Multi-dimensionally adjustable wafer lifting mechanism

Abstract

The invention provides a multi-dimensional adjustable wafer lifting mechanism, which comprises a lifting rod, a reference plate, a front-back adjusting assembly, a leveling assembly and a rotating assembly, and is characterized in that the reference plate is fixedly connected to the top end of the lifting rod, and the front-back adjusting assembly comprises a front-back position adjusting plate located on the reference plate; the leveling assembly comprises a leveling plate located on the front-back position adjusting plate, a leveling bolt penetrating through the leveling plate and making contact with the front-back position adjusting plate and a positioning bolt penetrating through the leveling bolt and screwed into the front-back position adjusting plate, the rotating assembly comprises a rotating plate capable of rotating around a rotating shaft within a preset angle range, and the rotating plate comprises a horizontal plate and a vertical plate; the vertical plate is connected with the wafer basket to drive the wafer basket to move back and forth, level and rotate. According to the wafer lifting mechanism capable of being adjusted in multiple dimensions, independent adjustment in multiple dimensions can be achieved, the convenience and operability of adjustment are improved, the matching degree of the wafer lifting mechanism and a clamping device is improved, and accurate butt joint and smooth transfer of wafers are ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor equipment and relates to a wafer lifting mechanism with multi-dimensional adjustment. Background Art

[0002] In tank cleaning equipment, the clamping device is used to carry the wafer to each process tank, and the wafer lifting mechanism in each process tank is used to receive the wafer. The handover between the clamping device and the wafer lifting mechanism is the key to the entire equipment motion system. The motion system must ensure that the clamping device can accurately insert multiple wafers into the wafer slots of the wafer lifting mechanism. However, since the tank cleaning equipment is composed of multiple independent process modules and has a long body, there may be a large spatial error between the wafer lifting mechanism in the process tank and the clamping device. In order to compensate for these errors and ensure the smooth handover of the wafer, an adjustable wafer lifting mechanism is necessary.

[0003] Among the drying modules currently on the market, most wafer lifting mechanisms lack adjustment functions, and the few adjustable mechanisms can only be adjusted in a single direction. This limited adjustment capability makes the adjustment operation difficult, and their own adjustment functions alone cannot ensure the accurate connection between the wafer lifting mechanism and the clamping device.

[0004] Therefore, how to provide a wafer lifting mechanism to achieve independent adjustment of multiple dimensions without affecting each other has become an important problem that needs to be solved urgently by technical personnel in this field.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Summary of the invention

[0006] In view of the shortcomings of the prior art described above, an object of the present invention is to provide a wafer lifting mechanism with multi-dimensional adjustment, which can realize independent adjustment of multiple dimensions without affecting each other, and is used to solve the problem that the wafer lifting mechanism in the prior art is difficult to adjust and cannot accurately accommodate multiple wafers.

[0007] To achieve the above objectives and other related objectives, the present invention provides a multi-dimensionally adjustable wafer lifting mechanism, comprising:

[0008] A lifting rod extending in the Z direction and performing lifting and lowering motion in the Z direction;

[0009] A reference plate, fixedly connected to the top end of the lifting rod;

[0010] A front-to-back adjustment component, used for adjusting the position of the wafer basket in the X direction, the front-to-back adjustment component comprising a front-to-back position adjustment plate located on the reference plate;

[0011] A leveling assembly is used to adjust the horizontality of the wafer lifting basket on the XY plane. The leveling assembly includes an adjustment plate, a leveling bolt and a positioning bolt. The adjustment plate is located on the front and rear position adjustment plate. The leveling bolt passes through the adjustment plate and contacts the front and rear position adjustment plate. The leveling bolt adjusts the Z-direction spacing between the adjustment plate and the front and rear position adjustment plate by changing the screw-in amount to achieve horizontality adjustment of the wafer lifting basket on the XY plane. A through hole is provided in the leveling bolt. The stud of the positioning bolt includes a non-threaded portion close to the bolt head and a threaded portion away from the bolt head. The non-threaded portion is inserted into the through hole and precisely matched with the through hole. The threaded portion is threadedly connected to the front and rear position adjustment plate.

[0012] A rotating assembly is used to adjust the rotation angle of the wafer basket. The rotating assembly includes a rotating plate that can rotate around a rotating shaft within a preset angle range. The rotating plate includes a horizontal plate and a vertical plate. The horizontal plate is located on the adjusting plate and is provided with an opening to expose the leveling bolt. The rotating shaft extends along the Z direction and passes through the horizontal plate and the adjusting plate. There is a gap between the bottom end of the rotating shaft and the front and rear position adjustment plates. The vertical plate is connected to the end of the horizontal plate away from the rotating shaft. The vertical plate is used to connect with the wafer basket to drive the wafer basket to move forward and backward, level and rotate.

