Circuit board feeding device and electroplating equipment

Abstract

The invention discloses a circuit board feeding device and electroplating equipment, and relates to the technical field of circuit board electroplating. The circuit board feeding device comprises a rack, a feeding conveying mechanism, a positioning mechanism and a pushing mechanism, the feeding conveying mechanism is used for allowing a circuit board to be horizontally placed and conveying the circuit board to an electroplating conveying mechanism of electroplating equipment in the horizontal direction, the positioning mechanism is used for positioning the circuit board on the feeding conveying mechanism to a preset position, the pushing mechanism comprises a first driving part and a first pushing part, and the first pushing part is in driving connection with the first driving part. The first driving part is used for driving the first material pushing part to move back and forth in the first direction and driving the circuit boards to move so as to adjust the distance between the two adjacent circuit boards arranged in the first direction after positioning, and the circuit boards can be prevented from inclining on the electroplating conveying mechanism due to position deviation through positioning of the positioning mechanism. And the distance between the adjacent circuit boards is adjusted by the pushing mechanism, so that the electroplating uniformity and the production efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board electroplating, and in particular to a circuit board feeding device and electroplating equipment. Background Art

[0002] In the current printed circuit board (PCB) manufacturing process, the effect of the first electroplating often fails to reach the ideal standard, resulting in the need for a secondary electroplating process. The ideal electroplating effect usually requires a thin layer of electroplating first, followed by a thick layer of electroplating. To achieve this goal, the existing electroplating method usually uses a horizontal electroplating machine.

[0003] Before the plates enter the electroplating machine, they are required to be arranged side by side and maintain a certain spacing. However, the existing equipment uses a roller conveyor structure, resulting in insufficient spacing control accuracy, usually only 10-15mm. If the positioning is inaccurate, the plate thickness will cause tilt problems, which will affect the final electroplating quality and lead to low production efficiency. Summary of the invention

[0004] The main purpose of the present invention is to provide a circuit board feeding device and electroplating equipment, aiming to solve the problem of low production efficiency of existing electroplating equipment.

[0005] To achieve the above-mentioned purpose, the circuit board feeding device proposed in the present invention is applied to electroplating equipment, the electroplating equipment includes an electroplating conveying mechanism and an electroplating cylinder, the electroplating conveying mechanism is used to drive the circuit board to move in the electroplating cylinder for electroplating, the circuit board feeding device includes a frame and a feeding conveying mechanism, a positioning mechanism and a pushing mechanism arranged on the frame;

[0006] The loading conveying mechanism is used for placing the circuit board horizontally and conveying the circuit board to the electroplating conveying mechanism in a horizontal direction;

[0007] The positioning mechanism is used to position the circuit board on the loading conveying mechanism to a preset position so that the circuit board moves along the first direction to the electroplating conveying mechanism;

[0008] The pushing mechanism is used to push the circuit board to move along the first direction, so as to adjust the distance between two adjacent circuit boards positioned by the positioning mechanism and arranged along the first direction.

[0009] In one embodiment, the first pusher has a first position and a second position above the loading and conveying mechanism, the positioning mechanism is located between the first position and the second position, and the first driving member is used to drive the first pusher to move back and forth between the first position and the second position.

[0010] In one embodiment, the pushing mechanism includes a first driving member and a first pushing member, the first pushing member is drivingly connected to the first driving member, the first pushing member has a first position and a second position on the first driving member, the positioning mechanism is located between the first position and the second position, and the first driving member is used to drive the first pushing member to move back and forth between the first position and the second position.

[0011] In one embodiment, the first pusher also includes a first lifting device, and the first connecting plate is driven and connected to the first driving member through the first lifting device. The first lifting device is used to drive the first connecting plate and the first guide wheel to move along a third direction to make the first guide wheel approach or move away from the loading and conveying mechanism.

[0012] In one embodiment, the pushing mechanism is used to push the circuit board positioned by the positioning mechanism to move along the first direction so that the spacing between the pushed circuit board and the previous circuit board positioned by the positioning mechanism is a preset value L, and the actual spacing value between the two circuit boards is D, and L and D satisfy: L-1.5mm≤D≤L+1.5mm.

