High-resolution semiconductor package internal defect detection device

Abstract

The present invention discloses a high-resolution semiconductor package internal defect detection device, which belongs to the field of semiconductor detection technology. A loading and unloading mechanism is arranged outside the detection box, a driving mechanism is arranged on one side of the base, a plurality of placement grooves for placing semiconductor packages are processed on the carrier plate, a clamping mechanism for clamping a plurality of semiconductor packages is arranged on the carrier plate, a light source sleeve for fixing and clamping the light source is arranged on the fifth support plate, a camera is arranged on the sixth support plate, and the camera is located on the upper side of the semiconductor package. The present invention drives the carrier plate to move to the bottom of the light source inside the detection box through the driving mechanism, and performs detection inside the detection box to avoid interference from other light. With the cooperation of the light source, the camera collects images of the semiconductor package on the carrier plate from multiple angles, and the image acquisition system and the image processing system collect and analyze photos at different irradiation angles, thereby automatically detecting defects inside the semiconductor package, which can improve the accuracy of detection.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor detection, and in particular relates to a high-resolution semiconductor package internal defect detection device. Background Art

[0002] High-resolution semiconductor package internal defect detection device is a device used to identify and detect defects in the semiconductor packaging process. Semiconductor packaging is a key step in integrated circuit manufacturing, and the quality of packaging directly affects the performance, reliability and service life of the chip. Therefore, accurate and efficient defect detection is crucial in semiconductor production.

[0003] The semiconductor packaging process mainly includes the following steps: 1. Wafer cutting: Cut the wafer into individual chips. This process requires the use of a cutting machine and is completed through film pasting, cleaning and other steps. 2. Wafer mounting: Paste the cut chip on the base island of the lead frame, usually by high-temperature heating to fix the chip on the base island. 3. Wire bonding: Use extremely fine gold wire or other metal wires to connect the bonding pressure points of the chip to the inner lead angle of the lead frame to complete the circuit connection. 4. Plastic encapsulation: Use plastic materials to encapsulate the chip to protect the circuit and enhance the electrical and thermal performance. This process includes steps such as chip arrangement, loading, mold closing and pressurization, injection molding and curing. 5. Post-assimilation: Deeply process the plastic encapsulated product to improve device performance. 6. Electroplating: Remove the overflow after plastic encapsulation and tin the surface to enhance the reliability and appearance of the product. 7. Rib cutting and molding: Segment and mold the electroplated product. 8. Testing and packaging: After all processes are completed, the finished product is tested and packaged to ensure that the product meets quality requirements. These steps together ensure the whole process of semiconductor chips from wafer to independent package, and each step has an important impact on the performance and reliability of the final product. Therefore, a high-resolution semiconductor package internal defect detection device is needed. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a high-resolution semiconductor package internal defect detection device with automatic loading, automatic unloading and automatic detection, thereby realizing high detection accuracy.

[0005] The technical solution adopted to solve the above technical problems is: a loading and unloading mechanism for loading and unloading semiconductor packages is arranged on the outside of the detection box, a feed port is processed on the detection box, an opening cover for covering the feed port is arranged on the detection box, a base is arranged inside the detection box, and a driving mechanism for driving the seventh support plate to move in the vertical direction and rotate in the circumferential direction is arranged on one side of the base, and at the same time, the driving mechanism drives the seventh support plate from the inside of the detection box through the feed port of the detection box to the loading and unloading mechanism, and drives the opening cover to separate from the feed port of the detection box, a carrier plate is arranged at one end of the seventh support plate, a plurality of placement grooves for placing semiconductor packages are processed on the carrier plate, and a clamping mechanism for clamping a plurality of semiconductor packages is arranged on the carrier plate, a second fixing rod is arranged on the other side of the base, a fifth supporting plate is arranged on the top of the second fixing rod, and a light source sleeve for fixing and clamping a light source is arranged on the fifth supporting plate, the light source is located above the semiconductor package and provides lighting for the semiconductor package, and a sixth support plate located below the fifth support plate is arranged on the second fixing rod , a camera for taking pictures of the semiconductor package is arranged on the sixth support plate, and the camera is located on the upper side of the semiconductor package; the driving mechanism is as follows: a first motor for driving the gear to rotate is arranged at the bottom of the base, an incomplete gear for meshing and transmitting with the gear is rotatably installed on the base, the incomplete gear is fixedly connected to the support seat, a third connecting shaft is arranged on one side of the support seat, a vertical rod is arranged on the support seat, a third sliding ring and a fourth sliding ring are slidably connected to the vertical rod in a vertical direction, the fourth sliding ring is located above the third sliding ring, a third motor for driving the second screw rod to rotate is arranged on the support seat, the second screw rod is threadedly connected to the fourth sliding ring, a sixth connecting shaft is arranged on one side of the fourth sliding ring, the third sliding ring is fixedly connected to the first fixed rod, the first fixed rod is slidably connected to the second sliding ring in a horizontal direction, a second connecting shaft is arranged on one side of the second sliding ring, the sixth connecting shaft is rotatably connected to one end of the second connecting rod, the other end of the second connecting rod is rotatably connected to the second connecting shaft, the second connecting shaft is rotatably connected to one end of the first connecting rod, and the other end of the first connecting rod is rotatably connected to the third connecting shaft.

[0006] Furthermore, a fourth motor driving the first conveyor roller to rotate is arranged inside the detection box, the first conveyor roller is connected to the second conveyor roller through a conveyor belt, the first conveyor roller and the second conveyor roller are respectively connected to the base for rotation, and a plurality of base fabrics are arranged on the conveyor belt.

[0007] Furthermore, the gear is coaxially fixedly connected with the fifth transmission wheel, a second rotating shaft is rotatably installed on the base, a sixth transmission wheel is arranged at the bottom of the second rotating shaft, the fifth transmission wheel is transmission-connected to the sixth transmission wheel through a fifth transmission belt, a first transmission wheel is arranged at the top of the second rotating shaft, a first screw rod is rotatably installed on the outside of the detection box, the first screw rod is threadedly connected to the second transmission wheel, the first transmission wheel is transmission-connected to the second transmission wheel through the first transmission belt, the bottom of the first screw rod is fixedly connected to the opening cover, and a third guide rod is provided on the top of the opening cover, which is slidingly connected to the detection box along a vertical direction.

