Electronic device

Abstract

The embodiment of the invention provides electronic equipment which can solve the problem that the layout area of a circuit board is insufficient. The electronic equipment comprises a shell structure which at least comprises a first part and a second part, and the plane where the first part is located is different from the plane where the second part is located; the circuit board assembly is located on one side of the shell structure; the circuit board assembly comprises at least two layers of circuit boards, the at least two layers of circuit boards at least comprise a first circuit board and at least one layer of second circuit board which are stacked, the first circuit board is located on the side, away from the shell structure, of the second circuit board, and the distance from the first part to the first circuit board is larger than that from the second part to the first circuit board; the circuit board comprises a first surface and a second surface, functional devices are arranged at the positions, corresponding to the first part, of the circuit board assembly, the number of the surfaces provided with the functional devices is a first preset value, functional devices are arranged at the positions, corresponding to the second part, of the circuit board assembly, and the number of the surfaces provided with the functional devices is a second preset value. The first preset value is greater than the second preset value.

Description

[0001] This application is a divisional application of the Chinese patent application submitted to the State Intellectual Property Office on May 26, 2023, with application number 202310610247.4 and application name “Electronic Device”. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0003] As the functions of electronic devices such as mobile phones and tablets are gradually enriched and their performance is gradually improved, more devices are required to be integrated on the circuit board. The circuit board in conventional electronic devices has only one layer, and more devices can only be arranged in the plane direction. However, as the battery life capacity increases, the size of the circuit board decreases, resulting in a lack of layout area. Therefore, how to arrange more devices in a limited space is an urgent problem to be solved. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides an electronic device that can solve the problem of insufficient layout area.

[0005] In a first aspect, an embodiment of the present application provides an electronic device, which includes: a shell structure, including at least a first part and a second part, and the plane where the first part is located is different from the plane where the second part is located; a circuit board assembly, along a first direction, the circuit board assembly is located on one side of the shell structure, wherein the first direction is perpendicular to the plane where the first part is located; the circuit board assembly includes at least two layers of circuit boards, the at least two layers of circuit boards include at least a first circuit board and at least one second circuit board that are stacked, along the first direction, the first circuit board is located on the side of the second circuit board away from the shell structure, and the distance from the first part to the first circuit board is greater than the distance from the second part to the first circuit board; along the first direction, the circuit board includes two opposite surfaces, the two surfaces include a first surface and a second surface, functional devices are arranged on the first surface and / or the second surface, the circuit board assembly is provided with a functional device at a position corresponding to the first part, and the number of surfaces provided with the functional devices is a first preset value; the circuit board assembly is provided with a functional device at a position corresponding to the second part, and the number of surfaces provided with the functional devices is a second preset value, and the first preset value is greater than the second preset value.

[0006] Exemplarily, the first direction is the Z-axis direction in the embodiment.

[0007] Exemplarily, the plane where the first portion is located is parallel to the plane where the second portion is located.

[0008] Exemplarily, the plane where each circuit board is located is parallel to the plane where the first part is located.

[0009] Exemplarily, the position of the circuit board assembly corresponding to the first part is an area where a projection of the circuit board assembly on the plane formed by the X-axis and the Y-axis overlaps with a projection of the first part on the plane formed by the X-axis and the Y-axis.

[0010] Exemplarily, the position of the circuit board assembly corresponding to the second part is an area where a projection of the circuit board assembly on the plane formed by the X-axis and the Y-axis overlaps with a projection of the second part on the plane formed by the X-axis and the Y-axis.

[0011] Since each circuit board includes only two surfaces, the number of surfaces on which the functional devices are set is not only related to which surface of the circuit board the functional devices are set, but also related to the number of circuit boards. Since the plane where the first part is located is different from the plane where the second part is located, the height limit of the circuit board assembly by the shell structure is different. The embodiment of the present application increases the number of circuit boards in the space in the Z-axis direction by flexibly utilizing the height limit difference, and the number of surfaces on which the functional devices are set at different positions is different, or the number of circuit boards is the same, but due to the different number of surfaces on which the functional devices are set, the height of the circuit board assembly in the Z-axis direction is different, so as to make full use of the space of the electronic device in the Z-axis direction, increase the device layout area, improve the device integration, and solve the problem of insufficient layout area.

[0012] According to the first aspect, the number of circuit boards at the position of the circuit board assembly corresponding to the first part is a third preset value, the number of circuit boards at the position of the circuit board assembly corresponding to the second part is a fourth preset value, and the third preset value is greater than or equal to the fourth preset value.

[0013] Exemplarily, the number of circuit boards at the position of the circuit board assembly corresponding to the first part of the shell structure is three, the number of circuit boards at the position of the circuit board assembly corresponding to the second part of the shell structure is two, the number of surfaces of the three circuit boards is six, the number of surfaces of the two circuit boards is four, functional devices are arranged on five of the six surfaces, and functional devices are arranged on three of the four surfaces.

[0014] Exemplarily, at a position in the circuit board assembly corresponding to the first part of the shell structure, there are two circuit boards, and functional devices are arranged on four surfaces of the two circuit boards; at a position in the circuit board assembly corresponding to the second part of the shell structure, there are two circuit boards, and functional devices are arranged on three of the four surfaces of the two circuit boards.

[0015] According to the first aspect, or any implementation of the first aspect above, the circuit board assembly also includes at least one third circuit board, the first circuit board includes at least a first area and a second area, the second circuit board is at least located in the first area, and the first circuit board and at least one layer of the second circuit board are stacked in sequence, and the third circuit board is at least located in the second area, and the first circuit board and at least one layer of the third circuit board are stacked in sequence; the circuit board assembly also includes a supporting connector, which is located between two adjacent circuit boards, used to support the circuit board and electrically connect the two adjacent circuit boards; the first area is opposite to the first part, and the second area is opposite to the second part, functional devices are arranged in the first area, and the number of surfaces with functional devices is a first preset value, and functional devices are arranged in the second area, and the number of surfaces with functional devices is a second preset value.

[0016] That is, the number of circuit boards is large, so that more functional devices can be arranged without occupying the horizontal size of the electronic equipment.

[0017] Exemplarily, the second circuit board is located not only in the first area but also in other areas, and the third circuit board is located not only in the second area but also in other areas.

[0018] According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a back cover, and the shell structure is the back cover of the electronic device. Of course, the shell structure is not limited to the back cover, and can also be other structures.

[0019] When the shell structure is a back cover, the specific structure of the circuit board assembly can be set according to the shape of the back cover, thereby making full use of the space in the Z-axis direction, increasing the device layout area, improving the device integration, and solving the problem of insufficient layout area.

[0020] According to the first aspect, or any implementation of the first aspect above, the electronic device also includes a back cover, which is provided with a decorative hole; the shell structure includes a camera decorative part (hereinafter referred to as the decorative part), the camera decorative part includes a shielding part and a skirt, the skirt at least partially surrounds the shielding part, the decorative part is fixed to the battery cover through the skirt, and the shielding part is exposed through the decorative hole; the first part is the shielding part, and the second part is the skirt; wherein, H1>H2>H3, H1 is the distance from the shielding part to the first circuit board, H2 is the distance from the back cover to the first circuit board, and H3 is the distance from the skirt to the first circuit board; the first circuit board includes a first area, a second area and a third area; the first area is opposite to the shielding part, the second area is opposite to the skirt, and the third area is opposite to the preset area of ​​the back cover, wherein the preset area of ​​the back cover is the part where the projection of the back cover on the plane where the first circuit board is located overlaps with the third area; the number of surfaces provided with functional devices at the first area is greater than the number of surfaces provided with functional devices at the second area, and is greater than the number of surfaces provided with functional devices at the third area.

