A vacuum eutectic furnace for chip packaging

Abstract

The present invention relates to the field of semiconductor device processing technology, and specifically to a vacuum eutectic furnace for chip packaging, comprising: a furnace body, a first bracket fixedly installed on the upper end surface of the furnace body, a first lifting drive member fixedly installed in the first bracket, and a sealing device fixedly installed on the upper end surface of the furnace body and at a position away from the first bracket. The present invention drives the chip to descend, allowing the elastic sheet to enter the gap between the solder balls at the chip welding point, and detects the solder balls at the offset position. When the solder balls are offset, the elastic sheet will be squeezed and deformed, and the chip can be raised and then lowered to rotate the elastic sheet, and the vertical spacing between the solder balls is detected to avoid the failure to detect the offset of the solder balls. In this way, when the chip enters the furnace body for welding later, the circuit function abnormality of the chip can be effectively avoided during welding, thereby improving the quality of the furnace body.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor device processing, and in particular to a vacuum eutectic furnace for chip packaging. Background Art

[0002] A vacuum eutectic furnace is a device used for chip packaging and assembly in the electronic manufacturing process, especially for heating and melting solder (such as solder paste or solder balls) during the soldering process to achieve electrical connection between electronic components and circuit boards.

[0003] During the soldering process of BGA packaged chips, solder balls are usually arranged at the bottom of the chip. These solder balls are melted in a vacuum eutectic furnace by heating and form an electrical connection with the pads (base) on the PCB. Taking a vacuum eutectic furnace for chip soldering disclosed in publication number CN221551834U as an example, it can realize the soldering process of the chip and the pad. However, during the solder ball placement process, if the equipment used (such as an automatic ball placement machine) is not accurate enough or is not calibrated accurately, the solder ball may deviate from the predetermined position. This deviation may be caused by a variety of factors, such as insufficient equipment movement accuracy, air pressure fluctuations, inaccurate alignment of the suction nozzle and the pad, etc. The deviation of the solder ball will lead to a series of welding defects, such as solder bridging, cold welding, false welding, voids, etc. These defects will not only affect the electrical connection stability and reliability between the chip and the PCB, but may even cause circuit function abnormalities or complete failure. At present, although the deviation problem during the solder ball placement process has been paid attention to by the industry, the existing technology has not been able to effectively detect and automatically correct the deviation of the solder ball in real time during the welding process in the vacuum eutectic furnace. Therefore, ensuring the accurate placement of the solder ball and the high-precision calibration of the equipment is a key link to ensure welding quality, improve product reliability and reduce failure rates. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a vacuum eutectic furnace for chip packaging, which can effectively solve the problem in the prior art that the solder ball deviation is not detected and automatically corrected in real time during the chip entering the vacuum eutectic furnace for welding.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] The present invention provides a vacuum eutectic furnace for chip packaging, comprising:

[0007] A furnace body, wherein a first bracket is fixedly mounted on the upper end surface of the furnace body, a first lifting drive member is fixedly mounted in the first bracket, and a sealing device is fixedly mounted on the upper end surface of the furnace body and at a position away from the first bracket;

[0008] A feeding assembly, used for driving the chip and the base to move into the furnace body;

[0009] A detection component, the detection component includes an elastic sheet and a detection component, the elastic sheet contacts the welding surface of the chip when being driven to move, and extends into between the solder balls on the chip welding points for detection, and the detection component is used to detect the tension change of the elastic sheet;

[0010] Cleaning component, used to clean the solder balls that are out of position on the chip soldering points;

[0011] The ball planting component is used to re-add solder balls corresponding to the chip welding points and initially solder the solder balls on the chip welding points.

[0012] Preferably, a frame is slidably mounted on the upper end surface of the furnace body, and the frame is fixed to the output end of the first lifting drive member, a linear drive device is fixedly mounted on one side of the frame, and a lifting plate is fixedly mounted on the driving end of the linear drive device, and the lifting plate is composed of two rectangular plates, and a connecting column is rotatably mounted between the two rectangular plates, and a rotating plate is fixedly mounted on the outer wall of the connecting column, and a rotating drive member is fixedly mounted on one side of one of the rectangular plates, and the driving end of the rotating drive member passes through the rectangular plate and is fixedly connected to the connecting column, and a placing frame is fixedly mounted on the lower end of the rotating plate, and a plurality of suction cups are evenly mounted on the inner top end of the placing frame, and two connecting pipes are fixedly mounted on the upper end surface of the rotating plate, and the two connecting pipes are fixedly mounted on the upper end surface of the rotating plate. The lower end of each connecting pipe passes through the rotating plate and is connected to the suction cup, the upper ends of the two connecting pipes are connected with an exhaust pipe, a one-way valve is fixedly installed on the inner wall of the exhaust pipe and away from the connecting pipe, a valve plate is slidably installed in the exhaust pipe, a first spring is fixedly installed between the valve plate and the inner wall of the exhaust pipe, the outer wall of the exhaust pipe is symmetrically connected with two external boxes, a second lifting rod is slidably installed in the external box, a U-shaped frame is fixedly installed on the upper end of the external box, a second spring is fixedly installed between the second lifting rod and the U-shaped frame, an air outlet groove is opened on the outer wall of the second lifting rod, a connecting straight rod is fixedly installed on the lower end of the second lifting rod, and a long plate is fixedly installed on the side of the connecting straight rod away from the exhaust pipe.