[0008] Furthermore, the support seat is provided with a second motor that drives the fourth transmission wheel to rotate, the support seat is rotatably installed with a second sleeve shaft, an eighth transmission wheel and a ninth transmission wheel that are coaxially fixedly connected, a fourth connecting shaft is provided on the first sleeve shaft, a second slider is provided on the fourth connecting shaft, a second sliding hole is processed on the second sleeve shaft and is slidably connected to the second slider in a circumferential direction, a first connecting shaft is provided on the other side of the second sliding ring, a first slider is provided on the first connecting shaft, a first sleeve shaft is provided on the outer circumference of the first connecting shaft, and a first hole is processed on the first sleeve shaft and is slidably connected to the first slider in a circumferential direction A sliding hole, a first sleeve shaft is coaxially fixedly connected with the seventh transmission wheel and the third transmission wheel, a fifth connecting shaft is arranged on the other side of the fourth sliding ring, a third slider is arranged on the fifth connecting shaft, a third sleeve shaft is arranged on the outer circumference of the fifth connecting shaft, a third sliding hole is processed on the third sleeve shaft and is slidably connected with the third slider along the circumferential direction, the third sleeve shaft is fixedly connected with the seventh support plate through the tenth transmission wheel, the fourth transmission wheel is transmission-connected with the eighth transmission wheel through the fourth transmission belt, the ninth transmission wheel is transmission-connected with the third transmission wheel through the third transmission belt, and the seventh transmission wheel is transmission-connected with the tenth transmission wheel through the second transmission belt.

[0009] Furthermore, sliding bearings are respectively arranged between the fourth sliding ring and the vertical rod, between the third sliding ring and the vertical rod, and between the second sliding ring and the first fixed rod.

[0010] Further, the loading and unloading mechanism is as follows: a second support frame and a first support frame are arranged on the outside of the detection box body, a slide plate is slidably connected to the first support frame in the horizontal direction, a third support plate and a fourth support plate are fixedly installed on the slide plate, and a second support plate is rotatably installed on the slide plate, a second electric cylinder is arranged on the first support frame, and an output end of the second electric cylinder is fixedly connected to the fourth support plate, a second guide rod is arranged on the first support frame and is slidably connected to the fourth support plate in the horizontal direction, a plurality of second storage slots for placing semiconductor packages to be detected are processed on the third support plate, a first horizontal plane, an inclined plane and a second horizontal plane are processed on both sides of the fourth support plate respectively to conflict with the clamping mechanism, a plurality of first storage slots for placing semiconductor packages after detection are arranged on the second support plate, a plurality of unloading chutes interconnected with the first storage slots are arranged on the side of the second support plate, a first guide rod is arranged on the first support frame and is slidably connected to the first support plate in the horizontal direction, a first electric cylinder is arranged on the first support frame, and an output end of the first electric cylinder is fixedly connected to the first support plate, and a driving plate is arranged on the first support plate to move in the vertical direction. The third electric cylinder, one side of the first support plate is processed with a plurality of second through holes respectively connected to the second electric suction cup in a vertical direction for sliding, each second electric suction cup is provided with a second spring, one end of each second spring is respectively fixedly connected to the second fixing ring, each second electric suction cup is respectively provided with a second fixing ring, the other end of each second spring is respectively fixedly connected to the bottom of the second through hole, the second electric suction cup transports the semiconductor package on the carrier plate to the first storage slot, the other side of the first support plate is processed with a plurality of third through holes respectively connected to the first electric suction cup in a vertical direction for sliding, each first electric suction cup is respectively provided with a first spring, one end of each first spring is respectively fixedly connected to the first fixing ring, each first electric suction cup is respectively provided with a first fixing ring, the other end of each first spring is respectively fixedly connected to the inner bottom surface of the third through hole, the two sides of the pressing plate are respectively processed with first through holes connected to the second electric suction cup and the first electric suction cup in a vertical direction for sliding, the first electric suction cup transports the semiconductor package in the second storage slot to the carrier plate, and the bottom of the pressing plate is respectively in conflict with the plurality of second fixing rings and the plurality of first fixing rings.

[0011] Furthermore, a second support frame is provided on the outside of the detection box, a fixing pin is provided on the second support frame, the second support frame is slidably connected to the first rotating shaft in the horizontal direction, a horizontal slide groove and an inclined slide groove are processed on the first rotating shaft and are slidably connected to the fixing pin, the horizontal slide groove and the inclined slide groove are connected to each other, the first rotating shaft is fixedly connected to the second support plate, the first rotating shaft is rotatably connected to the slide plate, a baffle rod that blocks the second support frame is provided on the first rotating shaft, a slot that is clamped with one end of the spring sheet is processed on the first rotating shaft, and the other end of the spring sheet is clamped with the slide plate.

[0012] Furthermore, the clamping mechanism is as follows: clamping plates are provided on the carrier plate and are slidably connected in the horizontal direction on both sides of the semiconductor package, the two clamping plates clamp the semiconductor package, a sliding rod is provided on each clamping plate, a third spring is provided on each sliding rod, one end of each third spring is fixedly connected to the carrier plate, and the other end of each third spring is fixedly connected to the clamping plate, and rollers are provided at the bottom of each clamping plate and are slidably connected to the first horizontal plane, the inclined plane and the second horizontal plane on both sides of the fourth support plate.

[0013] Furthermore, the sixth support plate is fixedly connected to the second fixing rod via a first bolt, and both sides of the light source sleeve that fixes the light source are fixedly connected via a second bolt.

[0014] Furthermore, the opening of the detection box is connected to the box door via a hinge.

[0015] The beneficial effects of the present invention are as follows: (1) The present invention adopts a driving mechanism to drive the carrier plate to move to the bottom of the light source inside the detection box, and performs detection inside the detection box, which can avoid interference from other light. With the cooperation of the light source, the camera collects multi-angle images of the semiconductor package on the carrier plate, and the image acquisition system and the image processing system collect and analyze photos at different illumination angles, thereby automatically detecting defects inside the semiconductor package, which can improve the accuracy of detection.

[0016] (2) The present invention adopts a driving mechanism that can drive the seventh support plate to move in the vertical direction and rotate in the circumferential direction, and can automatically adjust the height position and angle of the semiconductor package on the seventh support plate. It has the advantage of high stability, reduces the vibration generated by the camera during shooting, and improves image quality.

[0017] (3) The present invention adopts a method in which a semiconductor package on a carrier plate is clamped by a clamping mechanism through a feeding port of the testing box, and then the driving mechanism drives the carrier plate to move to the bottom of a light source inside the testing box for testing. After the testing is completed, the driving mechanism drives the carrier plate to move to the loading and unloading mechanism, and the loading and unloading mechanism transports and unloads the semiconductor package on the carrier plate, thereby completing the functions of automatic loading and unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of an embodiment of a high-resolution semiconductor package internal defect detection device of the present invention.

