An efficient heat dissipation device and electronic equipment

Abstract

The application discloses an efficient heat dissipation device and electronic equipment, which comprises a top cover plate, a bottom cavity and a plurality of heat dissipation fins; the top cover plate and the bottom cavity form a cavity; the top surface of the top cover plate is covered with a first solder layer, and the top surface of the top cover plate is provided with a mounting through slot which is communicated with the cavity downward; the top end of the mounting through slot is chamfered to form an annular flow guide surface around the mounting through slot; the heat dissipation fin has a flow channel, and the heat dissipation fin is provided with a flow channel interface part corresponding to the outlet and the inlet of the flow channel; the flow channel interface part is inserted into the mounting through slot, the inside of the flow channel interface part is communicated with the cavity downward, and an annular gap is formed between the outer circumferential surface of the flow channel interface part and the annular flow guide surface; the first solder layer on the top surface of the top cover plate is melted and flows into the annular gap along the annular flow guide surface, and then forms a sealed welding and fixation between the outer circumferential surface of the flow channel interface part and the annular flow guide surface. In this way, the problem that the working fluid medium is prone to leakage at the welding position is effectively solved, and the heat dissipation effect is good.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation devices, in particular to an efficient heat dissipation device and electronic equipment. BACKGROUND

[0002] Heat dissipation devices are widely used in electronic equipment, for example, in communication equipment, heat dissipation devices are often used to dissipate heat from chips, power supplies, etc. The heat dissipation device usually includes a heat dissipation substrate and a plurality of heat dissipation fins arranged on the heat dissipation substrate. The heat generating element is generally attached to the heat dissipation substrate, and the heat generating element and the heat dissipation fins are distributed on both sides of the heat dissipation substrate. A cavity and a flow channel are pre-set in the heat dissipation substrate and the heat dissipation fins, and a working fluid medium (also referred to as refrigerant) flows inside. Since the heat dissipation fins are welded to the heat dissipation substrate, the welding seam is prone to working fluid medium leakage. Therefore, the technical personnel in the industry are committed to improving the problem of working fluid medium leakage.

[0003] For example: CN 117222184 A discloses a phase change heat dissipation device and communication equipment, comprising: a substrate having a first hollow cavity; a plurality of tooth arrays, each tooth having a second hollow cavity, the second hollow cavities of the teeth are communicated through the connecting parts located outside the teeth; the teeth include first and second teeth located at both ends of the tooth array in the first extension direction, the bottom of the first tooth has a first inlet communicating with its second hollow cavity, and the bottom of the second tooth has a first outlet communicating with its second hollow cavity, each tooth array is fixedly connected to the substrate through the first inlet and the first outlet, the substrate absorbs heat from the heat generating element, so that the working medium undergoes phase change cycle in the first hollow cavity and the second hollow cavity, and the heat is dissipated through the teeth. Each group of tooth array flow channel and the cavity of the substrate only has two interfaces to reduce the number of welding points, reduce leakage, and thus improve the use reliability of the heat dissipation device. However, the interface needs to be connected to a connecting pipe, and the connecting pipe is welded to the substrate, which is troublesome to operate, especially the step of adding the connecting pipe, which is prone to false welding and still has the risk of working fluid medium leakage.

[0004] For example, CN 117222183 A discloses a phase change heat sink and a communication device. The phase change heat sink includes a substrate unit and a fin unit. The substrate unit includes a first surface and a second surface. The first surface faces the heat-generating element, and the second surface is used to mount the fin unit. The fin unit includes a mounting portion abutting against the second surface and a heat dissipation portion extending from the mounting portion. The mounting portion has a second opening communicating with a refrigerant channel to the heat dissipation portion. The second surface has a first opening communicating with the hollow inner cavity inside the substrate unit. When the mounting portion abuts against the second surface, the first opening and the second opening are fixed by welding. By welding the mounting portion and the two openings of the substrate unit, the welding area is small and the weld seam is short, reducing the welding difficulty and improving the process yield, thus making it less likely to cause refrigerant leakage. In actual welding, it is equivalent to welding the surfaces where the two openings are located together. Due to the limited flatness of the surfaces, it is difficult to achieve an ideal fit between the two surfaces, resulting in the potential for leakage of the working fluid medium at the weld joint even after welding.