[0013] Preferably, a plurality of first lifting rods are evenly installed on the lower end surface of the lifting plate, and a bottom plate is fixedly installed on the lower end surfaces of the plurality of first lifting rods together, a top block is fixedly installed on the upper end surface of the bottom plate and close to the long plate, a feeding trough is provided in the bottom plate, a plurality of long blocks are evenly installed in the feeding trough, a supporting plate is slidably installed in each of the long blocks, a lifting short rod is slidably installed in the long block and at a position away from the supporting plate, a second bracket is sleeved on the outer wall of the lifting short rod and above the long block, a triangular groove is provided in the support plate, one end of the second bracket is slidably connected to the triangular groove, and a third spring is fixedly installed between the second bracket and the long block.

[0014] Preferably, two translation driving devices are slidably installed on both sides of the frame, and a return spring is fixedly installed between the two translation driving devices and the frame, a linkage rod is fixedly installed on the driving end of one of the translation driving devices, a first telescopic rod is fixedly installed on the side of the linkage rod away from the linear driving device, a sliding sleeve is slidably installed on the outer side of the lower end of the first telescopic rod, a cross bar is fixedly installed at a lower position on the side of the sliding sleeve away from the linkage rod, the cross bar is composed of a straight plate and a collar integrally formed with the straight plate, a rotating rod is sleeved on the inner wall of the collar, and the rotating rod is composed of a disk and a short shaft fixed to each other, and the short shaft A threaded groove is provided on the outer wall of the short shaft, and the short shaft is threadedly connected to the collar through the threaded groove. A one-way bearing is fixedly installed on the upper end of the short shaft, and a support plate is fixedly installed on the upper end of the one-way bearing. The support plate is fixedly connected to the detection component, and a C-shaped frame is symmetrically installed on the upper end surface of the support plate and on both sides of the detection component. The C-shaped frame is fixedly connected to the detection component on one side corresponding to the elastic sheet, and the detection end of the detection component is fixedly connected to the elastic sheet. A fourth spring is fixedly installed between the first telescopic rod and the cross bar, and two L-shaped telescopic frames are fixedly installed on both sides of the first telescopic rod, and the two L-shaped telescopic frames are fixedly connected to the disc.

[0015] Preferably, a supporting long rod is fixedly installed on the driving end of one of the translational driving devices, a supporting plate is fixedly installed on the end of the supporting long rod away from the linear driving device, a heating plate is fixedly installed on the upper end surface of the supporting plate and at the middle position, and a brush head is fixedly installed on the upper end surface of the supporting plate and on both sides of the heating plate.

[0016] Preferably, a second lifting drive member is fixedly mounted on the inner top of the frame, a loading tank is fixedly mounted on the lifting end of the second lifting drive member, the loading tank is filled with solder balls, and a solenoid valve is fixedly mounted on the lower end of the loading tank.

[0017] Preferably, two external connecting rods are symmetrically installed on the outer wall of the output end of the second lifting drive member, and the lower ends of the two external connecting rods are rotatably installed with second telescopic rods, and the lower ends of the second telescopic rods are fixedly installed with a mesh plate, the inner bottom end of the mesh plate is provided with mesh holes, and two pairs of feed boxes are symmetrically installed on both sides of the mesh plate.

[0018] Preferably, an air inlet pipe is fixedly mounted on the inner top of the frame and on both sides of the second lifting drive member, an air outlet is fixedly mounted on the lower end surface of the air inlet pipe, and a hot air blower is externally connected to the air inlet pipe.