[0021] That is to say, the space between the plane where the shielding part is located and the first circuit board is larger, the space between the plane where the back cover is located and the first circuit board is moderate, and the space between the plane where the skirt is located and the first circuit board is smaller. More functional components and / or functional components with larger heights are arranged in the area with larger space, a moderate number of functional components and / or functional components with moderate heights are arranged in the area with moderate space, and fewer functional components and / or functional components with smaller heights are arranged in the area with smaller space, so as to make full use of the space of the electronic device in the Z-axis direction and solve the problem of insufficient layout area.

[0022] According to the first aspect, or any implementation of the first aspect above, along the second direction, the second area includes a first sub-area and a second sub-area arranged on both sides of the first area, wherein the second direction is perpendicular to the first direction; the circuit board assembly includes a first circuit board, two layers of second circuit boards and a layer of third circuit board, the two layers of second circuit boards are stacked in the first area, and the second circuit board adjacent to the first circuit board extends to the second sub-area and the third area, and the third circuit board is at least arranged in the second sub-area; the first surface is located on the side of the second surface away from the shell structure; functional devices are arranged on both surfaces of the first circuit board, functional devices are arranged on both surfaces of the second circuit board adjacent to the first circuit board, functional devices are arranged on the second surface of the second circuit board away from the first circuit board, and functional devices are arranged on the second surface of the third circuit board.

[0023] That is, the first area, the second sub-area and the third area share the same second circuit board, so as to reduce the number of circuit boards and further simplify the process steps.

[0024] Exemplarily, the second direction is the Y-axis direction in the embodiment.

[0025] According to the first aspect, or any implementation of the first aspect above, along the first direction, the height of the first functional device is less than the height of the second functional device, wherein the first functional device is the highest functional device arranged on the second surface of the first circuit board in the first sub-region, and the second functional device is the highest functional device arranged on the second surface of the first circuit board in other regions, so as to reduce the thickness of the supporting connector in the first sub-region, thereby ensuring that the overall thickness of the circuit board assembly in the first sub-region is small.

[0026] According to the first aspect, or any implementation of the first aspect above, along the first direction, the height of the functional components on the second surface of the third circuit board is greater than the height of the functional components on the surfaces of other circuit boards, that is, the functional components with higher heights are concentrated on the second surface of the third circuit board to avoid the waste of Z-axis space caused by the uneven heights of the functional components arranged in other areas.

[0027] According to the first aspect, or any implementation of the first aspect above, the functional components on the second surface of the third circuit board include components with relatively high height, such as a board-to-board connector.

[0028] According to the first aspect, or any implementation of the first aspect above, the second surface of the first circuit board, the first surface of the second circuit board adjacent to the first circuit board, and the supporting connector form a first accommodating space, the second surface of the second circuit board adjacent to the first circuit board, the first surface of the second circuit board away from the first circuit board, and the supporting connector form a second accommodating space, and the second surface of the first circuit board, the first surface of the third circuit board, and the supporting connector form a third accommodating space; the functional devices on the second surface of the first circuit board corresponding to the first area, the second sub-area, and the third area and the functional devices on the first surface of the second circuit board adjacent to the first circuit board are all located in the first accommodating space, the functional devices on the second surface of the second circuit board adjacent to the first circuit board and corresponding to the first area are located in the second accommodating space, and the functional devices on the second surface of the first circuit board corresponding to the first sub-area are located in the third accommodating space, so as to protect the functional devices.

[0029] According to the first aspect, or any implementation of the first aspect above, a shielding cover is provided on the outside of at least part of the functional components in the first surface of the first circuit board, the second surface of the second circuit board away from the first circuit board, and the second surface of the second circuit board adjacent to the first circuit board and corresponding to the second sub-area to protect the functional components.

[0030] Exemplarily, a shielding cover is provided on the outer side of the functional device on the first surface of the first circuit board, a shielding cover is provided on the outer side of the functional device on the second surface of the second circuit board away from the first circuit board, and / or a shielding cover is provided on the outer side of the functional device on the second surface of the second circuit board adjacent to the first circuit board and corresponding to the second sub-area.

[0031] According to the first aspect, or any implementation method of the first aspect above, a light-transmitting hole is opened on the shielding portion; the electronic device also includes a camera module, the projection of the camera module on the plane where the first part is located overlaps with the projection of the shielding portion on the plane where the first part is located, and the camera module collects light through the light-transmitting hole to realize the shooting function of the electronic device and improve the shooting effect of the camera module.

[0032] According to the first aspect, or any implementation of the first aspect above, the thickness of the camera module is greater than the distance from the shielding portion to the first circuit board; the first circuit board also includes a fourth area, the fourth area is opposite to the shielding portion, the first circuit board is provided with an avoidance hole at the fourth area, and one end of the camera module passes through the avoidance hole. That is, the normal operation of the camera module is ensured, and the space of the electronic device in the Z-axis direction is fully utilized, the device layout area is increased, the device integration is improved, and the problem of insufficient layout area is solved.

[0033] According to the first aspect, or any implementation of the first aspect above, the difference between the distance from the shielding portion to the first circuit board and the thickness of the camera module is within a preset range; the first circuit board also includes a fourth area, the fourth area is opposite to the shielding portion, the camera module is arranged at the fourth area of ​​the first circuit board, and the camera module is fixed and supported by the first circuit board. In this way, the setting position of the camera module is more flexible, and the area of ​​the support member of the middle frame can be released, so that other structures can be arranged on the support member.

[0034] According to the first aspect, or any implementation of the first aspect above, the difference between the distance from the shielding portion to the third circuit board and the thickness of the camera module is within a preset range; the third circuit board extends to the bottom of the camera module, the camera module is arranged on the third circuit board, and the camera module is fixed and supported by the third circuit board. In this way, the setting position of the camera module is more flexible, and the area of ​​the support member of the middle frame can be released, so that other structures can be arranged on the support member.

[0035] According to the first aspect, or any implementation of the first aspect above, when the circuit board assembly further includes a supporting connector, the supporting connector includes a frame board. The frame board is a type of PCB, which has the same or substantially the same structure as a conventional PCB, and has wiring for achieving electrical connection therein. The frame board can be obtained by segmenting a whole PCB. When the frame board is disposed on the circuit board, the frame board occupies less area of ​​the circuit board, and area can be saved to arrange more devices.

[0036] According to the first aspect, or any implementation of the first aspect above, when the circuit board assembly further includes a supporting connector, the supporting connector is formed integrally with the circuit board. For example, the supporting connector and the circuit board formed integrally can be formed by a manufacturing process of a cavity (local recess) structure of a PCB, and since the supporting connector and the circuit board do not need to be reflow soldered, the number of reflows can be reduced, thereby avoiding the impact on functional devices on the circuit board when the number of reflows is large. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0038] Figure 2 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0039] Figure 3 for Figure 1 A cross-sectional view of the electronic device shown along the WW' direction;

[0040] Figure 4 A schematic diagram of the structure of a decorative element provided in an embodiment of the present application;

[0041] Figure 5 A top view position relationship diagram of a decorative component and a circuit board assembly provided in an embodiment of the present application;

[0042] Figure 6 A side view position relationship diagram of a decorative element, a circuit board assembly and a battery cover provided in an embodiment of the present application;

[0043] Figure 7 Another side view position relationship diagram of the decorative element, circuit board assembly and battery cover provided in the embodiment of the present application;

[0044] Figure 8 Another side view position relationship diagram of the decorative element, circuit board assembly and battery cover provided in the embodiment of the present application;

[0045] Fig. 9 Another side view position relationship diagram of the decorative element, circuit board assembly and battery cover provided in the embodiment of the present application;

[0046] Fig.10 A flow chart of a method for preparing a circuit board assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0048] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0049] The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.

