 to 4, characterized in that: Step (2) The infiltration liquid used in the first infiltration and the second infiltration is indium solder; Preferably, the indium solder is preheated at 180-220° C. before use; Preferably, in step (2), both the first infiltration and the second infiltration are performed on a heating table, and the heating temperature of the heating table is 190-240°C.

6. The welding method according to any one of claims 1 to 5, characterized in that: Step (2) the first infiltration is performed using a steel brush; Preferably, the second infiltration method in step (2) is ultrasonic infiltration; Preferably, the second infiltration time in step (2) is 25-35 minutes.

7. The welding method according to any one of claims 1 to 6, characterized in that: When performing the pressurized welding in step (3), the heating table is turned off; Preferably, the pressurized welding in step (3) is performed by independently placing a pressing block at the center of each brittle target blank to be welded for pressurized welding; Preferably, the weight of the briquette is 8-12 kg.

8. The welding method according to any one of claims 1 to 7, characterized in that: The temperature when removing the spacer and the sealing tape in step (3) is 20-30°C.

9. The welding method according to any one of claims 1 to 8, characterized in that: The welding method comprises the following steps: (1) Place at least three brittle target blanks at intervals, then fill the joints with a spacer sheet with a thickness of 0.1-0.3 mm, and then fix the sides of the brittle target blanks with tape or rope to form a spliced ​​target blank; Using a sealing tape with a thickness of 0.05-0.5 mm and a width of ≤25 mm to wrap the outer surface of the spacer; (2) preheating the back plate and the spliced ​​target blank described in step (1) on a heating table at 190-240° C., and then sequentially performing a first infiltration and a second infiltration on the welding surfaces of the back plate and the spliced ​​target blank, and then buckling the back plate and the spliced ​​target blank to obtain a target material to be welded; The infiltration liquid used in the first infiltration and the second infiltration is indium solder; the indium solder is preheated at 180-220° C. before use; The first infiltration and the second infiltration are both performed on a heating table at 190-240°C; The first infiltration is performed using a steel brush; the second infiltration is ultrasonic infiltration for 25-35 minutes; (3) Turn off the heating table, and then independently place a pressing block weighing 8-12 kg at the center of each brittle target blank to be welded in step (2) for pressure welding, and then remove the spacer and the sealing tape at 20-30°C to obtain a spliced ​​brittle target.

10. A spliced ​​brittle target material, characterized in that: The spliced ​​brittle target material is made by the welding method described in any one of claims 1 to 9; The flatness of the spliced ​​brittle target material is less than 0.3 mm.

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