A surface acoustic wave device processing device and a processing method

Abstract

The invention discloses a surface acoustic wave device processing device and a processing method, comprising a base, a supporting structure; a first guide rail fixed on both sides of the upper end surface of the base; a second guide rail, the second guide rail is slidably arranged on the first guide rail to achieve forward and backward movement; a lifting device, the lifting device is slidably arranged on the second guide rail to achieve lateral movement; two upper glue injection devices, each of which is connected to a cover plate at the lower end; the lifting device is used to drive the two upper glue injection devices to perform lifting and lowering movements; a tray, the tray is arranged above the base, and the upper end surface of the tray is provided with two rows of parallel grooves, each groove is used to place a surface acoustic wave device substrate to be processed; the size of the cover plate matches the groove on the tray to cover and seal the groove; compared with the prior art, the invention shows significant beneficial effects in improving production efficiency, ensuring product quality, reducing production costs, etc.

Description

Technical Field

[0001] The invention relates to the technical field of device shell casting and molding, in particular to a surface acoustic wave device processing device and a processing method. Background Art

[0002] Surface acoustic wave devices (SAW) are a type of microelectronic component that is widely used in wireless communications, sensor technology, signal processing and other fields. Its core advantage is to use the characteristics of piezoelectric materials to excite and propagate surface acoustic waves on the surface of the material to achieve functions such as filtering, delaying, and resonating high-frequency signals. Surface acoustic wave devices have the characteristics of small size, light weight, good frequency selectivity, low insertion loss, and strong temperature stability. They are an indispensable component of modern electronic systems. Figure 1 As shown, the surface acoustic wave device includes a substrate 100 , a filter chip 101 formed by photolithography is located at the center of the substrate 100 , and energized contacts 102 are distributed around the filter chip 101 .

[0003] The manufacturing process of existing surface acoustic wave devices usually includes multiple links such as chip preparation, electrode pattern formation, and packaging. The chip part is mainly composed of a piezoelectric substrate, on which a fine electrode pattern is formed through processes such as photolithography to achieve the excitation and detection of surface acoustic waves. The packaging link is to protect the chip from interference from the external environment and ensure the stability of the electrical connection of the device. Existing packaging technologies mostly use direct glue injection sealing or pasting of the shell. Specifically, glue is applied directly to the surface of the chip or the surrounding area, and a protective layer is formed by curing; or a prefabricated metal or plastic shell is used, and the chip is fixed inside with an adhesive, leaving the necessary electrical interfaces. For contacts that need to be energized, they are connected to the pins on the shell by welding or crimping to connect to the external circuit.

[0004] Limitations of directly injecting glue to seal the chip: Although injecting glue to seal the chip directly can provide some protection, the glue layer often increases the resistance of the surface acoustic wave propagating on the surface of the piezoelectric substrate. This is because the glue layer has a certain thickness and elastic modulus, which will change the propagation path and speed of the surface acoustic wave, thereby affecting the filtering performance and signal quality of the device. In addition, the glue layer may also introduce additional noise and loss, further reducing the performance of the device.

[0005] Stability and sealing problems of directly pasting the shell: Although the method of directly pasting the shell is simple and easy, it has the problem of insufficient stability and sealing. Since the performance of the adhesive is greatly affected by environmental factors such as temperature and humidity, it may age and fall off after long-term use, causing the shell to loosen or the seal to fail. This will not only affect the electrical performance and service life of the device, but may also cause safety hazards such as short circuit and leakage.

[0006] Low processing efficiency of contact welding or crimping: In traditional technologies, the contacts used for power supply need to be connected to the pins on the housing by welding or crimping. These process steps are not only complicated and time-consuming, but also easily affected by human factors, making it difficult to ensure processing accuracy and consistency. In addition, the chip or pins may be damaged during welding or crimping, further reducing the reliability of the device.

