A wafer lifting mechanism with multi-dimensional adjustment

Abstract

The present invention provides a wafer lifting mechanism with multi-dimensional adjustment. The wafer lifting mechanism with multi-dimensional adjustment includes a lifting rod, a reference plate, a front-back adjustment component, a leveling component and a rotation component. Among them, the reference plate is fixedly connected to the top of the lifting rod. The front-back adjustment component includes a front-back position adjustment plate located on the reference plate. The leveling component includes a leveling plate located on the front-back position adjustment plate, a leveling bolt passing through the leveling plate and contacting the front-back position adjustment plate, and a positioning bolt passing through the leveling bolt and screwed into the front-back position adjustment plate. The rotation component includes a rotating plate that can rotate around a rotating shaft within a preset angle range. The rotating plate includes a horizontal plate and a vertical plate. The vertical plate is connected to the wafer basket to drive the wafer basket to move back and forth, level and rotate. The wafer lifting mechanism with multi-dimensional adjustment of the present invention can achieve independent adjustment in multiple dimensions, improve the convenience and operability of adjustment, enhance the cooperation degree with the clamping device, and ensure the accurate docking and smooth transfer of the wafer.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor equipment and relates to a wafer lifting mechanism with multi-dimensional adjustment. Background Art

[0002] In tank cleaning equipment, the clamping device is used to carry the wafer to each process tank, and the wafer lifting mechanism in each process tank is used to receive the wafer. The handover between the clamping device and the wafer lifting mechanism is the key to the entire equipment motion system. The motion system must ensure that the clamping device can accurately insert multiple wafers into the wafer slots of the wafer lifting mechanism. However, since the tank cleaning equipment is composed of multiple independent process modules and has a long body, there may be a large spatial error between the wafer lifting mechanism in the process tank and the clamping device. In order to compensate for these errors and ensure the smooth handover of the wafer, an adjustable wafer lifting mechanism is necessary.

[0003] Among the drying modules currently on the market, most wafer lifting mechanisms lack adjustment functions, and the few adjustable mechanisms can only be adjusted in a single direction. This limited adjustment capability makes the adjustment operation difficult, and their own adjustment functions alone cannot ensure the accurate handover between the wafer lifting mechanism and the clamping device.

[0004] Therefore, how to provide a wafer lifting mechanism to achieve independent adjustment of multiple dimensions without affecting each other has become an important problem that needs to be solved urgently by technical personnel in this field.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Summary of the invention

[0006] In view of the shortcomings of the prior art mentioned above, the purpose of the present invention is to provide a multi-dimensionally adjustable wafer lifting mechanism to achieve independent adjustment of multiple dimensions without affecting each other, so as to solve the problem that the wafer lifting mechanism in the prior art is difficult to adjust and cannot accurately accommodate multiple wafers.

[0007] To achieve the above objectives and other related objectives, the present invention provides a multi-dimensionally adjustable wafer lifting mechanism, comprising:

[0008] A lifting rod extending in the Z direction and performing lifting and lowering motion in the Z direction;

[0009] A reference plate, fixedly connected to the top end of the lifting rod;

[0010] A front-back adjustment component for adjusting the position of the wafer basket in the X direction. The front-back adjustment component includes a front-back position adjustment plate located on the reference plate.

[0011] A leveling component for adjusting the levelness of the wafer basket in the X-Y plane. The leveling component includes a leveling plate, leveling bolts, and positioning bolts. The leveling plate is located on the front-back position adjustment plate. The leveling bolts penetrate through the leveling plate and contact the front-back position adjustment plate. By changing the screwing-in amount of the leveling bolts, the Z-direction spacing between the leveling plate and the front-back position adjustment plate is adjusted to achieve the adjustment of the levelness of the wafer basket in the X-Y plane. A through-hole is provided in the leveling bolts. The stud of the positioning bolt includes a non-threaded portion adjacent to the bolt head and a threaded portion away from the bolt head. The non-threaded portion is inserted into the through-hole and is in precise fit with the through-hole. The threaded portion is threadedly connected to the front-back position adjustment plate.

[0012] A rotation component for adjusting the rotation angle of the wafer basket. The rotation component includes a rotation plate that can rotate around a rotation axis within a preset angle range. The rotation plate includes a horizontal plate and a vertical plate. The horizontal plate is located on the leveling plate and is provided with an opening exposing the leveling bolts. The rotation axis extends along the Z direction through the horizontal plate and the leveling plate, and there is a gap between the bottom end of the rotation axis and the front-back position adjustment plate. The vertical plate is connected to one end of the horizontal plate away from the rotation axis. The vertical plate is used to connect to the wafer basket to drive the wafer basket to move back and forth, level, and rotate.

[0013] Optionally, the front-back adjustment component further includes a pair of fixed block components arranged in sequence and spaced apart along the Y direction. The fixed block components are connected to the reference plate and the front-back position adjustment plate, and are used to adjust the distance of the front-back position adjustment plate sliding relative to the reference plate along the X direction, thereby adjusting the position of the wafer basket in the X direction.