[0005] Therefore, a new technical solution needs to be researched to address the above problems. Summary of the Invention

[0006] In view of this, the present invention addresses the shortcomings of the existing technology, and its main objective is to provide a high-efficiency heat dissipation device and electronic device, which effectively solves the problem of potential leakage of working fluid medium at the welding joint in traditional technology, and has a better heat dissipation effect.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A high-efficiency heat dissipation device includes an upper cover plate, a bottom cavity, and several heat sinks;

[0009] The upper cover plate and the bottom cavity form a cavity for containing fluid media. The top surface of the upper cover plate is covered with a first solder layer, and the top surface of the upper cover plate is provided with a mounting groove that communicates downward with the cavity. The top edge of the mounting groove is chamfered to form an annular guide surface around the mounting groove. The heat sink has a flow channel, and the heat sink is provided with a flow channel interface corresponding to the inlet and outlet of the flow channel. The flow channel interface is inserted into the mounting groove, and the interior of the flow channel interface communicates downward with the cavity. An annular gap is formed between the outer peripheral surface of the flow channel interface and the annular guide surface. After the first solder layer melts, it flows into the annular gap along the annular guide surface, thereby forming a sealed weld between the outer peripheral surface of the flow channel interface and the annular guide surface.

[0010] As a preferred solution, the bottom of the upper cover plate is provided with two groups of riveting convex parts corresponding to the positions of the two ends of the mounting through slot, each group of riveting convex parts includes two riveting convex parts arranged at a left-right interval, the flow channel interface part extends downward from the bottom of the upper cover plate and extends into the space between the two riveting convex parts, and the flow channel interface part is fixed by riveting the riveting convex parts to fix the heat dissipation fins on the upper cover plate.

[0011] As a preferred solution, the flow channel interface part includes a flow channel enclosing wall and a first wall body part connected to the two ends of the flow channel enclosing wall, and the flow channel enclosing wall is configured to form a flow channel interface, and the first wall body parts at the two ends extend into the space between the two riveting convex parts.

[0012] As a preferred solution, the outer end of the first wall body part further extends a second wall body part, the lower end surface of the second wall body part is higher than the lower end surface of the first wall body part, so that the lower end surface of the second wall body part serves as an abutting surface, and after the flow channel interface part is inserted into the mounting through slot, the abutting surface abuts against the top surface of the upper cover plate.

[0013] As a preferred solution, the flow channel is filled with a first capillary filler.

[0014] As a preferred solution, the cavity is filled with a second capillary filler.

[0015] As a preferred solution, the top end of the mounting through slot is provided with an inclined chamfer or an arc chamfer.

[0016] As a preferred solution, the first solder layer is a brazing filler metal layer.

[0017] As a preferred solution, the heat dissipation fins include a heat dissipation A single fin and a heat dissipation B single fin arranged in a superimposed manner; the superimposed side surfaces of the heat dissipation A single fin and the heat dissipation B single fin are provided with corresponding matching flow channel wall surfaces, the heat dissipation A single fin and the heat dissipation B single fin extend downward at the ends of the corresponding flow channel wall surfaces to form connecting parts, and the connecting parts are superimposed to form the flow channel interface part; the superimposed side surfaces of the heat dissipation A single fin and / or the heat dissipation B single fin are covered with a second solder layer, and the superimposed side surfaces of the heat dissipation A single fin and the heat dissipation B single fin are mutually adhered and welded to be fixed.

[0018] An electronic device includes a heat generating element and a heat dissipation device, the heat dissipation device dissipates heat from the heat generating element; the heat dissipation device is a high-efficiency heat dissipation device as described in any one of the preceding aspects.

[0019] Compared with the prior art, the application has obvious advantages and beneficial effects, specifically, the main technical scheme is that the mounting through groove which is communicated with the cavity downward is arranged on the top surface of the upper cover plate, the top end peripheral edge of the mounting through groove is chamfered to form the annular flow guide surface around the mounting through groove; the flow channel is arranged in the heat dissipation fin, the flow channel interface part is arranged on the outlet and inlet of the flow channel of the heat dissipation fin respectively, the flow channel interface part is inserted into the mounting through groove, the inside of the flow channel interface part is communicated with the cavity downward, and the annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular flow guide surface; the first solder layer of the top surface of the upper cover plate is melted and flows into the annular gap along the annular flow guide surface, and then the outer peripheral surface of the flow channel interface part and the annular flow guide surface are sealed and welded and fixed, the welding effect is good, the problem that the working fluid medium is prone to leakage at the welding position in the traditional technology is effectively solved, the heat dissipation efficiency is high, and the heat dissipation effect is good.