[0007] In summary, the existing surface acoustic wave device processing technology has many shortcomings, which limits the performance of the device and the expansion of the application range. Therefore, it is necessary to provide a surface acoustic wave device processing device and processing method to solve these problems and improve the overall performance of the device. Summary of the invention

[0008] To achieve the above object, the present invention provides the following technical solution: a surface acoustic wave device processing device, comprising:

[0009] Base, supporting structure;

[0010] A first guide rail is fixed on both sides of the upper end surface of the base;

[0011] A second guide rail, the second guide rail is slidably arranged on the first guide rail to achieve forward and backward movement;

[0012] A lifting device, wherein the lifting device is slidably disposed on the second guide rail to achieve lateral movement;

[0013] Two upper glue injection devices, each of which has a cover plate connected to its lower end;

[0014] The lifting device is used to drive the two upper glue injection devices to perform lifting movements;

[0015] A tray, the tray is arranged above the base, and the upper end surface of the tray is provided with two rows of parallel grooves, each groove is used to place the surface acoustic wave device substrate to be processed;

[0016] The front and rear faces of the tray are rotatably connected to the base, and the tray is connected to a turning motor;

[0017] The size of the cover plate matches the groove on the tray to cover and seal the groove;

[0018] A bottom hole is provided at the base below the tray, a lower cover plate is connected to the bottom hole via a lifting cylinder, and a lower glue injection device is provided on each groove of the lower cover plate corresponding to the tray;

[0019] The groove of the tray is through from top to bottom, and a bottom plate is provided below, and a plurality of protrusions are provided on the bottom plate, and the size of each protrusion matches that of each groove;

[0020] Two copper wire threading mechanisms are arranged on the base, and each of the threading mechanisms is equipped with a corresponding winding drum for providing copper wire.

[0021] Furthermore, preferably, a circle of enclosure is fixed in the middle of the lower end surface of the cover plate, a plurality of glue injection holes are distributed around the lower end surface of the cover plate, a branch pipe penetrating to each glue injection hole is provided above the cover plate, and the branch pipe is connected to the upper glue injection device.

[0022] Furthermore, as a preference, a plurality of rubber sleeves are distributed around the lower end surface of the cover plate, and each rubber sleeve corresponds to a contact point on the device substrate.

[0023] Further, as a preference, a plurality of springs are provided around the tray and the bottom plate, and the springs separate the tray from the bottom plate in a natural state and embed the protrusions into the grooves.

[0024] Furthermore, as a preference, eccentric wheels are rotatably provided on the bases on both sides of the tray, each of the eccentric wheels is driven to rotate by a servo motor, and the side surfaces of the eccentric wheels are in contact with the bottom plate.

[0025] Further, as a preference, the threading mechanism has an L-shaped channel, the outlet end of which is vertically upward, and a guide wheel is rotatably arranged at the bend in the channel;

[0026] A hydraulic shear is arranged at the outlet end of the threading mechanism.

[0027] A method for processing a surface acoustic wave device comprises the following steps:

[0028] S1. Move the cover plate to the top of the threading mechanism, push the copper wire into the rubber sleeve of the cover plate through the guide wheel, and cut the copper wire through the hydraulic shear to form a copper column. The copper column is combined with the cover plate under the clamping force of the rubber sleeve, and the copper column is inserted into each rubber sleeve in turn;

[0029] S2. Move the cover plate with the copper pillar installed to the top of the tray, lower the cover plate to cover the groove, and surround the filter chip.