[0014] Optionally, each of the fixed block assemblies includes a first fixed block and a second fixed block that are sequentially and spaced apart along the X direction. The first fixed block is fixedly connected to the reference plate, and the second fixed block is fixedly connected to the front and rear position adjustment plate. The fixed block assembly further includes a front and rear adjustment bolt, a first front and rear adjustment nut, and a second front and rear adjustment nut. The front and rear adjustment bolt sequentially penetrates through the first fixed block and the second fixed block along the X direction. The first front and rear adjustment nut is located on one side of the second fixed block close to the first fixed block and is connected to the front and rear adjustment bolt in a mating manner. The second front and rear adjustment nut is located on one side of the second fixed block away from the first fixed block and is connected to the front and rear adjustment bolt in a mating manner. The first front and rear adjustment nut and the second front and rear adjustment nut rotate and move in the same direction to enable the second fixed block to slide back and forth along the X direction relative to the first fixed block, thereby adjusting the distance of the front and rear position adjustment plate sliding back and forth along the X direction relative to the reference plate.

[0015] Optionally, the leveling plate and the front and rear position adjustment plate are both provided with openings. The first fixed block is located within the opening ranges of the horizontal plate, the leveling plate, and the front and rear position adjustment plate and is fixedly connected to the top surface of the reference plate. The second fixed block is located within the opening ranges of the horizontal plate and the leveling plate and is fixedly connected to the top surface of the front and rear position adjustment plate.

[0016] Optionally, the front and rear adjustment assembly further includes a front and rear position locking member. The front and rear position locking member includes a front and rear position locking bolt and a sliding groove formed in the front and rear position adjustment plate and extending in the X direction. The front and rear position locking bolt passes through the sliding groove along the Z direction and contacts the reference plate. Openings exposing the front and rear position locking bolt are provided on both the leveling plate and the horizontal plate. When the front and rear position locking member is in a released state, the front and rear position adjustment plate is in a state of being movable back and forth. When the front and rear position locking member is in a locked state, the front and rear position of the front and rear position adjustment plate is locked to lock the wafer basket at a preset position in the X direction.

[0017] Optionally, the rotating assembly further includes an angle adjustment assembly. The angle adjustment assembly is connected to the front and rear position adjustment plate and the horizontal plate, and the angle adjustment assembly is spaced apart from the rotating shaft along the X direction and is used to adjust the rotation angle of the horizontal plate relative to the front and rear position adjustment plate around the rotating shaft, thereby adjusting the rotation angle of the wafer basket around the rotating shaft.

[0018] Optionally, the angle adjustment component includes a first set screw block, a set screw fixing plate, and a second set screw block that are sequentially and spaced apart along the Y direction. The first set screw block and the second set screw block are fixedly connected to the top surface of the horizontal plate. The set screw fixing plate is fixedly connected to the top surface of the front-back position adjustment plate and is exposed outside through the opening. The angle adjustment component further includes a first set screw bolt and a second set screw bolt. The first set screw bolt penetrates through the set screw fixing plate along the Y direction and contacts the first set screw block. The second set screw bolt penetrates through the set screw fixing plate along the Y direction and contacts the second set screw block. The first set screw bolt adjusts the Y-direction spacing between the set screw fixing plate and the first set screw block by changing the screwing-in amount. The second set screw bolt adjusts the Y-direction spacing between the set screw fixing plate and the second set screw block by changing the screwing-in amount, thereby adjusting the rotation angle of the horizontal plate relative to the front-back position adjustment plate around the rotating shaft.

[0019] Optionally, the rotation component further includes a rotation locking member. The rotation locking member includes a rotation locking bolt and an arc-shaped groove formed in the horizontal plate. The center of the circle where the arc-shaped groove is located is on the rotation axis of the rotating shaft. The rotation locking bolt passes through the arc-shaped groove along the Z direction and contacts the leveling plate. When the rotation locking member is in the released state, the rotating plate is in a rotatable state. When the rotation locking member is in the locked state, the rotating plate is fixed to lock the wafer basket at a preset rotation angle.

[0020] Optionally, the number of the leveling bolts is at least three, and the number of the positioning bolts is the same as that of the leveling bolts.

[0021] Optionally, a groove is formed in the upper surface of the front-back position adjustment plate. The groove is located directly below the rotating shaft, and the bottom end of the rotating shaft extends into the groove.

[0022] Optionally, a first locking nut is provided at the upper end of the rotating shaft, and a second locking nut is provided at the lower end of the rotating shaft. The second locking nut is located in the groove.

[0023] Optionally, a bearing is sleeved on the rotating shaft. A boss is provided on the leveling plate, and a groove for receiving the bearing is formed in the boss. A groove for receiving the boss is formed in the lower surface of the horizontal plate.

[0024] Optionally, a support plate is connected between the horizontal plate and the vertical plate.