[0019] Figure 2 yes Figure 1 Schematic diagram of the structure from another angle.

[0020] Figure 3It is a structural schematic diagram of a semiconductor package on a carrier plate located in a loading and unloading mechanism.

[0021] Figure 4 It is a schematic diagram of the structure of the semiconductor package of the carrier tray being located under the camera during the inspection process.

[0022] Figure 5 yes Figure 4 Schematic diagram of the structure from another angle.

[0023] Figure 6 It is a schematic diagram of the structure of the base fabric on the conveyor belt.

[0024] Figure 7 It is a structural diagram of the loading and unloading mechanism.

[0025] Figure 8 yes Figure 7 A schematic structural diagram of the first angle.

[0026] Fig. 9 yes Figure 7 A schematic structural diagram from a second angle.

[0027] Fig.10 It is a schematic diagram of the structure of the carrier plate, the third support plate and the second support plate.

[0028] Fig.11 It is a structural schematic diagram of the first rotating shaft and the second supporting plate.

[0029] Fig.12 It is a structural schematic diagram of the first rotating shaft.

[0030] Fig.13 It is a schematic diagram of the structure of the shrapnel.

[0031] Fig.14 It is a schematic diagram of the parts structure on the first support plate.

[0032] Fig.15 It is a schematic diagram of the structures of the slide plate, the third support plate, the fourth support plate and the second support plate.

[0033] Fig.16 It is a structural schematic diagram of the clamping mechanism.

[0034] Fig.17 yes Fig.16 Schematic diagram of the bottom structure.

[0035] Fig.18 It is a schematic diagram of the structure of the clamping plate and the roller.

[0036] Fig.19 It is a schematic diagram of the structure of the slots placed on the carrier plate.

[0037] Fig. 20It is a structural diagram of the driving mechanism.

[0038] Fig.21 yes Fig. 20 Schematic diagram of the structure from another angle.

[0039] Fig. 22 It is a schematic diagram of the parts structure on the second sliding ring.

[0040] Fig.23 It is a schematic diagram of the parts structure on the support seat.

[0041] Fig.24 It is a schematic diagram of the parts structure on the fourth sliding ring.

[0042] Figure numerals: 1, hinge; 2, box door; 3, detection box; 4, opening cover; 5, loading and unloading mechanism; 501, first storage slot; 502, unloading chute; 503, first electric cylinder; 504, first rotating shaft; 505, first support frame; 506, fixing pin; 507, second support frame; 508, second electric cylinder; 509, first guide rod; 510, first support plate; 511, first fixing ring; 512, pressing plate; 513, first electric suction cup; 514, first spring; 515, second support plate; 516, third support plate; 517, second guide rod; 518, second storage slot; 519, spring; 520, inclined chute; 521, horizontal chute; 522, card slot; 523, stop rod; 52 4. The third electric cylinder; 525. The second fixing ring; 526. The second spring; 527. The second electric suction cup; 528. The first through hole; 529. The second through hole; 530. The fourth support plate; 531. The first horizontal plane; 532. The inclined plane; 533. The second horizontal plane; 534. The third through hole; 535. The slide plate; 6. The feed port; 7. The clamping mechanism; 701. The third spring; 702. The slide bar; 703. The clamping plate; 704. The roller; 8. The driving mechanism; 801. The first transmission wheel; 802. The first transmission belt; 803. The first screw rod; 804. The second transmission wheel; 805. The third guide rod; 806. The second transmission belt; 807. The third transmission wheel; 808. The third transmission belt; 809. The support seat; 81 0, fourth transmission belt; 811, fourth transmission wheel; 812, first motor; 813, gear; 814, fifth transmission wheel; 815, fifth transmission belt; 816, sixth transmission wheel; 817, second motor; 818, second rotating shaft; 819, first connecting rod; 820, first fixed rod; 821, second sliding ring; 822, second connecting rod; 823, incomplete gear; 824, third motor; 825, second screw rod; 826, third sliding ring; 827, fourth sliding ring; 828, first sliding hole; 829, first sleeve shaft; 830, first slider; 831, first connecting shaft; 832, second connecting shaft; 833, third connecting shaft; 834, fourth connecting shaft; 835, second slider; 836 , second sleeve shaft; 837, second slide hole; 838, third slider; 839, third slide hole; 840, third sleeve shaft; 841, fifth connecting shaft; 842, sixth connecting shaft; 843, vertical rod; 844, seventh transmission wheel; 845, eighth transmission wheel; 846, ninth transmission wheel; 847, tenth transmission wheel; 9, light source sleeve; 10, fifth support plate; 11, light source; 12, sixth support plate; 13, first bolt; 14, second fixing rod; 15, fourth motor; 16, conveyor belt; 17, base cloth; 18, base; 19, second bolt; 20, camera; 21, semiconductor package; 22, carrier plate; 23, seventh support plate; 24, first conveyor roller; 25, second conveyor roller; 26, placement groove. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0044] like Figures 1 to 6 , Fig.19 As shown, the high-resolution semiconductor package internal defect detection device of this embodiment is composed of a hinge 1, a box door 2, a detection box 3, an opening cover 4, a loading and unloading mechanism 5, a feed port 6, a clamping mechanism 7, a driving mechanism 8, a light source sleeve 9, a fifth support plate 10, a light source 11, a sixth support plate 12, a first bolt 13, a second fixing rod 14, a fourth motor 15, a conveyor belt 16, a base cloth 17, a base 18, a second bolt 19, a camera 20, a semiconductor package 21, a carrier plate 22, a seventh support plate 23, a first conveying roller 24, a second conveying roller 25, and a placement groove 26.