[0030] S3, the upper glue injection device injects glue into the groove through the glue injection hole, and the glue evenly covers the upper surface of the substrate around the enclosure to form a first glue injection layer, and at the same time, the copper column is implanted in the first glue injection layer and fits the contact point;

[0031] S4, after waiting for the glue to be initially cured, glue is injected into each row of grooves in turn to form a first glue injection layer and implant copper pillars;

[0032] S5, the tray is turned over so that the groove faces downward, the lifting cylinder drives the lower cover plate to rise, the tray fits together, and the groove is closed;

[0033] S6, injecting glue into each groove through the glue injection device until it combines with the first glue injection layer to form a second glue injection layer;

[0034] S7, after the glue is completely cured, the tray is flipped to the initial position again, and the servo motor drives the eccentric wheel to rotate, pushing the bottom plate to move upward, so that the convex block pushes the substrate in the groove out, and a casting-molded shell with a cavity is formed on the substrate;

[0035] S8. Grinding the upper surface of the processed surface acoustic wave device to a predetermined thickness, thinning the thickness of the second injection layer, exposing the copper column, and obtaining a finished surface acoustic wave device.

[0036] Compared with the prior art, the present invention has the following beneficial effects:

[0037] In the present invention, a double-layer glue injection design is adopted, combined with the enclosure and the glue injection hole on the cover plate, to achieve accurate glue injection and effective sealing of the device substrate. And through the design of the enclosure, a cavity is formed in the glue injection layer to provide a low-impedance propagation environment, allowing the surface acoustic wave to propagate effectively on the surface of the piezoelectric substrate and complete the filtering function. And it prevents the colloid from overflowing into the filter chip area, protecting the chip from contamination.

[0038] In the present invention, the copper pillar is formed by automatically pushing and cutting the copper wire through the threading mechanism, and the rubber sleeve on the cover plate is used to achieve accurate implantation and tight fitting of the copper pillar, which not only simplifies the operation of implanting the conductor, but also improves the contact reliability between the copper pillar and the contact, providing a strong guarantee for the electrical performance of the device.

[0039] In the present invention, the tray and the bottom plate are combined with the driving mechanism of the eccentric wheel to achieve rapid demoulding after processing, significantly shortening the production cycle. At the same time, the flipping function of the tray enables the upper and lower injection processes to be carried out continuously without the need to change the tooling, further improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a schematic diagram of the structure of a surface acoustic wave device to be processed;

[0041] Figure 2 It is a structural schematic diagram of a surface acoustic wave device processing device;

[0042] Figure 3 A top view of a surface acoustic wave device processing device;

[0043] Figure 4 It is a front view of a surface acoustic wave device processing device;

[0044] Figure 5 is a schematic diagram of the structure of the cover plate;

[0045] Figure 6It is a structural schematic diagram of the threading mechanism;

[0046] Figure 7 This is a schematic diagram of the first injection layer when injecting glue;

[0047] Figure 8 It is a schematic diagram showing the process of injecting glue into the second injection layer;

[0048] Fig. 9 Schematic diagram of the structure of the completed surface acoustic wave device.

[0049] In the figure: 100, substrate; 101, filter chip; 102, contact; 103, copper column; 104, first glue injection layer; 105, second glue injection layer; 106, cavity; 1, base; 2, first guide rail; 3, second guide rail; 4, lifting device; 5, upper glue injection device; 6, cover plate; 61, enclosure; 62, rubber sleeve; 63, glue injection hole; 64, branch pipe; 7, tray; 71, groove; 72, bottom plate; 73, spring; 8, bottom hole; 9, threading mechanism; 91, guide wheel; 10, hydraulic shear; 11, eccentric wheel; 12, winding drum; 13, lower cover plate; 14, lower glue injection device; 15, lifting cylinder; 16, flip motor. DETAILED DESCRIPTION

[0050] See also Figure 2~Figure 5 In an embodiment of the present invention, a surface acoustic wave device processing device includes:

[0051] Base 1, supporting structure;

[0052] The first guide rail 2 is fixed on both sides of the upper end surface of the base 1;

[0053] A second guide rail 3, wherein the second guide rail 3 is slidably disposed on the first guide rail 2 to achieve forward and backward movement;

[0054] A lifting device 4, wherein the lifting device 4 is slidably disposed on the second guide rail 3 to achieve lateral movement;

[0055] Two upper glue injection devices 5, each of which has a cover plate 6 connected to its lower end;