[0025] As described above, the multi-dimensional adjustable wafer lifting mechanism of the present invention includes a lifting rod, a reference plate, a front-back adjustment component, a leveling component, and a rotation component. Among them, the reference plate is fixedly connected to the top of the lifting rod. The front-back adjustment component includes a front-back position adjustment plate located on the reference plate. The leveling component includes a leveling plate located on the front-back position adjustment plate, a leveling bolt passing through the leveling plate and contacting the front-back position adjustment plate, and a positioning bolt passing through the leveling bolt and screwed into the front-back position adjustment plate. The rotation component includes a rotating plate that can rotate around a rotating shaft within a preset angle range. The rotating plate includes a horizontal plate and a vertical plate. The vertical plate is connected to the wafer basket to drive the wafer basket to move back and forth, level, and rotate. The multi-dimensional adjustable wafer lifting mechanism of the present invention can achieve independent adjustment in multiple dimensions, improve the convenience and operability of adjustment, enhance the cooperation with the clamping device, and ensure the accurate docking and smooth transfer of the wafer. Description of the Drawings

[0026] Figure 1 Shown is a three-dimensional structural schematic diagram of the multi-dimensional adjustable wafer lifting mechanism of the present invention in an embodiment.

[0027] Figure 2 Shown is a side view structural schematic diagram of the multi-dimensional adjustable wafer lifting mechanism of the present invention in an embodiment.

[0028] Figure 3 Shown as Figure 2 An enlarged schematic diagram of area A in

[0029] Figure 4 Shown is a three-dimensional structural schematic diagram of the multi-dimensional adjustable wafer lifting mechanism of the present invention when the leveling plate and the rotating plate are in a separated state.

[0030] Figure 5 Shown is a top view structural schematic diagram of the horizontal plate of the multi-dimensional adjustable wafer lifting mechanism of the present invention in an embodiment.

[0031] Figure 6 Shown is a top view structural schematic diagram of the leveling plate of the multi-dimensional adjustable wafer lifting mechanism of the present invention in an embodiment.

[0032] Figure 7 Shown is a top view structural schematic diagram of the front-back position adjustment plate of the multi-dimensional adjustable wafer lifting mechanism of the present invention in an embodiment.

[0033] Description of the Reference Numerals

[0034] 1 Lifting rod

[0035] 2 Reference plate

[0036] 3 Wafer basket

[0037] 4 Front-back position adjustment plate

[0038] 5 leveling plate

[0039] 6 leveling bolt

[0040] 7 positioning bolt

[0041] 701 threadless part

[0042] 702 threaded part

[0043] 8 rotating shaft

[0044] 9 rotating plate

[0045] 901 horizontal plate

[0046] 902 vertical plate

[0047] 10 opening for exposing the leveling bolt

[0048] 11 first fixing block

[0049] 12 second fixing block

[0050] 13 front - rear adjusting bolt

[0051] 14 first front - rear adjusting nut

[0052] 15 second front - rear adjusting nut

[0053] 16 opening for exposing the first fixing block

[0054] 17 opening for exposing the first and second fixing blocks

[0055] 18 front - rear position locking part

[0056] 1801 front - rear position locking bolt

[0057] 1802 sliding groove

[0058] 19 opening for exposing the front - rear position locking bolt

[0059] 20 first set - screw block

[0060] 21 set - screw fixing plate

[0061] 22 second set - screw block

[0062] 23 first set - screw bolt

[0063] 24 second set - screw bolt

[0064] 25 rotation locking part

[0065] 2501 rotation locking bolt

[0066] 2502 Arc-shaped groove

[0067] 26 Groove

[0068] 27 First locking nut

[0069] 28 Boss

[0070] 29 Bearing

[0071] 30 Groove

[0072] 31 Support plate

[0073] θ Rotation angle Detailed implementation manners

[0074] The following describes the implementation manners of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0075] It should be emphasized that the term "comprising / including" when used herein refers to the presence of features, whole pieces, steps or components, but does not exclude the presence or addition of one or more other features, whole pieces, steps or components.

[0076] Features described and / or illustrated for one implementation manner can be used in the same or similar manner in one or more other implementation manners, combined with features in other implementation manners, or replace features in other implementation manners.

[0077] When detailing the embodiments of the present invention, for the convenience of description, the schematic diagrams showing the device structure will be enlarged locally not in accordance with the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions including length, width and depth should be included.

[0078] For the convenience of description, spatial relationship terms such as "beneath", "below", "lower than", "under", "above", "on" etc. may be used herein to describe the relationship between one element or feature shown in the drawings and other elements or features. It will be understood that these spatial relationship terms are intended to include other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there can also be one or more layers in between.

[0079] In the context of the present application, the structure where the described first feature is "above" the second feature may include embodiments where the first and second features are in direct contact, and may also include embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0080] It should be noted that the illustrations provided in this embodiment only schematically illustrate the basic concept of the present invention. Therefore, only the components related to the present invention are shown in the illustrations, rather than being drawn according to the number, shape, and size of the components in actual implementation. The types, quantities, and proportions of the components in actual implementation can be arbitrarily changed, and the layout type of the components may also be more complex.

