Horizontal electroplating device
By using a cup -shaped isolation tank, gas blowing component, and liquid adsorption component in the horizontal plating device to isolate the cathode brush brush and plating fluid, it solves the problem of short effective electroplating distance, high cost and low yield in existing technologies. Uniformly plating and high -yield capacity.
Patent Information
- Application Number
- CN202411469485.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-01-24
AI Technical Summary
Due to the structural settings of the isolation groove and cathode conductive brushes, the effective plating distance becomes shorter and the equipment length becomes longer, which increases additional costs. The conductive rollers are easily covered by the plating layer, which requires frequent deplating, which reduces the equipment production. Rate.
The cup -shaped isolation slot, the gas blowing component, and the liquid adsorption component are used to isolate the cathode bristles from the electroplating fluid through the settings of these components to achieve first and second -level removal to avoid the cathode brush.
It increases the effective plating area, reduces equipment cost, power and floor space, avoids the phenomenon of coating thickening, achieves uniform plating, extends the service life of the cathode conductive brush, and increases production capacity.
Smart Images
Figure CN119352137A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of electroplating and relates to a horizontal electroplating device. Background Art
[0002] In the solar industry, the horizontal electroplating process of cells is widely used, such as BC (Back Contact) cells. Since the conductive surface and the electroplating surface of BC cells are on the same surface, the cell needs to contact the electroplating solution and the conductor at the same time to achieve electroplating.
[0003] In the current BC horizontal electroplating process, most electroplating devices use a conductive roller connected to the negative electrode of a constant current source as a cathode, and a titanium rod connected to the positive electrode of a constant current source and placed in the electroplating solution as an insoluble anode. When the cell is transferred in the tank, the cell contacts the electroplating solution and the conductive roller at the same time, so that the conductive roller, the electroplating solution, the titanium rod and the cell form a closed circuit to achieve electroplating.
[0004] See also Figure 1 The figure shows an existing horizontal electroplating equipment, wherein 1 represents anode, 2 represents driving roller, 3 represents cathode conductive brush, 4 represents isolation slot, 5 represents battery cell, 6 represents slot body, 7 represents power supply, and all cathode conductive brushes 3 are connected to the negative pole of power supply 7 by wires, and anode 1 is connected to the positive pole of power supply 7. Due to the structural setting of isolation slot and cathode conductive brush, the existing horizontal electroplating equipment encounters many problems in production, such as:
[0005] First, the conductive roller needs to be placed in an isolation tank to be separated from the plating solution. Only when the battery cell contacts the plating solution can a closed circuit be formed for electroplating. Since there is no plating solution in the isolation tank, the distance in the isolation tank cannot be electroplated, which will shorten the effective plating distance in the tank of the same length. If electroplating is required at the same current intensity, the number of required plating tanks will increase, which will increase the overall length of the equipment and occupy plant space.
[0006] Second, once the number of electroplating tanks increases, more constant current sources, insoluble anodes, pumps and other components need to be equipped, which increases additional costs;
[0007] Third, once the lower conductive roller contacts the electroplating solution, it will also be plated with a metal coating, which requires the conductive roller to be deplated regularly, increasing the idle rate of the equipment and reducing the productivity of the equipment;
[0008] Therefore, it is necessary to provide a horizontal electroplating device. Summary of the invention
[0009] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a horizontal electroplating device for solving the above-mentioned series of application limitation problems existing in the horizontal electroplating device in the prior art during the electroplating process.