[0019] Compared with the known prior art, the technical solution provided by the present invention has the following beneficial effects:

[0020] First, by driving the chip to descend, the elastic sheet is allowed to enter the gap between the chip welding point and the solder ball, and the solder ball in the offset position is detected. When the solder ball is offset, the elastic sheet will be squeezed and deformed. The chip rises and then descends again to rotate the elastic sheet, and the vertical spacing between the solder balls is detected to avoid inadequate detection of solder ball offset. In this way, when the chip enters the furnace body for welding later, abnormal circuit function of the chip during welding can be effectively avoided, thereby improving the quality of the furnace body.

[0021] Second, after detecting the offset of the solder ball, another translation drive device is used to drive the supporting long rod to drive the carrier plate to move back and forth under the chip. The heating plate will heat and melt the solder ball, and the brush head will clean the melted solder ball. The welding point of the chip is facing downward, and after melting, the solder ball will be cleaned off from the welding point of the chip due to gravity and the reciprocating cleaning of the brush head.

[0022] Third, after cleaning the solder balls at the chip's soldering points, turn the chip so that its soldering points face upward, open the solenoid valve to allow the solder balls in the loading tank to fall into the mesh, and allow the solder balls to pass through the mesh and accurately fall on the chip's soldering points. Then, use an external hot air blower to blow air to re-melt the solder balls at the chip's soldering points for re-balling. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 It is a side view structural schematic diagram of the present invention;

[0026] Figure 3 It is a schematic diagram of the framework structure of the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the feeding assembly of the present invention;

[0028] Figure 5 It is a schematic diagram of the rotating plate structure of the present invention;

[0029] Figure 6 It is a bottom view structural schematic diagram of the rotating plate of the present invention;

[0030] Figure 7It is a schematic diagram of the exhaust pipe exploded structure of the present invention;

[0031] Figure 8 for Figure 7 The enlarged structural diagram at A in the middle;

[0032] Fig. 9 It is a schematic diagram of the long block structure of the present invention;

[0033] Fig.10 It is a schematic diagram of the structure of the detection component and the cleaning component of the present invention;

[0034] Fig.11 It is a schematic diagram of the structure of the detection assembly of the present invention when viewed from above;

[0035] Fig.12 It is a schematic diagram of the structure of the ball planting assembly of the present invention;

[0036] Fig.13 It is a schematic diagram of the mesh plate structure of the present invention.

[0037] 1. furnace body; 2. first bracket; 3. feeding assembly; 301. frame; 302. first lifting rod; 303. lifting plate; 304. connecting column; 305. rotating plate; 306. placing frame; 307. suction cup; 308. connecting pipe; 309. exhaust pipe; 310. valve plate; 311. first spring; 312. one-way valve; 313. external box; 314. second lifting rod; 315. second spring; 316. air outlet groove; 317. connecting straight rod; 318. long plate; 319. bottom plate; 320. top block; 321. long block; 322. lifting short rod; 323. second bracket; 324. third spring; 325. support plate ; 4. Sealing device; 5. Detection component; 501. Linkage rod; 502. First telescopic rod; 503. Sleeve; 504. Fourth spring; 505. Cross bar; 506. Rotating rod; 507. One-way bearing; 508. Support plate; 509. Elastic sheet; 510. C-shaped frame; 511. Detection component; 512. L-shaped telescopic frame; 6. Cleaning component; 601. Support long rod; 602. Loading plate; 603. Heating plate; 604. Brush head; 7. Ball planting component; 701. Loading tank; 702. Solenoid valve; 703. External rod; 704. Second telescopic rod; 705. Screen plate; 706. Feed box; 707. Air inlet pipe; 708. Air outlet. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] The present invention will be further described below in conjunction with the embodiments.

[0040] Example: Refer to Figures 1 to 13 , a vacuum eutectic furnace for chip packaging, comprising:

[0041] A furnace body 1, a first bracket 2 is fixedly installed on the upper end surface of the furnace body 1, a first lifting drive member is fixedly installed in the first bracket 2, and a sealing device 4 is fixedly installed on the upper end surface of the furnace body 1 and at a position away from the first bracket 2;

[0042] A feeding assembly 3, used for driving the chip and the base to move into the furnace body 1;

[0043] Detection component 5, detection component 5 includes an elastic sheet 509 and a detection component 511. The elastic sheet 509 contacts the welding surface of the chip when being driven to move, and extends into between the solder balls on the chip welding points for detection. The detection component 511 is used to detect the tension change of the elastic sheet 509. The detection component 511 can be used with a strain gauge. The strain gauge is an existing device that indirectly reflects the pressure change on the elastic sheet 509 by measuring the slight deformation on the surface of the elastic sheet 509.