[0081] Please refer to Figure 1 , which shows a schematic three-dimensional structure diagram of the multi-dimensional adjustable wafer lifting mechanism of the present invention in an embodiment. The multi-dimensional adjustable wafer lifting mechanism includes: a lifting rod 1, a reference plate 2, a front-back adjustment component, a leveling component, and a rotating component. Among them, the lifting rod 1 extends along the Z direction and moves up and down in the Z direction, and the reference plate 2 is fixedly connected to the top end of the lifting rod 1.

[0082] Specifically, the front-back adjustment component is used to adjust the position of the wafer basket 3 in the X direction. The front-back adjustment component includes a front-back position adjustment plate 4 located on the reference plate 2.

[0083] Specifically, the leveling component is used to adjust the levelness of the wafer basket 3 in the X-Y plane. The leveling component includes a leveling plate 5, leveling bolts 6, and positioning bolts 7. The leveling plate 5 is located on the front-back position adjustment plate 4. The leveling bolts 6 penetrate through the leveling plate 5 and contact the front-back position adjustment plate 4. The leveling bolts 6 adjust the Z-direction spacing between the leveling plate 5 and the front-back position adjustment plate 4 by changing the screwing-in amount to achieve the levelness adjustment of the wafer basket 3 in the X-Y plane.

[0084] As an example, the number of the leveling bolts 6 is at least three, and the number of the positioning bolts 7 is the same as that of the leveling bolts 6. Among them, three of the leveling bolts 6 are distributed in a triangle to determine a plane.

[0085] As an example, in Figure 1 the presented embodiment, the number of the leveling bolts 6 is four, located at the four corners of the leveling plate 5. The Z-direction gap between the leveling plate 5 and the front-back position adjustment plate 4 is adjusted by the screwing-in amount of the leveling bolts 6 to adjust the levelness of the X-Y plane of the wafer basket 3. In other embodiments, the number of the leveling bolts 6 can also be determined according to specific circumstances, and no limitation is made here.

[0086] To better present the cooperation relationship between the leveling bolt 6 and the positioning bolt 7 in the leveling assembly, please refer to Figure 2 and Figure 3 , where Figure 2 shows a schematic side view structure of the multi-dimensional adjustable wafer lifting mechanism of the present invention in an embodiment, Figure 3 shows as Figure 2 an enlarged schematic view of area A in

[0087] . Among them, a through hole is provided in the leveling bolt 6. The stud of the positioning bolt 7 includes a threadless part 701 close to the bolt head and a threaded part 702 far from the bolt head. The threadless part 701 passes through the through hole and is in precise fit with the through hole. The threaded part 702 is threadedly connected to the front and rear position adjusting plate 4. During the leveling process of the leveling bolt 6, only the positioning bolt 7 needs to be loosened, and it is not necessary to completely remove the positioning bolt 7, making the leveling work of the leveling bolt 6 very simple and easy to operate. Moreover, the positioning function of the positioning bolt 7 can keep the position of the leveling screw unchanged in other directions (i.e., the X direction and the Y direction) during the leveling operation, so that the displacement of the wafer basket 3 in other directions (i.e., the X direction and the Y direction) does not affect the adjustment operations in other directions, thereby realizing the independence and accuracy of the leveling operation. Figure 1 Specifically, the rotation assembly is used to adjust the rotation angle θ of the wafer basket 3. Please refer back to

[0088] . To better show the cooperation relationship between the rotating plate 9 and other components, please refer to Figures 4 to 5 , Figure 4 shows a three-dimensional structure schematic diagram of the multi-dimensional adjustable wafer lifting mechanism when the leveling plate 5 and the rotating plate 9 are in a separated state, Figure 5 shows a top view structure schematic diagram of the horizontal plate 901. Among them, the rotating plate 9 includes a horizontal plate 901 and a vertical plate 902. The horizontal plate 901 is located on the leveling plate 5 and is provided with an opening 10 exposing the leveling bolt. The rotating shaft 8 extends along the Z direction through the horizontal plate 901 and the leveling plate 5, and there is a gap between the bottom end of the rotating shaft 8 and the front and rear position adjusting plate 4. This gap can ensure that the rotation assembly of the multi-dimensional adjustable wafer lifting mechanism is not affected by the front and rear adjustment assemblies (i.e., the rotation adjustment of the wafer basket 3 is not affected by the front and rear adjustments), so as to realize the independent adjustment of each dimension. The vertical plate 902 is connected to one end of the horizontal plate 901 far from the rotating shaft 8. The vertical plate 902 is used to connect to the wafer basket 3 to drive the wafer basket 3 to move back and forth, level, and rotate.