[0020] In order to more clearly illustrate the structural features and effects of the application, the application will be described in detail below with reference to the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is an exploded view of the high-efficiency heat dissipation device of the embodiment of the application (the number of heat dissipation A single pieces and heat dissipation B single pieces is not limited);

[0022] Figure 2 is another exploded view of the high-efficiency heat dissipation device of the embodiment of the application (the heat dissipation A single piece and the heat dissipation B single piece have been combined into one before being inserted and assembled, and the number of heat dissipation fins is not limited);

[0023] Figure 3 is an exploded view of the heat dissipation A single piece and the heat dissipation B single piece of the embodiment of the application;

[0024] Figure 4 is an assembled view of the heat dissipation A single piece and the heat dissipation B single piece of the embodiment of the application after being overlapped;

[0025] Figure 5 is a partial structural view of a group of heat dissipation fins arranged on the heat dissipation base of the embodiment of the application;

[0026] Figure 6A is a partial structural view of the flow channel interface part and the upper cover plate of the embodiment of the application after being assembled (before being welded);

[0027] Figure 6B is a partial structural view of the flow channel interface part and the upper cover plate of the embodiment of the application after being assembled (after being welded);

[0028] Figure 7 is a partial perspective view of the heat dissipation A single piece and the heat dissipation B single piece of the embodiment of the application arranged on the upper cover plate (the bottom structure of the upper cover plate is shown);

[0029] Figure 8 is a sectional view of the middle of the heat dissipation A monolithic and the heat dissipation B monolithic provided with the first capillary filler of another embodiment of the present application;

[0030] Figure 9 is an exploded view of the bottom cavity provided with the second capillary filler of another embodiment of the present application;

[0031] Figure 10 is an assembled view of the bottom cavity provided with the second capillary filler of another embodiment of the present application;

[0032] Figure 11 is a step view of a manufacturing method of the high-efficiency heat dissipation device of an embodiment of the present application;

[0033] Figure 12 is an exploded view of a heat dissipation device provided with a connecting plate on the top of the heat dissipation fin;

[0034] Figure 13 shows an exploded view of another heat dissipation device provided with a folding piece on the heat dissipation fin. DETAILED DESCRIPTION

[0035] Please refer to Figures 1 to 13 which shows the specific structure of various embodiments of the present application.

[0036] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as limiting the device or element indicated or implied to have a specific orientation, to be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application.

[0037] A high-efficiency heat dissipation device is suitable for dissipating heat for high-power electronic components, and has good heat dissipation effect. The high-efficiency heat dissipation device comprises an upper cover plate, a bottom cavity, and a plurality of heat dissipation fins. The upper cover plate and the bottom cavity form a cavity for accommodating fluid medium. The top surface of the upper cover plate is covered with a first solder layer. The top surface of the upper cover plate is provided with a mounting through slot which communicates downward with the cavity. The top end of the mounting through slot is chamfered to form an annular flow guide surface around the mounting through slot. The heat dissipation fin has a flow channel. The heat dissipation fin is provided with a flow channel interface part corresponding to the outlet and inlet of the flow channel. The flow channel interface part is inserted into the mounting through slot. The inside of the flow channel interface part communicates downward with the cavity. An annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular flow guide surface. The first solder layer of the top surface of the upper cover plate melts and flows into the annular gap along the annular flow guide surface, and then forms a sealed welded fixation between the outer peripheral surface of the flow channel interface part and the annular flow guide surface.

[0038] In actual production, each heat dissipation fin can be provided with an independent flow channel and a flow channel interface part, or the flow channels of multiple heat dissipation fins can be connected, so that the two flow channel interface parts are not limited to being arranged on each heat dissipation fin. Meanwhile, the structure and production method of the heat dissipation fin are not limited.

[0039] In this embodiment, the high-efficiency heat dissipation device includes a top cover plate 1, a bottom cavity 2, a heat dissipation A single fin 3, and a heat dissipation B single fin 4.