[0013] In one embodiment, the positioning mechanism includes a second driving member, a second pushing member and a positioning member, the positioning member and the second pushing member are respectively arranged on both sides of the loading and conveying mechanism, a positioning area is formed between the second pushing member and the positioning member, the second pushing member is drivingly connected to the second driving member, and the second pushing member is used to push the circuit board located in the positioning area to abut against the positioning member.

[0014] In one embodiment, the positioning member includes a mounting plate and a second guide wheel, and a plurality of the second guide wheels are rotatably disposed on the mounting plate and arranged at intervals along the first direction for abutting against the circuit board;

[0015] And / or, the second pushing member includes a second connecting plate and a third guide wheel, the second connecting plate is drivingly connected to the second driving member, and a plurality of the third guide wheels are rotatably arranged on the side of the second connecting plate facing the loading and conveying mechanism and are arranged at intervals along the first direction for pushing the circuit board.

[0016] In one embodiment, the loading and conveying mechanism includes a plurality of rollers, which are arranged at intervals along the first direction to form a conveying line, and each roller is provided with a plurality of friction wheels at intervals, and the rollers are used to drive the friction wheels to rotate, so that the friction wheels drive the circuit board to move along the first direction.

[0017] In one embodiment, the loading and conveying mechanism also includes a steering support assembly arranged at the positioning mechanism, and the steering support assembly includes a bracket and a guide member. A plurality of the guide members can be movably arranged on the bracket for slidingly abutting against the circuit board when the circuit board moves along the first direction or is positioned and moved by the positioning mechanism.

[0018] The present invention further provides an electroplating device, comprising an electroplating conveying mechanism and an electroplating cylinder and a circuit board loading device in any of the aforementioned embodiments.

[0019] The circuit board loading device proposed in the technical solution of the present invention adopts a positioning mechanism and a pushing mechanism to control the position and spacing of the circuit boards on the loading and conveying mechanism to improve production efficiency. Specifically, the circuit board loading device is used to be arranged at the board input end of the electroplating equipment. The electroplating equipment includes a plating conveying mechanism and a plating cylinder. The plating cylinder contains liquid medicine. The electroplating conveying mechanism is usually used to clamp one side edge of the circuit board and drive the circuit board to move in the plating cylinder to complete the electroplating.

[0020] The circuit board loading device includes a frame and a loading conveying mechanism, a positioning mechanism and a pushing mechanism arranged on the frame. The loading conveying mechanism is a conveying line with a certain length. The loading conveying mechanism is used to place the circuit board horizontally and convey the circuit board horizontally to the electroplating conveying mechanism of the electroplating equipment. The positioning mechanism is used to position the circuit board on the loading conveying mechanism to a predetermined position so that the board edge of the circuit board is aligned with the electroplating conveying mechanism. After the positioning is completed, the circuit board moves to the electroplating conveying mechanism along the first direction. The pushing mechanism includes a first driving member and a first pushing member. The first pushing member is connected to the first driving member for driving. The first driving member is used to drive the first pushing member to move back and forth along the first direction and drive the circuit board to move. During production loading, the operator generally puts multiple circuit boards on the loading conveying mechanism. The first pushing member is used to adjust the spacing between two adjacent circuit boards that are positioned and arranged along the first direction.

[0021] From the above, it can be seen that the circuit board is positioned by the positioning mechanism to align with the electroplating conveying mechanism to prevent the circuit board from being offset and tilted on the electroplating conveying mechanism, which in turn leads to unsatisfactory electroplating effect. In addition, the positioned circuit board is pushed to move by the pushing mechanism so that the distance between two adjacent circuit boards after positioning can be accurately controlled, thereby improving the uniformity of electroplating and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 A schematic structural diagram of an embodiment of a circuit board feeding device provided by the present invention;

[0024] Figure 2 A schematic diagram of the internal structure of an embodiment of a circuit board feeding device provided by the present invention;

[0025] Figure 3 A schematic diagram of the structure of a feeding and conveying mechanism, a positioning mechanism and a pushing mechanism in an embodiment of a circuit board feeding device provided by the present invention;

[0026] Figure 4 A top view of a feeding conveying mechanism and a positioning mechanism in an embodiment of a circuit board feeding device provided by the present invention;