[0010] To achieve the above-mentioned object and other related objects, the present invention provides a horizontal electroplating device, which comprises:
[0011] Electroplating tanks;
[0012] an anode, the anode being disposed in the electroplating tank;
[0013] A transmission roller, which is disposed in the electroplating tank and is used to carry and transmit the electroplated parts;
[0014] A cathode conductive brush, wherein the cathode conductive brush is disposed above the transmission roller at intervals, and contacts the upper surface of the edge area of the electroplated part located on the transmission roller through the cathode conductive brush;
[0015] A cup-shaped isolation groove, which is arranged in the electroplating tank and corresponds to the cathode conductive brush, and the electroplating solution in the electroplating tank is refluxed through the cup-shaped isolation groove, so that the cathode conductive brush is isolated from the electroplating solution in the electroplating tank;
[0016] A liquid supply nozzle, the liquid supply nozzle is arranged above the transmission roller and is connected to the electroplating tank, and the electroplating liquid is provided to the upper surface of the electroplated part through the liquid supply nozzle;
[0017] A gas purge assembly, the gas purge assembly is arranged above the transmission roller and is arranged corresponding to the cathode conductive brush, and the upper surface of the electroplated part is firstly deliquified by the gas purge assembly;
[0018] A liquid adsorption component is arranged above the transmission roller and corresponds to the cathode conductive brush. The liquid adsorption component is used to perform secondary liquid removal on the upper surface of the electroplated part, wherein the cathode conductive brush is isolated from the electroplating liquid on the upper surface of the electroplated part through the primary liquid removal and the secondary liquid removal.
[0019] Optionally, the adsorption ports of the liquid adsorption assembly are distributed in a ring shape and / or the purge ports of the gas purge assembly are distributed in a ring shape.
[0020] Optionally, the purge ports of the gas purge assembly are symmetrically arranged; the adsorption ports of the liquid adsorption assembly are symmetrically arranged.
[0021] Optionally, the liquid adsorption component includes a liquid adsorption support having a accommodating cavity, an adsorption pipeline arranged in the wall of the liquid adsorption support, and an adsorption port connected to the adsorption pipeline and located at the bottom of the liquid adsorption support, and the cathode conductive brush is located in the accommodating cavity.
[0022] Optionally, the liquid adsorption component further includes a flexible adsorption layer located at the bottom of the liquid adsorption support and covering the adsorption port.
[0023] Optionally, the gas purge assembly includes a gas purge support, a purge pipeline arranged in the wall of the gas purge support, and a purge port connected to the purge pipeline and located at the bottom of the gas purge support, and there is a purge gas inclination angle between the gas purged from the purge port and the upper surface of the electroplating part.
[0024] Optionally, the gas purge assembly is fixed on the liquid adsorption assembly.
[0025] Optionally, there is a conductive brush inclination angle between the cathode conductive brush and the upper surface of the electroplating part.
[0026] Optionally, the cathode conductive brush is disposed on the liquid adsorption component, and the cathode conductive brush comprises a displacement-adjustable conductive brush.
[0027] Optionally, the cathode conductive brush includes a titanium metal conductive brush, a stainless steel metal conductive brush, a nickel metal conductive brush or a copper metal conductive brush.
[0028] As described above, the horizontal electroplating device of the present invention includes an electroplating tank, an anode, a transfer roller, a cathode conductive brush, a cup-shaped isolation tank, a liquid supply nozzle, a gas purge assembly and a liquid adsorption assembly. The cup-shaped isolation tank is provided to isolate the cathode conductive brush from the electroplating liquid in the electroplating tank, the gas purge assembly is used to perform primary liquid removal on the upper surface of the electroplated part, and the liquid adsorption assembly is used to perform secondary liquid removal on the upper surface of the electroplated part, so that the cathode conductive brush is isolated from the electroplating liquid on the upper surface of the electroplated part through the primary and secondary liquid removal.
[0029] The horizontal electroplating device of the present invention adopts a cup-shaped isolation groove, which can increase the effective electroplating area and reduce equipment cost, power and floor space; the conductive area is set on both sides of the electroplating part, which can reduce the effective electroplating distance and avoid the phenomenon of thickening of the plating layer on both sides of the electroplating part due to edge effect, thereby achieving uniform electroplating; the setting of the cup-shaped isolation groove, gas purge component and liquid adsorption component can achieve isolation of the cathode conductive brush and the electroplating liquid, which can effectively prevent the cathode conductive brush from being electroplated, extend the service life of the cathode conductive brush, improve production capacity and achieve good electroplating. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1Shown is a structural schematic diagram of a horizontal electroplating equipment in the prior art.