[0040] The upper cover plate 1 is provided with a first solder layer on the top surface, and the top surface of the upper cover plate 1 is provided with a mounting through slot 101, the top end of the mounting through slot 101 is chamfered (can be chamfered obliquely or chamfered arcuately) to form an annular flow guide surface 102 around the mounting through slot 101; the superimposed side surfaces of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are provided with corresponding matching flow channel wall surfaces, and the heat dissipation A single piece 3 and the heat dissipation B single piece 4 extend downward at the ends of the corresponding flow channel wall surfaces to form connecting portions 342; the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting through slot 101 to form a first-stage semi-finished product, wherein the connecting portions 342 are superimposed to form flow channel interface portions 347, and an annular gap is formed between the outer circumferential surface of the flow channel interface portions 347 and the annular flow guide surface 102; the bottom of the upper cover plate 1 is provided with two groups of riveting protrusions 104 corresponding to the positions of the two ends of the mounting through slot 101, each group of riveting protrusions 104 includes two riveting protrusions 104 arranged at a left-right interval, the connecting portions 342 extend downward beyond the bottom of the upper cover plate 1 and extend into the space between the two riveting protrusions 104, and the connecting portions 342 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are fixed by pressing the riveting protrusions 104, wherein the connecting portions 342 include a flow channel enclosing wall and first wall body portions 345 connected to the two ends of the flow channel enclosing wall, respectively, the flow channel enclosing wall is configured to form a closed flow channel interface, the first wall body portions 345 at the two ends are correspondingly attached to form widened portions, the first wall body portions 345 at the two ends extend into the space between the two riveting protrusions 104, the outer end of the first wall body portions 345 further extends a second wall body portion 346, the lower end surface of the second wall body portion 346 is higher than the lower end surface of the first wall body portion 345, so that the lower end surface of the second wall body portion 346 serves as an abutting surface, and after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting through slot 101, the abutting surface abuts against the top surface of the upper cover plate 1. Therefore, after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting through slot 101, the lower end surface of the second wall body portion 346 limits the insertion depth and also serves as a pre-insertion positioning function, and the two riveting protrusions 104 can be riveted at the bottom of the upper cover plate 1 to fix the heat dissipation A single piece 3 and the heat dissipation B single piece 4.

[0041] The first stage semi-product is loaded into the bottom cavity 2 to form a second stage semi-product, and the upper cover plate 1 and the bottom cavity 2 form a cavity. The assembly process can be airtight assembly of the upper cover plate 1 and the bottom cavity 2, or the subsequent vacuum welding can be used to fix the upper cover plate 1 and the bottom cavity 2. The inner part of the flow channel interface part 347 penetrates the cavity downward. The first solder layer on the top surface of the upper cover plate melts and flows into the annular gap along the annular flow guide surface 102, and then forms a sealed weld between the outer peripheral surface of the flow channel interface part 347 and the annular flow guide surface 102.

[0042] The second solder layer is arranged on the superimposed side of the heat dissipation A single piece 3 and / or the heat dissipation B single piece 4, and the superimposed sides of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are welded and fixed to each other. The heat dissipation A single piece 3 and the heat dissipation B single piece 4 can be welded into one body before being inserted into the installation slot 101, or the heat dissipation A single piece 3 and the heat dissipation B single piece 4 can be inserted into the installation slot 101, and then welded into one body during the vacuum welding of the second stage semi-product.

[0043] Before the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the installation slot 101 of the upper cover plate 1, a first capillary filler can be arranged between the heat dissipation A single piece 3 and the heat dissipation B single piece 4. Before the first semi-product is loaded into the bottom cavity 2, a second capillary filler can be filled in the cavity of the bottom cavity 2.

[0044] An electronic device, such as a communication device, is provided, which includes a heat generating element and a heat dissipation device for dissipating heat from the heat generating element. Typically, the bottom of the bottom cavity 22 of the heat dissipation device is attached to the heat generating element, and the heat dissipation device is the heat dissipation device described above.

[0045] As described above, the heat dissipation A single piece and the heat dissipation B single piece can be welded into one body in advance, or can be welded into one body after being inserted into the installation slot.