[0013] Optionally, the front-to-back adjustment assembly further includes a pair of fixed block assemblies arranged sequentially and at intervals along the Y direction, wherein the fixed block assemblies are connected to the reference plate and the front-to-back position adjustment plate, and are used to adjust the sliding distance of the front-to-back position adjustment plate relative to the reference plate along the X direction, thereby adjusting the position of the wafer basket in the X direction.

[0014] Optionally, each of the fixed block assemblies includes a first fixed block and a second fixed block which are arranged in sequence and at intervals along the X direction, the first fixed block being fixedly connected to the reference plate, and the second fixed block being fixedly connected to the front-rear position adjustment plate, the fixed block assembly also includes a front-rear adjustment bolt, a first front-rear adjustment nut and a second front-rear adjustment nut, the front-rear adjustment bolts sequentially passing through the first fixed block and the second fixed block along the X direction, the first front-rear adjustment nut being located on a side of the second fixed block close to the first fixed block and being connected in cooperation with the front-rear adjustment bolt, the second front-rear adjustment nut being located on a side of the second fixed block away from the first fixed block and being connected in cooperation with the front-rear adjustment bolt, the first front-rear adjustment nut and the second front-rear adjustment nut being rotated and moved in the same direction to enable the second fixed block to slide forward and backward relative to the first fixed block along the X direction, thereby adjusting the distance by which the front-rear position adjustment plate slides forward and backward relative to the reference plate along the X direction.

[0015] Optionally, the adjusting plate and the front and rear position adjusting plate are both provided with openings, the first fixed block is located within the opening range of the horizontal plate, the adjusting plate and the front and rear position adjusting plate and is fixedly connected to the top surface of the reference plate, and the second fixed block is located within the opening range of the horizontal plate and the adjusting plate and is fixedly connected to the top surface of the front and rear position adjusting plate.

[0016] Optionally, the front-to-back adjustment assembly further includes a front-to-back position locking piece, which includes a front-to-back position locking bolt and a sliding groove provided in the front-to-back position adjustment plate and extending in the X direction, the front-to-back position locking bolt passes through the sliding groove along the Z direction and contacts the reference plate, the adjustment plate and the horizontal plate are both provided with openings exposing the front-to-back position locking bolt, when the front-to-back position locking piece is in a released state, the front-to-back position adjustment plate is in a state where it can be moved forward and backward, and when the front-to-back position locking piece is in a locked state, the front-to-back position of the front-to-back position adjustment plate is locked to lock the wafer basket at a preset position in the X direction.

[0017] Optionally, the rotating assembly further includes an angle adjustment assembly, which is connected to the front and rear position adjustment plates and the horizontal plate, and the angle adjustment assembly is spaced apart from the rotating shaft along the X direction, for adjusting the rotation angle of the horizontal plate relative to the front and rear position adjustment plates around the rotating shaft, thereby adjusting the rotation angle of the wafer basket around the rotating shaft.

[0018] Optionally, the angle adjustment component includes a first top screw block, a top screw fixing plate and a second top screw block which are arranged in sequence and at intervals along the Y direction, the first top screw block and the second top screw block being fixedly connected to the top surface of the horizontal plate, the top screw fixing block being fixedly connected to the top surface of the front and rear position adjustment plate and exposed to the outside through the opening, the angle adjustment component also includes a first top screw bolt and a second top screw bolt, the first top screw bolt penetrates the top screw fixing block along the Y direction and contacts the first top screw block, the second top screw bolt penetrates the top screw fixing block along the Y direction and contacts the second top screw block, the first top screw bolt adjusts the Y-direction spacing between the top screw fixing plate and the first top screw block by changing the screw-in amount, and the second top screw bolt adjusts the Y-direction spacing between the top screw fixing plate and the second top screw block by changing the screw-in amount, thereby adjusting the rotation angle of the horizontal plate relative to the front and rear position adjustment plate around the rotating shaft.

[0019] Optionally, the rotating assembly also includes a rotating locking piece, which includes a rotating locking bolt and an arc groove opened in the horizontal plate, the center of the circle where the arc groove is located is located on the rotation axis of the rotating shaft, and the rotating locking bolt passes through the arc groove along the Z direction and contacts the adjusting plate. When the rotating locking piece is in a released state, the rotating plate is in a rotatable state. When the rotating locking piece is in a locked state, the rotating plate is fixed to lock the wafer basket at a preset rotation angle.

[0020] Optionally, the number of the leveling bolts is at least three, and the number of the positioning bolts is the same as the number of the leveling bolts.

[0021] Optionally, a groove is provided on the upper surface of the front-rear position adjustment plate, the groove is located directly below the rotating shaft, and the bottom end of the rotating shaft extends into the groove.

[0022] Optionally, a first locking nut is disposed at the upper end of the rotating shaft, and a second locking nut is disposed at the lower end of the rotating shaft, and the second locking nut is located in the groove.

[0023] Optionally, the rotating shaft sleeve is provided with a bearing, the adjusting plate is provided with a boss, the boss is provided with a groove for accommodating the bearing, and the lower surface of the horizontal plate is provided with a groove for accommodating the boss.