[0027] Figure 5 A schematic structural diagram of a material pushing mechanism in an embodiment of a circuit board feeding device provided by the present invention;

[0028] Figure 6 A schematic diagram of the split structure of the first pushing member in an embodiment of the circuit board feeding device provided by the present invention;

[0029] Figure 7 A schematic diagram of the assembly structure of the positioning mechanism and the steering support assembly in one embodiment of the circuit board feeding device provided by the present invention;

[0030] Figure 8 for Figure 7 Schematic diagram of the split structure of the central positioning mechanism and the steering support assembly;

[0031] Fig. 9 A schematic structural diagram of an embodiment of an electroplating device provided by the present invention;

[0032] Fig.10 A top view of the connection between a circuit board feeding device, an electroplating cylinder and an electroplating conveying mechanism in one embodiment of the electroplating equipment provided by the present invention.

[0033] Description of Figure Numbers:

[0034] 100, circuit board feeding device; 110, feeding conveying mechanism; 110a, positioning area; 111, roller; 112, friction wheel; 113, steering support assembly; 1131, bracket; 1132, guide member; 1133, second lifting device; 114, driving motor; 120, positioning mechanism; 121, second driving member; 122, second pushing member; 1221, second connecting plate; 1222, third guide wheel; 123, positioning member; 1231, mounting plate; 1232, second guide wheel; 130, pushing mechanism; 131, first driving member; 132, first pushing member; 1321, first connecting plate; 1322, first guide wheel; 1323, first lifting device; 1324, box; 140, frame;

[0035] 200. Circuit board;

[0036] 300. Electroplating equipment; 310. Electroplating conveying mechanism; 320. Electroplating cylinder.

[0037] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0040] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0041] In the current printed circuit board (PCB) manufacturing process, the effect of a single electroplating process often fails to meet the ideal standard, resulting in the need for a secondary electroplating process. The ideal electroplating effect usually requires thin-layer electroplating first, followed by thick-layer electroplating. To achieve this goal, the existing electroplating method usually uses a horizontal electroplating machine. Before the panels enter the electroplating machine, the panels are required to be arranged sideways and maintain a certain spacing. However, the existing equipment uses a roller conveyor structure, resulting in insufficient spacing control accuracy, which can usually only reach 10-15mm. If the positioning is inaccurate, the tilt problem caused by the different thickness of the panels will affect the final electroplating quality and lead to low production efficiency.

[0042] The invention provides a circuit board feeding device.

[0043] See also Figures 1 to 3 In one embodiment of the present invention, the circuit board feeding device 100 is used to be arranged at the board feeding end of the electroplating equipment. The electroplating equipment includes a plating conveying mechanism and a plating cylinder. The plating cylinder contains liquid medicine. The plating conveying mechanism is usually used to clamp one side edge of the circuit board 200 and drive the circuit board 200 to move in the plating cylinder to complete the electroplating.

[0044] The circuit board loading device 100 includes a frame 140 and a loading conveying mechanism 110, a positioning mechanism 120 and a pushing mechanism 130 arranged on the frame 140. The loading conveying mechanism 110 is a conveying line with a certain length. The loading conveying mechanism 110 is used to place the circuit board 200 horizontally and convey the circuit board 200 horizontally to the electroplating conveying mechanism of the electroplating equipment. The positioning mechanism 120 is used to position the circuit board 200 on the loading conveying mechanism 110 to a predetermined position so that the board edge of the circuit board 200 is aligned with the electroplating conveying mechanism. After the positioning is completed, the circuit board 200 moves to the electroplating conveying mechanism along the first direction. The pushing mechanism 130 includes a first driving member 131 and a first pushing member 132. The first pushing member 132 is drivingly connected to the first driving member 131. The first driving member 131 is used to drive the first pushing member 132 to move back and forth along the first direction and drive the circuit board 200 to move. During production loading, the operator generally places a plurality of circuit boards 200 on the loading and conveying mechanism 110 , and the first pusher 132 is used to adjust the distance between two adjacent circuit boards 200 that are positioned and arranged along the first direction.