[0089] Among them, the adjustment ranges of the rotation angle θ, the X-direction displacement, and the Z-direction displacement of the wafer carrier 3 can be selected as needed. For example, the range of the rotation angle θ can be 0° to 10°, such as 2°, 4°, 6°, 9°, 10°, etc. The range of the X-direction displacement of the wafer carrier 3 can be 0 mm to 70 mm, such as 2 mm, 14 mm, 16 mm, 25 mm, 65 mm, etc. There is no excessive limitation here.

[0090] As an example, a groove 26 is formed on the upper surface of the front and rear position adjustment plate 4. The groove 26 is located directly below the rotating shaft 8, and the bottom end of the rotating shaft 8 extends into the groove 26.

[0091] As an example, a first locking nut 27 is provided at the upper end of the rotating shaft 8, and a second locking nut is provided at the lower end of the rotating shaft 8. The second locking nut is located within the groove 26. The rotating shaft 8 can be locked by the first locking nut 27 and the second locking nut.

[0092] As an example, a bearing 29 is sleeved on the rotating shaft 8. A boss 28 is provided on the leveling plate 5, and a groove for receiving the bearing 29 is formed in the boss 28. A groove 30 for receiving the boss 28 is formed on the lower surface of the horizontal plate 901.

[0093] As an example, a support plate 31 is connected between the horizontal plate 901 and the vertical plate 902, and the support plate 31 can make the connection between the horizontal plate 901 and the vertical plate 902 more firm.

[0094] As an example, the number range of the wafer slots of the wafer carrier 3 can be 10 to 50, such as 10, 20, 50, etc. There is no excessive limitation here. The accommodating opening of the wafer slot is in a Y shape.

[0095] Specifically, in this embodiment, to be applicable to a corrosive environment, such as an acidic environment, the wafer carrier 3 is preferably a quartz wafer carrier. Among them, to improve the strength, the rotating plate 9 is preferably a metal plate. Further, to avoid contamination such as metal particles caused by the metal material, a polytetrafluoroethylene modified material (PFA) is sprayed on the surface of the metal plate. When connecting the quartz wafer carrier and the metal plate, it is preferably to provide a buffer pad with relatively stable physical and chemical properties, such as a PPS buffer pad or a PTFE buffer pad, etc., between the wafer carrier 3 and the vertical plate 902.

[0096] As an example, the front-back adjustment assembly further includes a pair of fixed block assemblies arranged in sequence and at intervals along the Y direction. The fixed block assemblies are connected to the reference plate 2 and the front-back position adjustment plate 4, and are used to adjust the distance of the front-back position adjustment plate 4 sliding relative to the reference plate 2 along the X direction, thereby adjusting the position of the wafer carrier 3 in the X direction.

[0097] As an example, each of the fixed block assemblies includes a first fixed block 11 and a second fixed block 12 arranged in sequence and at intervals along the X direction. The first fixed block 11 is fixedly connected to the reference plate 2, and the second fixed block 12 is fixedly connected to the front-back position adjustment plate 4. The fixed block assembly further includes a front-back adjustment bolt 13, a first front-back adjustment nut 14, and a second front-back adjustment nut 15. The front-back adjustment bolt 13 sequentially penetrates through the first fixed block 11 and the second fixed block 12 along the X direction. The first front-back adjustment nut 14 is located on the side of the second fixed block 12 close to the first fixed block 11 and is in fit connection with the front-back adjustment bolt 13. The second front-back adjustment nut 15 is located on the side of the second fixed block 12 away from the first fixed block 11 and is in fit connection with the front-back adjustment bolt 13. The first front-back adjustment nut 14 and the second front-back adjustment nut 15 rotate and move in the same direction to make the second fixed block 12 slide back and forth along the X direction relative to the first fixed block 11. That is, when the first front-back adjustment nut 14 and the second front-back adjustment nut 15 both rotate and move in the positive direction of X, the second fixed block 12 will slide forward along the X direction relative to the first fixed block 11. When the first front-back adjustment nut 14 and the second front-back adjustment nut 15 both rotate and move in the negative direction of X, the second fixed block 12 will slide backward along the X direction relative to the first fixed block 11, thereby adjusting the distance of the front-back position adjustment plate 4 sliding back and forth along the X direction relative to the reference plate 2, and thus adjusting the position of the wafer carrier 3 in the X direction.

[0098] As an example, both the leveling plate 5 and the front-back position adjustment plate 4 are provided with openings. The first fixed block 11 is located within the opening ranges of the horizontal plate 901, the leveling plate 5, and the front-back position adjustment plate 4 and is fixedly connected to the top surface of the reference plate 2. The second fixed block 12 is located within the opening ranges of the horizontal plate 901 and the leveling plate 5 and is fixedly connected to the top surface of the front-back position adjustment plate 4. The opening ranges are used to provide an operating space for the second fixed block 12 to slide back and forth along the X direction, that is, to provide a moving range for adjusting the wafer carrier 3 in the X direction by the front-back adjustment assembly.

