Semiconductor electrostatic chuck and preparation method thereof

Abstract

A semiconductor electrostatic chuck and a preparation method thereof belong to the field of semiconductor preparation. The semiconductor electrostatic chuck comprises a chuck body, an adsorption assembly and a ventilation assembly. The preparation method comprises the following steps: mounting the sucking disc, assembling the groove body and the communicating pipe, mounting the ejector rod and assembling the top cover. The mounting assembly is used for mounting the electrode assembly, the shell is used as a carrier for stably assembling the electrostatic chuck, the detachable top cover is used for achieving fixation, preparation of the electrostatic chuck is facilitated, the heat dissipation mechanism is arranged for achieving heat dissipation treatment of the electrode assembly, and a channel for airflow circulation is arranged around the electrode assembly, so that the heat dissipation efficiency is improved. Air flow is formed in the middle of the top cover to diffuse outwards, formed negative pressure adsorption can achieve auxiliary fixing of semiconductor materials, and the power of the electrode assembly is reduced; the airflow channel is arranged, airflow is formed in the middle of the top cover to diffuse outwards, meanwhile, the ejector rod is connected with the communicating pipe, adjustment can be conducted according to the adsorption force during machining, the stable adsorption function is ensured, and semiconductor material machining is achieved.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor preparation, and in particular relates to a semiconductor electrostatic chuck and a preparation method thereof. Background Art

[0002] Semiconductor electrostatic chuck is an adsorption device based on the principle of static electricity, which is widely used in semiconductor production lines and precision machining equipment. Semiconductor electrostatic chuck uses the principle of electrostatic adsorption to evenly clamp ultra-thin wafers or other tiny objects. The principle is that when an object with static electricity is close to another object without static electricity, due to electrostatic induction, the object without static electricity will generate a charge of the opposite polarity to the charged object, thereby attracting each other and showing the phenomenon of "electrostatic adsorption". The semiconductor electrostatic chuck generates high-voltage static electricity through an electrostatic generator, and forms an electrostatic magnetic field through an electrostatic adsorption unit to electrostatically adsorb objects. As one of the important equipment in the field of semiconductor manufacturing and precision machining, the semiconductor electrostatic chuck has the advantages of high precision, high efficiency, non-destructiveness, flexibility, environmental protection and energy saving. With the continuous development of the semiconductor industry and the promotion of technological innovation, the semiconductor electrostatic chuck market will continue to grow and show a diversified development trend.

[0003] Electrostatic chucks are crucial in semiconductor processing. Their advantages are:

[0004] 1) Uniform adsorption force;

[0005] 2) Less pollution;

[0006] 3) Can work in vacuum environment.

[0007] The key and difficulty of the electrostatic chuck is temperature control. Take dry etching as an example. Dry etching requires the wafer to be controlled at a specific temperature between 100°C and -70°C to maintain certain etching characteristics. It mainly relies on the following two methods:

[0008] 1) Increase gas convection between the wafer surface and the electrostatic chuck surface to dissipate heat (the cooling gas usually used in semiconductor processes is helium);

[0009] 2) Heat is dissipated through heat conduction on the surface of the electrostatic chuck.

[0010] Semiconductor electrostatic chucks are usually used in processes such as chip packaging, mask handling and wafer processing. When processing wafers, the semiconductor material needs to be placed on the surface of the electrostatic chuck for adsorption and fixation before fine processing. Therefore, the stability of the semiconductor material fixation is crucial. When the existing electrostatic chuck is used, the heat generated by the electrode layer will affect the processing of the semiconductor material. Although the air holes are set to play a role in heat dissipation, when the power of the electrode layer is too large, it is still easy to cause the temperature to rise, affecting the processing quality of the semiconductor. In addition, the adsorption force of the electrostatic chuck is not easy to control stably. After the electrostatic chuck is used for a long time, it is not easy to maintain, which increases the difficulty of disassembly and assembly during maintenance. Summary of the invention

[0011] In order to solve the technical problems that a semiconductor electrostatic chuck is difficult to maintain and heat is not easily dissipated effectively, the present invention provides a semiconductor electrostatic chuck and a preparation method thereof.

[0012] The present invention solves the above technical problems through the following technical solutions:

[0013] The present invention provides a semiconductor electrostatic chuck, the semiconductor electrostatic chuck comprising:

[0014] A suction cup body, the suction cup body comprising a shell, a heat dissipation mechanism fixedly mounted on the bottom of the shell, the heat dissipation mechanism being attached to the bottom surface of the mounting assembly, the mounting assembly being fixedly mounted to the top of the shell by screws, and an electrode assembly being fixedly connected to the inside of the mounting assembly;

[0015] An adsorption component, the adsorption component is movably connected to the top of the shell, the adsorption component is closely connected to the top of the mounting component, and an external diffusion port for air circulation is formed in the middle of the adsorption component;

[0016] The ventilation assembly is composed of a connecting pipe, which is respectively inserted into the shell and the mounting assembly, the connecting pipe is distributed corresponding to the edge of the electrode assembly, and a guide groove connected to the external diffuser is opened on the top of the electrode assembly.