[0031] Figure 2 Shown is a schematic diagram of the three-dimensional structure of a horizontal electroplating device in an embodiment of the present invention.
[0032] Figure 3 Display as Figure 2 Schematic diagram of the top view of the medium-level electroplating device.
[0033] Figure 4 Display as Figure 2 Schematic diagram of the cross-sectional structure along the A-A' line.
[0034] Figure 5 Display as Figure 2 Schematic diagram of the cross-sectional structure along the B-B' line.
[0035] Figure 6 Display as Figure 2 Schematic diagram of the three-dimensional assembly structure of the cathode conductive brush, gas purge assembly and liquid adsorption assembly.
[0036] Figure 7 Display as Figure 6 Schematic diagram of the cross-sectional structure along C-C'.
[0037] Figure 8 Shown is a schematic diagram of the three-dimensional structure of the cathode conductive brush in an embodiment of the present invention.
[0038] Fig. 9 Shown is a schematic diagram of the three-dimensional structure of a gas purge assembly in an embodiment of the present invention.
[0039] Description of Reference Numerals
[0040] 1 Anode
[0041] 2 Drive rollers
[0042] 3 Cathode conductive brush
[0043] 4 Isolation slots
[0044] 5. Battery Cell
[0045] 6 Trough
[0046] 7 Power Supply
[0047] 100 Plating tank
[0048] 200 Anode
[0049] 300 Transport Roller
[0050] 400 Cathode Conductive Brush
[0051] 500 Cup Isolation Tank
[0052] 600 Liquid supply nozzle
[0053] 700 Gas Purge Kit
[0054] 701 Gas Purge Support
[0055] 702 Purge line
[0056] 703 Purge Port
[0057] 800 Liquid Absorption Components
[0058] 801 Liquid Adsorption Support
[0059] 802 adsorption pipeline
[0060] 803 Adsorption port
[0061] 900 Flexible adsorption layer
[0062] 110 Electroplating parts DETAILED DESCRIPTION
[0063] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.
[0064] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0065] See also Figure 2 to Figure 9 , this embodiment provides a horizontal electroplating device, the horizontal electroplating device comprising:
[0066] Electroplating tank 100;
[0067] an anode 200, wherein the anode 200 is disposed in the electroplating tank 100;
[0068] A transmission roller 300 , the transmission roller 300 is disposed in the electroplating tank 100 for carrying and transmitting the electroplated component 110 ;
[0069] A cathode conductive brush 400, wherein the cathode conductive brush 400 is disposed above the transmission roller 300 at intervals, and contacts the upper surface of the edge area of the electroplating part 110 located on the transmission roller 300 through the cathode conductive brush 400;
[0070] A cup-shaped isolation groove 500, wherein the cup-shaped isolation groove 500 is disposed in the electroplating tank 100 and is disposed corresponding to the cathode conductive brush 400, and the electroplating solution in the electroplating tank 100 is refluxed through the cup-shaped isolation groove 500, so that the cathode conductive brush 400 is isolated from the electroplating solution in the electroplating tank 100;
[0071] A liquid supply nozzle 600, wherein the liquid supply nozzle 600 is disposed above the transmission roller 300 and is connected to the electroplating tank 100, and the electroplating liquid is provided to the upper surface of the electroplating part 110 through the liquid supply nozzle 600;
[0072] A gas purge assembly 700, wherein the gas purge assembly 700 is disposed above the transmission roller 300 and is disposed corresponding to the cathode conductive brush 400, and the upper surface of the electroplating part 110 is firstly deliquified by the gas purge assembly 700;
[0073] A liquid adsorption component 800 is disposed above the transmission roller 300 and corresponds to the cathode conductive brush 400. The liquid adsorption component 800 is used to perform secondary liquid removal on the upper surface of the electroplating component 110, wherein the cathode conductive brush 400 is isolated from the electroplating liquid on the upper surface of the electroplating component 110 through the primary liquid removal and the secondary liquid removal.