[0050] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0051] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more than two. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

[0052] The embodiment of the present application provides an electronic device, which may be a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), a car computer, a television, a smart wearable device (such as a smart watch, a smart bracelet, etc.), a smart home device, etc. The embodiment of the present application does not specifically limit the specific form of the above electronic device. For the convenience of explanation, the following description is made by taking the electronic device as an example.

[0053] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 1 As shown, the mobile phone includes a middle frame 10 , a shell assembly 20 and a display screen 30 .

[0054] Figure 1 In the figure, the mobile phone 100 is in the shape of a rectangular flat plate. In order to facilitate the clear description of the subsequent structural features and the positional relationship of the structural features, the positional relationship of the various structures in the mobile phone is specified in the X-axis direction, the Y-axis direction and the Z-axis direction, wherein the X-axis direction is the width direction of the mobile phone, the Y-axis direction (also called the second direction) is the length direction of the mobile phone, and the Z-axis direction (also called the first direction) is the thickness direction of the mobile phone. It can be understood that the coordinate system (i.e., the X-axis, Y-axis and Z-axis) of the electronic device can be flexibly set according to actual needs, and no specific limitation is made here. In other optional embodiments, the shape of the electronic device can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc. Of course, the electronic device can also be a foldable electronic device, etc.

[0055] See also Figure 2, Figure 2 This is an exploded diagram of an electronic device provided in an embodiment of the present application. Figure 1 and Figure 2 As shown, the middle frame 10 includes an appearance part 11 and a support part (not shown in the figure). The appearance part 11 of the middle frame 10, the shell assembly 20 and the display screen 30 can surround the accommodating cavity, and the support part of the middle frame 10 is located between the display screen 30 and the shell assembly 20. The accommodating cavity is provided with structures such as a printed circuit board (PCB) 40, a flexible printed circuit (FPC) 50, a camera module 60, and a battery 70. The support part of the middle frame 10 can support some structures and / or the display screen 30 in the accommodating cavity, for example, the display screen 30 is fixed to the support part by adhesive.

[0056] In the embodiment of the present application, the PCB 40 includes a main board 41 and a sub-board 42. Along the Y-axis direction, the main board 41 and the sub-board 42 are arranged on both sides of the battery 70. The FPC 50 passes through the battery 70 (located on one side of the battery 70 along the Z-axis direction) to electrically connect the main board 41 and the sub-board 42 to realize the transmission of data and signals between the main board 41 and the sub-board 42.

[0057] Functional devices such as control chips are integrated on the mainboard 40. The control chip includes, for example, a system on chip (SoC), an application processor (AP), a radio frequency device, and a baseband device (not shown in the figure). Among them, the SoC integrates, for example, a central processing unit (CPU), a graphic processing unit (GPU), and a modem.

[0058] The sub-board 50 integrates functional devices such as Universal Serial Bus (USB) devices.

[0059] The so-called functional devices are all electronic components arranged on the PCB, which include, for example, chips with control functions, USB devices, etc., as well as passive devices such as resistors, capacitors, and inductors.

[0060] The camera module 60 includes, for example, a rear camera 61, and the number of the rear cameras 61 may be one or more. When the number of the rear cameras 61 is multiple, the functions of the multiple rear cameras 61 may be different. In one possible implementation, the number of the rear cameras 61 is, for example, three, one of which is responsible for the main camera, one of which is responsible for zooming, and one of which is responsible for wide angle, etc. In some embodiments, the camera module 60 also includes a flash 62. When a user uses the camera function of the mobile phone to take pictures in a dark environment, the flash 62 can provide fill light to improve the shooting effect.

[0061] The rear camera 61 is electrically connected to the main board 41 through the FPC 50. In some embodiments, a board-to-board connector (BTB) (not shown in the figure) is provided between the FPC 50 of the rear camera 61 and the main board 41, and the FPC 50 of the rear camera 61 is electrically connected to the main board 41 through the BTB. Similarly, the FPC 50 electrically connected to the main board 41 and the sub-board 42 can also be electrically connected to the main board 41 and the sub-board 42 through the BTB, that is, one BTB can be provided between the main board 41 and the FPC 50 (the FPC 50 electrically connected to the main board 41 and the sub-board 42), and the FPC 50 is electrically connected to the main board 41 through the BTB, and another BTB can be provided between the sub-board 42 and the FPC 50, and the same FPC 50 is electrically connected to the sub-board 42 through the BTB, so that the main board 41 and the sub-board 42 are electrically connected through the FPC 50.

[0062] The battery 70 is used to supply power to the display screen 30 , at least some functional components on the main board 41 , at least some functional components on the sub-board 42 , and the camera module 60 , etc., to ensure their normal operation.

[0063] Continue to see Figure 1 and Figure 2 The housing assembly 20 includes a battery cover (also called a rear cover or a rear shell) 21 and a decorative member 22 . A decorative hole 211 is formed on the battery cover 21 .

[0064] See also Figure 3 , Figure 3 for Figure 1 The cross-sectional view of the electronic device along the WW' direction shown in FIG. 1 is a cross-sectional view of the electronic device along the WW' direction. It should be noted that in order to more clearly show the positional relationship between the battery cover 21, the decorative member 22 and the camera module 60, Figure 3 Only the battery cover 21, the decorative member 22 and the camera module 60 are shown, and other structures such as the display screen 30 are not shown. Figure 2 and Figure 3As shown, the decorative member 22 includes a shielding portion 221 and a skirt 222, and the skirt 222 is arranged around the shielding portion 221. The plane where the shielding portion 221 is located (i.e., the plane formed by the X-axis and the Y-axis) is different from the plane where the skirt 222 is located (i.e., the plane formed by the X-axis and the Y-axis), that is, the shielding portion 221 and the skirt 222 are located in different planes, respectively. Accordingly, the decorative member 22 also includes, for example, a connecting portion 223 connecting the shielding portion 221 and the skirt 222. A light-transmitting hole 2211 is opened on the shielding portion 221.

[0065] The decorative member 22 is fixed to the battery cover 21 through the skirt 222, the shielding portion 221 of the decorative member 22 is exposed through the decorative hole 211 of the battery cover 21, and at least a portion of the connecting portion 223 is located in the decorative hole 211. Along the Z-axis direction, the rear camera 61 is opposite to the shielding portion 221, that is, the projection of the rear camera 61 on the plane formed by the X-axis and the Y-axis overlaps with the projection of the shielding portion 221 on the plane formed by the X-axis and the Y-axis, and the rear camera 61 collects light through the light-transmitting hole 2211 to realize functions such as taking pictures and / or video.

[0066] It should be noted here that Figure 1-Figure 3 The connection portion 223 is respectively perpendicular to the shielding portion 221 and the skirt 222 as an example for description, but it does not constitute a limitation of the present application. In other optional embodiments of the present application, see Figure 4 , Figure 4 A structural diagram of a decorative element provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the connection portion 223 can also be set at an angle. For example, the connection portion 223 is in the shape of a crater. The so-called crater shape is a trumpet shape that is narrow at the top and wide at the bottom. By setting the crater shape, the appearance quality of the electronic device can be improved.