[0045] From the above, it can be known that the circuit board 200 is positioned by the positioning mechanism 120 to align with the electroplating conveying mechanism, thereby preventing the circuit board 200 from being offset and tilted on the electroplating conveying mechanism, thereby causing an unsatisfactory electroplating effect. In addition, the positioned circuit board 200 is pushed to move by the pushing mechanism 130, so that the distance between two adjacent circuit boards 200 after positioning can be accurately controlled, thereby improving the uniformity of electroplating and production efficiency.

[0046] In one embodiment, the pushing mechanism 130 includes a first driving member 131 and a first pushing member 132. The first pushing member 132 is drivingly connected to the first driving member 131. The first pushing member 132 has a first position and a second position on the first driving member 131. The positioning mechanism 120 is located between the first position and the second position. The first driving member 131 is used to drive the first pushing member 132 to move back and forth between the first position and the second position.

[0047] like Figure 3 and Figure 5 As shown, in one embodiment of the present invention, the first driving member 131 is a linear motor extending along the first direction, the first pushing member 132 is arranged below the first driving member 131, and the first pushing member 132 is at a first position and a second position at both ends of the maximum stroke on the first driving member 131, and the positioning mechanism 120 is arranged between the first position and the second position. Specifically, Figure 3The position of the first pusher 132 is the first position. At this time, when the operator places multiple circuit boards 200 horizontally on the loading and conveying mechanism 110 in sequence, multiple circuit boards 200 enter the operating range of the first pusher 132 at intervals. Whenever a circuit board 200 enters the operating range, the first pusher 132 moves to the second position and pushes the circuit board 200 to the positioning mechanism 120 to stop. After the positioning mechanism 120 positions the circuit board 200 to the preset position, the first pusher 132 continues to move to the second position to push the circuit board 200. A transition section (not shown) is also provided between the loading and conveying mechanism 110 and the electroplating conveying mechanism shown in the figure. The first pusher 132 pushes the positioned circuit board 200 onto the transition section and maintains a certain distance from the previous circuit board 200. Then the first pusher 132 returns to the first position and cyclically performs the pushing operation, and the multiple circuit boards 200 on the transition section enter the electroplating conveying mechanism in sequence along the first direction.

[0048] It is understandable that, in order to ensure the spacing of the circuit boards 200 entering the electroplating conveying mechanism, the running speeds of the transition section and the electroplating conveying mechanism are usually adjusted to be consistent. If factors such as sliding friction are considered, the transportation speed of the transition section can be slightly faster than that of the electroplating conveying mechanism, which can be adjusted according to actual conditions. When the specifications of the circuit boards 200 are consistent, when the first pusher 132 pushes the circuit board 200 to the positioning mechanism 120, the position of the current circuit board 200 on the feeding conveying mechanism 110 is determined, and the time from the first pusher 132 pushing the current circuit board 200 into the positioning mechanism 120, and the positioning mechanism 120 completing the positioning and then pushing it to the transition section is fixed, and the previous circuit board 200 moves at the first speed on the transition section. It is only necessary to determine the moving distance of the previous circuit board 200 within the time difference, and adjust the speed and distance of the first pusher 132 moving from the first position to the second position to accurately control the spacing between the current circuit board 200 and the previous circuit board 200, so as to improve the electroplating quality of the circuit board 200.

[0049] Of course, in some other embodiments of the present invention, the positions of the positioning mechanism 120 and the first pusher 132 are not specifically limited. For example, the positioning mechanism 120 can be arranged at the first position or at the side of the first position away from the second position, as long as the spacing of the circuit boards 200 entering the electroplating conveying mechanism can be accurately controlled. In addition, the first driving member 131 and the first pusher 132 can also be arranged below the loading and conveying mechanism 110, so that the first pusher 132 can abut against the circuit board 200 when passing through the loading and conveying mechanism 110. At this time, the loading and conveying mechanism 110 can open an avoidance groove for the first pusher 132 to push the circuit board to move along the first direction. The specific setting can be based on actual needs and is not specifically limited here.

[0050] In one embodiment, the first pusher 132 includes a first connecting plate 1321 and a first guide wheel 1322. The first connecting plate 1321 is drivingly connected to the first driving member 131. A plurality of first guide wheels 1322 are rotatably disposed on one side of the first connecting plate 1321 toward the loading and conveying mechanism 110 and are arranged at intervals along the second direction to push the circuit board 200 to move.

