Front light plate mold and manufacturing method thereof

Abstract

The invention relates to a front light plate mold and a manufacturing method and application thereof. The manufacturing method of a front light plate comprises the following steps that an initial microstructure is manufactured on a mother board in a laser or mechanical dotting mode; activating the mother board with the initial microstructure; and depositing a metal layer on the surface of the initial microstructure of the activated mother board through a chemical deposition method to obtain the front light plate mold. The metal layer is deposited on the mother board of the initial microstructure formed by laser or mechanical dotting in a chemical deposition mode, so that the microstructure size of the front light plate mold is reduced, and the front light plate manufactured by using the front light plate mold can meet the requirements of a reflective display and the like on high optical uniformity and resolution; accurate size control can be realized by controlling the chemical deposition rate and time, and the production stability and applicability of the front light plate can be greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of front light plate mould manufacturing, and in particular to a front light plate mould and a manufacturing method thereof. Background Art

[0002] The microstructure of the existing front light plate mold is usually made by laser or mechanical dotting process, and its typical size is about 20-30μm. However, with the increasing demand for optical uniformity and high resolution of reflective displays, smaller microstructures have become the trend of technological development. However, the existing laser dotting and mechanical dotting technologies are difficult to break through the size limit of 20-30μm, making it impossible for the front light plate made using the front light plate mold to meet the requirements of high-precision and high-uniformity optical performance, making it difficult for the front light plate to meet the needs of future high-performance displays, especially in the application fields of electronic paper, reflective liquid crystal displays, etc. Summary of the invention

[0003] Based on this, in view of the technical problem that the microstructure of the current front light panel mold is usually made by laser or mechanical dotting technology, and its typical size is about 20-30μm, which makes the front light panel made by the front light panel mold unable to meet the requirements of high-precision and high-uniformity optical performance, the present invention provides a front light panel mold and its production method and application.

[0004] The present invention provides a method for manufacturing a front light plate mold, which comprises the following steps:

[0005] The initial microstructure is made on the mother board by laser or mechanical dotting;

[0006] Activating the mother board with the initial microstructure;

[0007] A metal layer is deposited on the surface of the initial microstructure of the motherboard after activation by a chemical deposition method to obtain a front light board mold.

[0008] The present invention deposits a metal layer on a motherboard with an initial microstructure formed by laser or mechanical dotting by chemical deposition, thereby reducing the microstructure size of the front light plate mold. The front light plate made using the front light plate mold can meet the requirements of reflective displays and the like for high optical uniformity and resolution. The present invention can achieve precise size control by controlling the chemical deposition rate and time, and can greatly improve the production stability and applicability of the front light plate mold.

[0009] As a further improvement of the above solution of the present invention, the diameter of the initial microstructure is 20-30 μm, and the thickness of the metal layer is 7.5-12.5 μm.

[0010] As a further improvement of the above solution of the present invention, the metal layer is a nickel layer.

[0011] As a further improvement of the above solution of the present invention, the speed of the chemical deposition is 10 μm / h.

[0012] As a further improvement of the above-mentioned solution of the present invention, the method for manufacturing the front light plate mold further includes a step of ultrasonically cleaning the mother plate with the initial microstructure before the activation treatment.

[0013] As a further improvement of the above solution of the present invention, the activation treatment is to form an activation film on the surface of the motherboard with the initial microstructure by electroplating nickel impact.

[0014] As a further improvement of the above solution of the present invention, the method for manufacturing the front light panel mold further includes a post-processing step after the chemical deposition step: heat treating the front light panel.

[0015] The present invention also provides a front light panel mold, which is manufactured by using the front light panel mold manufacturing method as described above.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention deposits a metal layer on a motherboard with an initial microstructure formed by laser or mechanical dotting by chemical deposition, thereby reducing the microstructure size of the front light plate mold. The front light plate made using the front light plate mold can meet the requirements of reflective displays and the like for high optical uniformity and resolution. The present invention can achieve precise size control by controlling the chemical deposition rate and time, and can greatly improve the production stability and applicability of the front light plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the initial microstructure of the motherboard in Example 1 and Example 2 of the present invention;

[0019] Figure 2 Schematic diagram of the structure of the front light panel mold microstructure produced in Example 1 and Example 2 of the present invention. DETAILED DESCRIPTION