[0046] Next, a manufacturing method for assembling and welding the upper cover plate 1, the bottom cavity 2, the plurality of heat dissipation A single pieces 3, and the plurality of heat dissipation B single pieces 4 into a finished product is introduced, which includes the following steps (the description of the structure of the heat dissipation device below is not the only structure limitation of this manufacturing method, and the heat dissipation device of the present application can still be designed or further designed with the same or similar structure when other manufacturing methods are used) :

[0047] Step 1, prepare the upper cover plate 1, the bottom cavity 2, the plurality of heat dissipation A single pieces 3, and the plurality of heat dissipation B single pieces 4;

[0048] The upper cover plate 1 is a composite layer material with solder layer, such as aluminum-based brazing composite layer material, and thus a first solder layer C1 is arranged on the top surface of the upper cover plate 1. The top surface of the upper cover plate 1 is provided with a plurality of installation through grooves 101 arranged at intervals left and right. The installation through grooves 101 pass through the top surface and the bottom surface of the upper cover plate 1. The top end of the installation through grooves 101 is chamfered to form an annular flow surface 102 around the installation through grooves 101.

[0049] The bottom cavity 2 is provided with a cavity 201. A plurality of convex columns 202 are arranged at intervals in the cavity 201 to divide the cavity 201 into a plurality of tortuous flow channels. The top end of the bottom cavity 2 is convex upward to form an installation column 203. Correspondingly, the periphery of the upper cover plate 1 is provided with an installation hole 103. The installation column 203 extends into the corresponding installation hole 103 to form the mutual assembly and positioning of the upper cover plate 1 and the bottom cavity 2. Further, the installation column 203 can also be arranged in the cavity 201, and the installation hole 103 is correspondingly arranged on the upper cover plate 1 to improve the assembly stability of the upper cover plate 1 and the bottom cavity 2. In the subsequent welding process, the installation column 203 and the installation hole 103 are welded and fixed. Specifically, the outer periphery of the installation column 203 and the inner periphery of the installation hole 103, as well as the top surface of the upper cover plate 1, and even the top end of the bottom cavity 2 and the bottom surface of the upper cover plate 1, the outer periphery of the installation column 203, and the inner periphery of the installation hole 103 are integrally welded and sealed and fixed.

[0050] The heat dissipation A single piece 3 and / or the heat dissipation B single piece 4 are also composite materials with solder layer, such as aluminum-based solder composite material, so that a second solder layer is provided on the overlapping side of the heat dissipation A single piece 3 and the heat dissipation B single piece 4, preferably, a second solder layer is provided on the overlapping side of the heat dissipation A single piece 3 and the heat dissipation B single piece 4, which is easier to solder and has better soldering effect compared with the case that only the overlapping side of the heat dissipation A single piece 3 or the heat dissipation B single piece 4 is provided with a second solder layer, and the heat dissipation A single piece 3 and the heat dissipation B single piece 4 can be designed with the same structure (such as symmetrical structure), which can be designed and produced uniformly, is conducive to mass production, and can better control the production quality and reduce the production cost. The overlapping side of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 is provided with (such as recessed) a matching corresponding flow channel wall surface 341, in the embodiment, the overlapping side of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 is recessed with a flow channel wall surface 341, and the other overlapping side can be recessed with a flow channel wall surface 341, and the other overlapping side is a flat surface, which is equivalent to the flow channel wall surface 341 on the other overlapping side being a flat surface, and the heat dissipation A single piece 3 and the heat dissipation B single piece 4 extend downward at the end of the corresponding flow channel wall surface 341 to form a connecting portion 342; the second solder layer can be on the entire overlapping side, or can be provided on the area on the overlapping side except the flow channel wall surface 341, or at least can form a closed flow channel 348 after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are overlapped and soldered.

[0051] Step 2, the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting slot 101, wherein the connecting portions 342 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are overlapped to form a flow channel interface portion 347, the flow channel interface portion 347 forms a closed annular shape, an annular gap is formed between the outer circumferential surface of the flow channel interface portion 347 and the annular flow guide surface 102, which is equivalent to that the annular gap surrounds the outer periphery of the outer circumferential surface of the flow channel interface portion 347, the overlapping sides of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are in contact, one heat dissipation A single piece 3 and one heat dissipation B single piece 4 are overlapped to form a group of heat dissipation fins 200, the flow channel wall surfaces 341 thereof are matched to form a flow channel, the connecting portions 342 thereof are also matched and consistent, and two groups of connecting portions 342 are formed at the lower end of the group of heat dissipation fins 200, corresponding to the fluid inlet and the fluid outlet of the group of heat dissipation fins 200; and the bottom cavity 2 is overlapped on the bottom of the upper cover plate 1; the upper cover plate 1 and the bottom cavity 2 form a heat dissipation base 100.