[0074] The horizontal electroplating device of this embodiment adopts the cup-shaped isolation groove 500, which can increase the effective electroplating area and reduce the equipment cost, power and floor space. The conductive area is set on both sides of the electroplating part 110 to reduce the effective electroplating distance, avoid the phenomenon that the plating layer on both sides of the electroplating part 110 is thickened due to the edge effect, and achieve uniform electroplating. The arrangement of the cup-shaped isolation groove 500, the gas purge assembly 700 and the liquid adsorption assembly 800 can achieve the isolation of the cathode conductive brush 400 from the electroplating liquid, which can effectively prevent the cathode conductive brush 400 from being electroplated, extend the service life of the cathode conductive brush 400, improve production capacity, and achieve good electroplating.
[0075] For details, see Figure 2 to Figure 5The schematic diagram of the structure of the horizontal electroplating device in this embodiment is shown, wherein the horizontal electroplating device includes a first water washing area Q1, an electroplating area Q2 and a second water washing area Q3, and the electroplating tank 100 is located in the electroplating area Q2. The type of electroplating solution in the electroplating area Q2 can be selected as needed, and is not overly limited here. The transmission roller 300 is arranged in the electroplating tank 100 to carry and transport the electroplated part 110. The electroplated part 110 includes but is not limited to battery cells. The cathode conductive brush 400 is arranged above the transmission roller 300 at intervals, wherein the cathode conductive brush 400 is electrically connected to the negative electrode of the power supply, such as the negative electrode of the constant current source, so as to contact the upper surface of the edge area of the electroplated part 110 located on the transmission roller 300 through the cathode conductive brush 400, so as to use the cathode conductive brush 400 as the cathode end of the electroplated part 110. The anode 200 is arranged in the electroplating tank 100 and is electrically connected to the positive electrode of the power supply, such as the positive electrode of the constant current source, and the electroplating surface of the electroplating part 110 in this embodiment is the upper surface of the electroplating part 110, so that the liquid supply nozzle 600 located above the transmission roller 300 and connected to the electroplating tank 100 can provide a positively charged electroplating liquid to the upper surface of the electroplating part 110, so that it can serve as the anode end of the electroplating part 110. When the upper surface of the electroplating part 110 is transmitted to the cathode conductive brush 400 and contacts the electroplating sprayed from the liquid supply nozzle 600, a current loop can be formed to carry out the electroplating process.
[0076] The material of the anode 200 may be titanium, copper, nickel, etc., without any undue restriction; the cathode conductive brush 400 may include titanium metal conductive brush, nickel metal conductive brush or copper metal conductive brush, etc., without any undue restriction.
[0077] Among them, when electroplating is carried out, the cathode conductive brush 400 can be isolated from the electroplating liquid through the arrangement of the cup-shaped isolation groove 500, the gas purge assembly 700 and the liquid adsorption assembly 800, which can effectively prevent the cathode conductive brush 400 from being electroplated, extend the service life of the cathode conductive brush 400, improve production capacity, and achieve good electroplating.
[0078] Specifically, when the electroplating component 110 is not transferred between the transfer roller 300 and the cathode conductive brush 400, a reflux groove of the electroplating liquid can be formed below the cathode conductive brush 400 by setting the cup-shaped isolation groove 500, thereby avoiding the contact between the cathode conductive brush 400 and the electroplating liquid in the electroplating tank 100; when the electroplating component 110 is transferred between the transfer roller 300 and the cathode conductive brush 400, the gas purge component 700 can be used to perform a primary liquid removal on the upper surface of the electroplating component 110, and the liquid adsorption component 800 can be used to perform a secondary liquid removal on the upper surface of the electroplating component 110, thereby isolating the cathode conductive brush 400 from the electroplating liquid on the upper surface of the electroplating component 110.
[0079] Among them, see Figure 2 to Figure 5 The liquid supply nozzle 600 is arranged above the transmission roller 300. The specific shape, position, number and arrangement of the liquid supply components of the liquid supply nozzle 600, such as a pump, a connecting pipe, etc., are not overly limited here and can be selected according to needs.