[0017] In the present technical solution, a convex edge is provided on the top of the shell, and a plurality of evenly distributed positioning grooves are provided on the surface of the convex edge, each positioning groove is an L-shaped structure for matching with the adsorption component, and a positioning hole is provided inside the convex edge at the horizontal part of the bottom end of the positioning groove, and the adsorption component is composed of a top cover, and the cross-section of the top cover is a U-shaped structure and is fixedly connected with positioning blocks, and the positioning blocks are evenly distributed on the inner wall of the top cover and corresponding to the positioning grooves, and when the top cover is installed, the positioning blocks are slidably connected to the inside of the positioning grooves, and the top cover and the positioning blocks are both threadedly connected with bolts, and the bolts extend to the inside of the positioning holes on the surface of the convex edge.

[0018] In the present technical solution, the heat dissipation mechanism includes a radiator, which is fixedly installed to the bottom of the outer shell, and is fittedly connected to the bottom of the trough body. The radiator is made of metal and has a number of evenly distributed heat dissipation grooves. The two ends of the radiator are respectively connected with a water inlet pipe and a water outlet pipe, and the water inlet pipe and the water outlet pipe are respectively fixedly connected with the two ends of the heat exchange tube. The heat exchange tube is an S-shaped structure and is distributed inside the heat dissipation groove. The two ends of the bottom of the outer shell are respectively connected with an air inlet pipe and an air outlet pipe, and the air inlet pipe and the air outlet pipe are respectively distributed corresponding to the two sides of the radiator.

[0019] In the present technical solution, the installation assembly includes a trough body, the outer bottom of the trough body is fixedly connected to the side groove, the cross-sections of the trough body and the side groove are both U-shaped structures, the inner wall of the side groove is fixedly connected to the inside of the shell by screws, and a ring-shaped cover plate is provided above the side groove and the trough body, and the cover plate is fixedly connected to the edge of the side groove and the trough body by screws respectively, and an insulating layer is provided on the inner wall of the trough body, and an electrode assembly is fixedly installed inside the trough body above the insulating layer.

[0020] In the present technical solution, the electrode assembly includes a shell, a metal body is fixedly installed inside the shell, a guide plate with a spiral structure is fixedly connected to the edge of the shell, the guide plate is located inside the cavity formed by the shell and the groove body, two centrally symmetrical guide grooves are opened on the top of the shell, and a tip is provided on the top of the shell located between the guide grooves, the tip is fixedly connected to the connecting plate through a connecting rod, and the connecting plate is a flat conical structure.

[0021] In the present technical solution, a metal disk is embedded and installed in the middle part of the top cover, and a plurality of evenly distributed protrusions are provided on the surface of the metal disk. The top cover, the metal disk and the protrusion surfaces are all coated with a coating layer. A channel for air circulation is opened in the middle part of the metal disk, and the channel is connected to the diffuser and is smaller than the diameter of the diffuser. A connecting rod is provided inside the channel, and the inner diameter of the channel is larger than the diameter of the connecting disk, and the connecting disk is located inside the diffuser to form an inclined flow channel that diffuses outward.

[0022] In the present technical solution, two external threads are provided on the surface of the connecting pipe, and the connecting pipe is connected through the internal thread of one of the external thread side grooves, one end of the connecting pipe is movably plugged into the inner wall of the bottom end of the groove body, a sealing ring is sleeved on the surface of the connecting pipe, and the sealing ring is fit-connected to the surface of the groove body, and a blocking block and a sealing plug with an annular structure are movably sleeved on the surface of the connecting pipe, the blocking block is sleeved with another external thread, a sealing plug is fixedly connected to one side of the blocking block, and the sealing plug is chiseled and connected to the inside of the outer shell.

[0023] In the present technical solution, a sleeve is provided on the surface of the connecting pipe, a pressure sensor is movably sleeved inside the sleeve, and the pressure sensor is connected to the inside of the sleeve through a first spring. The inside of the connecting pipe located on one side of the sleeve is movably sleeved with a push rod, and the top of the push rod is respectively inserted through the cover plate and the top cover. The push rod is made of insulating material and is located at the edge of the top cover.