[0051] like Figure 3 , Figure 5 and Figure 6 As shown, in one embodiment of the present invention, the first pushing member 132 includes a first connecting plate 1321 and a first guide wheel 1322. The first connecting plate 1321 is drivingly connected to the first driving member 131. There are multiple first guide wheels 1322. The first connecting plate 1321 is spaced apart with multiple rotating shafts on one side facing the loading and conveying mechanism 110. A first guide wheel 1322 is rotatably provided on each rotating shaft. Multiple first guide wheels 1322 are arranged at intervals along the second direction, which is the width direction of the loading and conveying mechanism 110. The surface of the first guide wheel 1322 is used to abut against the side edge of the circuit board 200 to push the circuit board 200 to move along the first direction. When the circuit board 200 is positioned, it may move along the second direction. At this time, the edge of the board slides against the multiple first guide wheels 1322 to reduce wear.

[0052] In one embodiment, the first pushing member 132 also includes a first lifting device 1323, and the first connecting plate 1321 is driven and connected to the first driving member 131 through the first lifting device 1323. The first lifting device 1323 is used to drive the first connecting plate 1321 and the first guide wheel 1322 to move along the third direction so that the first guide wheel 1322 is close to or away from the loading and conveying mechanism 110.

[0053] like Figure 3 , Figure 5 and Figure 6As shown, in one embodiment of the present invention, the first pushing member 132 also includes a first lifting device 1323 and a box body 1324. Specifically, the box body 1324 is connected to the first driving member 131 through a connecting member. The first lifting device 1323 is a cylinder arranged in the box body 1324. The first connecting plate 1321 is fixed on the first lifting device 1323. The first lifting device 1323 is used to drive the first connecting plate 1321 and the multiple first guide wheels 1322 on the first connecting plate 1321 to move along the third direction, so that the first guide wheel 1322 moves toward or away from the feeding conveying mechanism 110. Specifically, when the circuit board 200 moves on the loading and conveying mechanism 110 toward the positioning mechanism 120, the first lifting device 1323 drives the first guide wheel 1322 to rise to avoid blocking the circuit board 200. When the circuit board 200 completely enters the operating range of the first pushing member 132, the first lifting device 1323 drives the first guide wheel 1322 to descend so that the side wall of the first guide wheel 1322 can abut against the side of the circuit board 200. At this time, the first driving member 131 drives the first pushing member 132 to move to push the circuit board 200.

[0054] In one embodiment, the pushing mechanism 130 is used to push the circuit board 200 positioned by the positioning mechanism 120 to move along the first direction so that the distance between the pushed circuit board 200 and the previous circuit board 200 positioned by the positioning mechanism 120 is a preset value L, and the actual distance value between the two circuit boards is D, and L and D satisfy: L-1.5mm≤D≤L+1.5mm.

[0055] Since multiple circuit boards 200 need to enter the electroplating tank in sequence, the uneven spacing of the circuit boards 200 may cause uneven flow of the electroplating solution, resulting in excessively thick or thin coating in some areas, affecting the overall performance. The existing equipment uses a roller conveying structure, and the spacing control accuracy is not high. Figure 3As shown, in one embodiment of the present invention, the push mechanism 130 uses a linear motor, and uses the first push member 132 to push the circuit board 200 positioned by the positioning mechanism 120 to the electroplating conveying mechanism to catch up with the previous circuit board 200. The controller calculates the operating gap and the transportation distance, and controls the positioning mechanism 120 and the push mechanism 130 to cooperate with each other, so that the spacing value between two adjacent circuit boards 200 is controlled at a preset value L. For example, the preset value L of the board spacing can be set to 5mm, 10mm or 15mm, etc., but due to the influence of the control accuracy of the mechanical equipment The actual spacing value D is different from the preset value L. By controlling the linear motor, the error between the spacing value D and the preset value L can be further reduced compared with conventional roller conveying. Specifically, L and D satisfy: L-1.5mm≤D≤L+1.5mm, that is, the error can be controlled within the range of 1.5mm. For example, if the preset value L between the plates is set to 10mm, the minimum value of the actual spacing value D can be 8.5mm, the maximum value can be 11.5mm, the spacing value D can also be 9.5mm, or any value within the aforementioned range. Compared with the traditional roller conveying structure, the control is more precise, and the electroplating effect is better.

