Imprint apparatus and method of use thereof

Abstract

The invention provides imprinting equipment and a using method thereof, the imprinting equipment comprises a first imprinting piece, a second imprinting piece and a supporting platform, the first imprinting piece and the second imprinting piece are respectively provided with imprinting areas matched with a wafer, and the wafer is arranged on the imprinting area of the second imprinting piece; the first impressing piece is a flexible impressing piece configured to be capable of covering the wafer; the first imprinting piece is arranged on the supporting platform, the second imprinting piece is arranged on the supporting platform, a plurality of first air holes are formed in the supporting platform, and the first air holes are configured to vacuumize the space between the first imprinting piece and the second imprinting piece when the second imprinting piece is covered with the first imprinting piece. According to the technical scheme, the two surfaces of the wafer can be impressed by the impressing equipment only through one-time impressing, and the impressing efficiency of the impressing equipment on wafer impressing is improved. And in the impressing process, how to avoid damage to the impressed pattern does not need to be considered any more, so that the operation difficulty during wafer impressing is reduced.

Description

Technical Field

[0001] The present application relates to the field of wafer imprinting technology, and in particular to an imprinting device and a method of using the same. Background Art

[0002] Nanoimprint wafer is a nano-processing technology, also known as nanoimprint technology, which is used to prepare wafers with micro-nanoscale pattern structures. This technology forms nanoscale or micron-scale patterns on the wafer surface by imprinting the nanoscale structure on the mold or template onto the wafer surface. Generally speaking, the pattern structure needs to be imprinted on both sides of the wafer. In the existing nanoimprint technology, it is usually necessary to first imprint one side of the wafer and then imprint the second side of the wafer. This makes the imprinting efficiency low. At the same time, in the process of imprinting the second side of the wafer, it is also necessary to avoid damaging the already imprinted pattern, which makes the imprinting operation more difficult. Summary of the invention

[0003] The purpose of the present invention is to provide an imprinting device and a method for using the same, so as to solve the problems of high imprinting efficiency and high operating difficulty of nanoimprint technology in the related art.

[0004] According to a first aspect of an embodiment of the present application, there is provided an imprinting device for imprinting a surface of a wafer, the imprinting device comprising:

[0005] A first stamping member and a second stamping member, wherein the first stamping member and the second stamping member are respectively provided with a stamping area cooperating with the wafer, and the wafer is arranged on the stamping area of ​​the second stamping member; the first stamping member is a flexible stamping member configured to cover the wafer;

[0006] A supporting platform, wherein the second stamping member is arranged on the supporting platform, and a plurality of first air holes are opened on the supporting platform, wherein the first air holes are configured to: when the first stamping member covers the second stamping member, the space between the first stamping member and the second stamping member is evacuated.

[0007] Through the above technical solution, through the first stamping piece that can cover the second stamping piece and the first air hole that can extract air, the stamping equipment can stamp the two surfaces of the wafer with only one stamping, thereby improving the stamping efficiency of the stamping equipment on the wafer. And during the stamping process, there is no need to consider how to avoid damaging the already stamped pattern, which reduces the difficulty of operation during wafer stamping. In addition, the first air hole will extract the air in the space between the first stamping piece and the second stamping piece, so that during the wafer stamping process, the air in the two stamping areas and the surface of the wafer can be effectively discharged, and the pattern stamped on the wafer surface has higher precision, which reduces the poor stamping caused by bubbles left between the stamping area and the surface of the wafer.

[0008] In a specific possible implementation scheme, the stamping device also includes a detection component, which includes a detection piece, a plurality of first detection marks arranged on the first stamping piece, and a plurality of second detection marks arranged on the second stamping piece, the plurality of second detection marks respectively corresponding one-to-one to the plurality of first detection marks, and the detection piece is used to detect whether the second detection marks are aligned with the first detection marks in the vertical direction.

[0009] In a specific possible implementation scheme, the imprinting device also includes a first clamping assembly for clamping and moving the wafer, the first clamping assembly includes a first abutment member and a second abutment member, the first abutment member includes a first manipulator and a first contact piece connected to the first manipulator, the second abutment member includes a second manipulator and a second contact piece connected to the second manipulator, the first contact piece and the second contact piece are arranged opposite to each other, and the first contact piece and the second contact piece respectively have an arc edge matching the shape of the wafer for abutting against the wafer.