[0056] The lifting device 4 is used to drive the two upper glue injection devices 5 to perform lifting movements;

[0057] A tray 7, the tray 7 is arranged above the base 1, and the upper end surface of the tray 7 is provided with two parallel rows of grooves 71, each groove 71 is used to place the surface acoustic wave device substrate 100 to be processed;

[0058] The size of the cover plate 6 matches the groove 71 on the tray 7 to cover and seal the groove 71;

[0059] Two copper wire threading mechanisms 9 are arranged on the base 1, and each of the threading mechanisms 9 is equipped with a corresponding winding drum 12 for providing copper wire.

[0060] The first guide rail 2 and the second guide rail 3 cooperate with each other to realize the two-dimensional movement of the lifting device 4 on the horizontal plane, so as to facilitate the casting process of the grooves 71 in different areas of the tray 7;

[0061] The lifting device 4 has the ability to accurately control the lifting height, ensuring that the upper glue injection device 5 and the cover plate 6 can accurately align and cover the groove 71, thereby achieving high-quality casting operations;

[0062] The groove 71 of the tray 7 is designed to match the size and shape of the device substrate 100 to ensure the stability and accuracy of the device substrate 100 during processing.

[0063] In this embodiment, a circle of enclosure 61 is fixed in the middle of the lower end surface of the cover plate 6, and multiple glue injection holes 63 are distributed around the lower end surface of the cover plate 6. A branch pipe 64 that passes through each glue injection hole 63 is provided above the cover plate 6, and the branch pipe 64 is connected to the upper glue injection device 5.

[0064] When the enclosure 61 covers the top of the groove 71 of the tray 7, the enclosure 61 can surround the filter chip 101 at the center of the device, and the upper glue injection device 5 injects glue into the upper surface of the substrate 100 around the enclosure 61 in the groove 71 through the glue injection holes 63 to form a first glue injection layer 104.

[0065] In this embodiment, a plurality of rubber sleeves 62 are distributed around the lower end surface of the cover plate 6, and each rubber sleeve 62 corresponds to the contact 102 on the device substrate 100. The rubber sleeve 62 can cover the copper pillar 103 with a certain clamping force, so that the copper pillar 103 is implanted into the first injection layer 104 after injection and cooling, and the copper pillar 103 is fitted with the contact 102, so that the contact 102 is led out.

[0066] In this embodiment, the front and rear surfaces of the tray 7 are rotatably connected to the base 1 , and the tray 7 is connected to a flip motor 16 .

[0067] The tray 7 can be turned over by the turning motor 16 so that the groove 71 faces downward.

[0068] In this embodiment, a bottom hole 8 is formed in the base 1 below the tray 7 , a lower cover 13 is connected to the bottom hole 8 via a lifting cylinder 15 , and a lower glue injection device 14 is provided in the lower cover 13 corresponding to each groove 71 of the tray 7 .

[0069] After the first glue injection layer 104 is completed, when the tray 7 is turned over so that the groove 71 faces downward, the lower cover plate 13 can be fitted with the tray 7 by raising the lower cover plate 13, and each groove 71 is closed, and then glue is injected into each groove 71 through the lower glue injection device 14 until it is combined with the first glue injection layer 104, thereby forming a second glue injection layer 105, and the second glue injection layer 105 closes the top of the filter chip 101 to form a cavity 106, so as to provide a low-impedance propagation environment, allowing the surface acoustic wave to effectively propagate on the surface of the piezoelectric substrate and complete the filtering function.

[0070] In this embodiment, the groove 71 of the tray 7 is through-connected from top to bottom, and a bottom plate 72 is provided below. The bottom plate 72 is provided with a plurality of protrusions, and the size of each protrusion matches that of each groove 71 .

[0071] When the bottom plate 72 is in contact with the tray 7 , the protrusions can push out the substrate 100 in the groove 71 .