[0052] Step 3, the assembly is placed into a vacuum welding furnace for welding, usually a vacuum welding is performed, the first solder layer C1 on the top surface of the upper cover plate 1 melts and flows into the annular gap along the annular flow surface 102, forming a complete circle of solder D in the annular gap, and further forming a sealing weld between the outer circumferential surface of the flow channel interface portion 347 and the annular flow surface 102, solving the problem of leakage of working fluid medium.

[0053] Further, the solder layer is a brazing filler metal layer, and in step 3, brazing is performed, and the assembly is placed into a vacuum brazing furnace for brazing, and a finished product is brazed in one time.

[0054] In step 1, a first capillary filler 6 is also prepared; the first capillary filler 6 is filled and arranged corresponding to the flow channel wall surface 341, so that the flow channel is filled with the first capillary filler 6.

[0055] In step 1, a second capillary filler 7, such as a capillary mesh, is also prepared; the second capillary filler 7 is filled and arranged corresponding to the bottom cavity 2, so that the cavity formed by the stacking of the upper cover plate 1 and the bottom cavity 2 is filled with the capillary mesh.

[0056] In step 2, after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting slot 101, the flow channel interface part 347 extends downward from the bottom of the upper cover plate 1, and the extension part of the flow channel interface part 347 is pressed and fixed to fix the heat dissipation A single piece 3 and the heat dissipation B single piece 4 on the upper cover plate 1. The connecting part 342 includes a flow channel enclosing wall 343 and a widened abutting wall 344 connected to the front and rear ends of the flow channel enclosing wall 343, respectively. The widened abutting wall 344 includes a first wall body part 345 close to the flow channel enclosing wall 343 and a second wall body part 346 away from the flow channel enclosing wall 343. The lower end surface of the second wall body part 346 is higher than the lower end surface of the first wall body part 345, so that the lower end surface of the second wall body part 346 serves as an abutting surface. After the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting slot 101, the abutting surface abuts against the top surface of the upper cover plate 1. On the one hand, it plays a role in assembly positioning and limits the insertion depth. On the other hand, in the subsequent welding process, the first solder layer C1 on the top surface of the upper cover plate 1 forms a welding fixation with the abutting surface, thereby strengthening the combination stability of the entire heat dissipation fin 200 and the upper cover plate 1. The bottom of the upper cover plate 1 is provided with two groups of riveting protrusions corresponding to the front and rear ends of the mounting slot 101. Each group of riveting protrusions includes two riveting protrusions 104 arranged at a left-right interval. The first wall body part 345 extends downward between the two riveting protrusions 104, and the two first wall body parts 345 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are pressed and fixed by pressing the two riveting protrusions 104. In actual operation, the two riveting protrusions 104 can be pressed in both directions, or one riveting protrusion 104 can be pressed towards the other riveting protrusion 104 to press the two first wall body parts 345 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 between the two riveting protrusions 104, thereby fixing the heat dissipation fin 200.

[0057] Preferably, after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are fixed on the upper cover plate 1, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1. The third solder layer is arranged on the stacked side of the bottom cavity 2 and the upper cover plate 1. In step 3, the bottom cavity 2 and the upper cover plate 1 are welded and fixed. The third solder layer is usually a brazing filler metal layer, so that in step 3, the upper cover plate 1, the bottom cavity 2, the heat dissipation A single piece 3, and the heat dissipation B single piece 4 are brazed to realize the welding fixation of all accessories at one time.

[0058] In step 1, a connecting plate 5 is also prepared, which is provided with a plurality of positioning grooves 501, the top end of the heat dissipation A single piece 3 and / or the heat dissipation B single piece 4 is provided with an upwardly extending positioning portion 349 which extends into the positioning groove 501, the upper cover plate 1 and the bottom cavity 2 form a heat dissipation base 100, and the connecting plate 5 is usually arranged in parallel with the heat dissipation base 100, which is equivalent to positioning the upper and lower ends of the plurality of groups of heat dissipation fins 200.