[0010] In a specific possible implementation scheme, the support platform also includes a support member arranged on the first air hole, a ventilation channel is opened in the support member, one end of the ventilation channel is connected to the first air hole, and the other end of the ventilation channel is opened on the side wall of the support member.

[0011] In a specific implementation manner, the stamping device further comprises a frame, on which a plurality of suction cups for fixing the first stamping piece are arranged; and the support platform further comprises second air holes for adsorbing and fixing the second stamping piece.

[0012] In a specific possible implementation manner, the imprinting device further comprises a plurality of ultraviolet lamps for curing the imprinting adhesive layer on the wafer, and a portion of the supporting platform corresponding to the imprinting area on the second imprinting member is a transparent structure.

[0013] According to a second aspect of an embodiment of the present application, a method for using an imprinting device is provided, wherein the imprinting device is the imprinting device described in any one of the above;

[0014] placing the wafer on the stamping area of ​​the second stamping member;

[0015] Covering the wafer and the first air hole with the first stamping member;

[0016] The space between the first stamping member and the second stamping member is evacuated through the first air hole.

[0017] Through the above technical solution, through the first stamping piece that can cover the second stamping piece and the first air hole that can extract air, the stamping equipment can stamp the two surfaces of the wafer with only one stamping, thereby improving the stamping efficiency of the stamping equipment on the wafer. And during the stamping process, there is no need to consider how to avoid damaging the already stamped pattern, which reduces the difficulty of operation during wafer stamping. In addition, the first air hole will extract the air in the space between the first stamping piece and the second stamping piece, so that during the wafer stamping process, the air in the two stamping areas and the surface of the wafer can be effectively discharged, and the pattern stamped on the wafer surface has higher precision, which reduces the poor stamping caused by bubbles left between the stamping area and the surface of the wafer.

[0018] In a specific implementation scheme, the wafer includes a wafer body; the imprinting device also includes a plasma device, a glue barrel containing imprinting glue, a vibration component for driving the glue barrel to vibrate, and a second clamping component for clamping and moving the wafer body, and the method also includes:

[0019] Controlling the plasma equipment to spray plasma toward two sides of the wafer;

[0020] Controlling the second clamping assembly to immerse the wafer body in the embossing glue in the glue barrel;

[0021] Controlling the vibration component to drive the rubber barrel to vibrate;

[0022] The wafer body immersed in the embossing glue is taken out by the second clamping assembly.

[0023] In a specific implementation scheme, the stamping device further includes a detection component, the detection component includes a detection member, a plurality of first detection marks arranged on the first stamping member, and a plurality of second detection marks arranged on the second stamping member, the plurality of second detection marks respectively corresponding to the plurality of first detection marks one by one,

[0024] The method further includes: controlling the stamping device to adjust the position of the first stamping member and / or the position of the second stamping member until the detection member detects that the second detection mark is aligned with the corresponding first detection mark.

[0025] In a specific implementation manner, the method further includes: after the wafer imprinting is completed, controlling the first air hole to exhaust.

[0026] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are part of the present invention and are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but do not constitute an improper limitation of the present invention. Obviously, the drawings described below are only some embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the accompanying drawings:

[0028] Figure 1 is a schematic structural diagram of an imprinting device provided in an exemplary embodiment of the present disclosure;

[0029] Figure 2 is a schematic diagram of the use of an imprinting device provided by an exemplary embodiment of the present disclosure;

[0030] Figure 3 is a flowchart of a method for using an imprint device provided by an exemplary embodiment of the present disclosure;

[0031] Figure 4 is a flowchart of another method for using the imprint device provided by an exemplary embodiment of the present disclosure.

[0032] In the figure: 100-first stamping part, 200-second stamping part, 300-stamping area, 400-support platform 400, 401-first air hole, 402-support part, 403-ventilation channel, 404-second air hole, 500-detection part, 501-first detection mark, 502-second detection mark, 600-frame, 601-suction cup, 700-wafer, 701-wafer body, 702-stamping glue layer, 800-ultraviolet lamp.