[0044] Cleaning component 6, used for cleaning solder balls that are dislocated on chip soldering points;

[0045] The ball planting assembly 7 is used to re-add solder balls corresponding to the chip soldering points and preliminarily solder the solder balls on the chip soldering points.

[0046] Reference Figures 4 to 8A frame 301 is slidably installed on the upper end surface of the furnace body 1, and the frame 301 is fixed to the output end of the first lifting drive member. A linear drive device is fixedly installed on one side of the frame 301, and a lifting plate 303 is fixedly installed on the driving end of the linear drive device. The lifting plate 303 is composed of two rectangular plates, and a connecting column 304 is rotatably installed between the two rectangular plates. A rotating plate 305 is fixedly installed on the outer wall of the connecting column 304, and a rotating drive member is fixedly installed on one side of one of the rectangular plates. The driving end of the rotating drive member penetrates the rectangular plate and is fixedly connected to the connecting column 304, and a placing frame 306 is fixedly installed on the lower end of the rotating plate 305. A plurality of suction cups 307 are evenly installed on the inner top of the placing frame 306. Two connecting pipes 308 are fixedly installed on the upper end surface of the rotating plate 305. The lower ends of the two connecting pipes 308 penetrate the rotating plate 305 and are connected to the suction cup 307. The upper end is connected to an exhaust pipe 309, a one-way valve 312 is fixedly installed on the inner wall of the exhaust pipe 309 and at a position away from the connecting pipe 308, a valve plate 310 is slidably installed in the exhaust pipe 309, a first spring 311 is fixedly installed between the valve plate 310 and the inner wall of the exhaust pipe 309, the outer wall of the exhaust pipe 309 is symmetrically connected to two external boxes 313, a second lifting rod 314 is slidably installed in the external box 313, a U-shaped frame is fixedly installed on the upper end of the external box 313, a second spring 315 is fixedly installed between the second lifting rod 314 and the U-shaped frame, an air outlet groove 316 is opened on the outer wall of the second lifting rod 314, a connecting straight rod 317 is fixedly installed on the lower end of the second lifting rod 314, a long plate 318 is fixedly installed on the side of the connecting straight rod 317 away from the exhaust pipe 309, and the size of the placement frame 306 can be replaced according to the diameter of the adsorbed chip during the process of the suction cup 307 adsorbing the chip.

[0047] Reference Fig. 9 The lower end surface of the lifting plate 303 is evenly mounted with a plurality of first lifting rods 302, and the lower end surfaces of the plurality of first lifting rods 302 are commonly fixedly mounted with a bottom plate 319, and a top block 320 is fixedly mounted on the upper end surface of the bottom plate 319 and at a position close to the long plate 318, and a material discharge trough is provided in the bottom plate 319, and a plurality of long blocks 321 are evenly mounted in the material discharge trough, and a support plate 325 is slidably mounted in each long block 321, and a lifting short rod 320 is slidably mounted in the long block 321 and at a position away from the support plate 325. 22, the outer wall of the lifting short rod 322 is sleeved with a second bracket 323 above the long block 321, a triangular groove is opened in the support plate 325, one end of the second bracket 323 is slidably connected to the triangular groove, and a third spring 324 is fixedly installed between the second bracket 323 and the long block 321. The multiple support plates 325 can support the base, and when the support plate 325 slides in the long block 321, the substrate will lose the support of the support plate 325 and fall onto the heating carrier in the furnace body 1.

[0048] Reference Figure 10 to Figure 11Two translation driving devices are slidably installed on both sides of the frame 301, and a return spring is fixedly installed between the two translation driving devices and the frame 301. A linkage rod 501 is fixedly installed on the driving end of one of the translation driving devices, and a first telescopic rod 502 is fixedly installed on the side of the linkage rod 501 away from the linear driving device. A sliding sleeve 503 is slidably installed on the outer side of the lower end of the first telescopic rod 502, and a cross bar 505 is fixedly installed at a lower position on the side of the sliding sleeve 503 away from the linkage rod 501. The cross bar 505 is composed of a straight plate and a sleeve integrally formed with the straight plate. A rotating rod 506 is sleeved on the inner wall of the sleeve. The rotating rod 506 is composed of a circular disk and a short shaft fixed to each other. A threaded groove is opened on the outer wall of the short shaft. The short shaft is threadedly connected to the sleeve through the threaded groove. A one-way bearing 507 is fixedly installed on the upper end of the short shaft. A support plate 508 is fixedly connected to a detection component 511, a C-shaped frame 510 is symmetrically installed on the upper end surface of the support plate 508 and on both sides of the detection component 511, the C-shaped frame 510 is fixedly connected to the detection component 511 on one side corresponding to the elastic sheet 509, and the detection end of the detection component 511 is fixedly connected to the elastic sheet 509. A fourth spring 504 is fixedly installed between the first telescopic rod 502 and the cross bar 505. Two L-shaped telescopic frames 512 are fixedly installed on both sides of the first telescopic rod 502, and the two L-shaped telescopic frames 512 are fixedly connected to the disc. The elastic sheet 509 can be made of stainless steel or aluminum alloy material and is designed into a plurality of strip structures, and a total connecting sheet is arranged at both ends of the plurality of strip structures. When one of the elastic sheets 509 is bent, the total connecting sheet will bend, so that the detection component 511 can be detected.