[0024] In the present technical solution, a fixing plate is fixedly connected to the middle part of the push rod, and the fixing plate is connected to the connecting pipe through a second spring, and the second spring is sleeved on the surface of the push rod. A cylinder is fixedly installed on the bottom of the cover plate, and the cylinder is correspondingly arranged on one side of the fixing plate, and the other side of the fixing plate is correspondingly distributed with the pressure sensor. The inside of the fixing plate is movably sleeved with the surface of the guide rod, and the guide rod is fixedly connected to the inside of the side groove.

[0025] In the technical solution, a method for preparing a semiconductor electrostatic chuck is provided, the method comprising the following steps:

[0026] (1) Suction cup installation: fix the heat exchange tube to the inside of the shell, connect the water inlet pipe and the water outlet pipe respectively, install the radiator to the bottom of the shell, and complete the assembly after the heat exchange tube is located inside the heat dissipation groove;

[0027] (2) Assemble the tank body and the connecting pipe. Install the side groove to the inner wall of the shell with screws, so that the bottom of the tank body fits with the radiator. Pass the connecting pipe through the side groove and the bottom of the tank body, so that the sealing ring is against the surface of the tank body to achieve sealing, and the connecting pipe fits against the inner wall of the tank body. Then tighten the block and drive the sealing plug to fit inside the shell to achieve assembly. Finally, install the cover plate to the top of the tank body and the side groove with screws;

[0028] (3) Installation of the mandrel: Before installing the cover plate, the sleeve is glued or welded to the surface of the connecting pipe, and the mandrel is inserted into the connecting pipe to fix the mandrel. When installing the cover plate, it is sleeved on the surface of the mandrel;

[0029] (4) Assemble the top cover, press the top cover against the surface of the cover plate, retract the top cover into the slot, and drive the positioning block to move into place inside the positioning slot. Then rotate the top cover and tighten the bolts to fix it. At this time, the top rod is extended by the second spring, and the metal disk fits with the top of the motor assembly shell. Finally, connect the air inlet pipe to the air pump, connect the water inlet pipe to the water pump, and finally connect the connecting pipe to the air pump to complete the preparation of the semiconductor electrostatic suction cup.

[0030] On the basis of being in accordance with the common sense in the art, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0031] The positive and progressive effects of the present invention are:

[0032] The above-mentioned semiconductor electrostatic chuck and its preparation method use a mounting assembly to install the electrode assembly, use the outer shell as a carrier for stable assembly, and use a detachable top cover to fix it, which can facilitate the assembly of the electrostatic chuck, improve the convenience of disassembly and assembly, and facilitate the preparation of the electrostatic chuck. A heat dissipation mechanism is arranged inside the electrostatic chuck to realize heat dissipation of the electrode assembly, and a channel for air flow is arranged around the electrode assembly, and an air flow is formed in the middle of the top cover to diffuse outward. Negative pressure adsorption is realized by using the Bernoulli principle, which can play a role of partial adsorption force, thereby reducing the power of the electrode assembly and avoiding excessive power that causes the temperature to be unable to dissipate quickly and affect the processing quality of the semiconductor material. At the same time, the push rod and the connecting pipe are connected, and can be adjusted according to the adsorption force during processing to ensure a stable adsorption function and realize the smooth processing of the semiconductor material. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0034] Figure 2 It is a front view schematic diagram of the internal structure of the present invention;

[0035] Figure 3 For the present invention Figure 2 A schematic diagram of the local enlarged structure at point A in the middle;

[0036] Figure 4 It is a front view structural schematic diagram of the connecting pipe of the present invention;

[0037] Figure 5 For the present invention Figure 2 A schematic diagram of the local enlarged structure at B in the middle;

[0038] Figure 6 It is a schematic diagram of the top view of the electrode assembly of the present invention;

[0039] Figure 7 It is a schematic diagram of a half-section structure of the housing of the present invention;

[0040] Figure 8 It is a schematic diagram of the three-dimensional structure of the shell of the present invention;

[0041] Fig. 9 It is a schematic diagram of the three-dimensional structure of the housing of the present invention;

[0042] Fig.10 It is a schematic diagram of the three-dimensional structure of the connecting pipe of the present invention.

[0043] Description of reference numerals:

[0044] 100, suction cup body; 101, housing; 102, convex edge; 103, positioning groove; 104, positioning hole; 105, air inlet pipe; 106, air outlet pipe; 107, radiator; 108, heat sink; 109, water inlet pipe; 110, heat exchange pipe; 111, water outlet pipe;

[0045] 200, installation assembly; 201, tank body; 202, insulation layer; 203, side groove; 204, cover plate;

[0046] 300, electrode assembly; 301, shell; 302, guide plate; 303, guide groove; 304, tip; 305, connecting rod; 306, connecting plate;

[0047] 400, adsorption assembly; 401, top cover; 402, metal plate; 403, coating layer; 404, protrusion; 405, channel; 406, diffuser; 407, positioning block; 408, bolt;