[0045] The opening of the detection box 3 is connected to the box door 2 through a hinge 1, and a loading and unloading mechanism 5 for loading and unloading the semiconductor package 21 is arranged on the outside of the detection box 3, a feed port 6 is processed on the detection box 3, and an opening cover 4 for covering the feed port 6 is arranged on the detection box 3, a base 18 is arranged inside the detection box 3, and a driving mechanism 8 for driving the seventh support plate 23 to move in the vertical direction and rotate in the circumferential direction is arranged on one side of the base 18, and at the same time, the driving mechanism 8 drives the seventh support plate 23 from the inside of the detection box 3 through the feed port 6 of the detection box 3 to the loading and unloading mechanism 5, and the driving mechanism 8 drives the opening cover 4 to separate from the feed port 6 of the detection box 3, and a carrier plate 22 is arranged at one end of the seventh support plate 23, and a plurality of placements for placing the semiconductor packages 21 are processed on the carrier plate 22 The carrier plate 22 is provided with a clamping mechanism 7 for clamping a plurality of semiconductor packages 21, a second fixing rod 14 is provided on the other side of the base 18, a fifth support plate 10 is provided on the top of the second fixing rod 14, a light source sleeve 9 for fixing and clamping the light source 11 is provided on the fifth support plate 10, the two sides of the light source sleeve 9 for fixing the light source 11 are fixedly connected by second bolts 19, the light source 11 is located above the semiconductor package 21 and provides lighting for the semiconductor package 21, a sixth support plate 12 is provided on the second fixing rod 14 and is located below the fifth support plate 10, the sixth support plate 12 is fixedly connected to the second fixing rod 14 by a first bolt 13, a camera 20 for taking pictures of the semiconductor package 21 is provided on the sixth support plate 12, and the camera 20 is located on the upper side of the semiconductor package 21.

[0046] A fourth motor 15 is arranged inside the detection box 3 to drive the first conveyor roller 24 to rotate. The first conveyor roller 24 is connected to the second conveyor roller 25 through the conveyor belt 16. The first conveyor roller 24 and the second conveyor roller 25 are respectively connected to the base 18 for rotation. A plurality of base fabrics 17 are arranged on the conveyor belt 16.

[0047] like Figures 7 to 15 As shown, the loading and unloading mechanism 5 is composed of a first storage tank 501, a material unloading chute 502, a first electric cylinder 503, a first rotating shaft 504, a first support frame 505, a fixing pin 506, a second support frame 507, a second electric cylinder 508, a first guide rod 509, a first support plate 510, a first fixing ring 511, a pressure plate 512, a first electric suction cup 513, a first spring 514, a second support plate 515, a third support plate 516, a second guide rod 517, the second storage slot 518, the spring piece 519, the inclined slide slot 520, the horizontal slide slot 521, the card slot 522, the blocking rod 523, the third electric cylinder 524, the second fixing ring 525, the second spring 526, the second electric suction cup 527, the first through hole 528, the second through hole 529, the fourth support plate 530, the first horizontal plane 531, the inclined plane 532, the second horizontal plane 533, the third through hole 534, and the slide plate 535 are connected to form a structure.

[0048] The loading and unloading mechanism 5 is as follows: a second support frame 507 and a first support frame 505 are arranged on the outside of the detection box 3, a slide plate 535 is connected to the first support frame 505 in a horizontal sliding direction, a third support plate 516 and a fourth support plate 530 are fixedly installed on the slide plate 535, and the second support plate 515 is rotatably installed on the slide plate 535, a second electric cylinder 508 is arranged on the first support frame 505, and the output end of the second electric cylinder 508 is fixedly connected to the fourth support plate 530, a second guide rod 517 is arranged on the first support frame 505 and is connected to the fourth support plate 530 in a horizontal sliding direction, a plurality of second storage slots 518 for placing the semiconductor packages 21 to be detected are processed on the third support plate 516, and a fourth storage slot 519 is provided on the third support plate 516. The two sides of the support plate 530 are respectively processed with a first horizontal surface 531, an inclined surface 532 and a second horizontal surface 533 that are in conflict with the clamping mechanism 7. The second support plate 515 is provided with a plurality of first storage slots 501 for placing the semiconductor packages 21 after detection. The side of the second support plate 515 is provided with a plurality of unloading chutes 502 that are interconnected with the first storage slots 501. The first support frame 505 is provided with a first guide rod 509 that is slidably connected to the first support plate 510 in the horizontal direction. The first support frame 505 is provided with a first electric cylinder 503, and the output end of the first electric cylinder 503 is fixedly connected to the first support plate 510. The first support plate 510 is provided with a first drive plate 512 to move in the vertical direction. The third electric cylinder 524, a plurality of second through holes 529 are processed on one side of the first support plate 510 and are respectively connected to the second electric suction cup 527 in a sliding manner in the vertical direction, each second electric suction cup 527 is respectively provided with a second spring 526, one end of each second spring 526 is respectively fixedly connected to the second fixing ring 525, each second electric suction cup 527 is respectively provided with a second fixing ring 525, and the other end of each second spring 526 is respectively fixedly connected to the bottom of the second through hole 529, and the second electric suction cup 527 transports the semiconductor package 21 on the carrier plate 22 to the first storage slot 501, and a plurality of second through holes 529 are processed on the other side of the first support plate 510 and are respectively connected to the first electric suction cup 513 in a sliding manner in the vertical direction. There are three through holes 534, and each first electric suction cup 513 is respectively provided with a first spring 514, and one end of each first spring 514 is respectively fixedly connected to the first fixing ring 511, and each first electric suction cup 513 is respectively provided with a first fixing ring 511, and the other end of each first spring 514 is respectively fixedly connected to the inner bottom surface of the third through hole 534, and first through holes 528 are respectively processed on both sides of the pressure plate 512 to be slidably connected to the second electric suction cup 527 and the first electric suction cup 513 in the vertical direction, and the first electric suction cup 513 transports the semiconductor package 21 in the second storage slot 518 to the carrier plate 22, and the bottom of the pressure plate 512 is respectively in contact with multiple second fixing rings 525 and multiple first fixing rings 511.

[0049] A second support frame 507 is arranged on the outside of the detection box body 3, and a fixing pin 506 is arranged on the second support frame 507. The second support frame 507 is slidably connected to the first rotating shaft 504 in the horizontal direction. The first rotating shaft 504 is processed with a horizontal slide groove 521 and an inclined slide groove 520 which are slidably connected to the fixing pin 506. The horizontal slide groove 521 and the inclined slide groove 520 are connected to each other. The first rotating shaft 504 is fixedly connected to the second support plate 515, and the first rotating shaft 504 is rotatably connected to the slide plate 535. A blocking rod 523 which blocks the second support frame 507 is arranged on the first rotating shaft 504. A slot 522 which is engaged with one end of the spring piece 519 is processed on the first rotating shaft 504, and the other end of the spring piece 519 is engaged with the slide plate 535.

[0050] like Figures 16 to 19 As shown, the clamping mechanism 7 is composed of a third spring 701 , a slide bar 702 , a clamping plate 703 , and a roller 704 .