[0049] Reference Fig.10 A supporting long rod 601 is fixedly installed on the driving end of one of the translation driving devices, a supporting long rod 601 is fixedly installed on the end away from the linear driving device, a heating plate 603 is fixedly installed on the upper end surface and in the middle position of the supporting plate 602, a brush head 604 is fixedly installed on the upper end surface of the supporting plate 602 and on both sides of the heating plate 603, the heating plate 603 can adopt a resistance heater, which is the most common heating device, and its working principle is to generate heat when current flows through the resistance material to heat.

[0050] Reference Figure 12 to Figure 13A second lifting drive member is fixedly installed on the inner top of the frame 301, and a loading tank 701 is fixedly installed on the lifting end of the second lifting drive member. The loading tank 701 is filled with solder balls, and a solenoid valve 702 is fixedly installed on the lower end of the loading tank 701. Two external connecting rods 703 are symmetrically installed on the outer wall of the output end of the second lifting drive member. A second telescopic rod 704 is rotatably installed on the lower ends of the two external connecting rods 703. A mesh plate 705 is fixedly installed on the lower end of the second telescopic rod 704. A mesh is opened at the inner bottom end of the mesh plate 705, and two pairs of feeding boxes 706 are symmetrically installed on both sides of the mesh plate 705. An air inlet pipe 707 is fixedly installed on the inner top of the frame 301 and on both sides of the second lifting drive member. An air outlet 708 is fixedly installed on the lower end surface of the air inlet pipe 707. The air inlet pipe 707 is externally connected to a hot air blower. The mesh opened on the mesh plate 705 can be adjusted in size and the distance between them through the welding points of the chip, so as to adapt to the chip that needs to be welded.

[0051] The working principle of the present invention is as follows:

[0052] Place the chip with solder balls pre-soldered into the placement frame 306 and press upwards. When the base to be soldered is placed on the support plate 325, the chip will squeeze the suction cup 307 so that the air in the suction cup 307 enters the exhaust pipe 309 through the connecting pipe 308. The air entering the exhaust pipe 309 will push the valve plate 310 to slide in the exhaust pipe 309 and stretch the first spring 311. During the movement of the exhaust pipe 309, the air between the one-way valve 312 and the one-way valve 312 will be squeezed and the air will be squeezed out from the one-way valve 312. When the valve plate 310 stops moving, the outside air cannot enter the one-way valve 312. The air flows back to the exhaust pipe 309 at the valve 312, so the valve plate 310 cannot be retracted and moved in the exhaust pipe 309 by the first spring 311 after being pushed by the air. In this way, the chip will be adsorbed on the lower end of the suction cup 307. The lifting plate 303 is driven down by opening the linear drive device, and the lowered lifting plate 303 will drive the chip to descend together. The translation drive device is opened to drive the linkage rod 501 to drive the first telescopic rod 502 to move. The moving first telescopic rod 502 will drive the cross bar 505 and the rotating rod 506 to descend through the sliding sleeve 503 and slide and press in the sliding sleeve 503. The fourth spring 504 is compressed to drive the support plate 508 and the detection component 511 to move to the right below the chip. The descending chip will drive the solder balls on the soldering points to descend between the elastic sheets 509 to detect the lateral spacing between the solder balls. If the soldering point of the chip is offset, the solder balls will squeeze the elastic sheet 509, causing the elastic sheet 509 to deform, and the tension of the deformed elastic sheet 509 will also change. At this time, the detection components 511 set on both sides of the elastic sheet 509 will detect the tension change of the elastic sheet 509, so as to judge the deviation of the solder balls on the chip soldering points. After the detection of the elastic sheet 509, the linear drive device will drive the chip to rise, and the chip will be separated from the elastic sheet 509. At this time, the compressed fourth spring 504 will drive the cross bar 505 and the sliding sleeve 503 to slide and rise on the outer wall of the first telescopic rod 502. The cross bar 505 will drive the rotating rod 506 to rotate through the threaded connection with the thread groove provided on the outer wall of the short shaft through the ring. The rotating rotating rod 506 will drive the supporting plate 508 and the elastic sheet 509 to rotate 90 degrees together. At this time, the linear drive device will drive the chip to descend again to contact the elastic sheet 509 to detect the vertical spacing between the sweat beads.

