Vibration reduction bonding platform driven by linear motor

Abstract

The invention discloses a vibration reduction bonding platform driven by a linear motor, which is provided with a bonding device driven by a floating linear motor, an induction driving shaft of a mover is inserted into a linear magnetic field gap of a stator from one end close to the mover, and the bonding device is fixedly connected to the mover and can reciprocate along with the mover. The induction driving shaft is slightly shorter than the linear magnetic field; and a fixed metal conduction plate made of a non-magnetic material is inserted into the linear magnetic field at the other end far away from the rotor. According to the invention, the inertial vibration amplitude is eliminated or reduced, and the operation precision of equipment can be stabilized.

Description

Technical Field

[0001] The invention relates to a bonding device in the integrated circuit industry, in particular to a bonding device driven by a linear motor. Background Art

[0002] During the operation of the linear motor semiconductor chip high-speed bonding equipment, the inertial force generated by the movement of the bonding head can easily cause the base (motor) to shake, thereby reducing the accuracy of the equipment.

[0003] The structure of a linear motor mainly includes three parts: a stator, a mover and a support wheel for linear motion.

[0004] Linear motor stator: The stationary part of the linear motor when it is running is called the stator, which is equivalent to the stator of a rotating motor, called the primary. The stator consists of three parts: the stator core, the stator winding and the frame. The main function of the stator is to generate a rotating magnetic field.

[0005] Linear Motor Mover: The mover is the part that moves back and forth when the linear motor is running. The mover is supported by a guide rail system between two magnetic tracks and is generally made of epoxy material to compress the coils together. The motor mover includes the coil windings, Hall element circuit board, thermistor and electronic interface. The mover is non-steel, which means there is no suction and no interference between the magnetic track and the thrust coil. The non-steel coil assembly has a low inertia, allowing very high acceleration.

[0006] The invention of the applicant with application number 2023116984777 introduces a recoil-free linear motor micro-electromechanical system, whose stator and mover are both floating. Due to high-speed operation, unnecessary vibrations may be generated; this application mainly aims to improve such problems.

[0007] The principle of eddy current shock absorber https: / / www.bilibili.com / video / BV1iM411c7by / can be used for reference in this application. Summary of the invention

[0008] Purpose of the invention: Provided is a linear motor driven vibration reduction bonding platform which can significantly reduce the vibration amplitude and vibration frequency of the stator, thereby reducing the inertia force of the bonding equipment and improving the bonding accuracy.

[0009] Technical solution: The linear motor driven vibration reduction bonding platform of the present invention has a floating linear motor driven bonding device and is suitable for the bonding mechanism of semiconductor manufacturing equipment.

[0010] The stator of the linear motor is floatingly set on the stator track, and the mover of the linear motor is floatingly set on the mover track. The stator track and the mover track are parallel to each other, or on the left and right parts of the same horizontal axis. The induction drive shaft of the mover (fixedly connected to the rest of the mover, in which the induction coil is pre-embedded, or a necessary component of the mover of a conventional linear motor) is inserted from the end close to the mover into the linear magnetic field gap of the stator (there are a row of N poles and S poles of magnets or electromagnets facing each other on the upper and lower sides, with a magnetic field gap in the middle). The bonding device is fixedly connected to the mover and can follow the reciprocating motion of the mover to realize the process of picking up the chip from the bottom and bonding the chip.

[0011] In the present invention, the induction drive shaft can sense the periodic changes of the linear magnetic field of the stator, so that the mover performs periodic reciprocating linear vibration relative to the stator (vibration amplitudes are different, frequencies are the same, and directions are opposite).

[0012] In the present invention, the length of the induction drive shaft is slightly shorter than the length of the linear magnetic field. When the stator and the mover vibrate relative to each other, the mover will not touch the metal conductive plate, and will not affect the normal reciprocating motion of each other. In the linear magnetic field at the other end away from the mover, a metal conductive plate (preferably a copper plate with high conductivity and greater resistance caused by eddy current) made of a fixed non-magnetic material (will not be adsorbed on the magnet) is inserted. The outer end of the metal conductive plate is fixedly connected to the outside of the stator, and the inside is suspended in the middle of the stator magnetic field.

[0013] When the floating stator reciprocates, the fixed metal conductive plate in the linear magnetic field is equivalent to the metal conductive plate making relative motion inside the stator, cutting the magnetic lines of force. Induced eddy currents will be generated, generating heat that will be dissipated into the surrounding atmosphere, consuming the oscillation energy of the stator, so that the reciprocating movement of the stator can quickly reduce the vibration amplitude and vibration frequency. That is, the eddy currents generated in the metal conductive plate after cutting the magnetic lines of force of the straight magnetic field will slow down the oscillation speed and frequency of the stator, and then slow down the speed and frequency of the linear vibration of the mover, thereby achieving the purpose of vibration reduction.