[0020] For ease of understanding of the present invention, the present invention will be described more fully below in conjunction with specific embodiments. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0022] Example 1

[0023] This embodiment provides a front light plate mold, and the manufacturing method thereof includes the following steps:

[0024] The initial microstructure is made on the motherboard by laser dotting. Figure 1 As shown, the diameter and depth of the initial microstructure are both 30 μm;

[0025] The mother board with the initial microstructure is cleaned using ultrasonic waves;

[0026] The motherboard with the initial microstructure is activated: an activation film is formed on the surface of the motherboard with the initial microstructure by electroplating nickel impact;

[0027] A nickel layer is deposited on the surface of the initial microstructure of the motherboard after activation by chemical deposition. The deposition rate is controlled to be 10 μm / h. After 2.5 hours of deposition, the diameter and depth of the microstructure are reduced to 5 μm, and a front light plate mold is obtained. The structure of the front light plate mold is as follows: Figure 2 As shown; it should be noted that, during the chemical deposition process, a test blank sheet plated with nickel is simultaneously produced in the same deposition tank, and the test blank sheet is taken out at predetermined intervals and the thickness of the test blank sheet is measured, so that the thickness of the nickel layer deposited on the mother board in the same tank can be known, so as to ensure the precise control of the microstructure size;

[0028] Heat treatment is performed on the front light panel mold to improve the mechanical strength and durability of the front light panel and ensure the stability of the front light panel mold in mass production.

[0029] Example 2

[0030] This embodiment provides a front light plate mold, and the manufacturing method thereof includes the following steps:

[0031] The initial microstructure is made on the motherboard by mechanical dotting. Figure 1 As shown, the diameter and depth of the initial microstructure are both 30 μm;

[0032] The mother board with the initial microstructure is cleaned using ultrasonic waves;

[0033] The motherboard with the initial microstructure is activated: an activation film is formed on the surface of the motherboard with the initial microstructure by electroplating nickel impact;

[0034] A nickel layer is deposited on the surface of the initial microstructure of the motherboard after activation by chemical deposition. The deposition rate is controlled to be 10 μm / h. After 2 hours of deposition, the diameter and depth of the microstructure are reduced to 10 μm, and a front light plate mold is obtained. At this time, the front light plate structure is as follows: Figure 2 As shown; it should be noted that, during the chemical deposition process, a test blank sheet plated with nickel is simultaneously produced in the same deposition tank, and the test blank sheet is taken out at predetermined intervals and the thickness of the test blank sheet is measured, so that the thickness of the nickel layer deposited on the mother board in the same tank can be known, so as to ensure the precise control of the microstructure size;

[0035] Heat treatment is performed on the front light panel mold to improve the mechanical strength and durability of the front light panel and ensure the stability of the front light panel mold in mass production.

[0036] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a front light plate mold, characterized in that: It includes the following steps: The initial microstructure is made on the mother board by laser or mechanical dotting; Activating the mother board with the initial microstructure; A metal layer is deposited on the surface of the initial microstructure of the motherboard after activation by a chemical deposition method to obtain a front light board mold.

2. The method for manufacturing a front light plate mold according to claim 1, characterized in that: The diameter of the initial microstructure is 20-30 μm, and the thickness of the metal layer is 7.5-12.5 μm.

3. The method for manufacturing a front light plate mold according to claim 1, characterized in that: The metal layer is a nickel layer.

4. The method for manufacturing a front light plate mold according to claim 1, characterized in that: The speed of the chemical deposition was 10 μm / h.

5. The method for manufacturing a front light plate mold according to claim 1, characterized in that: The front light plate manufacturing method further comprises a step of ultrasonically cleaning the mother plate with the initial microstructure before the activation treatment.

6. The method for manufacturing a front light plate mold according to claim 3, characterized in that: The activation treatment is to form an activation film on the surface of the mother board with the initial microstructure by electroplating nickel impact.

7. The method for manufacturing a front light plate mold according to claim 1, characterized in that: The method for manufacturing the front light panel further comprises a post-processing step after the chemical deposition step: performing a heat treatment on the front light panel.

8. A front light plate mold, characterized in that: It is manufactured by the front light plate mold manufacturing method as described in any one of claims 1 to 7.

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