[0024] Optionally, a support plate is connected between the horizontal plate and the vertical plate.

[0025] As described above, the multi-dimensionally adjustable wafer lifting mechanism of the present invention includes a lifting rod, a reference plate, a front-to-back adjustment component, a leveling component and a rotating component, wherein the reference plate is fixedly connected to the top of the lifting rod, the front-to-back adjustment component includes a front-to-back position adjustment plate located on the reference plate, the leveling component includes an adjustment plate located on the front-to-back position adjustment plate, a leveling bolt that passes through the adjustment plate and contacts the front-to-back position adjustment plate, and a positioning bolt that passes through the leveling bolt and is screwed into the front-to-back position adjustment plate, and the rotating component includes a rotating plate that can rotate around a rotating axis within a preset angle range, and the rotating plate includes a horizontal plate and a vertical plate, and the vertical plate is connected to the wafer lifting basket to drive the wafer lifting basket to move forward and backward, level and rotate. The multi-dimensionally adjustable wafer lifting mechanism of the present invention can realize independent adjustment in multiple dimensions, improve the convenience and operability of adjustment, enhance the degree of coordination with the clamping device, and ensure accurate docking and smooth transfer of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer lifting mechanism with multi-dimensional adjustment in one embodiment of the present invention.

[0027] Figure 2 FIG. 1 is a schematic side view of the structure of a multi-dimensionally adjustable wafer lifting mechanism in one embodiment of the present invention.

[0028] Figure 3 Display as Figure 2 A magnified schematic diagram of area A in the middle.

[0029] Figure 4 It is a three-dimensional structural schematic diagram of the multi-dimensionally adjustable wafer lifting mechanism of the present invention when the adjustment plate and the rotating plate are in a separated state.

[0030] Figure 5 It is a schematic top view of the structure of a horizontal plate of a multi-dimensionally adjustable wafer lifting mechanism in one embodiment of the present invention.

[0031] Figure 6 The diagram shows a top view of the structure of an adjustment plate of a wafer lifting mechanism with multi-dimensional adjustment according to an embodiment of the present invention.

[0032] Figure 7 The diagram shows a top view of the front and rear position adjustment plates of the wafer lifting mechanism with multi-dimensional adjustment in one embodiment of the present invention.

[0033] Description of Reference Numerals

[0034] 1 Lifting rod

[0035] 2 Reference plate

[0036] 3 Wafer Basket

[0037] 4 Front and rear position adjustment plate

[0038] 5. Adjust the plate

[0039] 6 Leveling bolts

[0040] 7 Positioning bolt

[0041] 701 No thread part

[0042] 702 Threaded part

[0043] 8 Axis

[0044] 9 Rotating Plate

[0045] 901 Horizontal Plate

[0046] 902 Vertical Plate

[0047] 10 Openings to expose leveling bolts

[0048] 11 First fixing block

[0049] 12 Second fixing block

[0050] 13 Front and rear adjustment bolts

[0051] 14 First front and rear adjustment nut

[0052] 15 Second front and rear adjustment nut

[0053] 16 Opening of the first fixing block

[0054] 17 Openings for revealing the first fixing block and the second fixing block

[0055] 18 Front and rear position locking piece

[0056] 1801 Front and rear locking bolts

[0057] 1802 Slide slot

[0058] 19 Openings showing the front and rear locking bolts

[0059] 20 First top screw block

[0060] 21 Top screw fixing plate

[0061] 22 Second top screw block

[0062] 23 First set screw bolt

[0063] 24 Second set screw bolt

[0064] 25 Rotary locking element

[0065] 2501 Rotary locking bolt

[0066] 2502 Arc Groove

[0067] 26 grooves

[0068] 27 First locking nut

[0069] 28 Boss

[0070] 29 Bearings

[0071] 30 grooves

[0072] 31 Support plate

[0073] θ Rotation angle DETAILED DESCRIPTION

[0074] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0075] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components.

[0076] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0077] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the schematic diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0078] For ease of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0079] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0080] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0081] See also Figure 1 , which is a schematic diagram of the three-dimensional structure of a multi-dimensionally adjustable wafer lifting mechanism of the present invention in one embodiment, wherein the multi-dimensionally adjustable wafer lifting mechanism comprises: a lifting rod 1, a reference plate 2, a front-rear adjustment component, a leveling component and a rotating component, wherein the lifting rod 1 extends along the Z direction and performs lifting and lowering motion in the Z direction, and the reference plate 2 is fixedly connected to the top of the lifting rod 1.

[0082] Specifically, the front-to-back adjustment component is used to adjust the position of the wafer basket 3 in the X direction, and the front-to-back adjustment component includes a front-to-back position adjustment plate 4 located on the reference plate 2 .