[0051] The clamping mechanism 7 is as follows: clamping plates 703 are slidably connected in the horizontal direction on both sides of the semiconductor package 21 on the carrier plate 22, and the two clamping plates 703 clamp the semiconductor package 21. A slide bar 702 is provided on each clamping plate 703, and a third spring 701 is provided on each slide bar 702. One end of each third spring 701 is fixedly connected to the carrier plate 22, and the other end of each third spring 701 is fixedly connected to the clamping plate 703. The bottom of each clamping plate 703 is provided with rollers 704 that are slidably connected to the first horizontal surface 531, the inclined surface 532 and the second horizontal surface 533 on both sides of the fourth support plate 530.

[0052] like Figure 20 to Figure 24As shown, the driving mechanism 8 includes a first transmission wheel 801, a first transmission belt 802, a first screw rod 803, a second transmission wheel 804, a third guide rod 805, a second transmission belt 806, a third transmission wheel 807, a third transmission belt 808, a support seat 809, a fourth transmission belt 810, a fourth transmission wheel 811, a first motor 812, a gear 813, a fifth transmission wheel 814, a fifth transmission belt 815, a sixth transmission wheel 816, a second motor 817, a second rotating shaft 818, a first connecting rod 819, a first fixed rod 820, a second sliding ring 821, a second connecting rod 822, an incomplete gear 823, The third motor 824, the second screw rod 825, the third sliding ring 826, the fourth sliding ring 827, the first sliding hole 828, the first sleeve shaft 829, the first slider 830, the first connecting shaft 831, the second connecting shaft 832, the third connecting shaft 833, the fourth connecting shaft 834, the second slider 835, the second sleeve shaft 836, the second sliding hole 837, the third slider 838, the third sliding hole 839, the third sleeve shaft 840, the fifth connecting shaft 841, the sixth connecting shaft 842, the vertical rod 843, the seventh transmission wheel 844, the eighth transmission wheel 845, the ninth transmission wheel 846, and the tenth transmission wheel 847 are connected to form a structure.

[0053] The driving mechanism 8 is as follows: a first motor 812 for driving a gear 813 to rotate is provided at the bottom of the base 18, an incomplete gear 823 meshing with the gear 813 is rotatably installed on the base 18, the incomplete gear 823 is fixedly connected to the support seat 809, a third connecting shaft 833 is provided on one side of the support seat 809, a vertical rod 843 is provided on the support seat 809, a third sliding ring 826 and a fourth sliding ring 827 are slidably connected to the vertical rod 843 in a vertical direction, the fourth sliding ring 827 is located above the third sliding ring 826, and sliding bearings are respectively provided between the fourth sliding ring 827 and the vertical rod 843 and between the third sliding ring 826 and the vertical rod 843. The support seat 809 is provided with a third motor 824 for driving the second screw rod 825 to rotate. The second screw rod 825 is threadedly connected to the fourth sliding ring 827. A sixth connecting shaft 842 is provided on one side of the fourth sliding ring 827. The third sliding ring 826 is fixedly connected to the first fixed rod 820. The first fixed rod 820 is slidably connected to the second sliding ring 821 in the horizontal direction. A sliding bearing is provided between the second sliding ring 821 and the first fixed rod 820. A second connecting shaft 832 is provided on one side of the second sliding ring 821. The sixth connecting shaft 842 is rotatably connected to one end of the second connecting rod 822. The other end of the second connecting rod 822 is rotatably connected to the second connecting shaft 832. The second connecting shaft 832 is rotatably connected to one end of the first connecting rod 819. The other end of the first connecting rod 819 is rotatably connected to the third connecting shaft 833.

[0054] The gear 813 is coaxially fixedly connected with the fifth transmission wheel 814, a second rotating shaft 818 is rotatably installed on the base 18, a sixth transmission wheel 816 is arranged at the bottom of the second rotating shaft 818, the fifth transmission wheel 814 is transmission-connected with the sixth transmission wheel 816 through a fifth transmission belt 815, a first transmission wheel 801 is arranged at the top of the second rotating shaft 818, a first screw rod 803 is rotatably installed on the outer side of the detection box 3, the first screw rod 803 is threadedly connected with the second transmission wheel 804, the first transmission wheel 801 is transmission-connected with the second transmission wheel 804 through a first transmission belt 802, the bottom of the first screw rod 803 is fixedly connected with the opening cover 4, and a third guide rod 805 is provided on the top of the opening cover 4 which is slidably connected with the detection box 3 in a vertical direction.

[0055] The support seat 809 is provided with a second motor 817 that drives the fourth transmission wheel 811 to rotate. The support seat 809 is rotatably installed with a second sleeve shaft 836, an eighth transmission wheel 845 and a ninth transmission wheel 846 that are coaxially fixedly connected. The first sleeve shaft 829 is provided with a fourth connecting shaft 834. The fourth connecting shaft 834 is provided with a second slider 835. The second sleeve shaft 836 is processed with a second sliding hole 837 that is slidably connected to the second slider 835 along the circumferential direction. The other side of the second sliding ring 821 is provided with a first connecting shaft 831. The first connecting shaft 831 is provided with a first slider 830. The first sleeve shaft 829 is provided on the outer circumference of the first connecting shaft 831. The first sleeve shaft 829 is processed with a first sliding hole 828 that is slidably connected to the first slider 830 along the circumferential direction. The sleeve shaft 829 is coaxially fixedly connected with the seventh transmission wheel 844 and the third transmission wheel 807. A fifth connecting shaft 841 is arranged on the other side of the fourth sliding ring 827. A third slider 838 is arranged on the fifth connecting shaft 841. A third sleeve shaft 840 is arranged on the outer circumference of the fifth connecting shaft 841. A third sliding hole 839 is processed on the third sleeve shaft 840 to be slidably connected with the third slider 838 along the circumferential direction. The third sleeve shaft 840 is fixedly connected with the seventh support plate 23 through the tenth transmission wheel 847. The fourth transmission wheel 811 is transmission-connected with the eighth transmission wheel 845 through the fourth transmission belt 810. The ninth transmission wheel 846 is transmission-connected with the third transmission wheel 807 through the third transmission belt 808. The seventh transmission wheel 844 is transmission-connected with the tenth transmission wheel 847 through the second transmission belt 806.