[0099] As an example, the first fixing block 11 is located on the top surface of the reference plate 2, and the second fixing block 12 is located on the top surface of the front-back position adjusting plate 4. The first fixing block 11 and the second fixing block 12 are exposed to the outside through openings formed in the front-back position adjusting plate 4 and / or the leveling plate 5.

[0100] As an example, please refer to Figure 6 and Figure 7 , in which, Figure 6 is shown as a top view structural schematic diagram of the leveling plate 5 in an embodiment, Figure 7 is shown as a top view structural schematic diagram of the front-back position adjusting plate 4 in an embodiment. The front-back position adjusting plate 4 is provided with an opening 16 exposing the first fixing block 11, and the leveling plate 5 is provided with an opening 17 exposing the first fixing block 11 and the second fixing block 12. The opening 16 exposing the first fixing block 11 and the opening 17 exposing the first fixing block 11 and the second fixing block 12 are side openings and have a certain opening range, so that the second fixing block 12 is located within the opening range and has a space for sliding back and forth in the X direction. In other embodiments, the opening 16 exposing the first fixing block 11 and the opening 17 exposing the first fixing block 11 and the second fixing block 12 may also be internal openings.

[0101] As an example, please refer back to Figure 1 and Figure 4 , the front-back adjusting assembly further includes a front-back position locking member 18. The front-back position locking member 18 includes a front-back position locking bolt 1801 and a sliding slot 1802 formed in the front-back position adjusting plate 4 and extending in the X direction, which is used to cooperate with the sliding of the front-back position adjusting plate 4 in the X direction. The front-back position locking bolt 1801 passes through the sliding slot 1802 in the Z direction and contacts the reference plate 2.

[0102] Please refer to Figure 5 and Figure 6 again. Openings 19 exposing the front-back position locking bolt 1801 are formed on both the leveling plate 5 and the horizontal plate 901. When the front-back position locking member 18 is in a released state, the front-back position adjusting plate 4 is in a state where it can move back and forth. When the front-back position locking member 18 is in a locked state, the front-back position of the front-back position adjusting plate 4 is locked to lock the wafer basket 3 at a preset position in the X direction.

[0103] As an example, the rotating assembly further includes an angle adjustment assembly. The angle adjustment assembly is connected to the front-back position adjustment plate 4 and the horizontal plate 901, and is spaced from the rotating shaft 8 in the X direction. It is used to adjust the rotation angle θ of the horizontal plate 901 relative to the front-back position adjustment plate 4 around the rotating shaft 8, and further adjust the rotation angle θ of the wafer carrier 3 around the rotating shaft 8. In this embodiment, the angle adjustment assembly is arranged on the side of the rotating shaft 8 close to the wafer carrier 3. In other embodiments, the angle adjustment assembly can also be arranged on the side of the rotating shaft 8 away from the wafer carrier 3.

[0104] As an example, please refer back to Figure 1 and Figure 4 , the angle adjustment assembly includes a first set screw block 20, a set screw fixing plate 21 and a second set screw block 22 that are arranged in sequence and at intervals in the Y direction. The first set screw block 20 and the second set screw block 22 are fixedly connected to the top surface of the horizontal plate 901. The set screw fixing plate 21 is fixedly connected to the top surface of the front-back position adjustment plate 4 and is exposed to the outside through the opening of the horizontal plate 901 (i.e., Figure 5 the opening 10 where the leveling bolt is exposed in ). The opening 10 where the leveling bolt is exposed is used to provide a rotation operation space for the horizontal plate 901 relative to the front-back position adjustment plate 4 around the rotating shaft 8.

[0105] As an example, the angle adjustment assembly further includes a first set screw bolt 23 and a second set screw bolt 24. The first set screw bolt 23 penetrates the set screw fixing plate 21 in the Y direction and contacts the first set screw block 20. The second set screw bolt 24 penetrates the set screw fixing plate 21 in the Y direction and contacts the second set screw block 22. The first set screw bolt 23 adjusts the Y-direction distance between the set screw fixing plate 21 and the first set screw block 20 by changing the screwing-in amount. The second set screw bolt 24 adjusts the Y-direction distance between the set screw fixing plate 21 and the second set screw block 22 by changing the screwing-in amount, and further adjusts the rotation angle θ of the horizontal plate 901 relative to the front-back position adjustment plate 4 around the rotating shaft 8, thereby driving the rotation of the wafer carrier 3 around the rotating shaft 8 and adjusting the rotation angle θ of the wafer carrier 3 around the rotating shaft 8.