[0067] The shape of the decorative hole 211 is not limited in the embodiment of the present application. For example, the shape of the decorative hole 211 may include a runway shape, a circle, a rounded square or a rounded rectangle, etc. The embodiment of the present application takes the shape of the decorative hole 211 as a circle as an example for description. It can be understood that the runway shape may be a shape of two arcs and a rectangle on opposite sides, wherein the two arcs are arranged opposite to each other and the two arcs are respectively adjacent to the opposite sides.

[0068] It is understandable that the shape of the shielding portion 221 corresponds to the shape of the decorative hole 211. Exemplarily, when the shape of the decorative hole 211 is circular, the shape of the shielding portion 221 is also circular.

[0069] As can be seen from the background technology, as the functions of electronic devices such as mobile phones and tablets are gradually enriched and the performance is gradually improved, it is required that more devices can be integrated on the PCB (i.e., the main board and / or the sub-board). The PCB in conventional electronic devices has only one layer, and more devices can only be arranged in the plane direction. However, as the battery life capacity increases (i.e., the size of the battery increases), the size of the circuit board decreases accordingly; and in order to meet better shooting needs, the number of cameras included in the camera module is increasing, and the size of the camera module becomes larger, resulting in the central area of ​​the mainboard being larger and larger due to the hole digging to avoid the camera module, which in turn leads to the reduction of the projection area of ​​the mainboard on the plane formed by the X-axis and the Y-axis. As a result, the PCB layout area is insufficient. In other words, the area of ​​the PCB where the functional devices are set is small, which cannot meet the requirement that more devices can be integrated on the PCB.

[0070] Based on this, an embodiment of the present application also provides an electronic device, which includes a shell structure and a circuit board assembly located on one side of the shell structure. When the heights of different areas of the shell structure are different, the number of surfaces (surfaces of the circuit board) on which functional devices are arranged in different areas of the shell structure in the circuit board assembly is different, and the number of surfaces on which functional devices are arranged in different positions in the circuit board assembly corresponding to the same area (same height) of the shell structure may be the same or different. Wherein, the circuit board assembly includes at least two layers of circuit boards, and each layer of circuit boards includes two opposite surfaces along the Z-axis direction. The number of surfaces on which the functional devices are arranged may be different, and the number of circuit board layers corresponding to different regions of the housing structure in the circuit board assembly is different, and functional devices are arranged on both surfaces of each circuit board. It may also be that the number of circuit board layers corresponding to different regions of the housing structure in the circuit board assembly is the same, but the number of surfaces on which the functional devices are arranged is different. It may also be that the number of circuit board layers corresponding to different regions of the housing structure in the circuit board assembly is different, and the number of surfaces on which the functional devices are arranged is also different, that is, the number of circuit boards is increased by using the space of the electronic device in the Z-axis direction, thereby increasing the device layout area and improving the device integration. Different regions of the housing structure have different height limits on the circuit board assembly, and accordingly, the number of surfaces on which the functional devices are arranged in the circuit board assembly corresponding to different regions is different, so that the space of the electronic device in the Z-axis direction is fully utilized to solve the problem of insufficient layout area. Wherein, the housing structure may be, for example, the decorative part mentioned above, or a battery cover (for example, for electronic devices with different heights of different regions of the battery cover, such as a smart watch), etc., and the embodiments of the present application are not limited to this.

[0071] The specific structure of the shell structure and the circuit board assembly provided in the embodiment of the present application and the positional relationship of each structure are explained below with reference to specific examples. In order to more conveniently and clearly describe the subsequent scheme, the following example uses the shell structure as a decorative part to illustrate the specific structure of the shell structure and the circuit board assembly and the positional relationship of each structure. The following content does not constitute a limitation of the present application.

[0072] It can be understood that when the shell structure is a battery cover, etc., the specific structure of the circuit board assembly corresponding to different areas of the battery cover and the effects produced are the same as the examples below where the shell structure is a decorative part. The specific structure of the circuit board assembly when the shell structure is a battery cover and the positional relationship of each structure will not be repeated below.

[0073] See also Figure 5 and Figure 6 , Figure 5 A top view of the position relationship between the decorative element and the circuit board assembly provided in an embodiment of the present application, Figure 6 A side view of the position relationship of the decorative element, circuit board assembly and battery cover provided in the embodiment of the present application. Figure 5 and Figure 6As shown, the PCB 40 includes a circuit board assembly 43, that is, the main board 41 and / or the sub-board 42 in the above content are the circuit board assembly 43, wherein the embodiments of the present application are all described by taking the main board 41 as the circuit board assembly 43 as an example. The circuit board assembly 43 includes a first circuit board 431, the first circuit board 431 includes at least two areas, the at least two areas include a first area A1 and a second area A2, the circuit board assembly 43 also includes at least one second circuit board 432 stacked at the first area A1 and at least one third circuit board 433 stacked at the second area A2, along the Z-axis direction, the adjacent two layers of circuit boards are stacked at intervals, the so-called adjacent two layers of circuit boards are stacked at intervals, that is, along the Z-axis direction, there is a certain distance between the adjacent two layers of circuit boards, and they are not in direct contact. The circuit board assembly 43 also includes a supporting connector 434, along the Z-axis direction, the supporting connector 434 is located between the adjacent two layers of circuit boards, for supporting the circuit board, and electrically connecting the adjacent two circuit boards. The adjacent two circuit boards and the supporting connector 434 located between the adjacent two layers of circuit boards enclose a receiving space. Along the Z-axis direction, each layer of the circuit board includes a first surface and a second surface facing each other, and a functional device 80 is arranged on the first surface and / or the second surface of each layer of the circuit board, and the functional device 80 located between two adjacent layers of the circuit board is arranged in the accommodation space, that is, along the Z-axis direction, the first circuit board 431, the second circuit board 432 and the third circuit board 433 all include a first surface and a second surface facing each other, and a functional device 80 is arranged on the first surface and / or the second surface of the first circuit board 431, and a functional device 80 is arranged on the first surface and / or the second surface of the second circuit board 432, and a functional device 80 is arranged on the first surface and / or the second surface of the third circuit board 433. The functional device 80, the functional device 80 between the first circuit board 431 and one of the second circuit boards 432 is located in the accommodation space surrounded by the first circuit board 431, one of the second circuit boards 432 and the supporting connecting member 434 between the two circuit boards, the functional device 80 between the two second circuit boards 432 is located in the accommodation space surrounded by the two second circuit boards 432 and the supporting connecting member 434 between the two second circuit boards 432, and the functional device 80 between the first circuit board 431 and the third circuit board 433 is located in the accommodation space surrounded by the first circuit board 431, the third circuit board 433 and the supporting connecting member 434 between the two circuit boards.