[0056] In one embodiment, the positioning mechanism 120 includes a second driving member 121, a second pushing member 122 and a positioning member 123. The positioning member 123 and the second pushing member 122 are respectively arranged on both sides of the loading and conveying mechanism 110. A positioning area 110a is formed between the second pushing member 122 and the positioning member 123. The second pushing member 122 is drivingly connected to the second driving member 121. The second pushing member 122 is used to push the circuit board 200 located in the positioning area 110a to abut against the positioning member 123.

[0057] like Figure 3 , Figure 4As shown, in one embodiment of the present invention, the positioning mechanism 120 includes a second driving member 121, a second pushing member 122 and a positioning member 123. Specifically, the positioning member 123 and the second pushing member 122 are arranged on opposite sides of the loading and conveying mechanism 110, and a positioning area 110a is formed therebetween. The second pushing member 122 and the second driving member 121 are driven and connected. When the first pushing member 132 pushes the circuit board 200 to the positioning area 110a along the first direction, the second driving member 121 drives the second pushing member 122 to push the circuit board 200 along the second direction so that its side abuts against the positioning member 123. It should be noted that the angle formed by the first direction and the second direction can be 90° or other angles. The abutting position of the positioning member 123 is consistent with the clamping position of the electroplating conveying mechanism. The side of the circuit board 200 abuts on the positioning member 123 to be aligned with the electroplating conveying mechanism. After the alignment is completed, the first pushing member 132 pushes the current circuit board 200 away from the positioning area 110a and catches up with the previous circuit board 200. In this embodiment, the second driving member 121 also adopts a linear motor. The second driving member 121 is arranged on the frame 140 along the second direction. It can be understood that due to the inconsistent size specifications of different circuit boards 200, a second pushing member 122 and a positioning member 123 are provided to push circuit boards 200 of different specifications along the second direction until they abut against the positioning member 123 to complete positioning.

[0058] In one embodiment, the positioning member 123 includes a mounting plate 1231 and a second guide wheel 1232 , and a plurality of second guide wheels 1232 are rotatably disposed on the mounting plate 1231 and arranged at intervals along the first direction to abut against the circuit board 200 ;

[0059] And / or, the second pushing member 122 includes a second connecting plate 1221 and a third guide wheel 1222, the second connecting plate 1221 is drivingly connected to the second driving member 121, and a plurality of third guide wheels 1222 are rotatably disposed on a side of the second connecting plate 1221 facing the loading and conveying mechanism 110 and are arranged at intervals along the first direction for pushing the circuit board 200.

[0060] like Figure 7 and Figure 8As shown, in one embodiment of the present invention, the positioning member 123 includes a mounting plate 1231 and a second guide wheel 1232, and the second pushing member 122 includes a second connecting plate 1221 and a third guide wheel 1222. Specifically, the mounting plate 1231 extends along the first direction and is arranged on one side of the feeding conveying mechanism 110. A plurality of rotatable second guide wheels 1232 are arranged at intervals along the first direction on the mounting plate 1231; and the second connecting plate 1221 also extends along the first direction and is provided with a plurality of rotatable third guide wheels 1222 at intervals. When the circuit board 200 enters the positioning area 110a, the second driving member 121 drives the second connecting plate 1221 to rotate. The plate 1221 moves toward the positioning member 123, and the multiple third guide wheels 1222 abut against the side of the circuit board 200 parallel to the first direction and push it toward the positioning member 123. The side of the circuit board 200 parallel to the second direction slides and abuts against the first guide wheel 1322, and the side of the circuit board 200 away from the third guide wheel 1222 abuts against the multiple second guide wheels 1232 to complete the positioning. At this time, the first pushing member 132 pushes the circuit board 200 along the first direction, and the two sides of the circuit board 200 parallel to the first direction slide and abut against the second guide wheel 1232 and the third guide wheel 1222 respectively, which can reduce wear and extend the life of the equipment.