[0059] The heat dissipation A single piece 3 is provided with a fold 301 which extends towards the heat dissipation B single piece 4, and after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are overlapped, the fold 301 extends out of the side of the heat dissipation B single piece 4 which is away from the heat dissipation A single piece 3, and the extending end of the fold 301 is in contact with the adjacent heat dissipation A single piece 3.

[0060] The fold 301 can be arranged at the edge positions of the front side, the back side and the top of the heat dissipation A single piece 3, so as to form a circumferential clamping and positioning of the heat dissipation A single piece 3 on the heat dissipation B single piece 4, which is beneficial to the stability of the overlap of the two, the overall integrity of the overlapped heat dissipation single piece is good, and the fold 301 can also be arranged in the middle area of the plate of the heat dissipation A single piece 3 except for the edge, where the middle area referred to herein is not an absolutely central position, but actually refers to an internal area surrounded by the edge, and the folds 301 are bent from the hollow part 302 on the heat dissipation A single piece, and correspondingly, a hollow part which is opposite to and consistent or basically consistent with the hollow part is also formed on the heat dissipation B single piece 4. Of course, the heat dissipation B single piece 4 usually does not need to retain the fold 301 which is cut and bent from the hollow part like the heat dissipation A single piece, and the hollow part of the heat dissipation B single piece 4 is mainly used for the fold 301 of the heat dissipation A single piece of the heat dissipation fin 200 in the group to pass through, which plays a role in avoiding. In actual production, if the heat dissipation B single piece 4 also retains the fold 301 which is cut and bent from the hollow part like the heat dissipation A single piece, it can also be realized that the folds 301 of the heat dissipation A single piece and the heat dissipation B single piece form an overlapping state. Since the middle area can be provided with one or more folds 301, the folds 301 play a good role in the mutual positioning of the heat dissipation fins 200 of adjacent groups in the left-right direction, and strengthen the structural correlation between the heat dissipation fins 200 of each group, so that the heat dissipation fins 200 of each group are not prone to shaking, so that the overall structural strength is better, and the folds 301 also play a role in strengthening the heat conduction between the heat dissipation fins 200 of each group. Figure 13 The plurality of folds 301 in the middle area are arranged in multiple rows along the up-down interval, and each row includes a plurality of folds 301 arranged along the front-rear interval. The arrangement of the multiple folds 301 makes the contact positioning force points between the heat dissipation fins 200 of each group evenly distributed, and after welding, the contact positioning part will be welded and fixed, so that all the heat dissipation fins 200 form a heat dissipation module which has good strength and is not prone to deformation, which is better than the prior art. Figure 11and Figure 12 The heat dissipation device shown, the assembly of the top connecting plate is omitted, the assembly is more convenient, and the structural stability is better.

[0061] In addition, regarding the heat dissipation A single piece 3, the heat dissipation B single piece 4, preferably, they are both composite layer materials with solder layers, which can be single-sided with solder layers or double-sided with solder layers. For the case of single-sided with solder layers, the solder layer is located on the stacking side, so that the same group of heat dissipation, the flaps 301 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are in contact and positioned during assembly and welded during welding.

[0062] Regarding the upper cover plate 1, it is at least a composite layer material with a solder layer, that is, the top surface is covered with a solder layer, and it can also be double-sided with a solder layer, that is, the bottom surface is also covered with a solder layer, that is, the third solder layer is arranged on the bottom surface, and the third solder layer can also be arranged on the top surface of the bottom cavity 2.

[0063] Preferably, the same solder layer is arranged in the same heat dissipation device, which facilitates the guarantee of the vacuum welding effect. The heat dissipation A single piece 3, the heat dissipation B single piece 4, the upper cover plate 1, the bottom cavity 2 and the connecting plate are all metal substrates, such as aluminum substrates, and some use aluminum alloy, copper, copper alloy, copper-aluminum composite material, etc.