[0083] Specifically, the leveling assembly is used to adjust the horizontality of the wafer basket 3 on the XY plane. The leveling assembly includes a leveling plate 5, a leveling bolt 6 and a positioning bolt 7. The leveling plate 5 is located on the front and rear position adjustment plate 4. The leveling bolt 6 passes through the leveling plate 5 and contacts the front and rear position adjustment plate 4. The leveling bolt 6 adjusts the Z-direction distance between the leveling plate 5 and the front and rear position adjustment plate 4 by changing the screw-in amount to achieve horizontality adjustment of the wafer basket 3 on the XY plane.

[0084] As an example, the number of the leveling bolts 6 is at least three, and the number of the positioning bolts 7 is the same as the number of the leveling bolts 6 , wherein the three leveling bolts 6 are distributed in a triangle to define a plane.

[0085] As an example, in Figure 1 In the embodiment presented, there are four leveling bolts 6 located at four corners of the leveling plate 5, and the Z-direction gap between the leveling plate 5 and the front-rear position adjustment plate 4 is adjusted by screwing the leveling bolts 6 in order to adjust the horizontality of the XY plane of the wafer basket 3. In other embodiments, the number of the leveling bolts 6 can also be determined according to specific circumstances, which is not limited here.

[0086] In order to better present the matching relationship between the leveling bolt 6 and the positioning bolt 7 in the leveling assembly, please refer to Figure 2 and Figure 3 ,in, Figure 2 It is a schematic diagram of the side view structure of the multi-dimensionally adjustable wafer lifting mechanism in one embodiment of the present invention, Figure 3 Display as Figure 2 An enlarged schematic diagram of area A in the middle, wherein a through hole is provided in the leveling bolt 6, and the stud of the positioning bolt 7 includes a non-threaded portion 701 close to the bolt head and a threaded portion 702 away from the bolt head, the non-threaded portion 701 is penetrated in the through hole and precisely matched with the through hole, and the threaded portion 702 is threadedly connected to the front and rear position adjustment plates 4. During the leveling process of the leveling bolt 6, it is only necessary to loosen the positioning bolt 7, and there is no need to unscrew all the positioning bolts 7, so that the leveling work of the leveling bolt 6 is very simple and easy to operate, and the positioning function of the positioning bolt 7 can make the position of the leveling screw in other directions (i.e., X direction and Y direction) remain unchanged during the leveling operation, so that the displacement of the wafer basket 3 in other directions (i.e., X direction and Y direction) does not affect the adjustment operation in other directions, thereby realizing the independence and accuracy of the leveling operation.

[0087] Specifically, the rotating assembly is used to adjust the rotation angle θ of the wafer basket 3. Please refer to Figure 1 The rotating assembly includes a rotating plate 9 that can rotate around a rotating shaft 8 within a preset angle range.

[0088] In order to better illustrate the matching relationship between the rotating plate 9 and other components, please refer to Figures 4 to 5 , Figure 4 It is a schematic diagram of the three-dimensional structure of the wafer lifting mechanism with multi-dimensional adjustment when the adjustment plate 5 and the rotating plate 9 are in a separated state, Figure 5 The diagram shows a top view of the structure of the horizontal plate 901, wherein the rotating plate 9 includes a horizontal plate 901 and a vertical plate 902, the horizontal plate 901 is located on the adjustment plate 5 and is provided with an opening 10 for exposing the leveling bolts, the rotating shaft 8 extends along the Z direction through the horizontal plate 901 and the adjustment plate 5, and there is a gap between the bottom end of the rotating shaft 8 and the front and rear position adjustment plate 4, the gap can ensure that the rotating component of the multi-dimensionally adjustable wafer lifting mechanism is not affected by the front and rear adjustment components (that is, the rotation adjustment of the wafer basket 3 is not affected by the front and rear adjustment) to achieve independent adjustment of each dimension, the vertical plate 902 is connected to the end of the horizontal plate 901 away from the rotating shaft 8, and the vertical plate 902 is used to connect with the wafer basket 3 to drive the wafer basket 3 to move forward and backward, level and rotate.

[0089] Among them, the adjustment range of the rotation angle θ, the X-direction displacement and the Z-direction displacement of the wafer basket 3 can be selected according to needs. For example, the range of the rotation angle θ can be 0° to 10°, such as 2°, 4°, 6°, 9°, 10°, etc., and the range of the X-direction displacement of the wafer basket 3 can be 0mm to 70mm, such as 2mm, 14mm, 16mm, 25mm, 65mm, etc., and no excessive restrictions are made here.

[0090] As an example, a groove 26 is formed on the upper surface of the front-rear position adjustment plate 4 . The groove 26 is located directly below the rotating shaft 8 , and the bottom end of the rotating shaft 8 extends into the groove 26 .

[0091] As an example, a first locking nut 27 is provided at the upper end of the rotating shaft 8, and a second locking nut is provided at the lower end of the rotating shaft 8. The second locking nut is located in the groove 26, and the rotating shaft 8 can be locked by the first locking nut 27 and the second locking nut.