[0080] As an example, the liquid adsorption component 800 includes a liquid adsorption support 801 having a accommodating cavity, an adsorption pipeline 802 arranged in the wall of the liquid adsorption support 801, and an adsorption port 803 connected to the adsorption pipeline 802 and located at the bottom of the liquid adsorption support 801, and the cathode conductive brush 400 is located in the accommodating cavity.
[0081] For details, see Figure 6 , Figure 7 and Fig. 9 In this embodiment, the liquid adsorption component 800 includes the liquid adsorption support 801, the adsorption pipeline 802 and the adsorption port 803, wherein the liquid adsorption support 801 is used to accommodate the cathode conductive brush 400 through the accommodating cavity, and the adsorption pipeline 802 is arranged in the wall of the liquid adsorption support 801, and the adsorption port 803 is arranged at the bottom of the liquid adsorption support 801, and the adsorption port 803 is connected to the adsorption pipeline 802, so that when the adsorption pipeline 802 is connected to the pump, and when the adsorption port 803 contacts the upper surface of the electroplating part 110, the electroplating liquid on the upper surface of the electroplating part 110 can be sucked back through the adsorption port 803.
[0082] As an example, the liquid adsorption assembly 800 further includes a flexible adsorption layer 900 located at the bottom of the liquid adsorption support 801 and covering the adsorption port 803 .
[0083] For details, see Figure 6 and Figure 7 In this embodiment, the liquid adsorption component 800 also includes the flexible adsorption layer 900 located at the bottom of the liquid adsorption support 801 and covering the adsorption port 803, so as to contact the upper surface of the electroplating part 110 through the flexible adsorption layer 900 to avoid damage to the electroplating part 110, wherein the flexible adsorption layer 900 may include a sponge or the like.
[0084] As an example, the gas purge assembly 700 may be fixed on the liquid adsorption assembly 800 .
[0085] For details, see Figure 6 and Figure 7 In this embodiment, the gas purge assembly 700 is fixed on the liquid adsorption assembly 800, but the fixing position of the gas purge assembly 700 is not limited thereto. The gas purge assembly 700 can be used to purge gas to the upper surface of the electroplating part 110 to perform a primary de-liquidation on the electroplating liquid on the upper surface of the electroplating part 110. After the primary de-liquidation, the electroplating liquid remaining on the upper surface of the electroplating part 110 can be adsorbed by the liquid adsorption assembly 800 to achieve a secondary de-liquidation of the electroplating liquid remaining on the upper surface of the electroplating part 110, so as to ensure the effective removal of the electroplating liquid on the surface of the electroplating part 110, thereby avoiding the contact between the cathode conductive brush 400 and the electroplating liquid on the upper surface of the electroplating part 110 and avoiding electroplating.
[0086] As an example, the gas purge assembly 700 includes a gas purge support 701 , a purge pipeline 702 disposed in a wall of the gas purge support 701 , and a purge port 703 communicating with the purge pipeline 702 and located at the bottom of the gas purge support 701 .
[0087] For details, see Figure 6 and Figure 7 In this embodiment, the gas purge assembly 700 is disposed on both sides of the liquid adsorption support 801, see Figure 3 The projection of the gas purge assembly 700 is located on both sides of the transmission roller 300, so that the gas is purged toward the upper surface of the electroplating part 110 through the purge port 703 to perform a primary liquid removal on the upper surface of the electroplating part 110, wherein, of course, according to needs, the gas purge assembly 700 can also be arranged in an inverted U shape and located at the periphery of the liquid adsorption support 801, including being located on the side of the liquid adsorption support 801, or annularly covering the liquid adsorption support 801.
[0088] Preferably, there is a purge gas inclination angle θ2 between the gas purged from the purge port 703 and the upper surface of the electroplating part 110, such as Figure 7, so as to effectively purge the electroplating liquid on the upper surface of the electroplating part 110. The purge gas inclination angle θ2 may be 100°, 110°, 120°, etc., to improve the purge and liquid removal effect.
[0089] As an example, the adsorption ports 803 of the liquid adsorption assembly 800 are distributed in a ring shape and / or the purge ports 703 of the gas purge assembly 700 are distributed in a ring shape.