[0033] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but are intended to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0035] It should be understood that the "multiple" mentioned herein refers to two or more. In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, and A and B exist, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish the same or similar items with basically the same functions and effects. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like do not limit them to be necessarily different. In addition, when the following description involves the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0036] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "inside" and "outside" is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "contacted", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Nanoimprint wafer is a nano-processing technology, also known as nanoimprint technology, which is used to prepare wafers with micro-nanoscale pattern structures. The wafer is usually constructed in the shape of a disc, and imprint glue is provided on both surfaces of the wafer. This technology forms a nanoscale or micron-scale pattern on the surface of the wafer by imprinting the nanoscale structure on the mold or template onto the surface of the wafer. Generally speaking, the mold or template is usually an elastic soft film made of a specific material, on which a nanoscale imprint pattern is formed. The imprint pattern contacts and imprints the surface of the wafer, so that a pattern structure is formed on the surface of the wafer. Generally speaking, the pattern structure needs to be imprinted on both surfaces of the wafer. In the existing nanoimprint technology, it is usually necessary to first imprint one surface of the wafer, and then imprint the second surface of the wafer. In this way, the efficiency of imprinting is low. At the same time, in the process of imprinting the second surface of the wafer, it is also necessary to avoid damaging the imprinted pattern, resulting in a high difficulty in operation when the wafer is imprinted.

[0039] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides an imprinting device for imprinting a surface of a wafer 700 , and the imprinting device includes a first imprinting member 100 , a second imprinting member 200 and a supporting platform 400 .

[0040] The first stamping member 100 and the second stamping member 200 are respectively provided with stamping areas 300 cooperating with the wafer 700. Here, the first stamping member 100 and the second stamping member 200 may respectively have a mold or a template, on which a stamping area 300 with a stamping pattern is formed, and the wafer 700 is arranged on the stamping area 300 of the second stamping member 200; the first stamping member 100 is a flexible stamping member configured to cover the wafer 700. When the first stamping member 100 covers the wafer 700, correspondingly, the stamping area 300 of the first stamping member 100 can also cover the surface of the wafer 700, so that the two surfaces of the wafer 700 can contact the two stamping areas 300 (the stamping area 300 on the first stamping member 100 and the stamping area 300 on the second stamping member 200) respectively. The two imprinting areas 300 can imprint the two surfaces of the wafer 700 at the same time, so that the two surfaces of the wafer 700 can be imprinted at the same time, thereby improving the imprinting efficiency of the wafer 700.

[0041] The second stamping member 200 is disposed on the supporting platform 400, and a plurality of first air holes 401 are provided on the supporting platform 400, wherein the first air holes 401 are configured to: when the first stamping member 100 covers the second stamping member 200, the space between the first stamping member 100 and the second stamping member 200 is vacuumed. When the first stamping member 100 covers the second stamping member 200 and the first air holes 401 vacuumize the space between the first stamping member 100 and the second stamping member 200, the specific configuration can be referred to Figure 2 At this time, when the first imprinting member 100 covers the second imprinting member 200, as the gas between the first imprinting member 100 and the second imprinting member 200 is lost, the imprinting area 300 on the first imprinting member 100 will gradually adhere to the wafer 700 and the second imprinting member 200 due to the flexibility of the first imprinting member 100, thereby realizing the imprinting of the surface of the wafer 700. The first imprinting member 100 will gradually be pressed onto the wafer 700 due to the loss of gas between the first imprinting member 100 and the second imprinting member 200, so that the wafer 700 moves toward the imprinting area 300 on the second imprinting member 200, and the surface of the wafer 700 can gradually abut against the imprinting area 300 on the second imprinting member 200, thereby realizing the imprinting of the imprinting area 300 on the second imprinting member 200 on the surface of the wafer 700. At the same time, the first air hole 401 will draw out the air in the space between the first stamping part 100 and the second stamping part 200, so that during the stamping process of the wafer 700, the air in the two stamping areas 300 and the surface of the wafer 700 can be effectively discharged, and the pattern stamped on the surface of the wafer 700 is more accurate, reducing the poor stamping caused by bubbles left between the stamping area 300 and the surface of the wafer 700.