[0074] As can be seen from the foregoing, the decorative element includes a shielding portion 221 (also referred to as a first portion) and a skirt 222 (also referred to as a second portion), and the shielding portion 221 and the skirt 222 are located in different planes. Specifically, along the Z-axis direction, the distance from the plane where the shielding portion 221 is located to the first circuit board 431 is greater than the distance from the plane where the skirt 222 is located to the first circuit board 431. The first area A1 is opposite to the shielding portion 221, and the second area A2 is opposite to the skirt 222, that is, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the first area A1, and the projection of the skirt 222 on the first circuit board 431 overlaps with the second area A2. The number of surfaces provided with functional devices in the first area A1 is greater than the number of surfaces provided with functional devices in the second area A2. Since each circuit board includes only two surfaces, the number of surfaces provided with functional devices is related to the number of circuit boards. When the number of surfaces provided with functional devices in the first area A1 is greater than the number of surfaces provided with functional devices in the second area A2, the number of second circuit boards 432 located in the first area A1 may be greater than the number of third circuit boards 433 located in the second area A2, or the number of second circuit boards 432 located in the first area A1 is the same as the number of third circuit boards 433 located in the second area A2, but no functional devices are provided on the first surface or the second surface of the third circuit board 433 located in the second area A2. In this way, the heights of the circuit board assembly 43 in the Z-axis direction are different in the first area A1 and the second area A2, and thus they may correspond to different parts of the decorative element (the first area A1 corresponds to the first part, and the second area A2 corresponds to the second part). Compared with providing more functional devices in the plane direction, the embodiment of the present application can make full use of the space of the electronic device in the Z-axis direction to solve the problem of insufficient layout area.

[0075] That is to say, the distance from the plane where the shielding portion 221 is located to the first circuit board 431 is greater than the distance from the plane where the skirt 222 is located to the first circuit board 431. Therefore, the space between the plane where the shielding portion 221 is located and the first circuit board 431 is larger, and the space between the plane where the skirt 222 is located and the first circuit board 431 is smaller. More functional components 80 and / or functional components 80 with larger heights are arranged in areas with larger space, and fewer functional components 80 and / or functional components 80 with smaller heights are arranged in areas with smaller space, so as to make full use of the space of the electronic equipment in the Z-axis direction and solve the problem of insufficient layout area.

[0076] It should be noted that the number of surfaces provided with functional devices at different positions in the same area may be the same or different, and may be specifically determined according to the height of the functional devices provided at different positions. For example, the second area A2 includes a first sub-area A21 and a second sub-area A22, both of which are provided with two-layer circuit boards, and the first sub-area A21 is provided with devices with a relatively high height such as a BTB, therefore, only three of the four surfaces of the first sub-area A21 are provided with functional devices, while all four surfaces of the second sub-area A22 are provided with functional devices.

[0077] For example, see Figure 5 and Figure 6 The circuit board assembly 43 includes a first circuit board 431, and the first circuit board 431 includes a first area A1, a second area A2, and a third area A3. The first area A1 is opposite to the shielding portion 221, that is, the projection of the shielding portion 221 on the plane where the first circuit board 431 is located overlaps with the first area A1, the second area A2 is opposite to the skirt 222, that is, the projection of the skirt 222 on the plane where the first circuit board 431 is located overlaps with the second area A2, and the third area A3 is opposite to the preset area of ​​the battery cover 21, and the preset area of ​​the battery cover 21 is the portion where the projection of the battery cover 21 on the plane where the first circuit board 431 is located overlaps with the third area A3. The second area A2 includes a first sub-area A21 and a second sub-area A22. The first sub-area A21 and the second sub-area A22 correspond to different positions of the skirt 222. For example, the first sub-area A21 corresponds to a first position 2221 of the skirt 222, and the second sub-area A22 corresponds to a second position 2222 of the skirt 222. Along the Y-axis direction, the first position 2221 and the second position 2222 are located on opposite sides of the shielding portion 221. The shielding portion 221, the skirt 222 and the preset area of ​​the battery cover 21 are all located in different planes. Specifically, along the Z-axis direction, the distance H1 from the plane where the shielding portion 221 is located to the first circuit board 431 is greater than the distance H2 from the plane where the preset area of ​​the battery cover 21 is located to the first circuit board 431, and the distance H2 from the plane where the preset area of ​​the battery cover 21 is located to the first circuit board 431 is greater than the distance H3 from the plane where the skirt 222 is located to the first circuit board 431.

[0078] The circuit board assembly 43 also includes two layers of second circuit boards 432 stacked in the first area A1 and a layer of third circuit boards 433 stacked in the first sub-area A21 of the second area A2, and the second circuit board 432 adjacent to the first circuit board 431 in the two layers of second circuit boards 432 arranged in the first area A1 extends to the second sub-area A22 and the third area A3 of the second area A2. This is because most of the area relative to the shielding portion 221 is used to set the camera module 60, and the remaining area can be used to set the circuit board. The circuit board of the area adjacent to the remaining area (i.e., the area where the second sub-area A22 is located) and the circuit board of the area adjacent to the second sub-area A22 where the third area A3 is located can be the same circuit board as the circuit board set in the remaining area to reduce the number of circuit boards and thereby simplify the process steps. In this way, the first area A1 includes three layers of circuit boards (one layer of first circuit board 431 and two layers of second circuit boards 432), the first sub-area A21 of the second area A2 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of third circuit board 433), the second sub-area A22 of the second area A2 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of second circuit board 432), the third area A3 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of second circuit board 432), and the second circuit board 432 of the second sub-area A22 and the second circuit board 432 of the third area A3 are the same circuit board as one of the second circuit boards 432 in the first area A1 (the second circuit board 432 adjacent to the first circuit board 431).

[0079] Along the Z-axis direction, the first circuit board 431 and the third circuit board 433 are stacked with each other, and the first circuit board 431 and the two second circuit boards 432 are stacked with each other in sequence, that is, the first circuit board 431 and one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431) are stacked with each other, and one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431) and the other second circuit board 432 (the second circuit board 432 away from the first circuit board 431) are stacked with each other.

[0080] The circuit board assembly 43 further includes a supporting connector 434. Along the Z-axis direction, at least one supporting connector 434 (also referred to as a first supporting connector) is disposed between the first circuit board 431 and one of the second circuit boards 432. For example, at least one supporting connector 434 is disposed at the periphery of the second circuit board 432. The supporting connector 434 is used to support the second circuit board 432 and electrically connect the first circuit board 431 and the second circuit board 432. At least one supporting connector is also disposed between one of the second circuit boards 432 (a second circuit board 432 that is adjacent to the first circuit board 431) and another second circuit board 432 (a second circuit board 432 that is away from the first circuit board 431). Connector 434 (also called second supporting connector), at least one supporting connector 434 is, for example, disposed at the periphery of another second circuit board 432, and the supporting connector 434 is used to support another second circuit board 432 and electrically connect the two second circuit boards 432; at least one supporting connector 434 (also called third supporting connector) is also disposed between the first circuit board 431 and the third circuit board 433, at least one supporting connector 434 is, for example, disposed at the periphery of the third circuit board 433, and the supporting connector 434 is used to support the third circuit board 433 and electrically connect the first circuit board 431 and the third circuit board 433. Along the Z-axis direction, each circuit board includes a first surface and a second surface facing away from each other, and the second surface is located on the side of the first surface facing away from the display screen 30, or in other words, the first surface is located on the side of the second surface facing away from the battery cover 21. The second surface of the first circuit board 431, the first surface of the third circuit board 433 and the third supporting connecting member 434 between the first circuit board 431 and the third circuit board 433 form a accommodating space (also called the third accommodating space), the second surface of the first circuit board 431, the first surface of one of the second circuit boards 432 and the first supporting connecting member 434 between the first circuit board 431 and the second circuit board 432 form another accommodating space (also called the first accommodating space), the second surface of one of the second circuit boards 432, the first surface of another second circuit board 432 and the second supporting connecting member 434 between the two second circuit boards 432 form another accommodating space (also called the second accommodating space).