[0014] Along with the attenuation force generated by the stator speed, due to the coupling effect between the mover and the stator, the mover will also reduce the vibration amplitude and vibration frequency, thereby reducing the vibration amplitude and vibration frequency of the bonding device connected thereto, and reducing the movement inertia force of the bonding device.

[0015] In the floating motor of the present invention, due to the long-term wear of the mover and the stator relative to their respective tracks, the vibration caused by the pick-up and bonding of the chip by the mover, the sliding friction of the mover on the track and the sliding friction of the stator on the track cannot always be constant; therefore, the force of the reciprocating inertial oscillation will be different, which will lead to the bonding position deviation of the bonding device. Therefore, reducing the inertial vibration is helpful to improve the bonding accuracy of the bonding device.

[0016] Technical effects of the present invention: In the magnetic field of the above-mentioned floating linear motor with a metal conduction plate inserted, the inertial vibration amplitude of the stator is eliminated or reduced, the mover and the stator move in opposite directions, the vibration of the mover is also reduced accordingly, the friction between the stator or mover and the track can be consistent, and the operating accuracy of the equipment can be stabilized. According to the attenuation caused by the eddy current, the large inertial force (or reaction force, recoil force) generated during long stroke and high-speed movement can be suppressed, and the heat generated by the eddy current is dissipated in the surrounding atmosphere through the conduction plate. There is no direct contact heat transfer to the stator and the mover, the temperature rise is small, and the equipment quality is maintained well. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of a cross-sectional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the metal conduction plate and the local magnetic field of the present invention.

[0018] In the figure, 1-stator; 2-mover; 3-induction drive shaft; 4-statator track; 5-mover track; 6-slider A (friction force A); 7-slider B (friction force B); 8-magnet; 9-magnet N pole; 10-magnet S pole; 11-metal conduction plate; 12-bonding device; 13-fixed platform. Specific embodiments of the present invention

[0019] Embodiment 1: like Figure 1 The bonding device 12 shown has a floating linear motor drive, the stator 1 of the linear motor is floatingly set on the stator track 4, and the mover 2 of the linear motor is floatingly set on the mover track 5. The stator track 4 and the mover track 5 are on the left and right parts of the same horizontal axis.

[0020] The bonding device 12 is fixedly connected to the mover 2 to pick up and place the chip below for bonding. The induction drive shaft 3 of the mover 2 is inserted into the linear magnetic field gap of the stator 1 from the end close to the mover 2, and a wire such as a magnetic stripe is inserted into the middle of the linear magnetic field at the other end away from the mover 2. Figure 2 The metal conductive plate 11 of copper alloy is shown fixed.

[0021] The length of the linear magnetic field of the stator 1 is greater than the sum of the length of the induction drive shaft 3 and the length of the metal conductive plate 11, and does not hinder the relative reciprocating motion between the stator 1 and the mover 2. The width and thickness of the metal conductive plate 11 are both smaller than the magnetic field space of the stator 1.

Claims

1. A linear motor driven vibration damping bonding platform, comprising a floating linear motor driven bonding device (12), wherein a stator (1) of the linear motor is floatingly arranged on a stator track (4), a mover (2) of the linear motor is floatingly arranged on a mover track (5), and the bonding device (12) is fixedly connected to the mover (2), characterized in that: The stator track (4) is parallel to the mover track (5), and the induction drive shaft (3) of the mover (2) is inserted into the straight magnetic field gap of the stator (1) from one end. A fixed metal conductive plate (11) made of non-magnetic material is inserted into the straight magnetic field of the stator at the other end away from the mover (2). The eddy current generated in the metal conductive plate (11) after cutting the magnetic field lines of the straight magnetic field will slow down the oscillation speed and frequency of the stator, and then slow down the speed and frequency of the linear vibration of the mover towards each other, thereby achieving vibration reduction.

2. The linear motor driven vibration damping bonding platform according to claim 1, characterized in that: The metal conductive plate (11) is a copper plate.

3. The linear motor driven vibration damping bonding platform according to claim 1, characterized in that: The stator track (4) and the mover track (5) are located on the left and right parts of the same horizontal axis.

4. The linear motor driven vibration reduction bonding platform according to claim 1, characterized in that: The sum of the length of the induction drive shaft (3) and the length of the metal conductive plate is slightly shorter than the length of the flat magnetic field.

5. The linear motor driven vibration damping bonding platform according to claim 1 or 2, characterized in that: The outer end of the metal conductive plate (11) is fixedly connected to the outside of the stator (1), and the inside is suspended in the middle of the magnetic field of the stator (1).

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