[0048] 500, ventilation assembly; 501, connecting pipe; 502, sleeve; 503, pressure sensor; 504, first spring; 505, push rod; 506, cylinder; 507, second spring; 508, fixing plate; 509, external thread; 510, blocking block; 511, sealing plug; 512, sealing ring; 513, guide rod. DETAILED DESCRIPTION

[0049] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0050] like Figure 1-10 As shown, the semiconductor electrostatic chuck comprises:

[0051] The suction cup body 100 includes a shell 101, a heat dissipation mechanism is fixedly installed at the bottom of the shell 101, and the heat dissipation mechanism is attached to the bottom surface of the mounting assembly 200. The mounting assembly 200 is fixedly installed to the top of the shell 101 by screws, and the electrode assembly 300 is fixedly connected inside the mounting assembly 200;

[0052] The adsorption component 400 is movably connected to the top of the housing 101, the adsorption component 400 is closely connected to the top of the mounting component 200, and an external diffuser for air circulation is formed in the middle of the adsorption component 400;

[0053] The ventilation component 500 is composed of a connecting pipe 501, which is respectively inserted into the outer shell 101 and the installation component 200, and the connecting pipe 501 is distributed corresponding to the edge of the electrode assembly 300, and the top of the electrode assembly 300 is provided with a guide groove 303 connected to the external diffuser.

[0054] A convex edge 102 is provided on the top of the shell 101, and a plurality of evenly distributed positioning grooves 103 are provided on the surface of the convex edge 102. Each positioning groove 103 is an L-shaped structure for matching with the adsorption component 400, and a positioning hole 104 is provided inside the convex edge 102 at the horizontal position at the bottom end of the positioning groove 103. The adsorption component 400 is composed of a top cover 401. The cross-section of the top cover 401 is a U-shaped structure and is fixedly connected with a positioning block 407. The positioning blocks 407 are evenly distributed on the inner wall of the top cover 401 and correspond to the positioning grooves 103. When the top cover 401 is installed, the positioning blocks 407 are slidably connected to the inside of the positioning groove 103. The top cover 401 and the positioning block 407 are both threadedly connected with bolts 408, and the bolts 408 extend to the inside of the positioning hole 104 on the surface of the convex edge 102.

[0055] By adopting such a scheme, the convex edge 102 can be provided to cooperate with the top cover 401, so that the top cover 401 and the outer shell 101 can be socketed to complete the assembly. When the top cover 401 is assembled, the positioning block 407 can be driven to move inside the positioning groove 103. When the positioning block 407 moves to the bottom of the positioning groove 103, the top cover 401 can be rotated to drive the positioning block 407 to move to the horizontal part of the positioning groove 103. At this time, the bolt 408 corresponds to the positioning hole 104. The bolt 408 is tightened to firmly install the top cover 401. When disassembling and assembling, it only needs to tighten the bolt 408 and rotate the top cover 401 to realize disassembly and assembly.

[0056] The heat dissipation mechanism includes a radiator 107, which is fixedly installed on the bottom of the shell 101. The radiator 107 is fitted and connected to the bottom of the slot body 201. The radiator 107 is made of metal and has a number of evenly distributed heat dissipation slots 108. The two ends of the radiator 107 are respectively connected with a water inlet pipe 109 and a water outlet pipe 111. The water inlet pipe 109 and the water outlet pipe 111 are respectively fixedly connected with the two ends of the heat exchange pipe 110. The heat exchange pipe 110 is an S-shaped structure and is distributed inside the heat dissipation slot 108. The two ends of the bottom of the shell 101 are respectively connected with an air inlet pipe 105 and an air outlet pipe 106. The air inlet pipe 105 and the air outlet pipe 106 are respectively distributed corresponding to the two sides of the radiator 107.

[0057] As an extended solution, after the water inlet pipe 109 and the water outlet pipe 111 are connected to an external water pump and a pipeline, the water pump is used to transport cooling water from the water inlet pipe 109 to the heat exchange tube 110 and discharge it from the water outlet pipe 111. The radiator 107 absorbs the heat generated by the electrode assembly 300. At this time, the heat exchange tube 110 adsorbs the heat of the radiator 107 and discharges it, thereby realizing rapid cooling of the heat exchanger. The air inlet pipe 105 is connected to an external air pump. Before the water pump is started, the air pump is started first to allow the outside air to enter the inside of the housing 101 from the air inlet pipe 105, and be discharged from multiple heat dissipation slots 108, and finally discharged from the air outlet pipe 106, thereby realizing the discharge of heat after the radiator 107 absorbs heat.