[0053] It should be noted that, because the distances between the soldering points of each chip are different, and when the ball is implanted on the soldering point of the chip, the offset range of the solder ball is allowed to have a certain error. For common 0.5mm packages such as QFN and BGA, the solder ball is usually allowed to offset within the range of about ±0.2mm to ±0.25mm. The width design of the elastic sheet 509 needs to calculate the spacing between the chip soldering points, the solder ball diameter, and the solder ball offset range, so as to avoid misjudgment of the elastic sheet 509 during detection;

[0054] When the solder ball is detected to be misaligned, the detection component 5 is driven by the translation drive device to move from the bottom of the chip to one side, and another translation drive device is driven to drive the support rod 601 to drive the carrier plate 602 to move to the bottom of the chip and reciprocate under the chip. At this time, the heating plate 603 is heated to melt the solder ball, and the brush head 604 is cleaned during the reciprocating movement. Because the soldering point of the chip is facing downward, the solder ball will be cleaned from the soldering point of the chip after melting due to gravity and the reciprocating cleaning of the brush head 604, and stick to the brush head 604;

[0055] After cleaning the solder balls, the cleaning component 6 is driven by the translation drive device to move from the bottom of the chip to the other side of the detection component 5, and the rotating plate 305 is driven by the rotary drive member to rotate. The rotating rotating plate 305 will drive the placement frame 306 to rotate together with the chip, so that the chip changes from rotating downward to rotating upward, and the second lifting drive member is opened to drive the mesh plate 705 to descend to fit the welding point of the chip, and the solenoid valve 702 is opened to allow the solder balls filled in the loading tank 701 to fall from the solenoid valve 702 into the mesh plate 705, and fall from the mesh into the position of the corresponding chip welding point. It should be noted that the welding point positions of different chips are different, and the mesh diameter and distance of the mesh plate 705 corresponding to the welding point can be adjusted or replaced according to the welding points of different chips, and the number of solder balls falling in the loading tank 701 when the solenoid valve 702 is opened can be adjusted by adjusting the opening and closing time of the solenoid valve 702, so that the number of solder balls flowing per unit time of the solenoid valve 702 can roughly correspond to the number of chip welding points;

[0056] When the solder ball falls into the mesh 705 and falls on the position of the chip welding point through the mesh, the rotating drive member is turned on to drive the rotating plate 305 and the placement frame 306 to rotate back and forth. When the placement frame 306 rotates back and forth, the mesh 705 is driven to rotate back and forth together. The rotating mesh 705 drives the excess solder balls that fall into the mesh 705 to roll into the feed box 706, so as to clean up the excess solder balls. At this time, the second lifting drive member is turned on to drive the mesh 705 to rotate back and forth. 05 and the loading tank 701 are raised, and then hot air is input into the air inlet pipe 707 through an external hot air blower, and the hot air is blown out from the air outlet 708 to the welding point of the chip, so that the solder ball is melted on the welding point of the chip. It should be noted that after the welding point of the chip is heated and cleaned by the cleaning component 6, the residual temperature will make the solder ball to be re-planted adhere to the welding point (the interval time between cleaning and re-planting is short), so that after the solder ball is subsequently heated and melted, the solder ball will not move with the hot air;

[0057] After the ball is replanted, the chip is driven to rotate downward by the rotating driving member, and the lifting plate 303 is driven to move downward continuously by the linear driving device. During the downward movement, the lifting plate 303 will drive the first lifting rod 302 and the bottom plate 319 to move downward together, and the bottom plate 319 will drive the lifting short rod 322 to contact the carrier plate of the furnace body 1. As the lifting plate 303 continues to move downward, the first lifting rods 302 will slide and shrink. After the first lifting rods 302 have completed shrinking, the downward force of the first lifting rod 302 will be transmitted to the bottom plate 319 to make the bottom plate 319 descend. The descending bottom plate 319 will drive the long block 321 to slide on the outer wall of the lifting short rod 322, allowing the lifting short rod 322 to slide and rise in the long block 321 and stretch the third spring 324. The lifting short rod 322 will drive the second bracket 323 to rise together, and the second bracket 323 is connected to the part that is slidably connected to the triangular groove. The branch will be slidably connected with the triangular groove to drive the support plate 325 to slide in the long block 321, so that the support plate 325 stops supporting the base and allows the base to fall onto the carrier plate, and the continuously descending lifting plate 303 will drive the long plate 318 to contact the top block 320, so that the long plate 318 drives the connecting straight rod 317 and the second lifting rod 314 to slide and rise in the external box 313, and the external air will enter the exhaust pipe 309 through the air outlet groove 316. At this time, the compressed first spring 311 will drive the valve plate 310 to return to its original position in the exhaust pipe 309, and the air squeezed during the movement of the valve plate 310 when returning to its original position will enter the suction cup 307 through the connecting pipe 308, so that the suction cup 307 loses its adsorption force and stops adsorbing the chip, allowing the chip to fall above the base, and finally the frame 301 is raised to the top of the furnace body 1 through the first lifting drive member, and the sealing device 4 is closed to seal the furnace body 1;