[0081] Functional devices 80 are provided on the first surface and the second surface of the first circuit board 431, wherein functional devices 80 are provided on the first surface and the second surface of one second circuit board 432 (the second circuit board 432 adjacent to the first circuit board 431), functional devices 80 are provided on the second surface only of the other second circuit board 432, and functional devices 80 are provided on the second surface only of the third circuit board 433, and the height of the highest functional device 80 in the first sub-area A21 of the second area A2 is less than the height of the highest functional device 80 in the first area A1, so as to reduce the thickness of the supporting connecting member 434 between the first circuit board 431 and the third circuit board 433, thereby ensuring that the overall thickness of the circuit board assembly 43 of the first sub-area A21 is as small as possible. The functional device 80 on the second surface of the first circuit board 431 corresponding to the first area A1, the second sub-area A22 and the third area A3 and the functional device 80 on the first surface of the second circuit board 432 are both located in the first accommodation space, the functional device 80 on the second surface of the second circuit board 432 adjacent to the first circuit board 431 and corresponding to the first area A1 are located in the second accommodation space, and the functional device 80 on the second surface of the first circuit board 431 corresponding to the first sub-area are located in the third accommodation space to protect the functional device 80. In addition, a shielding cover 90 can be set on the outside of the functional device 80 that is not set in the accommodation space to protect the functional device 80, such as the functional device 80 on the first surface of the first circuit board 431 and the functional device 80 on the second surface of the second circuit board 432 are both provided with a shielding cover 90.

[0082] That is to say, since the distances from the shielding portion 221 of the decorative member 22, the skirt 222 of the decorative member 22 and the preset area of ​​the battery cover 21 to the first circuit board 41 are different, that is, the heights of the circuit board assembly 43 restricted by the shielding portion 221 of the decorative member 22, the skirt 222 of the decorative member 22 and the preset area of ​​the battery cover 21 are different, by utilizing the height limit difference, the five surfaces in the first area A1 (the two surfaces of the first circuit board 431, the two surfaces of one of the second circuit boards 432 and the second surface of the other second circuit board 432) are provided with the functional device 80, and the second sub-area A22 of the second area A2 and the four surfaces in the third area A3 (the two surfaces of the first circuit board 431 and the two surfaces of one of the second circuit boards 432) are provided with the functional device 80. The functional device 80 is arranged on the first surface of the battery cover 21, and since the height of the preset area of ​​the battery cover 21 corresponding to the third area A3 is relatively high, the height of the functional device 80 on one of the surfaces in the third area A3 is relatively high, such as the position where the second surface of the second circuit board 432 corresponds to the third area A3, so that the thickness of the supporting connector 434 between the first circuit board 431 and the second circuit board 432 can be reduced. The three surfaces in the first sub-area A21 of the second area A2 are arranged with functional devices, so that a high-height functional device can be arranged on one of the surfaces of the first sub-area A21 of the second area A2, such as a high-thickness BTB is arranged on the second surface of the third circuit board 433, such as the BTB connecting the FPC50 and the main board 41 in the above content. Make full use of the Z-direction space of the whole machine to solve the problem of insufficient layout area.

[0083] It is understandable that the thickness of the supporting connector 434 can be determined according to the height and gap (the gap between the functional devices on the two opposite surfaces of the two circuit boards in the Z-axis direction) of the functional devices actually arranged.

[0084] Regarding the type of the supporting connector 434 , the embodiment of the present application does not limit the type of the supporting connector 434 , as long as it can support the circuit board and electrically connect two adjacent circuit boards.

[0085] In a possible implementation, see Figure 6 The supporting connector 434 includes a frame board (FB), which is a PCB board that is hollowed out in the middle or partially hollowed out.

[0086] In another possible implementation, see Figure 7 , Figure 7 This is another side view of the position relationship of the decorative element, circuit board assembly and battery cover provided in the embodiment of the present application. Figure 7As shown, the supporting connector 434 is formed integrally with the circuit board, that is, the first supporting connector and one of the second circuit boards 432 are formed integrally, the second supporting connector and another second circuit board 432 are formed integrally, and the third supporting connector and the third circuit board 433 are formed integrally. For example, the above-mentioned integrally formed first supporting connector and one of the second circuit boards 432, the above-mentioned integrally formed second supporting connector and another second circuit board 432, and the above-mentioned integrally formed third supporting connector and the third circuit board 433 can be formed by a manufacturing process of a cavity (local recess) structure of a PCB.

[0087] When the main board in the mobile phone is a circuit board assembly 43, since the circuit board assembly 43 and the camera module 60 are both arranged in the area opposite to the shielding portion 221 of the decorative member 22, in order to avoid mutual interference between the circuit board assembly 43 and the camera module 60, the circuit board assembly 43 can be improved accordingly according to the thickness (dimension along the Z-axis direction) of the camera module 60.

[0088] In a possible implementation, the thickness of the camera module 60 is relatively thick. For example, the thickness of the camera module 60 is greater than the distance from the shielding portion 221 to the first circuit board 431. In order to avoid the camera module 60, continue to refer to Figure 6 The first circuit board 431 also includes a fourth area A4, which is opposite to the shielding portion 221, that is, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the fourth area A4. In order to avoid the camera, an avoidance hole is opened in the fourth area A4 of the first circuit board 431, and one end of the camera module 60 passes through the avoidance hole and is fixedly connected to the support member of the middle frame 10, and the camera module 60 is supported by the support member.

[0089] Regarding the size of the avoidance hole, the embodiment of the present application does not limit the size of the avoidance hole, and those skilled in the art can set it according to actual conditions, as long as it can avoid interference and obstruction to the camera module 60 and ensure the normal operation of the camera module 60.

[0090] In another possible implementation, the thickness of the camera module 60 is moderate. For example, the difference between the distance from the shielding portion 221 to the first circuit board 431 and the thickness of the camera module 60 is within a preset range, and the preset range is, for example, between 0.5-3.5 mm. For example, the difference between the distance from the shielding portion 221 to the first circuit board 431 and the thickness of the camera module 60 is 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm or 3.5 mm, etc., see Figure 8 , Figure 8 This is another side view of the position relationship of the decorative element, circuit board assembly and battery cover provided in the embodiment of the present application. Figure 8As shown, the first circuit board 431 also includes a fourth area A4, and the fourth area A4 is opposite to the shielding portion 221, that is, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the fourth area A4, and the camera module 60 is arranged in the fourth area A4 of the first circuit board 431, and the camera module 60 is fixed and supported by the first circuit board 431. In this way, the setting position of the camera module 60 is more flexible, and the area of ​​the supporting member of the middle frame 10 can be released, so that other structures can be arranged on the supporting member.

[0091] In another possible implementation, the thickness of the camera module 60 is relatively thin. For example, the difference between the distance from the shielding portion 221 to the third circuit board 433 and the thickness of the camera module 60 is within a preset range, and the preset range is, for example, between 0.5-3.5 mm. For example, the difference between the distance from the shielding portion 221 to the third circuit board 433 and the thickness of the camera module 60 is 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm or 3.5 mm, etc., see Fig. 9 , Fig. 9 This is another side view of the position relationship of the decorative element, circuit board assembly and battery cover provided in the embodiment of the present application. Fig. 9 As shown, the third circuit board 433 extends to the bottom of the camera module 60, and the camera module 60 is arranged on the third circuit board 433, that is, the second surface of the third circuit board 433 is not only provided with functional devices, such as BTB, but also provided with the camera module 60, and the camera module 60 is fixed and supported by the third circuit board 433. In this way, the setting position of the camera module 60 is more flexible, and the area of ​​the support member of the middle frame 10 can be released, so that other structures can be set on the support member.