[0092] As an example, the rotating shaft 8 is provided with a bearing 29 , the adjusting plate 5 is provided with a boss 28 , the boss 28 is provided with a groove for accommodating the bearing 29 , and the lower surface of the horizontal plate 901 is provided with a groove 30 for accommodating the boss 28 .

[0093] As an example, a support plate 31 is connected between the horizontal plate 901 and the vertical plate 902 , and the support plate 31 can make the connection between the horizontal plate 901 and the vertical plate 902 more secure.

[0094] As an example, the number of wafer slots of the wafer basket 3 may range from 10 to 50, such as 10, 20, 50, etc., without excessive restriction. The accommodating openings of the wafer slots are Y-shaped.

[0095] Specifically, in this embodiment, in order to be suitable for corrosive environments, such as acidic environments, the wafer basket 3 is preferably a quartz wafer basket, wherein the rotating plate 9 is preferably a metal plate to improve strength. Further, in order to avoid contamination caused by metal materials such as metal particles, the surface of the metal plate is sprayed with polytetrafluoroethylene modified material (PFA), and when connecting the quartz wafer basket and the metal plate, a buffer pad with relatively stable physical and chemical properties, such as a PPS buffer pad or a PTFE buffer pad, is preferably provided between the wafer basket 3 and the vertical plate 902.

[0096] As an example, the front-to-back adjustment assembly also includes a pair of fixed block assemblies arranged sequentially and at intervals along the Y direction, and the fixed block assemblies are connected to the reference plate 2 and the front-to-back position adjustment plate 4, and are used to adjust the sliding distance of the front-to-back position adjustment plate 4 relative to the reference plate 2 along the X direction, thereby adjusting the position of the wafer basket 3 in the X direction.

[0097] As an example, each of the fixed block assemblies includes a first fixed block 11 and a second fixed block 12 which are arranged in sequence and at intervals along the X direction, the first fixed block 11 is fixedly connected to the reference plate 2, and the second fixed block 12 is fixedly connected to the front-rear position adjustment plate 4, the fixed block assembly also includes a front-rear adjustment bolt 13, a first front-rear adjustment nut 14 and a second front-rear adjustment nut 15, the front-rear adjustment bolt 13 sequentially passes through the first fixed block 11 and the second fixed block 12 along the X direction, the first front-rear adjustment nut 14 is located on a side of the second fixed block 12 close to the first fixed block 11 and is connected in cooperation with the front-rear adjustment bolt 13, the second front-rear adjustment nut 15 is located on a side of the second fixed block 12 away from the first fixed block 11 and is connected to the front-rear adjustment bolt 15 3, the first front-to-back adjusting nut 14 and the second front-to-back adjusting nut 15 rotate and move in the same direction to make the second fixing block 12 slide forward and backward relative to the first fixing block 11 along the X direction, that is, when the first front-to-back adjusting nut 14 and the second front-to-back adjusting nut 15 rotate and move in the positive direction of X, the second fixing block 12 will slide forward relative to the first fixing block 11 along the X direction, and when the first front-to-back adjusting nut 14 and the second front-to-back adjusting nut 15 rotate and move in the negative direction of X, the second fixing block 12 will slide backward relative to the first fixing block 11 along the X direction, thereby adjusting the distance of the front-to-back sliding of the front-to-back position adjusting plate 4 relative to the reference plate 2 along the X direction, thereby adjusting the position of the wafer lifting basket 3 in the X direction.

[0098] As an example, the adjustment plate 5 and the front-rear position adjustment plate 4 are both provided with openings, the first fixed block 11 is located within the opening range of the horizontal plate 901, the adjustment plate 5 and the front-rear position adjustment plate 4 and is fixedly connected to the top surface of the reference plate 2, the second fixed block 12 is located within the opening range of the horizontal plate 901 and the adjustment plate 5 and is fixedly connected to the top surface of the front-rear position adjustment plate 4, and the opening range is used to provide an operating space for the second fixed block 12 to slide forward and backward along the X direction, that is, to provide the front-rear adjustment component with a movement range of the wafer basket 3 in the X direction.

[0099] As an example, the first fixed block 11 is located on the top surface of the reference plate 2, and the second fixed block 12 is located on the top surface of the front and rear position adjustment plate 4. The first fixed block 11 and the second fixed block 12 are exposed to the outside through openings opened in the front and rear position adjustment plate 4 and / or the adjustment plate 5.

[0100] As an example, see Figure 6 and Figure 7 ,in, Figure 6 The diagram is a top view of the structure of the adjustment plate 5 in one embodiment. Figure 7 The diagram shows a top view of the structure of the front-rear position adjustment plate 4 in one embodiment. The front-rear position adjustment plate 4 is provided with an opening 16 for exposing the first fixing block 11, and the adjustment plate 5 is provided with an opening 17 for exposing the first fixing block 11 and the second fixing block 12. The opening 16 for exposing the first fixing block 11 and the opening 17 for exposing the first fixing block 11 and the second fixing block 12 are side openings and have a certain opening range, so that the second fixing block 12 is located within the opening range and has space for sliding forward and backward along the X direction. In other embodiments, the opening 16 for exposing the first fixing block 11 and the opening 17 for exposing the first fixing block 11 and the second fixing block 12 may also be internal openings.