[0058] It should be noted that the opening and closing of the electrical components (such as the first lifting drive member, the translation drive device, the second lifting drive member, etc.) used in the vacuum eutectic furnace are all controlled by mature existing control technologies and will not be elaborated here.

[0059] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vacuum eutectic furnace for chip packaging, characterized in that: include: A furnace body (1), a first bracket (2) being fixedly mounted on the upper end surface of the furnace body (1), a first lifting drive member being fixedly mounted inside the first bracket (2), and a sealing device (4) being fixedly mounted on the upper end surface of the furnace body (1) and at a position away from the first bracket (2); A feeding assembly (3) for driving the chip and the base to move into the interior of the furnace body (1), wherein a frame (301) is slidably mounted on the upper end surface of the furnace body (1); A detection component (5), the detection component (5) comprising an elastic sheet (509) and a detection component (511), the elastic sheet (509) being in contact with a soldering surface of a chip when being driven to move, and extending into between solder balls on a soldering point of the chip for detection, the detection component (511) being used to detect changes in tension of the elastic sheet (509); A cleaning component (6) is used to clean solder balls that are misaligned on chip soldering points; A ball planting assembly (7) is used to re-add solder balls corresponding to the chip soldering points and preliminarily solder the solder balls to the chip soldering points; Two translation driving devices are slidably mounted on both sides of the frame (301), and a return spring is fixedly mounted between the two translation driving devices and the frame (301). A linkage rod (501) is fixedly mounted on the driving end of one of the translation driving devices, and a first telescopic rod (502) is fixedly mounted on the side of the linkage rod (501) away from the linear driving device, and a sliding sleeve (503) is slidably mounted on the outer side of the lower end of the first telescopic rod (502), and a cross bar (505) is fixedly mounted at a lower position on the side of the sliding sleeve (503) away from the linkage rod (501), and the cross bar (505) is composed of a straight plate and a sleeve ring integrally formed with the straight plate, and a rotating rod (506) is sleeved on the inner wall of the sleeve ring, and the rotating rod (506) is composed of a disk and a short shaft fixed to each other, and a threaded groove is provided on the outer wall of the short shaft, and the short shaft is screwed into the rotating rod (506) by a screw thread. The groove is threadedly connected to the collar; a one-way bearing (507) is fixedly mounted on the upper end of the short shaft; a support plate (508) is fixedly mounted on the upper end of the one-way bearing (507); the support plate (508) is fixedly connected to the detection component (511); a C-shaped frame (510) is symmetrically mounted on the upper end surface of the support plate (508) and on both sides of the detection component (511); one side of the C-shaped frame (510) corresponding to the elastic sheet (509) is fixedly connected to the detection component (511); a detection end of the detection component (511) is fixedly connected to the elastic sheet (509); a fourth spring (504) is fixedly mounted between the first telescopic rod (502) and the cross bar (505); two L-shaped telescopic frames (512) are fixedly mounted on both sides of the first telescopic rod (502); and the two L-shaped telescopic frames (512) are fixedly connected to the disc; The elastic sheet (509) is made of stainless steel or aluminum alloy and is designed into a plurality of strip structures, and a total connection sheet is provided at both ends of the plurality of strip structures. When one of the elastic sheets (509) bends, the total connection sheet will bend, thereby allowing the detection component (511) to perform detection.