[0042] Through the above technical solution, through the first stamping piece 100 that can cover the second stamping piece 200 and the first air hole 401 that can extract air, the stamping device can stamp the two surfaces of the wafer 700 with only one stamping, thereby improving the stamping efficiency of the stamping device on the wafer 700. In addition, during the stamping process, it is no longer necessary to consider how to avoid damaging the already stamped pattern, thereby reducing the difficulty of operation during the stamping of the wafer 700. In addition, the first air hole 401 will extract the air in the space between the first stamping piece 100 and the second stamping piece 200, so that during the stamping process of the wafer 700, the air in the two stamping areas 300 and the surface of the wafer 700 can be effectively discharged, and the pattern stamped on the surface of the wafer 700 has a higher precision, thereby reducing the poor stamping caused by bubbles left between the stamping area 300 and the surface of the wafer 700.

[0043] The imprinting device may include a detection component, which includes a detection member 500, a plurality of first detection marks 501 set on the first imprinting member 100, and a plurality of second detection marks 502 set on the second imprinting member 200. The plurality of second detection marks 502 correspond to the plurality of first detection marks 501 one by one. The detection member 500 is used to detect whether the second detection marks 502 are aligned with the first detection marks 501 in the vertical direction. By using the detection component, it is possible to ensure that the two imprinting areas 300 are aligned in a specific direction. Figure 1 For reference, in Figure 1 In the embodiment, when the imprinting device does not imprint the wafer 700, the first imprinting member 100 and the second imprinting member 200 are respectively arranged horizontally, and the wafer 700 needs to be arranged horizontally on the imprinting area 300 of the second imprinting member 200. At this time, the detection member 500 is used to detect whether the second detection mark 502 corresponds to the first detection mark 501 in the vertical direction, which can reflect whether the two imprinting areas 300 are aligned in the vertical direction, that is, when the second detection mark 502 is aligned with the first detection mark 501 in the vertical direction, it means that the two imprinting areas 300 are aligned in the vertical direction. When the first imprinting member 100 covers the second imprinting member 200 and the wafer 700 is arranged on the imprinting area 300 of the second imprinting member 200, the two surfaces of the wafer 700 can be aligned with the two imprinting areas 300 at the same time, ensuring that the two imprinting areas 300 will not have errors with the surface of the wafer 700 during imprinting.

[0044] The detection element 500 here can be an optical detection sensor or a camera, and the first detection mark 501 and the second detection mark 502 can be marks that can respond to light signals. In this way, the positions of the first detection mark 501 and the second detection mark 502 can be detected through the light signals emitted and received by the optical detection sensor, and it is possible to determine whether the second detection mark 502 is aligned with the first detection mark 501; through the camera, the marks can also be photographed, recorded and analyzed, and the positions of the first detection mark 501 and the second detection mark 502 can be detected, and it is possible to determine whether the second detection mark 502 is aligned with the first detection mark 501.

[0045] The imprinting device may further include a first clamping assembly for clamping and moving the wafer 700, the first clamping assembly including a first abutment member and a second abutment member, the first abutment member including a first manipulator and a first contact piece connected to the first manipulator, the second abutment member including a second manipulator and a second contact piece connected to the second manipulator, the first contact piece and the second contact piece being arranged opposite to each other, the first contact piece and the second contact piece respectively having an arc-shaped edge matching the shape of the wafer 700, for abutting against the wafer 700. When the wafer 700 is arranged between the first abutment member and the second abutment member, and the first manipulator and the second manipulator respectively drive the first contact piece and the second contact piece to approach each other, the first contact piece and the second contact piece will respectively abut against the wafer 700 to clamp the wafer 700, for example, referring to Figure 1 And Figure 1 The drawing direction is referenced. Figure 1 In the embodiment, the wafer 700 is arranged horizontally, and the first contact piece and the second contact piece abut against the wafer 700 in the left and right directions to clamp the horizontally arranged wafer 700. Moreover, the first manipulator and the second manipulator move simultaneously to drive the wafer 700 to move. When the wafer 700 needs to be stamped, the first abutment member and the second abutment member can move the wafer 700 to the second stamping member 200. When the stamping of the wafer 700 is completed, the first abutment member and the second abutment member can transfer the wafer 700 from the second stamping member 200.