[0092] In summary, the electronic device provided in the embodiment of the present application has different distances from the shielding portion 221 of the decorative part 22, the skirt 222 of the decorative part 22 and the preset area of ​​the battery cover 21 to the first circuit board 41, that is, different positions of the decorative part 22 have different height limits for the circuit board assembly 43. By flexibly utilizing the height limit differences, the number of circuit boards is increased in the space in the Z-axis direction, and the number of surfaces on which functional devices are arranged at different positions is different, thereby fully utilizing the space of the electronic device in the Z-axis direction, increasing the device layout area, improving the device integration, and solving the problem of insufficient layout area.

[0093] The present application also provides a method for preparing a circuit board assembly, for preparing Figure 6 The circuit board assembly shown has the same beneficial effects. For details not described in detail in the following content, please refer to the description of the above content. Figure 6 The circuit board assembly of the present invention describes the preparation method of the circuit board assembly, and the following content does not constitute a limitation of the present application.

[0094] See also Fig.10 , Fig.10 A flowchart of a method for preparing a circuit board assembly provided in an embodiment of the present application. Fig.10 As shown, the method for preparing the circuit board assembly includes the following steps:

[0095] S101. Provide a first circuit board motherboard, two second circuit board motherboards and a third circuit board motherboard, wherein each circuit board motherboard includes a plurality of circuit board setting areas.

[0096] In order to simplify the process steps, a larger circuit board motherboard may be provided first. After the components are arranged on each circuit board setting area of ​​the circuit board motherboard, the circuit board motherboard is divided into boards, wherein the boards are divided into boards according to the number of circuit board setting areas to form a plurality of circuit boards, that is, one circuit board setting area corresponds to one circuit board.

[0097] S102: Arrange a plurality of functional devices on a second surface of one of the second circuit board motherboards, wherein the number and type of the functional devices in each circuit board arrangement area of ​​the second circuit board motherboard are the same.

[0098] S103, disposing a plurality of second supporting and connecting members on the first surface of the second circuit board motherboard in step S102, wherein the number of the second supporting and connecting members in each circuit board disposing area of ​​the second circuit board motherboard is the same.

[0099] It is understandable that before the second supporting connector is arranged on the first surface of the second circuit board motherboard, it is necessary to form the second supporting connector first. For example, the second supporting connector motherboard is first divided into boards to form a plurality of second supporting connectors. The specific steps of forming the second supporting connector can refer to the existing technology and will not be repeated in the embodiments of the present application.

[0100] S104, dividing the second circuit board motherboard provided with functional devices and second supporting connectors to form a plurality of second circuit boards, wherein the second surface of the second circuit board is provided with functional devices, and the first surface is provided with at least one second supporting connector.

[0101] The second circuit board 432 separated from the first circuit board 431 in the above content is formed through step S104.

[0102] S105. Arrange a plurality of functional devices and a plurality of first supporting connectors on the first surface of another second circuit board motherboard, wherein the number and type of functional devices in each circuit board setting area of ​​the second circuit board motherboard are the same, and the number of first supporting connectors in each circuit board setting area is the same.

[0103] It is understandable that before the first supporting connector is arranged on the first surface of the second circuit board motherboard, it is necessary to form the first supporting connector first. For example, the first supporting connector motherboard is first divided into boards to form multiple first supporting connectors. The specific steps of forming the first supporting connector can refer to the existing technology and will not be repeated in the embodiments of the present application.

[0104] S106. Arrange functional devices on the second surface of another second circuit board motherboard and arrange the second circuit board in step S104, wherein the number and type of functional devices in each circuit board arrangement area of ​​the second circuit board motherboard are the same, and each circuit board arrangement area of ​​the second circuit board motherboard corresponds to a second circuit board in step S104.

[0105] S107. Divide the second circuit board motherboard that has been provided with functional devices and the second circuit board in step S104 to form a plurality of second circuit boards, wherein the first surface of the second circuit board is provided with functional devices and at least one first supporting connection, and the second surface of the second circuit board is provided with functional devices and a second circuit board in step S104.

[0106] The second circuit board 432 in the above content that is adjacent to the first circuit board 431 is formed through step S107 , and a second circuit board 432 that is away from the first circuit board 431 is disposed on the second circuit board 432 .

[0107] S108. Arrange a plurality of functional devices on the second surface of the third circuit board motherboard, wherein the number and type of the functional devices in each circuit board arrangement area of ​​the third circuit board motherboard are the same.

[0108] S109, disposing a plurality of third supporting and connecting members on the first surface of the third circuit board motherboard, wherein the number of the third supporting and connecting members in each circuit board disposing area of ​​the third circuit board motherboard is the same.

[0109] It is understandable that before the third supporting connector is arranged on the first surface of the third circuit board motherboard, it is necessary to form the third supporting connector first. For example, the third supporting connector motherboard is first divided into boards to form multiple third supporting connectors. The specific steps of forming the third supporting connector can refer to the existing technology and will not be repeated in the embodiments of the present application.

[0110] S110, dividing the third circuit board motherboard provided with functional devices and third supporting connecting members to form a plurality of third circuit boards, wherein the functional devices are provided on the second surface of the third circuit board, and at least one third supporting connecting member is provided on the first surface.

[0111] The third circuit board 433 in the above-mentioned content is formed through step S110.

[0112] S111. Arrange a plurality of functional devices on a first surface of a first circuit board motherboard, wherein the number and type of the functional devices in each circuit board arrangement area of ​​the first circuit board motherboard are the same.

[0113] S112. Arrange the third circuit board formed in step S110 and the second circuit board formed in step S107 on the first surface of the first circuit board motherboard, wherein the number and type of functional devices in each circuit board arrangement area of ​​the first circuit board motherboard are the same, and each circuit board arrangement area of ​​the first circuit board motherboard corresponds to a third circuit board in step S110 and a second circuit board in step S107.

[0114] S113, dividing the first circuit board motherboard which is already provided with functional devices, a second circuit board and a third circuit board to form a plurality of first circuit boards, wherein the functional devices are provided on the first surface of the first circuit board, and a third circuit board in step S110 and a second circuit board in step S107 are provided on the second surface.

[0115] The first circuit board 431 mentioned above is formed through step S113 , and two layers of second circuit boards and one layer of third circuit board are arranged on the first circuit board 431 , that is, the circuit board assembly 43 mentioned above is formed.

[0116] It can be understood that when the circuit board assembly also includes other structures, such as a shielding cover, etc., the steps for preparing the circuit board assembly can be adaptively adjusted.

[0117] It should be noted that the above example only shows a process of preparing a circuit board assembly, but does not constitute a limitation of the present application. For example, multiple functional devices may be first arranged on the first surface of a first circuit board motherboard, and then multiple functional devices may be arranged on the second surface of one of the second circuit board motherboards.

[0118] The above steps can be performed, for example, by a reflow soldering process. Among them, the functional components on the second surface of the second circuit board 432 away from the first circuit board 431 need to undergo multiple reflows, for example, at least two low-temperature reflows (a low-temperature reflow soldering process is used when soldering the supporting connector) and two high-temperature reflows (a high-temperature reflow soldering process is used when soldering the functional components), that is, even after multiple reflow solderings, there will be no impact on the functional components on each circuit board.