[0106] Specifically, when adjusting the angle, the reference plate 2, the front and rear position adjustment plate 4, and the leveling plate 5 remain stationary. By rotating the first set screw bolt 23, the Y-direction spacing between the set screw fixing plate 21 and the first set screw block 20 is increased. That is, the first set screw bolt 23 pushes the first set screw block 20 to move in the negative Y direction, which can cause the first set screw block 20 to drive the rotating plate 9 to rotate clockwise (viewed from bottom to top) relative to the front and rear position adjustment plate 4 around the rotating shaft 8. At this time, the rotation angle θ of the wafer carrier 3 around the rotating shaft 8 is the clockwise rotation angle, and the magnitude of the clockwise rotation angle can be adjusted by changing the Y-direction spacing between the set screw fixing plate 21 and the first set screw block 20. By rotating the second set screw bolt 24, the Y-direction spacing between the set screw fixing plate 21 and the second set screw block 22 is increased. That is, the second set screw bolt 24 pushes the second set screw block 22 to move in the positive Y direction, which can cause the second set screw block 22 to drive the rotating plate 9 to rotate counterclockwise (viewed from bottom to top) relative to the front and rear position adjustment plate 4 around the rotating shaft 8. At this time, the rotation angle θ of the wafer carrier 3 around the rotating shaft 8 is the counterclockwise rotation angle, and the magnitude of the counterclockwise rotation angle can be adjusted by changing the Y-direction spacing between the set screw fixing plate 21 and the second set screw block 22.

[0107] As an example, please refer to Figure 1 , Figure 4 and Figure 5 , the rotation assembly further includes a rotation locking member 25. The rotation locking member 25 includes a rotation locking bolt 2501 and an arc-shaped groove 2502 formed in the horizontal plate 901. The center of the circle where the arc-shaped groove 2502 is located is on the rotation axis of the rotating shaft 8, and is used to cooperate with the rotation of the horizontal plate 901 around the rotating shaft 8. The rotation locking bolt 2501 passes through the arc-shaped groove 2502 in the Z direction and contacts the leveling plate 5. When the rotation locking member 25 is in the released state, the rotating plate 9 is in a rotatable state. When the rotation locking member 25 is in the locked state, the rotating plate 9 is fixed to lock the wafer carrier 3 at a preset rotation angle θ.

[0108] In summary, the multi-dimensional adjustable wafer lifting mechanism of the present invention includes a lifting rod, a reference plate, a front-back adjustment component, a leveling component, and a rotation component. Among them, the reference plate is fixedly connected to the top of the lifting rod. The front-back adjustment component includes a front-back position adjustment plate located on the reference plate. The leveling component includes a leveling plate located on the front-back position adjustment plate, a leveling bolt passing through the leveling plate and contacting the front-back position adjustment plate, and a positioning bolt passing through the leveling bolt and screwed into the front-back position adjustment plate. The rotation component includes a rotating plate that can rotate around a rotating shaft within a preset angle range. The rotating plate includes a horizontal plate and a vertical plate. The vertical plate is connected to the wafer basket to drive the wafer basket to move back and forth, level, and rotate. In the multi-dimensional adjustable wafer lifting mechanism of the present invention, the Z-direction displacement of the wafer basket can be adjusted through the lifting rod, the X-direction displacement of the wafer basket can be adjusted through the reference plate and the front-back adjustment component, the levelness of the wafer basket can be adjusted through the leveling component, and the rotation angle of the wafer basket around the bearing can be adjusted through the rotation component, so that the wafer basket can be independently adjusted in the three dimensions of X, Y, and Z, improving the convenience and operability of the adjustment, enhancing the cooperation with the clamping device, and ensuring the accurate docking and smooth transfer of the wafer. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0109] The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A multi-dimensionally adjustable wafer lifting mechanism, characterized in that: include: A lifting rod extending in the Z direction and performing lifting and lowering motion in the Z direction; A reference plate, fixedly connected to the top end of the lifting rod; A front-to-back adjustment assembly, used to adjust the position of the wafer basket in the X direction, the front-to-back adjustment assembly includes a front-to-back position adjustment plate located on the reference plate and a pair of fixed block assemblies arranged in sequence and at intervals along the Y direction, each of the fixed block assemblies includes a first fixed block and a second fixed block, a front-to-back adjustment bolt, a first front-to-back adjustment nut and a second front-to-back adjustment nut, each of the fixed block assemblies includes a first fixed block and a second fixed block, arranged in sequence and at intervals along the X direction, a front-to-back adjustment bolt, a first front-to-back adjustment nut and a second front-to-back adjustment nut, the first fixed block is fixed to the reference plate, the second fixed block is fixed to the front-to-back position adjustment plate, the front-to-back adjustment bolt passes through the first fixed block and the second fixed block in sequence along the X direction, the first front-to-back adjustment nut and the second front-to-back adjustment nut are arranged on both sides of the second fixed block along the X direction and are both connected with the front-to-back adjustment bolt; A leveling assembly is used to adjust the horizontality of the wafer lifting basket on the XY plane. The leveling assembly includes an adjustment plate, a leveling bolt and a positioning bolt. The adjustment plate is located on the front and rear position adjustment plate. The leveling bolt passes through the adjustment plate and contacts the front and rear position adjustment plate. The leveling bolt adjusts the Z-direction spacing between the adjustment plate and the front and rear position adjustment plate by changing the screw-in amount to achieve horizontality adjustment of the wafer lifting basket on the XY plane. A through hole is provided in the leveling bolt. The stud of the positioning bolt includes a non-threaded portion close to the bolt head and a threaded portion away from the bolt head. The non-threaded portion is inserted into the through hole and precisely matched with the through hole. The threaded portion is threadedly connected to the front and rear position adjustment plate. A rotating assembly is used to adjust the rotation angle of the wafer basket. The rotating assembly includes a rotating plate that can rotate around a rotating shaft within a preset angle range. The rotating plate includes a horizontal plate and a vertical plate. The horizontal plate is located on the adjusting plate and is provided with an opening to expose the leveling bolt. The rotating shaft extends along the Z direction and passes through the horizontal plate and the adjusting plate. There is a gap between the bottom end of the rotating shaft and the front and rear position adjustment plates. The vertical plate is connected to the end of the horizontal plate away from the rotating shaft. The vertical plate is used to connect with the wafer basket to drive the wafer basket to move forward and backward, level and rotate.

2. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The adjusting plate and the front and rear position adjusting plate are both provided with openings, the first fixed block is located within the opening range of the horizontal plate, the adjusting plate and the front and rear position adjusting plate and is fixedly connected to the top surface of the reference plate, and the second fixed block is located within the opening range of the horizontal plate and the adjusting plate and is fixedly connected to the top surface of the front and rear position adjusting plate.

3. The multi-dimensionally adjustable wafer lifting mechanism according to any one of claims 1 to 2, characterized in that: The front-to-back adjustment assembly also includes a front-to-back position locking piece, which includes a front-to-back position locking bolt and a sliding groove provided in the front-to-back position adjustment plate and extending in the X direction. The front-to-back position locking bolt passes through the sliding groove along the Z direction and contacts the reference plate. The adjustment plate and the horizontal plate are both provided with openings to expose the front-to-back position locking bolt. When the front-to-back position locking piece is in a released state, the front-to-back position adjustment plate is in a state where it can move forward and backward. When the front-to-back position locking piece is in a locked state, the front-to-back position of the front-to-back position adjustment plate is locked to lock the wafer basket in a preset position in the X direction.

4. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The rotating assembly also includes an angle adjustment assembly, which is connected to the front and rear position adjustment plates and the horizontal plate, and the angle adjustment assembly is spaced apart from the rotating shaft along the X direction, and is used to adjust the rotation angle of the horizontal plate relative to the front and rear position adjustment plates around the rotating shaft, thereby adjusting the rotation angle of the wafer basket around the rotating shaft.

5. The multi-dimensionally adjustable wafer lifting mechanism according to claim 4, characterized in that: The angle adjustment component includes a first top screw block, a top screw fixing plate and a second top screw block which are arranged in sequence and at intervals along the Y direction, the first top screw block and the second top screw block being fixedly connected to the top surface of the horizontal plate, the top screw fixing plate being fixedly connected to the top surface of the front and rear position adjustment plate and exposed to the outside through the opening, and the angle adjustment component also includes a first top screw bolt and a second top screw bolt, the first top screw bolt penetrates the top screw fixing plate along the Y direction and contacts the first top screw block, the second top screw bolt penetrates the top screw fixing plate along the Y direction and contacts the second top screw block, the first top screw bolt adjusts the Y-direction spacing between the top screw fixing plate and the first top screw block by changing the screwing amount, and the second top screw bolt adjusts the Y-direction spacing between the top screw fixing plate and the second top screw block by changing the screwing amount, thereby adjusting the rotation angle of the horizontal plate relative to the front and rear position adjustment plate around the rotating shaft.

6. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The rotating assembly also includes a rotating locking piece, which includes a rotating locking bolt and an arc-shaped groove opened in the horizontal plate. The center of the circle where the arc-shaped groove is located is located on the rotation axis of the rotating shaft. The rotating locking bolt passes through the arc-shaped groove along the Z direction and contacts the adjusting plate. When the rotating locking piece is in a released state, the rotating plate is in a rotatable state. When the rotating locking piece is in a locked state, the rotating plate is fixed to lock the wafer basket at a preset rotation angle.

7. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The number of the leveling bolts is at least three, and the number of the positioning bolts is the same as the number of the leveling bolts.

8. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: A groove is provided on the upper surface of the front-rear position adjustment plate. The groove is located directly below the rotating shaft, and the bottom end of the rotating shaft extends into the groove.

9. The multi-dimensionally adjustable wafer lifting mechanism according to claim 8, characterized in that: A first locking nut is disposed at the upper end of the rotating shaft, and a second locking nut is disposed at the lower end of the rotating shaft, and the second locking nut is located in the groove.

10. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: The rotating shaft sleeve is provided with a bearing, the adjusting plate is provided with a boss, the boss is provided with a groove for accommodating the bearing, and the lower surface of the horizontal plate is provided with a groove for accommodating the boss.

11. The multi-dimensionally adjustable wafer lifting mechanism according to claim 1, characterized in that: A supporting plate is connected between the horizontal plate and the vertical plate.

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