[0046] The support platform 400 may also include a support member 402 disposed on the first air hole 401, a ventilation channel 403 is provided in the support member 402, one end of the ventilation channel 403 is connected to the first air hole 401, and the other end of the ventilation channel 403 is provided on the side wall of the support member 402. When the first stamping member 100 covers the second stamping member 200 and the first air hole 401, the support member 402 can ensure that a certain space is formed between the first air hole 401 and the first stamping member 100, so as to avoid the first stamping member 100 blocking the first air hole 401 when the space between the first stamping member 100 and the second stamping member 200 has not yet formed a vacuum. The ventilation channel 403 ensures the communication between the first air hole 401 and the space between the first stamping member 100 and the second stamping member 200, and ensures the use effect of the air hole.

[0047] The stamping device may also include a frame 600, on which a suction cup 601 for fixing the first stamping piece 100 is provided; the support platform 400 may also be provided with a second air hole 404 for adsorbing and fixing the second stamping piece 200. The suction cup 601 here may be an air pump suction cup 601. When the air pump in the air pump suction cup 601 is started, the air inside the suction cup 601 will be sucked out, so that the suction cup 601 forms a negative pressure, so that the first stamping piece 100 is tightly pressed against the suction cup 601, thereby achieving the fixation of the first stamping piece 100. When the first stamping piece 100 needs to be released, for example, when the first stamping piece 100 needs to cover the second stamping piece 200, the air pump can stop pumping air, or inject air into the suction cup 601 to restore the atmospheric pressure, thereby loosening the first stamping piece 100, and the first stamping piece 100 can be separated from the frame 600. Refer to Figure 1 and Figure 2 When the first stamping member 100 and the second stamping member 200 are respectively arranged horizontally and the first stamping member 100 is arranged above the second stamping member 200, when the first stamping member 100 can be separated from the frame 600, the first stamping member 100 can rely on its own gravity to separate from the frame 600, and automatically fall and cover the second stamping member 200.

[0048] The embossing adhesive is usually a photosensitive adhesive, in which a photosensitizer capable of absorbing light of a specific wavelength is provided. When the light of a specific wavelength penetrates into the photosensitive adhesive, the photosensitizer is activated, causing cross-linking or photochemical reaction to occur, thereby solidifying the photosensitive adhesive. Therefore, when the embossing device is in use, the embossing device may also include a plurality of ultraviolet lamps 800, which can generate light of a specific wavelength. After the wafer 700 is embossed, the ultraviolet lamps 800 may be irradiated on the two embossing areas 300, and the ultraviolet rays can penetrate the first embossing part 100 and the second embossing part 200, and quickly solidify the embossing adhesive layer 702 on the wafer 700. Among them, the portion on the support platform 400 corresponding to the embossing area 300 on the second embossing part 200 is a transparent structure. The transparent structure ensures that the ultraviolet rays can penetrate the support platform 400, so that the ultraviolet rays can penetrate the second embossing part 200 and penetrate into the embossing adhesive.

[0049] like Figure 3 to Figure 4 As shown, an embodiment of the present application further provides a method for using an imprinting device, wherein the imprinting device is an imprinting device of any of the above embodiments; the method comprises:

[0050] Step S100: disposing the wafer 700 on the imprinting area 300 of the second imprinting member 200; specifically, the wafer 700 may be disposed on the imprinting area 300 of the second imprinting member 200 by a first clamping assembly.

[0051] Step S200 : controlling the first imprinting member 100 to cover the wafer 700 and the first air hole 401 , so that a space can be formed between the first imprinting member 100 and the second imprinting member 200 .

[0052] Step S300 : controlling the first air hole 401 to evacuate the space between the first stamping member 100 and the second stamping member 200 .