[0072] In this embodiment, a plurality of springs 73 are disposed around the tray 7 and the bottom plate 72 . The springs 73 separate the tray 7 and the bottom plate 72 in a natural state and the protrusions are embedded in the grooves 71 .

[0073] In this embodiment, an eccentric wheel 11 is rotatably provided on the base 1 on both sides of the tray 7 , each of the eccentric wheels 11 is driven to rotate by a servo motor, and the side surface of the eccentric wheel 11 is in contact with the bottom plate 72 .

[0074] When the first injection layer 104 and the second injection layer 105 on the substrate 100 in the groove 71 are solidified, the tray 7 rotates to the bottom plate 72 facing downward, and the servo motor drives the eccentric wheel 11 to rotate so that the eccentric wheel 11 can push the bottom plate 72 upward, so that the protrusion pushes the substrate 100 in the groove 71 out for quick demoulding.

[0075] See also Figure 6 In this embodiment, the threading mechanism 9 has an L-shaped channel, the outlet of which is vertically facing upward, and a guide wheel 91 is rotatably provided at the bend in the channel;

[0076] A hydraulic shear 10 is provided at the outlet end of the threading mechanism 9 .

[0077] The two cover plates 6 are moved to above the exit ends of the two threading mechanisms 9 by the first guide rail 2 and the second guide rail 3 , the copper wire is pushed up by the guide wheel 91 to the rubber sleeve 62 inserted into the cover plates 6 , and the copper wire is cut by the hydraulic shear 10 , thereby forming a copper column 103 .

[0078] See also Figure 7 and Figure 8 , a surface acoustic wave device processing method, comprising the following steps:

[0079] S1, move the cover plate 6 to the top of the threading mechanism 9, push the copper wire into the rubber sleeve 62 of the cover plate 6 through the guide wheel 91, and cut the copper wire through the hydraulic shear 10 to form a copper column 103, which is combined with the cover plate 6 under the clamping force of the rubber sleeve 62, and insert the copper column 103 into each rubber sleeve 62 in turn;

[0080] S2, move the cover plate 6 with the copper pillar installed to above the tray 7, the cover plate 6 is lowered to cover the groove 71, and the enclosure 61 surrounds the filter chip 101.

[0081] S3, the upper glue injection device 5 injects glue into the groove 71 through the glue injection hole 63, and the glue uniformly covers the upper surface of the substrate 100 around the enclosure 61 to form a first glue injection layer 104, and at the same time, the copper pillar 103 is implanted in the first glue injection layer 104 and fits the contact 102;

[0082] S4, after waiting for the glue to be initially cured, glue is injected into each row of grooves 71 in turn to form a first glue injection layer 104 and implant copper pillars 103;

[0083] S5, the tray 7 is turned 180 degrees so that the groove 71 faces downward, and the lifting cylinder 15 drives the lower cover 13 to rise, and the tray 7 fits and closes the groove 71;

[0084] S6, injecting glue into each groove 71 through the lower glue injection device 14 until it combines with the first glue injection layer 104 to form a second glue injection layer 105;

[0085] S7, after the glue is completely cured, the tray 7 is flipped to the initial position again, and the servo motor drives the eccentric wheel 11 to rotate, pushing the bottom plate 72 to move upward, so that the protrusion pushes the substrate 100 in the groove 71 out, and a casting-molded shell with a cavity 106 is formed on the substrate 100;

[0086] S8, grinding the upper surface of the processed surface acoustic wave device to a predetermined thickness, thinning the thickness of the second injection layer 105, so that the copper pillar 103 is exposed, and obtaining a finished surface acoustic wave device (such as Fig. 9 as shown).