[0058] The installation component 200 includes a slot body 201, the outer bottom of the slot body 201 is fixedly connected to the side slot 203, the cross-sections of the slot body 201 and the side slot 203 are both U-shaped structures, the inner wall of the side slot 203 is fixedly connected to the inside of the shell 101 by screws, and a cover plate 204 with an annular structure is provided above the side slot 203 and the slot body 201, and the cover plate 204 is fixedly connected to the edge of the side slot 203 and the slot body 201 by screws, and the inner wall of the slot body 201 is provided with an insulating layer 202, and the electrode assembly 300 is fixedly installed inside the slot body 201 above the insulating layer 202.

[0059] As a specific solution, after the heat dissipation mechanism is installed, the slot body 201 and the side slot 203 are installed inside the outer shell 101, and the side slot 203 is fixed to the inner wall of the outer shell 101 by screws, and the insulating layer 202 is used to provide insulation protection between the slot body 201 and the shell 301, and the guide plate 302 on the surface of the shell 301 is installed inside the slot body 201 to realize an air circulation channel, and form an air dissipation channel 405 with the middle of the top cover 401.

[0060] The electrode assembly 300 includes a shell 301, a metal body is fixedly installed inside the shell 301, a guide plate 302 with a spiral structure is fixedly connected to the edge of the shell 301, and the guide plate 302 is located inside the cavity formed by the shell 301 and the groove body 201. Two centrally symmetrical guide grooves 303 are opened on the top of the shell 301, and a tip 304 is provided on the top of the shell 301 located between the guide grooves 303. The tip 304 is fixedly connected to the connecting plate 306 through a connecting rod 305, and the connecting plate 306 is a flat conical structure.

[0061] As a specific solution, after the connecting pipe 501 is installed, the air pump is connected to the connecting pipe 501 to transport the clean gas to the interior of the slot body 201. After being guided by the guide plate 302, the airflow is transported upward in a spiral shape and enters the interior of the guide slot 303, so that the gas enters the interior of the channel 405 from the tip 304, and is guided by the connecting plate 306 to diffuse from the diffuser 406 to the surroundings. When the semiconductor material is adsorbed, it is supported by the protrusion 404, so that the airflow is dispersed in the gap formed between the semiconductor material and the top cover 401, and the airflow tends to flow in a horizontal direction, so that a negative pressure is formed at the bottom of the semiconductor material, thereby improving the adsorption capacity. At this time, the power of the electrode layer can be reduced, and the stable fixation of the semiconductor material can be achieved by electrostatic adsorption and air pressure adsorption.

[0062] A metal plate 402 is embedded in the middle of the top cover 401, and a plurality of evenly distributed protrusions 404 are provided on the surface of the metal plate 402. The surfaces of the top cover 401, the metal plate 402 and the protrusions 404 are coated with a coating layer 403. A channel 405 for air circulation is opened in the middle of the metal plate 402. The channel 405 is connected to the diffuser 406 and is smaller than the diameter of the diffuser 406. A connecting rod 305 is provided inside the channel 405. The inner diameter of the channel 405 is larger than the diameter of the connecting plate 306, and the connecting plate 306 is located inside the diffuser 406 to form an inclined flow channel that diffuses outward.

[0063] With such a scheme, a dielectric layer is formed by coating layer 403 to provide insulation between the semiconductor material and the metal disk 402, and a connecting rod 305 is used to fix the connecting disk 306. When the top cover 401 is installed, the channel 405 and the connecting disk 306 can be smoothly assembled, thereby improving the convenience of assembly and realizing the formation of an air flow channel, so that the formed airflow can not only improve the adsorption capacity of the electrostatic suction cup, but also play a role in heat dissipation of the semiconductor material.

[0064] The connecting tube 501 has two external threads 509 on its surface, and the connecting tube 501 is connected to the internal thread of the groove 203 by one of the external threads 509. One end of the connecting tube 501 is movably plugged into the inner wall of the bottom end of the groove body 201. A sealing ring 512 is sleeved on the surface of the connecting tube 501, and the sealing ring 512 is closely connected to the surface of the groove body 201. A blocking block 510 and a sealing plug 511 with an annular structure are movably sleeved on the surface of the connecting tube 501, and the blocking block 510 is threadedly sleeved on the other external thread 509. A sealing plug 511 is fixedly connected to one side of the blocking block 510, and the sealing plug 511 is chime-connected to the inside of the outer shell 101.