[0090] For details, see Figure 6 and Fig. 9 In this embodiment, the adsorption port 803 of the liquid adsorption component 800 is distributed in a ring shape, and the purge port 703 of the gas purge component 700 is distributed in a strip shape. The cathode conductive brush 400 can be surrounded by the adsorption port 803. The purge port 703 performs a primary liquid removal on the plating liquid on the upper surface of the electroplating part 110, and the remaining plating liquid can be adsorbed by the adsorption port 803 distributed in a ring shape, so as to effectively remove the plating liquid located outside the cathode conductive brush 400. However, the distribution of the purge port 703 and the adsorption port 803 is not limited to this. For example, the purge port 703 and the adsorption port 803 can both be set in a ring shape, or combined with the setting of the gas purge component 700, the adsorption port 803 is set in a strip shape. Among them, it is sufficient to ensure that the coordinated setting of the purge port 703 and the adsorption port 803 can isolate the cathode conductive brush 400 from the plating liquid on the upper surface of the electroplating part 110.
[0091] Further, it is preferred that the purge ports 703 of the gas purge assembly 700 are symmetrically arranged; and the adsorption ports 803 of the liquid adsorption assembly 800 are symmetrically arranged.
[0092] Specifically, when the purge port 703 is set to be symmetrical along the transmission roller 300, and the adsorption port 803 is set to be symmetrical along the transmission roller 300, the force acting on the upper surface of the electroplating part 110 can be balanced during the primary liquid removal and the secondary liquid removal, which is beneficial to the back-absorption of the electroplating liquid and does not hinder the operation of the electroplating part 110, so as to reduce damage to the electroplating part 110.
[0093] No excessive restrictions are imposed on the specific structural arrangements of the liquid adsorption assembly 800 and the gas purge assembly 700.
[0094] As an example, the cathode conductive brush 400 may be disposed on the liquid adsorption assembly 800 , and the cathode conductive brush 400 includes a displacement-adjustable conductive brush.
[0095] For details, see Figure 6 to Figure 8 In this embodiment, the cathode conductive brush 400 is directly disposed on the liquid adsorption support 801, but the fixing method of the cathode conductive brush 400 is not limited thereto and can also be fixed by an additional bracket, which is not limited here.
[0096] Among them, see Figure 7 Preferably, the cathode conductive brush 400 is a displacement-adjustable conductive brush, that is, the cathode conductive brush 400 can achieve horizontal displacement in the lateral direction and / or lifting and lowering in the vertical direction, so that the position of the cathode conductive brush 400 can be conveniently changed to achieve good contact with the electroplating part 110.
[0097] Among them, see Figure 7 , the electroplated part 110 can be regarded as being transmitted from right to left, and preferably, there is a conductive brush inclination angle θ1 between the cathode conductive brush 400 and the upper surface of the electroplated part 110, such as 30°, 45°, etc., so as to facilitate good contact between the cathode conductive brush 400 and the upper surface of the electroplated part 110, thereby reducing damage to the cathode conductive brush 400 and / or the electroplated part 110.
[0098] Furthermore, an upper pressure wheel (not shown) corresponding to the transmission roller 300 may be provided above the transmission roller 300, and the upper pressure wheel is preferably a step roller, so as to prevent the electroplating part 110 from being offset due to the suction or blowing force during the blowing and adsorption process. The step roller with grooves on the surface can facilitate the flow of the electroplating liquid while achieving the clamping effect on the electroplating part 110.
[0099] In summary, the horizontal electroplating device of the present invention includes an electroplating tank, an anode, a transmission roller, a cathode conductive brush, a cup-shaped isolation tank, a liquid supply nozzle, a gas purge assembly and a liquid adsorption assembly. The cup-shaped isolation tank is arranged to isolate the cathode conductive brush from the electroplating liquid in the electroplating tank, the gas purge assembly is used to perform primary liquid removal on the upper surface of the electroplated part, and the liquid adsorption assembly is used to perform secondary liquid removal on the upper surface of the electroplated part, so that the cathode conductive brush is isolated from the electroplating liquid on the upper surface of the electroplated part through the primary and secondary liquid removal.