[0056] The working principle of this embodiment is as follows: the driving mechanism 8 drives the carrier plate 22 to move to the loading and unloading mechanism 5, and at the same time, the driving mechanism 8 drives the opening cover 4 to separate from the feeding port 6 of the detection box 3, the loading and unloading mechanism 5 places the semiconductor package 21 on the carrier plate 22, the loading and unloading mechanism 5 is separated from the semiconductor package 21, and the clamping mechanism 7 clamps the semiconductor package 21 on the carrier plate 22, and the driving mechanism 8 drives the carrier plate 22 to move to below the light source 11 inside the detection box 3, and the base cloth 17 is transported to the bottom of the light source 11, and the detection is performed inside the detection box 3 to avoid interference from other light. The driving mechanism 8 can drive the seventh support The plate 23 moves in the vertical direction and rotates in the circumferential direction respectively to adjust the height position and angle of the semiconductor package 21 on the seventh support plate 23. With the cooperation of the light source 11, the camera 20 collects multi-angle images of the semiconductor package 21 on the carrier plate 22. The image acquisition system and the image processing system collect and analyze photos at different illumination angles. The image acquisition system and the image processing system adopt well-known technologies to detect defects inside the semiconductor package 21. After the detection, the driving mechanism 8 drives the carrier plate 22 to move to the loading and unloading mechanism 5, and the loading and unloading mechanism 5 transports and unloads the semiconductor package 21 on the carrier plate 22.

[0057] The driving mechanism 8 drives the carrier plate 22 to move onto the loading and unloading mechanism 5, and at the same time, the driving mechanism 8 drives the opening cover 4 to separate from the feed port 6 of the detection box 3. The working principle is as follows: the output shaft of the first motor 812 drives the gear 813 to rotate, and the gear 813 drives the incomplete gear 823 to rotate by meshing with the incomplete gear 823, and the incomplete gear 823 drives the parts on the vertical rod 843 to rotate through the support seat 809, and the seventh support plate 23 and the carrier plate 22 on the vertical rod 843 move from the inside of the detection box 3 through the feed port 6 of the detection box 3 to below the first support plate 510, and at the same time, the gear 813 drives the fifth transmission wheel 814. The fifth transmission wheel 814 drives the sixth transmission wheel 816 to rotate through the fifth transmission belt 815, and the sixth transmission wheel 816 drives the first transmission wheel 801 to rotate through the second rotating shaft 818. The first transmission wheel 801 drives the second transmission wheel 804 to rotate through the first transmission belt 802. Since the first screw rod 803 is threadedly connected with the second transmission wheel 804, the first screw rod 803 moves upward in the vertical direction inside the second transmission wheel 804, and the first screw rod 803 drives the opening cover 4 to move upward in the vertical direction. The third guide rod 805 at the top of the opening cover 4 moves in the vertical direction on the detection box body 3, and the opening cover 4 is separated from the feed port 6 of the detection box body 3.

[0058] Among them, the loading and unloading mechanism 5 places the semiconductor package 21 on the carrier tray 22, the loading and unloading mechanism 5 is separated from the semiconductor package 21, and the clamping mechanism 7 clamps the semiconductor package 21 on the carrier tray 22. The working principle is as follows: the output end of the second electric cylinder 508 drives the slide plate 535, the fourth support plate 530, the second support plate 515 and the third support plate 516 to move in the horizontal direction on the first support frame 505, and the roller 704 at the bottom of the clamping plate 703 slides with the first horizontal plane 531, the inclined plane 532 and the second horizontal plane 533 of the fourth support plate 530 in turn. The two rollers 704 drive the clamping plate 703 to slide in the horizontal direction, and the distance between the two clamping plates 703 increases. At the same time, the semiconductor package 21 in the second storage slot 518 on the third support plate 516 moves to below the first electric suction cup 513, and the output end of the third electric cylinder 524 drives the pressing plate 512 to move in the vertical direction. , the pressing plate 512 moves to contact with the first fixing ring 511, the first fixing ring 511 drives the first electric suction cup 513 to move downward in the vertical direction on the third through hole 534 of the first support plate 510, the first electric suction cup 513 is energized, the output end of the first electric cylinder 503 drives the parts on the first support plate 510 to slide in the horizontal direction on the first guide rod 509, the first electric suction cup 513 transports the semiconductor package 21 in the second storage slot 518 of the third support plate 516 to the placement slot 26 of the carrier plate 22, the output end of the second electric cylinder 508 drives the fourth support plate 530 to move in the opposite direction in the horizontal direction, the roller 704 at the bottom of the clamping plate 703 slides with the second horizontal plane 533, the inclined plane 532 and the first horizontal plane 531 of the fourth support plate 530 in turn, the distance between the two clamping plates 703 is reduced, and the two clamping plates 703 clamp the semiconductor package 21.

[0059] Among them, the driving mechanism 8 can drive the seventh support plate 23 to move in the vertical direction and rotate in the circumferential direction respectively. The working principle of adjusting the height position and angle of the semiconductor package 21 on the seventh support plate 23 is as follows: the output shaft of the third motor 824 drives the second screw rod 825 to rotate. Since the fourth sliding ring 827 is threadedly connected to the second screw rod 825, the fourth sliding ring 827 moves in the vertical direction on the second screw rod 825. The fourth sliding ring 827 drives the second sliding ring 821 to move in the horizontal direction on the first fixed rod 820 through the second connecting rod 822. The second sliding ring 821 drives the first connecting rod 819 to move. The first fixed rod 820 drives the third sliding ring 826 to move in the vertical direction on the vertical rod 843, which can adjust the vertical position of the seventh support plate 23, the carrier plate 22 and the semiconductor package 21 on the fourth sliding ring 827.

[0060] The output shaft of the second motor 817 drives the fourth transmission wheel 811 to rotate, the fourth transmission wheel 811 drives the eighth transmission wheel 845 to rotate through the fourth transmission belt 810, the eighth transmission wheel 845 drives the second sleeve shaft 836 and the ninth transmission wheel 846 to rotate, the second slider 835 of the fourth connecting shaft 834 slides in the second sliding hole 837 of the second sleeve shaft 836, so as to limit the rotation angle of the second sleeve shaft 836, the ninth transmission wheel 846 drives the third transmission wheel 807 to rotate through the third transmission belt 808, the third transmission wheel 807 drives the seventh transmission wheel 844 and the first sleeve shaft 829 to rotate, and the first connecting shaft 834 is connected to the first connecting shaft 834. The first slider 830 of 31 slides in the first sliding hole 828 on the first sleeve shaft 829, so as to limit the rotation angle of the first sleeve shaft 829. The seventh transmission wheel 844 drives the tenth transmission wheel 847 to rotate through the second transmission belt 806. The tenth transmission wheel 847 drives the third sleeve shaft 840 to rotate. The third slider 838 of the fifth connecting shaft 841 slides in the third sliding hole 839 of the third sleeve shaft 840, so as to control the rotation angle of the third sleeve shaft 840. The tenth transmission wheel 847 drives the seventh support plate 23, the carrier tray 22 and the semiconductor package 21 to rotate, so as to adjust the rotation angle of the semiconductor package 21.