[0061] In one embodiment, the loading conveying mechanism 110 includes a plurality of rollers 111, which are arranged at intervals along a first direction to form a conveying line, and a plurality of friction wheels 112 are provided at intervals on each roller 111. The rollers 111 are used to drive the friction wheels 112 to rotate, so that the friction wheels 112 drive the circuit board 200 to move along the first direction.

[0062] like Figure 3 and Figure 4 As shown, in one embodiment of the present invention, the loading and conveying mechanism 110 includes a plurality of rollers 111. Specifically, the plurality of rollers 111 are arranged side by side along a first direction on a frame 140 to form a conveying line. A plurality of friction wheels 112 are arranged on each roller 111. A driving motor 114 is also arranged on the frame 140. Meshing gears are arranged at the ends of any two adjacent rollers 111. The driving motor 114 drives the plurality of rollers 111 to rotate at the same speed through the gears. The friction wheels 112 are in contact with the bottom of the board surface to drive the circuit board 200 to move. The position where the friction wheels 112 contact the circuit board 200 can adopt a structure such as soft rubber to prevent scratches. The friction wheels 112 are arranged at intervals to form an avoidance space for the first guide wheel 1322 to rise and fall and move to avoid interference.

[0063] In one embodiment, the loading and conveying mechanism 110 also includes a steering support assembly 113 disposed at the positioning mechanism 120, and the steering support assembly 113 includes a bracket 1131 and a guide member 1132. A plurality of guide members 1132 can be movably disposed on the bracket 1131, and are used to slide and abut against the circuit board 200 when the circuit board 200 moves along the first direction or is positioned and moved by the positioning mechanism 120.

[0064] like Figure 7 and Figure 8 As shown, in one embodiment of the present invention, the feeding conveying mechanism 110 further includes a steering support assembly 113 disposed in the positioning area 110a. Specifically, the steering support assembly 113 includes two brackets 1131 and a plurality of guide members 1132 disposed on the two brackets 1131. The guide members 1132 are rollers. The rollers on one of the brackets 1131 are rotatably disposed along a first direction, and the rollers on the other bracket 1131 are rotatably disposed along a second direction. One of the two brackets 1131 is rotatably disposed along a second direction, and one of the two brackets 1131 is rotatably disposed along a second direction. 3, when the first pusher 132 pushes the circuit board 200 to the positioning area 110a, the bottom surface of the circuit board 200 slides and contacts with the guide member 1132 rotatably arranged along the first direction, and when entering the positioning operation, the second lifting device 1133 drives the bracket 1131 connected to itself to rise and fall, so that the guide member 1132 rotatably arranged along the second direction contacts with the bottom surface of the circuit board 200, and when the second pusher 122 pushes the circuit board 200 to move toward the positioning member 123, the bottom surface of the circuit board 200 slides and contacts with the roller rotatably arranged along the second direction. As can be seen from the above, by setting the steering support assembly 113, scratches on the circuit board 200 when it moves or is positioned on the feeding conveying mechanism 110 are avoided, and the product quality of the circuit board 200 is guaranteed.

[0065] In another embodiment of the present invention, the steering support assembly 113 may adopt a bracket 1131, and the guide member 1132 may adopt a universal ball or a universal bead. Multiple universal balls or universal beads are set on the bracket 1131 to abut against the circuit board 200. When the circuit board 200 enters the positioning area 110a and moves, the universal ball or universal bead rotates with the circuit board 200, which can also avoid scraping. Therefore, the specific structure of the bracket 1131 and the guide member 1132 in this solution is not limited.