[0119] In addition, when the supporting connector 434 is formed integrally with the circuit board, that is, the first supporting connector and one of the second circuit boards 432 are formed integrally, the second supporting connector and another second circuit board 432 are formed integrally, and the third supporting connector and the third circuit board 433 are formed integrally, for example, the above-mentioned integrally formed first supporting connector and one of the second circuit boards 432, the above-mentioned integrally formed second supporting connector and another second circuit board 432, and the above-mentioned integrally formed third supporting connector and the third circuit board 433 can be formed by the manufacturing process of the cavity (local recess) structure of the PCB, the number of reflows can be further reduced, for example, only two high-temperature reflows are required (a high-temperature reflow soldering process is used when soldering functional devices), and the specific process steps are similar to the above process steps, the only difference is that the step of setting the supporting connector is not included. Please refer to the above steps for details, and no further details will be given here.

[0120] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: Back cover; A camera decoration, wherein the camera decoration is fixed on the back cover, the camera decoration comprises a shielding portion and a skirt, the shielding portion is located on a plane different from the plane where the skirt is located, and a light-transmitting hole is opened on the shielding portion; A camera module, wherein the camera module collects light through the light-transmitting hole; A circuit board assembly, wherein the circuit board assembly is located at one side of the back cover along a first direction, wherein the first direction is perpendicular to the plane where the shielding portion is located; The circuit board assembly comprises at least two layers of circuit boards, wherein the at least two layers of circuit boards comprise a first circuit board and at least one second circuit board which are stacked and spaced apart from each other, and along the first direction, the first circuit board is located on a side of the second circuit board away from the back cover; The distance between the shielding portion and the first circuit board is greater than the distance between the skirt and the first circuit board; along the first direction, the circuit board includes a first surface and a second surface opposite to each other, and functional devices are arranged on the first surface and / or the second surface; The circuit board assembly is provided with functional devices at positions corresponding to the shielding portions, and the number of surfaces provided with the functional devices is a first value; The circuit board assembly is provided with functional devices at positions corresponding to the skirt, and the number of surfaces provided with the functional devices is a second value, and the first value is greater than the second value.

2. The electronic device according to claim 1, characterized in that: The position of the circuit board assembly corresponds to the shielding portion, and the number of the circuit boards is a third value; The circuit board assembly corresponds to the position of the skirt, the number of the circuit boards is a fourth value, and the third value is greater than or equal to the fourth value.

3. The electronic device according to claim 1 or 2, characterized in that: The first circuit board includes at least a first area and a second area, and the second circuit board at least corresponds to the first area; The first area is opposite to the shielding portion, and the second area is opposite to the skirt. Functional devices are arranged in the first area, and the number of surfaces provided with the functional devices is the first value; functional devices are arranged in the second area, and the number of surfaces provided with the functional devices is the second value.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The circuit board assembly also includes a supporting connector, which is located between two adjacent circuit boards and is used to support the circuit boards and electrically connect the two adjacent circuit boards.

5. The electronic device according to claim 3, characterized in that: The circuit board assembly further includes at least one third circuit board, the third circuit board at least corresponds to the second area, and the first circuit board and the at least one third circuit board are stacked in an interval.

6. The electronic device according to claim 4 or 5, characterized in that: The first circuit board further includes a third area, and the third area is opposite to the preset area of ​​the back cover; The number of surfaces provided with functional devices in the first region is greater than the number of surfaces provided with functional devices in the second region, and greater than the number of surfaces provided with functional devices in the third region.

7. The electronic device according to claim 6, characterized in that: Along a second direction, the second region includes a first sub-region and a second sub-region arranged on both sides of the first region, wherein the second direction is perpendicular to the first direction; The circuit board assembly includes a first circuit board, two layers of a second circuit board and a layer of a third circuit board, the two layers of the second circuit boards are stacked in the first area, and the second circuit board adjacent to the first circuit board extends to the second sub-area and the third area, and the third circuit board is at least arranged in the second area.

8. The electronic device according to claim 7, characterized in that: Functional devices are arranged on both surfaces of the first circuit board, functional devices are arranged on the second surface of the second circuit board adjacent to the first circuit board, functional devices are arranged on the second surface of the second circuit board far away from the first circuit board, and functional devices are arranged on the second surface of the third circuit board, wherein the first surface is located on the side of the second surface facing away from the back cover.

9. The electronic device according to any one of claims 1 to 8, characterized in that: A shielding cover is provided on the outer side of at least some functional components on the first surface of the first circuit board; A shielding cover is provided on the outer side of at least some functional components on the second surface of the second circuit board away from the first circuit board; and / or, A shielding cover is provided on the outer sides of at least some functional components on the second surface of the second circuit board that is adjacent to the first circuit board.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The thickness of the camera module is greater than the distance from the shielding portion to the first circuit board; The first circuit board also includes a fourth area, the fourth area is opposite to the shielding portion, and the first circuit board is provided with an avoidance hole in the fourth area, and one end of the camera module passes through the avoidance hole.

11. The electronic device according to any one of claims 1 to 9, characterized in that: The difference between the thickness of the camera module and the distance from the shielding portion to the first circuit board is within a preset range; The first circuit board also includes a fourth area, which is opposite to the shielding portion. The camera module is arranged at the fourth area of ​​the first circuit board, and the camera module is fixed and supported by the first circuit board.

12. The electronic device according to any one of claims 1 to 9, characterized in that: The difference between the thickness of the camera module and the distance from the shielding portion to the third circuit board is within a preset range; The third circuit board extends to the bottom of the camera module. The camera module is arranged on the third circuit board. The camera module is fixed and supported by the third circuit board.

13. The electronic device according to any one of claims 4 to 12, characterized in that: The supporting connector is formed integrally with the circuit board.

14. The electronic device according to claim 7, characterized in that: Along the first direction, the height of the first functional device is less than the height of the second functional device, wherein the first functional device is the functional device with the highest height arranged on the second surface of the first circuit board in the first sub-area, and the second functional device is the functional device with the highest height arranged on the second surface of the first circuit board in other areas.

15. The electronic device according to any one of claims 5 to 14, characterized in that: Along the first direction, the height of the functional components on the second surface of the third circuit board is greater than the height of the functional components on the surfaces of other circuit boards.

16. The electronic device according to any one of claims 5 to 15, characterized in that: The functional devices on the second surface of the third circuit board include a board-to-board connector.

17. The electronic device according to any one of claims 8 to 16, characterized in that: The second surface of the first circuit board, the first surface of the second circuit board adjacent to the first circuit board, and the supporting connection member form a first accommodation space; The functional components on the second surface of the first circuit board corresponding to the first area, the second sub-area and the third area are all located in the first accommodation space.

18. The electronic device according to any one of claims 8 to 17, characterized in that: The second surface of the second circuit board adjacent to the first circuit board, the first surface of the second circuit board away from the first circuit board and the supporting connection member form a second accommodation space; The functional components at the second surface of the second circuit board adjacent to the first circuit board and corresponding to the first area are located in the second accommodation space.

19. The electronic device according to any one of claims 8 to 18, characterized in that: The second surface of the first circuit board, the first surface of the third circuit board and the supporting connecting member form a third accommodating space; The functional components on the second surface of the first circuit board and corresponding to the first sub-area are located in the third accommodation space.

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