[0101] As an example, refer back to Figure 1 and Figure 4 The front-to-back adjustment assembly also includes a front-to-back position locking member 18, which includes a front-to-back position locking bolt 1801 and a sliding groove 1802 opened in the front-to-back position adjustment plate 4 and extending in the X direction, which is used to cooperate with the sliding of the front-to-back position adjustment plate 4 along the X direction. The front-to-back position locking bolt 1801 passes through the sliding groove 1802 along the Z direction and contacts the reference plate 2.

[0102] Please see again Figure 5 and Figure 6 The adjusting plate 5 and the horizontal plate 901 are both provided with openings 19 for exposing the front-rear position locking bolts 1801. When the front-rear position locking member 18 is in a released state, the front-rear position adjusting plate 4 is in a state of being movable forward and backward. When the front-rear position locking member 18 is in a locked state, the front-rear position of the front-rear position adjusting plate 4 is locked to lock the wafer basket 3 at a preset position in the X direction.

[0103] As an example, the rotating assembly also includes an angle adjustment assembly, which is connected to the front and rear position adjustment plates 4 and the horizontal plate 901, and the angle adjustment assembly is spaced apart from the rotating shaft 8 along the X direction, and is used to adjust the rotation angle θ of the horizontal plate 901 relative to the front and rear position adjustment plates 4 around the rotating shaft 8, thereby adjusting the rotation angle θ of the wafer basket 3 around the rotating shaft 8. In this embodiment, the angle adjustment assembly is arranged on the side of the rotating shaft 8 close to the wafer basket 3. In other embodiments, the angle adjustment assembly may also be arranged on the side of the rotating shaft 8 away from the wafer basket 3.

[0104] As an example, refer back to Figure 1 and Figure 4 The angle adjustment assembly includes a first top screw block 20, a top screw fixing plate 21 and a second top screw block 22 arranged in sequence and at intervals along the Y direction. The first top screw block 20 and the second top screw block 22 are fixedly connected to the top surface of the horizontal plate 901, and the top screw fixing block 21 is fixedly connected to the top surface of the front-rear position adjustment plate 4 and passes through the opening of the horizontal plate 901 (i.e. Figure 5 The opening 10 for exposing the leveling bolt is exposed to the outside, and the opening 10 for exposing the leveling bolt is used to provide a rotation operation space for the horizontal plate 901 relative to the front and rear position adjustment plate 4 around the rotating shaft 8.

[0105] As an example, the angle adjustment assembly also includes a first top screw bolt 23 and a second top screw bolt 24. The first top screw bolt 23 penetrates the top screw fixing block 21 along the Y direction and contacts the first top screw block 20. The second top screw bolt 24 penetrates the top screw fixing block 21 along the Y direction and contacts the second top screw block 22. The first top screw bolt 23 adjusts the Y-direction spacing between the top screw fixing plate 21 and the first top screw block 20 by changing the screw-in amount. The second top screw bolt 24 adjusts the Y-direction spacing between the top screw fixing plate 21 and the second top screw block 22 by changing the screw-in amount, thereby adjusting the rotation angle θ of the horizontal plate 901 relative to the front and rear position adjustment plate 4 around the rotating shaft 8, thereby driving the rotation of the wafer lifting basket 3 around the rotating shaft 8 and adjusting the rotation angle θ of the wafer lifting basket 3 around the rotating shaft 8.

[0106] Specifically, when adjusting the angle, the reference plate 2, the front and rear position adjustment plate 4 and the adjustment plate 5 are all stationary, and the Y-direction spacing between the top screw fixing plate 21 and the first top screw block 20 is increased by rotating the first top screw bolt 23, that is, the first top screw bolt 23 pushes the first top screw block 20 to move in the negative direction of the Y direction, so that the first top screw block 20 can drive the rotating plate 9 to rotate clockwise around the rotating shaft 8 relative to the front and rear position adjustment plate 4 (viewed from bottom to top). At this time, the rotation angle θ of the wafer lifting basket 3 around the rotating shaft 8 is a clockwise rotation angle, and the size of the clockwise rotation angle can be adjusted by changing the spacing between the top screw fixing plate 21 and the first top screw block 20. The Y-direction spacing between the first top screw block 20 is adjusted; the Y-direction spacing between the top screw fixing plate 21 and the second top screw block 22 is increased by rotating the second top screw bolt 24, that is, the second top screw bolt 24 pushes the second top screw block 22 to move in the positive direction of Y, so that the second top screw block 22 can drive the rotating plate 9 to rotate counterclockwise around the rotating shaft 8 relative to the front and rear position adjustment plate 4 (viewed from bottom to top). At this time, the rotation angle θ of the wafer lifting basket 3 around the rotating shaft 8 is a counterclockwise rotation angle, and the size of the counterclockwise rotation angle can be adjusted by changing the Y-direction spacing between the top screw fixing plate 21 and the second top screw block 22.