[0061] Among them, the driving mechanism 8 drives the carrier plate 22 to move onto the loading and unloading mechanism 5, and the working principle of the loading and unloading mechanism 5 to transport and unload the semiconductor package 21 on the carrier plate 22 is: the same as the working principle of the driving mechanism 8 driving the carrier plate 22 to move onto the loading and unloading mechanism 5, the output end of the third electric cylinder 524 drives the pressing plate 512 to move in the vertical direction, the pressing plate 512 moves to contact with the second fixing ring 525, the second fixing ring 525 drives the second electric suction cup 527 to move downward in the vertical direction on the second through hole 529 of the first support plate 510, the second electric suction cup 527 is energized, and the first The output end of the electric cylinder 503 drives the parts on the first support plate 510 to slide horizontally on the first guide rod 509. The second electric suction cup 527 transports the carrier plate 22 of the semiconductor package 21 to the first storage slot 501. During the process of the slide plate 535 driving the second support plate 515 to retreat, the fixing pin 506 slides to the inclined slot 520 from the horizontal slot 521 of the first rotating shaft 504 in sequence. Under the action of the spring 519, the first rotating shaft 504 drives the second support plate 515 to rotate, and the semiconductor package 21 in the first storage slot 501 moves to the unloading slot 502 for unloading.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. A high-resolution semiconductor package internal defect detection device, characterized in that: A loading and unloading mechanism (5) for loading and unloading semiconductor packages (21) is arranged outside the detection box (3); a feeding port (6) is machined on the detection box (3); an opening cover (4) for shielding the feeding port (6) is arranged on the detection box (3); a base (18) is arranged inside the detection box (3); a driving mechanism (8) for driving the seventh support plate (23) to move in a vertical direction and a circumferential direction is arranged on one side of the base (18); at the same time, the driving mechanism (8) drives the seventh support plate (23) from the inside of the detection box (3) through the feeding port (6) of the detection box (3) to the loading and unloading mechanism (5), and drives the opening cover (4) to separate from the feeding port (6) of the detection box (3); a carrier plate (22) is arranged at one end of the seventh support plate (23); a plurality of a placement groove (26) for placing semiconductor packages (21), a clamping mechanism (7) for clamping a plurality of semiconductor packages (21) is arranged on the carrier plate (22), a second fixing rod (14) is arranged on the other side of the base (18), a fifth support plate (10) is arranged on the top of the second fixing rod (14), a light source sleeve (9) for fixing and clamping a light source (11) is arranged on the fifth support plate (10), the light source (11) is located above the semiconductor package (21) and provides lighting for the semiconductor package (21), a sixth support plate (12) is arranged on the second fixing rod (14) and is located below the fifth support plate (10), a camera (20) for taking pictures of the semiconductor package (21) is arranged on the sixth support plate (12), and the camera (20) is located on the upper side of the semiconductor package (21); The driving mechanism (8) comprises: a first motor (812) for driving a gear (813) to rotate is arranged at the bottom of the base (18); an incomplete gear (823) meshing with the gear (813) is rotatably mounted on the base (18); the incomplete gear (823) is fixedly connected to a support base (809); a third connecting shaft (833) is arranged on one side of the support base (809); a vertical rod (843) is arranged on the support base (809); a third sliding ring (826) and a fourth sliding ring (827) are slidably connected to the vertical rod (843) in a vertical direction; the fourth sliding ring (827) is located above the third sliding ring (826); a third motor (824) for driving a second screw rod (825) to rotate is arranged on the support base (809); ), the second screw rod (825) is threadedly connected to the fourth sliding ring (827), a sixth connecting shaft (842) is provided on one side of the fourth sliding ring (827), the third sliding ring (826) is fixedly connected to the first fixed rod (820), the first fixed rod (820) is slidably connected to the second sliding ring (821) in the horizontal direction, a second connecting shaft (832) is provided on one side of the second sliding ring (821), the sixth connecting shaft (842) is rotatably connected to one end of the second connecting rod (822), the other end of the second connecting rod (822) is rotatably connected to the second connecting shaft (832), the second connecting shaft (832) is rotatably connected to one end of the first connecting rod (819), and the other end of the first connecting rod (819) is rotatably connected to the third connecting shaft (833).

2. The high-resolution semiconductor package internal defect detection device according to claim 1, characterized in that: A fourth motor (15) for driving a first conveying roller (24) to rotate is arranged inside the detection box (3); the first conveying roller (24) is connected to a second conveying roller (25) via a conveying belt (16); the first conveying roller (24) and the second conveying roller (25) are respectively connected to a base (18) in a rotational manner; and a plurality of base fabrics (17) are arranged on the conveying belt (16).

3. The high-resolution semiconductor package internal defect detection device according to claim 1, characterized in that: The gear (813) is coaxially fixedly connected with the fifth transmission wheel (814); a second rotating shaft (818) is rotatably mounted on the base (18); a sixth transmission wheel (816) is arranged at the bottom of the second rotating shaft (818); the fifth transmission wheel (814) is transmission-connected to the sixth transmission wheel (816) via a fifth transmission belt (815); a first transmission wheel (801) is arranged at the top of the second rotating shaft (818); a first screw rod (803) is rotatably mounted on the outer side of the detection box (3); the first screw rod (803) is threadedly connected to the second transmission wheel (804); the first transmission wheel (801) is transmission-connected to the second transmission wheel (804) via a first transmission belt (802); the bottom of the first screw rod (803) is fixedly connected to the opening cover (4); and a third guide rod (805) is arranged at the top of the opening cover (4) and is slidably connected to the detection box (3) in a vertical direction.