[0100] The horizontal electroplating device of the present invention adopts a cup-shaped isolation groove, which can increase the effective electroplating area and reduce equipment cost, power and floor space; the conductive area is set on both sides of the electroplating part, which can reduce the effective electroplating distance and avoid the phenomenon of thickening of the plating layer on both sides of the electroplating part due to edge effect, thereby achieving uniform electroplating; the setting of the cup-shaped isolation groove, gas purge component and liquid adsorption component can achieve isolation of the cathode conductive brush and the electroplating liquid, which can effectively prevent the cathode conductive brush from being electroplated, extend the service life of the cathode conductive brush, improve production capacity and achieve good electroplating.
[0101] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.
Claims
1. A horizontal electroplating device, characterized in that: The horizontal electroplating device comprises: Electroplating tanks; an anode, the anode being disposed in the electroplating tank; A transmission roller, which is disposed in the electroplating tank and is used to carry and transmit the electroplated parts; A cathode conductive brush, wherein the cathode conductive brush is disposed above the transmission roller at intervals, and contacts the upper surface of the edge area of the electroplated part located on the transmission roller through the cathode conductive brush; A cup-shaped isolation groove, which is arranged in the electroplating tank and corresponds to the cathode conductive brush, and the electroplating solution in the electroplating tank is refluxed through the cup-shaped isolation groove, so that the cathode conductive brush is isolated from the electroplating solution in the electroplating tank; A liquid supply nozzle, the liquid supply nozzle is arranged above the transmission roller and is connected to the electroplating tank, and the electroplating liquid is provided to the upper surface of the electroplated part through the liquid supply nozzle; A gas purge assembly, the gas purge assembly is arranged above the transmission roller and is arranged corresponding to the cathode conductive brush, and the upper surface of the electroplated part is firstly deliquified by the gas purge assembly; A liquid adsorption component is arranged above the transmission roller and corresponds to the cathode conductive brush. The liquid adsorption component is used to perform secondary liquid removal on the upper surface of the electroplated part, wherein the cathode conductive brush is isolated from the electroplating liquid on the upper surface of the electroplated part through the primary liquid removal and the secondary liquid removal.
2. The horizontal electroplating device according to claim 1, characterized in that: The adsorption ports of the liquid adsorption component are distributed in a ring shape and / or the purge ports of the gas purge component are distributed in a ring shape.
3. The horizontal electroplating device according to claim 1, characterized in that: The purge ports of the gas purge assembly are symmetrically arranged; The adsorption ports of the liquid adsorption component are symmetrically arranged.
4. The horizontal electroplating device according to claim 1, characterized in that: The liquid adsorption component includes a liquid adsorption support with a accommodating cavity, an adsorption pipeline arranged in the wall of the liquid adsorption support, and an adsorption port connected to the adsorption pipeline and located at the bottom of the liquid adsorption support, and the cathode conductive brush is located in the accommodating cavity.
5. The horizontal electroplating device according to claim 4, characterized in that: The liquid adsorption component further comprises a flexible adsorption layer located at the bottom of the liquid adsorption support and covering the adsorption port.
6. The horizontal electroplating device according to claim 1, characterized in that: The gas purge assembly includes a gas purge support, a purge pipeline arranged in the wall of the gas purge support, and a purge port connected to the purge pipeline and located at the bottom of the gas purge support, and there is a purge gas inclination angle between the gas purged from the purge port and the upper surface of the electroplating part.
7. The horizontal electroplating device according to claim 1, characterized in that: The gas purge component is fixed on the liquid adsorption component.
8. The horizontal electroplating device according to claim 1, characterized in that: There is a conductive brush inclination angle between the cathode conductive brush and the upper surface of the electroplating part.
9. The horizontal electroplating device according to claim 1, characterized in that: The cathode conductive brush is arranged on the liquid adsorption component, and the cathode conductive brush comprises a displacement-adjustable conductive brush.
10. The horizontal electroplating device according to claim 1, characterized in that: The cathode conductive brush includes a titanium conductive brush, a stainless steel conductive brush, a nickel conductive brush or a copper conductive brush.