[0053] Through the above technical solution, through the first stamping piece 100 that can cover the second stamping piece 200 and the first air hole 401 that can extract air, the stamping device can stamp the two surfaces of the wafer 700 with only one stamping, thereby improving the stamping efficiency of the stamping device on the wafer 700. In addition, during the stamping process, it is no longer necessary to consider how to avoid damaging the already stamped pattern, thereby reducing the difficulty of operation during the stamping of the wafer 700. In addition, the first air hole 401 will extract the air in the space between the first stamping piece 100 and the second stamping piece 200, so that during the stamping process of the wafer 700, the air in the two stamping areas 300 and the surface of the wafer 700 can be effectively discharged, and the pattern stamped on the surface of the wafer 700 has a higher precision, thereby reducing the poor stamping caused by bubbles left between the stamping area 300 and the surface of the wafer 700.

[0054] The wafer 700 may include a wafer body 701. In some embodiments, as described above, the imprinting device may further include a plasma device, a glue barrel, a second clamping component, and a vibration component. In this case, the method of use in the present application further includes: controlling the plasma device to spray plasma toward the two surfaces of the wafer 700; controlling the second clamping component to immerse the wafer body 701 in the imprinting glue in the glue barrel; controlling the vibration component to drive the glue barrel to vibrate; controlling the second clamping component to take out the wafer body 701 immersed in the imprinting glue. In this way, an imprinting glue layer 702 can be formed on both surfaces of the wafer body 701. The plasma device is used to perform surface treatment on the wafer body 701; in this way, plasma will be attached to the two surfaces of the wafer body 701 respectively, and the plasma can ensure that when the wafer body 701 is immersed in the imprinting glue, the imprinting glue can be adsorbed onto the wafer body 701. The rubber barrel contains embossing glue; the second clamping assembly is used to clamp the wafer body 701 and soak the wafer body 701 in the embossing glue; when the wafer body 701 is soaked in the embossing glue, the embossing glue is fully attached to the two surfaces of the wafer body 701 due to the plasma on the two surfaces of the wafer body 701. When the wafer body 701 is taken out of the embossing glue by the second clamping assembly, the two surfaces of the wafer body 701 will be respectively attached with embossing glue, forming a wafer 700 with no embossing structure formed on the two surfaces. Plasma can make the embossing glue fully attached to the two surfaces of the wafer body 701, avoiding that when the wafer body 701 is taken out of the embossing glue, the two surfaces of the wafer body 701 are partially not attached with embossing glue. The vibration assembly can drive the rubber barrel to vibrate. When the wafer body 701 is soaked in the embossing glue, the vibration of the rubber barrel will drive the vibration of the embossing glue, so that the thickness of the embossing glue attached to the two surfaces of the wafer body 701 is uniform.

[0055] The imprinting device may further include a detection component, the detection component including a detection member 500, a plurality of first detection marks 501 disposed on the first imprinting member 100, and a plurality of second detection marks 502 disposed on the second imprinting member 200, wherein the plurality of second detection marks 502 correspond to the plurality of first detection marks 501 one by one, and the method further includes step S400: controlling the imprinting device to adjust the position of the first imprinting member 100 and / or the position of the second imprinting member 200 until the detection member 500 detects that the second detection mark 502 is aligned with the corresponding first detection mark 501. By means of the detection component, it is possible to ensure that the two imprinting areas 300 are aligned in a specific direction, so as to Figure 1 For reference, in Figure 1In the embodiment, when the imprinting device does not imprint the wafer 700, the first imprinting member 100 and the second imprinting member 200 are respectively arranged horizontally, and the wafer 700 needs to be arranged horizontally on the imprinting area 300 of the second imprinting member 200. At this time, the detection member 500 is used to detect whether the second detection mark 502 corresponds to the first detection mark 501 in the vertical direction, which can reflect whether the two imprinting areas 300 are aligned in the vertical direction, that is, when the second detection mark 502 is aligned with the first detection mark 501 in the vertical direction, it means that the two imprinting areas 300 are aligned in the vertical direction. When the first imprinting member 100 covers the second imprinting member 200 and the wafer 700 is arranged on the imprinting area 300 of the second imprinting member 200, the two surfaces of the wafer 700 can be aligned with the two imprinting areas 300 at the same time, ensuring that the two imprinting areas 300 will not have errors with the surface of the wafer 700 during imprinting.