4. The high-resolution semiconductor package internal defect detection device according to claim 1, characterized in that: The support seat (809) is provided with a second motor (817) for driving the fourth transmission wheel (811) to rotate; the support seat (809) is rotatably mounted with a second sleeve shaft (836), an eighth transmission wheel (845) and a ninth transmission wheel (846) that are coaxially fixedly connected; the first sleeve shaft (829) is provided with a fourth connecting shaft (834); the fourth connecting shaft (834) is provided with a second slider (835); the second sleeve shaft (836) is machined with a second sliding hole (837) that is slidably connected to the second slider (835) along a circumferential direction; the other side of the second sliding ring (821) is provided with a first connecting shaft (831); the first connecting shaft (831) is provided with a first slider (830); the first sleeve shaft (829) is located on the outer circumference of the first connecting shaft (831); the first sleeve shaft (829) is machined with a first sliding hole (828) that is slidably connected to the first slider (830) along a circumferential direction; the first The sleeve shaft (829) is coaxially fixedly connected with the seventh transmission wheel (844) and the third transmission wheel (807); a fifth connecting shaft (841) is arranged on the other side of the fourth sliding ring (827); a third sliding block (838) is arranged on the fifth connecting shaft (841); a third sleeve shaft (840) is arranged on the outer circumference of the fifth connecting shaft (841); a third sliding hole (839) is processed on the third sleeve shaft (840) and is slidably connected with the third sliding block (838) along the circumferential direction; the third sleeve shaft (840) is fixedly connected with the seventh support plate (23) through the tenth transmission wheel (847); the fourth transmission wheel (811) is transmission-connected with the eighth transmission wheel (845) through the fourth transmission belt (810); the ninth transmission wheel (846) is transmission-connected with the third transmission wheel (807) through the third transmission belt (808); and the seventh transmission wheel (844) is transmission-connected with the tenth transmission wheel (847) through the second transmission belt (806).

5. The high-resolution semiconductor package internal defect detection device according to claim 1, characterized in that: Sliding bearings are respectively arranged between the fourth sliding ring (827) and the vertical rod (843), between the third sliding ring (826) and the vertical rod (843), and between the second sliding ring (821) and the first fixed rod (820).

6. The high-resolution semiconductor package internal defect detection device according to claim 1, characterized in that: The loading and unloading mechanism (5) comprises: a second support frame (507) and a first support frame (505) are arranged outside the detection box (3); a slide plate (535) is slidably connected to the first support frame (505) in a horizontal direction; a third support plate (516) and a fourth support plate (530) are fixedly installed on the slide plate (535); the second support plate (515) is rotatably installed on the slide plate (535); a second electric cylinder (508) is arranged on the first support frame (505); an output end of the second electric cylinder (508) is fixedly connected to the fourth support plate (530); a second guide rod (517) is slidably connected to the fourth support plate (530) in a horizontal direction on the first support frame (505); the third support plate (516) and the fourth support plate (530) are fixedly installed on the slide plate (535); 6) is processed with a plurality of second storage grooves (518) for placing semiconductor packages (21) to be tested, a first horizontal surface (531), an inclined surface (532) and a second horizontal surface (533) are processed on both sides of the fourth support plate (530) to contact the clamping mechanism (7), a plurality of first storage grooves (501) for placing semiconductor packages (21) after testing are arranged on the second support plate (515), a plurality of unloading chutes (502) interconnected with the first storage grooves (501) are arranged on the side of the second support plate (515), a first guide rod (509) connected to the first support plate (510) in a horizontal sliding direction is arranged on the first support frame (505), and the first support frame (505) is connected to the first support plate (510) in a horizontal sliding direction. ) is provided with a first electric cylinder (503), the output end of the first electric cylinder (503) is fixedly connected to the first support plate (510), the first support plate (510) is provided with a third electric cylinder (524) for driving the pressing plate (512) to move in a vertical direction, a plurality of second through holes (529) are processed on one side of the first support plate (510) and are respectively connected to the second electric suction cups (527) in a sliding manner in a vertical direction, each second electric suction cup (527) is respectively provided with a second spring (526), ​​one end of each second spring (526) is respectively fixedly connected to the second fixing ring (525), each second electric suction cup (527) is respectively provided with a second fixing ring (525), and the other end of each second spring (526) is respectively provided with a second fixing ring (525). The second electric suction cup (527) is respectively fixedly connected to the inner bottom of the second through hole (529), and the semiconductor package (21) on the carrier plate (22) is transported to the first storage slot (501). The other side of the first support plate (510) is processed with a plurality of third through holes (534) respectively connected to the first electric suction cup (513) in a vertical sliding direction. Each first electric suction cup (513) is respectively provided with a first spring (514), and one end of each first spring (514) is respectively fixedly connected to the first fixing ring (511). Each first electric suction cup (513) is respectively provided with a first fixing ring (511), and the other end of each first spring (514) is respectively fixedly connected to the inner bottom surface of the third through hole (534).First through holes (528) are processed on both sides of the pressing plate (512) and are slidably connected to the second electric suction cup (527) and the first electric suction cup (513) in a vertical direction. The first electric suction cup (513) transports the semiconductor package (21) in the second storage slot (518) to the carrier plate (22). The bottom of the pressing plate (512) is respectively in contact with the plurality of second fixing rings (525) and the plurality of first fixing rings (511).

7. The high-resolution semiconductor package internal defect detection device according to claim 6, characterized in that: A second support frame (507) is arranged on the outer side of the detection box (3), a fixing pin (506) is arranged on the second support frame (507), the second support frame (507) is slidably connected to the first rotating shaft (504) along the horizontal direction, a horizontal slide groove (521) and an inclined slide groove (520) which are slidably connected to the fixing pin (506) are processed on the first rotating shaft (504), the horizontal slide groove (521) and the inclined slide groove (520) are communicated with each other, the first rotating shaft (504) is fixedly connected to the second support plate (515), the first rotating shaft (504) is rotatably connected to the slide plate (535), a blocking rod (523) which blocks the second support frame (507) is arranged on the first rotating shaft (504), a slot (522) which is clamped to one end of the spring sheet (519) is processed on the first rotating shaft (504), and the other end of the spring sheet (519) is clamped to the slide plate (535).

8. The high-resolution semiconductor package internal defect detection device according to claim 6, characterized in that: The clamping mechanism (7) comprises: clamping plates (703) are slidably connected in the horizontal direction on both sides of the semiconductor package (21) on the carrier plate (22); the two clamping plates (703) clamp the semiconductor package (21); each clamping plate (703) is provided with a slide bar (702); each slide bar (702) is provided with a third spring (701); one end of each third spring (701) is fixedly connected to the carrier plate (22); the other end of each third spring (701) is fixedly connected to the clamping plate (703); and each clamping plate (703) is provided with a roller (704) at the bottom thereof, which is slidably connected to the first horizontal surface (531), the inclined surface (532) and the second horizontal surface (533) on both sides of the fourth support plate (530).

9. The high-resolution semiconductor package internal defect detection device according to claim 1, characterized in that: The sixth support plate (12) is fixedly connected to the second fixing rod (14) via a first bolt (13), and two sides of the light source sleeve (9) that fixes the light source (11) are fixedly connected via a second bolt (19).

10. The high-resolution semiconductor package internal defect detection device according to claim 1, characterized in that: The opening of the detection box (3) is connected to the box door (2) via a hinge (1).

Images