[0064] The design focus of the present application is that a mounting through slot communicating downward cavity is arranged on the top surface of the upper cover plate, the top end of the mounting through slot is chamfered to form an annular flow guide surface around the mounting through slot; the heat dissipation fin has a flow channel, the outlet and the inlet of the heat dissipation fin corresponding to the flow channel are respectively provided with a flow channel interface part, the flow channel interface part is inserted into the mounting through slot, the inside of the flow channel interface part communicates downward cavity, and an annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular flow guide surface; the first solder layer on the top surface of the upper cover plate melts and flows into the annular gap along the annular flow guide surface, and then forms a sealed welding fixation between the outer peripheral surface of the flow channel interface part and the annular flow guide surface, the welding effect is good, effectively solving the problem of leakage of working fluid medium at the welding position in the traditional technology, the heat dissipation efficiency is high, and the heat dissipation effect is good.

[0065] The above is only a preferred embodiment of the present application, and does not limit the technical scope of the present application in any way, so any slight modification, equivalent change and modification made according to the technical essence of the present application to the above embodiment still belongs to the scope of the technical solution of the present application.

Claims

1. A highly efficient heat dissipating device, characterized by, The upper cover plate, the bottom cavity and the several heat dissipation fins are included; the upper cover plate and the bottom cavity are surrounded to form a cavity for containing fluid medium; The upper cover plate is a composite layer material with a solder layer, so that the top surface is covered with a first solder layer; the top surface of the upper cover plate is provided with a mounting through slot communicating downward with the cavity, and the top end periphery of the mounting through slot is chamfered to form an annular flow guide surface around the mounting through slot; The heat dissipation fin has a flow channel, and the outlet and inlet of the flow channel are respectively provided with flow channel interface parts; the flow channel interface parts are inserted into the mounting through slot, the inside of the flow channel interface parts communicates downward with the cavity, and the outer periphery of the flow channel interface parts and the annular flow guide surface form an annular gap around the outer periphery of the flow channel interface parts; When welding in a vacuum welding furnace, the first solder layer on the top surface of the upper cover plate melts and flows into the annular gap along the annular flow guide surface, forming a complete circle of solder in the annular gap, and then sealing and welding the outer periphery of the flow channel interface part and the annular flow guide surface.

2. The high efficiency heat dissipating device of claim 1, wherein, The bottom of the upper cover plate is provided with two groups of riveting convex parts corresponding to the positions of the two ends of the mounting through slot, each group of riveting convex parts includes two riveting convex parts arranged at an interval, the flow channel interface part extends downward from the bottom of the upper cover plate and extends between the two riveting convex parts, and the flow channel interface part is fixed by riveting the riveting convex parts to fix the heat dissipation fin on the upper cover plate.

3. The high efficiency heat dissipating device of claim 2, wherein, The flow channel interface part includes a flow channel enclosing wall and a first wall body part connected to the two ends of the flow channel enclosing wall, and the flow channel enclosing wall forms a flow channel interface, and the first wall body parts at the two ends extend between the two riveting convex parts.

4. The high efficiency heat dissipating device of claim 3, wherein, The outer end of the first wall body part further extends a second wall body part, the lower end surface of the second wall body part is higher than the lower end surface of the first wall body part, so that the lower end surface of the second wall body part serves as an abutting surface, and after the flow channel interface part is inserted into the mounting through slot, the abutting surface abuts against the top surface of the upper cover plate.

5. The high efficiency heat dissipating device of claim 1, wherein, The flow channel is filled with a first capillary filler.

6. The high efficiency heat dissipating device of claim 1, wherein, The cavity is filled with a second capillary filler.

7. The high efficiency heat dissipating device of claim 1, wherein, The top end periphery of the mounting through slot is obliquely chamfered or arc chamfered.

8. The high efficiency heat dissipating device of claim 1, wherein, The first solder layer is a brazing material layer.

9. The high efficiency heat dissipating device of claim 1, wherein, The heat dissipation fin includes a heat dissipation A single piece and a heat dissipation B single piece arranged in superposition; the superposition side of the heat dissipation A single piece and the heat dissipation B single piece is provided with corresponding flow channel wall surfaces, the heat dissipation A single piece and the heat dissipation B single piece extend downward at the ends of the corresponding flow channel wall surfaces to form connecting parts, and the connecting parts are arranged in superposition to form the flow channel interface part; The superposition side of the heat dissipation A single piece and / or the heat dissipation B single piece is covered with a second solder layer, and the superposition sides of the heat dissipation A single piece and the heat dissipation B single piece are mutually abutted and welded.

10. An electronic device, comprising: The heat dissipation device is the high-efficiency heat dissipation device of any one of claims 1 to 9.

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