[0087] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A surface acoustic wave device processing device, characterized in that: include: Base, supporting structure; A first guide rail is fixed on both sides of the upper end surface of the base; A second guide rail, the second guide rail is slidably arranged on the first guide rail to achieve forward and backward movement; A lifting device, wherein the lifting device is slidably disposed on the second guide rail to achieve lateral movement; Two upper glue injection devices, each of which has a cover plate connected to its lower end; The lifting device is used to drive the two upper glue injection devices to perform lifting movements; A tray, the tray is arranged above the base, and the upper end surface of the tray is provided with two rows of parallel grooves, each groove is used to place the surface acoustic wave device substrate to be processed; The front and rear surfaces of the tray are rotatably connected to the base, and the tray is connected to a flip motor; the size of the cover plate matches the groove on the tray to cover and seal the groove; A bottom hole is provided at the base below the tray, a lower cover plate is connected to the bottom hole via a lifting cylinder, and a lower glue injection device is provided on each groove of the lower cover plate corresponding to the tray; The groove of the tray is through from top to bottom, and a bottom plate is provided below, and a plurality of protrusions are provided on the bottom plate, and the size of each protrusion matches that of each groove; Two copper wire threading mechanisms are arranged on the base, each of the threading mechanisms is equipped with a corresponding winding drum for providing copper wire; A circle of enclosure is fixed in the middle of the lower end surface of the cover plate, and a plurality of glue injection holes are distributed around the lower end surface of the cover plate. A branch pipe penetrating to each glue injection hole is provided above the cover plate, and the branch pipe is connected to the upper glue injection device; A plurality of rubber sleeves are distributed around the lower end surface of the cover plate, and each rubber sleeve corresponds to a contact point on the device substrate.

2. A surface acoustic wave device processing device according to claim 1, characterized in that: A plurality of springs are arranged around the tray and the bottom plate, and the springs separate the tray from the bottom plate in a natural state and embed the protrusions into the grooves.

3. The surface acoustic wave device processing device according to claim 1, characterized in that: An eccentric wheel is rotatably arranged on the bases on both sides of the tray, each of the eccentric wheels is driven to rotate by a servo motor, and the side surface of the eccentric wheel is in contact with the bottom plate.

4. The surface acoustic wave device processing device according to claim 1, characterized in that: An L-shaped channel is arranged in the threading mechanism, and an outlet end of the channel faces vertically upwards. A guide wheel is rotatably arranged at a bend in the channel.

5. The surface acoustic wave device processing device according to claim 4, characterized in that: A hydraulic shear is arranged at the outlet end of the threading mechanism.

6. A method for processing a surface acoustic wave device, using a surface acoustic wave device processing apparatus according to any one of claims 1 to 5, characterized in that: The processing method comprises the following steps: S1. Move the cover plate to the top of the threading mechanism, push the copper wire into the rubber sleeve of the cover plate through the guide wheel, and cut the copper wire through the hydraulic shear to form a copper column. The copper column is combined with the cover plate under the clamping force of the rubber sleeve, and the copper column is inserted into each rubber sleeve in turn; S2. Move the cover plate with the copper pillar installed above the tray, lower the cover plate to cover the groove, and surround the filter chip; S3, the upper glue injection device injects glue into the groove through the glue injection hole, and the glue evenly covers the upper surface of the substrate around the enclosure to form a first glue injection layer, and at the same time, the copper column is implanted in the first glue injection layer and fits the contact point; S4, after waiting for the glue to be initially cured, glue is injected into each row of grooves in turn to form a first glue injection layer and implant copper pillars; S5. The pallet turns 180 degrees so that the groove faces downward, and the lifting cylinder drives the lower cover plate to rise, and the pallet fits together to close the groove; S6, injecting glue into each groove through the glue injection device until it combines with the first glue injection layer to form a second glue injection layer; S7, after the glue is completely cured, the tray is flipped to the initial position again, and the servo motor drives the eccentric wheel to rotate, pushing the bottom plate to move upward, so that the convex block pushes the substrate in the groove out, and a casting-molded shell with a cavity is formed on the substrate; S8, grinding the upper surface of the processed surface acoustic wave device to a predetermined thickness, thinning the thickness of the second injection layer, so that the copper column is exposed, and obtaining a finished surface acoustic wave device.

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