[0056] In a specific implementation scheme, the method may further include step S500: after the wafer 700 is imprinted, the first air hole 401 is controlled to exhaust. When the first air hole 401 is exhausted, gas is added between the first imprinting member 100 and the second imprinting member 200, so that air is generated between the first imprinting member 100 and the wafer 700 and between the second imprinting member 200 and the wafer 700, so that the wafer 700 is easily separated from the first imprinting member 100 and the second imprinting member 200.

[0057] One or more embodiments of this specification are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification should be included in the scope of protection of this disclosure.

[0058] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An imprinting device for imprinting the surface of a wafer, characterized in that: The embossing device comprises: A first stamping member and a second stamping member, wherein the first stamping member and the second stamping member are respectively provided with a stamping area cooperating with the wafer, and the wafer is arranged on the stamping area of ​​the second stamping member; the first stamping member is a flexible stamping member configured to cover the wafer; A supporting platform, wherein the second stamping member is arranged on the supporting platform, and a plurality of first air holes are opened on the supporting platform, wherein the first air holes are configured to: when the first stamping member covers the second stamping member, the space between the first stamping member and the second stamping member is evacuated.

2. The embossing device according to claim 1, characterized in that The stamping device also includes a detection component, which includes a detection piece, a plurality of first detection marks arranged on the first stamping piece, and a plurality of second detection marks arranged on the second stamping piece, wherein the plurality of second detection marks correspond one-to-one to the plurality of first detection marks respectively, and the detection piece is used to detect whether the second detection marks are aligned with the first detection marks in the vertical direction.

3. The imprinting device according to claim 1, characterized in that The imprinting device also includes a first clamping assembly for clamping and moving the wafer, the first clamping assembly includes a first abutment member and a second abutment member, the first abutment member includes a first manipulator and a first contact piece connected to the first manipulator, the second abutment member includes a second manipulator and a second contact piece connected to the second manipulator, the first contact piece and the second contact piece are arranged opposite to each other, and the first contact piece and the second contact piece respectively have an arc edge matching the shape of the wafer for abutting against the wafer.

4. The embossing device according to claim 1, characterized in that The support platform also includes a support member arranged on the first air hole, a ventilation channel is opened in the support member, one end of the ventilation channel is connected to the first air hole, and the other end of the ventilation channel is opened on the side wall of the support member.

5. The imprinting device according to claim 1, characterized in that The stamping device further comprises a frame, on which a plurality of suction cups for fixing the first stamping piece are arranged; and the supporting platform is further provided with second air holes for adsorbing and fixing the second stamping piece.

6. The embossing device according to any one of claims 1 to 5, characterized in that: The imprinting equipment further comprises a plurality of ultraviolet lamps for curing the imprinting adhesive layer on the wafer, and the portion on the supporting platform corresponding to the imprinting area on the second imprinting member is a transparent structure.

7. A method for using an imprinting device, characterized in that: The imprinting device is the imprinting device according to any one of claims 1 to 6; the method comprises: placing the wafer on the stamping area of ​​the second stamping member; Covering the wafer and the first air hole with the first stamping member; The space between the first stamping member and the second stamping member is evacuated through the first air hole.

8. The method of use according to claim 7, characterized in that: The wafer includes a wafer body; the imprinting device also includes a plasma device, a glue barrel containing imprinting glue, a vibration component for driving the glue barrel to vibrate, and a second clamping component for clamping and moving the wafer body, and the method also includes: Controlling the plasma equipment to spray plasma toward two sides of the wafer; Controlling the second clamping assembly to immerse the wafer body in the embossing glue in the glue barrel; Controlling the vibration component to drive the rubber barrel to vibrate; The wafer body immersed in the embossing glue is taken out by the second clamping assembly.

9. The method of use according to claim 7, characterized in that: The imprinting device further includes a detection component, the detection component including a detection member, a plurality of first detection marks arranged on the first imprinting member, and a plurality of second detection marks arranged on the second imprinting member, wherein the plurality of second detection marks correspond to the plurality of first detection marks one by one, respectively. The method further includes: controlling the stamping device to adjust the position of the first stamping member and / or the position of the second stamping member until the detection member detects that the second detection mark is aligned with the corresponding first detection mark.

10. The method of use according to any one of claims 7 to 9, characterized in that: The method further includes: after the wafer imprinting is completed, controlling the first air hole to exhaust air.

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