[0065] As a specific solution, when installing the connecting pipe 501, after passing the connecting pipe 501 through the outer shell 101, the side groove 203 and the tank body 201, the connecting pipe 501 is tightened inside the side groove 203 through one of the external threads 509, so that the sealing ring 512 is pressed against the surface of the tank body 201. At this time, the connecting pipe 501 extends to the inside of the tank body 201, and then the blocking block 510 is tightened on one of the external threads 509. At this time, the blocking block 510 drives the sealing plug 511 to be embedded in the inside of the outer shell 101, and the sealing plug 511 is compressed and deformed to fit tightly on the surface of the connecting pipe 501 between the two external threads 509, thereby achieving sealing at the connection, and at the same time facilitating the installation of the connecting pipe 501, so that the air entering through the connecting pipe 501 forms a spiral gas inside the tank body 201 and is discharged.

[0066] The surface of the connecting pipe 501 is provided with a sleeve 502, and a pressure sensor 503 is movably sleeved inside the sleeve 502, and the pressure sensor 503 is connected to the inside of the sleeve 502 through a first spring 504. The inside of the connecting pipe 501 located on one side of the sleeve 502 is movably sleeved with a push rod 505, and the top of the push rod 505 is respectively inserted through the cover plate 204 and the top cover 401. The push rod 505 is made of insulating material and is located at the edge of the top cover 401; the middle of the push rod 505 is fixedly connected to the cover plate 204 and the top cover 401. A fixed plate 508 is connected, and the fixed plate 508 is connected to the connecting pipe 501 through a second spring 507. The second spring 507 is sleeved on the surface of the push rod 505. A cylinder 506 is fixedly installed on the bottom of the cover plate 204. The cylinder 506 is correspondingly arranged on one side of the fixed plate 508, and the other side of the fixed plate 508 is distributed correspondingly to the pressure sensor 503. The fixed plate 508 is movably sleeved on the surface of the guide rod 513 around the inside, and the guide rod 513 is fixedly connected to the inside of the side groove 203.

[0067] As a specific solution, after the connecting pipe 501 is installed, the sleeve 502 is welded or bonded to the surface of the connecting pipe 501, and after the push rod 505 is assembled, the cover plate 204 is installed. At this time, the cylinder 506 will contact the top of the fixed plate 508. Before processing the semiconductor material, the cylinder 506 is shortened. At this time, the elasticity of the second spring 507 pushes the push rod 505 upward. When the semiconductor material is placed on the suction cup by using a bracket, the push rod 505 supports the semiconductor material. The cylinder 506 starts to push the fixed plate 508 downward. At this time, the push rod 505 retracts to stably place the semiconductor material on the surface of the protrusion 404. When the conductor material is adsorbed by electrostatic adsorption and negative pressure, the cylinder 506 is reset and separated from the fixed plate 508. At this time, the push rod 505 is limited by the semiconductor material, and the fixed plate 508 drives the pressure sensor 503 to move downward. At this time, the first spring 504 is in a static state, so that the pressure value detected by the pressure sensor 503 remains stable. When the adsorption force of the semiconductor material changes, the slight vibration of the semiconductor material will cause the value of the pressure sensor 503 to change. At this time, the cylinder 506 extends to contact the fixed plate 508, driving the push rod 505 to separate from the semiconductor material to increase the adsorption force, so that the adsorption pressure can be adjusted during the processing.

[0068] In the technical solution, a method for preparing a semiconductor electrostatic chuck is provided, the method comprising the following steps:

[0069] (1) Suction cup installation: fix the heat exchange tube 110 to the inside of the housing 101, and connect the water inlet pipe 109 and the water outlet pipe 111 respectively. Install the radiator 107 to the bottom of the housing 101, so that the heat exchange tube 110 is located inside the heat dissipation groove 108, and then complete the assembly;

[0070] (2) Assemble the tank body 201 and the connecting pipe 501. Install the side groove 203 to the inner wall of the housing 101 by screws, so that the bottom of the tank body 201 fits with the radiator 107. Pass the connecting pipe 501 through the side groove 203 and the bottom of the tank body 201, so that the sealing ring 512 abuts against the surface of the tank body 201 to achieve sealing, so that the connecting pipe 501 fits against the inner wall of the tank body 201, then tighten the blocking block 510 and drive the sealing plug 511 to fit inside the housing 101 to achieve assembly. Finally, install the cover plate 204 to the tank body 201 and the top of the side groove 203 by screws;

[0071] (3) Installation of the ejector rod 505: Before installing the cover plate 204, the sleeve 502 is bonded or welded to the surface of the connecting pipe 501, and the ejector rod 505 is inserted into the connecting pipe 501 to fix the ejector rod 505. When installing the cover plate 204, the cover plate 204 is sleeved on the surface of the ejector rod 505;

[0072] (4) Assemble the top cover 401. Press the top cover 401 against the surface of the cover plate 204. Retract the top cover 401 into the slot body 201. After the top cover 401 drives the positioning block 407 to move into position inside the positioning slot 103, rotate the top cover 401 and tighten the bolt 408 to fix it. At this time, the top rod 505 is extended by the second spring 507, and the metal disk 402 fits with the top of the housing 301 of the motor assembly. Finally, connect the air inlet pipe 105 to the air pump, connect the water inlet pipe 109 to the water pump, and finally connect the connecting pipe 501 to the air pump to complete the preparation of the semiconductor electrostatic suction cup.