[0107] As an example, see Figure 1 , Figure 4 and Figure 5 The rotating assembly also includes a rotating locking member 25, which includes a rotating locking bolt 2501 and an arc groove 2502 opened in the horizontal plate 901. The center of the circle where the arc groove 2502 is located is located on the rotation axis of the rotating shaft 8, which is used to cooperate with the rotation movement of the horizontal plate 901 around the rotating shaft 8. The rotating locking bolt 2501 passes through the arc groove 2502 along the Z direction and contacts the adjusting plate 5. When the rotating locking member 25 is in a released state, the rotating plate 9 is in a rotatable state. When the rotating locking member 25 is in a locked state, the rotating plate 9 is fixed to lock the wafer basket 3 at a preset rotation angle θ.

[0108] To summarize, the multi-dimensionally adjustable wafer lifting mechanism of the present invention includes a lifting rod, a reference plate, a front-to-back adjustment component, a leveling component and a rotating component, wherein the reference plate is fixedly connected to the top of the lifting rod, the front-to-back adjustment component includes a front-to-back position adjustment plate located on the reference plate, the leveling component includes an adjustment plate located on the front-to-back position adjustment plate, a leveling bolt that penetrates the adjustment plate and contacts the front-to-back position adjustment plate, and a positioning bolt that penetrates the leveling bolt and is screwed into the front-to-back position adjustment plate, the rotating component includes a rotating plate that can rotate around a rotating axis within a preset angle range, the rotating plate includes a horizontal plate and a vertical plate, and the vertical plate is connected to the wafer lifting basket to drive the wafer lifting basket to move back and forth, level and rotate. In the multi-dimensionally adjustable wafer lifting mechanism of the present invention, the Z-direction displacement of the wafer basket can be adjusted by the lifting rod, the X-direction displacement of the wafer basket can be adjusted by the reference plate and the front and rear adjustment components, the horizontality of the wafer basket can be adjusted by the leveling component, and the rotation angle of the wafer basket around the bearing can be adjusted by the rotating component, so that the wafer basket can be independently adjusted in the three dimensions of X, Y and Z, which improves the convenience and operability of adjustment, improves the degree of coordination with the clamping device, and ensures the accurate docking and smooth transfer of the wafer. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0109] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A multi-dimensionally adjustable wafer lifting mechanism, characterized in that: include: A lifting rod extending in the Z direction and performing lifting and lowering motion in the Z direction; A reference plate, fixedly connected to the top end of the lifting rod; A front-to-back adjustment component, used for adjusting the position of the wafer basket in the X direction, the front-to-back adjustment component comprising a front-to-back position adjustment plate located on the reference plate; A leveling assembly is used to adjust the horizontality of the wafer lifting basket on the XY plane. The leveling assembly includes an adjustment plate, a leveling bolt and a positioning bolt. The adjustment plate is located on the front and rear position adjustment plate. The leveling bolt passes through the adjustment plate and contacts the front and rear position adjustment plate. The leveling bolt adjusts the Z-direction spacing between the adjustment plate and the front and rear position adjustment plate by changing the screw-in amount to achieve horizontality adjustment of the wafer lifting basket on the XY plane. A through hole is provided in the leveling bolt. The stud of the positioning bolt includes a non-threaded portion close to the bolt head and a threaded portion away from the bolt head. The non-threaded portion is inserted into the through hole and precisely matched with the through hole. The threaded portion is threadedly connected to the front and rear position adjustment plate. A rotating assembly is used to adjust the rotation angle of the wafer basket. The rotating assembly includes a rotating plate that can rotate around a rotating shaft within a preset angle range. The rotating plate includes a horizontal plate and a vertical plate. The horizontal plate is located on the adjusting plate and is provided with an opening to expose the leveling bolt. The rotating shaft extends along the Z direction and passes through the horizontal plate and the adjusting plate. There is a gap between the bottom end of the rotating shaft and the front and rear position adjustment plates. The vertical plate is connected to the end of the horizontal plate away from the rotating shaft. The vertical plate is used to connect with the wafer basket to drive the wafer basket to move forward and backward, level and rotate.

2. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The front-to-back adjustment assembly also includes a pair of fixed block assemblies arranged in sequence and at intervals along the Y direction. The fixed block assembly is connected to the reference plate and the front-to-back position adjustment plate, and is used to adjust the sliding distance of the front-to-back position adjustment plate relative to the reference plate along the X direction, thereby adjusting the position of the wafer lifting basket in the X direction.