[0066] The present invention also provides an electroplating device, which includes an electroplating conveying mechanism 310, an electroplating cylinder 320 and a circuit board feeding device 100. Fig. 9 and Fig.10As shown, the electroplating conveying mechanism 310 is disposed in the electroplating cylinder 320, and the electroplating conveying mechanism 310 is docked with the feeding conveying mechanism 110 of the circuit board feeding device 100, and the circuit board 200 moves from the feeding conveying mechanism 110 to the electroplating conveying mechanism 310, and then is clamped by the electroplating conveying mechanism 310 and horizontally moved in the electroplating cylinder 320 for electroplating. The specific structure of the circuit board feeding device 100 refers to the above embodiment, and since the present electroplating equipment adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0067] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A circuit board feeding device, applied to electroplating equipment, characterized in that: The electroplating equipment includes an electroplating conveying mechanism and an electroplating cylinder, wherein the electroplating conveying mechanism is used to drive the circuit board to move in the electroplating cylinder for electroplating, and the circuit board feeding device includes a frame and a feeding conveying mechanism, a positioning mechanism and a pushing mechanism arranged on the frame; The loading conveying mechanism is used for placing the circuit board horizontally and conveying the circuit board to the electroplating conveying mechanism in a horizontal direction; The positioning mechanism is used to position the circuit board on the loading conveying mechanism to a preset position so that the circuit board moves along the first direction to the electroplating conveying mechanism; The pushing mechanism is used to push the circuit board to move along the first direction, so as to adjust the distance between two adjacent circuit boards positioned by the positioning mechanism and arranged along the first direction.

2. The circuit board feeding device according to claim 1, characterized in that: The pushing mechanism includes a first driving member and a first pushing member, the first pushing member is drivingly connected to the first driving member, the first pushing member has a first position and a second position on the first driving member, the positioning mechanism is located between the first position and the second position, and the first driving member is used to drive the first pushing member to move back and forth between the first position and the second position.

3. The circuit board feeding device according to claim 1, characterized in that: The first pushing member includes a first connecting plate and a first guide wheel. The first connecting plate is drivingly connected to the first driving member. A plurality of the first guide wheels are rotatably disposed on a side of the first connecting plate facing the loading and conveying mechanism and are arranged at intervals along the second direction to push the circuit board to move.

4. The circuit board feeding device according to claim 3, characterized in that: The first pusher also includes a first lifting device, through which the first connecting plate is driven and connected to the first driving member, and the first lifting device is used to drive the first connecting plate and the first guide wheel to move along a third direction so that the first guide wheel is close to or away from the feeding conveying mechanism.

5. The circuit board feeding device according to claim 1, characterized in that: The pushing mechanism is used to push the circuit board positioned by the positioning mechanism to move along the first direction so that the distance between the pushed circuit board and the previous circuit board positioned by the positioning mechanism is a preset value L, and the actual distance value between the two circuit boards is D, and L and D satisfy: L-1.5mm≤D≤L+1.5mm.

6. The circuit board feeding device according to any one of claims 1 to 5, characterized in that: The positioning mechanism includes a second driving member, a second pushing member and a positioning member. The positioning member and the second pushing member are respectively arranged on both sides of the loading and conveying mechanism. A positioning area is formed between the second pushing member and the positioning member. The second pushing member is drivingly connected to the second driving member. The second pushing member is used to push the circuit board located in the positioning area to abut against the positioning member.

7. The circuit board feeding device according to claim 6, characterized in that: The positioning member comprises a mounting plate and a second guide wheel, wherein a plurality of the second guide wheels are rotatably disposed on the mounting plate and are arranged at intervals along the first direction for contacting the circuit board; And / or, the second pushing member includes a second connecting plate and a third guide wheel, the second connecting plate is drivingly connected to the second driving member, and a plurality of the third guide wheels are rotatably arranged on the side of the second connecting plate facing the loading and conveying mechanism and are arranged at intervals along the first direction for pushing the circuit board.

8. The circuit board feeding device according to claim 1, characterized in that: The loading and conveying mechanism includes a plurality of rollers, which are arranged at intervals along the first direction to form a conveying line. A plurality of friction wheels are arranged at intervals on each of the rollers. The rollers are used to drive the friction wheels to rotate so that the friction wheels drive the circuit board to move along the first direction.

9. The circuit board feeding device according to claim 1, characterized in that: The loading and conveying mechanism also includes a steering support assembly arranged at the positioning mechanism, and the steering support assembly includes a bracket and a guide member. A plurality of the guide members can be movably arranged on the bracket and are used to slide and abut against the circuit board when the circuit board moves along the first direction or is positioned and moved by the positioning mechanism.

10. An electroplating device, characterized in that: It comprises an electroplating conveying mechanism, an electroplating cylinder and a circuit board feeding device as claimed in any one of claims 1 to 9.

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