[0073] The present invention is not limited to the above-mentioned embodiments, and any changes in shape or structure are within the protection scope of the present invention. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and essence of the present invention, but these changes and modifications are within the protection scope of the present invention.

Claims

1. A semiconductor electrostatic chuck, characterized in that: include: A suction cup body (100), the suction cup body (100) comprising a shell (101), a heat dissipation mechanism fixedly mounted on the bottom of the shell (101), the heat dissipation mechanism being attached to the bottom surface of the mounting assembly (200), the mounting assembly (200) being fixedly mounted inside the top end of the shell (101), and an electrode assembly (300) being fixedly connected inside the mounting assembly (200); An adsorption component (400), the adsorption component (400) being movably sleeved with the top of the housing (101), the adsorption component (400) being fitted and connected with the top of the mounting component (200), and an external diffusion port for air circulation being formed in the middle of the adsorption component (400); A ventilation assembly (500), the ventilation assembly (500) comprising a connecting pipe (501), the connecting pipe (501) respectively penetrating and plugging into the housing (101) and the mounting assembly (200), the connecting pipe (501) being arranged corresponding to the edge of the electrode assembly (300), and a guide groove (303) communicating with an external diffuser is provided at the top of the electrode assembly (300).

2. The semiconductor electrostatic chuck according to claim 1, wherein: The top of the housing (101) is provided with a convex edge (102), and the surface of the convex edge (102) is provided with a plurality of evenly distributed positioning grooves (103), each positioning groove (103) is an L-shaped structure for matching with the adsorption component (400), and a positioning hole (104) is provided inside the convex edge (102) at the horizontal part of the bottom end of the positioning groove (103), and the adsorption component (400) is composed of a top cover (401), and the cross section of the top cover (401) is U-shaped. The structure is fixedly connected with a positioning block (407), the positioning blocks (407) are evenly distributed on the inner wall of the top cover (401) and are distributed corresponding to the positioning groove (103), and when the top cover (401) is installed, the positioning blocks (407) are slidably connected to the inside of the positioning groove (103), the top cover (401) and the positioning blocks (407) are both threadedly connected to the bolts (408), and the bolts (408) extend to the inside of the positioning holes (104) on the surface of the flange (102).

3. The semiconductor electrostatic chuck according to claim 1, wherein: The heat dissipation mechanism comprises a radiator (107), the radiator (107) being fixedly mounted to the bottom of the housing (101), the radiator (107) being fitted and connected to the bottom of the tank body (201), the radiator (107) being made of metal and being provided with a plurality of evenly distributed heat dissipation slots (108), the two ends of the radiator (107) being respectively connected through a water inlet pipe (109) and a water outlet pipe (111), the water inlet pipe (109) and the water outlet pipe (111) being respectively fixedly connected to the two ends of a heat exchange pipe (110), the heat exchange pipe (110) being an S-shaped structure and being distributed inside the heat dissipation slot (108), the two ends of the bottom of the housing (101) being respectively connected through an air inlet pipe (105) and an air outlet pipe (106), the air inlet pipe (105) and the air outlet pipe (106) being respectively distributed correspondingly to two sides of the radiator (107).

4. The semiconductor electrostatic chuck according to claim 1, wherein: The mounting assembly (200) comprises a trough body (201), the outer bottom of the trough body (201) is fixedly connected to the side trough (203), the cross-sections of the trough body (201) and the side trough (203) are both U-shaped structures, the inner wall of the side trough (203) is fixedly connected to the inside of the housing (101) by means of screws, a cover plate (204) of an annular structure is provided above the side trough (203) and the trough body (201), the cover plate (204) is fixedly connected to the edge of the side trough (203) and the trough body (201) by means of screws, and an insulating layer (202) is provided on the inner wall of the trough body (201), and an electrode assembly (300) is fixedly installed inside the trough body (201) above the insulating layer (202).

5. The semiconductor electrostatic chuck according to claim 4, wherein: The electrode assembly (300) comprises a shell (301), a metal body is fixedly installed inside the shell (301), a guide plate (302) with a spiral structure is fixedly connected to the edge of the shell (301), the guide plate (302) is located inside a cavity formed by the shell (301) and the groove body (201), two centrosymmetrical guide grooves (303) are provided on the top of the shell (301), a tip (304) is provided on the top of the shell (301) between the guide grooves (303), the tip (304) is fixedly connected to a connecting plate (306) via a connecting rod (305), and the connecting plate (306) is a flat conical structure.