3. The multi-dimensionally adjustable wafer lifting mechanism according to claim 2, characterized in that: Each of the fixed block assemblies includes a first fixed block and a second fixed block which are sequentially and spaced apart along the X direction, the first fixed block being fixedly connected to the reference plate, and the second fixed block being fixedly connected to the front-rear position adjustment plate, the fixed block assembly also includes a front-rear adjustment bolt, a first front-rear adjustment nut and a second front-rear adjustment nut, the front-rear adjustment bolt sequentially passes through the first fixed block and the second fixed block along the X direction, the first front-rear adjustment nut is located on a side of the second fixed block close to the first fixed block and is connected in cooperation with the front-rear adjustment bolt, the second front-rear adjustment nut is located on a side of the second fixed block away from the first fixed block and is connected in cooperation with the front-rear adjustment bolt, the first front-rear adjustment nut and the second front-rear adjustment nut are rotated and moved in the same direction to make the second fixed block slide forward and backward relative to the first fixed block along the X direction, thereby adjusting the distance by which the front-rear position adjustment plate slides forward and backward relative to the reference plate along the X direction.

4. The multi-dimensionally adjustable wafer lifting mechanism according to claim 3, characterized in that: The adjusting plate and the front and rear position adjusting plate are both provided with openings, the first fixed block is located within the opening range of the horizontal plate, the adjusting plate and the front and rear position adjusting plate and is fixedly connected to the top surface of the reference plate, and the second fixed block is located within the opening range of the horizontal plate and the adjusting plate and is fixedly connected to the top surface of the front and rear position adjusting plate.

5. The multi-dimensionally adjustable wafer lifting mechanism according to any one of claims 1 to 4, characterized in that: The front-to-back adjustment assembly also includes a front-to-back position locking piece, which includes a front-to-back position locking bolt and a sliding groove provided in the front-to-back position adjustment plate and extending in the X direction. The front-to-back position locking bolt passes through the sliding groove along the Z direction and contacts the reference plate. The adjustment plate and the horizontal plate are both provided with openings to expose the front-to-back position locking bolt. When the front-to-back position locking piece is in a released state, the front-to-back position adjustment plate is in a state where it can move forward and backward. When the front-to-back position locking piece is in a locked state, the front-to-back position of the front-to-back position adjustment plate is locked to lock the wafer basket in a preset position in the X direction.

6. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The rotating assembly also includes an angle adjustment assembly, which is connected to the front and rear position adjustment plates and the horizontal plate, and the angle adjustment assembly is spaced apart from the rotating shaft along the X direction, and is used to adjust the rotation angle of the horizontal plate relative to the front and rear position adjustment plates around the rotating shaft, thereby adjusting the rotation angle of the wafer basket around the rotating shaft.

7. The multi-dimensionally adjustable wafer lifting mechanism according to claim 6, characterized in that: The angle adjustment component includes a first top screw block, a top screw fixing plate and a second top screw block which are arranged in sequence and at intervals along the Y direction, the first top screw block and the second top screw block being fixedly connected to the top surface of the horizontal plate, the top screw fixing block being fixedly connected to the top surface of the front and rear position adjustment plate and exposed to the outside through the opening, and the angle adjustment component also includes a first top screw bolt and a second top screw bolt, the first top screw bolt penetrates the top screw fixing block along the Y direction and contacts the first top screw block, the second top screw bolt penetrates the top screw fixing block along the Y direction and contacts the second top screw block, the first top screw bolt adjusts the Y-direction spacing between the top screw fixing plate and the first top screw block by changing the screw-in amount, and the second top screw bolt adjusts the Y-direction spacing between the top screw fixing plate and the second top screw block by changing the screw-in amount, thereby adjusting the rotation angle of the horizontal plate relative to the front and rear position adjustment plate around the rotating shaft.

8. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The rotating assembly also includes a rotating locking piece, which includes a rotating locking bolt and an arc-shaped groove opened in the horizontal plate. The center of the circle where the arc-shaped groove is located is located on the rotation axis of the rotating shaft. The rotating locking bolt passes through the arc-shaped groove along the Z direction and contacts the adjusting plate. When the rotating locking piece is in a released state, the rotating plate is in a rotatable state. When the rotating locking piece is in a locked state, the rotating plate is fixed to lock the wafer basket at a preset rotation angle.

9. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The number of the leveling bolts is at least three, and the number of the positioning bolts is the same as the number of the leveling bolts.

10. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: A groove is provided on the upper surface of the front-rear position adjustment plate. The groove is located directly below the rotating shaft, and the bottom end of the rotating shaft extends into the groove.

11. The multi-dimensionally adjustable wafer lifting mechanism according to claim 10, characterized in that: A first locking nut is disposed at the upper end of the rotating shaft, and a second locking nut is disposed at the lower end of the rotating shaft, and the second locking nut is located in the groove.

12. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The rotating shaft sleeve is provided with a bearing, the adjusting plate is provided with a boss, the boss is provided with a groove for accommodating the bearing, and the lower surface of the horizontal plate is provided with a groove for accommodating the boss.

13. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: A supporting plate is connected between the horizontal plate and the vertical plate.

Images