2. The vacuum eutectic furnace for chip packaging according to claim 1, characterized in that: The frame (301) is fixed to the output end of the first lifting drive member, a linear drive device is fixedly installed on one side of the frame (301), a lifting plate (303) is fixedly installed on the driving end of the linear drive device, the lifting plate (303) is composed of two rectangular plates, a connecting column (304) is rotatably installed between the two rectangular plates, a rotating plate (305) is fixedly installed on the outer wall of the connecting column (304), a rotating drive member is fixedly installed on one side of one of the rectangular plates, the driving end of the rotating drive member penetrates the rectangular plate and is fixedly connected to the connecting column (304), a placing frame (306) is fixedly installed on the lower end of the rotating plate (305), a plurality of suction cups (307) are evenly installed on the inner top end of the placing frame (306), two connecting pipes (308) are fixedly installed on the upper end surface of the rotating plate (305), the lower ends of the two connecting pipes (308) penetrate the rotating plate (305) and are connected to the suction cups (307), and the two connecting pipes (308) are fixedly installed on the upper end surface of the rotating plate (305), the lower ends of the two connecting pipes (308) penetrate the rotating plate (305) and are connected to the suction cups (307), and the two connecting pipes (308) are fixedly installed on the upper end surface of the rotating plate (305). The upper end of the pipe (308) is connected to an exhaust pipe (309), a one-way valve (312) is fixedly installed on the inner wall of the exhaust pipe (309) and at a position away from the connecting pipe (308), a valve plate (310) is slidably installed in the exhaust pipe (309), a first spring (311) is fixedly installed between the valve plate (310) and the inner wall of the exhaust pipe (309), and the outer wall of the exhaust pipe (309) is symmetrically connected to two external boxes (313), and the inner wall of the external boxes (313) is provided with a first spring (311). A second lifting rod (314) is slidably mounted, a U-shaped frame is fixedly mounted on the upper end of the external box (313), a second spring (315) is fixedly mounted between the second lifting rod (314) and the U-shaped frame, an air outlet groove (316) is provided on the outer wall of the second lifting rod (314), a connecting straight rod (317) is fixedly mounted on the lower end of the second lifting rod (314), and a long plate (318) is fixedly mounted on the side of the connecting straight rod (317) away from the exhaust pipe (309).

3. The vacuum eutectic furnace for chip packaging according to claim 2, characterized in that: A plurality of first lifting rods (302) are evenly mounted on the lower end surface of the lifting plate (303), a bottom plate (319) is fixedly mounted on the lower end surfaces of the plurality of first lifting rods (302), a top block (320) is fixedly mounted on the upper end surface of the bottom plate (319) and at a position close to the long plate (318), a material discharge trough is provided in the bottom plate (319), a plurality of long blocks (321) are evenly mounted in the material discharge trough, and a support plate is slidably mounted in each of the long blocks (321). (325), a lifting short rod (322) is slidably installed in the long block (321) and at a position away from the support plate (325), a second bracket (323) is sleeved on the outer wall of the lifting short rod (322) and above the long block (321), a triangular groove is opened in the support plate (325), one end of the second bracket (323) is slidably connected to the triangular groove, and a third spring (324) is fixedly installed between the second bracket (323) and the long block (321).

4. The vacuum eutectic furnace for chip packaging according to claim 1, characterized in that: A supporting long rod (601) is fixedly mounted on the driving end of one of the translational driving devices, a supporting plate (602) is fixedly mounted on one end of the supporting long rod (601) away from the linear driving device, a heating plate (603) is fixedly mounted on the upper end surface of the supporting plate (602) and at a middle position, and a brush head (604) is fixedly mounted on the upper end surface of the supporting plate (602) and on both sides of the heating plate (603).

5. The vacuum eutectic furnace for chip packaging according to claim 2, characterized in that: A second lifting drive member is fixedly mounted on the inner top end of the frame (301), a loading tank (701) is fixedly mounted on the lifting end of the second lifting drive member, the loading tank (701) is filled with solder balls, and a solenoid valve (702) is fixedly mounted on the lower end of the loading tank (701).

6. The vacuum eutectic furnace for chip packaging according to claim 5, characterized in that: Two external connecting rods (703) are symmetrically mounted on the outer wall of the output end of the second lifting drive member, and a second telescopic rod (704) is rotatably mounted on the lower ends of the two external connecting rods (703), and a mesh plate (705) is fixedly mounted on the lower end of the second telescopic rod (704), and mesh holes are formed at the inner bottom end of the mesh plate (705), and two pairs of feed boxes (706) are symmetrically mounted on both sides of the mesh plate (705).

7. The vacuum eutectic furnace for chip packaging according to claim 2, characterized in that: An air intake pipe (707) is fixedly installed at the inner top end of the frame (301) and on both sides of the second lifting drive member, an air outlet (708) is fixedly installed on the lower end surface of the air intake pipe (707), and the air intake pipe (707) is externally connected to a hot air blower.

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