6. The semiconductor electrostatic chuck according to claim 2, wherein: A metal disk (402) is embedded and installed in the middle of the top cover (401), and a plurality of evenly distributed protrusions (404) are provided on the surface of the metal disk (402). The surfaces of the top cover (401), the metal disk (402) and the protrusions (404) are all coated with a coating layer (403). A channel (405) for air circulation is opened in the middle of the metal disk (402), and the channel (405) is connected to the diffuser (406) and is smaller than the diameter of the diffuser (406). A connecting rod (305) is provided inside the channel (405), and the inner diameter of the channel (405) is larger than the diameter of the connecting disk (306), and the connecting disk (306) is located inside the diffuser (406) to form an inclined flow channel that diffuses outwards.

7. The semiconductor electrostatic chuck according to claim 1, wherein: The surface of the connecting tube (501) is provided with two external threads (509), and the connecting tube (501) is threadably connected to the inner wall of the side groove (203) through one of the external threads (509). One end of the connecting tube (501) is movably plugged into the inner wall of the bottom end of the groove body (201). A sealing ring (512) is sleeved on the surface of the connecting tube (501), and the sealing ring (512) is closely connected to the surface of the groove body (201). A blocking block (510) and a sealing plug (511) with an annular structure are movably sleeved on the surface of the connecting tube (501), and the blocking block (510) is threadably sleeved with the other external thread (509). A sealing plug (511) is fixedly connected to one side of the blocking block (510), and the sealing plug (511) is chime-connected to the inside of the housing (101).

8. The semiconductor electrostatic chuck according to claim 7, wherein: A sleeve (502) is provided on the surface of the connecting tube (501), a pressure sensor (503) is movably sleeved inside the sleeve (502), and the pressure sensor (503) is connected to the inside of the sleeve (502) via a first spring (504), the inside of the connecting tube (501) located on one side of the sleeve (502) is movably sleeved with a push rod (505), the top of the push rod (505) is respectively inserted through the cover plate (204) and the top cover (401), and the push rod (505) is made of insulating material and is located at the edge of the top cover (401).

9. The semiconductor electrostatic chuck according to claim 8, wherein: A fixing plate (508) is fixedly connected to the middle of the push rod (505), and the fixing plate (508) is connected to the connecting pipe (501) via a second spring (507). The second spring (507) is sleeved on the surface of the push rod (505). A cylinder (506) is fixedly installed on the bottom of the cover plate (204). The cylinder (506) is correspondingly arranged on one side of the fixing plate (508), and the other side of the fixing plate (508) is correspondingly distributed with the pressure sensor (503). The fixing plate (508) is movably sleeved on the surface of the guide rod (513) around the inside, and the guide rod (513) is fixedly connected to the inside of the side groove (203).

10. The method for preparing a semiconductor electrostatic chuck according to any one of claims 1 to 9, characterized in that: The steps include: (1) The heat exchange tube (110) is fixed to the inside of the housing (101), and the water inlet pipe (109) and the water outlet pipe (111) are respectively connected, and the radiator (107) is installed to the bottom of the housing (101), so that the heat exchange tube (110) is located inside the heat dissipation groove (108), and the assembly is completed; (2) The side groove (203) is installed to the inner wall of the housing (101) by means of screws, so that the bottom of the tank body (201) is fitted with the radiator (107), the connecting pipe (501) is passed through the side groove (203) and the bottom of the tank body (201), the sealing ring (512) is pressed against the surface of the tank body (201) to achieve sealing, the connecting pipe (501) is fitted to the inner wall of the tank body (201), the blocking block (510) is tightened and the sealing plug (511) is driven to fit inside the housing (101) to achieve assembly, and finally the cover plate (204) is installed to the tank body (201) and the top of the side groove (203) by means of screws; (3) Before installing the cover plate (204), the sleeve (502) is fixed to the surface of the connecting pipe (501) by bonding or welding, and the push rod (505) is inserted into the connecting pipe (501) to fix the push rod (505). When installing the cover plate (204), the cover plate (204) is sleeved on the surface of the push rod (505); (4) The top cover (401) is pressed against the surface of the cover plate (204), the top cover (401) is retracted into the groove body (201), and the top cover (401) drives the positioning block (407) to move into position inside the positioning groove (103), and then the top cover (401) is rotated and the bolt (408) is tightened to fix it. At this time, the top rod (505) is extended by the second spring (507), and the metal disk (402) is fitted with the top of the housing (301) of the motor assembly. Finally, the air inlet pipe (105) is connected to the air pump, the water inlet pipe (109) is connected to the water pump, and finally the connecting pipe (501) is connected to the air pump to complete the preparation of the semiconductor electrostatic suction cup.

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